CN1309529C - One-step molding technology and device for spherical soldering tin - Google Patents
One-step molding technology and device for spherical soldering tin Download PDFInfo
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- CN1309529C CN1309529C CNB200410100844XA CN200410100844A CN1309529C CN 1309529 C CN1309529 C CN 1309529C CN B200410100844X A CNB200410100844X A CN B200410100844XA CN 200410100844 A CN200410100844 A CN 200410100844A CN 1309529 C CN1309529 C CN 1309529C
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Abstract
The present invention provides a processing technology of non-ferrous metal granules and a device, more specifically a processing technology and a device for packaging soldering tin balls of BGA, CSP, etc. by an integrated circuit (IC). In the method of the present invention, melting soldering tin is continuously sent in an SMT laser hole plate container which is provided with an edge frame under the definite atmosphere, the temperature and the pressure by a melting water conveying pipe which is provided with a controllable adjusting valve; a synergistic effect of transversal force and longitudinal force which are generated by electromechanical oscillations enables the melting soldering tin to pass through the bottom of an SMT laser hole plate; when a plurality of micropores which form bulgy shape are to drip downwards, melting soldering tin liquid droplets are separated from the bottom of the SMT hole plate to drop by adding downward vacuum attracted force, and primary shaping of round balls and anti-oxidation treatment are completed in a vertical round barrel of the definite height; products are obtained by selecting, checking and packaging the true roundness of ball granules and the diameters of the ball granules. The shaping device is mainly composed of a metal melting furnace, a liquid granule shaper and a round ball shaper. The products of the non-ferrous metal ball-shaped granules of phi 0.1 to 1.0mm are prepared by using the technology and the device, and therefore, the present invention has the advantages of simple method and high yield rate, and the obtained products have the advantages of good true roundness, bright appearance and good anti-oxidation performance.
Description
Technical field
The present invention relates to non-ferrous metal particle preparation technology and device, be specifically related to IC encapsulation solder ball preparation technology and devices such as BGA, CSP.
Background technology
Solder ball is the metal pins of BGA encapsulation and CSP encapsulation IC, is mainly used in the products such as notebook computer, mobile communication equipment, computer motherboard, palm PC, global position system, digital camera.At present, the method that production solder ball in the world generally adopts is quantitative consolidation method, promptly cut method, its main technique is earlier metal to be drawn into thin footpath heart line, filament is cut into the transversal material of required compact dimensions, utilize the specific shaping dope that overweights certainly of material itself to carry out forming processes afterwards, make through cleaning, sieve, checking, as CN1355075, CN1320959A patent.But technology exists with limit inferior: (1) is directly limited by thin silk thread,＜0.3mm sphere diameter solder ball can't be made with " cutting method " technology, this method is mainly used in＞production of 0.3mm sphere diameter at present, is difficult to satisfy the IC encapsulation technology to the needs that become more meticulous, microminiaturization develops; Easily produce tolerance when (2) die-cut, yield rate is low; (3) adopt the shaping dope typing, increased follow-up cleaning, baking operation, increased the cost of product to a certain extent.
Summary of the invention
The object of the present invention is to provide a kind of adaptability strong, the ratio defective product height, good product quality, raw materials consumption is few, the simple solder ball moulding process of manufacture method; Simultaneously, also provide this method employed shaped device.
IC such as BAG of the present invention, CSP encapsulation mainly may further comprise the steps with solder ball " fusion one electromechanical integration " one-shot forming technique: metal molten, the moulding of electromechanical integration liquid grain, elementary ball moulding, landing cooling and anti-oxidant treatment, elementary ball screening, check and packing.It is characterized in that:
(1) metal molten: a certain amount of metal or alloy is dropped into the fusing of heating in the electric smelting pot, under on the fusing point 100～200 ℃, fully stir, be incubated.
