CN1294628C - Quick draining washing tank - Google Patents

Abstract

A rapid draining and cleaning tank at least comprises a tank body and a guide plate. Wherein, the bottom of the tank body at least comprises a drain hole, and the guide plate is fixed in the tank body above the drain hole. The flow guiding plate can be used to change the flow field in the tank from large jet to small jet, so as to eliminate the wafer sticking effect.

Description

Quick Drain Cleaning Tank

technical field

The present invention relates to a Quick Dump Rinse Tank (QDR Tank), and in particular to a Quick Dump Rinse Tank with a Flow Regulator Plate, which can eliminate the Wafer sticking effect (Sticking Effect).

Background technique

In the semiconductor manufacturing process, the cleanliness of the wafer has a great influence on the yield of manufacturing. In view of this, it is usually necessary to carry out another wafer cleaning step before each semiconductor process and after the process is completed, so as to remove material particles and chemical residues attached to the wafer.

At present, in the procedure of wafer cleaning, the rapid drain cleaning method is a quite common wafer cleaning method. The so-called quick drain cleaning method is to completely immerse the wafer on the wafer stand (Wafer Stand) in the deionized water in the quick drain cleaning tank, and then quickly drain the deionized water in the quick drain cleaning tank. At the same time, spray deionized water on the wafer on the wafer holder to rinse the wafer. Usually, on a multi-bath wet bench (Wet Bench), after the wafer is in each chemical bath process, it is usually followed by a quick drain cleaning tank step to remove the stains from the previous process. Process particles and chemical residues attached to the wafer.

Please refer to Fig. 1, Fig. 1 is the schematic cross-sectional view of the existing rapid drainage cleaning tank. The wafer 106, the wafer 106a, and the wafer 106b are first placed on the slots of the wafer holder 101 by the transfer of the robot arm, wherein the wafer holder 101 has been set in the quick drainage cleaning tank 100 first, and then Deionized water has been housed in the quick drain cleaning tank 100 . In the quick drain cleaning tank 100 , a wafer seat 101 has an area 108 and an area 110 , and each of the area 108 and the area 110 can hold a batch of wafers. The bottom central part of the tank body 102 of the quick drainage cleaning tank 100 has a drainage hole 104 . When the cleaning liquid in the quick drain cleaning tank 100 is discharged from the drain hole 104 , the flow rate of the cleaning liquid near the drain hole 104 is greater than that in other areas in the quick drain cleaning tank 100 . For example, the flow rate of the cleaning liquid between the wafers 106 a and 106 b located above the drain hole 104 is greater than the flow rate of the cleaning liquid between the wafers 106 farther away from the drain hole 104 . According to Bernoulli's Law, the greater the flow rate, the lower the pressure. Therefore, the pressure in the area between wafer 106a and wafer 106b is lower than the pressure in the area between wafers 106 . In this way, the pressure difference between the left and right sides of the wafer 106a and the wafer 106b will not only cause the vibration of the wafer 106a and the wafer 106b itself, but also push the wafer 106a and the wafer 106b closer to each other, and even make the wafer The circle 106a is glued to the upper side of the wafer 106b. In addition, when the wafer holder 101 is not full of wafers or only a batch of wafers are placed in the wafer holder 101 (for example, only placed in the area 108), not only the wafer sticking effect is more significant, but each wafer There will also be a pressure difference between the left and right sides of the circle 106, and the pressure difference on both sides of the wafer 106 will also cause the wafer to vibrate. Therefore, when the wafer holder 101 is not filled with wafers or only a batch of wafers are placed on the wafer holder 101 , the above-mentioned wafer sticking effect and wafer vibration phenomenon do not only occur above the drainage holes 104 .

Contents of the invention

The object of the present invention is to provide a fast drainage cleaning tank for cleaning wafers. The rapid drainage cleaning tank of the present invention has a deflector, and the deflector is arranged above the drainage hole at the bottom of the tank body, so the large jet flow field in the tank body can be transformed into several small jet flow fields.

