CN1298506C - Cutting tip monitoring device for cutting device - Google Patents

Abstract

Provided is a cutting blade monitoring device for a cutting device capable of correctly detecting the state of a cutting edge of a cutting blade without being affected by cutting water or contamination, which can also be applied to cutting devices having multiple blades. This cutting blade monitoring device is for a cutting device provided with a workpiece holding means to hold a workpiece, and a cutting means to cut the workpiece held by the workpiece holding means, where the cutting means is provided with a rotary spindle, and a cutting blade installed on the rotary spindle, and provided with a cutting edge comprising abrasive grains fixed by magnetic material. It is provided with a magnetism sensor disposed to face the outer circumference of the cutting edge of the cutting blade, and a control means to determine the state of the cutting edge based on detection signals from the magnetism sensor.

Description

Cutting blade monitoring device for cutting device

technical field

The present invention relates to a cutting blade monitoring device of a cutting device, and more specifically, to a cutting blade monitoring device of a cutting device for determining the breakage and wear limit of a cutting blade for cutting workpieces such as semiconductor wafers.

Background technique

As is well known to those skilled in the art, in a semiconductor device manufacturing process, the surface of a generally wafer-shaped semiconductor wafer is divided into a plurality of regions by lines (cutting lines) arranged in a grid. Circuits such as ICs and LSIs are formed in this divided area. Then, by cutting the semiconductor wafer along the lanes, the regions where the circuits are formed are separated, and individual semiconductor chips are manufactured. Typically, semiconductor wafers are severed along the lanes using a cutting device known as a slicer. This cutting device includes: a chuck table as a workpiece holding unit that holds a workpiece semiconductor wafer; and a cutting unit that cuts the semiconductor wafer held on the chuck table. The cutting unit includes a rotary shaft rotating at high speed, and a cutting blade mounted on the rotary shaft. The cutting blade is composed of a disc-shaped base and an annular cutting edge mounted on the side surface of the base. The cutting edge is, for example, fixed on the base with diamond abrasives with a particle size of about 3 μm by electroforming to form a 15 μm About the thickness.

If the cutting edge of the cutting insert is damaged, or if the wear amount of the cutting edge exceeds a predetermined limit value, it will cause damage and cracks on the cut surface of the cut semiconductor chip, resulting in a problem that the quality of the semiconductor chip is reduced. Therefore, the cutting device has a cutting insert monitoring device that monitors the state of breakage and wear of the cutting edge of the cutting insert. Such a cutting blade monitoring device has a light emitting element arranged on one side so as to sandwich the outer peripheral portion of the cutting edge of the cutting blade, and a light receiving element arranged on the other side. The element receives a change in the amount of light emitted by the light-emitting element, that is, the amount of breakage and wear occurring on the cutting edge of the cutting blade is detected based on the change in the amount of light emitted by the light-emitting element blocked by the cutting edge of the cutting blade.

However, in the above-mentioned cutting device, since the cutting operation is performed while supplying cutting water to the cutting blade, the cutting blade monitoring device using a light-emitting element and a light-receiving element has the following problems:

(1) Due to the influence of cutting water, light is refracted, and although no damage occurs on the cutting edge, it may be misjudged that damage has occurred.

(2) If dirt generated by cutting adheres to the light-emitting surface of the light-emitting element or the light-receiving surface of the light-receiving element, the amount of light received by the light-receiving element will change, so the state of the cutting edge of the cutting blade cannot be accurately detected.

(3) Since the light-emitting element and the light-receiving element are arranged so as to sandwich the cutting edge of the cutting insert, it is difficult to apply to a so-called multi-blade case in which two or more cutting inserts are arranged in the axial direction.

Contents of the invention

The present invention is in view of the above facts, and its main technical task is to provide a cutting tool that can accurately detect the state of the cutting edge of the cutting blade without being affected by cutting water and dirt, and can also be applied to equipment equipped with a so-called multi-blade cutting device. Cutting blade monitoring device for cutting devices.

In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a cutting blade monitoring device of a cutting device, which is characterized in that the cutting device includes: a workpiece holding unit for holding a workpiece; A cutting unit for a workpiece held by a holding unit, the cutting unit is provided with: a rotary shaft, and a cutting blade mounted on the rotary shaft and having a cutting edge whose abrasive is fixed by a magnetic material,

The cutting blade monitoring device of the cutting unit has:

a magnetic sensor disposed opposite the periphery of the cutting edge of the cutting insert, and

A control unit that judges the state of the cutting edge based on the detection signal from the magnetic sensor.

The magnetic sensor converts the magnetic force generated between the cutting edge into a voltage value and outputs it, and the control unit determines the state of the cutting edge based on a change in the detected voltage value detected by the magnetic sensor. The control unit obtains an average value of detection voltage values detected by the magnetic sensor, and determines that the cutting edge has reached the wear limit when the average value exceeds a predetermined wear limit value. In addition, the control means determines that the cutting edge is broken when a peak voltage value of the detected voltage value detected by the magnetic sensor exceeds a predetermined limit value. In addition, the control unit obtains an average value of the detection voltage values detected by the above-mentioned magnetic sensor, and determines that a cutting edge occurs when the peak voltage value of the detection voltage value exceeds a value obtained by adding the average value and a predetermined limit value. damaged.

