CN1629592A - Heat transfer enhancement structure of flat heat pipe - Google Patents
Heat transfer enhancement structure of flat heat pipe Download PDFInfo
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- CN1629592A CN1629592A CN 200310121710 CN200310121710A CN1629592A CN 1629592 A CN1629592 A CN 1629592A CN 200310121710 CN200310121710 CN 200310121710 CN 200310121710 A CN200310121710 A CN 200310121710A CN 1629592 A CN1629592 A CN 1629592A
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- heat pipe
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Abstract
A heat conduction reinforcing structure of flat heat pipe, its evaporation end of heat pipe is connected to the heating element, and the condensation end is connected to the heat dissipating double-fuselage, the internal surface of the heat pipe cavity has capillary structures, and fill the appropriate amount of working fluid, and carry on the evaporation, condensation cycle of the working fluid in the cavity, wherein, there are several heat conduction columns that butt against the upper, lower wall in the cavity in the higher temperature, in order to be regarded as the reinforcing structure of the heat conduction; therefore, by utilizing the design of the heat conducting column, the thermal resistance on the heat conducting path can be effectively reduced, and the purposes of good heat dissipation and uniform heating are further achieved.
Description
Technical field
The invention provides a kind of heat that the higher temperatures place is provided with the heating column of lower wall surface on the butt in the heat pipe cavity and pass to strengthen structure, utilize the higher coefficient of heat conduction of this heating column, high temperature is conducted to condensation end fast, reach heat radiation and soaking purpose.
Background technology
The continuous development of industrial technology, make electronic building brick move towards compact trend, simultaneously, in high-performance, under the high efficiency demand, the meaning of its representative is the just lifting of operating rate not, the also relative increase of electronic building brick that its unit volume is contained, in the process that performance improves constantly, the problem that its caloric value caused is serious day by day, and when the electronic building brick caloric value increases day by day, difference because of the design of electronic building brick usefulness, the heat flux distribution inequality on the electronic building brick surface of feasible heating, also because of the local temperature difference, and can form so-called focus (hot spot) from the teeth outwards, cause the too high phenomenon of local temperature, and the operating temperature of electronic building brick and its reliability, service life etc. are closely bound up, especially on the limited peripheral commodity assemblies such as notebook computer of volume, therefore how effectively promoting heat-sinking capability has become a critical problem.In order to solve aforesaid problem, the heat radiation of many passive types and soaking assembly are suggested in succession, with as the most effective heat radiation solution of electronic product of future generation, and these heat radiations or soaking assembly all have an identical operation principle, promptly shown in the 1st figure, be provided with capillary structure 2 on a vacuum cavity 1 inner surface, and filling working fluid partly, because of gravity and the event of capillarity, on the capillary structure of liquid distribution in this cavity 1, when cavity 1 contact heating source, with respect to the working fluid of pyrotoxin because of evaporating by heat, will condensation when steam touches colder position, then because of the capillary force that gravity and condensed fluid and capillary structure produced, liquid-conducting (is promptly contacted the position of evaporation) to the less capillary structure place of content liquid with pyrotoxin, to carry out evaporative condenser circulation next time, constantly evaporate and condensation process by liquid, the temperature difference with minimum reaches cold junction with heat by the hot junction; In this type of heat radiation or the soaking assembly, it is in evaporation and condensation process, capillary structure is crucial necessity design, capillary structure not only provides the channel as liquid, and the driving force (that is capillarity) of liquid flow is provided, makes to make in the cavity working fluid carry out the circulation of liquid vapour two-phase flow smoothly; Yet show according to analyzing, capillary structure is low because of its coefficient of heat conduction, becomes a heat also and pass to hinder, and makes that the liquid that is adsorbed in the capillary structure can't be as the appearance liquid Evaporation Phenomenon as the expection, cause heat radiation or soaking poor effect, and influence the performance of overall performance.Once had some to improve structure and occur, but its effect is all undesirable, as described in following patent documentation:
1, No. the 89210557th, Taiwan patent application " flat plate heat tube structural improvement ": see also Fig. 2, this patent case is to be filled with an amount of working fluid in an enclosed vacuum cavity 3, blazon the capillary structure 4 of the upper and lower wall of several butts in the cavity, and become the supporting construction of this flat plate heat tube, using increases heat pipe structure intensity, increases the quantity and the surface area of capillary structure simultaneously; This case is to blazon capillary structure, to provide support and the effect of condensed water liquid backflow water conservancy diversion, only lower because of the coefficient of heat conduction of capillary structure own, catch formation heat on the contrary in heat and pass obstruction, therefore this case is caught in heat and be there is no special effect, especially uneven at some heatings, form the electronic building brick of focus (hot spot) in the part, this case also can't provide the solution of effect.
