CN103252500B - A kind of tin ball production and equipment for semiconductor packages - Google Patents
A kind of tin ball production and equipment for semiconductor packages Download PDFInfo
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- CN103252500B CN103252500B CN201310006509.2A CN201310006509A CN103252500B CN 103252500 B CN103252500 B CN 103252500B CN 201310006509 A CN201310006509 A CN 201310006509A CN 103252500 B CN103252500 B CN 103252500B
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- rotating disk
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- tin ball
- coolant
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Abstract
The invention discloses a kind of tin ball production and equipment for semiconductor packages, and its method is to put into tin material to melt in melting furnace and keep tin liquor temperature to 250 450 DEG C；Tin liquor after fusing is by 500 3000 revs/min of the inflow turn up of conduit continuous uniform and the hemispherical rotating disk by preheating (preheating temperature is identical with tin liquor temperature), uniform tin ball is projected from the nozzle of rotating disk again, falls into the container equipped with coolant and is cooled and shaped.Then through over cleaning, product is examined and is packaged to be in anti-oxidant treatment, screening.The tin ball manufacturing equipment includes melting furnace, pipeline, three parts of spraying forming device.The invention uses continuous feed mode, and tin ball yield is greatly promoted, while yield also can be controlled flexibly, the tin ball particle of production is homogeneous, and out of roundness is high, and equipment is simple, and easy to operate, production cost is low.
Description
Technical field
The invention is related to a kind of production method for producing a diameter of 0.1-2.0mm for the tin ball of semiconductor packages.
The invention further relates to a kind of equipment used in aforementioned production method.
Background technology
BGA package is that come instead of the pin in IC component packaging structures, BGA package can be with using tin ball in semiconductor packages
Arrange more I/O, it is often more important that resistance optimization can be completed by functional requirement design from two layers to multilevel integration.
The tin ball that BGA package is used has at a relatively high size and form accuracy requirement.The major technique of existing production tin ball has chopping
Tin material, is first made the tin silk of certain specification, is cutting into segment, melted in the solvent that segment is immersed to certain temperature by remelting process
Change, be frozen into particle, solution causes tin silk thickness inequality in drawing process, the size for having influence on tin ball causes yield rate low,
And production equipment cost is higher.
The content of the invention
The purpose of the invention is to provide a kind of high yield rate, good product quality, and can produce 0.1-2.0mm diameters
Tin ball production method.
The another object of the invention is to provide a kind of simple structure for producing above-mentioned tin ball cheap equipment.
The tin ball production method of the semiconductor-sealing-purpose of the invention mainly has fusing, and centrifugal atomization shaping is shaped cold
But, anti-oxidant treatment, screening is examined and packed, it is characterised in that：
(1) centrifugal atomization is molded：Tin liquor is uniformly flowed into constantly rotated with 500-3000 revs/min and process preheating
Hemispherical rotating disk in, tin ball is ejected by the nozzle of hemispherical rotating disk bottom, different footpaths are changed according to production ball size
The nozzle of mouth size；
(2) sizing cooling：The tin ball ejected falls into cooling and shaping glomeration, coolant in the cooling bath equipped with coolant
For polyglycol solution, coolant temperature is not higher than 100 DEG C.
In above-mentioned centrifugal atomization forming step, the preferred rotating speed of dome-type rotating disk is in 800-2500 revs/min, rotating disk preheating
250-450 DEG C of temperature, preferably 350-450 DEG C；Shape in cooling step, coolant temperature is preferably no greater than 80 DEG C.
Fusing in aforementioned production method, centrifugal atomization shaping, sizing three steps of cooling can be set by complete set
The equipment of meter is completed, and it includes melting furnace, pipeline, spraying forming device, tin material is flowed into melting furnace fusing through piping
In shaped device, it is characterised in that：The shaped device includes rotating disk, mixer, coolant and cooling bath, wherein the stirring
Puddler is connected with below machine, mixer is fixed by puddler and rotating disk Internal Spherical Surface, and rotating disk is semi-spherical shape, and bottom is provided with
Nozzle, rotating disk is arranged right below cooling bath, and cooling bath is equipped with coolant, and cooling bath lower end is provided with outlet valve, rotating disk hemispherical
Sphere, which is fixed at the top of the end of puddler, spherical outside surface, opens a round mouth, and tin liquor flows into hemispherical rotating disk by round mouth, passes through rotating disk
The nozzle of bottom is projected, and is fallen into the coolant below rotating disk in cooling bath.