According to the present invention, there is provided a cutting blade monitoring device for a cutting device, characterized in that the cutting device includes: a workpiece holding unit that holds a workpiece; and a device that cuts the workpiece held by the workpiece holding unit. a cutting unit having: a rotary shaft, and a cutting blade mounted on the rotary shaft and having a cutting edge whose abrasive is fixed by a magnetic material,

The cutting blade monitoring device of the cutting unit has:

a magnetic sensor disposed opposite to the periphery of the cutting edge of the cutting insert,

a turning angle detection unit that detects the turning angle of the cutting insert, and

A control unit that determines the state of the cutting edge based on the detection signals from the magnetic sensor and the swivel angle detection unit.

The magnetic sensor converts the magnetic force generated between the cutting edge into a voltage value and outputs it, and the control unit determines the state of the cutting edge based on a change in the detected voltage value detected by the magnetic sensor. The control unit obtains an average value of detected voltage values detected by the magnetic sensor when the cutting blade makes one revolution, and determines that the cutting edge has reached the wear limit when the average value exceeds a predetermined wear limit value. In addition, the control means determines that the cutting edge is broken when the peak voltage value of the detection voltage value detected by the magnetic sensor exceeds a predetermined limit value when the cutting insert makes one revolution. In addition, the control unit obtains an average value of the detected voltage values detected by the magnetic sensor when the cutting blade rotates once, and when the peak voltage value of the detected voltage value exceeds a value obtained by adding the average value and a predetermined limit value, In this case, it is determined that the cutting edge is broken.

According to the present invention, there is provided a cutting blade monitoring device for a cutting device, characterized in that the cutting device includes: a workpiece holding unit that holds a workpiece; and a device that cuts the workpiece held by the workpiece holding unit. a cutting unit comprising: a rotary shaft, and a cutting blade mounted on the rotary shaft and having a cutting edge having abrasives fixed by a magnetic material and forming a plurality of notches on the cutting edge,

The cutting blade monitoring device of the cutting unit has:

a magnetic sensor disposed opposite to the periphery of the cutting edge of the cutting insert,

a turning angle detection unit that detects the turning angle of the cutting insert, and

A memory for storing the rotation angle position of the cutting insert forming the plurality of notches, and a control unit for determining the state of the cutting edge based on detection signals from the magnetic sensor and the rotation angle detection unit are provided.

The above-mentioned magnetic sensor converts the magnetic force generated between the above-mentioned cutting edge into a voltage value and outputs it, and the above-mentioned control unit obtains the average value of the detected voltage values detected by the magnetic sensor when the above-mentioned cutting blade rotates one revolution, and when corresponding to a plurality of notches, When the peak voltage value of the detected voltage value at the rotation angle position other than the rotation angle position exceeds the value obtained by adding the average value and the predetermined limit value, it is determined that the cutting edge is broken. In addition, the magnetic sensor converts the magnetic force generated between the cutting edge into a voltage value and outputs it. The memory stores voltage values corresponding to the rotation angle positions of the plurality of notches. When the peak voltage value of the detection voltage value detected by the magnetic sensor exceeds the voltage value corresponding to the rotation angle positions of the plurality of notches stored in the memory, it is determined that the cutting edge is broken. In addition, the magnetic sensor converts the magnetic force generated between the cutting edge into a voltage value and outputs it, and the control unit controls the rotation angle positions other than the rotation angle positions corresponding to the plurality of notches when the cutting blade rotates once. When the peak voltage value of the detection voltage value detected by the magnetic sensor exceeds a predetermined threshold value, it is determined that the cutting edge is broken.

Other characteristics of the present invention can be understood from the following description.

Description of drawings

Fig. 1 is a perspective view of a cutting device equipped with a cutting blade monitoring device according to the present invention.

Fig. 2 is a perspective view of main parts of a main shaft provided in the cutting device shown in Fig. 1 .

Fig. 3 is a block diagram showing the configuration of a cutting blade monitoring device according to the present invention.

FIG. 4 is an explanatory view showing another embodiment of the arrangement position of a magnetic sensor as a blade detection unit constituting the cutting blade monitoring device shown in FIG. 3 .

Fig. 5 is a block diagram of a procedure for wear monitoring control operation of a control unit constituting the cutting insert monitoring device shown in Fig. 3 .

FIG. 6 is an explanatory view showing a detection voltage value of a magnetic sensor as a blade detection means constituting the cutting blade monitoring device shown in FIG. 3 .

FIG. 7 is an explanatory diagram showing a relationship between an average value of detected voltage values of the magnetic sensor shown in FIG. 3 and a wear limit value.

Fig. 8 is a block diagram showing a procedure for a damage monitoring control operation of a control unit constituting the cutting insert monitoring device shown in Fig. 3 .

FIG. 9 is an explanatory view showing an insert breakage and a detection voltage value of a magnetic sensor as an insert detecting means constituting the cutting insert monitoring device shown in FIG. 3 .

