CN1260772C

CN1260772C - Substrate, stage device, method of driving stage, exposure system and exposure method

Info

Publication number: CN1260772C
Application number: CNB99816934XA
Authority: CN
Inventors: 高桥正人
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 1999-10-07
Filing date: 1999-10-07
Publication date: 2006-06-21
Anticipated expiration: 2019-10-07
Also published as: WO2001027978A1; AU6005499A; KR20020038592A; KR100625625B1; CN1373900A

Abstract

The present invention relates to a stage device which comprises a support part (8) and a reaction force stage (17), wherein the support part (8) can be independently arranged in a vibrating mode correspondingly to a fixed disk (3). The reaction force stage (17) freely moves on the support part (8) along a direction through reaction force generated in company with the drive of a stage body (2). Therefore, because the problems of swing, etc. caused by the reaction force can be avoided, the present invention can realize short adjusting time and increased productivity and can also prevent the residual vibration of the support part from being conveyed to the fixed disk.

Description

Objective table device, method of driving stage and exposure device and exposure method

Technical field

The objective table device and the driving method thereof that the present invention relates to the substrate of the exposure mask pattern of substrate of glass or wafer etc. and keep moving in the plane of objective table body on fixed disk of this substrate, and the exposure device and the exposure method thereof that use the mask that keeps in this objective table device and substrate to carry out exposure-processed, when being particularly related to devices such as making semiconductor integrated circuit or LCD, be fit to substrate, objective table device, method of driving stage and exposure device and exposure method thereof that photo-mask process uses.

Background technology

In the past; in photo-mask process as one of manufacturing process of semiconductor device, use will mask or master (hereinafter referred to as master) go up the circuitous pattern that forms and be replicated in suprabasil various exposure devices such as the wafer that applied resist (emulsion) or glass plate.For example, the exposure device that uses as semiconductor device, highly integrated along with integrated circuit in recent years is according to the miniaturization of the minimum feature (device rule) of figure, the main reduced projection exposure device that uses, this device use projection optical system with the figure reduction print of master on wafer.

As this reduced projection exposure device, known figure with master is replicated in the reduced projection exposure device (so-called portable one by one exposure device) of static exposed type of the substep repetitive mode of a plurality of shooting areas (exposure area) on the wafer successively, or to its carried out improved be disclosed in Japan's No. 166043/1996 patent disclosure communique etc. with master and wafer along the same moved further of one dimension direction, and with the exposure device (the portable one by one exposure device of so-called scanning) of the scan exposure type of the substep scan mode of each shooting area of master graph copying on wafer.

In these reduced projection exposure devices, as objective table device, use the base framework that at first is provided as the benchmark of device on the ground mostly, the vibrationproof platform of surface vibration loads the noumenal seat that supports master objective table, wafer stage and projection optical system (projecting lens) by being used for isolator thereon.In present objective table device, as described vibrationproof platform, employing comprises actuators such as the interior airmount of pressing of may command, voice coil motor, be installed on the noumenal seat (main frame), for example control described voice coil motor by instrumentation value according to 6 accelerometers, thus the active vibrationproof platform of the vibration of control noumenal seat.

But, in above-mentioned portable exposure device one by one etc., after certain shooting area on the wafer is exposed, because other shooting areas are repeated exposure successively, so, have the such unfavorable condition of the relative position error that produces projection optical system and wafer because of the acceleration of wafer stage (situation of portable exposure device one by one) or master objective table and wafer stage (scanning is the situation of portable exposure device one by one), reaction force that retarded motion produces become the vibration factor of noumenal seat.Above-mentioned the relative position error during to punctual or exposure is copy pattern on positions different with design load on the wafer finally, in this site error, comprises under the situation of oscillating component, and be to become the undesirable condition that causes image blurring (increase of figure live width) reason.Therefore, in order to suppress this undesirable condition, need the vibration of noumenal seat fully be decayed by above-mentioned active vibrationproof platform etc.For example, under the situation of portable exposure device one by one, need to wait for make wafer stage be in the sufficient position adjustment of desired locations, begin alignment function or exposing operation again.And under the situation that scans one by one portable exposure device, need under the state of the synchronous adjustment of fully guaranteeing master objective table and wafer stage, expose.Therefore, become the main cause that productivity ratio is worsened.

Therefore, as the invention that improves this uncomfortable situation, for example No. 166475/1996 patent disclosure communique of Japan is disclosed, use the reaction force of the mobile generation that frame parts will be by wafer stage mechanically to hide to ground (the earth), or for example Japan's No. 330224/1996 patent disclosure communique etc. is disclosed, uses the reaction force of the mobile generation that frame parts will be by the master objective table mechanically to hide to ground (the earth).

But, in above-mentioned existing objective table device and exposure device, have following problem.

Along with in recent years the master or the maximization of wafer, two objective tables all maximize, even use the invention be disclosed in No. the 166475/1996th, Japan or No. 330224/1996 patent disclosure communique, cause frame parts vibration itself because of hiding by frame parts to the reaction force of ground side, hide to the reaction force on ground and be sent to the noumenal seat (main body) that keeps projection optical system by the vibrationproof platform, make its starting of oscillation, the so-called danger of waving of generation is arranged.Therefore, be difficult to guarantee productivity ratio to a certain degree, and be difficult to carry out high-precision exposure.

Therefore, for example disclosed following technology in Japanese No. 63231/1996 patent disclosure communique: objective table body that being provided with on pedestal floats supports and driving framework along with advancing of objective table body is mobile, retreat the driving framework with reaction force.According to this technology,, keep the position of centre of gravity of the device on the pedestal, so can reduce influence to the vibration of frame parts because conservation of momentum rule works between objective table body and driving framework.But, even under the situation of this technology of employing, if objective table maximizes, high speed, the influence that can not remove above-mentioned reaction force so fully.

Consider above aspect, the object of the present invention is to provide a kind of objective table device, method of driving stage, exposure device and exposure method, even under the situation of using large-scale objective table or objective table at a high speed, also can keep the Position Control characteristic of objective table.Another object of the present invention is to provide a kind of exposure device, exposure method, even under the situation of using large-scale objective table or objective table at a high speed, also can guarantee productivity ratio to a certain degree, and can carry out high-precision exposure.A further object of the present invention is to provide the substrate of figure having been carried out the high accuracy exposure.

Summary of the invention

To achieve these goals, the present invention adopts and the corresponding following structure of Fig. 1 to Fig. 7 of representing embodiment.