(2) electromechanical integration liquid grain moulding: open fused solution grain device driving motor, vavuum pump, treat that atmosphere, temperature, pressure etc. are adjusted normal in the liquid grain device, open and be subjected to the liquid valve, by having the liquid pushing tube of controlled insulation, fused solution is sent in the band edge frame SMT laser orifice plate container of being transferred by mechanical force and electromagnetic force control, laterally reach under the longitudinal force in mechanical force, electromagnetic force, the liquid grain sees through and downward the protrusion in band edge frame SMT laser orifice plate.
According to the powder of prepared different-grain diameter, the aperture of SMT laser orifice plate is 0.05～0.50mm, error ± 0.005mm; Horizontal lateral force is the mechanical force that is produced by variable-speed motor and mechanism, 50～300 times/min of frequency, and vertical longitudinal force is the electromagnetic force that is produced by hertz oscilltor, 300～1200 times/min of frequency.
(3) elementary ball moulding: the liquid grain that SMT laser orifice plate protrudes down is subjected to downward vacuum action gravitational attraction, being the grain blobs shape breaks away to fall, pressing at oxygen is under the state of 40～600ppm, and the liquid grain is received circle gradually and is cooled to surface-brightening, zero defect, contains the spheric granules that oxygen is low, out of roundness is high in free settling.By various parameter control, can carry out the preparation of the different sphere diameter balls of Φ 0.1～1.0mm.
Described pull of vacuum by vavuum pump produce-0.02～-downward force of 0.06MPa.
(4) landing cooling and anti-oxidant treatment: spray into qualified antioxidant, the liquid grain is finished in the cooling cylinder of 7～9m in the cooling of receipts circle, bump against to produce to wrap with the antioxidant mist that sprays into and carry out, finish finishing when receiving the circle cooling.
(5) screening, check and packing: will wrap carry out the oxidation-resistant film spherolite and emit after, carry out spherolite out of roundness and particle diameter and screen, pack through the product that is up to the standards, defective work returns melt processed.
The employed shaped device of this method mainly is made up of metal molten stove, liquid grain former, ball former three parts.It is characterized in that being connected by liquid discharging tube between first one the liquid grain former of metal molten stove and second portion, liquid discharging tube has the heat-insulation layer of heating wire heating outward; The liquid grain former of second portion and the ball former of third part are close to the formation closed system; Liquid discharging tube, liquid grain former, ball former center line centering.
Establish the stainless steel melting pot in the described metal molten stove, be provided with temperature automatically controlled thermocouple and tapping control valve in the pot, bleeder valve is connected with liquid discharging tube.
Described liquid grain former is designed to airtight electromechanical oscillations structure, and inside is the SMT laser orifice plate container of band edge frame.Container top and liquid discharging tube center line centering, the surrounding is provided with the device of adjustable temperature control, and the bottom is a SMT laser orifice plate, is provided with some micropores that same diameter is evenly distributed; SMT laser orifice plate micropore is arranged as 100 * 100～300 * 300, and the aperture is 0.05～0.50mm, error soil 0.005mm.One end of adjustable motor and electric vibrator is installed in the liquid grain former enclosure that has heat-insulation layer, the SMT laser orifice plate container of other end connecting band frame.
Described ball former is the vertical cylinder of high 7～9m of being connected with liquid grain device.The antioxidant atomizing that middle upper end is provided with band adjustable electric magnet valve sprays into pipe, control nitrogen and antioxidant atomizing straying quatity, the lower end side is provided with the vacuum exhaust pipe of band adjustable electric magnet valve, vacuum and gas velocity in the control make-up machine, and the bottom is provided with the ball particle collecting vessel of band control valve.
The present invention has overcome the deficiency of conventional art, has the following advantages:
(1) Processes and apparatus adaptability is strong.By adjusting different dynamo-electric parameters, satisfy the tin ball (minimum diameter of " cutting method " production is 0.25mm) of producing 0.10～1.0mm different-grain diameter; Ball surface-brightening, good sphericity, oxygen content are low, and the product out of roundness is good, one-shot forming rate height.
(2) when making ball, finish anti-oxidant problem.The method that employing is sprayed at spherome surface, makes pellet surface form the thin oxidation-resistant film of one deck the organic or inorganic antioxidant spray coating, guarantees that elementary ball selects the fresh appearance of maintenance in round and the classification process at the postorder product, not because of the ingress of air oxidation stain.
