CN119458915A - Chip sealing dam preparation method, device, equipment and medium - Google Patents
Chip sealing dam preparation method, device, equipment and medium Download PDFInfo
- Publication number
- CN119458915A CN119458915A CN202510039747.6A CN202510039747A CN119458915A CN 119458915 A CN119458915 A CN 119458915A CN 202510039747 A CN202510039747 A CN 202510039747A CN 119458915 A CN119458915 A CN 119458915A
- Authority
- CN
- China
- Prior art keywords
- printing
- target
- dam
- printing head
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ink Jet (AREA)
Abstract
The invention relates to the technical field of chip packaging and discloses a method, a device, equipment and a medium for preparing a chip sealing dam, wherein the method comprises the steps of obtaining a dam parameter, and determining a plurality of target edges and a plurality of target angles according to the dam parameter; the method comprises the steps of controlling a printing head to rotate to a preset starting position, controlling a loading mechanism to rotate, sequentially enabling a plane where the printing head is located to be perpendicular to a plurality of target sides, moving the printing head according to a first preset track requirement to finish printing of the target sides in the surrounding dam, controlling the loading mechanism to rotate, sequentially enabling the printing head to be in the same plane with the central line of a plurality of target angles, and moving the printing head according to a second preset track requirement to finish printing of the target angles in the surrounding dam. According to the invention, the edge and the corner of the box dam are printed respectively to finally form a closed structure, so that the sealing printing of the box dam in the sample wall is realized, the sealing effect is good, the box dam is suitable for laminating printing of different box dam heights, the printing is more flexible and saves space, and the sealing requirement of the box dam with high density and small size is met.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a method, a device, equipment and a medium for preparing a chip sealing dam.
Background
In the field of electronic packaging, a sealed cavity is often required to be constructed in some specific scenes, and the purpose of selective sealing can be achieved by matching with a mold. At present, under the subsequent underfill process in the radio frequency module, the filling glue needs to be ensured not to enter the hollow area, so that the influence on the middle chip and the packaging structure is avoided. The traditional dam scheme is to paste prefabricated metal structural parts at the edge of a target area, then fill gaps between the metal structural parts and the patch structures by using a glue dispensing method to form an isolation dam, however, the size of the packaging structure of a chip is enlarged due to the fact that the size of the packaging structure of the chip is enlarged due to the fact that the packaging structure cannot meet the packaging requirements of high density and small size, and no good manufacturing method exists for manufacturing the inner dam currently.
Disclosure of Invention
In view of the above, the invention provides a method, a device, equipment and a medium for preparing a chip sealing dam, which are used for solving the problem that the existing chip sealing dam technology cannot meet the requirements of high-density and small-size packaging.
In a first aspect, the present invention provides a method of preparing a chip-sealing dam, printing material being extruded from a printhead to form the dam inside a sample wall on a loading mechanism, the method comprising:
acquiring a dam parameter, and determining a plurality of target edges and a plurality of target angles according to the dam parameter;
Controlling the printing head to rotate to a preset starting position;
The loading mechanism is controlled to rotate, a plurality of target edges are sequentially perpendicular to the plane where the printing head is located, the printing head is moved according to the first preset track requirement, and printing of the target edges in the dam is completed;
And controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
According to the preparation method of the chip sealing dam, the edges and the corners of the dam are printed respectively to finally form the closed structure, so that sealing printing of the dam in the sample wall is realized, the sealing effect is good, the method is suitable for laminating printing of different dam heights, printing is more flexible and saves space, and the sealing requirements of the dam with high density and small size are met.
In an alternative embodiment, moving the print head according to a first predetermined trajectory requirement to complete printing of the target edge in the dam includes:
determining the dam height according to the dam parameters, and determining the printing layer number according to the dam height and the preset layer height;
If the number of printing layers is 1, determining a printing starting point and a printing end point of a target edge according to a first preset offset distance and a second preset offset distance, and controlling a printing head to perform single printing of the target edge from the printing starting point to the printing end point, wherein the first preset offset distance is a vertical distance between the printing starting point of the target edge and a corresponding sample wall edge, and the second preset offset distance is a vertical distance between the printing starting point of the target edge and a corresponding sample wall edge of an adjacent target edge;
If the number of printing layers is greater than 1, determining a printing starting point and a printing end point corresponding to each printing layer on the target side according to the first preset offset distance and the second preset offset distance, and controlling the printing head to perform reciprocating printing between the printing starting point and the printing end point corresponding to each printing layer.
