CN1574114A - Resistor and circuit board - Google Patents
Resistor and circuit board Download PDFInfo
- Publication number
- CN1574114A CN1574114A CN 200410032939 CN200410032939A CN1574114A CN 1574114 A CN1574114 A CN 1574114A CN 200410032939 CN200410032939 CN 200410032939 CN 200410032939 A CN200410032939 A CN 200410032939A CN 1574114 A CN1574114 A CN 1574114A
- Authority
- CN
- China
- Prior art keywords
- layout
- resistor
- electrode
- prediction
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a resistor and a circuit board. The resistor (10) comprises an element body (11) and a rectangular electrode (12a, 12b) arranged on the element body (11), wherein, at least one corner of one end of the rectangular electrode (12a, 12b) with current flowing through passes a blend radius.
Description
Technical field
The present invention relates to a kind of resistor and the used circuit board of a kind of electronics.
Background technology
In the used a kind of square chip resistor of electronic circuit, following technology is known.The profile of resistive element is unlike rectangle, and a semicircle of picture and a half elliptic etc.For this reason, the someone proposes to reduce changes in resistance (for example, referring to Japanese Unexamined Patent Publication No 8-102401).
But, the resistive element manufacturing technology that this technology relates to is in order to reduce the resistance variations of resistive element in the resistor, the resistance variations when still not considering the circuit assembling.
As mentioned above, in the used resistor of electronic circuit, the resistance manufacturing technology that reduces the changes in resistance of resistive element has been arranged.But, reduce resistance variations when assembling, also do not propose a kind of otherwise effective technique about circuit.
Summary of the invention
An object of the present invention is to provide the little resistor of a kind of resistance error, and a kind of circuit board that when circuit assembles, can reduce resistance variations.
A kind of resistor according to first aspect present invention is characterized in that comprising: an element body; And a rectangular electrode of this element body outfit, at least one turning of an end of rectangular electrode of wherein electric current inflow is through rounding.
A kind of circuit board according to second aspect present invention is characterized in that comprising: one applies first layout of a voltage to it; The electric current that the voltage that one first layout applies produces flows into second layout wherein; A resistor has first and second electrodes, and its angle is through rounding, and first electrode is connected to first layout, and second electrode is connected to second layout.
Brief Description Of Drawings
Figure 1A and Figure 1B have shown a resistor and the assembling example of this resistor on a slice circuit board in the first embodiment of the invention;
Fig. 2 is a width of cloth oblique projection figure, has shown the profile of resistor among first embodiment;
Fig. 3 A and Fig. 3 B have shown a resistor and the assembling example of this resistor on a slice circuit board in the second embodiment of the invention;
Fig. 4 is a width of cloth oblique projection figure, shown the profile of resistor among second embodiment;
Fig. 5 has shown that in comprising a resistor with multiple profile of a resistor of the present invention a kind of wiring pattern the during CURRENT DISTRIBUTION of simulation electrode binding site is arranged (layout 1);
Fig. 6 has shown a kind of layout (layout 2) that is associated with Fig. 5;
Fig. 7 has shown a kind of layout (layout 3) that is associated with Fig. 5;
Fig. 8 has shown a kind of layout (layout 4) that is associated with Fig. 5;
Fig. 9 A and Fig. 9 B have shown the CURRENT DISTRIBUTION of the electrode binding site of layout 1 in the existing square chip resistor;
Figure 10 A and Figure 10 B have shown the CURRENT DISTRIBUTION of the electrode binding site of layout 2 in the existing square chip resistor;
Figure 11 A and Figure 11 B have shown the CURRENT DISTRIBUTION of the electrode binding site of layout 3 in the existing square chip resistor;
Figure 12 A and Figure 12 B have shown the CURRENT DISTRIBUTION of the electrode binding site of layout 4 in the existing square chip resistor;
Figure 13 is a width of cloth oblique projection figure, has shown the profile of the resistor (Resistance model for prediction 1) that will measure;
Figure 14 is a width of cloth oblique projection figure, has shown the profile of the resistor (Resistance model for prediction 2) that will measure;
Figure 15 is a width of cloth oblique projection figure, has shown the profile of the resistor (Resistance model for prediction 3) that will measure;
Figure 16 is a width of cloth oblique projection figure, has shown the profile of the resistor (Resistance model for prediction 4) that will measure;
Figure 17 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 1 in the Resistance model for prediction 1;
Figure 18 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 2 in the Resistance model for prediction 1;
Figure 19 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 1 in the Resistance model for prediction 2;
Figure 20 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 2 in the Resistance model for prediction 2;
Figure 21 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 1 in the Resistance model for prediction 3;
Figure 22 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 2 in the Resistance model for prediction 3;
Figure 23 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 1 in the Resistance model for prediction 4;
Figure 24 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 2 in the Resistance model for prediction 4;
Figure 25 has shown the CURRENT DISTRIBUTION of the electrode binding site of layout 3 in the Resistance model for prediction 3.
