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CN1209002C - 影像感测器的对位装置 - Google Patents

影像感测器的对位装置 Download PDF

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CN1209002C
CN1209002C CNB011363908A CN01136390A CN1209002C CN 1209002 C CN1209002 C CN 1209002C CN B011363908 A CNB011363908 A CN B011363908A CN 01136390 A CN01136390 A CN 01136390A CN 1209002 C CN1209002 C CN 1209002C
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image sensor
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image sensing
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CN1413080A (zh
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丁玉祥
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Nucam Corp
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Abstract

一种影像感测器的对位方法，包含以下步骤：提供一电路基板及一影像感测元件；提供一对位装置，以将该影像感测元件与该电路基板对位；组装该电路基板、该影像感测元件以及该对位装置，以便维持该影像感测元件和该电路基板相结合的准确性和一致性。一种影像感测器的对位装置，包含一具凹座和中央开口的框体，其中该凹座可收纳影像感测元件，且该开口的周缘尺寸小于该影像感测元件的外周缘尺寸，该对位装置可将该影像感测元件精确地组装于电路基板上。

Description

影像感测器的对位装置
技术领域
本发明是关于一种电子元件的对位方法及装置，尤其指一种通用于影像感测器的对位方法和对位装置。
背景技术
公知技术已将影像感测器运用于数字相机及数字摄影机中，作为摄取影像的元件。业界目前常用的影像感测器可分为电荷藕合装置(CCD)感测器及互补式金属氧化半导体(CMOS)感测器两种，且CMOS感测器有逐渐取代CCD感测器的趋势。如图1所示，其约略的装置及配置，多于一电路基板110上设置一影像感测器120，并由接线130实现电路基板110和影像感测器120的电连接目的。然而，使用CMOS影像感测器120作为数字相机或数字摄影机的影像摄取元件时，经常会因为电路基板110与影像感测器120的电连接制程中，例如表面贴装技术(SMT)时，CMOS影像感测器120的接线130以若干锡球电连接电路基板的接合厚度并非均一或者于接合际有电路基板110与影像感测器120的相对偏移产生，致影像感测器120无法与电路基板110完全贴装而易生倾斜，此种电路基板110与影像感测器120未适当对位或固定的情形，极易于后续组装透镜组后，对经透境组聚焦后的影像，产生扭曲或聚焦不准的情形，从而影响数字相机或数字摄影机影像的质量。而业界对于此项困难，一直以各种较复杂手段(例如，调整镜头组方式)来加以克服，使影像感测器的摄取影像的准确度受到限制。
发明内容
本发明的主要目的在于提供一种影像感测器的对位方法，以便以准确实用方式，节省制造工时，提升制程良率。
本发明的又一目的在于提供一种影像感测器的对位方法，以便能将影像感测元件对位地固定于电路基板上，确保影像感测元件与电路基板相结合时的准确性和一致性。
本发明的另一目的在于提供一种影像感测器的对位装置，以便能将影像感测元件对位地固定于电路基板上，确保影像感测元件与电路基板相结合时的准确性和一致性，提升制程良率。
为达成上述的目的，本发明提供的一种影像感测器的对位方法，包含以下步骤：提供一电路基板及一影像感测元件；提供一对位装置，以将该影像感测元件与该电路基板对位；组装该电路基板、该影像感测元件以及该对位装置；以及以便维持该影像感测元件和该电路基板相结合的准确性和一致性。
其中还包含于该影像感测元件与电路基板之间形成电连接的步骤。
其中该影像感测元件为互补式金属氧化半导体(CMOS)。
其中该影像感测元件以表面贴合技术(SMT)结合该电路基板。
本发明提供的一种影像感测器的对位装置，包含一具凹座和中央开口的框体，其中该凹座可收纳一影像感测元件，且该开口的周缘尺寸小于该影像感测元件的外周缘尺寸，以将该影像感测元件对位地组装于电路基板上。
其中另包含一连结机制(means)，以将该影像感测元件固定于一该电路基板上。
其中该连结机制可微调该影像感测元件和该电路基板的相对位置。
其中该连结机制为螺孔或螺丝、卡勾或卡槽。其中设置于该电路基板上的该框体的高度是小于该影像感测器的高度。
为进一步说明本发明的结构及其特征，以下结合附图对本发明作进一步的详细描述。
附图说明
图1是公知组装CMOS影像感测器及电路基板的示意图；
图2是本发明影像感测器对位装置实施例的立体图；
图3是图2对位装置、影像感测元件及电路基板的组装立体图；
图4是沿图3的I-I线所取的剖面视图。
具体实施方式
请参照图2至图4，根据本发明影像感测器的对位方法，先如同公知技术一样，需提供一CMOS影像感测元件310于一电路基板410上。但本发明首创一种如图2所示的对位装置200，提供该影像感测元件3 10与该电路基板410的相互对位；而后，组装该对位装置200、该影像感测元件310以及该电路基板410，以便维持该影像感测元件310和该电路基板410相结合的准确对位。而且，当在生产线上实际应用时，根据本发明的实施，确可对于量产产品，获致电路基板和影像感测元件组装对位的一致性。
本发明影像感测器的对位方法，可进一步包含影像感测元件310与电路基板410之间形成电连接的步骤。该电连接步骤以表面贴装技术的锡球接合方式为较佳。
本发明提出的一种影像感测器的对位装置，该对位装置的材料无限制，较佳为塑胶或金属。本发明的对位装置的加工制造方法无限制，较佳为以一体成形方法制造。适用本发明的框体的高度无限制，较佳为设置于电路基板上时是小于该CMOS感测元件的高度，本发明的框体可以视需要地配合黏著胶以辅助对位。本发明的对位装置的连接机制的位置无限制，较佳为位于框体的外缘并与框体一体成形。本发明的连接机制无限制，较佳为螺孔成螺丝、卡勾或卡槽、公母扣件、卡榫及卡槽、铆钉、栓、扣环或销。本发明的框体的内壁可以视需要地设有突出的凸块或图条，以接触影像感测器。
请参照本发明的图2，其为本发明影像感测器对位装置200的示意图。本较佳例的影像感测器对位装置200为一矩形框体210。该框体210的中央，具有一凹座220，用以容置影像感测器310，并设置有开口230，用以容许外来的光线进入该影像感测器310，以摄取影像。该框体210的开口230大小，约略等于该影像感测器的感光区域大小。该框体210的凹座220可为平坦的平面或具预设高度的凸粒240，用以接触该影像感测器310并分散作用于影像感测器310的压力，于本较佳例中，其为具预设高度的凸粒240。
根据本发明的实施，可于框体210的对称角落设置连接机制，以与电路基板410组装一起。在本较佳例中，该连接机制为螺孔250与螺丝260的组合，可进一步对该影像感测器310及该框体210的高度或平整度进行细部调整。于框体210的对称角落，可另设一补助性的连接机制，以与该电路基板410接合，并提供安装时的初步定位，于本较佳例中其为卡勾270，且与该电路基板410上预设的卡槽420相配合。
如图3及图4所示，于使用时，本较佳例将该影像感测器3 10先置入至于该对位装置框体210的凹座220中，再将该已承置有影像感测器310的框体210，以该电路基板410的预设螺孔250及卡槽420为对位基准，将置有影像感测器310的框体210与该卡槽420及该螺孔250套接对位，并由螺丝260与螺孔250的配合，将影像感测器310对位地固定于电路基板410上。
待影像感测器310准确地固定于电路基板410上后，以锡球电连接方式，对该CMOS影像感测器310进行后续的SMT接线的制程，以便将传导讯号的接线接合至该CMOS影像感测器310。由于影像感测器310的框体210高度小于该影像感测器310的高度，故后续的的SMT接线可于框体210与电路基板410间的空隙处完成。
倘于该后续的的SMT接线制程，由于电接合时可能造成的影像感测器310与电路基板410的相对性些微对位偏移或者若干接合锡球的厚度并不均一，致有进一步调整影像感测器310与镜头组(图中未示)的对位必要性时，可由调整螺丝260与螺孔250的松紧配合度，以进一步微调影像感测器310及电路基板410的相对水平，以符合该影像感测器310及聚光焦点的需求，以更精确校准影像感测器310与电路基板410的定位接合。
应注意的是，上述诸多实施例仅是为了便于说明而举例而已，本发明所主张的权利范围自应以申请专利范围所述为准，而非仅限于上述实施例。