(3) compare with the method for cutting, save operations such as " solder cut, cleans, oven dry, shaping dope moulding, cleaning, oven dry, cooling, cleaning ", directly will promptly carry out the spheroid moulding behind the required alloy melting, product cost reduces about 10% than like product.
(4) process units is simple, and is rational in infrastructure, easy to operate, under identical production scale, can reduce investment 50% than existing " cutting method ".
Description of drawings
Fig. 1 is the used shaping machine structure schematic diagram of the present invention.
Referring to Fig. 1, the used make-up machine of the present invention is mainly by three parts: the one, and the metal molten stove; The 2nd, liquid grain former; The 3rd, the ball former.Liquid discharging tube 6 by the band heat-insulation layer between metal molten stove and the liquid grain former is connected.
The metal molten stove: stainless steel melting pot 2 has temperature-control heat couple 1 and tapping control valve 3, has in the electrothermal furnace of heat-insulation layer and control-temperature electric heating silk 5 outside stainless steel melting pot 2 is contained in, and point molten metal 16 enters the outer liquid discharging tube 6 that has in the temperature adjustment heat-insulation layer 7 by bleeder valve 4.
The dynamo-electric make-up machine of fused solution grain: point molten metal 9 is provided with SMT laser template 12 and is with in the controlled insulation frame 17 in make-up machine shell 11, controllable mechanical power and electromagnetic force generator 10 act on controlled insulation frame 17 and support 8.
Receive circle cooling and finishing: liquid grain cooling cylinder 13 is connected on make-up machine shell 11 lower ends, and liquid grain cooling cylinder 13 middle and upper parts are provided with nitrogen and the antioxidant atomizing sprays into pipe 18, and the lower end is provided with vaccum suction tube 15 and the product collection is received bucket 14.
The specific embodiment
The present invention can produce the non-ferrous metal spheric granules of heterogeneity, different-grain diameter.Concrete needs alloyage as requested, and adjusts machinery and relevant parameters such as electric and magnetic oscillation frequency, atmosphere, pressure, temperature and SMT aperture, can obtain the spheric granules of varigrained high out of roundness.
The present invention further specifies by following examples.
Embodiment one
Utilize above-mentioned shaped device, the employing raw material is the alloy of 63%Sn, 37%Pb, produces solder ball according to the following steps:
(1) alloy melting: with commodity 1#Sn and 1#Pb ingot in proportion or qualified 63Sn37Pb alloy pig adds in the electric smelting pot after the heat fused,, treat that the alloy temperature reaches 360 ℃ ± 10 ℃, prepare alloy liquid put into " liquid grain make-up machine " through stirring.
(2) electromechanical integration liquid grain moulding: open each heat tracing facility in " make-up machine ", in machine, send into nitrogen and adjust atmosphere, pressure, temperature simultaneously, oxygen atmosphere 100ppm wherein, 390 ℃ ± 10 ℃ of temperature; Starter motor electric oscillation device, opening in the electric smelting pot bleeder valve puts alloy liquid and goes in the SMT laser orifice plate container, be respectively in frequency under the acting in conjunction of the mechanical force of 100 times/min, 800 times/min and electromagnetic force, the fused solution penetrating aperture is that Φ 0.10mm ± 0.005mm SMT laser orifice plate is drop and protrudes.
(3) elementary ball moulding, landing cooling: the drop that SMT laser orifice plate protrudes down is subjected to from downwards-and the 0.03MPa vacuum force comes off, and drop drops to and receives circle, cooling, moulding in 7.5 meters high cooling cylinders.
(4) anti-oxidant treatment: ball is received downwards in cooling cylinder and is accepted in circle, cooling, the moulding bag of the antioxygen mist agent that the middle and upper part sprays into to the cooling cylinder to carry out, and finishes the processing of ball surface oxidation-resistant and is elementary ball and drops into collecting vessel.