10 is an explanatory diagram showing the relationship between detection voltage values of a notch blade and a magnetic sensor serving as blade detection means constituting the cutting blade monitoring device shown in FIG. 3 , its average value, and a wear limit value.

FIG. 11 is an explanatory diagram showing a notch blade breakage and a detection voltage value of a magnetic sensor as blade detection means constituting the cutting blade monitoring device shown in FIG. 3 .

FIG. 12 is an explanatory diagram showing an embodiment related to the arrangement of magnetic sensors for multiple blades.

FIG. 13 is an explanatory diagram showing another embodiment related to the arrangement of magnetic sensors for multiple blades.

The symbols are explained as follows:

2: Device stand

3: Suction cup table

4: Spindle part

41: Spindle sleeve

42: rotary axis

43: Cutting blade

44: Blade Guard

45: Support components

5: Cutting blade monitoring device

51: Magnetic sensor (MS)

52: Control unit

53: Rotation angle detection unit ((RE)

6: camera mechanism

7: Display device (DSP))

11: Semiconductor wafer

12: Support box

13: Tape

14: box

16: The processed object is transported out of the device

17: Processed object conveying device

18: washing device

19: Washing and transporting device

Detailed ways

The following details the cutting blade monitoring device of the cutting device according to the present invention with reference to the accompanying drawings.

preferred embodiment.

Fig. 1 is a perspective view showing a cutting device equipped with a cutting blade monitoring device according to the present invention.

The cutting device in the illustrated embodiment includes a substantially rectangular parallelepiped device stand 2 . In the apparatus stand 2, a chuck table 3 serving as a workpiece holding unit for holding a workpiece is arranged so as to be movable in a direction indicated by an arrow X which is a cutting feed direction. The chuck table 3 is provided with: an adsorption chuck support table 31, and an adsorption chuck 32 mounted on the adsorption chuck support table 31, and a workpiece to be processed, such as a disk-shaped semiconductor wafer, is held on the adsorption chuck 32 by an adsorption device not shown in the figure. The surface is the mounting surface. In addition, the chuck table 3 is configured to be rotatable by a not-shown rotatable mechanism.

The cutting device of the illustrated embodiment includes a spindle portion 4 as a cutting means. The main shaft portion 4 is provided with: a main shaft sleeve 41 that can be moved and adjusted in the direction indicated by the arrow Y in the cut-out direction or in the direction indicated by the arrow Z in the cut-out direction, which is mounted on a mobile base not shown in the figure, and is supported freely in rotation. A rotary shaft 42 in the main shaft sleeve, and a rotary tool, namely, a cutting blade 43 mounted on the front end of the rotary shaft 42 . As shown in FIG. 2, the cutting insert 43 is composed of a disc-shaped base 431 formed of aluminum alloy and an annular cutting edge 432 attached to the side of the base 431. As shown in FIG. The cutting edge 432 is, for example, fixed on the base 431 with a diamond abrasive with a particle size of about 3 μm by electroforming to form a thickness of about 15 μm.

As shown in FIG. 2 , an insert guard 44 covering the upper half of the cutting insert 43 is attached to the front end portion of the main shaft sleeve 41 constituting the main main shaft portion 4 . A support member 45 is slidably attached to the blade guard 44 along guide pins 451, 451, and the support member 45 is used for mounting a blade constituting a cutting blade monitoring device for detecting cutting blade wear limit time and cutting blade breakage described later. detection unit. In addition, the cutting water supply nozzles 461 and 462 arranged on both sides of the cutting blade 43 are attached to the blade guard 44 . In addition, the outer cutting water supply nozzle 462 is attached to the movable attachment member 47 which is rotatably supported by the blade guard 44 via the spindle 471 . These cutting water supply nozzles 461 and 462 are connected to a cutting water supply source by flexible hoses (not shown). In addition, an actuation pin 472 is attached to the above-mentioned movable attachment member 47 . When the cutting blade 43 is replaced, the movable mounting member 47 is rotated upward around the support shaft 471, and the actuating pin 472 comes into contact with the lower surface of the support member 45, so that the support member 45 moves upward along the guide pins 451, 451. .

Returning to FIG. 1 to continue the description, the cutting device in the illustrated embodiment is provided with an imaging mechanism 6 for imaging the surface of the workpiece held on the suction chuck 32 constituting the aforementioned chuck table 3, or for detecting The entire area cut by the cutting blade 43, or the state of the cutting groove is checked. The imaging mechanism 6 is composed of optical devices such as a microscope and a CCD (charge-coupled device) camera. In addition, the cutting device is provided with an image display unit 7 (DSP digital signal processing) for displaying images captured by the camera 6 .

The cutting apparatus in the illustrated embodiment includes a box 14 for storing semiconductor wafers 11 to be processed. The semiconductor wafer 11 is supported by an adhesive tape 13 on an annular support frame 12 made of a metal material such as stainless steel, and is housed in the aforementioned case 14 in a state supported on the support frame 12 . In addition, the box 14 is placed on a box base 141 arranged to move up and down by an unshown elevating mechanism.