In an alternative embodiment, controlling the print head to print reciprocally between a print start point and a print end point corresponding to each print layer includes:
Printing of each layer is completed from the printing starting point to the printing end point of each layer in sequence according to the sequence that the plane distance from the loading mechanism is from small to large;
the distance between the printing start point of the current layer and the printing end point of the previous layer is the lifting height between the layers.
According to the preparation method of the chip sealing dam, multi-layer edge printing is achieved through reciprocating motion, the space occupation of the high dam is small, the packaging requirements of high density and small size can be met, the print head is prevented from being damaged by collision between the print head and the sample wall through setting two offset distances between the print head and the sample wall when the target edge is printed, the safety of the printing process is improved, and meanwhile the accuracy and the integrity of edge printing are guaranteed.
In an alternative embodiment, moving the print head in accordance with a second predetermined trajectory requirement to effect printing of the target angle in the dam includes:
Determining the dam surrounding height according to the dam surrounding parameters;
if the number of printing layers is 1, printing for one time according to the position of the target angle;
If the number of printing layers is greater than 1, controlling the printing head to lift and print according to the position of the target angle and the height of the surrounding dam.
In an alternative embodiment, the position of the target angle and the height of the surrounding dam control the printing head to print in a lifting mode, comprising:
Determining a lifting starting point and a lifting ending point of the printing head according to the position of the target angle and the height of the dam;
Controlling the printing head to move to a lifting starting point, and discharging for a preset time;
and controlling the printing head to perform lifting printing from the lifting starting point to the lifting ending point according to the preset discharging speed and the printing head moving speed.
The preparation method of the chip sealing dam is suitable for single-layer or multi-layer printing, meets the printing requirements of different dam heights, saves the space of a high dam, adopts a mode of lifting and discharging to perform corner printing, realizes sealing filling of connected edges, and improves the sealing performance of the dam.
In an alternative embodiment, the loading mechanism is controlled to rotate, so that a plurality of target edges are perpendicular to a plane where the printing head is located in sequence, the printing head is moved according to a first preset track requirement, and printing of the target edges in the dam is completed, including:
Controlling the loading mechanism to rotate to enable the initial target edge to be perpendicular to the plane where the printing head is located, and calculating the rotation angle of the rest target edges relative to the initial target edge;
sorting the other target edges from small to large according to the rotation angle of the other target edges relative to the initial target edge to obtain an edge sorting result;
and according to the edge sequencing result, sequentially enabling the other target edges to be perpendicular to the plane where the printing head is located, and moving the printing head according to the first preset track requirement to finish printing of the target edges in the surrounding dam.
In an alternative embodiment, the target angle is not less than 90 °, the loading mechanism is controlled to rotate, the central lines of the target angles and the printing head are sequentially located in the same plane, the printing head is moved according to the second preset track requirement, and printing of the target angle in the dam is completed, including:
controlling the loading mechanism to rotate so that the central line of the initial target angle and the printing head are in the same plane, and calculating the rotation angles of the central lines of the other target angles relative to the central line of the initial target angle;
sorting the rest target angles from small to large according to the rotation angle of the rest target angle central line relative to the initial target angle central line, and obtaining an angle sorting result;
and according to the angle sequencing result, sequentially enabling the central lines of the other target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the surrounding dam.
According to the preparation method of the chip sealing surrounding dam, the shape of the surrounding dam can be any shape, only the condition that the target angle is not smaller than 90 degrees is met, the adjacent sides are prevented from interfering with the printing head, the integrity of the surrounding dam and the tightness of the adjacent sides are guaranteed, the rotation angles of the other target sides and the initial target sides are calculated, the other target sides are printed according to the sequence of the rotation angles from small to large, the rotation angles of the other target angles and the initial target angles are calculated, the other target angles are printed according to the sequence of the rotation angles from small to large, the total rotation angle of the loading mechanism is enabled to be minimum, and the printing efficiency is improved.
