CN1555961A - A kind of composite solder ball and preparation method thereof - Google Patents
A kind of composite solder ball and preparation method thereof Download PDFInfo
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- CN1555961A CN1555961A CNA2004100210383A CN200410021038A CN1555961A CN 1555961 A CN1555961 A CN 1555961A CN A2004100210383 A CNA2004100210383 A CN A2004100210383A CN 200410021038 A CN200410021038 A CN 200410021038A CN 1555961 A CN1555961 A CN 1555961A
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- solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 53
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 claims abstract 2
- 229910020836 Sn-Ag Inorganic materials 0.000 claims abstract 2
- 229910020888 Sn-Cu Inorganic materials 0.000 claims abstract 2
- 229910020988 Sn—Ag Inorganic materials 0.000 claims abstract 2
- 229910018731 Sn—Au Inorganic materials 0.000 claims abstract 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims abstract 2
- 229910018956 Sn—In Inorganic materials 0.000 claims abstract 2
- 230000006698 induction Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000010298 pulverizing process Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005219 brazing Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 6
- 238000000889 atomisation Methods 0.000 abstract description 4
- 238000004100 electronic packaging Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 231100000956 nontoxicity Toxicity 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 22
- 238000005476 soldering Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 2
- 238000010410 dusting Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000009718 spray deposition Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910017091 Fe-Sn Inorganic materials 0.000 description 1
- 229910017142 Fe—Sn Inorganic materials 0.000 description 1
- 229910018320 SbSn Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
本发明属于金属材料技术领域，涉及到电子封装钎焊材料技术，特别涉及到一种新的复合钎料球及其制备方法。其特征在于钎料球含有0.1－10重量％的Fe，通过外加磁场于雾化制粉设备之外来控制Fe在Sn基钎料中的分布；Sn基钎料是Sn－Cu，Sn－In，Sn－Au，Sn－Ag，Sn－Ag－Cu等低熔点钎料合金中任意一种。本发明效果和益处是合金其润湿性较好，组织细密，力学性能优良，无毒、无污染，价格便宜，综合性能优良，可广泛应用于电子工业，钎料应用领域。
The invention belongs to the technical field of metal materials, relates to electronic packaging brazing material technology, and in particular relates to a new composite solder ball and a preparation method thereof. It is characterized in that the solder ball contains 0.1-10% by weight of Fe, and the distribution of Fe in the Sn-based solder is controlled by applying an external magnetic field outside the atomization powder making equipment; the Sn-based solder is Sn-Cu, Sn-In, Any one of low melting point solder alloys such as Sn-Au, Sn-Ag, Sn-Ag-Cu. The effects and benefits of the invention are that the alloy has good wettability, fine structure, excellent mechanical properties, non-toxicity, no pollution, low price and excellent comprehensive performance, and can be widely used in the electronic industry and solder application fields.
Description
Technical field
The invention belongs to metal material field, relate to electronic packaging and brazing material technical field, specially refer to solder ball and preparation method thereof.
Background technology
Current, human effort for environment protection has related to very extensive fields.The history in existing thousand of tradition tin lead (SnPb) solder application is the main raw of present electronic package interconnections.But lead and compound thereof belong to toxic substance, bring bigger harm for human habitat and safety.Since anti-plumbous proposal HR-5374 (US Congress), the S-2637 and S-391 (United States Senate) proposition of the U.S., various tissues both domestic and external, scientific research institution and company release series forbidding motion, test assessment and environmentfriendly products one after another.On February 13rd, 2003, European Union has announced " scrapping electric instruction " and " about ban use of some objectionable impurities instruction in electronic electric equipment ", and the Electrical and Electronic equipment that regulation was put on market after 1 day July in 2006 must not contain 6 kinds of objectionable impuritiess such as comprising lead.Under the constraint and promotion of factors such as environmental requirement, the market requirement, the unleaded great scientific and technical advanced problems and the systems engineering problem that becomes academia and industry member of Electronic Packaging.
Now, the development of microelectronics has entered into ultra large scale integrated circuit (USLA), huge size unicircuit (GSI) epoch.The development of chip is had higher requirement to encapsulation technology.For satisfying IC to high-density and the development of high number of pins, traditional chip/substrate interconnection technique has been difficult to satisfy the requirement of unicircuit development of new generation.Because flip-chip welding technology (FC) is owing to have high packaging density, and improved electric property, the reliability of unicircuit greatly, thereby become the one preferred technique that chip and substrate interconnect.Along with increasing substantially of microelectronic circuit integrated level, the number of solder joint is more and more on device, and size is more and more littler.At present, ball grid array (BGA) solder ball minimum diameter is about 50 μ m, at 1cm
2Chip on, just can obtain 10,000 input and output (I/O) binding sites (pad).Yet the inefficacy of a solder joint will cause device integral body to lose efficacy.Thereby as the key part in the Electronic Packaging, the reliability of solder joint is related to the quality and the life-span of unicircuit, components and parts and even complete machine.Solder joint is as the passage that is electrically connected, and solder joint should have higher specific conductivity; As the passage of mechanical connection between the different material, solder joint should have higher intensity; In the face of abominable environment for use, solder joint should have certain creep resistance and tired performance, prolongs its work-ing life as much as possible; Should have high thermal, system thermal is dissipated easily.Avoiding heat effect, and cause losing efficacy in the solder joint local superheating.