2, No. the 86115415th, Taiwan patent application " heat-pipe type radiator ": see also Fig. 3, this patent case is to be filled with an amount of working fluid in an enclosed vacuum cavity 5, the cavity top is provided with several radiating fins 6, be provided with several diversion columns 7 and capillary structure district 8 in the cavity, and provide support and guide functions, and increase liquid and the contact area of thermal source and the guide functions of condensate liquid with capillary structure 8 by diversion column 7; But the diversion column 7 of this case is to blazon setting, mainly act as to support and water conservancy diversion, therefore catches in heat to there is no special-effect and produce, and also needleless is made special heat to hot localised points (hot spot) and passed design, and effect is apparent a deficiency so heat passes.
3, No. the 88210055th, Taiwan patent application " heat pipe soaking plate ": see also Fig. 4, this patent case is that the upper face 10 at a cavity 9 is provided with several protruding posts 11, lower face 12 is provided with capillary structure 13, this capillary structure 13 and with protruding post 11 butts of upper face 10, make the backflow water conservancy diversion of condensed water liquid by utilizing capillary structure 13, and with protruding post 11 butts, to form supporting role; This case is with capillary structure 13 and protruding post 11 butts, and provide a supporting role, forming heat at capillary structure 13 on the contrary because of the coefficient of heat conduction is low passes under the obstruction, protruding post 11 with capillary structure 13 butts, and the effect that can't provide heat to pass, especially use at the electronic building brick of hot localised points (hot spot), effective heat radiation and equal thermal effect can't be provided.
Summary of the invention
The heat that main purpose of the present invention provides a kind of plate heat pipe passes the reinforcement structure, it is to fill an amount of working fluid in an enclosed vacuum cavity, cavity inner surface is provided with capillary structure, to carry out the liquid vapour two-phase flow circulation of working fluid, wherein, the higher temperatures place also is provided with the heating column of the upper and lower internal face of butt in cavity, strengthens structure to pass as heat; By this, utilize heating column to provide the high-temperature region effective heat transfer path,, reach good heat radiation and equal thermal effect to reduce the thermal resistance on the heat biography path.
The heat that another object of the present invention provides a kind of plate heat pipe passes the reinforcement structure, wherein this is connected to the heating column of upper and lower internal face, be to make by the high thermal conductivity coefficient material, pass effect and have high heat, and in high-temperature region distribution setting, can make heat biography fast at the high temperature of part, to reach good uniform temperature and thermal diffusivity.
The heat that another purpose of the present invention provides a kind of plate heat pipe passes the reinforcement structure, wherein, all sides at heating column also can be inserted the capillary structure with flow conductivity, this heating column week the capillary structure of side be metal spring shape, netted or with the porous structure of sintering metal powder institute moulding; And the capillary structure of all sides of this heating column, can also be channel form or the vesicular texture that all side straight formings of heating column body go out, make the evaporation of liquid phenomenon to follow and occur on this path, to promote the cyclic process of evaporation and condensation, and when utilizing heating column to reduce thermal resistance, also can be because of liquid evaporation provide good diffusion effect, reaching the requirement of soaking, and reduce the thermal resistance of whole device.
The object of the present invention is achieved like this: a kind of heat of plate heat pipe passes strengthens structure, it is to be an enclosed vacuum cavity, the outside heat generating component that connects of cavity evaporation ends, the condensation end outside then connects heat abstractor, cavity inner surface is provided with capillary structure, and be filled with an amount of working fluid, with evaporation, the condensation cycle of carrying out two-phase flow; Its principal character is to be to be provided with in this cavity the heating column that several are connected to upper and lower wall.
Wherein, the heating column that this is connected to upper and lower internal face is distributed in high-temperature region or focus place, and can be of different sizes or shape, to reach good uniform temperature and thermal diffusivity.
Wherein, this heating column is to be made by the high thermal conductivity coefficient material, passes effect and have high heat.Described high thermal conductivity coefficient material is meant the material that has high heat-conduction coefficient as solid silver, copper, aluminium, diamond, graphite, CNT etc.,
Wherein, all sides of this heating column are provided with capillary structure.
Wherein, this heating column week side capillary structure be metal spring shape, netted or with the porous structure of sintering metal powder institute moulding.
Wherein, the capillary structure of all sides of this heating column is the channel form or the cellular that go out in all side straight formings of heating column body.
Description of drawings
Fig. 1 is the schematic diagram of general radiator condensation cycle.
Fig. 2 is the schematic diagram of Taiwan patent application No. 89210557 " flat plate heat tube structural improvement ".