Embodiment
Hereinafter, will quote these accompanying drawings, explain some embodiment of the present invention.
Figure 1A, Figure 1B and Fig. 2 have shown the structure of square chip resistor in the first embodiment of the invention respectively.Figure 1A is a plane graph, and Figure 1B is a side view, and Fig. 2 is oblique projection figure.
Resistor 10 in the first embodiment of the invention has a square pellet resistance body 11 (R), and it has hexahedral shape and a pair of rectangular electrode 12a and 12b in fact, is provided in the two ends of square sheet resistive element 11 (R) lower surface.
In first embodiment of the present invention, constitute the square sheet resistive element 11 (R) of resistor 10 and electrode pair 12a and the 12b that square sheet resistive element 11 (R) downside two ends are equipped with, rounding (carrying out arc angling: be called " rounding " hereinafter) has all been carried out at its each angle, respectively as Figure 1A, Figure 1B and shown in Figure 2.
Shown in Figure 1B, for example make electrode pair 12a and the 12b that is equipped with on square sheet resistive element 11 (R) lower surface with scolder, be connected with Pb with the layout Pa that is equipped with on the circuit board 30, resistor 10 (rounding has been passed through at the turning of its square sheet resistive element 11 (R) and electrode pair 12a and 12b respectively) just has been assemblied on the circuit board 30.In this case, the electrode 12a of resistor 10 layout Pa and Pb that be connected with 12b, circuit board 30, wideer than electrode 12a and 12b, so electrode 12a and 12b are connected to layout Pa and Pb with whole width.
Therefore, each angle of square shaped pellet resistance body 11 (R) and electrode pair 12a and 12b is all passed through respectively after the rounding, flows to the electric current resistance error that concentration of local caused on the turning of resistor 10 of resistor 10, just can be controlled.
Exactly, when the electric current that for example applies the rectangular voltage generation flows into resistive element, if supposing electrode and resistive element is rectangle, square sheet resistive element as routine, so in the electrode area of electric current flow side (source), electric current just is concentrated on the electrode turning, and it is quite significant that the bias current of this concentration of local distributes.So electric current can not flow into resistive element equably, will produce the resistance error that bias current distributes and causes.
In this case, as in the above-described embodiments, rounding is all carried out at each angle of square shaped pellet resistance body 11 (R) and electrode pair 12a and 12b respectively.As a result, be controlled because above-mentioned bias current distributes, electric current flows to resistive element equably, just can suppress the resistance error that bias current distributes and causes.
So, only rounding is carried out at the turning of the electrode (for example 12a) of the source of electric current inflow, just can expect above-mentioned advantage.
The bias current resistance error cause that distributes also can (remittance side) produce in the electric current outflow side, as at above-mentioned source.But, rounding is all carried out at the electrode 12a that square shaped pellet resistance body 11 (R) is equipped with and each turning of 12b respectively, and the bias current of just having controlled on the above-mentioned remittance side distributes, thereby has suppressed the resistance error that bias current distributes and causes.