In a second aspect, the present invention provides an apparatus for preparing a chip seal dam, printing material being extruded from a printhead to form a dam inside a sample wall on a loading mechanism, the apparatus comprising:
the parameter acquisition module is used for acquiring the parameters of the surrounding dam and determining a plurality of target edges and a plurality of target angles according to the parameters of the surrounding dam;
The printing head position initializing module is used for controlling the printing head to rotate to a preset starting position;
the edge printing module is used for controlling the loading mechanism to rotate, sequentially enabling a plurality of target edges to be perpendicular to the plane where the printing head is located, moving the printing head according to the first preset track requirement, and finishing printing of the target edges in the dam;
And the angle printing module is used for controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
In a third aspect, the invention provides a computer device comprising a memory and a processor, the memory and the processor being communicatively coupled to each other, the memory having stored therein computer instructions, the processor executing the computer instructions to perform the method of the first aspect or any of its corresponding embodiments.
In a fourth aspect, the present invention provides a computer readable storage medium having stored thereon computer instructions for causing a computer to perform the method of the first aspect or any of its corresponding embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of several prior art printing methods of a chip-sealed internal dam;
FIG. 2 is a schematic flow chart of a method for manufacturing a chip sealing dam according to an embodiment of the invention;
FIG. 3 is a schematic diagram of the positions of a target edge and a target angle in a method for manufacturing a chip sealing dam according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing the printing effect of a target edge in a method for manufacturing a chip sealing dam according to an embodiment of the present invention;
FIG. 5 is a schematic diagram showing the printing effect of a target corner in a method for manufacturing a chip sealing dam according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a print ordering of each target edge of an irregular dam in a method of fabricating a chip seal dam according to an embodiment of the present invention;
FIG. 7 is a schematic flow chart of another method for manufacturing a chip sealing dam according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of two preset offset distances of a target edge in a method for fabricating a chip sealing dam according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a print head trace during target edge lamination printing in a method of fabricating a chip seal dam according to an embodiment of the present invention;
FIG. 10 is a schematic view of a preset offset distance for target corner printing in a method of fabricating a chip seal dam according to an embodiment of the present invention;
FIG. 11 is a schematic illustration of a single layer printing effect in one embodiment of a method of fabricating a chip seal dam according to an embodiment of the present invention;
FIG. 12 is a block diagram of a chip seal dam preparation apparatus according to an embodiment of the present invention;
Fig. 13 is a schematic diagram of a hardware structure of a computer device according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, several prior art printing methods are used to chip seal the internal dams. The common sealant dispensing mode is vertical dispensing (shown in a of fig. 1), the sealing height and the line width are not required, and the feasibility of the sealing of the peripheral dam can be ensured by reserving a position for dispensing in design. However, this approach generally wastes a large area, and the device density is reduced, which gradually fails to meet the current design direction requirements of miniaturized and densely packed products. In addition, as for the internal dam, since the cavity is usually provided with a functional area, enough position allowance is difficult to be reserved in design for filling sealing glue, the mobility of the glue is limited, and the glue with a certain shape retention is selected, and as the glue dispensing head is provided with a wall thickness, even if a thin-wall glass needle is used, the sealing material and the structure to be sealed cannot be thoroughly sealed due to the fact that the dam (formed by the sealing material) is not tightly attached to the wall of a sample (the structure to be sealed).
The material with conformality is selected, the precise adhesion of the sealing material and the structure to be sealed can be ensured by tilting the printing head, but the novel problem exists that the printing end point and the printing start point need to be closed to form a complete graph, and the shape of the start point is necessarily destroyed when the end point is caused by the reason that the printing head has the wall thickness. If the next adjacent edge is printed after the single-side solidification, the solidified single-side end point interferes with the starting point of the next adjacent edge, a gap exists, and the sealing can not be realized (shown as c in fig. 1), on the other hand, the inclined printing of the box dam is required to have a rotating function on a printing head or a bottom supporting structure, and the adoption of the bottom rotating to-be-processed area and the bottom supporting structure is required to satisfy the condition that the three are positioned in the same rotating center (shown as d in fig. 1), otherwise, the angular speed is the same, but the linear speeds of different parts are different, so that the line width is inconsistent, and the method cannot be applied to array products.
Based on the above problems, the embodiment of the invention provides a method for preparing a chip sealing dam, which prints the edges and corners of the dam to finally form a closed structure so as to achieve the effect that the prepared sealing dam meets the requirements of high-density and small-size packaging.
