CN1204447C - 显示装置用基板及其制造方法、以及液晶装置及电子设备 - Google Patents
显示装置用基板及其制造方法、以及液晶装置及电子设备 Download PDFInfo
- Publication number
- CN1204447C CN1204447C CNB011047305A CN01104730A CN1204447C CN 1204447 C CN1204447 C CN 1204447C CN B011047305 A CNB011047305 A CN B011047305A CN 01104730 A CN01104730 A CN 01104730A CN 1204447 C CN1204447 C CN 1204447C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- electrode
- transparency conducting
- conducting layer
- metal level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 166
- 238000000034 method Methods 0.000 title claims description 56
- 239000000758 substrate Substances 0.000 claims abstract description 216
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000002184 metal Substances 0.000 claims abstract description 128
- 238000009826 distribution Methods 0.000 claims description 163
- 229920002120 photoresistant polymer Polymers 0.000 claims description 36
- 238000005530 etching Methods 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 238000010276 construction Methods 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000004411 aluminium Substances 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 230000033228 biological regulation Effects 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 157
- 239000010408 film Substances 0.000 description 55
- 239000003990 capacitor Substances 0.000 description 34
- 230000015572 biosynthetic process Effects 0.000 description 20
- 239000011521 glass Substances 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 12
- 239000008393 encapsulating agent Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 10
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910001362 Ta alloys Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- -1 then Substances 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133553—Reflecting elements
- G02F1/133555—Transflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000041752 | 2000-02-18 | ||
JP41752/2000 | 2000-02-18 | ||
JP2001016182A JP3617458B2 (ja) | 2000-02-18 | 2001-01-24 | 表示装置用基板、液晶装置及び電子機器 |
JP16182/2001 | 2001-01-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1309320A CN1309320A (zh) | 2001-08-22 |
CN1204447C true CN1204447C (zh) | 2005-06-01 |
Family
ID=26585692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011047305A Expired - Lifetime CN1204447C (zh) | 2000-02-18 | 2001-02-19 | 显示装置用基板及其制造方法、以及液晶装置及电子设备 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6850307B2 (zh) |
JP (1) | JP3617458B2 (zh) |
KR (1) | KR100416173B1 (zh) |
CN (1) | CN1204447C (zh) |
TW (1) | TW538293B (zh) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001282935A1 (en) | 2000-08-01 | 2002-02-13 | First Usa Bank, N.A. | System and method for transponder-enabled account transactions |
JP2002303879A (ja) * | 2001-04-03 | 2002-10-18 | Nec Corp | アクティブマトリクス基板及びその製造方法 |
US6999106B2 (en) * | 2001-04-30 | 2006-02-14 | Intel Corporation | Reducing the bias on silicon light modulators |