The direction of resistor and layout can change this CURRENT DISTRIBUTION in the electrode binding site.Below with reference to Fig. 5 to Figure 25, introduce the CURRENT DISTRIBUTION difference of square chip resistor in the square chip resistor of conventional structure and the embodiment of the invention.
With reference to figure 3A, Fig. 3 B and Fig. 4, resistor and assembling example in the explanation second embodiment of the invention.
Each width of cloth among Fig. 3 A, Fig. 3 B and Fig. 4 has all shown the square sheet resistor structure according to second embodiment of the invention.Fig. 3 A is a plane graph, and Fig. 3 B is a side view, and Fig. 4 is an external perspective view.
In second embodiment of the present invention, suppose that the square sheet resistive element 21 (R) of formation resistor 20 is a rectangle, be similar to conventional resistor.Constitute the square sheet resistive element 21 (R) of resistor 20, rounding has all been carried out at the electrode pair 22a that its downside two ends are equipped with and each angle of 22b respectively, as shown in Figure 3A.
Shown in Fig. 3 B, for example make electrode pair 22a and the 22b that is equipped with on square sheet resistive element 21 (R) lower surface with scolder, be connected with Pb with the layout Pa that is equipped with on the circuit board 30, resistor 20 (be provided in the electrode pair 22a at square sheet resistive element 21 (R) lower surface two ends and the turning of 22b and passed through rounding) just has been assemblied on the circuit board 30.In this case, the layout Pa and the Pb of the electrode 22a of resistor 20 and the circuit board 30 that 22b is attached thereto, wideer than electrode 22a and 22b, so electrode 22a and 22b are connected to layout Pa and Pb with whole width.
As mentioned above, rounding has all been passed through at the electrode pair 22a that square sheet resistive element 21 (R) is equipped with and each turning of 22b respectively.As a result, at the binding site of layout Pa and Pb layout Pa and Pb and electrode 22a and 22b, the resistance error that the electric current concentration of local is caused on the turning of electrode 22a and 22b just can be controlled.Exactly, be rectangle for example at the hypothesis electrode, during as the square sheet resistive element of routine, make electric current flow into resistive element if apply rectangular voltage, in the source electrode area of corresponding electric current inflow, electric current just is concentrated on the electrode turning.So,, will produce the resistance error that bias current distributes and causes owing to go up inflow equably of electric current at the electrode 22a and the 22b of square sheet resistive element 21 (R).In this case, as above-mentioned embodiment, rounding has all been passed through at the electrode pair 22a that square sheet resistive element 21 (R) is equipped with and each turning of 22b respectively.As a result, because the bias current of above-mentioned CURRENT DISTRIBUTION has been subjected to control, electric current flows to resistive element equably, just can suppress the resistance error that bias current distributes and causes.In addition, the bias current resistance error cause that distributes also can be created in the remittance side, as at above-mentioned source.But, rounding is all carried out at each turning of electrode 22a and 22b, just controlled above-mentioned bias current and distributed, thereby suppressed the resistance error that bias current distributes and causes.In this case, the direction of resistor and layout can change CURRENT DISTRIBUTION.
Draw together conventional square chip resistor according to the square chip resistor that has the rounding turning of the above embodiment of the present invention and the square sheet resistor packages that has a multiple electrode shape, the analog result of its CURRENT DISTRIBUTION difference is presented among Fig. 5 to Figure 25.
Measuring condition is as follows.The square chip resistor of measuring is as follows.The basic configuration of square sheet resistive element is 6.35mm (L) * 3.18mm (W) * 4.7mm (T).The basic configuration of the electrode of square sheet resistive element downside two ends outfit is 2.20mm (d) * 3.18mm (W) X0.15mm (T).Resistance is 0.001 Ω, and electric rating is 1.0W, and rated current is 31.6A.In Fig. 5 to Figure 25, square chip resistor is represented that by symbol R electrode is by symbol Ta (source) and symbol Tb (remittance side) expression.Suppose that the ambient temperature of measuring is 25 ± 5 ℃, measuring electric current is DC1A or littler, and Measurement Resolution is 0.1 μ Ω.