Objective table device of the present invention is included in the

objective table device

4,7 of the

objective table body

2,5 of at least one direction driving of fixed disk 3,6 upper edges, it is characterized in that, this

objective table device

4,7 comprises:

support portion

8,10, with respect to described fixed disk 3,6 independent configurations quiveringly; And reaction force objective table 17,37, along with the driving of described

objective table body

2,5, move freely in the described direction in 8,10 upper edges, described support portion by reaction force.Method of driving stage of the present invention is used for objective table and drives, this objective table is included in the 1st objective table 2,5 that at least one direction of fixed disk 3,6 upper edges drives, it is characterized in that, driving along with described the 1st objective table 2,5, by reaction force, will be supported on along the 2nd objective table 17,37 that a described direction moves freely on the

support portion

8,10 with respect to described fixed disk 3,6 independent vibrations.Therefore, in objective table device of the present invention and method of driving stage, when a direction drives in fixed disk 3,6 upper edges with the

objective table body

2,5 of the 1st objective table, driving along with

objective table body

2,5, pass through reaction force, the reaction force objective table 17,37 of the 2nd objective table moves along the rightabout with

objective table body

2,5, so conservation of momentum rule works between

objective table body

2,5 and reaction force objective table 17,37.Because reaction force objective table 17,37 moves on the

support portion

8,10 of independent vibration with respect to fixed disk 3,6, so the vibration of

support portion

8,10 is not sent to fixed disk 3,6, can prevent from the Position Control of

objective table body

2,5 is exerted an influence.

Exposure device of the present invention is to the figure of the mask R of maintenance on the substrate W exposed mask objective table 2 that keeps on the substrate objective table 5, it is characterized in that, in this exposure device 1, as at least one objective table of described mask objective table 2 and described substrate objective table 5, use any one described

objective table device

4,7 of claim 1 to 9.Exposure method of the present invention is used for the figure to the mask R that keeps on the substrate W exposed mask objective table 2 that keeps on the substrate objective table 5, it is characterized in that, as at least one method of driving stage of described mask objective table 2 and described substrate objective table 5, use any one described method of driving stage of claim 17 to 20.Therefore, in exposure device of the present invention and exposure method, owing to can shorten the adjustment time of the

objective table body

2,5 that keeps mask R or substrate W, boost productivity, suppress simultaneously to be applied to the influence of the vibration on the

objective table body

2,5 and to keep Position Control, so can carry out high-precision exposure.By making mask objective table 2, substrate objective table 5 and the separate vibration of projection optical system PL, can prevent that the vibration that the driving because of mask objective table 2 and substrate objective table 5 causes is sent to projection optical system PL, so can improve the imaging characteristic of mask R.And, on the substrate W of exposing according to these exposure methods, the figure of copy mask R accurately.

According to objective table device of the present invention and method of driving stage, owing to comprise with respect to the fixed disk vibration and go up the support portion of separate configurations and the reaction force objective table that on the support portion, moves by the reaction force that produces along with the objective table drive bulk, so problem such as can avoid waving, shorten the adjustment time, boost productivity, simultaneously can suppress the residual vibration of support portion is sent to fixed disk, can keep the Position Control of objective table body.Because fixed disk comes supported portion by vibration proof mechanism,, also can obtain to keep the effect of the Position Control of objective table body so can suppress the residual vibration of support portion is sent to fixed disk.And, because the reaction force objective table becomes with the structure of objective table body at least a portion of the Drive Structure of a direction driving, so do not need to be designed in addition the mechanism of eliminating reaction force, the miniaturization of implement device and low price.And, between reaction force objective table and support portion, because plug-in mounting makes the rotor that moves with respect to the support portion around the reaction force objective table of axis rotation, so when the reaction force objective table moves, rotor centers on axis and rotates such shirtsleeve operation, simplification that can implement device.In addition,, the reaction force objective table is not being moved under the friction, so the external disturbance that can get rid of the vibration of support portion, bring with friction by plug-in mounting non-contact bearing between reaction force objective table and support portion.And, by to the reaction force objective table along the mutually opposite direction return mechanism of the force section etc. of the application of force respectively, also can obtain can easily the reaction force objective table be turned back to the effect of initial position with simple mechanism.In addition, because having the objective table body can move freely along the approximate vertical direction that moves, the reaction force objective table is arranged on the structure on the direction of each this approximate vertical, even so under the situation that objective table body bidimensional moves, also can avoid along with moving because of problems such as waving of causing of reaction force, can further shorten the adjustment time, boost productivity.

And, according to exposure device of the present invention and exposure method, at least one objective table as mask objective table and substrate objective table, owing to use claim 1 any one described objective table device to claim 9, or claim 17 is to any one described method of driving stage of claim 20, so can shorten the adjustment time, boost productivity and exposure accuracy, the residual vibration that can suppress the support portion simultaneously is sent to fixed disk, can keep the Position Control of objective table body.By the separate configuration in vibration of mask objective table, substrate objective table and projection optical system, can prevent that the vibration that the driving because of objective table causes is sent to projection optical system, so prevent the deviation of the graph copying position that the vibration because of projection optical system causes effectively or produce image blurringly etc., improve exposure accuracy.And, keeping the multi-disc mask by the mask objective table, the substrate objective table keeps the multi-disc substrate, and exchange and alignment function and exposing operation are carried out equally, so can boost productivity significantly.And, if make stator shared by a plurality of rotors, can realize so parts reduction, be simplification, the low price of implement device.

On the other hand,, use above-mentioned exposure method to carry out graph exposure, can make overlapping, the live width of figure keep high accuracy, manifest the device property of regulation according to substrate of the present invention.

Description of drawings

Fig. 1 is the figure of expression the present invention the 1st embodiment, is master objective table, wafer stage and projection optical system to be associated in vibration and the schematic configuration diagram of the exposure device of separate configurations.

Fig. 2 is an outward appearance oblique view of being furnished with the objective table device of this master objective table.

Fig. 3 is the figure of expression the present invention the 1st embodiment, is the side view that both sides connect the stator of spring.

Fig. 4 is a partial enlarged drawing of being furnished with the objective table device of wafer stage.

Fig. 5 is the enlarged drawing of major part that drives the linear electric machine of wafer stage.

Fig. 6 is the figure of expression the present invention the 2nd embodiment, is master objective table, wafer stage and projection optical system to be associated in vibration and the schematic configuration diagram of the exposure device of separate configurations.

Fig. 7 is the outward appearance oblique view of another embodiment that expression is furnished with the objective table device of this wafer stage.

Fig. 8 is the flow chart of manufacturing process's example of expression semiconductor device.

Embodiment

Below, the embodiment of substrate of the present invention, objective table device, method of driving stage and exposure device and exposure method thereof is described referring to figs. 1 through Fig. 7.Here,, illustrate to make master and the same moved further of wafer, and use is at the example of the scanning objective table situation of the circuitous pattern that is replicated in the semiconductor device that forms on the master on the wafer for example as exposure device.In this exposure device, suppose all to adopt objective table device of the present invention at master objective table and wafer stage both sides.