JP4620298B2 (ja) * | 2001-07-23 | 2011-01-26 | パイオニア株式会社 | 銀若しくは銀合金配線及びその形成方法並びに表示パネル基板 |
TW588185B (en) * | 2001-09-06 | 2004-05-21 | Sharp Kk | Display, method of manufacturing the same, and method of driving the same |
JP3630129B2 (ja) * | 2001-09-28 | 2005-03-16 | ソニー株式会社 | 液晶表示装置 |
JP4027691B2 (ja) * | 2002-03-18 | 2007-12-26 | 株式会社日立製作所 | 液晶表示装置 |
US7053971B2 (en) * | 2002-07-17 | 2006-05-30 | Citzen Watch Co., Ltd. | Liquid crystal display panel |
TW588195B (en) * | 2002-07-30 | 2004-05-21 | Hong-Da Liu | Reflector structure in a liquid crystal display having light condensing effect |
EP1437683B1 (en) * | 2002-12-27 | 2017-03-08 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking account system using the IC card |
US7652359B2 (en) * | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
US7823777B2 (en) | 2003-01-03 | 2010-11-02 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making same |
US7588184B2 (en) * | 2003-01-03 | 2009-09-15 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
US8033457B2 (en) | 2003-01-03 | 2011-10-11 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
US7530491B2 (en) * | 2003-01-03 | 2009-05-12 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
TWI220045B (en) * | 2003-08-06 | 2004-08-01 | Au Optronics Corp | LCD display of slim frame design |
US7566001B2 (en) * | 2003-08-29 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
TWI267789B (en) * | 2004-06-30 | 2006-12-01 | Au Optronics Corp | Transparent touch panel for recognizing fingerprint |
KR100679100B1 (ko) * | 2004-10-29 | 2007-02-06 | 엘지.필립스 엘시디 주식회사 | 수평 전계 인가형 액정 표시 패널 및 그 제조방법 |
US7351519B2 (en) * | 2004-11-23 | 2008-04-01 | Advantech Global, Ltd | Patterning of indium-tin oxide (ITO) for precision-cutting and aligning a liquid crystal display (LCD) panel |
JP4902956B2 (ja) * | 2004-12-03 | 2012-03-21 | 株式会社ブリヂストン | 情報表示用パネル及び情報表示装置 |
JP2006284968A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Printing Co Ltd | 液晶分子をホメオトロピック配向させた光学素子およびこれを用いた液晶表示装置用基材ならびに液晶表示装置 |
JP2009178843A (ja) * | 2006-08-22 | 2009-08-13 | Rynne Group Llc | 識別カードおよびその識別カードを使用した識別カード取引システム |
JP5111867B2 (ja) | 2007-01-16 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | 表示装置 |
US20080218678A1 (en) * | 2007-03-09 | 2008-09-11 | Koji Nakayama | Liquid crystal display device |
WO2009054066A1 (ja) * | 2007-10-26 | 2009-04-30 | Fujitsu Limited | 液晶表示パネル |
US8103824B2 (en) * | 2008-04-17 | 2012-01-24 | International Business Machines Corporation | Method for self optimizing value based data allocation across a multi-tier storage system |
JP2009294447A (ja) * | 2008-06-05 | 2009-12-17 | Fujitsu Ltd | ドットマトリクス表示装置の透明電極基板、液晶表示素子および反射型表示素子 |
USD635186S1 (en) | 2008-06-30 | 2011-03-29 | Jpmorgan Chase Bank, N.A. | Metal transaction device |
US9305292B1 (en) | 2008-07-03 | 2016-04-05 | Jpmorgan Chase Bank, N.A. | Systems and methods for providing an adaptable transponder device |