After Fig. 5 to Fig. 8 has shown some arrangement examples of square chip resistor (R) and layout (Pa, Pb), comprised square chip resistor (R), just formed current path.Notice that in an example that shows, arranging (circuit is connecting) existing square chip resistor (R) on layout (Pa, Pb), rounding is not passed through at its turning.
Fig. 5 to Fig. 8 has shown assembled and when measuring square chip resistor (R) arrangement examples (layout 1 is to layout 4) of the representative configuration of square chip resistor (R) (Pa, Pb) respectively on circuit board.
In layout placement example shown in Figure 5, narrow layout (Pa, Pb) and square chip resistor (R) are the directions that flows along electric current, with straight line.In this layout placement example, after layout (Pa) applied voltage, electric current just was easy to flow from the end of the electrode Ta (source) of square chip resistor (R).Notice that layout layout shown in Figure 5 is called " layout 1 ".
In layout placement example shown in Figure 6, the width of layout (Pa, Pb) is greater than the width of electrode Ta and Tb.In this layout placement example, after layout (Pa) applied voltage, electric current just was easy to from the terminal of the electrode Ta (source) of square chip resistor (R) and flows on every side.Notice that layout layout shown in Figure 6 is called " layout 2 ".
In layout placement example shown in Figure 7, square chip resistor (R) is arranged in also each end of Column Layout (Pa, Pb).In this layout placement example, after layout (Pa) applied voltage, electric current turned to layout (Pb) by square chip resistor (R).Notice that layout layout shown in Figure 7 is called " layout 3 ".
In layout placement example shown in Figure 8, square chip resistor (R) is crossed on the different layout of bearing of trend (Pa, Pb).In this layout placement example, after layout (Pa) applied voltage, electric current flowed to layout (Pb) with Z-shaped direction.Notice that layout layout shown in Figure 8 is called " layout 4 ".
Fig. 9 A to Figure 12 B has shown and utilizes Fig. 5 to layout placement (layout 1 is to layout 4) shown in Figure 8 that the turning does not have the measured CURRENT DISTRIBUTION of square chip resistor (R) of profile rounding, existing.In Fig. 9 A to Figure 12 B, the highest part of current density is shown as d1, is shown as d2 than higher part.
Fig. 9 A has shown when arranging that with " layout 1 " shown in Figure 5 the turning does not have the square chip resistor (R) of profile rounding, existing, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of square chip resistor (R), partly concentrate on the point.
Fig. 9 B shown when arranging the square chip resistor (R) of existing profile with " layout 1 " shown in Figure 5, converges the CURRENT DISTRIBUTION of lateral electrode binding site.In this example, flow to the electric current of layout (Pb), partly concentrate on the point.
Figure 10 A has shown when arranging the square chip resistor (R) of existing profile with " layout 2 " shown in Figure 6, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of square chip resistor (R), partly concentrate on several points.
Figure 10 B shown when arranging the square chip resistor (R) of existing profile with " layout 2 " shown in Figure 6, converges the CURRENT DISTRIBUTION of lateral electrode binding site.In this example, flow to the electric current of layout (Pb), partly concentrate on several points.
Figure 11 A has shown when arranging the square chip resistor (R) of existing profile with " layout 3 " shown in Figure 7, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of square chip resistor (R), partly concentrate on the point.
Figure 11 B shown when arranging the square chip resistor (R) of existing profile with " layout 3 " shown in Figure 7, converges the CURRENT DISTRIBUTION of lateral electrode binding site.In this example, flow to the electric current of layout (Pb), partly concentrate on several points.
Figure 12 A has shown when arranging the square chip resistor (R) of existing profile with " layout 4 " shown in Figure 8, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of square chip resistor (R), partly concentrate on the point.
