CN1690817A - LCD device - Google Patents

Abstract

A liquid crystal display device using color filter integrated thin film transistor array substrate (COA) technology is disclosed, wherein when a glass substrate is formed by color filter (R, G, B) or light shielding layer (BM) resin, a wire collection region and an outer lead bonding region except a plurality of outer leads are covered at the same time, so as to prevent metal wires from being exposed, increase the insulation property between the outer leads, and improve the reliability of the product.

Description

LCD device

technical field

The present invention relates to a liquid crystal display device, in particular to a liquid crystal display device utilizing a color filter integrated thin film transistor array substrate (COA: Color Filter On Array) technology.

Background technique

Generally, the traditional thin-film transistor liquid crystal display (TFT-LCD) panel is made of a thin-film transistor (TFT: Thin-Film Transistor) panel glass and another piece of color filter (Color Filter) glass. Filled with liquid crystal molecules. The new mass production technology is to complete the manufacturing process of the thin film transistor array (Array) on the glass of the TFT panel, and then proceed to the manufacturing process of the color filter, which is the so-called color filter integrated thin film transistor array substrate (COA: Color Filter On Array) technology. Using COA technology can increase the aperture ratio of TFT, and its main function is to effectively improve the brightness of the panel. In the past, when laminating TFT panel glass and color filter glass and filling liquid crystals, the alignment of the two glasses must be very precise, and a uniform gap of 3-4 μm should be left in the middle to accommodate liquid crystals. Therefore, manufacturing in the middle of this (Cell) The process is the part with the lowest yield rate in the entire panel manufacturing process. If the loss in this section can be saved, it will greatly help the overall yield increase and cost reduction.

Please see Figure 1 and Figure 2. FIG. 1 is a cross-sectional view of a general conventional thin film transistor liquid crystal display (TFT-LCD). TFT panel glass 11 and color filter (Color Filter) glass 12 are laminated. There are multiple thin-film transistors 111 (TFT: Thin-Film Transistor) on the thin-film transistor panel glass 11 , each thin-film transistor 111 corresponds to a pixel electrode 112 , and between the thin-film transistor 111 and the pixel electrode 112 is a A transparent protective insulating layer 113 . On another piece of color filter (Color Filter) glass 12, there are a plurality of red (R), green (G), blue (B) color filters 121, each color filter is all with light-shielding layer 122 ( BM) to prevent light leakage. On the color filter 121 there is a transparent common electrode 123 . The liquid crystal layer 13 is sandwiched between the TFT panel glass 11 and the color filter glass 12 .

FIG. 2 is a cross-sectional view of a thin film transistor liquid crystal display (TFT-LCD) fabricated by COA technology. The lower panel glass 21 is attached to the upper panel glass 22 . There are multiple thin-film transistors 211 (TFT: Thin-Film Transistor) on the lower panel glass 21, and each thin-film transistor 211 corresponds to a pixel electrode 212, and there are many thin-film transistors between the thin-film transistor 211 and the pixel electrode 212. There are three red (R), green (G) and blue (B) color filters 213, and each color filter is separated by a light-shielding layer 214 (BM) to prevent light leakage. There is a transparent common electrode 221 on the upper panel glass. The liquid crystal layer 23 is sandwiched between the lower panel glass 21 and the upper panel glass 22 .

The structure of a thin film transistor liquid crystal display device currently manufactured by COA technology is shown in FIG. 3 . There is a layer of light-shielding layer area 32 outside the effective display area 31 (Active Area), and the light-shielding layer area 32 is adjacent to the wire collection area 33, and the wire collection area 33 is connected to the outer pin (OLB: Outer Lead Bonding) area 34 next to each other. At this time, the effective display area 31, the wire collection area 33 and the outer pin bonding area 34 are electrically connected, but the metal wires are protected by a protective layer in the effective display area 31, and are in the wire collection area 33 and the outer pin bonding area 34. Without protective layer protection, water vapor is easy to intrude, which in turn causes problems in product reliability.

Contents of the invention

In view of the above-mentioned background of the invention, the existing thin-film transistor liquid crystal display device made by COA technology has no protective layer for the metal wires in the wire gathering area and the outer pin bonding area, which makes it easy for water vapor to invade and cause product reliability. problem of degree. Therefore, the present invention provides a new liquid crystal display device to avoid the occurrence of the above situation.