USD636021S1 (en) | 2008-07-17 | 2011-04-12 | Jpmorgan Chase Bank, N.A. | Eco-friendly transaction device |
TWI525603B (zh) | 2009-01-16 | 2016-03-11 | 半導體能源研究所股份有限公司 | 液晶顯示裝置及其電子裝置 |
BR112012013359A2 (pt) * | 2009-12-04 | 2016-03-01 | Sharp Kk | dispositivo de visor de cristal líquido |
JP5499923B2 (ja) * | 2010-06-14 | 2014-05-21 | セイコーエプソン株式会社 | 表示シートの製造方法 |
RU2605524C2 (ru) * | 2011-12-23 | 2016-12-20 | Конинклейке Филипс Н.В. | Магнитно-резонансная визуализация с подавлением артефактов потока |
JP5876351B2 (ja) * | 2012-03-29 | 2016-03-02 | 三菱製紙株式会社 | 光透過性電極 |
CN103337501B (zh) * | 2013-06-24 | 2015-11-25 | 深圳市华星光电技术有限公司 | 阵列基板及其制作方法、平板显示装置 |
CN103489879B (zh) * | 2013-10-11 | 2016-04-20 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN104216182B (zh) * | 2014-08-22 | 2017-03-01 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和显示面板 |
JP6482256B2 (ja) * | 2014-12-02 | 2019-03-13 | 三菱電機株式会社 | 薄膜トランジスタ基板および液晶表示装置 |
US20160232438A1 (en) | 2015-02-06 | 2016-08-11 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards |
US10152159B2 (en) | 2015-04-01 | 2018-12-11 | Shanghai Tianma Micro-Electronics | Display panel and method for forming an array substrate of a display panel |
CN104699349B (zh) * | 2015-04-01 | 2017-12-05 | 上海天马微电子有限公司 | 一种阵列基板及其制作方法、显示面板 |
KR102411543B1 (ko) * | 2015-06-29 | 2022-06-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102484892B1 (ko) * | 2015-07-31 | 2023-01-06 | 엘지디스플레이 주식회사 | 투명표시장치 및 이의 제조방법 |
CN107343352A (zh) * | 2016-05-03 | 2017-11-10 | 琦芯科技股份有限公司 | 具显示介面的软性电路连接架构与其制作方法 |
CN107438333A (zh) * | 2016-05-25 | 2017-12-05 | 琦芯科技股份有限公司 | 具有双层线路层的基板及其制造方法 |
KR102529828B1 (ko) * | 2016-10-31 | 2023-05-08 | 엘지디스플레이 주식회사 | 표시장치 및 다면 표시장치 |
CN108873460A (zh) * | 2018-07-18 | 2018-11-23 | 深圳市华星光电半导体显示技术有限公司 | 液晶面板 |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5234918B2 (zh) * | 1974-05-31 | 1977-09-06 | ||
DE2807350C2 (de) * | 1977-03-02 | 1983-01-13 | Sharp K.K., Osaka | Flüssigkristall-Anzeigevorrichtung in Baueinheit mit einem integrierten Schaltkreis |
JPS6019608B2 (ja) * | 1978-10-03 | 1985-05-17 | シャープ株式会社 | 電極パタ−ン形成方法 |
US4838656A (en) * | 1980-10-06 | 1989-06-13 | Andus Corporation | Transparent electrode fabrication |
JPS57161882A (en) * | 1981-03-31 | 1982-10-05 | Hitachi Ltd | Display body panel |
US4824213A (en) * | 1983-12-16 | 1989-04-25 | Citizen Watch Co., Ltd. | Liquid crystal display having opaque portions on the electrodes |
US4688898A (en) * | 1984-02-11 | 1987-08-25 | Sartorius Gmbh | LCD display board for an electronic balance |
US4689116A (en) * | 1984-10-17 | 1987-08-25 | L'etat Francais Represented By The Minister Of Ptt (Centre National D'etudes Des Telecommunications) | Process for fabricating electronic circuits based on thin-film transistors and capacitors |
JPS61138285A (ja) * | 1984-12-10 | 1986-06-25 | ホシデン株式会社 | 液晶表示素子 |