The cutting device in the illustrated embodiment includes a device for transporting the semiconductor wafer 11 (in a state supported by the tape 13 on the support frame 12 ) of the workpiece stored in the box 14 to the workpiece placement area 15 . The processed object delivery device 16, the processed object delivery device 17 that transports the semiconductor wafer 11 carried out by the processed object delivery device 16 to the above-mentioned chuck table 3, and washes the semiconductor wafer 11 that has been cut on the chuck table 3 The cleaning device 18 and the cleaning transport device 19 for transporting the semiconductor wafer 11 cut on the chuck table 3 to the cleaning device 18 .

Hereinafter, the processing operation of the above-mentioned cutting device will be briefly described.

The box base 14 is moved up and down with a lifting device not shown, and the semiconductor wafer 11 in a state supported by the tape 13 on the support frame 12 at a predetermined position of the box 14 (hereinafter, the semiconductor wafer 11 will be supported by the tape 13 on the support frame 12) The state of the semiconductor wafer 11 is only referred to as a semiconductor wafer) is placed on the carry-out position. Then, the workpiece carrying-out device 16 advances and retreats, and carries out the semiconductor wafer 11 placed on the carrying-out position to the workpiece placement area 15 . The semiconductor wafer 11 carried out to the workpiece mounting area 15 is conveyed to the mounting surface of the suction chuck 32 constituting the above-mentioned chuck table 3 by the rotating operation of the workpiece conveying device 17, and is sucked by the suction pad (not shown). The attraction of the device keeps it on the suction cup 32. In this way, the chuck table 3 that sucks and holds the semiconductor wafer 11 is moved to directly below the imaging mechanism 6 . When the chuck table 3 is placed under the camera mechanism 6, the camera mechanism 6 detects the cutting line (line path) formed on the semiconductor wafer 11, moves and adjusts the main shaft part along the cutting direction, that is, the arrow Y direction, and operates to make the cutting line and the cutting blade The positions of 43 are precisely aligned.

Thereafter, while feeding the cutting blade 43 with a predetermined cutting amount in the direction shown by the arrow Z and rotating it in a predetermined direction, the cutting blade 43 is cut along the direction shown by the arrow X (the distance between the cutting blade 43 and the direction shown by the arrow X). The direction perpendicular to the axis of rotation) moves the chuck table 3 that attracts and holds the semiconductor wafer 11 at a prescribed cutting feed rate, whereby the semiconductor wafer 11 held on the chuck table 3 can be cut off along the prescribed cutting line with the cutting blade 43 . In addition, when cutting with the cutting blade 43 , cutting water is supplied to the cutting blade 43 from the cutting water supply nozzles 461 and 462 . When the semiconductor wafer 11 is cut along the cutting line in this way, the semiconductor wafer 11 is divided into individual semiconductor chips. The divided semiconductor chips are not scattered due to the action of the adhesive tape 13, and the state of the semiconductor wafer 11 supported on the frame 12 can be maintained. Like this, after the cutting of the semiconductor wafer 11 is finished, the chuck table 3 holding the semiconductor wafer 11 returns to the position where the semiconductor wafer 11 is sucked and held at first, and the suction action of the suction device not shown is interrupted, and the suction holding of the semiconductor wafer 11 is released. . Then, the semiconductor wafer 11 is transported by the washing transport unit 19 to the washing unit 18, where it is washed and dried. The thus washed and dried semiconductor wafer 11 is carried out of the workpiece placement area 15 by the workpiece conveyance device 17 . Then, the semiconductor wafer 11 is accommodated in a predetermined position of the box 14 by the workpiece carrying-out device 16 .

In the cutting of the semiconductor wafer 11 with the above-mentioned cutting blade 43, if damage occurs on the cutting edge 432, or the wear amount of the cutting edge 432 exceeds a predetermined limit value, damage and damage will occur on the cut surface of the cut semiconductor chip. Due to cracks, there is a problem of lowering the quality of semiconductor chips. Therefore, the cutting device in the illustrated embodiment has a cutting tip monitoring device that monitors the state of breakage and wear of the cutting edge 432 of the cutting tip 43 . The cutting blade monitoring device will be described below with reference to FIG. 3 .

The cutting blade monitoring device 5 shown in FIG. 3 includes: a magnetic sensor 51 (MS) disposed opposite to the outer periphery of the cutting edge 432 of the cutting blade 43; The control unit 52 of the state of the cutting edge 432; the magnetic sensor 51 (MS) in the embodiment shown in FIG. The top and the outer peripheral surface are arranged facing each other. In addition, the magnetic sensor 51 (MS) may be arranged on one side in the axial direction of the cutting edge 432 to face the peripheral side as shown in FIG. 4 . The magnetic sensor 51 (MS) outputs a voltage signal corresponding to the magnetic force generated between the cutting edges 432 of the magnetic body.