(5) screening, check and packing: with the feed hopper of packing into of elementary ball in the elementary ball collecting vessel, treat that " high accuracy ball separator " reaches " the out of roundness sorting " of carrying out elementary ball after " high accuracy sphere diameter separator " works well and reach " sphere diameter sorting " and obtain primary product, after check, qualified ball Φ 0.25mm ± 0.008mm packs into and charges into the inert gas warehouse-in behind the bottle, and defective ball returns the alloy melting pot and handles.
Embodiment two
The Pb-free solder ball of producing 96Sn3.5Ag0.5Cu by method and the step of embodiment one.Wherein the alloy melting holding temperature is 380 ℃ ± 10 ℃, interior 410 ℃ ± 10 ℃ of SMT laser orifice plate container, SMT laser hole panel aperture Φ 0.06mm ± 0.005mm; Other technological parameters are identical with embodiment one, and gained soldered ball particle diameter is Φ 0.15mm ± 0.005mm.
Claims (9)
1, a kind of IC encapsulation solder ball preparation technology is characterized in that carrying out according to the following steps: metal molten, the moulding of electromechanical integration liquid grain, elementary ball moulding, landing cooling and anti-oxidant treatment, elementary ball screening, check and packing; The moulding of described electromechanical integration liquid grain is under nitrogen protection fusion scolding tin to be sent in the SMT laser orifice plate container of band edge frame continuously by the fused solution carrier pipe of band controllable regulator valve; SMT laser orifice plate container bottom is distributed with the identical some micropores of diameter; by the horizontal lateral force of mechanical force and electromagnetic force generation and SMT laser orifice plate container generation level and the vertical vibration that vertical longitudinal force makes the band edge frame; make fusion scolding tin pass SMT laser orifice plate bottom micropore and protrude and desire to add from downward pull of vacuum when dripping downwards, make the fusion weld borne tin droplets break away from the bottom landing of SMT laser orifice plate.
2, preparation technology according to claim 1, it is characterized in that: the moulding of described electromechanical integration liquid grain, elementary ball moulding, landing cooling and anti-oxidant treatment are coherent processes, after the fusion weld borne tin droplets breaks away from SMT laser orifice plate bottom, in a high vertical cylinder of 7～9 meters, receive circle moulding, landing cooling.
3, by claim 1 or 2 described preparation technologies, it is characterized in that: described fused solution conveying, the moulding of liquid grain, elementary ball moulding, landing cooling and antioxygen are handled and are all carried out in the hypoxic atmosphere of nitrogen protection and 40～600ppm.
4, by claim 1 or 2 described preparation technologies, it is characterized in that: metal molten, liquid grain forming temperature should be higher than 100～200 ℃ of scolding tin melting temperatures.
5, by claim 1 or 2 described preparation technologies, it is characterized in that: horizontal lateral force is the mechanical force that is produced by variable-speed motor and mechanism, frequency is 50～300 times/min, vertical longitudinal force is the electromagnetic force that is produced by hertz oscilltor, frequency is 300～1200 times/min, pull of vacuum by vavuum pump produce-0.02～-the 0.06Mpa downward force.
6, by claim 1 or 2 described preparation technologies, it is characterized in that: SMT laser orifice plate micropore is arranged as 100 * 100～300 * 300, and the aperture is 0.05～0.50mm hole.
7, the employed shaped device of a kind of preparation IC encapsulation solder ball mainly is made up of metal molten stove, liquid grain former, ball former three parts; It is characterized in that being provided with temperature automatically controlled thermocouple and tapping control valve in the stainless steel melting pot in first one the metal molten stove, bleeder valve is connected with liquid discharging tube; Liquid discharging tube has the heat-insulation layer of heating wire heating outward, and the bleeder valve outlet is connected with the liquid grain former of second portion; The liquid grain former of second portion and the ball former of third part are close to the formation closed system; Liquid discharging tube, liquid grain former, ball former center line centering.
8, shaped device according to claim 7, it is characterized in that described liquid grain former is designed to airtight electromechanical oscillations structure, inside is the SMT laser orifice plate container of band edge frame, and its SMT laser orifice plate must form through retrofit, and its micropore error is ± 0.005mm.
