KR100262901B1 - Needle position fixing method and probe method in a probe device - Google Patents

Abstract

The probe device for semiconductor wafers includes a probe card having a plurality of probe needles mounted in the guide attachment hole. Under the probe card, a mounting table movable in the X-Y-θ direction in which the wafer is placed is provided. The mounting table includes a camera and is controlled by a controller. The probe card is connected to the probe card through the test head. It has a center of gravity to be aligned with the center of the probe card attachment hole. In order to fix the position of the probe needle after the guide is attached, first, the center position of the guide attachment hole on the absolute coordinate and the relative position between the probe needle on the probe card are stored in the memory of the controller. Next, one of the probe needles of the probe card attached to the card attachment hole is used as the reference needle, and the position of the reference needle on the absolute coordinate is detected and input to the controller. Next, the state positions between the probe needles stored in the memory are referred to, and the relative position of the needle position with respect to the reference needle is calculated from the controller. Next, the controller calculates the position of the reference needle on the absolute coordinate and the position of the center of the absolute coordinate according to the absolute position of the needle center. Next, the position error of the needle center position with respect to the position of the center of the card attachment hole on the absolute coordinate is calculated by the controller, and the position of the probe needle on the absolute coordinate is fixed according to the position error.

Description

Needle position fixing method and probe method in a probe device

1 is a schematic side view showing a probe device according to an embodiment of the present invention.

FIG. 2 is a planar outlet view showing the probe device shown in FIG.

3 is a perspective view showing a wafer mounting stage and a driving stage of the probe device shown in FIG.

4 is a schematic cross-sectional view showing a probe card having a balanced probe needle.

5 is a schematic cross-sectional view showing a probe card having a vertical probe needle.

6 is a schematic cross-sectional view showing a probe card having a bumper-type probe needle;

7 is a plan view showing a semiconductor device type top surface of a semiconductor wafer to be inspected.

8 is a schematic cross-sectional view showing the attachment state of another probe card for explaining the method according to the present invention.

FIG. 9 is a plan view showing the attachment state of the probe card shown in FIG. 8. FIG.

FIG. 10 is a plan view showing the needle area of the probe card shown in FIG.

FIG. 11 is a diagram showing cumulative errors in the attachment of the probe card shown in FIG. 8. FIG.

12 is a schematic cross-sectional view showing the needle state and needle center of another probe card.

13 is a perspective view showing a dummy card used in the method according to the present invention.

FIG. 14 is a plan view showing an example of the layout of the semiconductor chip group formed in a matrix on the wafer.

* Explanation of symbols for main parts of the drawings

1: Probe device 2: Stage base

3: mounting table 3a, 3b, 3c: stage

4, 40, 50, 60, 71: Probe card 5: Alignment unit

6: camera 7: joystick

8: controller 9: oploader

10 exchanger 11 wafer cassette

12: cassette holder 13: loader stage

14: handling arm 15, 52: probe needle

16: pogo pin 17: test head

20: camera 21, 23, 24, 25: chip

41: placement table 42, 51, 54: test substrate

43: substrate 44: probe needle

46: electrode pad 53: mounting table

55: guide portion 55a: sinking plate

55b: upper guide plate 55c: lower guide plate

56: Resin 57: Point

58: electrode pad 61: mounting table

62: test substrate 63: card substrate

64: block 65: membrane

66: electrode pad 67: bumper

68 buffer member 72 holder

73: plate 74: hole

CL ₁ , CL ₂ , CL ₃ , CL ₄ : Center 81: Pseudocard

81a: reference line 85: semiconductor group

85a: semiconductor chip W: wafer

An object of the present invention is to provide a needle position fixing method and a probe method using the probe in the probe device which enables automatic and efficient alignment of the probe needle with the contacted portion to be inspected.