Another object of the present invention is to provide a rapid drainage cleaning tank with deflectors, which can change the flow field of drainage and transform the discharge jet flow field into a uniform flow field. Therefore, not only the wafer vibration phenomenon can be improved, but also the wafer sticking effect can be effectively eliminated.

Another object of the present invention is to provide a rapid drainage cleaning tank, which can divert the fluid from the tank body to the drain hole, so as to make the drainage more smooth. Therefore, the drainage speed can be accelerated.

According to the above-mentioned purpose of the present invention, a kind of rapid drainage cleaning tank is proposed, which can be used to clean wafers. The rapid drainage cleaning tank at least includes: a tank body, wherein the tank body includes a drainage hole located at a bottom of the tank body; and a The deflector is fixed on the tank body above the drainage hole, so that a discharge jet flow field of the tank body can be transformed into a uniform flow field.

According to a preferred embodiment of the present invention, the above-mentioned deflector plate at least includes: a splitter plate, wherein the splitter plate includes at least a plurality of splitter holes; a plurality of connecting parts are respectively fixed on both sides of the splitter plate, and these The connection portion protrudes from the bottom of the distribution plate; a plurality of slide rails, wherein these slide rails are engaged with the above connection portion and are fixed below the two sides of the distribution plate that are engaged with the connection portion, and between these slide rails and the bottom of the distribution plate A movable space is formed between them; a plurality of telescopic parts are respectively located at both ends of the above-mentioned slide rail, and these telescopic parts can move in the movable space formed between the slide rail and the bottom of the diverter plate, and the guide can be adjusted according to the length of the tank body. the length of the flow plate, so that the flow guide plate can be fixed on the tank body; and a plurality of adjustment elements, used to fix the telescoping part that completes the length adjustment between the flow distribution plate and the slide rail. Wherein, the above-mentioned splitter plate also includes a shielding portion, and when the deflector plate is fixed in the tank, the shielding portion is preferably located directly above the drain hole.

Because, the diversion hole of the deflector can divert the flushing fluid in the tank body to the drain hole first, and most of the drain holes are also covered by the shielding part of the diverter plate. In this way, the large jet flow field of drainage can be transformed into several small jet flow fields, so that the flow field in the rapid drainage cleaning tank is more uniform. Therefore, not only can the sticking effect of the wafer be effectively eliminated, the vibration phenomenon of the wafer can be improved, but also the drainage can be made smoother, thereby increasing the drainage speed.

Description of drawings

Figure 1 is a schematic cross-sectional view of an existing rapid drainage cleaning tank.

Fig. 2 is a perspective view of a deflector of a quick drainage cleaning tank according to a preferred embodiment of the present invention.

Fig. 3 is a top view of a quick drainage cleaning tank according to a preferred embodiment of the present invention.

Fig. 4 is a cross-sectional view of a quick drainage cleaning tank according to a preferred embodiment of the present invention.

[Brief description of component representative symbols]

100: Quick drain cleaning tank

101: wafer seat

102: tank body

104: drainage hole

106: Wafer

106a: Wafer

106b: Wafer

108: Area

110: area

200: deflector

202: Splitter board

204: Split hole

206: Connecting part

208: slide rail

210: telescopic part

212: Adjustment element

214: Covering Department

216: Interval

300: tank body

301: wafer seat

302: drain hole

304: Wafer

306: Rapid drain cleaning tank

308: Area

310: area

Detailed ways

The invention discloses a fast drainage cleaning tank, which has a deflector. The deflector is arranged in the tank body above the drain hole of the quick drainage cleaning tank, which can change the discharge flow field from a large jet to several small jets, so that the discharge flow field of the quick drainage cleaning tank is more uniform. Therefore, the sticking effect of the wafer can be eliminated, the vibration problem of the wafer can be improved, and the drainage rate can be accelerated. In order to make the description of the present invention more detailed and complete, reference may be made to the following description and the diagrams in FIG. 2 to FIG. 4 .