In accordance with an embodiment of the present invention, there is provided a method embodiment for fabricating a chip seal dam, it being noted that the steps illustrated in the flowchart of the figures may be performed in a computer system, such as a set of computer executable instructions, and that although a logical sequence is illustrated in the flowchart, in some cases the steps illustrated or described may be performed in a different order than that illustrated herein.
In this embodiment, a method for manufacturing a chip sealing dam is provided, which may be used in the above computer system, and fig. 2 is a flowchart of a method for manufacturing a chip sealing dam according to an embodiment of the present invention, as shown in fig. 2, where the flowchart includes the following steps:
step S101, obtaining the parameters of the surrounding dam, and determining a plurality of target edges and a plurality of target angles according to the parameters of the surrounding dam.
Specifically, the printing material is extruded from the printhead, forming a dam inside the sample wall on the loading mechanism. The sample wall corresponds to a die of the box dam, and the shape of the box dam is identical to that of the sample wall, so the sample wall has edges and corners corresponding to the box dam, as shown in fig. 3, taking a rectangular sample wall as an example, the sample wall is composed of four edges (S1, S2, S3, S4) and four corners (A1, A2, A3, A4), wherein the included angle of the first target edge S1 and the second target edge S2 is the first target angle A1, the included angle of the second target edge S2 and the third target edge S3 is the second target angle A2, the included angle of the third target edge S3 and the fourth target edge S4 is the third target angle A3, and the included angle of the fourth target edge S4 and the first target edge S1 is the fourth target angle A4, but not limited thereto. The dam parameters include the height, width, distance between each side and the chip, and the like of the dam besides the target side and the target angle, and in this embodiment, the height of the dam is not greater than the height of the sample wall, and the width of the dam and the distance between each side and the chip of the dam can be determined according to practical situations, so that the dam packaging requirement can be met, which is only by way of example, but not by way of limitation.
In some alternative embodiments, the target angle is not less than 90 °.
Specifically, the prepared pattern of the weirs is not limited to a rectangle, and any pattern having an internal angle (target angle) of not less than 90 ° may be used. Because the interior angle is less than 90 °, two adjacent edges interfere with the printhead when printing by the rotary loading mechanism.
According to the method for manufacturing the chip sealing dam, the shape of the dam can be any shape, and only the condition that the target angle is not smaller than 90 degrees is met, the adjacent sides are prevented from interfering with the printing head, and the integrity of the dam and the tightness of the adjacent sides are guaranteed.
In step S102, the print head is controlled to rotate to a preset starting position.
Specifically, a proper preset starting position can be selected in advance by manually moving the printing head, so that the printing head is ensured not to collide with other objects, and the printing head can conveniently reach the printing position from the preset starting position, and starts to move and print tasks from the preset starting position. The printer head forms an included angle of 30 degrees with the vertical direction when the printer head is at a preset starting position, and the preset starting position and the posture of the printer head at the starting position are kept unchanged in the whole printing process.
Step S103, controlling the loading mechanism to rotate, sequentially enabling the plurality of target edges to be perpendicular to the plane where the printing head is located, moving the printing head according to the first preset track requirement, and finishing printing of the target edges in the dam.
Specifically, after the printing head reaches a fixed preset starting position, for the rectangular box dam, the loading mechanism is controlled to rotate, so that the plane where the printing head is located is perpendicular to the first target edge S1, when the printing head descends along the first target edge S1 to print, the relative position of the printing head and the sample wall edge corresponding to the first target edge S1 is ensured, and the accurate lamination of printing materials and the sample wall can be ensured. According to the first preset track requirement, controlling the printing head to move from a preset starting position to a printing starting point of a first target edge S1, then determining the discharging speed of the printing head and the moving speed of the printing head from the printing starting point to a printing ending point according to preset printing parameters, controlling the printing head to print to finish the first target edge S1 according to the printing parameters, and controlling the printing head to return to the preset starting position. After the first target side S1 is printed, the loading mechanism is rotated to sequentially make the second target side S2, the third target side S3 and the fourth target side S4 perpendicular to the plane where the print head is located, and printing of the remaining second target side S2, third target side S3 and fourth target side S4 is completed in the same manner as the printing of the first target side S1, so as to obtain a side printing effect diagram as shown in fig. 4.
