CN1316253C - Needle-adjusting jig and needle-adjusting method on reverse side of flip-up probe card - Google Patents

Abstract

A reverse side needle adjusting jig of a liftable probe card and a needle adjusting method thereof. In order to provide an integrated circuit detection instrument adjusting device and method capable of completely adjusting the needle position of a probe card to a correct position, the invention provides a jig which comprises an electron microscope, a base, a rotating structure arranged on the base, a glass base which is connected with the rotating structure and is used for placing replaceable glass, and a buffer piece for buffering the speed of the glass base when the glass base is overturned to a horizontal common plane; the glass base is provided with a turning structure for turning and adjusting the glass base; the method comprises fixing the probe card, installing the reverse side needle adjusting jig of the liftable probe card, and adjusting the needle position of the probe card; the fixed probe card is fixed on the platform of the probe adjusting machine with the reverse side of the probe card facing upwards; the back side needle adjusting jig for installing the liftable probe card is used for arranging the replaceable glass on the glass base; the replaceable glass is used for manufacturing different mask films aiming at different wafers, and the mask films are provided with a plurality of probe positioning points; the probe position of the probe card is adjusted to align the probe position of the probe card with the positioning point on the mask film.

Description

Needle-adjusting jig and needle-adjusting method on reverse side of flip-up probe card

technical field

The invention belongs to an integrated circuit detection device adjustment device and a method thereof, in particular to a flip-up probe card reverse needle adjustment jig and a needle adjustment method thereof.

Background technique

Due to the rapid development of the integrated circuit (IC) manufacturing process, in order to achieve high-density components in the IC, the size of the components is continuously reduced. However, the development of IC manufacturing process is progressing rapidly, and IC circuits must be tested to ensure the quality of IC shipments. After the wafer is manufactured, the IC in the wafer must be measured to confirm whether the IC is good or bad so as to maintain the shipment quality of the IC above the standard value.

Generally speaking, the probe card, prober and tester are the three key devices in the testing phase.

The probe card is a card with hundreds of micro spring technologies, on which there are many micro needles used to determine whether the die on the wafer is good or bad.

The needle testing machine is used to accurately move each piece of wafer to the correct position of the probe card, so that the tip of the micro needle on the probe card touches the carrier board, so as to transmit the electronic signal to the testing machine. Finally, the function, parameters and characteristics of the integrated circuit are tested by the testing machine.

As shown in Figure 1, generally speaking, the needle layer number of probe card 10 is seven layers, when testing crystal grain 14 in wafer 12 with probe card 10, be placed on the needing place with the probe of probe card 10 On the measured die 14 to confirm the quality of each die 14 . However, there are many types of ICs, and before using the probe card 10 to test the wafer 12, the needle positions of the probe card 10 must be adjusted to align with the positions of the crystal grains 14 to be measured. The probe card needle adjustment jig 16 adjusts the needle position of the probe card 10 to align with the position of the die 14 to be measured.

As shown in FIG. 2 , the conventional probe card needle adjustment fixture 16 includes a needle adjustment machine platform 18 , a fixing structure 20 and an electron microscope 22 .

During needle adjustment, the wafer 12 and the probe card 10 are sequentially placed on the needle adjustment machine platform 18 of the probe card adjustment fixture 16, and the wafer 12 and the probe card 10 are fixed with the fixed structure 20; The electron microscope 22 observes the front of the probe card 10 , and uses tweezers to adjust the position of the probe card 10 to align with the position of the die 14 to be measured in the wafer 12 . Since the conventional probe card adjustment jig 16 can only adjust the needle position by using the front side of the probe card 10, therefore, for the probe card with 10 needle layers more than three layers and probes with no window in the center are used during production. When the probe card 10 is used, then it is impossible to use tweezers to adjust the needle position to the correct position on the front of the probe card 10.

Contents of the invention

The object of the present invention is to provide a needle adjustment jig and needle adjustment method for the reverse side of a flip-up probe card that can completely adjust the needle position of the probe card to the correct position.