When the fast drain cleaning tank discharges the cleaning liquid, due to the high flow rate at the drain hole of the fast drain cleaning tank, a pressure difference occurs between the left and right sides of the wafer, which causes the wafer sticking effect and wafer vibration. The wafer sticking effect will make the parts of the wafers that stick together cannot be cleaned effectively. As a result, the cleanliness of the wafer will be reduced. Therefore, the present invention provides a quick drainage cleaning tank with a deflector, which can eliminate the wafer sticking effect and improve the wafer vibration problem.

Please refer to Fig. 2, Fig. 2 is a perspective view of a deflector of a quick drainage cleaning tank according to a preferred embodiment of the present invention, and please refer to Fig. 3, Fig. 3 is a diagram according to a preferred embodiment of the present invention A top view of a quick drainage cleaning tank. The deflector 200 at least includes a splitter 202 , a plurality of connecting parts 206 , a plurality of slide rails 208 , and a plurality of telescopic parts 210 . Wherein, the splitter plate 202 can be a single-piece structure, or can be a multi-piece combined structure, so that the flow guide plate 200 can be arranged in the tank body 300 of the quick drainage cleaning tank 306 . Wherein, the quick drainage cleaning tank 306 can be, for example, a quick drainage cleaning tank of a wet machine provided by KAIJO Company. The diverter plate 202 at least includes a plurality of diverter holes 204 and a shielding portion 214, wherein the diverter holes 204 can allow liquid to flow through, and the shielding portion 214 can be used to shield the drain hole 302 at the bottom of the tank body 300 of the quick drainage cleaning tank 306 ,As shown in Figure 3.

The connecting portion 206 is fixedly connected to two sides of the distribution plate 202 and extends downward to protrude from the bottom of the distribution plate 202 . The two slide rails 208 are respectively engaged on the connecting portion 206, and the two slide rails 208 are located below the bottoms on both sides of the distributor plate 202, and there is a gap 216 between each slide rail 208 and the bottom of the distributor plate 202, and Create an activity space. Four telescopic parts 210 are respectively located at both ends of each slide rail 208, and can move in the gap 216 between the slide rail 208 and the bottom of the diverter plate 202, wherein the cross-sectional structure of the telescopic part 210 is preferably a sleeve structure, and Can be sleeved on both ends of each slide rail 208 . However, the cross-sectional structure of the telescopic part 210 can also be other feasible structures, such as L-shaped structure or ㄇ-shaped structure, which can make the telescopic part 210 slide in the gap 216 between the slide rail 208 and the bottom of the distribution plate 202, The present invention is not limited thereto.

The deflector 200 also includes at least a plurality of adjustment elements 212 , wherein the adjustment elements 212 can be elements such as screws that can be used to adjust the tightness of the joints between items. The adjustment element 212 can only be connected to the diverter plate 202 and the telescopic part 210 , or can be connected to the diverter plate 202 , the telescopic part 210 , and the slide rail 208 . When the adjustment element 212 loosens the connection between the splitter plate 202 and the telescopic portion, the telescopic portion 210 can move in the gap 216 between the slide rail 208 and the bottom of the splitter plate 202 to adjust the length of the deflector 200 . After the length adjustment of the deflector 200 is completed, the telescopic part 210 can be fixed on the diverter plate 202 or fixed on the diverter plate 202 and the slide rail 208 by using the adjustment element 212 . Among them, the materials of the diverter plate 202, the connecting portion 206, the slide rail 208, the telescopic portion 210, and the adjustment element 212 of the deflector 200 are preferably high hardness, high temperature resistance, acid and alkali resistance, and antistatic materials. For example polyether ether ketone (Polyetheretherkefone; PEEK).

When the deflector 200 is arranged in the tank body 300 of the quick drainage cleaning tank 306, according to the length inside the tank body 300 of the quick drainage cleaning tank 306 and the position of the drainage hole 302, the telescopic part 210 is adjusted to protrude from the splitter plate 202 length, so that the length of the deflector 200 is approximately equal to the length inside the tank body 300 of the quick drainage cleaning tank 306, so that the deflector 200 is stuck in the tank body 300 of the quick drainage cleaning tank 306, and the diverter plate The shielding portion 214 of 202 is located above the drain hole 302, as shown in FIG. 3 . When the deflector 200 is arranged in the tank body 300 of the quick drainage cleaning tank 306, the original structure of the quick drainage cleaning tank 306 does not need to be changed, and the installation is quite easy.