Step S104, controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
Specifically, after printing of each target edge is completed, the loading mechanism is controlled to rotate, so that the printing head located at the preset starting position and the central line of the first target angle A1 are in the same plane, namely, in the projection direction, the printing head is parallel to the central line of the first target angle A1. And controlling the printing head to descend to a printing starting point of the first target angle, vertically and upwards pulling the printing head from the printing starting point according to preset printing parameters, and finishing printing of the first target angle A1 when the printing head reaches a printing ending point of the first target angle A1. And (3) rotating the loading mechanism to enable the central line of the second target angle A2, the central line of the third target angle A3 and the central line of the fourth target angle A4 to be respectively in the same plane with the printing head, and completing printing of the remaining second target angle A2, third target angle A3 and fourth target angle A4 in the same manner as the printing of the first target angle A1 to obtain an angle printing effect diagram shown in fig. 5, wherein the printing of the target angle is in a dotted line.
According to the preparation method of the chip sealing dam, the edge and the corner of the dam are printed to finally form the closed structure, so that sealing printing of the dam in the sample wall is realized, the sealing effect is good, the method is suitable for laminating printing of different dam heights, printing is more flexible and saves space, and the sealing requirements of the dam with high density and small size are met.
In some alternative embodiments, the step S103 includes:
and a1, controlling the loading mechanism to rotate, enabling the initial target edge to be perpendicular to the plane where the printing head is located, and calculating the rotation angle of the rest target edges relative to the initial target edge.
Specifically, the dam to be prepared is polygonal, the initial target side can be any side, when printing is started, the initial target side is vertical to the plane where the printing head is positioned, and the initial target side is printed first. The rotation angle of the remaining target side with respect to the initial target side means a rotation angle at which the loading mechanism needs to rotate when the remaining target side is made to be in the same angular direction as the initial target side.
And a2, sorting the rest target edges from small to large according to the rotation angle of the rest target edges relative to the initial target edges, and obtaining an edge sorting result.
Specifically, in order to ensure that the total rotation angle of the loading mechanism is minimum, the rest target edges are ordered from small to large according to the rotation angle, and an edge ordering result is obtained.
As shown in FIG. 6, the dam to be printed is in the shape of an irregular polygon, and the initial target side is labeled "1", and the rotation angles of the remaining target sides and the initial target side are respectively 2-90 degrees, 3-0 degrees, 4-90 degrees, 5-180 degrees, and 6-270 degrees, so that the side sorting result is 1-3-2-4-5-6, which is only by way of example, but not by way of limitation.
And a3, according to the edge sequencing result, sequentially enabling the other target edges to be perpendicular to the plane where the printing head is located, and moving the printing head according to the first preset track requirement to finish printing of the target edges in the dam.
Specifically, as shown in fig. 6, after the initial target edge is printed, the target edge with the reference number "3" is directly printed without rotating the loading mechanism, then the loading mechanism is rotated 90 ° counterclockwise, and the target edges with the reference numbers "2" and "4" are printed, so that the printing of the whole dam is completed in sequence, which is only by way of example, but not by way of limitation.
In some alternative embodiments, the step S104 includes:
And b1, controlling the loading mechanism to rotate, enabling the central line of the initial target angle to be in the same plane with the printing head, and calculating the rotation angles of the central lines of the rest target angles relative to the central line of the initial target angle.
Specifically, the dam to be prepared is polygonal, the initial target angle can be any one of inner angles, and when printing is started, the central line of the initial target angle and the printing head are in the same plane, and the initial target angle is printed first. The rotation angle of the remaining target angle centerline with respect to the initial target angle centerline refers to the rotation angle that the loading mechanism needs to rotate when the remaining target angle centerline is oriented in the same angular direction as the initial target angle centerline.
And b2, sorting the rest target angles from small to large according to the rotation angle of the rest target angle central line relative to the initial target angle central line, and obtaining an angle sorting result.
And b3, sequentially enabling the central lines of the other target angles to be in the same plane with the printing head according to the angle sequencing result, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
Specifically, the process of sorting and printing the target corners is similar to the process of sorting and printing the target edges, and will not be described here again.