According to a first aspect of the present invention, there is provided a probe device having a probe card having a plurality of probe needles and a card attachment portion for mounting the probe card,

A method of fixing the position of the probe needle after attaching a probe card having a needle center to be aligned with the center of the card attaching unit, and fixing the position of the probe needle in absolute coordinates. Storing a relative position between the probe needles in the probe card in a memory of the controller; and one of the probe needles attached to the card attachment portion as the reference needle, Detecting the position of the reference needle in absolute coordinates and inputting it to the controller, and referring to the relative position between the probe needle stored in the memory, and relative to the needle center with respect to the reference needle. Calculating the position by the control unit; the position of the reference needle on the absolute coordinate; and the relative of the reference needle center. In accordance with the value, the step of calculating the position of the needle center on the absolute coordinates by the controller; and the position error of the needle center position with respect to the center position of the card attachment portion on the absolute coordinates. The needle position processing method in the probe device provided with the said process, Comprising: The position of the said probe needle in the said absolute coordinate according to the said position error is provided.

A method provided by the second aspect of the present invention is a probe device having a probe card having a plurality of probe needles and a card attaching portion for attaching the probe card, wherein the card attaching portion is located at the center of the card attaching portion. A method of fixing the position of the probe needle after attaching the probe card to the card attachment part, wherein the relative position between the probe needles on the probe card is determined. Storing in the memory of the controller, and attaching a similar card having a shape congruent with the probe card to the card attachment portion, detecting the similar center of the similar card in absolute coordinates, and inputting the same to the controller. And the pseudo center is disposed corresponding to the needle center of the probe card, and the probe attached to the card attaching part. A step of detecting the position of the reference needle on the absolute coordinate and inputting the controller to one of the probe needles on the lobe card, and between the probe needles stored in the memory; Calculating, from the controller, a relative position of the needle center with respect to the reference needle with reference to a relative position of; and according to the position of the reference needle on the absolute coordinate and the relative position of the needle center. Calculating the position of the needle center in the absolute coordinates from the controller, and calculating the position error of the needle center with respect to the position of the pseudo center of the analogous card in the absolute coordinates; And a step of fixing the position of the probe needle on the absolute coordinate in accordance with the positional error. Provided with a hand position a probe method of Go.

The probe method which concerns on this invention using the needle position process method which concerns on the said 1st and 2nd viewpoint is equipped with the process of placing a test object on the mounting target of a probe device, and the said program in the said absolute coordinate. Driving the mounting table through the controller with reference to the position of the probe needle, and contacting the probe needle to the inspection object; and a test signal from the tester of the probe device to the inspection object through the probe needle. And measuring the electrical characteristics of the inspection object from the tester according to the response signal returned from the inspection object.

According to the present invention, it is possible to simplify the needle position fixing of the probe card, and the work efficiency can be improved. In particular, even when the contact between the electrode pad and the probe needle on the wafer is difficult to observe, such as a probe card having a vertical needle, the alignment of the electrode pad and the probe card needle can be easily performed.

Hereinafter, preferred embodiments of the present invention will be described in detail by the accompanying drawings.

First, the configuration and operation of the entire probe device for a semiconductor wafer according to the embodiment of the present invention will be described with reference to FIGS. 1 to 3.

In FIG. 1, the probe base 1 is provided with the stage base 2 in the substantially center.

The stage base 2 is equipped with a mounting table 3 for mounting the semiconductor wafer W and fixing it by vacuum suction. The mounting table 3 is composed of a Z-direction and a θ-direction stage 3a, an X-direction stage 3b, and a Y-direction stage 3c, as shown in FIG. 3, on the stage base 2 as desired. It is configured to be movable in the direction. The probe card 4 for probe inspection is provided above the mounting base 3 so as to face the semiconductor wafer W. As shown in FIG.

In the center of the probe device 1, an alignment unit 5 is provided as shown in FIG. The alignment unit 5 is provided with an image recognition device for alignment, for example, a camera 6, etc., and in the case of having the alignment, the mounting table 3 is moved to the lower position of the camera. In addition, the joystick 7 is attached to the alignment unit 5. The joystick 7 is operated by an operator, and it is possible to manually control the movement amount of the stick 2 in a micron order. In addition, the drive mechanism of the stick 2 is connected to the controller 8, the stick 2 is moved in the XYZ-θ direction in accordance with a control signal from the controller 8, and the probe card 4 is placed thereon. It is possible to have alignment with respect to the electrode pad of the semiconductor wafer W mounted in (3).

On the left side of the drawing of the probe device 1, an autoloader for carrying in and carrying out the semiconductor wafer W is arranged, and on the left side of the drawing, an exchanger 10 for replacing the probe card 4 is provided.