FR2581781B1 (fr) * | 1985-05-07 | 1987-06-12 | Thomson Csf | Elements de commande non lineaire pour ecran plat de visualisation electrooptique et son procede de fabrication |
JPS63162324U (zh) * | 1987-04-13 | 1988-10-24 | ||
US4859036A (en) * | 1987-05-15 | 1989-08-22 | Canon Kabushiki Kaisha | Device plate having conductive films selected to prevent pin-holes |
JPH0610702B2 (ja) * | 1987-11-18 | 1994-02-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | カラー液晶表示装置およびその製造方法 |
JP2605382B2 (ja) * | 1987-12-18 | 1997-04-30 | セイコーエプソン株式会社 | アクティブマトリクス基板の製造方法 |
JPH01197911A (ja) | 1988-01-30 | 1989-08-09 | Unitika Ltd | 導電性薄膜の製造法 |
US5187601A (en) * | 1988-03-07 | 1993-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for making a high contrast liquid crystal display including laser scribing opaque and transparent conductive strips simultaneously |
JPH022519A (ja) | 1988-06-15 | 1990-01-08 | Sharp Corp | 液晶表示素子の製造方法 |
JPH0253031A (ja) | 1988-08-18 | 1990-02-22 | Casio Comput Co Ltd | アクティブ駆動型液晶表示素子の駆動方法 |
US5187604A (en) * | 1989-01-18 | 1993-02-16 | Hitachi, Ltd. | Multi-layer external terminals of liquid crystal displays with thin-film transistors |
JP2746403B2 (ja) * | 1989-02-13 | 1998-05-06 | コニカ株式会社 | 液晶表示装置およびその製造方法 |
JPH02228629A (ja) * | 1989-02-28 | 1990-09-11 | Sharp Corp | 液晶表示装置 |
JPH02281237A (ja) | 1989-04-21 | 1990-11-16 | Fujitsu Ltd | 表示装置の電極構造 |
JP2778746B2 (ja) * | 1989-06-29 | 1998-07-23 | 株式会社東芝 | 液晶表示装置及び電極基板の製造方法 |
FR2651371B1 (fr) * | 1989-08-29 | 1991-10-18 | France Etat | Procede de realisation d'un ecran d'affichage a matrice active et a structure inversee. |
JP2652072B2 (ja) * | 1990-02-26 | 1997-09-10 | キヤノン株式会社 | 遮光層の形成方法 |
JP2673460B2 (ja) * | 1990-02-26 | 1997-11-05 | キヤノン株式会社 | 液晶表示素子 |
JP2673739B2 (ja) * | 1990-07-31 | 1997-11-05 | キヤノン株式会社 | 液晶素子 |
JP2814155B2 (ja) * | 1990-08-13 | 1998-10-22 | キヤノン株式会社 | Ito膜パターンの形成方法および液晶表示素子用基板の製造方法 |
JPH04116620A (ja) * | 1990-09-07 | 1992-04-17 | Sharp Corp | 液晶表示装置 |
JP2952075B2 (ja) * | 1991-06-12 | 1999-09-20 | キヤノン株式会社 | 液晶素子の製造法 |
US5285300A (en) * | 1991-10-07 | 1994-02-08 | Canon Kabushiki Kaisha | Liquid crystal device |
JP3350991B2 (ja) * | 1992-03-06 | 2002-11-25 | セイコーエプソン株式会社 | 電気光学装置用基板、及び電気光学装置 |
JPH07134300A (ja) | 1993-11-10 | 1995-05-23 | Toppan Printing Co Ltd | 反射型液晶表示装置 |
JP2882275B2 (ja) | 1994-02-22 | 1999-04-12 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置 |
JP3301219B2 (ja) | 1994-06-09 | 2002-07-15 | カシオ計算機株式会社 | 液晶表示装置 |
US5893624A (en) * | 1996-07-05 | 1999-04-13 | Seiko Instruments Inc. | Liquid crystal display device |
JPH09292623A (ja) * | 1996-04-24 | 1997-11-11 | Sanyo Electric Co Ltd | 表示基板とそれを用いる液晶表示器 |
JPH1096937A (ja) * | 1996-09-24 | 1998-04-14 | Canon Inc | 液晶素子及びその製造方法 |
JP3511861B2 (ja) * | 1996-10-04 | 2004-03-29 | セイコーエプソン株式会社 | 液晶表示パネル及びその検査方法、並びに液晶表示パネルの製造方法 |
JP2842426B2 (ja) | 1997-01-28 | 1999-01-06 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置およびその製造方法 |
