CN1416016A - Inclined bump structure on mirror surface and manufacturing method thereof - Google Patents

Abstract

A manufacturing method of inclined bump structure on a reflecting mirror surface at least comprises the following steps: providing a substrate; forming a photosensitive material layer on a substrate; the photosensitive material layer is planned in a partition mode to form a plurality of trapezoidal bodies with different bottom areas, and the bottoms of the trapezoidal bodies are connected with each other; and smoothing the trapezoids to form a plurality of groups of bump structures with an inclined angle. The invention uses optical diffraction method and a special photomask, and can make the applied reflective liquid crystal display screen achieve the purpose of reflecting brightness and wide viewing angle through a simple process of single exposure.

Description

Inclined bump structure on reflective mirror surface and manufacturing method thereof

Technical field

The invention relates to an inclined bump structure on a reflective mirror surface and a manufacturing method thereof, in particular to an inclined bump structure formed on a reflective mirror surface of a reflective liquid crystal display screen by an optical diffraction method and a manufacturing method thereof.

Background technique

For reflective liquid crystal display (reflective liquid crystal display), in addition to must pay attention to the brightness of liquid crystal display (LCD) reflection, must also pay attention to whether the viewing angle is wide. Therefore, how to design a reflector that enables the liquid crystal display to have both reflective brightness and a wide viewing angle is an important research direction at present.

Referring to FIG. 1 , this figure is a graph showing the relationship between the light reflectivity of a traditional mirror surface and the measurement angle. Wherein, the mirror surface is placed horizontally and has a smooth surface. Assume that when the incident light hits the reflective mirror of the LCD screen at an incident angle of 20 degrees, it will exit the LCD screen at a reflection angle of -20 degrees. Therefore, the maximum reflectance R ₁ will be measured when the angle is -20 degrees, and the reflection The distribution curve of the rate is very narrow, and most of them are concentrated around -20 degrees.

However, an ideal LCD should exhibit maximum reflectivity at an angle of about 0 degrees, and also exhibit partial reflectivity at other angles. Therefore, in order to move the reflectivity curve in Figure 1 to the left, so that the maximum reflectivity appears at about 0 degrees, and the curve distribution is wider, so as to achieve the effect of both reflective brightness and wide viewing angle, another traditional method is Slant the reflector to change the path of light. For example, the reflector is slanted about 10 degrees relative to the horizontal plane, so that the incident light originally at an incident angle of 20 degrees can be emitted at a reflection angle of about 0 degrees. Referring to FIG. 2 , it shows the relation diagram of light reflectivity and measurement angle of another traditional mirror surface. Wherein, the mirror surface is placed obliquely and has a smooth surface. The maximum reflectance R ₁ is measured at an angle of 0 degrees. However, the reflectance distribution curve in FIG. 2 is still very narrow, most of which are concentrated around 0 degrees, which cannot make the LCD screen achieve the effect of wide viewing angle.

In order to solve the problem that the reflectivity is too concentrated at a certain angle, another traditional method is to form bumps on the inclined mirror surface. Referring to FIG. 3 , this figure shows the relationship between light reflectivity and measurement angle of another conventional reflective mirror. Wherein, the reflection mirror surface is placed obliquely and a bump is formed on the surface. Due to the inclination of the mirror surface, high reflectivity can be measured at an angle near 0 degrees, and the normal angle of each point on the surface of the bump is different, and the light can be reflected in a wider angle. Comparing the maximum reflectance R ₂ in Figure 3 with that in Figure 2, since most of the light rays in Figure 2 are concentrated at 0 degrees, the maximum reflectance R ₁ will be greater than the maximum reflectance R ₂ , however, in Figure 3 The reflectance distribution curve, however, becomes broader. Therefore, the reflection mirror surface with bump structure can make the liquid crystal display screen achieve the effect of reflection brightness and wide viewing angle. As for the above process, a photomask with a single opening can be used to perform a multi-step exposure process. For example, the photoresist on the substrate is exposed with the exposure intensity L ₁ and the exposure time t ₁ to form the exposure area A; then the photomask is moved, and the photoresist is exposed with the exposure intensity L ₂ and the exposure time t ₂ The resist is exposed to form exposure area B; then the photomask is moved to expose, and so on. Wherein, the exposure time is equal but the exposure intensity L ₁ >L ₂ >.. is used, or the exposure intensity is equal but the exposure time t ₁ >t ₂ >.., so that the formed exposure area A>B>.. Then, developing is carried out so that the photoresist is stepped from high to low. Then, the step-shaped photoresist is reflowed by heating to form a photoresist with a smooth surface.