In the autoloader 9, a wafer cassette 11 in which a plurality of semiconductor wafers W are opened at predetermined intervals in a vertical direction to each other is disposed on the cassette holder 12 so as to be interchangeable. Between the wafer cassette 11 and the mounting table 3, a rotor stage 13 movable in a horizontal plane, and a wafer handling arm 14 which can be driven by a Y-direction drive mechanism and a Z-direction lift mechanism not shown are provided. .

When the semiconductor wafer W is probed by the probe card 4, the wafer W is conveyed by the rotor stage 13 to the vicinity of the mounting table 3, and by the handling arm 14. It is fixed again in 3) phase. Then, the probe needle 15 of the probe card 4 accurately positioned at the predetermined position by the method described below is connected to a predetermined contact point, for example, an electrode pad on the wafer W. As shown in FIG. The probe needle 15 is connected to the test head 17 via the pogo pin 16, and the test head 17 is connected to the disc.

During the test, test signals are sent to each chip by the tester, and the electrical characteristics of each chip are measured according to the response signals returned from each chip. That is, in the tester, the quality of the semiconductor device formed on the wafer W to be inspected is determined. After the inspection is finished, the wafer W is moved again on the loader stage 13 by the handling arm 14, and is transferred to the wafer cassette 11 by the loader stage 13.

In the exchanger 10, a probe card 4 in which one or two or more types of probe cards 4 are housed in the storage chamber 8, depending on the semiconductor device formed on the semiconductor wafer W to be inspected, is required. It is exchanged with the probe card 4 provided in the main body of the probe device 1.

Image recognition means, for example, a camera 20 is provided on the side surfaces of the mounting table 3 in the Z-direction and θ-direction stage 3a, and it is possible to image-recognize the lower surface of the probe card 4. . The camera 20 together with the mounting table 3 by driving the Z-direction and θ-direction stage 3a, the X-direction stage 3b and the Y-direction stage 3c from the controller 8 by a control signal. It is possible to drive to the desired position.

Next, the probe card 4 applicable to the probe device 1 is demonstrated, referring FIG. 4 thru | or FIG.

4 shows a probe card 40 with a so-called horizontal probe needle.

The probe card 40 includes a probe card substrate 43 disposed substantially parallel to an inspection surface of an inspection substrate 42 such as a wafer placed on the mounting table 41. For example, a probe needle 44 made of a dielectric material such as gold (Au), tungsten (W), and the like is attached so as to be inclined downward at an angle with respect to the probe card substrate 43. The front end 45 of the probe needle 44 is positioned so that the corresponding electrode pad 46 of the substrate under test 42 abuts.

At the time of inspection, the mounting table 41 is driven in the direction of arrow Z by a driving device (not shown), and the front end 45 of each probe needle 44 is electrically connected to the electrode pad 46. Thus, a signal is sent to each chip from the tester, and the electrical characteristics of each chip are tested according to the response signal returned from each chip.

5 shows a probe card 50 having a so-called vertical probe needle. The probe card 50 includes a substantially disk-shaped probe card substrate 51, a probe, a needle 52, and a probe on which the probe needle 52 is placed on the mounting table 53. The guide part 55 for guiding the test substrate 54 is provided. The probe 2 is made of, for example, a conductor such as gold (Au) or tungsten (W), and the portion 52a is placed in a direction perpendicular to the substrate under test.

The guide part is provided with a settling fixing plate 55a, an upper guide plate 55b and a lower guide plate 55c in order from above. These plate members 55a, 55b, 55c are provided with protrusions through which the probe needle 52 can be mounted, respectively. Each probe needle 52 is mounted through and positioned in a corresponding hole and then fixed by the fixing resin 56. The upper portion 52b of the probe needle is bent arcuately and electrically connected to the probe card substrate 51 at the point 57.

At the time of inspection, the mounting table 53 is driven in the direction of arrow Z, and the front end portion 52c of the probe needle is brought into contact with the electrode pad 58 of the substrate to be inspected 54. At this time, the probe needle 52 is elastically bent between the needle fixing plate 55a and the upper guide plate 55b, and acts to absorb the force in the vertical direction. In this way, the test signal is sent from the tester to the probe needle 52 electrically connected to the electrode pad 58 of the test substrate 54, and the electrical characteristics of each chip are changed according to the reaction signal returned from each chip. Is measured.