Figure 12 B shown when arranging the square chip resistor (R) of existing profile with " layout 4 " shown in Figure 8, converges the CURRENT DISTRIBUTION of lateral electrode binding site.In this example, flow to the electric current of layout (Pb), partly concentrate on the point.
Shown in Fig. 9 A to Figure 12 B, in the square chip resistor (R) of existing profile, even in layout placement (layout 1 is to layout 4) any, CURRENT DISTRIBUTION concentrates on the point or the distribution on several point with can becoming current segment, and electric current can not flow through resistive element equably.So can cause resistance error.
Figure 13 to Figure 16 has shown the form instance of the resistor that will measure respectively.Figure 13 to Figure 16 has shown the example (Resistance model for prediction 1 is to Resistance model for prediction 4) that the profile of pellet resistance body and electrode all changes.The chip resistor that Figure 13 shows, profile is as ellipse.The chip resistor that Figure 14 shows, its turning be crooked (roundings of radius 600 μ m) gradually.The square chip resistor that Figure 15 shows, the rounding (radius 300 μ m) of first embodiment of the invention has been passed through at its turning.The chip resistor that Figure 16 shows, the profile at its two ends is all as semicircle.Profile shown in Figure 13 is called " Resistance model for prediction 1 " as the chip resistor of ellipse.The chip resistor that its turning shown in Figure 14 is crooked gradually is called " Resistance model for prediction 2 ".Shown in Figure 15 according to the square chip resistor (be illustrated in figures 1 and 2 square chip resistor 10) of first embodiment of the invention through rounding, be called " Resistance model for prediction 3 ".The profile at its two ends shown in Figure 16 all as the chip resistor of semicircle, is called " Resistance model for prediction 4 ".
Figure 17 to Figure 24 has shown respectively and utilizes Fig. 5 to layout placement (layout 1 is to layout 4) shown in Figure 8, the measured CURRENT DISTRIBUTION of resistor of above-mentioned each Resistance model for prediction (Resistance model for prediction 1 is to Resistance model for prediction 4).In Figure 17 to Figure 24, the highest part of current density is shown as d1, is shown as d2 than higher part.
Figure 17 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 1 " shown in Figure 13 with " layout 1 " shown in Figure 5, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of the chip resistor (R) of " Resistance model for prediction 1 ", partly concentrate on the point.
Figure 18 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 1 " shown in Figure 13 with " layout 2 " shown in Figure 6, the CURRENT DISTRIBUTION of source electrode binding site.In this example, the current ratio of the chip resistor (R) of inflow " Resistance model for prediction 1 " is more even.
Figure 19 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 2 " shown in Figure 14 with " layout 1 " shown in Figure 5, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of the chip resistor (R) of " Resistance model for prediction 2 ", occur slightly partly concentrating on the point.
Figure 20 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 2 " shown in Figure 14 with " layout 2 " shown in Figure 6, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of the chip resistor (R) of " Resistance model for prediction 2 ", occur slightly partly concentrating on several points.
Figure 21 shown with " layout 1 " shown in Figure 5 and arranged the square chip resistor 10 according to first embodiment of the invention illustrated in figures 1 and 2, during the chip resistor (R) of " Resistance model for prediction 3 " promptly shown in Figure 15, and the CURRENT DISTRIBUTION of source electrode binding site.In this example, the current ratio of the chip resistor (R) of inflow " Resistance model for prediction 3 " is more even.
Figure 22 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 3 " shown in Figure 15 with " layout 2 " shown in Figure 6, the CURRENT DISTRIBUTION of source electrode binding site.In this example, the current ratio of the chip resistor (R) of inflow " Resistance model for prediction 3 " is more even.
Figure 23 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 4 " shown in Figure 16 with " layout 1 " shown in Figure 5, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of the chip resistor (R) of " Resistance model for prediction 4 ", partly concentrate on the point.
Figure 24 has shown when arranging the square chip resistor (R) of " Resistance model for prediction 4 " shown in Figure 16 with " layout 2 " shown in Figure 6, the CURRENT DISTRIBUTION of source electrode binding site.In this example, flow into the electric current of the chip resistor (R) of " Resistance model for prediction 4 ", partly concentrate on the point.