According to the chip sealing dam preparation method provided by the embodiment, the edge rotation angles of the rest target edges and the initial target edges are calculated, the rest target edges are printed according to the sequence from small rotation angles to large rotation angles, the angle rotation angles of the rest target angles and the initial target angles are calculated, the rest target angles are printed according to the sequence from small rotation angles to large rotation angles, the total rotation angle of the loading mechanism is minimized, and the printing efficiency is improved.
In this embodiment, a method for manufacturing a chip sealing dam is provided, which may be used in the above-mentioned computer system, and fig. 7 is a flowchart of a method for manufacturing a chip sealing dam according to an embodiment of the present invention, as shown in fig. 7, where the flowchart includes the following steps:
Step S201, obtaining the parameters of the surrounding dam, and determining a plurality of target edges and a plurality of target angles according to the parameters of the surrounding dam. Please refer to step S101 in the embodiment shown in fig. 1 in detail, which is not described herein.
In step S202, the print head is controlled to rotate to a preset start position. Please refer to step S101 in the embodiment shown in fig. 1 in detail, which is not described herein.
And step S203, controlling the loading mechanism to rotate, sequentially enabling the plurality of target edges to be perpendicular to the plane where the printing head is located, and moving the printing head according to the first preset track requirement to finish printing of the target edges in the dam.
Specifically, the step S203 includes:
Step S2031, determining the dam height according to the dam parameters, and determining the printing layer number according to the dam height and the preset layer height.
Specifically, the dam parameters, such as dam height, total area, etc., are determined according to the chip size and packaging requirements of the center of the dam, and the preset layer height is related to the discharge cross section of the printhead, for example, the diameter of the discharge cross section of the printhead is 50 μm, then the preset layer height is 50 μm, and in the case of multi-layer printing, the difference in height of the printhead between adjacent layers is 50 μm, which is only an example, but not a limitation.
The height of the box dam and the height of the preset layer are determined, and the printing layer number is obtained by dividing the height of the box dam and the height of the preset layer, wherein the printing layer number=the height of the box dam, the height of the preset layer is larger than the height of the box dam, or the lifting height of each layer can be increased according to actual conditions because the laminated material possibly has some collapse.
In step S2032, if the number of printing layers is 1, determining a printing start point and a printing end point of the target edge according to a first preset offset distance and a second preset offset distance, and controlling the print head to perform single printing of the target edge from the printing start point to the printing end point, where the first preset offset distance is a vertical distance between the printing start point of the target edge and a corresponding sample wall edge, and the second preset offset distance is a vertical distance between the printing start point of the target edge and a corresponding sample wall edge of an adjacent target edge.
Specifically, if the number of printing layers is 1, only the bottom of the sample needs to be subjected to further sealing treatment. The height of the sample wall is 500 μm, the width of the dam is 150 μm, the height of the dam is 60 μm, the printing head with the discharge diameter of 150 μm is selected, and the printing line width is 150 μm when the printing head is 60 μm away from the bottom plate of the loading mechanism by adjusting printing parameters (printing material discharge speed, printing head moving speed and the like).
The loading mechanism is rotated to make the plane of the printing head vertical to the first target side S1, and the offset distance of each target side is set for ensuring that the printing head does not collide with the sample wall. As shown in fig. 8, the vertical distance between the print start point of the first target side S1 and the sample wall corresponding to the first target side S1 is a first preset offset distance, and the vertical distance between the print start point of the first target side S1 and the sample wall corresponding to the fourth target side S4 is a second preset offset distance. Similarly, the vertical distance between the printing end point of the first target side S1 and the sample wall corresponding to the first target side S1 is a first preset offset distance, and the vertical distance between the printing end point of the first target side S1 and the sample wall corresponding to the second target side S4 is a second preset offset distance. In the space coordinate system, the first target side S1 may be taken as the y axis, the fourth target side S4 may be taken as the x axis, and the first preset offset distance is the x offset distance, and the second preset offset distance is the y offset distance.
After the printing of the first target side S1 is completed, the loading mechanism is rotated so that the second target side S2 is used as the y axis, the first target side S1 is used as the x axis, and the printing start point and the printing end point of the second target side S2 are determined again according to the x offset distance and the y offset distance. The vertical distance between the printing start point of the second target side S2 and the sample wall corresponding to the second target side S2 is an x offset distance, the vertical distance between the printing start point of the second target side S2 and the sample wall corresponding to the first target side S1 is a y offset distance, the vertical distance between the printing end point of the second target side S2 and the sample wall corresponding to the second target side S2 is an x offset distance, and the vertical distance between the printing end point of the second target side S2 and the sample wall corresponding to the third target side S1 is a y offset distance. After the printing of the second target side S2 is completed, the loading mechanism is rotated, the third target side and the fourth target side are sequentially made to be the y axis, and the positions of the printing starting points of the third target side and the fourth target side are determined according to the x offset distance and the y offset distance.
Step S2033, if the number of print layers is greater than 1, determining a print start point and a print end point corresponding to each print layer on the target side according to the first preset offset distance and the second preset offset distance, and controlling the print head to perform reciprocating printing between the print start point and the print end point corresponding to each print layer.
Specifically, if the number of printing layers is greater than 1, the height of the sample wall is 500 μm, the height of the preset layer is 50 μm, then the worker needs to print 10 layers, the print head needs to reciprocate 5 times, the rest of the lines of each layer are identical except the height, as shown in fig. 9, the motion track diagram is shown when the print head prints the first target edge S1, and the lifting height of each layer is the preset layer height. The printing processes of the first target side S1, the second target side S2, the third target side S3, and the fourth target side S4 are the same, and will not be described here again.
In some optional embodiments, step S2033 includes:
and printing the layers sequentially from the printing starting point to the printing end point of each layer according to the sequence from small to large in the plane distance of the loading mechanism.
The distance between the printing start point of the current layer and the printing end point of the previous layer is the lifting height between the layers.
Specifically, after one target edge is printed repeatedly in multiple layers, the required height of the dam is achieved, and then the next adjacent target edge is printed in the same mode. For printing of each target side dam, starting from the plane of the loading mechanism, printing is performed reciprocally layer by layer, and the printing end point of the current layer is lifted by a preset height and then is the printing start point of the next layer, as shown in fig. 9.
According to the chip sealing dam preparation method provided by the embodiment, multi-layer edge printing is realized through reciprocating motion, the space occupation of the high dam is small, the packaging requirements of high density and small size can be met, the print head is prevented from being damaged by collision between the print head and the sample wall through setting two offset distances between the print head and the sample wall when the target edge is printed, the safety of the printing process is improved, and meanwhile the accuracy and the integrity of edge printing are guaranteed.
And S204, controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
Specifically, the step S204 includes:
And step S2041, determining the dam height according to the dam parameters.
Specifically, the method for determining the dam height and the number of printing layers is described in detail in step S2031, which is not described here again.
In step S2042, if the number of print layers is 1, single printing is performed according to the position of the target angle.
Specifically, if the number of printing layers is 1, the loading mechanism is controlled to rotate, the printing head and the central lines of the target angles are sequentially enabled to be in the same plane, the printing starting point of the target angle printing is determined according to the preset offset distance of the angle printing and the position of the target angle, discharging is started from the printing starting point, after discharging is started for a preset time, two adjacent target edges of the target angle are in sealing connection, discharging is stopped, and the printing head is lifted. As shown in fig. 10, the preset offset distance of the corner print is shown as the linear distance between the vertex of the target corner and the print head in the horizontal plane, and by setting the preset offset distance of the corner print, collision and interference between the corner print and the adjacent edge and the target wall are avoided, and meanwhile, the sealing performance of the print is ensured.
In step S2043, if the number of printing layers is greater than 1, the print head is controlled to perform lifting printing according to the position of the target angle and the dam height.
In some alternative embodiments, controlling the printhead to lift and print according to the target angle position and the dam height includes:
and determining a lifting starting point and a lifting ending point of the printing head according to the position of the target angle and the height of the dam.
Specifically, the lifting start point of the print head is determined according to the position of the target angle and the preset offset distance of the target angle, which is the same as the process of printing the target angle in the single layer in step S2042, and the lifting end point is determined according to the lifting start point and the height of the surrounding dam, which is the point of the lifting start point vertically upwards being the same as the height of the surrounding dam. The first preset offset distance and the second preset offset distance of the target side can be adjusted according to actual conditions, so that the prepared dam parameters meet the preparation requirements.
And controlling the printing head to move to a lifting starting point, and discharging for a preset time.