Fig. 3 is the schematic diagram of Taiwan patent application No. 86115415 " heat-pipe type radiator ".
Fig. 4 is the schematic diagram of Taiwan patent application No. 88210055 " heat pipe soaking plate ".
Fig. 5 is the schematic diagram () of cavity of the present invention.
Fig. 6 is that the present invention's heat passes the distribution schematic diagram of strengthening structure.
Fig. 7 is the schematic diagram (two) of cavity of the present invention.
Fig. 8 is the schematic diagram (three) of cavity of the present invention.
The assembly numbering:
The prior art part:
The present invention's part:
Cavity 20; Capillary structure 201; Heating column 202; Capillary structure 203; Support column 204; Heat abstractor 21; Heat generating component 22.
The specific embodiment
See also Fig. 5, heat pipe cavity 20 of the present invention is an enclosed vacuum cavity, this cavity 20 is a copper, the good material of aluminium or other heat conduction is made, outside top in cavity 20 is equiped with heat abstractor 21, the below then links on the heat generating component 22, the surface, inside of cavity 20 is provided with capillary structure 201, and be filled with an amount of working fluid, this working fluid is generally pure water, ammoniacal liquor or organic solution such as methyl alcohol, ethanol or acetone etc. are beneficial to the fluid of evaporative heat loss, and can optionally add the metal or the non-metal solid powder of different proportion, because of gravity and the event of capillarity, working fluid is distributed in the position of capillary structure, when the contact heating source, the working fluid of contact area is because of evaporating by heat, when steam rises to colder position, top, will condensation and contact the capillary force that is produced with capillary structure 201 because of gravity and condensed fluid, liquid-conducting (is promptly contacted the position of evaporation) to the less capillary structure place of content liquid with the hot junction, to carry out the circulation of liquid vapour two-phase flow, yet because capillary structure 201 is low because of the coefficient of heat conduction, in fact be difficult for medium as the heat biography, in order to make the high-temperature region have better heat radiation and equal thermal effect, the present invention is provided with in cavity 20 and is connected to, the heating column 202 of lower wall surface, this heating column 202 is by as solid silver, copper, aluminium, diamond, graphite, the material of high thermal conductivity coefficients such as CNT is made, pass effect and have high heat, and it is connected to, lower wall surface, so reducing under the thermal resistance, can be fast and effectively with the heat energy on the heat generating component 22, conduct to the condensation end of top, and form the reinforcement structure that a heat passes.See also Fig. 6, because having preferable heat, heating column 202 passes effect, therefore on electronic building brick, can do the setting that distributes at its high-temperature region or focus (hot spot), so that high temperature is sent to condensation end fast, reaches good uniform temperature and thermal diffusivity, and look the distributed needs of high-temperature region or focus (hot spot), heating column 202 can be done the design of various different sizes or shape, passes effect to reach optimized heat.See also Fig. 7, heat of the present invention passes strengthens structure, can capillary structure 203 be set in all sides of heating column 202, this capillary structure 203 can be the metal spring shape, netted or with the porous structure of sintering metal powder institute moulding, owing to capillary structure 203 is set in heating column 202 all sides, the heat that not only can make the liquid Evaporation Phenomenon follow to occur in heating column 202 passes on the path, to promote the cyclic process of evaporation and condensation, and can provide the diffusion effect of good heat radiating because of evaporation of liquid, to reach the requirement of soaking, moreover capillary structure 203 also has flow conductivity, and it can be back to the high-temperature region with the water liquid water conservancy diversion of condensation end, to carry out the circulation of working fluid; In addition, in all sides of heating column 202 bodies, but also straight forming goes out channel form or cavernous capillary structure 203, and identical effect with capillary structure promotion absorption, evaporation and condensation cycle.See also Fig. 8, cavity 20 of the present invention is structural deterioration and the distortion of avoiding atmospheric pressure to cause owing to be to be vacuum cavity, and several support columns 204 are set in cavity in addition, to support the suffered stress in cavity hollow part.
Claims (6)
1, a kind of heat of plate heat pipe passes and strengthens structure, it is to be an enclosed vacuum cavity, the outside heat generating component that connects of cavity evaporation ends, the condensation end outside then connects heat abstractor, cavity inner surface is provided with capillary structure, and be filled with an amount of working fluid, with evaporation, the condensation cycle of carrying out two-phase flow; Its principal character is to be to be provided with in this cavity the heating column that several are connected to upper and lower wall.
2, the heat according to the described plate heat pipe of claim 1 passes the reinforcement structure, and wherein, the heating column that this is connected to upper and lower internal face is distributed in high-temperature region or focus place, and can be of different sizes or shape, to reach good uniform temperature and thermal diffusivity.