Described rotating disk is semi-spherical shape, and lumen width is 5-20cm, preferably 6-12cm, and outer hemisphere radius is 10-50cm,
It is preferred that 15-30cm, radian is 30-180 °, preferably 90-180 °, the material of rotating disk is stainless steel or titanium matter.
Described nozzle diameter is more somewhat larger than the tin ball size of production, preferably big 0.1mm, according to production different-diameter
Tin ball and the nozzle for choosing different bores.
The coolant uses polyethylene glycol 200, Liquid Macrogol, polyethylene glycol 400, Macrogol 600, poly- second two
Alcohol 800 or cetomacrogol 1000, the tin liquor ejected natural subsidence in the polyglycol solution of certain temperature, cooling, simultaneously
Tin ball ultimately forms the tin ball of circle by the surface tension of itself.
Tin ball is collected for convenience, and the bottom design of cooling bath is tapered.
The production method and equipment of the invention can be not only used for production leypewter tin ball and can also be used for producing Pb-free coating
Alloy tin ball.
The invention overcomes the shortcoming of prior art, with advantages below：
(1) strong adaptability of Processes and apparatus, can be met by the nozzle and adjustment agitator speed of changing different bores
The tin ball of the different footpath grains of 0.1-2.0mm is produced, product out of roundness is good, and one-pass finished rate is high；
(2) continuous feed mode is used, yield is greatly promoted, while yield also can be controlled flexibly；
(3) production equipment is simple and reasonable for structure, easy to operate, and other production methods of output investment ratio are few.
Brief description of the drawings
Fig. 1 is the flow sheet of the production method of the invention；
Fig. 2 is the equipment operation principle schematic diagram of the invention.
In figure：1st, melting furnace；2nd, flow valve；3rd, pipeline；4th, mixer；5th, puddler；6th, rotating disk；7th, nozzle；8th, cool down
Groove；9th, coolant；10th, outlet valve.
Embodiment
For the technical scheme of more preferable the invention, the embodiment of the invention is described below in detail.
Embodiment 1：
As shown in figure 1, the production method of the invention include molten tin, flow into rotating disk, it is injection molding, cooling and shaping, clear
Wash, it is anti-oxidation processing, screening, examine, packaging and other steps.
As shown in Fig. 2 the equipment of the invention includes melting furnace 1, pipeline 3, spraying forming device, spraying forming device
Including rotating disk 6, mixer 4, cooling bath 8, coolant 9, melting furnace 1 is connected to the surface of rotating disk 6 by pipeline 3, and tin material exists
Melting furnace 1 melts to be flowed into rotating disk 6 through piping, and the lower section of mixer 4 is connected with puddler 5, and mixer 4 passes through the He of puddler 5
The Internal Spherical Surface of rotating disk 6 is fixed, and rotating disk 6 is semi-spherical shape, and bottom is provided with nozzle 7, and rotating disk 6 is arranged right below cooling bath 8, cooling bath
8 are equipped with coolant 9, and the lower end of cooling bath 8 is provided with outlet valve 10, and the hemispherical Internal Spherical Surface of rotating disk 6 is fixed on the end of puddler 5, outside
A round mouth is opened at the top of sphere, tin liquor flows into hemispherical rotating disk 6 by round mouth, projected by the nozzle 7 of the bottom of rotating disk 6, falls into and turns
In coolant 9 in the lower section cooling bath 8 of disk 6.The radian of its turntable 6 is 90 °, and material is stainless steel or titanium matter, and inner chamber is wide
Spend for 5cm, outer radius of sphere 15cm, the footpath of nozzle 7 mouthful is 0.6mm.When produce sphere diameter for 0.5mm without slicker solder ball when, first will be unleaded
Fusing is heated in tin material ladle refining melting furnace 1, and tin liquor temperature is reached 400 DEG C, opening flow valve 2 makes tin liquor continuous and equal
Even 1400 revs/min of inflow turn up is simultaneously preheated in 400 DEG C of rotating disk 6, and is sprayed by footpath mouthful for 0.6mm nozzle 7, is fallen
Enter in the cooling bath 8 equipped with temperature for 60 DEG C of coolant 9- Liquid Macrogols, and be fixed to 0.5mm's in cooling procedure
Without slicker solder ball, then take out, tin ball is cleaned, anti-oxidant treatment by the outlet valve 10 of the bottom of cooling bath 8, screen, inspection
Test, be then packaged into product.
