[go: up one dir, main page]

CN1286175C - 大功率发光二极管发光装置 - Google Patents

大功率发光二极管发光装置 Download PDF

Info

Publication number
CN1286175C
CN1286175C CNB011353929A CN01135392A CN1286175C CN 1286175 C CN1286175 C CN 1286175C CN B011353929 A CNB011353929 A CN B011353929A CN 01135392 A CN01135392 A CN 01135392A CN 1286175 C CN1286175 C CN 1286175C
Authority
CN
China
Prior art keywords
light
emitting diode
light emitting
radiator
reflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011353929A
Other languages
English (en)
Other versions
CN1341966A (zh
Inventor
葛世潮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Manelux Lighting Co Ltd
Original Assignee
HANGZHOU FUYANG NOVEL ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU FUYANG NOVEL ELECTRONICS CO Ltd filed Critical HANGZHOU FUYANG NOVEL ELECTRONICS CO Ltd
Priority to CNB011353929A priority Critical patent/CN1286175C/zh
Publication of CN1341966A publication Critical patent/CN1341966A/zh
Application granted granted Critical
Publication of CN1286175C publication Critical patent/CN1286175C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种大功率发光二极管发光装置，包括有至少二个发光二极管芯片，它们被安装在至少一个反射体上，反射体被安装在一个基板和一个散热器上；一个透光容器，安装在反射体上方，透光容器内壁可有光转换材料，可将发光二极管芯片发出的光转变成所需色的光；至少一个驱动电路和一个电连接器，电连接器与外电源相连，其输出与发光二极管芯片相连，它可用于制造大功率、高效率发光二极管灯泡或平板式光源和显示器。

Description

大功率发光二极管发光装置
【技术领域】
本发明涉及一种大功率发光二极管照明和显示装置，用于照明和信息显示。
【背景技术】
现有的发光二极管如图1所示，均以1或2个芯片1安装在一个反射碗2内，芯片经连接线4和阳极引线3相连，并通过发光二极管芯片的引出线6外连，再用透光环氧树脂5密封为一基本单元，此种结构芯片散热难，芯片安装密度低，工作电流一般限于20mA以下，难于制成大功率的发光二极管器件。发光二极管是一种对温度很敏感的器件，输入功率增大时，芯片温度上升将导致发光效率明显下降。对于大功率发光二极管，如何改进散热，特别是在大电流和高芯片安装密度的情况下，散热更是一个关键问题。
【发明内容】
本发明的目的是要克服现有技术存在的不足，提供一种易散热的大功率发光二极管发光器件。
本发明采用的技术方案是：大功率发光二极管发光装置，它包括有安装在反射体上的发光二极管，所述的发光二极管芯片至少有二个，并安装在至少一个反射体上，反射体被安装在散热器上，反射体与散热器之间设置有导热胶，导热胶层内具有由玻璃珠构成的绝缘支柱。
所述的发光二极管芯片至少有二个，也可安装在至少一个反射体上，反射体被安装在散热基板上，散热基板安装在散热器上，基板与散热器之间设置有导热胶。
所述的安装有发光二极管芯片的发射体由导热金属制成，该发射体被安装在由导热绝缘材料制成的散热基板上，反射体、基板和散热器之间设置有导热胶。
所述的反射体上开有一反射碗，其深度大于反射碗口径的半径。
所述的发光二极管芯片和反射体上覆盖有光转换材料。
大功率发光二极管灯泡，发光二极管芯片前方有泡壳，该泡壳固定在散热器上，一个绝缘外壳用于连接散热器和下部灯头，灯头与外壳内有驱动器，其输入端经引线与灯头相连，其输出端经引线与发光二极管芯片相连。
所述的泡壳的内壁上有光转换材料，光转换材料上设有保护层。
所述的泡壳为一开口泡壳并设有反射层，基板和散热器上设有至少一个通孔。
大功率发光二极管显示单元，发光二极管芯片前方设有泡壳，该泡壳固定在散热器上，散热器安装在显示系统的基板上。
本发明具有易散热、效率高的优点，便于制成大功率的发光二极管灯和显示器。
【附图说明】
图1为现有的发光二极管的结构示意图。图2为本发明的大功率发光二极管发光装置的一个实施例的结构示意图。
图3为本发明的大功率发光二极管发光装置的又一个实施例的结构示意图。
图4为图3的等效电路图。
图5为图3的A-A剖面结构示意图。
图6为本发明的大功率发光二极管发光装置的又一个实施例的结构示意图。
图7为本发明的大功率发光二极管灯泡的一个实施例的结构示意图。
图8为本发明的大功率发光二极管灯泡的又一个实施例的结构示意图。
【具体实施方式】
下面结合附图对本发明作详细的介绍：
图2为本发明的大功率发光二极管发光装置的一个实施例结构示意图101。发光二极管芯片1固定在反射体7上，例如金属反射碗内，反射碗固定在基板8上。基板8与散热器9紧密接触，其间有导热胶10，用于导热。散热器9可为一平板或有多个槽的有利于散热的形状的板。芯片上有透光密封胶11，如环氧树脂。基板8由陶瓷、玻璃或电路板等高导热率材料制成。散热器由热导率高的材料如铝、银、铜或合金制成。为防止绝缘基板8因膨胀系数与散热器9不同而断裂，导热胶10可为软性胶。芯片1的排列可按需要串联、并联或串并联。绝缘基板8和散热器9可以是平面或曲面的。为避免透光密封胶11因热膨胀而断裂，所述透光密封胶11可分为若干小块。
图2所述结构，芯片1与散热器9之间热阻很小，可使芯片产生的热量很快散掉；同时芯片的安装密度很高，从而可制成大功率、高效率的发光二极管装置。
为确保发光二极管芯片中有个别损坏时器件仍能正常工作，可先将若干芯片并联后串联，如图3所示。图中的1a、1b、1c……和1A、1B、1C……为芯片，另图中所示有连接线4a、4b，导电反射基板12。所述芯片可安装在平面或曲面的反射体上。
图4为图3的等效电路图，其中1a、1b、1c……并联，1A、1B、1C……并联，若干阻并联的芯片串联。
图5为图3的A-A剖面示意图102，其中导电反射基板12和散热板9之间有薄绝缘导热层13，如云母、人造云母等。另有导热胶层10，芯片上有透光密封胶11。芯片和反射基板12上有光转换材料15，可将由芯片发出的光转变成所需色的光。
图5中导热胶层10内有绝缘支柱，如小玻璃珠，如图6中24所示。此时反射体可直接安装在散热器上，而不用绝缘导热层13。
为得到效率更高的出射光25，反射体上的反射碗12a可较深，其深度大于反射碗口径的半径，如图6所示。反射碗12a可设计成抛物面的形状。
图7为本发明的大功率发光二极管灯泡的一个实施例的结构示意图。其中的发光二极管发光装置可用图2、图5或图6的结构。散热器9被设计成与灯泡相似秉有利于散热的形状，如叶片、通孔等。芯片阵列1a、1b……上有一透光泡壳14，用玻璃或塑料制成，固定在散热器9上，其内壁上有光转换材料15，光转换材料15上有保护层16。图中有灯头17，绝缘外壳18有塑料或陶瓷制成，用于连接散热器与灯头。驱动电路19，其输入端经引线20与灯头17相连，其输出端经引线21与发光二极管芯片相连，当歪电源经灯头接通时，驱动其的输出即可点亮发光二极管芯片，使灯泡发光。
泡壳14内壁也可不用光转换材料，泡壳为透明或乳白色。
芯片可为同色或不同色发光体，以得到所需的光色。
图7所示的整灯的形状，可设计成其他几何形状，如球形，蘑菇形等。泡壳14也可以是开口的，其内壁上有反射层22，如图8所示。散热器9和基板12上有一通孔23，以使空气流通，增强散热效果。
图7与图8的装置也可用于制造显示单元，这时灯头17和外壳18不用，直接吧散热器9安装在显示系统基板上，散热器9也可以是显示系统基板本身。
本发明要求保护的范围不限于本文中介绍的各实施例，只要了解本发明内容，可以根据说明书做各种形式的变换和交换。