An object of the present invention is to provide a liquid crystal display device. When the light-shielding layer or the color filter is formed, the metal wires in the wire collection area are also covered to prevent the metal wires from being exposed and improve the reliability of the product.

Another object of the present invention is to provide a liquid crystal display device. When the light-shielding layer or the color filter is formed, the area of the external pin bonding area that does not include multiple external pins is covered together, so as to increase the insulation characteristics between the external pins and improve the reliability of the product.

Another object of the present invention is to provide a liquid crystal display device. When the light-shielding layer or color filter is formed, the metal wires in the wire collection area and the area that does not include multiple external pins in the outer pin bonding area are covered together to prevent the metal wires from being exposed and increase the number of external leads. The insulating properties between the feet improve the reliability of the product.

According to the purpose described above, the present invention provides a kind of liquid crystal display device utilizing color filter to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a shading area, adjacent to the effective display area connection; a wire collection area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an outer pin bonding area, adjacent to the wire collection area, has a plurality of outer pins and a protective layer formed on the light-shielding area and the wire-collecting area, wherein the light-shielding area is used to prevent light leakage, and the wire-collecting area is used to prevent the metal The wires are exposed.

According to the above idea, the protective layer is a resin layer.

According to the above idea, the resin layer is a non-conductive layer that is water-proof.

According to the above idea, the resin layer is a carbon-containing resin material.

According to the above idea, the resin layer is also formed on the outer pin bonding area at the same time, so as to increase the insulating property between the outer pins.

According to the above idea, the thickness of the resin layer is smaller than the height of the external pin.

According to the above idea, the thickness of the resin layer is about 0.5 μm˜3 μm.

According to the above concept, the material of the metal wire is selected from the following: molybdenum, aluminum and the combination of the foregoing.

According to the above idea, wherein the metal wire outer layer also includes a sputtering (sputter) method of coating, in order to prevent metal oxidation, its material is selected from the following: indium tin oxide (ITO), indium zinc oxide (IZO) and combinations of the foregoing.

According to the purpose described above, the present invention provides a kind of liquid crystal display device utilizing color filter to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a shading area, adjacent to the effective display area connection; a wire collection area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an outer pin bonding area, adjacent to the wire collection area, has a plurality of outer pins and a color filter layer is formed on the effective display area and the wire collection area, wherein the wire collection area is used to prevent the metal wire from being exposed.

According to the above idea, the material of the color filter layer formed in the wire gathering area is selected from the following: red color filter layer, blue color filter layer, green color filter layer and the aforementioned three any combination of species.

According to the above idea, the color filter layer is also formed on the outer pin bonding area at the same time, so as to increase the insulation property between the outer pins.

According to the above idea, the material of the color filter layer formed in the wire gathering area is selected from the following: red color filter layer, blue color filter layer, green color filter layer and the above three any combination of .

According to the above idea, the thickness of the color filter is smaller than the height of the external pin.

According to the above idea, the thickness of the color filter is about 0.5 μm˜3 μm.

According to the above idea, the material of the colored wire is selected from the following: molybdenum, aluminum and combinations of the foregoing.

According to the above idea, wherein the metal wire outer layer also includes a sputtering (sputter) method of coating, in order to prevent metal oxidation, its material is selected from the following: indium tin oxide (ITO), indium zinc oxide (IZO) and combinations of the foregoing.

According to the purpose described above, the present invention provides a kind of liquid crystal display device utilizing color filter to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a shading area, adjacent to the effective display area connection; a wire collection area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an outer pin bonding area, adjacent to the wire collection area, has a plurality of outer pins and a protective layer formed on the light-shielding area and the outer pin joint area, wherein the light-shielding area is used to prevent light leakage, and the outer pin joint area is used for In order to increase the insulation property between the external pins.

According to the above idea, the protective layer is a resin layer.

According to the above idea, the resin layer is a carbon-containing resin material.

According to the above idea, the thickness of the resin layer is smaller than the height of the external pin.

According to the above idea, the thickness of the resin layer is about 0.5 μm˜3 μm.

According to the purpose described above, the present invention provides a kind of liquid crystal display device utilizing color filter to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a shading area, adjacent to the effective display area connection; a wire collection area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an outer pin bonding area, adjacent to the wire collection area, has a plurality of outer pins and a color filter layer formed on the effective display area and the outer pin joint area, wherein the outer pin joint area is used to increase the distance between the outer pins insulating properties.