The control unit 52 is constituted by a microcomputer, and includes: a central processing unit (CPU) 521 for calculating and processing according to a control program, a read-only memory (ROM) 522 for storing control programs, etc., a readable random access memory 523 for storing calculation results, And input interface 524 and output interface 525. The detection signal from the magnetic sensor 51 (MS) and the detection signal from the rotation angle detection unit (RE) for detecting the rotation angle of the cutting blade 43 are input to the input interface 524 of the control unit 52 configured in this way. In addition, the rotation angle detection unit 53 (RE) can use, for example, a signal from a rotary encoder incorporated in a servo motor (not shown) that rotates the rotation shaft 42 of the spindle portion 4 on which the cutting insert is mounted. The output interface 525 of the control unit 52 outputs the judgment result to the above-mentioned display device 7 (DSP).

The cutting insert monitoring device 5 in the illustrated embodiment is configured as described above, and its processing operation will be described below.

FIG. 5 is a block diagram of a procedure for monitoring and controlling the wear of the cutting edge 432 of the cutting insert 43 in the control unit 52 constituting the cutting insert monitoring device 5 . This program is repeatedly executed every predetermined cycle.

The wear monitoring control will be described based on the program block diagram shown in FIG. The detected voltage value ( V0 ) detected by 51 (MS) is temporarily stored in a read random access memory (RAM) 523 . The detection voltage value (V0) detected by the magnetic sensor 51 (MS) is associated with the rotation angle signal (ω) of the cutting insert 43, and input to the control unit 52 as shown in FIG. 6 . In addition, the detection voltage value ( V0 ) of the input signal is read at least for one revolution of the cutting blade 43 . The magnetic sensor 51 (MS) outputs a low voltage value when the magnetic force generated between the magnetic sensor 51 (MS) and the cutting edge 432 is large, and outputs a high voltage value when the magnetic force generated between the magnetic sensor 51 (MS) and the cutting edge 432 is small. That is, the magnetic sensor 51 (MS) outputs a low voltage value when the cutting edge 432 of the cutting insert 43 is not worn, and outputs a high voltage value as the cutting edge 432 is worn.

Then, proceeding to step S2, the control unit 52 calculates the average value (VA) of the voltage values (V0) detected by the magnetic sensor 51 (MS). The average value (VA) of the detected voltage values (V0) is indicated by a dotted line in FIG. 7 . Next, proceeding to step S3, the control unit 52 judges whether the above-mentioned average value (VA) exceeds the wear limit value (V1) indicated by the two-dot chain line in FIG. 7 . In addition, this wear limit value (V1) is set according to the type of each cutting insert, and is stored in the read-only memory 522 (ROM) in advance. In step S3, if the above-mentioned average value (VA) does not exceed the wear limit value (V1), the control unit 52 determines that the cutting insert 43 can be used, and terminates this routine. In step S3, when the above-mentioned average value (VA) exceeds the occasion of the wear limit value (V1), the control unit 52 judges that the cutting blade 43 must be replaced, enters step S4, and outputs the wear limit signal to the above-mentioned display device 7 (DSP) on, inform the operator.

FIG. 8 is a block diagram showing a procedure for monitoring and controlling the breakage of the cutting edge 432 of the cutting insert 43 in the control unit 52 constituting the cutting insert monitoring device 5 .

In the breakage monitoring control, the control unit 52 also compares the rotation angle signal (ω) of the cutting blade 43 detected by the above-mentioned rotation angle detection unit 53 (RE) and The detection voltage value ( V0 ) detected by the above magnetic sensor 51 (MS) is temporarily stored in a read random access memory (RAM) 523 . Thus, the detection voltage value (V0) of the magnetic sensor 51 (MS) temporarily stored in the random access memory (RAM) 523 can be utilized by the control of both the wear monitoring control and the damage monitoring control. At this time, when the cutting edge 432 of the cutting insert 43 has a damage C as shown in FIG. As shown, the peak voltage value (Vmax) is formed at the rotation angle position where the damage C exists.

Then, proceeding to step P2, the control unit 52 calculates the average value (VA) of the voltage values (V0) detected by the magnetic sensor 51 (MS). This average value (VA) is shown by the dotted line in Fig. 9(b). Then, enter step P3, control unit 52 determines whether the above-mentioned peak voltage value (Vmax) exceeds the value (VB) of the above-mentioned average value (VA) and the predetermined limit value (VT) (in Fig. 9 (b) with one point A dashed line indicates) (Vmax>(VA+VT)). In addition, the threshold value (VT) is set according to the type of each cutting insert, and may be stored in the read-only memory 522 (ROM) in advance. In step P3, if the peak voltage value (Vmax) does not exceed the value (VB) that is the sum of the average value (VA) and the prescribed limit value (VT), the control unit 52 determines that there is no large peak voltage value, and there is no A breakage occurred and the program was terminated. In step P3, when the peak voltage value (Vmax) exceeds the value (VB) that is the sum of the average value (VA) and the predetermined limit value (VT), the control unit 52 determines that a voltage has occurred on the cutting edge 432 of the cutting insert 43 If it is damaged and must be replaced, go to step S4, and output a damage occurrence signal to the above-mentioned display device 7 (DSP) to inform the operator.