Because Sn has possessed metallurgy, environmental protection, the requirement of several respects such as economy and supply, Research of Lead-free Solders is matrix with Sn, adds Ag, Cu, In, alloy elements such as Bi.For the adapted to leadless requirement, the international printed wiring association of the U.S. (IPC) has estimated the feasibility of lead-free brazing, and has recommended two kinds of alloys.Be respectively that Sn-3Ag-0.5Cu and the north america electronics that Japan adopts made the Sn-3.9Ag-0.6Cu of association (NEMI).Current, though IPC etc. provide the lead-free brazing that can preferentially select, also there is not the consistent alloy of admitting.Mainly be because this class solder also exists integrity problem such as the whisker and the electromigration etc. of long-time running.Especially, relate to following point and requirement:
1, the inefficacy of soldering solder joint often occurs in the combining site of compound and solder matrix between interface metal;
2, because the size of BGA ball is more and more littler, need higher reliability.And in the Sn of the present precipitation strength base BGA solder ball, grow up unusually owing to stress concentration causes BGA ball and compound at the interface, cause inefficacy;
3, the inefficacy that causes of electromigration.Because there is very big-difference in current density between solder ball and lead-in wire, sternly give birth to ELECTROMIGRATION PHENOMENON, finally cause losing efficacy;
4, need solder to have high creep resistance in the optical package;
5, at automobile, aerospace needs high-intensity solder under military project and other extreme conditions.
In order to obtain the lead-free brazing of excellent combination property, composite S n-Pb solder and Research of Lead-free Solders are caused the very big attention of scientific circles.Enhancing substance comprises Cu
6Sn
5Intermetallic compound, Cu, Ag, NiTi particle and SbSn whisker etc.Composite soldering research exists many problems that need solution: how to control the distribution of additive; How reinforce obtains the high beginning intensity that combines with the matrix solder; How effectively to improve creep and thermal fatigue resistance etc.
Especially, S.Jin etc. utilizes magnetic field to control the Fe particle to suppress the alligatoring of Sn-58Bi alloy organizing.Under the effect in magnetic field, the Fe particle after the polarization is chain and distributes, and can greatly improve the creep resistance of alloy.According to our idea, develop this technology, prepare the composite soldering ball that contains the Fe particle by magnetic field control atomising method, have bigger Research Significance and application potential.By externally-applied magnetic field, can control enhancing substance and distribute, obtain Utopian Fe particle and strengthen the composite soldering ball.This new solder can effectively solve and satisfy above-mentioned problem and requirement.The Fe particle has magnetic diffusivity, can control its distribution by magnetic field, avoids the composition inequality; Can generate the Fe-Sn compound with the reaction of Sn matrix and make particle and matrix have good binding, can be from a minute performance strengthening effect; Have conduction, thermal conductivity preferably; Low price, aboundresources.And the solder ball that obtains uniform distribution Fe particle by externally-applied magnetic field on the powder by atomization device is feasible.
Can predict, this composite soldering ball has excellent reliability, can become that ball grid array (BGA)/flip-chip (FC) encapsulation is with solder ball and make the reflow welding soldering paste, and huge application potential is arranged.Here, we have invented a kind of NEW TYPE OF COMPOSITE solder ball and preparation technology thereof.This is simple for process, and the composite soldering ball has excellent mechanical property, conductivity, structure stability, good reliability.Be with a wide range of applications, can be used as the BGA ball and encapsulate; Can make soldering paste and be used for the encapsulation of electronic product; Can be used for optics etc. and need the encapsulation in high-performance field etc.
Summary of the invention
An object of the present invention is to provide lead-free brazing ball with following character:
1) has the good mechanical performance, higher creep and fatigue resistance;
2) brazed joint of Xing Chenging has sufficiently high bonding strength, and the brazed joint structure stability is good;
3) have good electroconductibility, thermal conductivity.
The composite soldering ball is the Fe particle that adds 0.5～10 weight % in the Sn base solder alloy, controls the distribution of Fe outside powder by atomization equipment by externally-applied magnetic field.The solder alloy composition according to following reason is: the Fe particle has magnetic diffusivity, and its distribution can be controlled in magnetic field; Have good electrical conductivity, make that the joint electroconductibility after the soldering significantly improves; The adding of Fe particle has the usefulness of turning into, significantly improves the reliability of joint.