Obtain following result from the CURRENT DISTRIBUTION of each Resistance model for prediction shown in Figure 17 to 24 (Resistance model for prediction 1 is to Resistance model for prediction 4).
Following result obtains from " Resistance model for prediction 1 " shown in Figure 13.In " layout 2 " shown in Figure 6, the current ratio of the chip resistor (R) of inflow " Resistance model for prediction 1 " is more even, as shown in figure 18.In " layout 1 " shown in Figure 5, because current segment ground concentrates, as shown in figure 17, electric current is the chip resistor (R) of inflow " Resistance model for prediction 1 " equably.So, in " layout 1 " shown in Figure 5, the chip resistor (R) of " Resistance model for prediction 1 " shown in Figure 13, its resistance error is big.
Following result obtains from " Resistance model for prediction 2 " shown in Figure 14.As Figure 19 and shown in Figure 20, in " layout 1 " shown in Figure 5 and " layout 2 " shown in Figure 6, all visible some current concentration of part is on several points.The result just can understand, and when carrying out rounding at the turning of electrode with circular arc, if radius is big, electric current also can partly be concentrated as " Resistance model for prediction 1 ".
Following result obtains from " Resistance model for prediction 4 " shown in Figure 16.From Figure 23 and Figure 24 as seen, as " Resistance model for prediction 1 " shown in Figure 13, in " layout 1 " shown in Figure 5 and " layout 2 " shown in Figure 6, electric current all partly concentrates on the point.The result just can understand, even the end of electrode is made semicircle, electric current also can partly be concentrated as " Resistance model for prediction 1 ".
Following result obtains from " Resistance model for prediction 3 " shown in Figure 15.As Figure 21 and shown in Figure 22, in " layout 1 " shown in Figure 5 and " layout 2 " shown in Figure 6, all do not see in the segment set of electric current, in having the Resistance model for prediction of every kind of above-mentioned profile, this CURRENT DISTRIBUTION is the most uniform.
In order to check the CURRENT DISTRIBUTION of " Resistance model for prediction 3 " in more detail, simulated the CURRENT DISTRIBUTION when distributing is it " layout 3 " shown in Figure 7.Figure 25 has shown this result.Can confirm that do not see current segment shown in Figure 11 at all and concentrate, the CURRENT DISTRIBUTION of electrode binding site is even.
Can see clearly that from above-mentioned measurement result in order to reduce the resistance error that bias current causes, it is the most effective that the profile of electrode is made " Resistance model for prediction 3 ".
Above-mentioned foundation electrode profile of the present invention is not limited to square chip resistor, the multiple impedance component that can be applied to assemble on the circuit board, need high accuracy.
The invention is characterized in the following structure of circuit board and resistor, circuit board has the layout that applies voltage, and resistor inserts between the layout, is flowing to apply the electric current that voltage produces.Resistor has been equipped with the square-shaped electrode of turning through rounding, so that at above-mentioned each layout that forms current path and the binding site of resistor, make CURRENT DISTRIBUTION even.Resistor is connected with scolder by this electrode with each layout, has just assembled resistor.As a result, make in the binding site of resistor and layout CURRENT DISTRIBUTION even, the bias current that produces in the binding site Control current segment set of resistor and layout distributes, and just can suppress the concentrated resistance error that causes of current segment.
For those skilled in the art, be not difficult to dream up other advantage and modification.So from broadly, the present invention is not limited to shown in this paper and specific detail, representative device and the displaying example introduced.Therefore, for subsidiary claims and quite content-defined general inventive concept thereof, under the situation that does not break away from its essence and scope, can make multiple modification.
Claims (8)
1. resistor is characterized in that comprising:
An element body; And
A rectangular electrode is provided on the element body, wherein
Electric current flows at least one turning process rounding of an end of rectangular electrode wherein.
2. according to the resistor of claim 1, it is characterized in that rounding is all passed through at all turnings of this electrode.