Please refer to FIG. 4 . FIG. 4 is a cross-sectional view of a quick drainage cleaning tank according to a preferred embodiment of the present invention. The wafer holder 301 is located in the tank body 300 of the quick drainage cleaning tank 306 , the wafer 304 is placed on the slot of the wafer holder 301 by the transfer of the robot arm, and the wafer 304 is located above the deflector 200 . The wafer seat 301 may at least include two parts, an area 308 and an area 310 , and each of the area 308 and the area 310 may be used to place a batch of wafers. The shielding portion 214 of the deflector 200 is located directly above the drain hole 302 of the quick drain cleaning tank 306 to prevent the cleaning fluid in the tank body 300 from being directly and quickly discharged from the drain hole 302 . The diversion hole 204 in the diversion plate 202 of the deflector 200 can divert the cleaning fluid to be discharged first, and then merge between the deflector 200 and the bottom of the tank body 300 to be discharged through the drain hole 302 .

Since the diverter plate 202 of the deflector 200 can convert the large jet flow field of the cleaning fluid in the tank body 300 into several small jet flow fields, the flow field distribution in the tank body 300 can be made more uniform, and Transform the discharge jet flow field into a uniform flow field. In this way, the pressure difference between the left and right sides of each wafer 304 can be effectively reduced.

It can be seen from the above preferred embodiments of the present invention that one advantage of the present invention is that the rapid drainage cleaning tank of the present invention has a deflector arranged above the drain hole at the bottom of the tank body. Therefore, the discharge flow field in the tank can be changed from a large jet flow field to a small jet flow field, so that the discharge flow field in the tank body is more uniform.

It can be seen from the above-mentioned preferred embodiments of the present invention that another advantage of the present invention is that the discharge flow field in the tank can be divided into several smaller discharge flow fields, so that the flow field in the tank is more uniform and the flow rate of each piece is improved. The pressure difference problem between the left and right sides of the wafer. Therefore, not only the wafer vibration phenomenon can be improved, but also the wafer sticking effect can be effectively eliminated, thereby achieving the purpose of improving the wafer cleaning efficiency.

It can be seen from the above-mentioned preferred embodiments of the present invention that another advantage of the present invention is that the rapid drainage cleaning tank of the present invention can divert the fluid in the tank to the drain hole in advance. In this way, the drainage can be made smoother, and the purpose of increasing the drainage rate can be achieved.

Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (5)

1. A fast drainage cleaning tank, comprising at least: a tank, wherein the tank includes at least one drainage hole located at a bottom of the tank; and A deflector, fixed on the tank above the drainage hole, wherein the deflector at least includes: A splitter plate, wherein the splitter plate includes at least a plurality of splitter holes; A plurality of connection parts are respectively fixed on both sides of the distribution plate, and the plurality of connection parts protrude from a bottom of the distribution plate; A plurality of slide rails, wherein the plurality of slide rails are engaged with the plurality of connecting parts and fixed under the plurality of sides of the diverter plate, and a movable space is formed between the plurality of slide rails and the bottom of the diverter plate space; A plurality of telescopic parts are respectively located at both ends of the plurality of slide rails, and the plurality of telescopic parts can move in the activity space to adjust a length of the deflector; and A plurality of adjustment elements are used to fix the plurality of telescopic parts between the splitter plate and the plurality of slide rails. 2. The quick drainage cleaning tank according to claim 1, wherein the splitter plate further comprises at least one shielding portion, and the shielding portion is located above the drainage hole. 3. The quick drainage cleaning tank according to claim 1, wherein the length of the deflector is equal to the length of the inside of the tank, so that the deflector is fixed in the tank. 4. The quick drainage cleaning tank according to claim 1, wherein the plurality of adjustment elements are a plurality of screws. 5. The rapid drainage cleaning tank according to claim 1, wherein the deflector is made of polyether ether ketone.

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