9, shaped device according to claim 7, the nitrogen and the antioxidant atomizing that are provided with band adjustable electric magnet valve on it is characterized in that in the described ball former spray into pipe, control nitrogen adds and antioxidant atomizing straying quatity, the lower end side is provided with the vacuum exhaust pipe of band adjustable electric magnet valve, vacuum and gas velocity in the control make-up machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410100844XA CN1309529C (en) | 2004-12-08 | 2004-12-08 | One-step molding technology and device for spherical soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410100844XA CN1309529C (en) | 2004-12-08 | 2004-12-08 | One-step molding technology and device for spherical soldering tin |
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| Publication Number | Publication Date |
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| CN1657226A CN1657226A (en) | 2005-08-24 |
| CN1309529C true CN1309529C (en) | 2007-04-11 |
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| CNB200410100844XA Expired - Fee Related CN1309529C (en) | 2004-12-08 | 2004-12-08 | One-step molding technology and device for spherical soldering tin |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100431747C (en) * | 2005-10-27 | 2008-11-12 | 徐振武 | Preparation method of leadless soldering ball |
| CN103252500B (en) * | 2013-01-09 | 2017-08-22 | 深圳市创智成功科技有限公司 | A kind of tin ball production and equipment for semiconductor packages |
| CN103157962B (en) * | 2013-03-27 | 2015-04-08 | 云南锡业锡材有限公司 | Preparation method of slant-rolling tin ball |
| CN107081431B (en) * | 2017-04-26 | 2023-08-22 | 江苏兴贤高新材料股份有限公司 | Full-automatic BGA solder ball preparation facilities |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001340992A (en) * | 2000-06-01 | 2001-12-11 | Dowa Mining Co Ltd | Method and apparatus for manufacturing spherical body |
| CN2476100Y (en) * | 2001-05-11 | 2002-02-06 | 黄清池 | Disposable solder ball forming machine |
| JP2002192383A (en) * | 2000-12-28 | 2002-07-10 | Mitsubishi Materials Corp | Manufacturing method and device for soldering ball high in surface hardness |
| US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
| CN1127386C (en) * | 2000-11-27 | 2003-11-12 | 张道光 | Technology for making welding balls used for packing material |
| CN1476954A (en) * | 2003-06-30 | 2004-02-25 | 广州市特铜电子材料有限公司 | Production method of soldering tin ball for BGA and its equipment |
-
2004
- 2004-12-08 CN CNB200410100844XA patent/CN1309529C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
| JP2001340992A (en) * | 2000-06-01 | 2001-12-11 | Dowa Mining Co Ltd | Method and apparatus for manufacturing spherical body |
| CN1127386C (en) * | 2000-11-27 | 2003-11-12 | 张道光 | Technology for making welding balls used for packing material |
| JP2002192383A (en) * | 2000-12-28 | 2002-07-10 | Mitsubishi Materials Corp | Manufacturing method and device for soldering ball high in surface hardness |
| CN2476100Y (en) * | 2001-05-11 | 2002-02-06 | 黄清池 | Disposable solder ball forming machine |
| CN1476954A (en) * | 2003-06-30 | 2004-02-25 | 广州市特铜电子材料有限公司 | Production method of soldering tin ball for BGA and its equipment |
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| CN1657226A (en) | 2005-08-24 |
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Assignee: Yunnan Xiye Microelectronics Material Co.,Ltd. Assignor: Research & Design Institute of Yunnan Tin Industry Group Inc. Contract fulfillment period: 2009.9.27 to 2024.10.21 Contract record no.: 2009530000027 Denomination of invention: One-step molding technology and device for spherical soldering tin Granted publication date: 20070411 License type: Exclusive license Record date: 20091009 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.9.27 TO 2024.10.21; CHANGE OF CONTRACT Name of requester: YUNNAN TIN MICROELECTRONICS MATERIALS CO., LTD. Effective date: 20091009 |
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Granted publication date: 20070411 |