6 shows a probe card 60 having a so-called bumper-type probe needle. The probe card 60 includes a probe card substrate 63 disposed substantially parallel to an inspection surface of an inspection target substrate 62 such as a wafer placed on the mounting table 61. A block 64 is attached to the lower surface of the probe card substrate 63, and a flexible methylene substrate 65 is disposed to cover the block 64. A bumper 67 made of a dielectric such as gold (Au) or tungsten (W), for example, is attached at a position corresponding to the electrode pad 66 on the test target substrate 62 of the methylene substrate 65. . In addition, a buffer member 68 is disposed on the rear surface of the bumper 67, and the pressure is absorbed by the contact between the bumper 67 and the electrode pad 66.

At the time of inspection, the mounting base 61 is driven in the direction of arrow Z by a drive mechanism (not shown), and each bumper 67 and the electrode pad 66 are electrically contacted. The test signal is sent from each tester to each chip and the electrical characteristics of each chip are tested according to the reaction signal returned from each chip.

As described above, the method of the present invention is applicable to any type of probe card.

Next, a description will be given of the case where a probe chip is probed by the probe device 1 with reference to FIGS. 1 to 3 and 7.

As shown in FIG. 7, the semiconductor wafer W is formed with a plurality of chips 21. On the wafer W, an orientation plate 22 is formed. The pre-alignment of the wafer W is performed by providing the orientation plate 22 in the desired direction in the loader stage 13. After completion of the prealignment, the wafer W is placed on the mounting table 3 on the stage base 2 by the transfer arm 14. As a result, the wafer W to be inspected is opposed to the probe card 4.

For example, the probe test can be performed by dividing one semiconductor wafer W into four times. For example, the test is performed in the order of the upper left area, the upper right area, and the lower left area as shown in FIG. For example, 64 semiconductor chips 21 are formed in each region. Each chip 21 is composed of a plurality of electrode pads, one of which is selected as the reference electrode pad. Normally, the reference electrode pad is selected from the electrode pads formed in the chips 23, 24, 25, and 26 on the upper left of each region.

At the time of inspection, the corresponding reference probes are electrically connected to the reference electrode pads, and the direction of the [theta] direction between the wafer W and the probe card 4 on the mounting table 3 is aligned correctly. The needle bar is also positioned to be electrically connectable to the corresponding electrode pad, respectively. For this reason, first, the mounting table 3 is moved in the XY plane, the front end position of the reference probe needle is detected by the camera 20 attached to the mounting table 3, and the position information is stored in the controller ( It is necessary to memorize it in 8) (teaching process). This teaching process is necessary because the position of the front end of the reference probe needle is somewhat different from the ideal position.

For example, when the probe card 71 is used as shown in FIG. 8, the probe card 71 is interchangeably mounted via a guide holder 72 such as a ring inside.

The guide holder 72 is mounted in the guide attachment hole 74 provided in the head plate 73 of the apparatus main body. A plurality of lobe needles 71a are disposed in the probe guide 71. Although the probe needle 71a is different from the probe needle shown in FIG. 5, it is vertically arrange | positioned previously, and the front-end part is made to contact substantially perpendicularly with respect to the wafer W on the mounting base 3. As shown in FIG.

In the case of such a probe card 71, the position shift ΔP of the reference probe needle is caused by a cumulative attachment error as described above. First, as shown in FIG. 9, the ring center CL ₂ of the guide holder 72 slightly shifts with respect to the center CL ₁ of the guide attachment hole 74 at the time of mounting. In addition, the guide center CL ₃ of the probe guide 71 is originally shifted with respect to the ring center CL ₂ of the guide holder 72. In contrary the guide center (CL ₃₎ needle center (CL ₄₎ with respect to the probe guide (71) the case wherein the pro Wu beuchim (71a) to guide the probe 71 as shown in the Figure 10. Each such attachment error accumulates in the X and Y directions, respectively, as shown in FIG.

In practice, the needle center CL ₄ of the probe guide 71 may be aligned with the center CL ₁ of the guide attachment hole 74. However, the center CL ₄ of the probe guide 71 cannot be seen linearly, and its absolute position coordinates cannot be recognized immediately.