In addition, in the above-mentioned embodiment, it is shown that the average value (VA) of the detection voltage value (V0) from the magnetic sensor 51 (MS) is obtained, and when the average value (VA) exceeds the predetermined limit value (VT ) is determined as an example of the occurrence of damage, but it is also possible to determine the occurrence of damage when the average value (VA) of the detected voltage values (V0) is not obtained. That is, the peak voltage value (Vmax) of the detected voltage value (V0) may be differentiated with time or a predetermined rotation angle, and when the differential value exceeds a predetermined limit value, it may be determined that damage has occurred.

As the blade detecting means for detecting the state of the cutting edge 432 of the cutting blade 43, the cutting blade monitoring device 5 in the above-mentioned illustrated embodiment uses a magnetic sensor 51, so it can accurately detect The state of the cutting edge 432. Accordingly, the wear limit of the cutting edge 432 and the occurrence of breakage can be accurately determined.

Next, monitoring control of a so-called notch insert in which a plurality of notches 432a are provided on the outer periphery of the cutting edge 432 of the cutting insert 43 as shown in FIG. 10(a) will be described.

For wear monitoring control, the program block diagram shown in Fig. 5 above can be used. Next, the so-called notch blade wear monitoring control will be described with reference to FIGS. 5 and 10 .

That is, in step S1, the control unit 52 temporarily converts the rotation angle signal (ω) of the cutting insert 43 detected by the above-mentioned rotation angle detection unit 53 (RE) and the detected voltage value (V0) detected by the above-mentioned magnetic sensor 51 (MS) to Stored in read random access memory (RAM) 523. At this time, since a plurality of notches 432a are provided on the outer periphery of the cutting edge 432 of the cutting insert 43, the detected voltage value (V0) from the magnetic sensor 51 (MS) becomes pulse-like. That is, a high value is formed at the turning angle corresponding to the notch 432a.

Then, it progresses to step S2, and the control unit 52 calculates the average value (VA) of the detection voltage value (V0) from the magnetic sensor 51 (MS). The average value (VA) of the detected voltage values (V0) is indicated by a dotted line in FIG. 10(b). Next, it goes to step S3, and the control unit 52 judges whether the said average value (VA) exceeds the wear limit value (V1) shown by the two-dot chain line in FIG.10(b). In step S3, if the above-mentioned average value (VA) does not exceed the wear limit value (V1), the control unit 52 determines that the cutting insert 43 can be used, and terminates this routine. In step S3, when the above-mentioned average value (VA) exceeds the occasion of the wear limit value (V1), the control unit 52 judges that the cutting blade 43 must be replaced, enters step S4, and outputs the wear limit signal to the above-mentioned display device 7 (DSP) on, inform the operator.

In addition, in the above-mentioned embodiment, an example was shown in which the processing is performed based on the pulse-shaped detection voltage value (V0) corresponding to the notch 432a formed on the outer periphery of the cutting edge 432 of the cutting insert 43, but the The position of the rotation angle forming the notch 432a is stored in the read-only memory (ROM) 522 in advance, the information of the voltage value corresponding to the rotation angle position is ignored (masking operation), and the position other than the rotation angle position corresponding to the notch 432a is used. The detection voltage value (V0) corresponding to the rotation angle position is processed, whereby processing can be performed based on a substantially flat detection voltage value.

Next, the breakage monitoring control of the notch blade will be described.

For damage monitoring control, the program block diagram shown in FIG. 8 above can also be used. 8 and 11, the breakage monitoring control of the so-called notch insert in which a plurality of notches 432a are provided on the outer periphery of the cutting edge 432 of the cutting insert 43 as shown in FIG. 11(a) will be described.

That is, in step P1, the control unit 52 temporarily converts the rotation angle signal (ω) of the cutting insert 43 detected by the above-mentioned rotation angle detection unit 53 (RE) and the detected voltage value (V0) detected by the above-mentioned magnetic sensor 51 (MS) to Stored in read random access memory (RAM) 523. At this time, since a plurality of notches 432a are provided on the outer periphery of the cutting edge 432 of the cutting insert 43, the voltage value (V0) detected by the magnetic sensor 51 (MS) is shown by the solid line in FIG. 11(b). pulse-like. That is, a high value is formed at the turning angle corresponding to the notch 432a. In addition, the voltage value corresponding to the rotation angle position formed by the notch 432a is set according to the type of each cutting insert, and may be stored in the read-only memory 522 (ROM) in advance. Therefore, each peak value and rotation angle position of the pulse-shaped input voltage ( V0 ) indicated by a solid line in FIG. Then, as shown in FIG. 11(a), when there is a breakage C on the cutting edge 432 of the cutting insert 43, as shown by the solid line in FIG. At the rotation angle position of damage C, a peak voltage value (Vmax) will occur.