Claims (3)

1、大功率发光二极管发光装置，它包括有安装在反射体上的发光二极管，其特征在于所述的发光二极管芯片至少有二个，并安装在至少一个反射体上，反射体被安装在散热器上，反射体与散热器之间设置有导热胶，导热胶层内具有由玻璃珠构成的绝缘支柱。
2、如权利要求1所述的大功率发光二极管发光装置，其特征在于所述的反射体上开有一反射碗，其深度大于反射碗口径的半径。
3、如权利要求1所述的大功率发光二极管发光装置，其特征在于所述的发光二极管芯片和反射体上覆盖有光转换材料。
CNB011353929A 2001-09-29 2001-09-29 大功率发光二极管发光装置 Expired - Fee Related CN1286175C (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB011353929A CN1286175C (zh) 2001-09-29 2001-09-29 大功率发光二极管发光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB011353929A CN1286175C (zh) 2001-09-29 2001-09-29 大功率发光二极管发光装置

Publications (2)

Publication Number Publication Date
CN1341966A CN1341966A (zh) 2002-03-27
CN1286175C true CN1286175C (zh) 2006-11-22

Family

ID=4673138

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011353929A Expired - Fee Related CN1286175C (zh) 2001-09-29 2001-09-29 大功率发光二极管发光装置

Country Status (1)

Country Link
CN (1) CN1286175C (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100379034C (zh) * 2003-03-10 2008-04-02 高陆股份有限公司 高效散热的发光二极管模块
CN1601768A (zh) * 2003-09-22 2005-03-30 福建省苍乐电子企业有限公司 一种发光二极管结构
US6942360B2 (en) * 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
WO2005067064A1 (fr) * 2003-11-25 2005-07-21 Shichao Ge Del et lampe a del
US6966674B2 (en) * 2004-02-17 2005-11-22 Au Optronics Corp. Backlight module and heat dissipation structure thereof
WO2011143510A1 (en) 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
JP2006114854A (ja) * 2004-10-18 2006-04-27 Sharp Corp 半導体発光装置、液晶表示装置用のバックライト装置
CN1848463A (zh) * 2005-04-15 2006-10-18 南京汉德森科技股份有限公司 基于金属线路板的led白光光源
KR20080006634A (ko) * 2005-04-28 2008-01-16 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 리세스 내에 배치된 ｌｅｄ를 포함하는 광원
CN100409440C (zh) * 2005-08-08 2008-08-06 佰鸿工业股份有限公司 矩阵式发光二极管及其制造方法
KR100983836B1 (ko) 2005-09-20 2010-09-27 파나소닉 전공 주식회사 Ｌｅｄ조명 기구
CN100499119C (zh) * 2006-07-07 2009-06-10 启萌科技有限公司 发光二极管模组
CN100485925C (zh) * 2006-07-07 2009-05-06 启萌科技有限公司 发光二极管模组
CN100572908C (zh) * 2006-11-17 2009-12-23 富准精密工业(深圳)有限公司 发光二极管灯具
US8444299B2 (en) 2007-09-25 2013-05-21 Enertron, Inc. Dimmable LED bulb with heatsink having perforated ridges
US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
US11317495B2 (en) 2007-10-06 2022-04-26 Lynk Labs, Inc. LED circuits and assemblies
CN101216156A (zh) * 2007-12-30 2008-07-09 佛山市国星光电股份有限公司 应用于通用照明的led面光源
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
CN102032475A (zh) * 2009-08-23 2011-04-27 彭云滔 一种组合式大功率led灯
CN102437266B (zh) * 2010-09-29 2016-05-11 王树生 Led封装结构
CN101949502B (zh) * 2010-10-07 2012-02-08 苏州盟泰励宝光电有限公司 一种led反射灯具
CN101963315B (zh) * 2010-10-14 2016-01-20 友达光电股份有限公司 光源模块与液晶显示器
CN102299235A (zh) * 2011-06-13 2011-12-28 协鑫光电科技（张家港）有限公司 高发光效率的发光二极管
US20140239809A1 (en) 2011-08-18 2014-08-28 Lynk Labs, Inc. Devices and systems having ac led circuits and methods of driving the same
US9247597B2 (en) 2011-12-02 2016-01-26 Lynk Labs, Inc. Color temperature controlled and low THD LED lighting devices and systems and methods of driving the same
US11079077B2 (en) 2017-08-31 2021-08-03 Lynk Labs, Inc. LED lighting system and installation methods

Also Published As

Publication number Publication date
CN1341966A (zh) 2002-03-27

Similar Documents

Publication Publication Date Title
CN1286175C (zh) 大功率发光二极管发光装置
CN100373638C (zh) 发光二极管及其发光二极管灯
WO2005029594A1 (fr) Structure de diode electroluminescente
CN1874015A (zh) 整合导热/散热模块的半导体发光装置
CN1359137A (zh) 超导热管灯
CN2585273Y (zh) 发光二极管照明装置
CN101005733A (zh) 薄型半导体照明平面集成光源模块的制造方法
JP2007324547A (ja) 発光ダイオード光源装置、照明装置、表示装置及び交通信号機
CN102213367A (zh) 发光二极管灯具、发光二极管模组及其散热器
CN201180947Y (zh) 发光二极管组合结构
CN2517112Y (zh) 大功率发光二极管
CN102437266A (zh) Led封装结构
CN2821749Y (zh) 发光显示面板
CN2540685Y (zh) 高效率大功率发光二极管
CN2641451Y (zh) 以薄型发光二极管构成的照明装置
CN2677742Y (zh) 大功率发光二极管灯
CN2544416Y (zh) 大功率发光二极管
CN2557805Y (zh) 大功率发光二极管灯
CN201425272Y (zh) 一种led封装结构
WO2005067064A1 (fr) Del et lampe a del
CN102213402A (zh) 发光二极管灯具、发光二极管模组及其散热器
CN1450850A (zh) 一种带发光二极体的电路板
CN2526981Y (zh) 高效率发光二极管
CN200972860Y (zh) 高功率发光二极管
CN2655429Y (zh) 一种发光二极管结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: HANGZHOU FUYANG NOVELTY ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: GE SHICHAO

Effective date: 20040106

C10 Entry into substantive examination
C41 Transfer of patent application or patent right or utility model
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20040106

Address after: Hangzhou City, Zhejiang province 311404 Fuyang New Economic Development Zone

Applicant after: HANGZHOU FUYANG XINYING DIANZI Ltd.

Address before: Two road 310012 Zhejiang city in Hangzhou Province, the Qiuzhi Lane room 2-203

Applicant before: Ge Shichao

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: ZHEJIANG MANELUX LIGHTING CO., LTD.

Free format text: FORMER NAME: HANGZHOU FUYANG XINYING ELECTRONICS CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Hangzhou City, Zhejiang province Fuyang New Economic Development Zone

Patentee after: ZHEJIANG MANELUX LIGHTING Co.,Ltd.

Address before: Hangzhou City, Zhejiang province Fuyang New Economic Development Zone

Patentee before: HANGZHOU FUYANG XINYING DIANZI Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061122

Termination date: 20110929