According to the above concept, wherein the material of the color filter layer formed in the outer pin bonding area is selected from the following: a red color filter layer, a blue color filter layer, a green color filter layer and Any combination of the above three.

According to the above idea, the thickness of the color filter layer is smaller than the height of the external pin.

According to the above idea, the thickness of the color filter layer is about 0.5 μm˜3 μm.

Description of drawings

Figure 1 shows a cross-sectional view of a general conventional thin film transistor liquid crystal display;

What Fig. 2 depicts is the sectional view of the thin film transistor liquid crystal display that utilizes COA technology to make at present;

What Fig. 3 depicts is the structure of the existing thin film transistor liquid crystal display device that utilizes COA technology to make;

What FIG. 4A depicts is the structure of the thin film transistor liquid crystal display device of the first and second embodiments of the present invention;

FIG. 4B is a cross-sectional view of the wire collection area according to the first embodiment of the present invention;

FIG. 4C is a cross-sectional view of the wire collection area according to the second embodiment of the present invention;

What FIG. 5A depicts is the structure of the thin film transistor liquid crystal display device of the third and fourth embodiments of the present invention;

FIG. 5B is a cross-sectional view of the lead bonding area of the third embodiment of the present invention;

FIG. 5C is a cross-sectional view of the lead bonding area of the fourth embodiment of the present invention;

FIG. 6A shows the structure of the TFT-LCD device according to the fifth and sixth embodiments of the present invention;

6B is a cross-sectional view of the wire gathering area and the outer pin bonding area of the fifth embodiment of the present invention; and

FIG. 6C is a cross-sectional view of the wire gathering area and the outer pin bonding area according to the sixth embodiment of the present invention.

simple notation

11: TFT panel glass

12: Color filter glass

13, 23: Liquid crystal layer

111, 211: thin film transistor

112, 212: pixel electrodes

113: Protective insulating layer

121, 213: color filter

122, 214: filter layer

123, 221: common electrode

21: lower panel glass

22: Upper panel glass

31, 41, 51, 61: effective display area

32: shading layer

33, 411, 511, 611: wire collection area

34, 412, 512, 612: Outer pin landing area

42, 52, 62: glass substrate

43, 53, 63: metal wire

44, 54, 64: ITO or IZO

45, 55, 65: shading layer

46, 56, 66: color filter layer

58, 68: external pins

Detailed ways

Some embodiments of the present invention are described in detail as follows. However, the invention may also be practiced broadly in other embodiments than those described in detail, and the scope of the invention is not limited only by the following claims.

For the first embodiment of the present invention, please refer to FIG. 4A for the structure of a thin film transistor liquid crystal display device and FIG. 4B for a cross-sectional view of a wire collection area. FIG. 4B is a cross-sectional view along the XX' direction in FIG. 4A. First, a series of thin film transistor manufacturing processes, external metal wires and external lead pin manufacturing processes are completed on a transparent glass substrate 42. After the manufacturing process is completed, a plurality of metal wires 43 protrusions as shown in FIG. 4B will be formed. At this time The effective display area, the wire collection area and the outer pin bonding area are electrically connected. Metal wires are generally made of molybdenum (Mo), aluminum (A1) or both. Generally, the outer periphery of metal wires is sputtered with indium tin oxide (ITO) or indium Zinc oxide (IZO) 44 is plated to prevent metal oxidation. After the above manufacturing process is completed, the manufacturing process of the color filter starts. Firstly, a light-shielding layer is formed on the effective display area 41 and the wire gathering area 411 . The method of forming is to spin-coat a carbon-containing resin material on the substrate first, and then expose, develop, and bake through photolithography, and the area outside the light-shielding area in the effective display area 41 and the outer pin bonding area 412 The light-shielding layer is removed, so that the light-shielding layer 45 on FIG. 4B is formed. The metal wires in the wire collection area are covered by the light-shielding layer to prevent the metal wires from being exposed and improve the reliability of the product.