Embodiment 2：
The present embodiment difference from Example 1 is：The radian of rotating disk 6 in the said equipment is 150 °, and lumen width is
8cm, outer radius of sphere is 20cm.When produce sphere diameter for 1.0mm without slicker solder ball when, first will be without slicker solder material ladle refining melting furnace 1
Middle heating fusing, and tin liquor temperature is reached 450 DEG C, opening flow valve 2 makes tin liquor continuous and uniformly flows into turn up 1100
Rev/min and be preheated in 450 DEG C of rotating disk 6, and sprayed by footpath mouthful for 1.1mm nozzle 7, it is 50 DEG C to fall into equipped with temperature
In the cooling bath 8 of coolant 9- polyethylene glycol-800s, and be fixed in cooling procedure 1.0mm without slicker solder ball, then through supercooling
But the outlet valve 10 of the bottom of groove 8 is taken out, and tin ball is cleaned, anti-oxidant treatment, screens, and examines, is then packaged into product.
Embodiment 3：
The present embodiment difference from Example 1 is：The radian of rotating disk 6 in the said equipment is 180 °, and lumen width is
10cm, outer radius of sphere is 25cm.When producing the leypewter tin ball that sphere diameter is 0.1mm, first leypewter tin ball tin material is closed
Fusing is heated in gold input melting furnace 1, and tin liquor temperature is reached 350 DEG C, opening flow valve 2 makes tin liquor continuous and uniformly flow
Enter 2000 revs/min of turn up and be preheated in 350 DEG C of rotating disk 6, and sprayed by footpath mouthful for 0.2mm nozzle, fall into and be equipped with
Temperature in the cooling bath 8 of 70 DEG C of coolant 9- Macrogol 600s, and be fixed in cooling procedure 0.1mm without slicker solder
Ball, then takes out by the outlet valve 10 of the bottom of cooling bath 8, tin ball is cleaned, anti-oxidant treatment, screens, and examines, then
It is packaged into product.
Embodiment 4：
The present embodiment difference from Example 1 is：The radian of rotating disk 6 in the said equipment is 30 °, and lumen width is
15cm, outer radius of sphere is 35cm.When producing the leypewter tin ball that sphere diameter is 1.5mm, first leypewter tin ball tin material is closed
Fusing is heated in gold input melting furnace 1, and tin liquor temperature is reached 250 DEG C, opening flow valve 2 makes tin liquor continuous and uniformly flow
Enter 500 revs/min of turn up and be preheated in 250 DEG C of rotating disk 6, and sprayed by footpath mouthful for 1.6mm nozzle, fallen into equipped with temperature
Spend in the cooling bath 8 for 80 DEG C of coolant 9- polyethylene glycol 200s, and be fixed in cooling procedure 1.5mm without slicker solder ball,
Then take out, tin ball is cleaned, anti-oxidant treatment by the outlet valve 10 of the bottom of cooling bath 8, screened, examine, then wrap
Dress up product.
Embodiment 5：
The present embodiment difference from Example 1 is：The radian of rotating disk 6 in the said equipment is 180 °, and lumen width is
20cm, outer radius of sphere is 50cm.When producing the leypewter tin ball that sphere diameter is 2.0mm, first leypewter tin ball tin material is closed
Fusing is heated in gold input melting furnace 1, and tin liquor temperature is reached 300 DEG C, opening flow valve 2 makes tin liquor continuous and uniformly flow
Enter 3000 revs/min of turn up and be preheated in 500 DEG C of rotating disk 6, and sprayed by footpath mouthful for 2.1mm nozzle, fall into and be equipped with
Temperature in the cooling bath 8 of 30 DEG C of the cetomacrogol 1000 of coolant -9, and be fixed in cooling procedure 2.0mm without slicker solder
Ball, then takes out by the outlet valve 10 of the bottom of cooling bath 8, tin ball is cleaned, anti-oxidant treatment, screens, and examines, then
It is packaged into product.
A kind of chemical Ni-P alloy electroplating bath applied in HF link plate provided is provided to the invention above
It is described in detail, for those of ordinary skill in the art, according to the thought of the invention embodiment, specific real
Apply and will change in mode and application, in summary, this specification content should not be construed as to the invention
Limitation.