However, the above process needs to continuously move the photomask to expose the photoresist in different regions, and also needs to adjust the position of the photomask and the exposure intensity or time, which has the disadvantages of time-consuming and increased manufacturing costs. In addition, in order to form a single bump with an inclination angle, it is necessary to move the photomask of this single opening multiple times and expose it, and then it can be completed after development and heating. If the number of bumps is to be increased on the mirror surface, that is, increase The degree of concave and convex on the mirror surface makes light scattering better, and the process will be more complicated and time-consuming, which is very unsuitable for batch production.

Contents of invention

Therefore, the object of the present invention is to provide an inclined bump structure on the mirror surface and its manufacturing method. The inclined bump structure is completed by the optical diffraction method, which not only has a simple process, but also has a better light scattering effect, which can make reflection The LCD screen achieves the purpose of both reflective brightness and wide viewing angle.

According to the purpose of the present invention, a method for manufacturing an inclined bump structure on a mirror surface is proposed, at least including the following steps: providing a substrate; forming a photosensitive material layer on the substrate; planning the photosensitive material layer to form a plurality of bumps with different bottom areas, and the bottoms of these bumps are connected to each other; and smoothing (smoothing) these bumps to form a plurality of groups of bump structures with an inclination angle.

Wherein, the step of partitioning the photosensitive material layer further includes exposing and developing, and providing a photomask to expose the photosensitive material layer. Wherein, the photomask includes m groups of patterns (m is a positive integer ≥ 1), and each group of patterns is composed of a plurality of strip-shaped light-shielding regions with different widths. A light-permeable gap between the strip-shaped light-shielding regions further has a narrow and long-shaped light-shielding region. The multiple trapezoids formed after exposure and development are arranged in descending order of bottom area, and the bottoms are connected. The smoothing step is accomplished by reflowing the trapezoids by baking. Each group of bump structures is formed by connecting a plurality of bumps from high to low and from large to small, and the multiple groups of bump structures are regularly or randomly formed on the substrate.

Description of drawings

Fig. 1 is a relational diagram representing its light reflectivity and measurement angle of a conventional reflecting mirror;

Fig. 2 is a relational diagram representing its light reflectivity and measurement angle of another traditional mirror surface;

Fig. 3 is a relational diagram representing its light reflectivity and measurement angle of another traditional reflecting mirror;

4 is a partial top view showing a photomask according to an embodiment of the present invention;

5A to 5C show a method for manufacturing an inclined bump structure on a mirror surface according to Embodiment 1 of the present invention;

6 is a perspective cross-sectional view showing the structure of the inclined bumps on the mirror surface according to Embodiment 1 of the present invention;

7 is a partial top view showing a photomask according to Embodiment 2 of the present invention;

FIG. 8 is a perspective cross-sectional view showing the structure of the inclined bumps on the reflection mirror surface formed by the photomask in FIG. 7 .

9A is a partial top view showing another photomask according to the present invention;

9B is a partial top view showing yet another photomask according to the present invention;

Fig. 10 is a partial top view showing another photomask according to the present invention.