Therefore, in the related art, the needles of the probe guide and the electrode pads of the chip of the wafer are actually aligned while being gradually inspected, or each of the absolute position coordinates is recognized by viewing the probe needle and the electrode pad up and down using a TV camera or the like. The process of following the needle trajectory on the electrode pad is repeated several times and used for specific positioning methods, such as positioning to maintain accurate contact. However, these methods are very complicated in addition to the special skill of the operator.

The needle position fixing method according to the present invention for solving the powder of the conventional method will be described below with reference to the probe guide 71 shown in FIG.

First, as a preliminary step the position of the center (CL ₁₎ in the guide mounting holes 74, for example, is measured in advance or the like during manufacture of the device. The position of the center CL ₁ in the XY absolute coordinates of the device is stored in the memory of the controller 8. In addition, the information regarding the relative position in the X direction and the Y direction between the probe needles 71a is also stored in the memory of the controller 8. These stored positional information can be read as needed. The relative position between the needles 71a is obtained from a design specification showing the X-ray coordinate component and the Y-coordinate component between the needles for the needle arrangement. The company specification is prepared in accordance with the semiconductor device of the wafer W, that is, the chip design specification, and is used when the probe needle 71a is provided.

In the first step, one of the probe needles 71a of the probe card 71 is used as the reference probe needle, and the placing table 3 is placed so that the tele-camera 20 on the mounting table 3 side is located below it. Will drive. Then, the center of the reference probe needle is detected through the position camera 20 of the reference probe needle on the absolute coordinate by matching the center of the camera 20 with the reference point in the time of the camera 20. The position of the reference probe needle on the absolute coordinate is stored in the memory of the controller 8.

When the probe card 71 faces the θ direction thereof, that is, is attached to the passage substantially set in the angular direction, at least one reference probe needle for detecting the position in the first step is required. The reference probe needle may be at least one even when information on an error of? Is previously detected and stored in the memory of the controller 8. However, if two or more probe needles are used, the error in the? Direction of the probe card 71 with respect to the mounting table 3 is referred to in the absolute coordinates while referring to the information of the relative position between the probe needles 71a. It is possible to calculate from the positions of a plurality of reference needles, and it is also possible to more accurately determine the position of the needle center CL ₄ . Next, in the second step, the relative position of the needle center CL ₄ with respect to the reference probe needle is calculated. In this calculation, the information of the relative position between the probe needles 71a stored in the memory of the controller 8 is referred to. In the case where two or more reference probe needles are used, information on the error in the? Direction of the probe card 71 with respect to the mounting table 3 is referred to while referring to the information on the relative position between the probe needles 71a. Can also be obtained.

Next, in the third step, the position of the needle center CL ₄ on the absolute coordinate is calculated. This calculation is performed in accordance with the position of the probe needle 71a on the absolute coordinate obtained in the first step and the relative position of the needle center CL ₄ calculated in the second step. That is, when the position in the absolute coordinate of at least one reference probe needle is found, the position of the other probe needle and the position of the needle center CL ₄ on the absolute coordinate are stored in the memory of the controller 8. It is calculated by referring to the information of the relative position between the woofer needles 71a.

The needle center CL ₄ is a position to be aligned with the center CL ₁ of the attachment hole in the developing state. The position of the needle center CL ₄ can also be stored in advance in the memory of the controller 8 as part of the information of the relative position between the probe needles 71a, and for example, in fixing the needle position, As shown in FIG. 12, the position of the two reference probe needles 71a arrange | positioned at the both ends of an X direction and a Y direction can be detected, and it can also specify as the position of the center.

Next, in the fourth step, the position of the needle center CL ₄ on the absolute coordinate obtained in the third step and the position on the absolute coordinate of the center CL ₁ of the card attachment hole 74 are compared. The positional error of both is calculated. In this way, the attachment error occurring progressively from the center CL ₁ to the center CL ₄ is obtained.

In this way, the progressive final error in the attachment structure of the probe card 71 is recognized very efficiently.

In other words, the individual error along the way, specifically, the error between the center CL ₁ and the center CL ₂ , the attachment error between the center CL ₃ , and the center CL ₄ is almost instantaneously recognized automatically. .