The jig of the present invention includes an electron microscope, a base fixed on the platform of the needle adjustment machine, a rotating structure on the base, a glass base connected to the rotating structure on which replaceable glass is placed, and a buffer glass base to flip to the horizontal A buffer for the speed of coplanarity; the glass base is provided with a flip structure for flipping and adjusting the glass base; the method includes the steps of fixing the probe card, installing the reverse needle adjustment jig of the flip-up probe card, and adjusting the probe. The needle position step of the needle card; the step of fixing the probe card is to fix the probe card on the platform of the needle adjustment machine with the back of the probe card facing upward; the step of installing the flip-up probe card reverse needle adjustment jig is to pull out The changeable glass is set on the glass base; the replaceable glass is made of different mask films for different wafers, and the mask film has multiple probe positioning points; the steps of adjusting the needle position of the probe card are to make the probe card The pin position of the probe is aligned with the positioning point on the mask film. Because the present invention can accurately move the probe of the probe card to the correct position, it overcomes the problems of the conventional technology, prolongs the service life of the probe card, reduces the cost of purchasing the probe card, and can completely adjust the probe. The needle is stuck in the correct position, so as to achieve the purpose of the present invention.

in:

The rotating structure is a rotating bearing.

The turning structure is a turning handle.

The needle adjustment machine platform with a fixed structure is provided with a protective structure to protect the probe card probes from being damaged and moved under pressure.

The glass base is provided with a glass trimmer for adjusting the horizontal coplanarity of the glass base.

The platform of the needle adjusting machine is fixed with a fixed structure for fixing the probe card on the platform of the needle adjusting machine.

The step of installing the needle-adjusting jig on the reverse side of the flip-up probe card also includes installing a protective structure on the needle-adjusting machine platform.

The step of installing the pin adjustment jig on the reverse side of the flip-up probe card also includes adjusting the horizontal coplanar error of the glass base to not exceed plus or minus 0.4 μm by means of the glass trimmer.

Description of drawings

Figure 1 is a schematic diagram of testing an IC in a wafer with a probe card.

Fig. 2 is a schematic perspective view of the structure of a conventional probe card adjustment jig.

Fig. 3 is a schematic perspective view of the structure of the present invention.

Fig. 4 is a schematic diagram of the horizontal coplanarity of the glass base of the present invention.

Fig. 5 is a vertical coplanar schematic view of the glass base of the present invention.

Fig. 6 is a schematic diagram of the replaceable glass covering the mask film under the electron microscope.

Fig. 7 is a schematic perspective view of the probe structure of the probe card.

Detailed ways

As shown in FIG. 3 , the flip-up type probe card reverse needle adjustment fixture 24 of the present invention includes a fixed structure 26 fixed on the needle adjustment machine platform 18, a base 28 fixed on the needle adjustment machine platform 18, and a The rotating structure 30, the glass base 32 connected with the rotating structure 30, the replaceable glass 34 placed on the glass base 32, the flipping structure 36 arranged on the glass base 32 and used to flip and adjust the glass base 32, The buffer member 38 , the support member 40 , the protective structure 42 and the electron microscope 22 arranged on the needle adjusting machine platform 18 .

The rotating structure 30 is a high-precision rotating bearing with an inversion error of 0.1 μm.

The turning structure 36 is a turning handle.

The protective structure 42 is a semicircular arc-shaped covering.

When flipping and adjusting the glass base 32 , the buffer member 38 buffers the speed when flipping to the horizontal coplanarity to prevent the probe card 10 from being damaged on the reverse side 1004 of the probe card 10 . surface, and the protection structure 42 protects the probes on the reverse side 1004 of the probe card 10 to avoid damage and movement due to human pressure.

The replaceable glass 34 is manufactured with different mask films 48 for different wafers 12 , and the positioning points on the mask film 48 are made according to the specifications of different wafers 12 .

As shown in Figure 4, the glass base 32 is connected to the rotating bearing 30, and the glass base 32 is turned and adjusted by the flip handle 36 fixed on the glass base 32; Place it on the glass base 32, adjust the horizontal coplanarity of the glass base 32 by means of the glass trimmer 46, and make the error of the horizontal coplanarity be 0.4 μm (mil) of the standard value, and then use the glass fixing piece 44 to adjust the horizontal coplanarity of the glass base 32 The removable glass 34 is fixed on the glass base 32; when the glass base 32 is flipped and adjusted, the speed at which the glass base 32 is flipped to a horizontal coplanar level is buffered by the buffer member 38, so as to prevent the 1004 probes on the reverse side of the probe card 10 from being damaged. And the support member 40 is used to maintain the horizontal coplanarity of the glass base 32 .