Claims (4)
1. a kind of production method of tin ball for semiconductor packages, is carried out according to the following steps：Fusing, centrifugal atomization shaping is fixed
Type is cooled down, anti-oxidant treatment, screening, is examined and is packed, it is characterised in that：
(1) melt：350-400 DEG C of the temperature of tin liquor；
(2) centrifugal atomization is molded：Tin liquor is uniformly flowed into constantly being rotated with 800-2500 revs/min and passing through preheating half
In spherical rotating disk, tin ball, 250-450 DEG C of rotating disk preheating temperature, preheating temperature are ejected by the nozzle of hemispherical rotating disk bottom
It is identical with tin liquor outflow fusing furnace temperature, the nozzle of different footpath mouthful sizes is changed according to production ball size；
(3) sizing cooling：The tin ball ejected falls into cooling and shaping glomeration in the cooling bath equipped with coolant, and coolant is poly-
Ethylene glycol solution, coolant temperature is not higher than 80 DEG C.
2. the equipment used in production method according to claim 1, it includes melting furnace, pipeline, spraying forming device,
Melting furnace, which is connected to by pipeline in the surface of rotating disk, pipeline, is provided with flow valve, and tin material is melted through piping stream in melting furnace
Enter in shaped device, it is characterised in that：The shaped device includes rotating disk, mixer, coolant and cooling bath, wherein described stir
Mix and be connected with puddler below machine, mixer is fixed by puddler and rotating disk Internal Spherical Surface, and rotating disk is semi-spherical shape, lumen width
For 5-20cm, outer hemisphere radius is 10-50cm, and radian is 30-180 °, and bottom is provided with nozzle, and rotating disk is arranged right below cooling bath,
Coolant is housed, cooling bath lower end is provided with outlet valve, and rotating disk hemispherical Internal Spherical Surface is fixed on the end of puddler, outside in cooling bath
Open a round mouth at the top of sphere, tin liquor flows into hemispherical rotating disk by round mouth, the material of rotating disk is stainless steel or titanium matter, described cold
But bottom land end is cone-shaped.
3. equipment according to claim 2, it is characterised in that：The footpath mouthful size of the nozzle is than the big 0.1mm of tin ball sphere diameter.
4. equipment according to claim 2, it is characterised in that：The coolant uses polyethylene glycol 200, polyethylene glycol
300, polyethylene glycol 400, Macrogol 600, polyethylene glycol-800 or cetomacrogol 1000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310006509.2A CN103252500B (en) | 2013-01-09 | 2013-01-09 | A kind of tin ball production and equipment for semiconductor packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310006509.2A CN103252500B (en) | 2013-01-09 | 2013-01-09 | A kind of tin ball production and equipment for semiconductor packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103252500A CN103252500A (en) | 2013-08-21 |
| CN103252500B true CN103252500B (en) | 2017-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310006509.2A Active CN103252500B (en) | 2013-01-09 | 2013-01-09 | A kind of tin ball production and equipment for semiconductor packages |
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| CN (1) | CN103252500B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109807340A (en) * | 2019-01-31 | 2019-05-28 | 徐九生 | A kind of manufacture craft of conducting sphere |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100493818C (en) * | 2003-06-30 | 2009-06-03 | 广州市特铜电子材料有限公司 | Production method of soldering tin ball for BGA and its equipment |
| CN1309529C (en) * | 2004-12-08 | 2007-04-11 | 云南锡业集团有限责任公司研究设计院 | One-step molding technology and device for spherical soldering tin |
| JP2007332406A (en) * | 2006-06-13 | 2007-12-27 | Sanki Dengyo Kk | Method for forming fine powder by using rotary crucible, and apparatus therefor |
| CN101722379B (en) * | 2009-11-26 | 2011-04-13 | 大丰市大奇金属磨料有限公司 | Preparation process of ball grid array encapsulation lead-free tin ball |
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| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yao Yu Inventor before: He Caixiong Inventor before: Chen Jianping Inventor before: Li Yunhua Inventor before: Wang Wenzhen Inventor before: Yang Ming |
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| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170629 Address after: 518000, Shenzhen, Guangdong, Baoan District Fuyong street, Fuyuan Industrial Zone, B2, block 1 (1 floor, C, 2 North) Applicant after: Shenzhen Chuangzhi Successful Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong, Xixiang Baoan District street the Peach Garden science and technology innovation park main building 626 (office space) Applicant before: Shenzhen Chuangzhi Material Technology Co., Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200402 Address after: 226400 East Jinchuan road and North Youzha Road, Nantong high tech Zone, Nantong City, Jiangsu Province Patentee after: Jiangsu Sizhi Semiconductor Technology Co., Ltd Address before: 518000, Shenzhen, Guangdong, Baoan District Fuyong street, Fuyuan Industrial Zone, B2, block 1 (1 floor, C, 2 North) Patentee before: AGC TECHNOLOGY CO., LTD. SHENZHEN SUCCESS |
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| TR01 | Transfer of patent right |