Explanation of schematic labels

R ₁ , R ₂ : Maximum reflectivity

L ₁ , L ₂ : exposure intensity

t ₁ , t ₂ : exposure time

400, 700: Photomask

(401) ₁ , (401) ₂ , (401) ₃ , (401) ₄ , ...(401) _n , (901) ₁ , (901) ₂ , (901) ₃ : strip

W ₁ , W ₂ , W ₃ , W ₄ ,...W _n : strip width

d ₁ , d ₂ , d ₃ , ...d _n , (902) ₁ , (902) ₂ : Clearance

s ₁ , s ₂ , s ₃ , ...s _n : strip width

405, S ₁₁ , S ₁₂ , S ₂₁ , S ₂₂ , S: narrow strip

W: slit width

θ: tilt angle

d ₁ ′, d ₂ ′, d ₃ ′, d ₄ ′, d ₅ ′: the distance between each group of patterns

502: Substrate

504, 505, 506, 507, 508, 505', 506', 507', 508': photoresist

Detailed ways

In order to make the above-mentioned purposes, features, and advantages of the present invention more obvious and understandable, preferred embodiments are specifically cited below, and detailed descriptions are as follows with reference to the accompanying drawings:

The technical feature of the present invention is, utilize optical diffraction method and a photomask that has slit (slit) figure, make the photosensitive material (photosensitivity material) after single exposure development, for example photoresist ( photo resist) to form multiple groups of patterns, each group of patterns includes a plurality of bumps connected to the bottom, wherein the bumps are arranged from large to small and from high to low. Afterwards, a smoothing process is performed on the bumps, such as baking to melt the bumps and then reflow them, so as to form a continuous smoothness with a predetermined inclination angle bumps, and each bump of each group is connected from big to small and from high to low.

When applying the inclined bump structure on the reflective mirror surface of the present invention to a reflective liquid crystal display (reflective liquid crystal display), a metal film is covered on the substrate, and the inclined bump structure is covered to form a metal reflective layer to reflect light. Since the metal reflective layer has the same concave-convex surface as the inclined bump structure and has an inclined angle, the light entering the liquid crystal display can be reflected from multiple different angles when it reaches the surface of the metal reflective layer, so that the liquid crystal display can achieve both reflection The purpose of brightness and wide viewing angle.

The following is an example to illustrate the inclined bump structure on the mirror surface of the present invention and its manufacturing method. However, the invention is not limited thereby. Embodiment one

In this embodiment, a photomask with slits is used to form the inclined bump structure on the mirror surface of the present invention. Wherein, the photomask includes m groups of patterns, and each group of patterns is composed of n strips of different widths arranged with a gap from wide to narrow, and at least one is added between each gap. The narrow strips form multi-slits on the photomask. Wherein, m is a positive integer ≥1, and n is a positive integer ≥2.

Referring to FIG. 4 , this figure shows a partial top view of a photomask according to Embodiment 1 of the present invention. The photomask 400 includes m groups of patterns, each group of patterns is composed of n strips (401) ₁ , (401) ₂ , (401) ₃ , ... (401) _n , and their widths are respectively are W ₁ , W ₂ , W ₃ , . . . , W _n . The gaps between strips are d ₁ , d ₂ , d ₃ , ..., d _n in sequence, and a narrow strip is taken as an example in the gap, and the widths of the narrow strips are s ₁ , s ₂ , s ₃ , ..., s _n , arrange another group of graphics after each group of graphics, and repeat until m groups of permutations are completed.

Next, pattern transfer is performed using the photomask 400 of FIG. 4 . In the following process, for convenience of explanation, it is assumed that n=4, and d ₁ =d ₂ =d ₃ =...=d _n =d, s ₁ =s ₂ =s ₃ =...=s _n = s.

Referring to FIGS. 5A-5C , it shows a manufacturing method of an inclined bump structure on a mirror surface according to an embodiment of the present invention. As shown in FIG. 5A , the substrate 502 is coated with a photosensitive material of height h, such as a photoresist 504 , and is exposed and developed with ultraviolet light (UV). Assume that the photoresist 504 is a positive photoresist that dissolves in a developer when exposed to light, and the hatched portion on the photomask 400 is an opaque region. Wherein, except for the strips (401) 1 , (401) ₂ , (401) _{3 , (401) 4 respectively having widths W 1 , W 2 , W 3 , and W 4 on the photomask 400 ,} the strips There is also a narrow strip 405 in the gap between them. The width d of the gap is about 4 μm, for example, and the width s of the strip 405 is about 1 μm, so the distance from the narrow strip 405 to the adjacent strip is about (4−1)/2=1.5 μm. Since the photoresist 504 under the strips (401) ₁ , (401) ₂ , (401) ₃ , (401) ₄ in the opaque area on the photomask 400 has not been irradiated by ultraviolet light, after developing Not soluble in developer solution. Since the gaps on the photomask 400 can transmit light, the corresponding photoresist 504 below can be dissolved in the developing solution.

It is worth noting that the existence of the narrow strip 405 (FIG. 5A) divides the already small gap into two smaller slits. When ultraviolet light is irradiated downwards and passes through the gap, double slit diffraction (diffraction) will occur, which reduces the amount of light passing through the photomask 400, and then the photoresist corresponding to the gap on the photomask below is exposed to light. , resulting in underexposure. Therefore, after the photoresist 504 of Fig. 5 A is developed, trapezoid photoresists 505, 506, 507, and 508 as shown in Fig. 5B will be formed, and the bottom of the trapezoid photoresist is interconnected.

In addition, the photoresist with a larger bottom area has a higher photoresist height after exposure and development, and vice versa. For example, the height of a photoresist with a width of 14 μm after exposure and development is greater than that of a photoresist with a width of 7 μm. Therefore, in the present invention, since W ₁ >W ₂ >W ₃ >W ₄ , the bottom area ratio of the trapezoidal photoresist shown in FIG. 5B after development is 505>506>507>508, and The height ratio thereof is h ₁ >h ₂ >h ₃ >h ₄ .

Next, the trapezoidal photoresists 505, 506, 507, and 508 are melted to perform a smoothing step. Since the photoresist is mainly composed of a resin and a photoactive photosensitive agent dissolved in a solvent, the developed photoresist is subjected to a heating process, such as baking , will further minimize the residual solvent content in the photoresist due to evaporation. The reduced solvent content in the photoresist enhances the adhesion of the photoresist to the substrate surface. When the heating temperature rises to the glass transition temperature, the photoresist softens into a melting state similar to glass at high temperature, and the surface can be reflowed and smoothed. Because the trapezoid photoresists 505, 506, 507, and 508 bottoms in FIG. bumps), as shown in Figure 5C. Since the heights of the trapezoidal photoresists 505, 506, 507, and 508 in FIG. 5B are arranged from high to low, the reflowed photoresists 505', 506', 507', and 508' will form a tilt angle θ. Among them, the heating temperature range for melting the multiple trapezoidal photoresists is preferably about 200-230° C., and the heating time is preferably about 1 hour, but this does not limit the present invention. When, the heating temperature and time are determined according to the characteristics of the selected photoresist material.

Referring to FIG. 6 , it shows a three-dimensional cross-sectional view of an inclined bump structure on a reflecting mirror according to an embodiment of the present invention. Assuming that the pattern on the photomask 400 includes 2 groups of graphics (m=2), the photoresist formed according to the process of FIGS. block structure, and each group is formed by connecting four (n=4) bumps from high to low and from large to small.

When the present invention is applied to the reflecting mirror surface of a liquid crystal display (LCD), then after the process of FIG. 507', 508' surfaces (FIG. 5C, FIG. 6), make the surface of the metal thin film resemble the surface of a photoresist with unevenness. The inclined bump structure of the reflecting mirror surface can reflect light from multiple angles, so that the LCD can achieve a wide viewing angle effect.

It can be seen from the above that the inclined bump structure represents: multiple groups (m) of bump structures formed by a plurality of bumps (m×n), and each group of bump structures is formed by n bumps, and n The bumps are connected from large to small and from high to low to form a bump structure with an inclination angle.

Certainly, in the above-mentioned embodiment, although each set of bump structures is described as being composed of n bumps, the present invention is not limited thereto. Each group can also contain different numbers of bumps between each group. For example, the first group has 5 bumps, the second group has 6 bumps, and the third group has 4 bumps. The pattern on the mask enables the exposed, developed and melted photoresist to produce a bump structure with an inclined angle, which is the technical protection scope of the present invention. Embodiment two

In the second embodiment, another photomask pattern with slits is provided for the manufacturing of the present invention to obtain the inclined bump structure. After fabrication, the photoresist of Example 2 has a higher degree of bump aggregation than that of Example 1, that is, the degree of concavo-convexity on the reflective mirror surface is improved, and the light scattering effect is better.

The photomask of the second embodiment includes m groups of patterns (m is a positive integer ≥ 1), each group of patterns is formed by a plurality of strips arranged from wide to narrow, and the gaps between the strips are Also take a narrow strip as an example. The m groups of patterns can be randomly arranged on the photomask, or they can be arranged neatly like a matrix, for example, m' groups of long sides and n' groups of wide sides (m=m'×n'). In this embodiment, for the convenience of description, m groups of figures are randomly arranged, and each set of figures includes n strips (n is a positive integer ≥ 2) for illustration. Among them, m=4, n=3.

Referring to FIG. 7 , it shows a partial top view of a photomask according to Embodiment 2 of the present invention. Among them, a total of 4 groups of graphics (ie m=4) are randomly arranged on the photomask 700, and each group of graphics is composed of 3 strips (ie n=3) arranged from wide to narrow, and the strips There is a narrow strip between them.

Next, pattern transfer of the photomask 700 is performed. Its manufacture is shown in FIGS. 5A to 5C. The photomask 400 in FIG. 5A is replaced with a photomask 700, and then exposure, development, and smoothing are performed as described in Embodiment 1. Three steps. Wherein, the photoresist is a positive photoresist, and the hatched part on the photomask 700 is an opaque area. In this embodiment, it is also necessary to control the distance between each group, such as d ₁ ′, d ₂ ′, d ₃ ′, d ₄ ′, d ₅ ′ as shown in Fig. Each group of photoresists after formation can also be connected to each other, so that the inclined bump structure can be continuously formed on the substrate.

Referring to FIG. 8 , this figure is a perspective cross-sectional view showing the bump structure on the reflective mirror surface formed by the photomask in FIG. 7 . Using the photoresist formed after the photomask 700 is manufactured ( FIG. 8 ), more bumps can be produced than in FIG. 6 , making the surface of the photoresist more concave-convex. Of course, if the m groups of graphic patterns on the photomask are arranged neatly as a matrix, such as the pattern (m=m'×n') of the long side m' group and the wide side n' group, the bump of the present invention can also be formed structure.

In the above embodiments, although the photomask patterns in FIG. 4 and FIG. 7 are used for illustration, it is not intended to limit the scope of the present invention. For example, m groups of random patterns can be scattered on the photomask, and each group is composed of a plurality of opaque regions arranged from wide to narrow, or m groups of patterns can be arranged like a matrix. As for The number of opaque regions in each group can be equal to the number of opaque regions in other groups, or not equal, so that the photoresist layer after the transfer of the photomask pattern can produce an inclined bump structure on the reflective mirror surface . In addition, the slits of the photomask pattern are not limited to _{the double} slits shown in _FIG . Two narrow strips S ₁₁ and S ₁₂ are provided; and the strip (901) ₁ and the narrow strip S ₁₁ , the narrow strip S ₁₁ and the narrow strip S ₁₂ , and the narrow strip S ₁₂ and the long strip (901) ₂ , in addition to being designed as the parallel line arrangement in FIG. 9A, it can also be drawn as shown in FIG. 9B, and the slit width W maintains a certain zigzag design, etc. Alternatively, as shown in FIG. 10 , discontinuous narrow strips S are provided in the gaps (102) ₁ , (102) ₂ between the strips (101) ₁ and the strips (101) ₂ . Such photomask designs with multi-slits can also produce the desired bumps of the present invention.

In addition, in the manufacture of general TFT liquid crystal panels, in addition to the part of the bump structure, there are some parts on the substrate that need to be exposed, such as the contact window for contact with the circuit, so the above photosensitive The resist needs to be completely removed to avoid poor contact due to excessive resistance values. In the photomask of the present invention, narrow strips are formed between the opaque regions, and the advantage is that when using ultraviolet light of general intensity for exposure, the ultraviolet light passes through the slits on both sides of the narrow strip to produce double slits. Radiation reduces the amount of light reaching the photoresist, similar to underexposure, so after development, the bottom of the photoresist can be connected to each other, so that the melted photoresist can A continuous bump structure with an inclined angle is formed smoothly. As for the part of the photomask relative to the substrate that needs to be exposed, openings are formed to allow ultraviolet light to pass through completely for exposure, and then the photoresist on it is completely removed through development. To put it simply, the present invention can simultaneously complete the inclined bump structure on the reflection mirror surface and remove the photoresist on the contact window of the substrate under the exposure process of general ultraviolet light.

Therefore, viewed from another perspective, the method for manufacturing the inclined bump structure on the mirror surface of the present invention is to use a photomask including the first region and the second region to expose the photosensitive material layer on the substrate. Wherein, the first region is a light-transmitting region with a multi-slit structure, so that the first part of the photosensitive material layer forms a concave portion in an under-exposed manner, while the second region is opaque. The light zone leaves the second portion of the layer of photosensitive material unexposed. Then, developing is carried out, so that the second part of the photosensitive material layer is bonded to each other through the first part, so as to form a plurality of bumps whose bottoms are connected. Then, smoothing the photosensitive material layer to form a contiguous deformity structure with a predetermined inclined angle.

In summary, the present invention utilizes a multi-slit photomask and a simple process to form multiple sets of inclined bump structures on the mirror surface through a single exposure, development, and smoothing steps to scatter light The effect is better, so that the applied reflective LCD screen (reflective LCD) achieves the purpose of both reflective brightness and wide viewing angle. In addition, when the number of m and n forming the pattern on the photomask is more, the number of bumps formed per unit area after fabrication is more, that is, the higher the aggregation degree of bumps is, the more effective the light scattering effect is. good.

The inclined bump structure on the reflecting mirror surface and its manufacturing method disclosed in the above-mentioned embodiments of the present invention have the following advantages:

1. Compared with the traditional technology, the aggregation degree of bumps on the mirror surface of the present invention is more increased, so that the light scattering effect is better, so that the applied reflective LCD screen has the advantages of reflective brightness and wide viewing angle.

2. Only one exposure process can be used to form the inclined bump structure of the present invention, which simplifies the process, reduces the manufacturing cost and time, and is very suitable for mass production.

3. It is only necessary to complete the inclined bump structure on the reflective mirror surface of the present invention under the general exposure amount, and at the same time completely remove the photoresist on the substrate contact window, so the process of the present invention is very time-saving and economical .

In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention, any person of ordinary skill in the art, without departing from the spirit and scope of the present invention, should be able to make various Therefore, the protection scope of the present invention should be defined by the scope of the claims.

Claims (21)

1. the manufacture method of the declining lug structure on the mirror surface may further comprise the steps at least:

One substrate is provided;

On this substrate, form a photosensitive material layer;

This photosensitive material layer of block planning is to form a plurality of projections with different floorages, and wherein, the bottom of these projections interconnects; And

Level and smooth these projections have the projection cube structure at a pitch angle with formation.

2. manufacture method as claimed in claim 1 wherein is to utilize baking procedure to make these prismatoid fusionizations and flow, with level and smooth these prismatoids.

3. manufacture method as claimed in claim 1, wherein these projections have different height.