[the 1st embodiment]

At first, according to Fig. 1 to Fig. 5 the 1st embodiment is described.The roughly following formation of exposure device 1 shown in Figure 1: by the lamp optical system IU that is thrown light on uniform illumination in the field of illumination of rectangular-shaped (or circular-arc) on master (mask) R from the illumination light of the exposure usefulness of light source (not shown); Comprise as the master objective table (objective table body, the 1st objective table) 2 of the mask objective table that keeps master R and the objective table device 4 of the master fixed disk (fixed disk) 3 that supports this master objective table 2; To project to the projection optical system PL on wafer (substrate) W from the illumination light of master R emission; Comprise as the wafer stage (objective table body, the 1st objective table) 5 of the substrate objective table that keeps wafer W and the objective table device 7 of the wafer fixed disk (fixed disk) 6 that keeps this wafer stage 5; And the reaction framework (support portion) 8 that supports above-mentioned objective table device 4 and support projection optical system PL.Here, the optical axis direction of establishing projection optical system PL is the Z direction, and the synchronous moving direction of master R and wafer W is the Y direction on the direction vertical with this Z direction, and asynchronous moving direction is a directions X.In addition, the direction of rotation of establishing each rotating shaft is θ Z, θ Y, θ X.

Lamp optical system IU is supported by the supporting seat 9 that is fixed in above the reaction framework 8.As illumination for exposure light, for example use from bright line (g line, i line) and KrF excimer laser extreme ultraviolet light (DUV light), ArF excimer laser (wavelength 193nm) and the F such as (wavelength 248nm) of the ultraviolet frequency domain of ultrahigh pressure mercury lamp emission ₂The vacuum-ultraviolet light (VUV) of laser (wavelength 157nm) etc. etc.Reaction framework 8 is arranged on the bedframe 10 that level is loaded into the bottom surface, and side and lower side form outstanding to the

inside stage portion

8a and 8b respectively at an upper portion thereof.

In the objective table device 4, master fixed disk 3 reacts in each bight on the stage portion 8a of framework 8 and is supported (the vibrationproof assembly for the paper inboard is not shown) by vibrationproof assembly (vibration proof mechanism) 11 by approximate horizontal ground, is formed at master R in the central in the portion and goes up the opening 3a that the graph image that forms passes through.Vibrationproof assembly 11 becomes the structure that the airmount 12 of adjustable inside pressure and voice coil motor 13 is arranged in series in stage portion 8a.By these vibrationproof assemblies 11,, the little vibration that is sent to master fixed disk 3 is insulated with little G level by base framework 10 and reaction framework 8.

On master fixed disk 3, but master objective table 2 is supported movably along these master fixed disk 3 bidimensionals.In the bottom surface of master objective table 2, will be fixing as a plurality of air bearing (air cushion) 14 of non-contacting bearing, by these air bearing 14, make master objective table 2 support of floating in the gap about by several microns on the master fixed disk 3.In the central portion of master objective table 2, the opening 2a that formation is communicated with opening 3 a of master fixed disk 3, the graph image of master R passes through.Master objective table 2 is driven on master fixed disk 3 in the regulation stroke range along the Y direction as the scanning direction by two groups of linear electric machines (driving mechanism) 15.Master objective table 2 have absorption keep master R and along non-scanning direction (directions X) and θ Z direction carry out the not shown master fine motion objective table of small driving and be connected with this fine motion objective table along X, Y direction coarse motion objective table movably, but here they are illustrated as an objective table.Therefore, master objective table 2 becomes along the Y direction with the long stroke linear drives, and along directions X and θ Z direction can small driving structure.

As shown in Figure 2, master objective table 2-end of Y direction on, fixing a pair of Y moving lens 18a, the 18b that form by the bight cube, and master objective table 2+end of directions X on, fixing the X moving lens of forming by level crossing 19 that extends along the Y direction.And, for these moving lens 18a, 18b, 19, survey three laser interferometers (all not shown) instrumentation of long light beam and the distance of each moving lens by irradiation, come X, the Y of instrumentation master objective table 2 accurately, the position of θ Z (the axial rotation of Z) direction.

As shown in Figure 1, on the Z direction approximate centre position of the directions X two sides of master objective table 2, the rotor 16 that internal coil is set respectively integratedly and extends along the Y direction.And with respect to each these rotors 16, configuration is as a pair of stator 17 of the section コ word shape of reaction force objective table (the 2nd objective table).Stator 17 constitutes by stator yoke iron with along the bearing of trend of this stator yoke iron a plurality of permanent magnets with the generation alternating magnetic field of predetermined distance configuration.That is, constitute DYN dynamic linear electric machine 15 by rotor 16 and stator 17, by and stator 17 between the interaction of electromagnetism, drive rotor 16 along Y direction (direction).Comprise master objective table 2 sides of rotor 16 grades and the weight ratio of stator 17 sides and approximately be set at 1: 4.

As shown in Figure 2, between the upper surface of each stator 17 and reaction framework 8, plug-in mounting rotates guide rail 20 respectively.Rotating guide rail 20 becomes the structure of extending and will be respectively disposing with certain interval around a plurality of rollers (rotor) 21 of axis rotation along directions X on the Y direction, stator 17 can move freely on the Y direction with respect to reaction framework 8 by the rotation of roller 21.As shown in Figure 3, on the Y of each stator 17 direction both sides, connect and compose an end of a pair of spring (force section) 22,22 that stator 17 is turned back to the return mechanism of initial position respectively.The other end of these springs 22 is fixed on the reaction framework 8, along on the mutually opposite direction of Y direction, gives stator 17 with the roughly the same power difference application of force (for example, stretching).Each spring 22 is set sufficient amount of bow, so as stator 17 when moving also in the elastic range internal strain.From Fig. 1,2 as can be known, this master objective table 2 becomes the no guide rail objective table of the track segment that moves that does not have guide rail master objective table 2 when X, Y direction mobile.

Turn back to Fig. 1, as projection optical system PL, here using object plane (master R) side and imaging surface (wafer W) side two sides that the circular projection visual field is being arranged under the heart far away, is the dioptric system of 1/4 (or 1/5) by quartz or fluorite as the reduction magnification that the refraction optical element (lens element) of optical glass material constitutes.Therefore, if illumination light is shone on the master R, so in the circuitous pattern on master R, imaging beam from the illumination light illumination section incides projection optical system PL, and the part inverted image of this circuitous pattern is with the central authorities of the circular field of view that is subject to the slot-shaped imaging surface side that images in projection optical system PL.Thus, in a plurality of shooting areas of the part inverted image of the circuitous pattern of projection on the wafer W of the imaging surface that is disposed at projection optical system PL, on the reduced resist layer that is replicated in a shooting area surface.

In Fig. 4, expression is amplified in the below by the projection optical system PL of exposure device 1.As shown in the figure, flange 23 with this lens barrel integrally is set on the periphery of the lens barrel portion of projection optical system PL.And, projection optical system PL is inserted in the lens barrel 25 of stage portion 8b by the formations such as mo(u)lding of vibrationproof assembly 24 approximate horizontal support of reaction framework 8 from the top as the Z direction with optical axis direction, and flange connector 23.As the material of flange 23, can use the material of low bulk, for example invar (Invar; The carbon of the nickel by 36%, 0.25% manganese and trace and comprise the alloy of the low bulk that the iron of other elements constitutes).This flange 23 passes through point, face and V groove by supported at three point with projection optical system PL for lens barrel fixed disk 25, forms the structure of so-called activity (kinematic) supporting bracket.When adopting such movable supporting structure, the assembling of the lens barrel fixed disk 25 of projection optical system PL is easy, and has the advantage that can alleviate the stress that causes because of the lens barrel fixed disk 25 after the assembling and the vibration of projection optical system PL, variations in temperature etc. most effectively.

Vibrationproof assembly 24 is configured in each bight (the vibrationproof assembly of not shown paper depth side) of lens barrel fixed disk 25, becomes the airmount 26 of pressing in can adjusting and voice coil motor 27 and is arranged in series in structure on the stage portion 8b.By these vibrationproof assemblies 24, can insulate with small G grade is sent to little vibration of lens barrel fixed disk 25 (or projection optical system PL) by base framework 10 and reaction framework 8.

Objective table device 7 with the wafer stage 5 that keeps wafer W, but to move the wafer fixed disk 6 that supports this wafer stage 5 along XY plane bidimensional be that main body constitutes.As shown in Figure 4, on the bottom surface of wafer stage 5, fixing a plurality of air bearing (air cushion) 28,, wafer stage 5 for example is being supported on the wafer fixed disk 6 by about several microns gap is unsteady by these air shaft 28 as non-contact bearing.

Wafer fixed disk 6 by vibrationproof assembly (vibration proof mechanism) 29 approximate horizontal be supported on the top of base framework (support portion) 10.Vibrationproof assembly 29 is configured in each bight (the vibrationproof assembly of not shown paper inboard) of wafer fixed disk 6, becomes the airmount 30 of pressing in can adjusting and voice coil motor 31 parallel connections and is configured in structure on the base framework 10.By these vibrationproof assemblies 29, can insulate with small G grade is sent to little vibration of wafer fixed disk 6 by base framework 10.

Wafer stage 5 by driving this wafer stage 5 along directions X a pair of linear electric machine 32 (not shown) than the linear electric machine of wafer stage 5 by this side of paper and can move freely at wafer fixed disk 6 upper edge XY two-dimensional directions along a pair of linear electric machine (driving mechanism) 33 that the Y direction drives wafer stage 5.The stator of lineation electrode 32 extends Y direction two outsides that are arranged on wafer stage 5 along directions X, by a pair of link 34 both ends is connected each other, constitutes the framework 35 of rectangle.The rotor of linear electric machine 32 is highlighted on the Y direction two sides that are arranged on wafer stage 5, so that in the face of stator.

On the lower surface of a pair of link 34 that constitutes framework 35 or linear electric machine 32, the rotor 36,36 that armature assembly constitutes is set respectively, extends along the Y direction as stator (the reaction force objective table) 37,37 of the 2nd objective table with magnet assemblies corresponding with these rotors 36,36.As shown in Figure 5, between each stator 37 and base framework 10, difference plug-in mounting rotary rail 38.Rotary rail 38 becomes axis is extended along directions X, the a plurality of rollers (rotor) 39 that respectively center on the axis rotation are along the structure of Y direction with certain arranged spaced, and stator 37 moves freely along the Y direction with respect to the base framework 10 as the support portion by the rotation of roller 39.

As shown in Figure 3, same with stator 17, in the Y of each stator 37 direction both sides, connect and compose an end of a pair of spring (force section) 40,40 that stator 37 is turned back to the return mechanism of initial position respectively.The other end of these springs 40 is fixed on the base framework 10, make stator 37 along on the mutually opposite direction of Y direction respectively with the roughly the same power application of force (for example stretch).Each spring 40 is set sufficient amount of bow, so as stator 37 when moving also in the elastic range internal strain.

Then, constitute DYN dynamic linear electric machine 33 by these rotors 36 and stator 37, with rotor 36 by and stator 37 between electromagnetic interaction drive along Y direction (direction).That is, by this linear electric machine 33, along the wafer stage 5 of Y direction driving with framework 35 one.As can be seen from Figure 4, wafer stage 5 becomes the no guide rail objective table that does not have track segment that moves in the Y direction.Have, moving of the directions X of relevant wafer stage 5 also can suitably form no guide rail objective table again.

On wafer stage 5,, utilize vacuum suction etc. to fix wafer W by chip support 41.The position of the directions X of wafer stage 5 is benchmark with the lens barrel lower end of being fixed in projection optical system PL with reference to mirror 42, be fixed in the laser interferometer 44 of position measuring device of the change in location of the moving lens 43 on the part of wafer stage 5 by instrumentation, with the resolution of regulation, for example the resolution about 0.5～1nm is carried out real-time instrumentation.By coming the position of the Y direction of instrumentation wafer stage 5 with reference to the not shown of mirror 42, moving lens 43, the configuration of laser interferometer 44 approximate vertical with reference to mirror, moving lens, laser interferometer with above-mentioned.In these laser interferometers at least one is that the survey major axis is the above multiaxis interferometer of diaxon, instrumentation value according to these laser interferometers, adjustment amount can also be asked in the not only XY position of wafer stage 5 (or wafer W), and rotation amount θ or except them.

On above-mentioned master fixed disk 3, wafer fixed disk 6, lens barrel fixed disk 25, three transducers (accelerometer for example of the Z direction vibration of each fixed disk of instrumentation is installed respectively, not shown) and instrumentation XY plane in three transducers (for example accelerometer is not shown) of vibration of direction.The vibration of each the fixed disk Y direction of two transducer instrumentations in the latter's the vibrating sensor, the vibration of remaining vibrating sensor instrumentation directions X (below, for easy, these vibrating sensors are called the vibrating sensor group).And, according to the instrumentation value of these vibrating sensor groups, can ask the vibration of 6 degrees of freedom (X, Y, Z, θ X, θ Y, θ Z) of master fixed disk 3, wafer fixed disk 6, lens barrel fixed disk 25 respectively.

And, as shown in Figure 4, on the flange 23 of projection optical system PL, fixing three laser interferometers 45 (wherein, in Fig. 4, in these laser interferometers, illustrating typically) in three different places as position detecting device.On the part of the lens barrel fixed disk 25 of facing each laser interferometer 45, form opening 25a respectively, by these openings 25a, the survey of Z direction is grown light beam irradiates to wafer fixed disk 6 from each laser interferometer 45.On wafer fixed disk 6 each surveyed on the opposed locations of long light beam, forms reflecting surface respectively.Therefore, by above-mentioned three laser interferometers 45,3 the different Z position of wafer fixed disk 6 is that benchmark comes the difference instrumentation (wherein with flange 23, in Fig. 4, the central shooting area of the wafer W on the wafer stage 5 represent to be in projection optical system PL optical axis under, be in the state that is blocked by wafer stage 5 so survey long light beam).Formation reflecting surface on wafer stage 5, also can be provided with projection optical system PL or flange 23 is the interferometer that benchmark comes the Z direction position of 3 of differences on this reflecting surface of instrumentation.

Below, in the

objective table device

4,7 of said structure, the working condition of objective table device 4 is described at first.

Master objective table 2 driving by linear electric machine 15 is when (for example+Y direction) is mobile along the scanning direction, and stator 17 relatively moves in reaction framework 8 upper edges opposite directions (Y direction) by rotary rail 20 under the reaction force that produces driving.At this moment, in rotary rail 20, because roller 21 rotations, so stator 17 moves smoothly.

Here, be under zero the situation in the triangular friction of master objective table 2 and stator 17 and master fixed disk 3, conservation of momentum rule works, along with moving of master objective table 2, the amount of movement of stator 17 decides by master objective table 2 sides (comprising Y moving lens 18a, 18b, X moving lens 19, rotor 16, master R etc.) and the weight ratio of stator 17 sides.Specifically because the weight ratio of master objective table 2 sides and stator 17 sides is about 1: 4, so for example master objective table 2+the mobile stator 17 edge-Y directions that make of the 30cm of Y direction move 7.5cm.

Therefore, the reaction force the during acceleration and deceleration of the scanning direction of master objective table 2 is absorbed by the mobile of stator 17, and the position of the center of gravity in the objective table device 4 is fixed in fact on the Y direction.Because the reaction framework 8 of support stator 17 supports master fixed disk 3 by vibrationproof assembly 11, so these reaction frameworks 8 and master fixed disk 3 become separate state in vibration.Therefore, when master objective table 2 is driven,, also can suppress the vibration of master fixed disk 3 effectively by above-mentioned reaction force.Move by stator 17 edge-Y directions, the application of force of the 22 pairs of stators 17 in force section shown in Figure 3 balanced destroyed increases the power to the stator 17 edge+Y direction application of forces.Therefore, stator 17 turn back to rapidly above-mentioned application of force equilibrium the position, be initial position.

Then, vibrationproof assembly 11 is according to the instrumentation value of laser interferometer, gives the power (reaction force) that moves influence that variation because of center of gravity cause of elimination along with master objective table 2 with feedforward, and driving gas support 12 and voice coil motor 13 produce this power.According to the friction between the three of master objective table 2 and stator 17 and master fixed disk 3 is zero, it only is different etc. the reason of the moving direction of master objective table 2 and stator 17, under the residual situation of the microvibration of 6 degree of freedom directions of master fixed disk 3, instrumentation value according to the vibrating sensor group, in order to remove above-mentioned residual vibration, also airmount 12 and voice coil motor 13 are carried out FEEDBACK CONTROL.

On the other hand, in objective table device 7, also produce and objective table device 4 identical operations.

Wafer stage 5 driving by linear electric machine 33 is driving under the reaction force that produces when (+Y direction) is mobile along the scanning direction, and stator 37 relatively moves in base framework 10 upper edges opposite directions (Y direction) by rotary rail 38.At this moment, in rotary rail 38, because roller 39 rotations, so stator 37 moves smoothly.And, be under zero the situation in wafer stage 5, stator 37 and the 6 triangular frictions of wafer fixed disk, conservation of momentum rule works, and along with moving of wafer stage 5, the amount of movement of stator 37 decides by the weight ratio of wafer stage 5 sides and stator 37 sides.Therefore, the reaction force the during acceleration and deceleration of the scanning direction of wafer stage 5 is absorbed by the mobile of stator 37, and the position of centre of gravity of objective table device 7 is fixed in fact on the Y direction.Because the base framework 10 that stator 37 supports comes supporting wafers fixed disk 6 by vibrationproof assembly 29, so these base frameworks 10 and wafer fixed disk 6 become the vibration separate state.Therefore, when driving wafer stage 5, also can suppress the vibration of wafer fixed disk 6 effectively by above-mentioned reaction force.Move by stator 37 edge-Y directions, the application of force of the 40 pairs of stators 37 in force section shown in Figure 3 balanced destroyed increases the power to the stator 37 edge+Y direction application of forces.Therefore, stator 37 turn back to rapidly above-mentioned application of force equilibrium the position, be initial position.

Then, vibrationproof assembly 29 is according to the instrumentation value of laser interferometer 44 grades, gives the reaction force that move influence that variation because of center of gravity cause of elimination along with wafer stage 5 by feedforward, and driving gas support 30 and voice coil motor 31 produce this power.Non-vanishing according to the friction between the three of wafer stage 5 and stator 37 and master fixed disk 6, it only is the somewhat dispar reason of moving direction of wafer stage 5 and stator 37, under the residual situation of the microvibration of 6 degree of freedom directions of wafer fixed disk 6, instrumentation value according to the vibrating sensor group, in order to remove above-mentioned residual vibration, also airmount 30 and voice coil motor 31 are carried out FEEDBACK CONTROL.

In lens barrel fixed disk 25, the reaction force of the mobile generation by master objective table 2, wafer stage 5 comes

mobile stator

17,37, even produce little vibration on reaction framework 8, plug-in mounting vibrationproof assembly 24 makes vibration independent between reaction framework 8.Even on lens barrel fixed disk 25, produce little vibration, ask the vibration of 6 degree of freedom directions according to the instrumentation value of the vibrating sensor group that on lens barrel fixed disk 25, is provided with, eliminate this little vibration by airmount 26 and voice coil motor 27 are carried out FEEDBACK CONTROL, can make lens barrel fixed disk 25 usually maintain stable position.Therefore, the projection optical system PL of lens barrel fixed disk 25 upper supports can be maintained stable position, prevent the deviation of the graph copying position that produces because of the vibration of projection optical system PL or image blurring etc. effectively, improve exposure accuracy.

Below, the exposing operation in the exposure device 1 of said structure is described.Preestablish the various conditions of exposures that are used for the shooting area on the wafer W being carried out scan exposure with correct exposure amount (target exposure).Then, use not shown master microscope and off-axis alignment line transducer to wait and carry out preparation works such as master aligning, baseline instrumentation, use alignment sensor to finish the fine registration (EGA of wafer W then; Enhancing general alignment etc.), ask the arrangement coordinate of a plurality of shooting areas on the wafer W.

So, if being used for the exposure beamhouse operation of wafer W finishes, come the instrumentation value of monitoring laser interferometer 44 so according to the alignment line result, control the exposure scanning starting position that linear

electric machine

32,33 moves to wafer stage 5 to be used for the 1st of wafer W to be taken simultaneously.Then, begin to carry out the scanning of the Y direction of master objective table 2 and wafer stage 5 by linear

electric machine

15,33, if two objective tables 2,5 reach targeted scans speed separately, by the illumination of exposure usefulness thrown light in the graphics field of master R the beginning scan exposure so.

When this scan exposure, come master objective table 2 and wafer stage 5 are carried out Synchronization Control by linear

electric machine

15,33, make the translational speed of Y direction of the translational speed of Y direction of master objective table 2 and wafer stage 5 keep the corresponding speed of projection multiplying power (1/5 times or 1/4 times) with projection optical system PL.Then, with throw light on the gradually zones of different of graphics field of master R of illumination light,, finish the scan exposure that the 1st on the wafer W taken by finishing illumination to whole surface, graphics field.Thus, the figure of master R is by in reduced the 1st shooting area that is replicated on the wafer W of projection optical system PL.

So, if the 1st scan exposure of taking finishes, divide moved further with wafer stage 5 along X, Y direction by linear

electric machine

32,33 so, move to the scanning starting position that is used for the 2nd exposure of taking.In this minute during moved further, according to the instrumentation value of the laser interferometer 44 of the position (position of wafer W) of detecting wafer stage 5, X, the Y of instrumentation wafer stage 5, the position of θ Z direction in real time.Then,, control linear

electric machine

32,33, and the position of control wafer objective table 5, make the displacement of XY position of wafer stage 5 be the state of regulation according to this instrumentation result.Displacement for the θ Z direction of wafer stage 5 comes Spin Control master objective table 2 according to the information of this displacement, makes the error of swing offset of recoverable wafer W side.Then, same with above-mentioned the 1st shooting area, the 2nd shooting area is carried out scan exposure.

So, repeat the scan exposure of the shooting area on the wafer W and be used for taking next time the branch moved further of exposure, the figure of duplicate original R successively on the whole exposure object shooting area on the wafer W.

In the objective table device and exposure device of present embodiment, reaction force during with driving master objective table 2, wafer stage 5 works

stator

17,37 respectively in the other direction along the conservation of momentum rule that moves, can prevent that these reaction forces are sent to reaction framework 8 or base framework 10, and then be sent to ground, problem such as can avoid waving, even so maximize at master R or wafer W, and under the situation of high-speed mobile, also can make the adjustment time short, boost productivity and exposure accuracy.Reaction framework 8 supports master fixed disk 3 by vibrationproof assembly 11, base framework 10 is by vibrationproof assembly 29 supporting wafers fixed disks 6, so can inhibitory reaction framework 8 and the residual vibration of base framework 10 be sent to master fixed disk 3 and wafer fixed disk 6, can keep the Position Control of each objective table 2,5.

In the present embodiment, because the

stator

17,37 of the part of the linear

electric machine

15,33 of above-mentioned each objective table 2,5 of formation driving is along with the driving of each objective table 2,5 is moved with reaction force respectively, so do not need to be designed in addition the structure of getting rid of this reaction force, miniaturization and low price that can implement device.And, when these

stators

17,37 move with above-mentioned reaction force, because

roller

21,39 carries out rotating such shirtsleeve operation around axis, so simplification that can implement device.

And, in the present embodiment,

spring

22,40 on mutually opposite direction to

stator

17,37 application of forces respectively, so when each

stator

17,37 moves with reaction force, also can easily turn back to initial position with simple mechanism.

In the exposure device of present embodiment, master objective table 2, wafer stage 5 and projection optical system PL vibrate separately by vibrationproof

assembly

11,29,24, be sent to projection optical system PL so can prevent the vibration that the driving of master objective table 2 and wafer stage 5 causes, can prevent the deviation of the graph copying position that the vibration of projection optical system PL causes effectively or produce image blurringly etc., improve exposure accuracy.

[the 2nd embodiment]

Fig. 6 is the figure of the 2nd embodiment of expression objective table device of the present invention and exposure device.In the figure, attached with same numeral with Fig. 1 to the identical parts of the structure member of the 1st embodiment shown in Figure 5, and omit its explanation.The difference of the 2nd embodiment and above-mentioned the 1st embodiment is the structure of objective table device 7, so carry out following explanation.

As shown in the figure, objective table device 7 is that main body constitutes with wafer stage 5, wafer fixed disk 6 with from their support frame of supported underneath (reaction force objective table) 46.And said stator 37 becomes the structure that moves along the Y direction with respect to support frame 46 by being inserted into the rotary rail 38 between the support frame 46.Wafer fixed disk 6 becomes the result with respect to support frame 46 independent vibrations also by being configured in the vibrationproof assembly 29 between the support frame 46.Therefore, support frame 46 plays the effect as the support portion for the reaction force of stator 37 moves.

Between support frame 46 and base framework 10, the rotary rail 48 that a plurality of rollers of plug-in mounting (rotor) 47 are formed.Roller 47 rotating around axis of extending along the Y direction, disposes along directions X respectively at certain intervals.And support frame 46 can move freely on directions X with respect to base framework 10 by the rotation around axis of roller 47.Other structure is identical with the foregoing description 1.

In the objective table device and exposure device of present embodiment, except can obtaining the effect and effect identical with above-mentioned the 1st embodiment, when wafer stage 5 edge+directions Xs move, with the reaction force that moves support frame 46 edge-directions Xs are moved, conservation of momentum rule is also worked along with wafer stage 5.Therefore, for scan exposure, not only when wafer stage 5 moves, and in order to change shooting area and to make 5 fens moved further of wafer stage, the problem such as wave that can avoid that reaction force along with minute moved further causes, so can further shorten the adjustment time, further boost productivity and exposure accuracy.In the present embodiment, can also suppress the residual vibration of base framework 10 or support frame 46 is sent to wafer fixed disk 6, can keep the Position Control of wafer stage 5.

[the 3rd embodiment]

Fig. 7 is the figure of the 3rd embodiment of expression objective table device of the present invention and exposure device.In the figure, attached with same numeral with Fig. 1 to the identical parts of the structure member of the 1st embodiment shown in Figure 5, and omit its explanation.The difference of the 3rd embodiment and above-mentioned the 1st embodiment is the structure of wafer stage 5, so carry out following explanation.

As shown in the figure, in the Y of projection optical system PL direction both sides, dispose off-axis alignment sensor 49a, 49b every the interval of regulation, this alignment sensor 49a, 49b are provided with two

wafer stage

5,5 along orientation.In each wafer stage 5, interior dress constitutes the magnet assemblies (seeing diagram) of the rotor of movable linear electric machine.And wafer stage 5 is extended the line slideway 50 that is provided with along the directions X as the stator that armature assembly is arranged and can independently respectively be moved freely on wafer fixed disk 6.

At the two ends of line slideway 50, the outstanding downwards above-mentioned rotor 36 that the armature assembly composition is set extends the corresponding stator 37 of rotor 36,36 both sides that is provided with two

wafer stage

5,5 along the Y direction.Therefore, each wafer stage 5 becomes along line slideway 50 mobile on directions X, and stator 37 is along the independent respectively structure that moves of Y direction simultaneously.In Fig. 7, omitted on the wafer stage 5 diagram of the moving lens that is provided with, mark component etc.

In the exposure device of said structure, as shown in Figure 7, during the wafer W on the wafer stage 5 of right-Y position is carried out exposing operation by projection optical system PL, implement to aim at for the wafer W on the wafer stage 5 of+Y side position.Specifically, the alignment mark (not shown) that the alignment sensor 49a of usefulness+Y side at first forms on instrumentation mark component, the wafer W carries out the prealignment of wafer W according to this instrumentation result.Then, the fine alignment of for example using EGA to obtain moves wafer stage 5, carries out the arrangement of each shooting area on the wafer W simultaneously.Then, the wafer stage 5 edge-Y directions that sequential exposure finishes move, and have carried out under alignment sensor 49b after the wafer exchange, carry out said sequence and aim at.By alignment sensor 49a carried out the wafer stage 5 of aiming at also edge-Y direction move, execution sequence exposes under projection optical system PL.

In the present embodiment, except can obtaining the effect identical with above-mentioned the 1st embodiment, owing to make two wafer stage, 5,5 independent moving, on an objective table, carry out wafer exchange and alignment function, carry out exposing operation simultaneously with another objective table, so can boost productivity significantly.And, because the shared stators 37 that when the Y direction moves, use at each objective table of the rotor 36 of two objective tables, so can realize cutting down parts, i.e. Zhuan Zhi simplification, low price.

In the above-described embodiments,, the structure of

roller

21,39,47 is set, but is not limited to this, non-contact bearings such as air bearing for example also can be set as the moving-member to the Y direction of stator 17,37.In this case, except obtaining and when using roller the same effect and effect, because

stator

17,37 is not moving under the friction,, can implement the higher exposure-processed of precision so can also get rid of the vibration of reaction framework 8 or base framework 10, the external disturbance that friction brings.Above-mentioned rollers or air bearing can be arranged in the stator, also can be arranged in any one of the reaction framework 8 of support stator or base framework 10.Although the diagram of omission, master objective table 2 also can form the structure that can support multi-disc master R as the 3rd embodiment.In this case, the coarse motion objective table of formation master objective table 2 carries out public, and the fine motion objective table that a plurality of maintenance master R independently are set is just passable.Thus, can be with the master objective table 2 whole compact structures that form.

In the above-described embodiments, in master objective table 2, wafer stage 5 both sides, form the structure that stator 17,37 moves with reaction force, but much less, only therein in objective table stator carry out reaction force and move also passable.And in the above-described embodiments, all vibrationproof assemblies form the structure of initiatively carrying out vibrationproof, carry out the such structure of passive vibrationproof but all these assemblies also can be some assemblies or any a plurality of assemblies in them.Master objective table 2 is formed the two-layer configuration of coarse motion objective tables, fine motion objective table, and it is also passable that the such structure of the parts (for example stator) that move with reaction force along with moving of objective table is set among one or the both sides therein.In the above-described embodiments, formation is applied to objective table device of the present invention the structure of exposure device 1, but be not limited to this, except exposure device 1, can also be applied to the micrometric measurement equipment of the scanning means of copy mask, the position coordinates determinator of mask graph etc.

Substrate as present embodiment; the semiconductor wafer W that not only can use semiconductor device to use can also be used the mask that uses in substrate of glass that LCD uses, ceramic wafers that film magnetic head uses or the exposure device or the master (synthetic quartz, silicon wafer) of master etc.As exposure device 1, (scan portable one by one exposure device with moved further and to the scanning exposure apparatus that the figure of master R carries out the substep scan mode of scan exposure except making master R and wafer W, PW; USP5473410) in addition, can use also making that the figure to master R exposes under master R and the wafer W inactive state, wafer W, PW be divided successively the projection aligner (portable one by one exposure device) of the substep repetitive mode of moved further.Kind as exposure device 1, the exposure device that the semiconductor device manufacturing that is not limited on wafer W semiconductor device graph to be exposed is used, also can be widely used in the exposure device that the liquid crystal display cells manufacturing is used, or be used to make the exposure device of film magnetic head, imaging apparatus (CCD) or master etc.

As the light source of exposure, not only can use the bright line (g line (436nm), h line (404.7nm), i line (365nm)), KrF excimer laser (248nm), ArF excimer laser (193nm), the F that produce from ultrahigh pressure mercury lamp with illumination light ₂Laser (157nm) also can use charge particle lines such as X line or electronics line.For example, under the situation of using the electronics line,, can use the lanthanum boride (LaB of thermionic emission type as electron gun ₆), tantalum (Ta).And, under the situation of using the electronics line, form use master R structure just can, and when not using master R, also can directly on wafer, form figure.In addition, can also use the high frequency of YAG laser or semiconductor laser etc.

The multiplying power of projection optical system PL not only can be a reduction system, and times system and amplification system such as can be.As projection optical system, under far ultraviolet situations such as use excimer laser,, use quartz or fluorite etc. to see through far ultraviolet material as glass material, using F ₂Under the situation of laser or X line, use the optical system (master R also uses the reflection-type type) of reflected refraction system or dioptric system, and under the situation of using the electronics line, as optical system, the electron-optical system of using electron lens and deflector to form just can.Much less, the light path by the electronics line is in vacuum state.Also can adopt master R is closely contacted with wafer W, the figure of master R is exposed and not use the proximity effect exposure device of projection optical system PL.

In wafer stage 5 or master objective table 2, use linear electric machine (with reference to USP5,623,853 or USP5,528,118) under the situation, also can and use the magnetic float type of Lorentz (Lorentz) power or reactance power with the air flotation type that has used air bearing.Each objective table 2,5 can be the type that moves along guide rail, also can be the no rail types that guide rail is not set.As the driving mechanism of each objective table 2,5, the electromagnetic force that has disposed the opposed generation of armature assembly of coil drives the planar motor of each objective table 2,5 with making bidimensional with also can using magnet assemblies (permanent magnet) by having disposed magnet and bidimensional.In this case, any one of magnet assemblies and armature assembly is connected to objective table 2,5, another all-moving surface side (pedestal) that is arranged on objective table 2,5 of magnet assemblies and armature assembly is just passable.

As more than, assemble the exposure device 1 of making present embodiment by the various subsystems of the various structure members enumerated in the claim scope that will comprise the application with the mechanical precision, electric precision, the optical accuracy that guarantee regulation.In order to ensure various precision, front and back in this assembling, be used to reach the adjustment of optical accuracy for various optical systems, be used to reach the adjustment of mechanical precision, various electrical systems are used to reach the adjustment of electric precision for various mechanical systems.The operation of dressing up exposure device from various groups of subsystems comprises the mutual mechanical connection of various subsystems, the wiring connection of circuit, the pipe arrangement connection of pneumatic circuit etc.Before dressing up the operation of exposure device, much less, be each assembling procedure of each subsystem from various groups of subsystems.Finish if various groups of subsystems are dressed up the operation of exposure device, so comprehensively adjust, guarantee various precision as exposure device integral body.The manufacturing of exposure device is preferably in the ultra-clean chamber that temperature and cleannes etc. is managed to be carried out.

As shown in Figure 8, through the function of device and performance design step 201, make step 202 based on the mask (master) of this design procedure, by silicon materials make the step 203 of wafer, exposure device 1 by the foregoing description waits processing of wafers step 204, device number of assembling steps (comprise scribing (dicing) operation, welding sequence, packaging process) 205, the inspection step 206 of graph exposure on wafer of master to make semiconductor device.

Claims

1. an objective table device is included in the objective table body that at least one direction of fixed disk upper edge drives, and it is characterized in that this objective table device also comprises:

The support portion is with respect to the independent configuration quiveringly of described fixed disk; And

The reaction force objective table, along with described objective table drive bulk, a described direction moves freely in upper edge, described support portion by reaction force.

2. objective table device as claimed in claim 1 is characterized in that described fixed disk is supported on the described support portion by vibration proof mechanism.

3. objective table device as claimed in claim 1 or 2 is characterized in that, described reaction force objective table constitutes described objective table body at least a portion along the driving mechanism of described direction driving.

4. objective table device as claimed in claim 3 is characterized in that, described driving mechanism is included in the rotor that is provided with on the described objective table body, and the stator that this rotor is driven along described direction by the electromagnetic interaction between this rotor,

Described reaction force objective table has described stator.

5. objective table device as claimed in claim 1, it is characterized in that, between described reaction force objective table and described support portion, the plug-in mounting rotor, this rotor rotates along axis, and described reaction force objective table is moved along a described direction with respect to described support portion.

6. objective table device as claimed in claim 1 is characterized in that, between described reaction force objective table and described support portion, and the plug-in mounting non-contact bearing.

7. objective table device as claimed in claim 1 is characterized in that, comprises making described reaction force objective table turn back to the return mechanism of initial position.

8. objective table device as claimed in claim 7 is characterized in that described return mechanism comprises the force section, and this force section is to the rightabout application of force of described reaction force objective table along a described direction.

9. objective table device as claimed in claim 1 is characterized in that, described objective table body can move freely along orthogonal direction,

Any one party that described reaction force objective table is set in the described orthogonal direction makes progress.

10. exposure device, it comprises mask objective table and substrate objective table, and the figure that is used for the mask that will keep on the described mask objective table throws light on by lamp optical system, with above-mentioned graph exposure in the substrate that keeps on the substrate objective table, it is characterized in that

Comprising one of at least in described mask objective table and the substrate objective table: at the driven objective table body of at least one direction of fixed disk upper edge; With respect to the independent support portion of configuration quiveringly of said fixing dish; By reaction force along with above-mentioned objective table drive bulk, the reaction force objective table that an above-mentioned direction moves freely in upper edge, above-mentioned support portion; Make this reaction force objective table turn back to the return mechanism of initial position.

11. exposure device as claimed in claim 10 is characterized in that, comprises projection optical system, be configured between described mask objective table and the described substrate objective table, with the graphic projection of described mask to described substrate.

12. exposure device as claimed in claim 11 is characterized in that, described mask objective table, described substrate objective table and described projection optical system be separate configurations quiveringly mutually.

13. exposure device as claimed in claim 10, it is characterized in that, described mask objective table has and keeps described mask and along the 1st direction fine motion objective table movably, and the edge that connects with described fine motion objective table 2nd direction different with described the 1st direction coarse motion objective table movably.

14. exposure device as claimed in claim 10 is characterized in that, at least one of described mask objective table and described substrate objective table is the guide rail objective table.

15. exposure device as claimed in claim 10 is characterized in that, described mask objective table can keep the multi-disc mask.

16. exposure device as claimed in claim 10 is characterized in that, described substrate objective table can keep the multi-disc substrate.

17. a method of driving stage, this objective table comprise by the linear electric machine objective table body that at least one direction drives in the fixed disk upper edge with stator and rotor, it is characterized in that,

Along with described objective table drive bulk, pass through reaction force, will along with a described side in the opposite direction movably and the reaction force objective table with described stator be supported on the support portion that independently vibrates with respect to described fixed disk, and make above-mentioned reaction force objective table turn back to initial position.

18. method of driving stage as claimed in claim 17 is characterized in that, the Heavy Weight of the described objective table body of the weight ratio of described reaction force objective table.

19. an exposure method in the substrate that the graph exposure of the mask that keeps on the mask objective table is kept to the substrate objective table, is characterized in that this method adopts following method of driving stage,

By having the linear electric machine of stator and rotor, drive at least one objective table body in described mask objective table and the described substrate objective table at least one direction of fixed disk upper edge, the reaction force objective table that will have said stator is supported on the support portion that independently vibrates with respect to the said fixing dish, reaction force by above-mentioned objective table drive bulk is produced moves to the direction opposite with above-mentioned objective table body.

20. exposure method as claimed in claim 19 is characterized in that, is included in the step of the described figure that exposes in the moving of described mask objective table and described substrate objective table.

21. exposure method as claimed in claim 19 is characterized in that, is included in the step that keeps a plurality of masks in the described mask objective table.

22. exposure method as claimed in claim 19 is characterized in that, is included in the step that keeps a plurality of substrates in the described substrate objective table.

23. exposure device as claimed in claim 10 is characterized in that, above-mentioned objective table one of at least is the mask objective table, and the weight of described reaction force objective table is greater than the weight of described objective table body.

24. exposure device as claimed in claim 10 is characterized in that, above-mentioned objective table one of at least is the substrate objective table, and the weight of described reaction force objective table is greater than the weight of described objective table body.