3, the heat according to the described plate heat pipe of claim 1 passes the reinforcement structure, and wherein, this heating column is to be made by the high thermal conductivity coefficient material, passes effect and have high heat.
4, the heat according to the described plate heat pipe of claim 1 passes the reinforcement structure, and wherein, all sides of this heating column are provided with capillary structure.
5, pass according to the heat of the described plate heat pipe of claim 4 and strengthen structure, wherein, this in heating column week the capillary structure of side be metal spring shape, netted or with the porous structure of sintering metal powder institute moulding.
6, the heat according to the described plate heat pipe of claim 4 passes the reinforcement structure, and wherein, the capillary structure of all sides of this heating column is the channel form or the cellular that go out in all side straight formings of heating column body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101217101A CN1300541C (en) | 2003-12-19 | 2003-12-19 | Heat transfer enhancement structure of flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101217101A CN1300541C (en) | 2003-12-19 | 2003-12-19 | Heat transfer enhancement structure of flat heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1629592A true CN1629592A (en) | 2005-06-22 |
| CN1300541C CN1300541C (en) | 2007-02-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101217101A Expired - Fee Related CN1300541C (en) | 2003-12-19 | 2003-12-19 | Heat transfer enhancement structure of flat heat pipe |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008101384A1 (en) * | 2007-02-09 | 2008-08-28 | Zhejiang Acmecools Electronic Technology Co., Ltd. | Heat transfer device and manufacturing method thereof |
| CN101090621B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
| CN107228585A (en) * | 2017-07-27 | 2017-10-03 | 中国科学院长春光学精密机械与物理研究所 | A kind of cavity body structure of spoke cold drawing |
| CN112752474A (en) * | 2020-10-30 | 2021-05-04 | 天津七所精密机电技术有限公司 | Wetting modification processing method for case body and high-protection reinforced electronic equipment |
| CN113260216A (en) * | 2020-02-10 | 2021-08-13 | 优材科技有限公司 | Heat conduction device and electronic device |
| CN113784571A (en) * | 2020-06-10 | 2021-12-10 | 尼得科超众科技股份有限公司 | Heat conduction member and cooling device having the same |
| CN114234735A (en) * | 2021-12-31 | 2022-03-25 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
| CN115244353A (en) * | 2019-12-24 | 2022-10-25 | 全球冷却技术集团有限责任公司 | Micro-channel pulsating heat pipe |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062234A (en) * | 2008-09-02 | 2010-03-18 | Sony Corp | Heat spreader, electronic equipment and method of manufacturing heat spreader |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1079994A1 (en) * | 1981-04-03 | 1984-03-15 | Научно-исследовательский конструкторско-технологический институт тракторных и комбайновых двигателей | Flat heat pipe |
| JP3164518B2 (en) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | Flat heat pipe |
| US6293332B2 (en) * | 1999-03-31 | 2001-09-25 | Jia Hao Li | Structure of a super-thin heat plate |
| CN1192202C (en) * | 2001-09-06 | 2005-03-09 | 李嘉豪 | Flat-plate loop heat pipe (1) |
-
2003
- 2003-12-19 CN CNB2003101217101A patent/CN1300541C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101090621B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
| WO2008101384A1 (en) * | 2007-02-09 | 2008-08-28 | Zhejiang Acmecools Electronic Technology Co., Ltd. | Heat transfer device and manufacturing method thereof |
| CN107228585A (en) * | 2017-07-27 | 2017-10-03 | 中国科学院长春光学精密机械与物理研究所 | A kind of cavity body structure of spoke cold drawing |
| CN115244353A (en) * | 2019-12-24 | 2022-10-25 | 全球冷却技术集团有限责任公司 | Micro-channel pulsating heat pipe |
| CN113260216A (en) * | 2020-02-10 | 2021-08-13 | 优材科技有限公司 | Heat conduction device and electronic device |
| CN113784571A (en) * | 2020-06-10 | 2021-12-10 | 尼得科超众科技股份有限公司 | Heat conduction member and cooling device having the same |
| CN112752474A (en) * | 2020-10-30 | 2021-05-04 | 天津七所精密机电技术有限公司 | Wetting modification processing method for case body and high-protection reinforced electronic equipment |
| CN114234735A (en) * | 2021-12-31 | 2022-03-25 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
| CN114234735B (en) * | 2021-12-31 | 2024-05-14 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
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| Publication number | Publication date |
|---|---|
| CN1300541C (en) | 2007-02-14 |
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Granted publication date: 20070214 Termination date: 20181219 |