Next, the wafer W is placed on the mounting table 3, and the actual inspection process is performed. At the time of inspection, the mounting table 3 is driven, and inspection is performed for every one semiconductor chip on the wafer W normally. The front end of the probe needle 71a is brought into contact with the corresponding electrode pad in the chip, and a test signal is sent from the test to the chip through the probe needle 71. And the electrical characteristics of the chip is measured according to the response signal returned from the chip. In the inspection, an error in the absolute coordinate between the center CL ₁ and the needle center CL ₄ , which are acquired information, and an error in the θ direction of the probe card 71 is used if necessary. For example, the measurement reference point originally set at the center CL ₁ is corrected according to the error between the center CL ₁ and the center CL ₄ , and the correction measurement reference point and, if necessary, θ of the probe card 71. The index movement of the mounting table 3 is performed with reference to the error in the direction.

In addition, US Patent Application No. 430,589 (USP4,966,520) and Japanese Patent Application, filed November 1, 1989 for the different positions of the wafers W mounted on the mounting table 3 at the time of inspection. Automatic positioning is performed by the disclosed technique which is disclosed in Japanese Patent Laid-Open No. 2-224260.

That is, first, the camera 6 of the alignment unit 5 is used, and the arrangement direction of each semiconductor chip arranged on the wafer W is detected. Thus, the wafer W is rotated so that the same arrangement direction is aligned with the moving direction of the mounting table 3. As a result, the electrode pad arrangement direction of the chip is aligned with the direction of the probe needle 71a. Simultaneously with this, the chip alignment pattern detected from the reference patterns previously stored in the memory of the controller 8 is selected. Therefore, the needle of the electrode pad of the chip and the probe needle 71a are automatically positioned by moving the wafer from the bottom of the alignment unit 5 of the wafer to the bottom of the probe card 71 according to the correction coordinates. .

The needle position fixing described above is executed every time the probe card 71 is exchanged with respect to the card attachment hole 74 of the apparatus. That is, a plurality of types of probe cards 71 having different needle placements are exchanged together with the ring inside 72, and when the probe cards 71 are exchanged, the fourth step from the first step described above is performed. Is executed.

In the above embodiment, the position on the absolute coordinate of the center CL ₁ of the card attachment hole 74 is previously stored in the memory of the controller 8 as a preliminary step of fixing the needle position. However, instead of this, it is possible to use a similar card 81 as shown in FIG. The similar card 81 constitutes a so-called dummy card having a shape coincided with the probe card 71 described above. The pseudo card 81 has a substrate made of a transparent material, such as glass, formed in the shape of a disk, which is co-ordinated with the probe card 71.

On the surface of the substrate, cross-shaped reference lines 81a and 81a are engraved on each other, and a center 81b appears by cross points between the two lines.

The pseudo card 81 is mounted in the card attachment hole 74 before the needle position is fixed, that is, before the probe card 71 is attached. Thus, the center 81b of the pseudo card 81 is detected through, for example, the TV camera 20, and the position on the absolute coordinate is stored in the memory of the controller 8. When the similar card 81 is used, instead of the center CL ₁ of the card attachment hole 74, the center 81b of the similar card 81 is set as an initial measurement reference point. Thus, the same positioning as in the above embodiment is possible.

In addition, the present invention can be similarly applied to the so-called multi-layout semiconductor chip group 85 as shown in FIG. In Fig. 14, a plurality of semiconductor chips 85a formed in a matrix on the wafer W are arranged. The needle of the probe card is arranged to correspond to the plurality of semiconductor chips 85a, and is configured to inspect them simultaneously. That is, the probe needles are provided so as to have a pair relationship with the electrode pads of the plurality of semiconductor chip groups 85.

In the probe apparatus, various data relating to the number and arrangement of chips in the multilayer outer chip group 85, the size of each semiconductor chip 85a, and the like are stored in advance. Probe cards needles for simultaneously inspecting the semiconductor chip group 85 are provided in accordance with these data. In the case of fixing the needle position of such a probe card, the data is used to align the center 85b of one suitable chip 85a in the semiconductor chip group 85 with the position of the corresponding probe card. The operation is performed.

Although the present invention has been described using a probe device of a semiconductor wafer as an example, the present invention can be equally applied to other probe devices that are inspected using a probe card, such as a probe device of an LCD substrate.