Next, proceeding to step P2, the control unit 52 calculates the average value (VA) of the voltage signal (V0) from the magnetic sensor 51 (MS). The average value (VA) is indicated by the dotted line in Fig. 11(b). Next, proceeding to step P3, the control unit 52 judges whether the above-mentioned peak voltage value (Vmax) other than the rotation angle corresponding to the notch 432a exceeds the value (VB) obtained by adding the above-mentioned average value (VA) and a predetermined limit value (VT). (indicated by a one-dot chain line in Fig. 11(b)) (Vmax>VA+VT). In addition, the threshold value (VT) is set according to the type of each cutting insert, and may be stored in the read-only memory 522 (ROM) in advance. In step P3, if the peak voltage value (Vmax) does not exceed the value (VB) that is the sum of the average value (VA) and the prescribed limit value (VT), the control unit 52 determines that there is no large peak voltage value, and there is no A breakage occurred and the program was terminated. In step P3, when the peak voltage value (Vmax) exceeds the value (VB) that is the sum of the average value (VA) and the predetermined limit value (VT), the control unit 52 determines that a voltage has occurred on the cutting edge 432 of the cutting insert 43 If it is damaged and needs to be replaced, go to step S4 and output a damage occurrence signal to the above-mentioned display device 7 (DSP).

In addition, in the above-mentioned embodiment, it is shown that the average value (VA) of the detection voltage value (V0) from the magnetic sensor 51 (MS) and the above-mentioned peak voltage value other than the rotation angle position corresponding to the notch 432a are obtained. (Vmax) exceeds the value (VB) which is the sum of the average value (VA) and the specified limit value (VT) and it is judged as an example of damage, but the average value (VA) of the detection voltage value (V0) is not calculated ) can also determine the occurrence of damage. That is, it is also possible to ignore the information of the voltage value corresponding to the rotation angle position formed by the notch 432a (masking operation), and use time or a predetermined rotation angle to detect voltage values (V0) other than the rotation angle position corresponding to the notch 432a. When the differential value of the peak voltage (Vmax) exceeds the specified limit value, it is determined that damage has occurred. In addition, when the peak voltage value of the detection voltage value from the magnetic sensor 51 (MS) exceeds the voltage value corresponding to the rotation angle position formed by the notch 432a stored in the read-only memory (ROM) 522 in advance, It was determined that damage occurred. According to such determination, even when the notch 432a is notched deeper, it is possible to detect the breakage occurring on the cutting edge 432 .

An embodiment of the arrangement of the above-mentioned magnetic sensor 51 (MS) with respect to a so-called multi-blade arrangement in which a plurality of cutting blades are arranged in the axial direction will be described below with reference to FIGS. 12 and 3 .

In the embodiment shown in FIG. 12 , the magnetic sensors 51 (MS) are arranged on the radially outer sides of the cutting edges 432 of the plurality of cutting inserts 43 arranged in the axial direction to face the outer peripheral surface, respectively. Also, when the intervals between the cutting inserts 43 are small, it is preferable to arrange the magnetic sensors 51 (MS) in a zigzag shape as shown in FIG. 12 in order to avoid the influence of adjacent magnetic sensors 51 (MS). In the embodiment shown in this way, since the magnetic sensor 51 (MS) is used as the blade detection means for detecting the state of the cutting edge 432 of the cutting blade 43, it is also possible to use a so-called multi-blade that arranges a plurality of cutting blades in the axial direction. Be applicable.

In the embodiment shown in Fig. 13, when the outer shape or width of the magnetic sensor 51 (MS) is large, the magnetic sensor 51 (MS) can also be connected to the outer peripheral surface on the radially outer sides of the two wide cutting edges 432, respectively. On the other hand, the state of the two cutting edges 432 is detected.

According to the present invention, the cutting blade monitoring device of the cutting device is constructed as described above, and the magnetic sensor is used as the blade detection means for detecting the state of the cutting edge of the cutting blade. change, so the state of the cutting edge can be detected correctly. Therefore, it is possible to accurately determine the wear limit of the cutting edge and the occurrence of breakage.

Claims (17)

1. the cutting tip monitoring arrangement of topping machanism is characterized in that, this topping machanism possesses: the machined object holding unit of maintenance machined object and cutting are by the cutting unit of the machined object of this machined object holding unit maintenance; This cutting unit possesses: gyroaxis and be contained on this gyroaxis and have cutting tip by the fixed abrasive cutting edge of magnetic material;

The cutting tip monitoring arrangement of this topping machanism possesses:

The magnetic sensor that sets with the periphery subtend of this cutting edge of this cutting tip and

According to the control module of judging the state of this cutting edge from the detection signal of this magnetic sensor.

2. the cutting tip monitoring arrangement of topping machanism according to claim 1, it is characterized in that, this magnetic sensor will and this cutting edge between the magnetic force that takes place be transformed into magnitude of voltage and output, this control module is judged the state of this cutting edge according to the variation of the detection magnitude of voltage that is detected by this magnetic sensor.

3. the cutting tip monitoring arrangement of topping machanism according to claim 2, it is characterized in that, this control module is obtained the mean value of the detection magnitude of voltage that is detected by this magnetic sensor, in the occasion of this mean value above the wear mark value of regulation, is judged to be this cutting edge and reaches wear mark.

4. the cutting tip monitoring arrangement of topping machanism according to claim 2 is characterized in that, this control module surpasses the occasion of the boundary value of regulation at the peak magnitude of voltage of the detection magnitude of voltage that is detected by this magnetic sensor, is judged to be this cutting edge and takes place damaged.