3. according to the resistor of claim 1, it is characterized in that:
Element body is a square sheet resistive element, and
Pair of electrodes is provided in the two ends of square sheet resistive element with one side.
4. according to the resistor of claim 3, it is characterized in that rounding is all passed through at all turnings of electrode.
5. according to the resistor of claim 3, it is characterized in that a turning of square sheet resistive element is through rounding.
6. circuit board is characterized in that comprising:
It is applied first layout of a voltage;
Second layout that the electric current that the voltage that applies on first layout produces flows therein;
A resistor has first and second electrodes of its turning through rounding, and first electrode is connected to first layout, and second electrode is connected to second layout.
7. according to the circuit board of claim 6, it is characterized in that first and second electrode deployment are at the two ends of square sheet resistive element with one side.
8. according to the circuit board of claim 7, it is characterized in that a turning of square sheet resistive element is through rounding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003148232A JP3688691B2 (en) | 2003-05-26 | 2003-05-26 | Resistors and circuit boards |
| JP148232/2003 | 2003-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1574114A true CN1574114A (en) | 2005-02-02 |
Family
ID=34044721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410032939 Pending CN1574114A (en) | 2003-05-26 | 2004-04-16 | Resistor and circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3688691B2 (en) |
| CN (1) | CN1574114A (en) |
| TW (1) | TW200502996A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5685411B2 (en) * | 2010-10-01 | 2015-03-18 | 京セラディスプレイ株式会社 | Touch panel |
| JP6892339B2 (en) * | 2012-01-06 | 2021-06-23 | ローム株式会社 | Resistor |
| JP2013157596A (en) * | 2012-01-06 | 2013-08-15 | Rohm Co Ltd | Chip resistor, and method for manufacturing chip resistor |
-
2003
- 2003-05-26 JP JP2003148232A patent/JP3688691B2/en not_active Expired - Fee Related
-
2004
- 2004-03-23 TW TW093107789A patent/TW200502996A/en unknown
- 2004-04-16 CN CN 200410032939 patent/CN1574114A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004356110A (en) | 2004-12-16 |
| JP3688691B2 (en) | 2005-08-31 |
| TW200502996A (en) | 2005-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6926536B2 (en) | Contact sheet and socket including same | |
| US6304251B1 (en) | Coordinate input device with flat cable having two divided flat mounting parts composing divided conductor portions | |
| DE102014000188B4 (en) | Motor drive unit with heat radiator | |
| JP2021061249A5 (en) | ||
| CN1956619A (en) | flexible substrate | |
| CN1848332A (en) | Wiring substrate, input device using same, and manufacturing method thereof | |
| EP2048922A3 (en) | COF Board | |
| CN101038988A (en) | Electrical connection member for connection between objects to be connected | |
| CN1574114A (en) | Resistor and circuit board | |
| CN1598976A (en) | Surface-mounted thermistor and manufacturing method thereof | |
| CN114222663B (en) | Screen printing plate for use in screen printing method, screen printing apparatus, and screen printing method | |
| KR20150009423A (en) | Touch window | |
| JP5293583B2 (en) | Capacitor module | |
| CN1426109A (en) | Semiconductor integrated circuit device | |
| CN1531084A (en) | Semiconductor component with at least two chips integrated in a housing and contacted by shared contact clips | |
| CN1278110C (en) | stress sensor | |
| CN101030578A (en) | Semiconductor integrated circuit apparatus and method of designing the same | |
| DE102018111406A1 (en) | Engine, circuit board and engine cooling module with the engine | |
| CN1976018A (en) | Wiring board and method for producing the same | |
| CN1405806A (en) | Chip type electronic part | |
| CN203046460U (en) | Splicing type thermal print head | |
| CN1784114A (en) | Printed wiring board | |
| CN1717754A (en) | Chip resistor and method of manufacturing the same | |
| CN1790712A (en) | Semiconductor device | |
| CN1324703C (en) | Structure of electrostatic discharge protection circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |