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CN1249835A - 印刷电路板模件和包含该模件的印刷电路板 - Google Patents

印刷电路板模件和包含该模件的印刷电路板 Download PDF

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CN1249835A
CN1249835A CN98802980A CN98802980A CN1249835A CN 1249835 A CN1249835 A CN 1249835A CN 98802980 A CN98802980 A CN 98802980A CN 98802980 A CN98802980 A CN 98802980A CN 1249835 A CN1249835 A CN 1249835A
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circuit board
printed circuit
module
pcb
contact
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CN1191617C (zh
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D·豪德奥
F·皮施纳
P·斯塔姆普卡
M·胡伯
J·黑策尔
J·蒙蒂格尔
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Infineon Technologies AG
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Siemens Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

本发明涉及一种印刷电路板模件(1),它包括一个与其上形成有接触面(3)的金属连接架(2)以导电方式连接的半导体芯片。半导体芯片和接触面(3)通过连接面(5)以导电方式连接。这些连接面设置在一个电绝缘层的背向半导体芯片的表面(4)上。借助于焊接头(6)或导电粘合剂固定方式可建立连接区(5)和接触区(3)之间的接触。另外,本发明涉及一种包含根据本发明的印刷电路板模件(1)的印刷电路板(10)。

Description

印刷电路板模件和包含该模件的印刷电路板
本发明涉及一种印刷电路板模件和一种包含该模件的印刷电路板。
印刷电路板模件通常包括一个支座，半导体芯片粘贴其上或以某种其它的方式紧固其上。此支座可以是薄的印刷电路板或者是塑料薄片，在其背向芯片的一侧压合着铜或类似物质制成的导电层，导电层构造成为各接触面，可由插卡阅读器分抽接通。除了层压的支座薄片之外，半导体芯片还可以安装在带有或者不带中介支座的金属连接架(Leadframe)上，各接触面分别印压在该连接架内。接触面的形状和大小通常取决于特定的标准规定，例如，IS0-标准7816。在惯常的印刷电路板模件中，借助于由半导体芯片的接触点导向接触面的端点的组装导线，使半导体芯片与接触面之间形成电接触。或者换一种方式，可以将触发技术应用于半导体芯片。
为了保护芯片和与接触面的连接，在电路板和接触点上覆盖有一层环氧树脂、热固性塑料或类似物质。成品的印刷电路板模件最后装入印刷电路板的电路板支座中。
以上述方式构造的印刷电路板模件通常具有至少500至600微米(μm)的组件高度。迄今尚未得到更小的组件高度。而且，由于印刷电路板模件的相对大的组件高度，插件板支座在模件范围内只能是很薄的，以便不超出印刷电路板的预定总厚度。因此，在印刷电路板模件范围内的插件板表面会呈现凹陷。
本发明的目的是提供一种印刷电路板模件，它能够以简单有效的方式生产，并具有尽可能最小的组件高度。与此同时，半导体电路板应尽量保护，以免受到机械损坏或化学影响。此外，通过使用印刷电路板，应有可能将电路板制成具有尽可能平整的表面而不带凸出或凹陷部分。
此目的是由根据权利要求1的印刷电路板达到的。优选的和有利的进一步发展由从属权利要求体现出来。在另外一个方面，本发明涉及一种根据权利要求10的印刷电路板，它包含根据本发明的印刷电路板模件。
本发明基于这样的事实而具有优越性，即半导体电路板并非作为“裸”板装入印刷电路板模件的，而是在其至少一面上带有电绝缘保护层，在其背向半导体芯片的表面上形成连接面，这些连接面与半导体芯片的接触点以导电方式接通。此保护层进一步确保半导体芯片免受机械压力并且同时隔开潮湿和其它有害化学物质的影响。当半导体芯片的顶面和底面都有保护层或者半导体芯片全面封于外罩内时，就确保了特别良好的保护。
所述的表面带有连接面的半导体组件通常称为“模具尺寸组装件”并在例如WO 96/02071中予以描述。
半导体芯片和金属连接架的接触面之间通过位于模具尺寸组装件的一个表面上的连接面而达到电接触。为此目的，组装件以连接面向前地置放在接触架上，从而达到电接触。
可通过例如焊接头的办法来做到这一点。在此情况下，连接面(也称作安装丘)含有一种焊接材料，例如软焊锡或者焊锡膏或者耐焊材料的一种。在后者的情况下，焊接材料施于半导体芯片的连接面上和/或施于连接架的接触点上，于是便产生焊接头。最好采用锡铅焊接材料来制成焊接头。这种材料的高度的韧性使焊接头能够吸收高度的机械压力，而不出现机械疲劳。
当金属连接架由铜或铜合金构成时，可获得特别良好的效果。最好是铜-锡合金，例如CuSn6。这些材料的高度的韧性使得以这种方式生产的印刷电路板模件和包含这些模件的印刷电路板对弯曲应力具有很低的灵敏度。因此，是十分可靠的。
连接架的分接抽头可按已知的方法带有一层或多层的绝缘层。
电路板连接面与连接架之间的焊接头可按已知的方式制作。一种优选的方法是热气焊接。这种焊接能力补充地确保安装具有高度的抗潮湿性，换言之，由于潮气的进入而在组装件中产生脆裂的风险是最小的。
另外一种可选用的接触方法是借助导电粘接剂将连接面与连接架接通。与之相应的材料和技术和通常用于半导体技术领域的相同。
模具尺寸组装件的装配可以基本上以通常方式采用惯常步骤进行。最好用一个连接架条进行装配，可使单个的印刷电路板模件与接触面在将模具尺寸组装件定位及接触之后才互相分离。
根据本发明的印刷电路板模件可用通常的方法安装在印刷电路板上。
根据本发明的印刷电路板模件除了已述的进一步抗机械和抗化学负荷的进一步的优点之外，还有若干优点。首先，它可以用极少的材料耗费以简单、快速和具成本效益的方式生产。由于它不需要在装配的半导体芯片上覆盖环氧树脂或类似物质，与惯常的制造方法相比，可以省却一个工作步骤。此外，模具尺寸组装件外壳的组装尺寸只有极微小的波动，使得有可能以可复制的外形制造印刷电路板模件。再有，根据本发明的印刷电路板模件的结构高度小于按通常方式生产的模件的结构高度。这对于印刷电路板的质量有影响。由于印刷电路板模件的总的组件高度很小，无论将印刷电路板模件安装在何处，与惯常的印刷电路板相比，电路板支座的壁厚可以较高，结果使得电路板具有平整的表面，其上没有凹陷的部分。
以下，参照附图对本发明作进一步的解释，附图中，
图1以俯视图示出根据本发明的印刷电路板模件；
图2以剖面图示出根据图1的印刷电路板模件，和
图3示出包含根据图1和2的印刷电路板模件的印刷电路板。
图1所示的印刷电路板模件1包括一个连接架2，接触面3即由该架压印而得。各接触面3各自以导电方式与一个连接面5接通，连接面5的位置由虚线区域表示。连接面5位于模具尺寸组装件7的一个表面4上。在成品的印刷电路板模件中，该组装件起到连接的作用，它将在印刷电路板模件从连接架上分开时压印而成的接触面3加以固定。
图2以两个连接面5范围内的剖面图示出根据图1的印刷电路板。连接面5通过焊接头6与相关的接触面3以导电方式接通。
图3示出印刷电路板10的剖面图，其中安装有图1和2所示的印刷电路板模件。以惯常的方式利用粘接剂9将印刷电路板模件1粘贴在板体8的一个凹进处，从而完成组装。