5. the cutting tip monitoring arrangement of topping machanism according to claim 2, it is characterized in that, this control module is obtained the mean value of the detection magnitude of voltage that is detected by this magnetic sensor, detect the occasion of peak magnitude of voltage of magnitude of voltage at this, be judged to be this cutting edge and take place damaged above the value of the boundary value addition of this mean value and regulation.

6. the cutting tip monitoring arrangement of topping machanism according to claim 1 is characterized in that

Also possess:

Detect this cutting tip the angle of revolution the angle of revolution detecting unit and according to the control module of judging the state of this cutting edge from the detection signal of this angle of revolution detecting unit.

7. the cutting tip monitoring arrangement of topping machanism according to claim 6, it is characterized in that, this magnetic sensor will and this cutting edge between the magnetic force that takes place be transformed into magnitude of voltage and output, this control module is judged the state of this cutting edge according to the variation of the detection magnitude of voltage that is detected by this magnetic sensor.

8. the cutting tip monitoring arrangement of topping machanism according to claim 7, it is characterized in that, this control module is obtained the mean value that this cutting tip returns the detection magnitude of voltage that is detected by this magnetic sensor when circling, in the occasion of this mean value, be judged to be this cutting edge and reach wear mark above the wear mark value of regulation.

9. the cutting tip monitoring arrangement of topping machanism according to claim 7, it is characterized in that, the peak magnitude of voltage that this control module returns the detection magnitude of voltage that is detected by this magnetic sensor when circling at this cutting tip surpasses the occasion of the boundary value of regulation, is judged to be this cutting edge and takes place damaged.

10. the cutting tip monitoring arrangement of topping machanism according to claim 7, it is characterized in that, this control module is obtained the mean value that this cutting tip returns the detection magnitude of voltage that is detected by this magnetic sensor when circling, detect the occasion of peak magnitude of voltage of magnitude of voltage at this, be judged to be this cutting edge and take place damaged above the value of the boundary value addition of this mean value and regulation.

11. the cutting tip monitoring arrangement of topping machanism, this topping machanism possesses: the machined object holding unit of maintenance machined object and cutting are by the cutting unit of the machined object of this machined object holding unit maintenance; This cutting unit possesses: gyroaxis and be installed on this gyroaxis and have by the fixed abrasive cutting edge of magnetic material and form the cutting tip of a plurality of notches on this cutting edge;

The cutting tip monitoring arrangement of this topping machanism possesses:

The magnetic sensor that sets with the periphery subtend of this cutting edge of this cutting tip,

Detect this cutting tip the angle of revolution the angle of revolution detecting unit and

Possess the memory of the position, angle of revolution of storing this cutting tip that forms these a plurality of notches, basis is judged the state of this cutting edge from the detection signal of this magnetic sensor and angle of revolution detecting unit control module.

12. the cutting tip monitoring arrangement of topping machanism according to claim 11, it is characterized in that, this magnetic sensor will and this cutting edge between the magnetic force that takes place be transformed into magnitude of voltage and output, this control module is obtained the mean value that this cutting tip returns the detection magnitude of voltage that is detected by this magnetic sensor when circling, in the position, angle of revolution beyond the position, angle of revolution corresponding with these a plurality of notches this detects the occasion of the peak magnitude of voltage of magnitude of voltage above the value of the boundary value addition of this mean value and regulation, is judged to be this cutting edge and takes place damaged.

13. the cutting tip monitoring arrangement of topping machanism according to claim 11, it is characterized in that, this magnetic sensor will and this cutting edge between the magnetic force that takes place be transformed into magnitude of voltage and output, position, the angle of revolution corresponding voltage value of this memory stores and these a plurality of notches, the peak magnitude of voltage of the detection magnitude of voltage that this control module is detected by this magnetic sensor during 1 week in the revolution of this cutting tip surpasses the occasion of that store and position, angle of revolution these a plurality of notches corresponding voltage value in this memory, is judged to be this cutting edge and takes place damaged.

14. the cutting tip monitoring arrangement of topping machanism according to claim 12, it is characterized in that, this magnetic sensor will and above-mentioned cutting edge between the magnetic force that produces be transformed into magnitude of voltage and output, this control module surpasses the occasion of the boundary value of regulation at the peak magnitude of voltage of this cutting tip revolution locational detection magnitude of voltage that is detected by this magnetic sensor in the angle of revolution beyond the position, angle of revolution corresponding with this a plurality of notches during 1 week, is judged to be this cutting edge generation breakage.

15. the cutting tip monitoring arrangement according to each described topping machanism of claim 1～14 is characterized in that, sets this magnetic sensor in the outside radially and the outer peripheral face subtend of this cutting edge of this cutting tip.

16. the cutting tip monitoring arrangement of topping machanism according to claim 15 is characterized in that, is axially setting a plurality of these cutting tips, sets this magnetic sensor respectively with this cutting edge subtends of this a plurality of these cutting tips.

17. the cutting tip monitoring arrangement of topping machanism according to claim 16 is characterized in that, this magnetic sensor indentation configuration that sets respectively with this cutting edge subtends of this a plurality of these cutting tips.

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