As shown in Figure 3, the needle adjustment method on the reverse side of the flip-up probe card of the present invention includes the following steps:

step one

fixed probe card 10

The probe card 10 is set on the needle adjusting machine platform 18 with the reverse side 1004 of the probe card 10 facing upwards, and the probe card 10 is fixed on the needle adjusting machine platform 18 by the fixing structure 26 .

step two

Install the needle adjustment jig on the reverse side of the flip-up probe card 24

As shown in FIG. 5 , the glass base 32 is turned over and adjusted to be vertically coplanar by the flip handle 36 fixed on the glass base 32 ; the replaceable glass 34 is used to make different masks for different wafers 12 Film 48, the positioning point on the mask film 48 should be made according to different wafer 12 specifications; the replaceable glass 34 that meets the test wafer 12 is placed on the glass base 32; The replaceable glass 34 is fixed on the glass base 32; the glass base 32 is adjusted to be horizontal and coplanar by the turning handle 36 fixed on the glass base 32, and the glass base 32 is buffered by the buffer member 38 Turn over to the speed of horizontal coplanarity to prevent the probe card 10 from being damaged on the reverse side 1004, and maintain the horizontal coplanarity of the glass base 32 with the support member 40; adjust the horizontal coplanarity of the glass base 32 by the glass trimmer 46 , and the error of the horizontal coplanarity is 0.4 μm (mil) of the standard value.

step three

Adjust the pin position of the probe

As shown in Figures 6 and 7, under the replaceable glass 34 with a mask film, use an electron microscope 22 to observe the mask film 48 on the replaceable glass 34, and then use tweezers to adjust and adjust the probe card 10 The pin position of the probe 1006 is on the reverse side 1004 , so that the pin position of the probe 1006 is aligned with several positioning points on the mask film 48 .

Since the present invention can accurately move the probe 1006 of the probe card 10 to the correct position, it overcomes the problems in the prior art, prolongs the service life of the probe card 10 and reduces the cost of purchasing the probe card.

Claims (9)

1, a kind of liftable probe reverse side needle regulating harness, it comprises electron microscope; It is characterized in that setting firmly base on the described pin adjusting machine platform; Base is provided with rotational structure; Rotational structure is connected with that placement can be substituted the glass pedestal of glass and so as to the bolster of the speed of buffering glass pedestal when turning to horizontal coplane; Glass pedestal is provided with and adjusts so as to upset the overturn structure of glass pedestal.

2, liftable probe reverse side needle regulating harness according to claim 1 is characterized in that described rotational structure is a rolling bearing.

3, liftable probe reverse side needle regulating harness according to claim 1 is characterized in that described overturn structure is the upset handle.

4, liftable probe reverse side needle regulating harness according to claim 1 is characterized in that the described pin adjusting machine platform that fixed sturcture is set is provided with the protection structure of avoiding fail in compression and moving so as to protection probe probe.

5, liftable probe reverse side needle regulating harness according to claim 1 is characterized in that described glass pedestal is provided with so as to adjusting the glass trimming piece of the horizontal coplane of glass pedestal.

6, liftable probe reverse side needle regulating harness according to claim 1 is characterized in that being fixed with on the described pin adjusting machine platform so as to probe being fixed in the fixed sturcture on the pin adjusting machine platform.

7, a kind of liftable probe reverse side needle regulating harness is transferred needle method, and it comprises stationary probe card step and adjusts probe pin position step; It is characterized in that described stationary probe card and adjust between the step of probe pin position being provided with the liftable probe reverse side needle regulating harness step of installation; Stationary probe card step system is fixedly arranged on probe on the pin adjusting machine platform up with the reverse side of probe; It is that extractable and changeable glass is located on the glass pedestal that liftable probe reverse side needle regulating harness step is installed; The shade film that extractable and changeable glass needle is different to different wafer manufacturing, the shade film has a plurality of probe anchor points; Adjust the anchor point on the pin bit alignment shade film that probe pin position step system makes the probe probe.

8, liftable probe reverse side needle regulating harness according to claim 7 is transferred needle method, it is characterized in that also being included in the liftable probe reverse side of the described installation needle regulating harness step protection structure is installed on the pin adjusting machine platform.

9, liftable probe reverse side needle regulating harness according to claim 7 is transferred needle method, it is characterized in that also comprising in the liftable probe reverse side of the described installation needle regulating harness step that adjusting the horizontal coplanar error of glass pedestal by the glass trimming piece is no more than positive and negative 0.4 μ m.

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