Claims (10)

1.一种印刷电路板模件(1)，包括一个半导体芯片，它与其上形成有接触面(3)的金属连接架(2)以导电方式连接，其特征在于，所述半导体芯片在至少一面带有电绝缘保护层，在其背向半导体芯片的表面(4)上设有连接面(5)，这些连接面以导电方式与半导体芯片的接触点连接，及所述半导体芯片以其连接面(5)面向前地置放在连接架(2)上，并且通过连接面(5)以导电方式与接触面(3)连接。
2.根据权利要求1的印刷电路板模件，其特征在于，所述连接面(5)是焊接到接触面(3)上的。
3.根据权利要求2的印刷电路板模件，其特征在于，所述连接面(5)借助热气焊接方式紧固于接触面(3)。
4.根据权利要求3的印刷电路板模件，其特征在于，焊接头(6)由锡铅焊接材料组成。
5.根据权利要求1的印刷电路板模件，其特征在于，所述连接面(5)借助导电粘接剂粘贴在接触面(3)。
6.根据权利要求1至5的其中之一的印刷电路板模件，其特征在于，所述连接架(2)由铜或一种铜合金组成。
7.根据权利要求6的印刷电路板模件，其特征在于，所述连接架由铜锡合金特别是CuSn6组成。
8.根据权利要求1至7的其中之一的印刷电路板模件，其特征在于，所述半导体芯片在顶面和底面都带有电绝缘保护层。
9.根据权利要求1至7的其中之一的印刷电路板模件，其特征在于，所述半导体芯片全面封于一个电绝缘的外罩(7)内。
10.一种印刷电路板(10)，其特征在于，它包含根据权利要求1至9的其中之一的印刷电路板模件(1)。
CNB988029804A 1997-03-03 1998-02-06 印刷电路板模件和包含该模件的印刷电路板 Expired - Lifetime CN1191617C (zh)

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DE19708617.9 1997-03-03
DE19708617A DE19708617C2 (de) 1997-03-03 1997-03-03 Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte

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US (1) US6191951B1 (zh)
EP (1) EP0965103B1 (zh)
JP (1) JP2001513928A (zh)
KR (1) KR20000075916A (zh)
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AT (1) ATE222387T1 (zh)
BR (1) BR9808171A (zh)
DE (2) DE19708617C2 (zh)
ES (1) ES2182279T3 (zh)
RU (1) RU2217795C2 (zh)
UA (1) UA58538C2 (zh)
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7451936B2 (en) 2003-12-02 2008-11-18 Infineon Technologies Ag Module for contactless chip cards or identification systems
CN1624718B (zh) * 2003-12-02 2010-05-26 因芬尼昂技术股份公司 无接触芯片卡或辨识系统的模块
CN102105894A (zh) * 2008-05-23 2011-06-22 斯迈达Ip有限公司 具有多个部件的芯片卡

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UA58538C2 (uk) 2003-08-15
RU2217795C2 (ru) 2003-11-27
DE19708617C2 (de) 1999-02-04
BR9808171A (pt) 2000-05-16
DE19708617A1 (de) 1998-09-10
US6191951B1 (en) 2001-02-20
WO1998039733A1 (de) 1998-09-11
EP0965103B1 (de) 2002-08-14
JP2001513928A (ja) 2001-09-04
KR20000075916A (ko) 2000-12-26
ES2182279T3 (es) 2003-03-01
CN1191617C (zh) 2005-03-02
DE59805191D1 (de) 2002-09-19
ATE222387T1 (de) 2002-08-15
EP0965103A1 (de) 1999-12-22

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