Another object of the present invention provides the preparation method of this composite soldering of preparation.Added magnetic field in powder by atomization equipment, its intensity is between 100 Gausses～1000 Gausses.Under the effect of externally-applied magnetic field, the Fe particle is magnetized, and repels mutually between the particle after the magnetization, forms stable chain type and distributes.The distribution of Fe particle is effectively controlled in the solder alloy of fusing like this, thereby obtains the equally distributed composite soldering ball of Fe particle when dusting.
Present solder powder manufacturing apparatus is to use micropowders (classification collection) reaction-injection moulding that method for vacuum induction smelting prepares metal or alloy.Obtain (measurement) and inflation system, induction melting heating temperature controlling system, induction heating insulation crucible temperature controlling system, spray deposition system by vacuum, powder separation gathering system, computer control system, host computer system, electrical control system, water circulation system are formed.Its mode of operation: melting, the insulation crucible is located in the vacuum chamber; Two intermediate frequency power supplies are controlled respectively.The whole process flow computer control.Equipment size: 8000 (W) * 10000 (L) * 7000 (H); Equipment total power: 350kW; Gross weight of equipment amount: 30000kg.Vacuum tightness: 6.6 * 10
-3Pa (cold conditions); Batch: 50kg.In preparation composite soldering ball process, the concrete distribution of uncontrollable substance can cause the ununiformity of solder ball interior tissue.
Preparation method of the present invention adds magnetic field outside induction heating insulation crucible temperature controlling system, externally-applied magnetic field intensity is about 100～1000G.Under the effect of externally-applied magnetic field, the Fe particle is magnetized, and repels mutually between the particle after the magnetization, forms stable chain type and distributes.The distribution of Fe particle is effectively controlled in the solder alloy of fusing like this, thereby obtains the equally distributed composite soldering ball of Fe particle when dusting.
Effect of the present invention and benefit be, can overcome the weakness that solder ball in the past exists, and is with a wide range of applications; The preparation method is simple and easy to do.
Description of drawings
Accompanying drawing is that the micropowders that the application method for vacuum induction smelting of externally-applied magnetic field prepares metal or alloy prepares synoptic diagram.
Among the figure: 1. externally-applied magnetic field; 2 induction meltings heating temperature controlling system; 3. solder alloy liquation; 4. spray deposition system; 5. solder ball; 6. the Fe particle that contains in the solder ball after amplifying.
Embodiment
Smelt 0.1 the Fe particle of～10 weight % and Sn base solder raw material are put into the induction furnace of illustrated fuel pulverizing plant, under normal pressure, 500 ℃ of temperature are incubated 4～6 hours, produce solder ball by spraying.
Embodiment:
Choose following chemical components (wt%): 2% diameter is about the Fe particle of 1 μ m; 3%Ag; 0.5%Cu; Surplus is Sn.Above-mentioned raw material of proportionately distributing put into shown in the figure install, under normal pressure, 500 ℃ of temperature insulations were smelted in 4～6 hours, produced solder ball through spraying.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100210383A CN1555961A (en) | 2004-01-10 | 2004-01-10 | A kind of composite solder ball and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100210383A CN1555961A (en) | 2004-01-10 | 2004-01-10 | A kind of composite solder ball and preparation method thereof |
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| Publication Number | Publication Date |
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| CN1555961A true CN1555961A (en) | 2004-12-22 |
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| CNA2004100210383A Pending CN1555961A (en) | 2004-01-10 | 2004-01-10 | A kind of composite solder ball and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666002A (en) * | 2010-08-18 | 2012-09-12 | 新日铁高新材料株式会社 | Solder ball for semiconductor mounting and electronic member |
| CN103170758A (en) * | 2011-12-26 | 2013-06-26 | 北京有色金属研究总院 | Aluminum base brazing filler metal including scandium and strontium and preparation method thereof |
| CN103639558A (en) * | 2013-12-12 | 2014-03-19 | 哈尔滨工业大学 | Thermal-ultrasonic-electromagnetic field combination reflow soldering method |
-
2004
- 2004-01-10 CN CNA2004100210383A patent/CN1555961A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666002A (en) * | 2010-08-18 | 2012-09-12 | 新日铁高新材料株式会社 | Solder ball for semiconductor mounting and electronic member |
| CN102666002B (en) * | 2010-08-18 | 2014-09-10 | 新日铁住金高新材料株式会社 | Solder ball for semiconductor mounting and electronic member |
| CN103170758A (en) * | 2011-12-26 | 2013-06-26 | 北京有色金属研究总院 | Aluminum base brazing filler metal including scandium and strontium and preparation method thereof |
| CN103639558A (en) * | 2013-12-12 | 2014-03-19 | 哈尔滨工业大学 | Thermal-ultrasonic-electromagnetic field combination reflow soldering method |
| CN103639558B (en) * | 2013-12-12 | 2015-12-09 | 哈尔滨工业大学 | Thermal-ultrasonic-electromagnetic multi-field compound reflow soldering method |
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