Claims (6)

A card attachment portion for mounting a probe card having a needle center so as to be aligned with the center of the card attachment portion, angular distribution conditions to be made with respect to the card attachment portion, and moveable in three-dimensional coordinates; A mounting table on which the inspection object is placed so as to face the first object, first optical detection means attached to the mounting table for image recognition of the probe needle, and a second optical device attached to the mounting table for image recognition of the semiconductor device. Probing an inspection object in which a plurality of semiconductor devices are arranged in a probe device including an optical detection means, a controller for controlling the operation of the mounting table, and a tester for sending a test signal to each semiconductor device through a probe probe. A method of fixing a position of a probe card having a plurality of probe needles for performing; Storing in the controller a relative position between the center position of the card attachment portion on the absolute coordinate and the probe needle on the probe card, and attaching the probe card on the card attachment portion; By referring to the center position of the card attachment portion and the relative position of the probe needle stored in the controller, the first and second reference probe needles of the probe needle are respectively made by the first optical detecting means. Moving the mounting table by the controller to recognize an image, detecting and storing positions of the first and second reference needles on the absolute coordinates in the controller, and the probe needles stored in the controller. Calculating a relative position of the needle center with respect to the first and second reference probe needles as the controller with reference to the relative position; Calculating a position of the probe needle center on the absolute coordinate based on the relative position of the probe position center and the positions of the first and second reference probe needles on the absolute coordinate; And calculating the position error of the needle center position with respect to the center position of the card attaching portion and the deviation of the probe card in the angular distribution in the absolute coordinates on the absolute coordinates. The needle position fixing method in a probe device provided with the process of fixing the position of the said probe needle in the said probe. The method of claim 1, wherein the inspection object comprises a semiconductor wafer, and the semiconductor device comprises an IC chip having electrode pads respectively in contact with the probe needle. The method of claim 1, wherein the probe needle is in contact with a plurality of the semiconductor devices at the same time. A card attachment portion for mounting a probe card having a plurality of probe needles, a probe card having a needle center so as to be aligned with the center of the card attachment portion, and conditions for angular distribution to be made with respect to the card attachment portion; A mounting table for placing the inspection object so as to be movable in three-dimensional coordinates so as to face the card attachment portion, first optical detection means attached to the mounting table for image recognition of the probe needle, and the mounting table. In a probe device comprising a second optical detection means attached to recognize the semiconductor device, a controller for controlling the operation of the mounting table, and a tester for sending a test signal to each semiconductor device through a probe probe, A method of probing a plurality of inspection targets in which a plurality of semiconductor devices are arranged, the method comprising: Storing a core position and a relative position between the probe needles on the probe card, attaching the probe card on the card attachment portion, the center position of the card attachment portion, The placement by the controller to recognize the first and second reference probe needles of the probe needle, respectively, by the first optical detection means with reference to the relative position of the probe needle stored in the controller. Moving the table and detecting and storing positions of the first and second reference needles on the absolute coordinates in the controller, and referring to the relative positions of the probe needles stored in the controller, Calculating a relative position of the needle center with respect to the first and second reference probe needles, the relative position of the probe needle center and Calculating a position of the center of the probe needle on the absolute coordinate based on the positions of the first and second reference probe needles on the absolute coordinate, and on the absolute coordinate, The position of the probe needle on the absolute coordinate is fixed by calculating the position error of the needle center position with respect to the center position of the card attachment portion and the deviation of the probe card in the angular distribution by the controller. And attaching the inspection object to the placement object, and moving the placement table to contact the semiconductor device with the probe needle, and inspecting the electrical characteristics of the semiconductor device by the tester. The positions of the semiconductor devices of the respective inspection targets are detected by the second optical detection means, The inspection object is aligned with the probe needle by moving the sneeze with reference to the detection position of the semiconductor device, the positions of the semiconductor device are detected for each inspection object, and the fixed position of the probe needle is Probe method, characterized in that commonly used in the alignment of the inspection object. The method of claim 4, wherein the inspection object comprises a semiconductor wafer, and the semiconductor device comprises an IC chip having electrode pads respectively in contact with the probe needle. The method of claim 4, wherein the probe needle is in contact with a plurality of the semiconductor devices at the same time.