For the second embodiment of the present invention, please refer to FIG. 4A for the structure of a thin film transistor liquid crystal display device and FIG. 4C for a cross-sectional view of the wire gathering area. FIG. 4C is a cross-sectional view along the direction XX' in FIG. 4A. First, a series of manufacturing processes of thin film transistors, external metal wires and external pins are completed on a transparent glass substrate 42. After the manufacturing process is completed, a plurality of metal wires 43 protrusions as shown in FIG. 4C will be formed. At this time The effective display area, the wire collection area and the outer pin bonding area are electrically connected. Metal wires are generally made of molybdenum (Mo), aluminum (A1) or both. Generally, the outer periphery of metal wires is sputtered with indium tin oxide (ITO) or indium Zinc oxide (IZO) 44 is plated to prevent metal oxidation. After the above manufacturing process is completed, the manufacturing process of the color filter starts. Firstly, a light-shielding layer is formed on the effective display area 41 . The method of forming is to spin-coat a carbon-containing resin material on the substrate first, and then expose, develop, and bake through photolithography, and the area outside the light-shielding area in the effective display area 41, the wire gathering area 411 and the external leads The light-shielding layer on the foot joint area 412 is removed, and the fabrication of the color filter begins after the light-shielding layer is completed. At present, the main commercial manufacturing process is the organic pigment dispersion method (PigmentDispersion), which uses the reactive group polymerization (Radical Polymerization) photoresist that disperses the organic pigment to coat the substrate, photolithographic exposure, development and baking, etc. The manufacturing process is performed back and forth three times to form color filter patterns of three different colors of red, green and blue (R, G, B). Organic pigments have Anthraquinone series in R, and Phthalocyanine series in G and B. Wherein, the color filter formed in the effective display area 41 and the wire collection area 411 will be reserved, wherein the color filter located in the wire collection area 411 forms the color filter layer 46 on FIG. 4C, and the retention method can be It is a color filter with a single color of red, green and blue, or a color filter composed of two or three of them, whichever is preferred when the color filter layer 46 is based on its waterproof characteristics and electrical characteristics. depends. Additionally, the color filter in the outer pin bonding area 412 will be removed during the manufacturing process.

For the third embodiment of the present invention, please refer to the structure of the thin film transistor liquid crystal display device in FIG. 5A and the sectional view of the outer pin bonding area in FIG. 5B . FIG. 5B is a sectional view along the YY' direction in FIG. 5A . First, a series of thin film transistor manufacturing processes, external metal wires and external pin manufacturing processes are completed on a transparent glass substrate 52. After the manufacturing process is completed, a plurality of external pins 58 will be formed as shown in FIG. 5B. When the active display area, the wire collection area and the outer pin bonding area are electrically connected. After the above manufacturing process is completed, the manufacturing process of the color filter starts. First, a light-shielding layer is formed on the effective display area 51 and the outer pin bonding area 512. The method of formation is to spin-coat a carbon-containing resin material on the substrate, and then expose, develop, and bake by photolithography. In this way, the light shielding layer 55 shown in FIG. 5B is formed by removing the region other than the light shielding region in the effective display region 51 and the light shielding layer on the wire gathering region 511 . The height of the light-shielding layer 55 is smaller than that of the external pins 58, so that the electrical disconnection problem will not occur when the external pins 58 are connected to a flexible printed circuit board (FPC: Flexible Printed Circuit Board). Generally, the height of the light-shielding layer 55 is about 0.5 μm˜3 μm.

For the fourth embodiment of the present invention, please refer to FIG. 5A for the structure of a thin film transistor liquid crystal display device and FIG. 5C for a cross-sectional view of the outer pin bonding area. FIG. 5C is a cross-sectional view along the YY' direction in FIG. 5A. First, a series of thin film transistor manufacturing processes, external metal wires and external lead pin manufacturing processes are completed on a transparent glass substrate 52. After the manufacturing process is completed, a plurality of external lead pins 58 will be formed as shown in FIG. 5C. When the active display area, the wire collection area and the outer pin bonding area are electrically connected. After the above manufacturing process is completed, the manufacturing process of the color filter starts. Firstly, a light-shielding layer is formed on the effective display area 51. The forming method is to spin-coat a carbon-containing resin material on the substrate, and then expose, develop, and bake through photolithography to cover the effective display area 51. The light-shielding layer on the area outside the light-shielding area, the wire gathering area 511 and the outer lead bonding area 512 is removed, and the production of the color filter starts after the light-shielding layer is completed. At present, the main commercialized manufacturing process is the organic pigment dispersion method (Pigment Dispersion), which uses the reactive group polymerization (Radical Polymerization) photoresist that disperses the organic pigment to coat the substrate, photolithography exposure, development and baking The manufacturing process is performed back and forth three times to form color filter patterns of three different colors of red, green and blue (R, G, B). Organic pigments have Anthraquinone series in R, and Phthalocyanine series in G and B. Wherein, the color filter formed in the effective display area 51 and the outer pin joint area 512 will be reserved, wherein the color filter located in the outer pin joint area 512, namely forms the color filter layer 56 on FIG. 5C , the retention method can be a single-color color filter of red, green, and blue, or a color filter in which two or three of them are laminated, and the color filter layer 56 is selected from the foregoing depending on its waterproof characteristics and Which of the electrical characteristics is preferred depends. In addition, the color filter in the wire gathering area 511 will be removed during the manufacturing process. The height of the color filter layer 56 is smaller than that of the external pins 58, so that the electrical disconnection problem will not occur when the external pins 58 are connected to a flexible printed circuit board (FPC: Flexible Printed Circuit Board). Generally, the height of the color filter layer 56 is about 0.5 μm˜3 μm.