Claims (4)

1.一种影像感测器的对位装置，用以将一影像感测元件对位地组装于一电路基板上，包含：
一具一凹座和中央开口的框体，其中该凹座收纳一影像感测元件，且该中央开口的周缘尺寸小于该影像感测元件的外周缘尺寸；以及
一连结部件，其中该连结部件将该影像感测元件固定于该电路基板上；
其中，该框体的高度小于该影像感测器的高度。
2.如权利要求1所述的对位装置，其特征在于，其中该连结部件可微调该影像感测元件和该电路基板的相对位置。
3.如权利要求1或2所述的对位装置，其特征在于，其中该连结部件为螺孔或螺丝。
4.如权利要求1所述的对位装置，其特征在于，其中该连结部件为卡勾或卡槽。
CNB011363908A 2001-10-12 2001-10-12 影像感测器的对位装置 Expired - Fee Related CN1209002C (zh)

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US10/014,540 US20030070288A1 (en) 2001-10-12 2001-12-14 Method and device for aligning an image sensor

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Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
CN1301614C (zh) * 2003-09-17 2007-02-21 菱光科技股份有限公司 扫瞄器感光元件的对位结构及其制作方法
US7495702B2 (en) * 2004-02-09 2009-02-24 Nokia Corporation Portable electronic device with camera
CN101662912B (zh) * 2008-08-29 2012-01-11 英业达股份有限公司 电路板旋转定位结构
KR101594831B1 (ko) * 2009-03-26 2016-02-17 삼성전자 주식회사 바이오 드라이브에서의 카메라 모듈 고정 구조
US8988601B2 (en) * 2011-10-24 2015-03-24 Siemens Medical Solutions Usa, Inc. Imaging system warp correction with phantom assembly
KR20130127841A (ko) * 2012-05-15 2013-11-25 삼성전자주식회사 촬상장치 및 촬상장치의 제조 방법
JP6750862B2 (ja) * 2016-07-13 2020-09-02 キヤノン株式会社 撮像素子およびその実装基板
CN112951864B (zh) * 2021-04-29 2022-08-02 中国科学院长春光学精密机械与物理研究所 一种拼接用图像传感器的窄边柔性封装结构及其封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085362A (en) * 1991-01-16 1992-02-04 Atmel Corporation Gravity-held alignment member for manufacture of a leadless chip carrier
US5232372A (en) * 1992-05-11 1993-08-03 Amp Incorporated Land grid array connector and method of manufacture
US5504988A (en) * 1994-05-17 1996-04-09 Tandem Computers Incorporated Apparatus for mounting surface mount devices to a circuit board
US6389687B1 (en) * 1999-12-08 2002-05-21 Amkor Technology, Inc. Method of fabricating image sensor packages in an array

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