JPH10319431A (ja) * | 1997-05-15 | 1998-12-04 | Advanced Display:Kk | 薄膜トランジスタアレイ基板 |
JP3544616B2 (ja) | 1997-09-01 | 2004-07-21 | 株式会社リコー | 液晶表示装置 |
JPH11223829A (ja) | 1998-02-09 | 1999-08-17 | Seiko Epson Corp | 液晶装置 |
JP3406515B2 (ja) | 1998-04-24 | 2003-05-12 | シャープ株式会社 | 液晶表示装置 |
US6037005A (en) | 1998-05-12 | 2000-03-14 | 3M Innovative Properties Company | Display substrate electrodes with auxiliary metal layers for enhanced conductivity |
JP3744203B2 (ja) | 1998-05-27 | 2006-02-08 | セイコーエプソン株式会社 | 液晶表示装置 |
-
2001
- 2001-01-24 JP JP2001016182A patent/JP3617458B2/ja not_active Expired - Fee Related
- 2001-02-16 TW TW090103630A patent/TW538293B/zh not_active IP Right Cessation
- 2001-02-16 US US09/785,511 patent/US6850307B2/en not_active Expired - Lifetime
- 2001-02-17 KR KR10-2001-0007975A patent/KR100416173B1/ko active IP Right Grant
- 2001-02-19 CN CNB011047305A patent/CN1204447C/zh not_active Expired - Lifetime
-
2003
- 2003-05-20 US US10/441,407 patent/US6924867B2/en not_active Expired - Lifetime
- 2003-05-20 US US10/441,586 patent/US6922225B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1309320A (zh) | 2001-08-22 |
US20030206263A1 (en) | 2003-11-06 |
JP2001305995A (ja) | 2001-11-02 |
US6922225B2 (en) | 2005-07-26 |
KR100416173B1 (ko) | 2004-01-24 |
KR20010087191A (ko) | 2001-09-15 |
US6924867B2 (en) | 2005-08-02 |
US6850307B2 (en) | 2005-02-01 |
JP3617458B2 (ja) | 2005-02-02 |
US20030202151A1 (en) | 2003-10-30 |
US20010022644A1 (en) | 2001-09-20 |
TW538293B (en) | 2003-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1204447C (zh) | 显示装置用基板及其制造方法、以及液晶装置及电子设备 | |
CN2630888Y (zh) | 半透过反射型液晶装置和使用其的电子设备 | |
CN2582024Y (zh) | 半透射反射式液晶装置和使用它的电子设备 | |
CN1224859C (zh) | 半透过反射型液晶装置和使用其的电子设备 | |
CN1149430C (zh) | 液晶屏用基板、液晶屏及使用它的电子装置 | |
CN1193259C (zh) | 液晶装置、其制造方法及电子装置 | |
CN101046593A (zh) | 液晶装置及电子设备 | |
CN1208664C (zh) | 液晶显示装置 | |
CN1749819A (zh) | 含有传感元件的液晶显示器件 | |
CN100343744C (zh) | 电光装置用基板、电光装置和电子设备 | |
CN1721934A (zh) | 液晶显示装置和图像显示装置 | |
CN1801307A (zh) | 可感应触摸的显示设备及其驱动方法 | |
CN1892384A (zh) | 薄膜晶体管阵列面板、液晶显示器、及其方法 | |
CN1991507A (zh) | 显示器件 | |
CN1517751A (zh) | 上基底及具有该基底的液晶显示装置 | |
CN1959501A (zh) | 显示器件 | |
CN1387074A (zh) | 液晶显示装置 | |
CN1523406A (zh) | 半透型液晶显示装置及其制造方法 | |
CN1841138A (zh) | 电光装置、布线基板的安装方法及电子设备 | |
CN1262746A (zh) | 液晶装置及电子设备 | |
CN1213334C (zh) | 电光装置用基板及其制造方法、电光装置和电子装置 | |
CN1410802A (zh) | 液晶显示装置 | |
CN1385828A (zh) | 电光装置、驱动用ic及电子设备 | |
CN1892267A (zh) | 偏振膜、包括偏振膜的液晶显示器及其制造方法 | |
CN1335943A (zh) | 反射型及半透射反射型液晶装置以及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160612 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: Hongkong, China Patentee before: BOE Technology (Hongkong) Co.,Ltd. Effective date of registration: 20160612 Address after: Hongkong, China Patentee after: BOE Technology (Hongkong) Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
CX01 | Expiry of patent term |
Granted publication date: 20050601 |
|
CX01 | Expiry of patent term |