For the fifth embodiment of the present invention, please refer to the structure of the thin film transistor liquid crystal display device in FIG. 6A and the cross-sectional view of the wire gathering area and the outer pin bonding area in FIG. 6B. FIG. 6B is a cross-section along the XX' and YY' directions in FIG. 6A picture. First, a series of thin film transistor manufacturing processes, external metal wires and external pin manufacturing processes are completed on a transparent glass substrate 62. After the manufacturing process is completed, a plurality of metal wires 63 and external pins 68 as shown in FIG. 6B will be formed. At this time, the effective display area, the wire collection area and the outer pin bonding area are electrically connected. Metal wires are generally made of molybdenum (Mo), aluminum (A1) or both. Generally, the outer periphery of metal wires is sputtered with indium tin oxide (ITO) or indium Zinc oxide (IZO) 64 is plated to prevent metal oxidation. After the above manufacturing process is completed, the manufacturing process of the color filter starts. Firstly, a light-shielding layer is formed on the effective display area 61, the wire gathering area 611, and the outer pin bonding area 612. The method of formation is to spin-coat a carbon-containing resin material on the substrate, and then expose it by photolithography. , development, and baking to remove the light-shielding layer in the area other than the light-shielding area in the effective display area 61, thus forming the light-shielding layer 65 in FIG. 6B. The height of the light-shielding layer 65 is greater than the height of the metal wire 63 plus indium tin oxide (ITO) or indium zinc oxide (IZO) 64, but less than the height of the external pin 68, so that the external pin 68 and the flexible printed circuit Board (FPC: Flexible Printed Circuit Board) is connected so that the problem of electrical disconnection will not occur, and the metal wire 63 is also covered by the light-shielding layer 65 to prevent the metal wire from being exposed, thereby improving the reliability of the product.

For the sixth embodiment of the present invention, please refer to the structure of the thin film transistor liquid crystal display device in FIG. 6A and the cross-sectional view of the wire collection area and the outer pin bonding area in FIG. 6C. FIG. 6C is a cross-section along the XX' and YY' directions in FIG. 6A picture. First, a series of thin film transistor manufacturing processes, external metal wires and external pin manufacturing processes are completed on a transparent glass substrate 62. After the manufacturing process is completed, a plurality of metal wires 63 and external pins 68 as shown in FIG. 6C will be formed. At this time, the effective display area, the wire collection area and the outer pin bonding area are electrically connected. Metal wires are generally made of molybdenum (Mo), aluminum (Al) or a combination of the two. Generally, the periphery of metal wires is sputtered with indium tin oxide (ITO) or indium Zinc oxide (IZO) 64 is plated to prevent metal oxidation. After the above manufacturing process is completed, the manufacturing process of the color filter starts. Firstly, a light-shielding layer is formed on the effective display area 61. The method of formation is to spin-coat a carbon-containing resin material on the substrate, and then expose, develop, and bake through photolithography to cover the effective display area 61. The light-shielding layer on the area outside the light-shielding area, the wire gathering area 611 and the outer lead bonding area 612 is removed, and the production of the color filter starts after the light-shielding layer is completed. At present, the main commercialized manufacturing process is the organic pigment dispersion method (Pigment Dispersion), which uses the reactive group polymerization (Radical Polymerization) photoresist that disperses the organic pigment to coat the substrate, photolithography exposure, development and baking The manufacturing process is performed back and forth three times to form color filter patterns of three different colors of red, green and blue (R, G, B). Organic pigments have Anthraquinone series in R, and PhthalocYanine series in G and B. Wherein, the color filter formed in the wire gathering area 611 and the outer pin bonding area 612 will be reserved, that is, the color filter layer 66 on FIG. The color filter, or the color filter made of two or three of them, which one of the above-mentioned ones is selected as the color filter layer 66 depends on which one is preferred for its waterproof characteristics and electrical characteristics. In addition, the height of the color filter layer 66 is greater than the height of the metal wire 63 plus indium tin oxide (ITO) or indium zinc oxide (IZO) 64, but less than the height of the external pin 68, so that the external pin 68 When it is connected with a flexible printed circuit board (FPC: Flexible Printed Circuit Board), the problem of electrical disconnection will not occur, and the metal wire 63 is also covered by the color filter layer 66, so it can prevent water vapor, and then Improve product reliability.