4. the manufacture method of the declining lug structure on the mirror surface may further comprise the steps at least:

One substrate is provided;

On this substrate, cover a photosensitive material layer;

This photosensitive material layer of block planning to be forming m picture group case (m be 〉=1 positive integer), and each picture group case is by having different floorages, and the continuous a plurality of projection in bottom is formed; And

Level and smooth these projections are to form the projection cube structure at tool one pitch angle.

5. manufacture method as claimed in claim 4, wherein, the step of this photosensitive material layer of block planning also comprises exposure and develops.

6. manufacture method as claimed in claim 5 wherein, provides a photomask so that this photosensitive material layer is carried out step of exposure.

7. manufacture method as claimed in claim 6, wherein, comprise m picture group case (m is 〉=1 positive integer) on this photomask, each picture group case is made up of a plurality of strip shading regions with different in width, and also has a long and narrow shading region in the light-permeable gap between adjacent described per two strip shading regions.

8. manufacture method as claimed in claim 4, wherein these projections have different height.

9. manufacture method as claimed in claim 8, wherein, these projections that the bottom links to each other be according to floorage greatly to minispread, make these projections after level and smooth form the projection cube structure that the m group has a pitch angle, and each group projection cube structure is to be formed by connecting to little projection to low, arrogant from height by a plurality of.

10. manufacture method as claimed in claim 4, wherein, this m picture group case is to be disposed at regularly on this photosensitive material layer.

11. manufacture method as claimed in claim 4, wherein, this m picture group case is to be disposed at randomly on this photosensitive material layer.

12. manufacture method as claimed in claim 4, wherein, each picture group case is to have the continuous projection of different floorages and bottom by n to form (n is 〉=2 positive integer).

13. manufacture method as claimed in claim 12, wherein, smoothly these projections after form the projection cube structure at m group tool one pitch angle, and each group projection cube structure is formed by connecting by n projection.

14. the manufacture method of a mirror surface comprises the following steps:

One substrate is provided;

On this substrate, form a photosensitive material layer;

This photosensitive material layer of block planning is to form a plurality of projections that different floorages of tool and bottom link to each other;

Level and smooth these projections are to form a declining lug structure; And

Form a metallic reflector on this substrate, this metallic reflector also covers this declining lug structure.

15. manufacture method as claimed in claim 14, wherein, the step of this photosensitive material layer of block planning also comprises exposure and develops.

16. manufacture method as claimed in claim 14 wherein is to utilize baking procedure to make these prismatoid fusionizations, with level and smooth these prismatoids.

17. manufacture method as claimed in claim 14, wherein, this mirror surface is to use in a reflecting type liquid crystal display panel.

18. the manufacture method of the declining lug structure on the mirror surface may further comprise the steps at least:

On a substrate, form a photosensitive material layer;

This photosensitive material layer that exposes makes the first under-exposure of this photosensitive material layer simultaneously;

This photosensitive material layer that develops is so that this first of this photosensitive material layer forms a recess; And

Level and smooth this photosensitive material layer is to form a continuous concaveconvex structure with a default pitch angle.

19. manufacture method as claimed in claim 18 wherein, provides a photomask so that this photosensitive material layer is exposed.

20. manufacture method as claimed in claim 18, wherein, this photomask comprises the first area to this first that should the photosensitive material layer, and to the second area of a second portion that should the photosensitive material layer, and this first area on this photomask comprises the photic zone of the many narrow slit structures of a tool, and this second area on this photomask then comprises a light tight district.

21. the manufacture method of the declining lug structure on the mirror surface may further comprise the steps at least:

Form a photosensitive material layer on a substrate, wherein, this photosensitive material layer comprises a first area and a second area;

This photosensitive material layer that exposes makes the first under-exposure of this photosensitive material layer simultaneously;

This photosensitive material layer that develops makes this second portion of this photosensitive material layer be bonded with each other via this first; And

This photosensitive material layer of fusion is to form a continuous concaveconvex structure with a default pitch angle.

Images