Even though the invention has been described by citing several preferred embodiments, the invention is not limited to the exemplified examples. Although specific embodiments have been exemplified and described above, it is obvious that other equivalent changes or modifications made without departing from the disclosed spirit of the present invention shall be included in the claims of the present invention. In addition, all other similar and similar changes or modifications made without departing from the disclosed spirit of the present invention are also included in the claims of the present invention. At the same time, the scope of the present invention should be interpreted in the broadest definition so as to include all modifications and similar structures.

Claims (10)

1. A liquid crystal display device utilizing color filters to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a light-shielding area adjacent to the effective display area; A wire gathering area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an external pin bonding area, adjacent to the wire collection area, having a plurality of external pins and electrically connected to the wire collection area; and A protective layer is formed on the light-shielding area and the wire collection area, wherein the light-shielding area is used to prevent light leakage, and the wire collection area is used to prevent the metal wire from being exposed. 2. The liquid crystal display device as claimed in claim 1, wherein the protective layer is a resin layer; wherein, the resin layer is a non-conductive layer that is water-proof. 3. The liquid crystal display device as claimed in claim 2, wherein the resin layer is also formed on the outer lead bonding area at the same time, in order to increase the insulating properties between the outer lead pins; wherein the thickness of the resin layer is about 0.5 μm～3μm, and less than the height of the external pin. 4. A liquid crystal display device utilizing color filters to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a light-shielding area adjacent to the effective display area; A wire gathering area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an external pin bonding area, adjacent to the wire collection area, having a plurality of external pins and electrically connected to the wire collection area; and A color filter layer is formed on the effective display area and the wire collection area, wherein the wire collection area is used to prevent the metal wire from being exposed. 5 . The liquid crystal display device as claimed in claim 4 , wherein the color filter layer is also formed at the bonding area of the external pins at the same time, so as to increase the insulating property between the external pins. 6. The liquid crystal display device as claimed in claim 5 , wherein the material of the color filter layer formed in the outer pin bonding area or the wire gathering area is respectively selected from the following: red color filter layer, blue color filter layer, green color filter layer, and any combination of the above three; wherein the thickness of the color filter layer is about 0.5 μm to 3 μm, and is smaller than the height of the external pin. 7. A liquid crystal display device utilizing color filters to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a light-shielding area adjacent to the effective display area; A wire gathering area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an external pin bonding area, adjacent to the wire collection area, having a plurality of external pins and electrically connected to the wire collection area; and A protective layer is formed on the light-shielding area and the outer pin joint area, wherein the light-shielding area is used to prevent light leakage, and the outer pin joint area is used to increase the insulation properties between the outer pins. 8. The liquid crystal display device as claimed in claim 7, wherein the protective layer is a resin layer, and the thickness of the resin layer is about 0.5 μm˜3 μm, and is smaller than the height of the external pin; wherein, and the resin layer It is a non-conductive layer that is waterproof and vapor-proof. 9. A liquid crystal display device utilizing color filters to integrate thin-film transistor array substrate (COA) technology, comprising: an effective display area; a light-shielding area adjacent to the effective display area; A wire gathering area, adjacent to the light-shielding area, has a plurality of metal wires and is electrically connected to the effective display area; an external pin bonding area, adjacent to the wire collection area, having a plurality of external pins and electrically connected to the wire collection area; and A color filter layer is formed on the effective display area and the outer lead joint area, wherein the outer lead joint area is used to increase the insulation property between the outer lead pins. 10. The liquid crystal display device as claimed in claim 9, wherein the material of the color filter layer formed in the outer pin bonding area is selected from the following: a red color filter layer, a blue color filter layer layer, the green color filter layer and any combination of the above three, wherein the thickness of the color filter layer is about 0.5 μm-3 μm, and is smaller than the height of the external pin.

Images