Specifically, when the target angle is printed, the printing head is controlled to move to the lifting starting point of the target angle, and then discharging and filling are carried out for preset time, so that the target angle and the loading mechanism bottom plate are sealed and filled.
And controlling the printing head to perform lifting printing from the lifting starting point to the lifting ending point according to the preset discharging speed and the printing head moving speed.
Specifically, according to the preset discharging speed and the printing head moving speed, the printing head is controlled to move and discharge from the lifting starting point to the lifting ending point for lifting printing. And after the final printing is finished, the height of each target angle is the same as the height of each target edge, and the heights of the target angles are all the heights of the dams.
The preparation method of the chip sealing dam is suitable for single-layer or multi-layer printing, meets the printing requirements of different dam heights, saves the space of a high dam, adopts a lifting and discharging mode to print corners, realizes sealing filling of connected edges, and improves the sealing performance of the dam.
In one embodiment, where the sample wall height is 500 μm, the dam width is required to be 150 μm, the dam height is required to be 60 μm, and the process of printing a single-layer dam on a rectangular sample wall comprises:
(1) And moving the printing head to a preset starting position, rotating the printing head until the printing head forms an included angle of 30 degrees with the vertical direction, and ensuring that the angle position of the printing head is not changed.
(2) The print head with a diameter of 150 μm is selected and printing parameters such as the material discharge size, the print head movement speed, etc. are adjusted so that the print line width is 150 μm when the print head is 60 μm from the base plate.
(3) Fixing the sample to the loading mechanism, rotating the loading mechanism so that the first target side S1 in the projection direction is perpendicular to the printing head, setting the side printing x offset distance of 65 mu m and the side printing y offset distance of 160 mu m for ensuring that the printing head does not collide with the sample, lowering the printing head to a height of 60 mu m from the bottom, moving the printing head according to the printing parameters in (2), lifting the printing head after printing, and moving the moving path as shown in figure 8.
(4) And (3) rotating the loading mechanism anticlockwise, sequentially enabling the second target side S2, the third target side S3 and the fourth target side S4 to be respectively identical to the first target side S1 in the step (3), and repeating the process of printing the first target side S1 to finish the printing of the four target sides.
(5) The rotary loading mechanism makes the projection direction downward, the printing head is parallel to the central line of the first target angle A1, the offset distance of the angle printing is 300 mu m, the printing head is lowered to 60 mu m from the bottom, the printing head is not moved to the lifting starting point without discharging, the single-layer printing does not need to do lifting action, and the printing head is lifted after the lifting starting point discharges for a period of time.
(6) And (3) sequentially enabling the second target angle A2, the third target angle A3 and the fourth target angle A4 to be respectively identical to the angle of the first target angle A1 in the step (5), and repeating the process of printing the first target angle A1 to finish printing of four target angles.
As shown in FIG. 11, in order to actually print a single-layer dam by using the dam manufacturing method provided by the embodiment, it can be seen that the target angle is in sealing connection with the adjacent edge, so that the printing precision is high, and the packaging requirements of high density and small size are met.
In another embodiment, where the sample wall height is 500 μm, the dam width is required to be 150 μm, the dam height is required to be 500 μm, and the process of printing a stacked internal dam on a rectangular sample wall includes:
(1) And moving the printing head to a preset starting position, rotating the printing head until the printing head forms an included angle of 30 degrees with the vertical direction, and ensuring that the angle position of the printing head is not changed.
(2) The print head with a diameter of 150 μm is selected and printing parameters such as the material discharge size, the print head movement speed, etc. are adjusted so that the print line width is 150 μm when the print head is 60 μm from the base plate.
(3) Fixing the sample to the loading mechanism, rotating the loading mechanism so that the first target side S1 in the projection direction is perpendicular to the printing head, setting the side printing x offset distance to be 50 mu m and the side printing y offset distance to be 160 mu m for ensuring that the printing head does not collide with the sample, lowering the printing head to be 60 mu m away from the bottom, moving the printing head according to the printing parameters in (2), printing 10 layers altogether, carrying out reciprocating motion 5 times, and lifting each layer by 50 mu m, wherein the total thickness=60+50x9=510 mu m, and the actual total thickness is smaller than 510 mu m due to the fact that the number of printing layers or the lifting height of each layer can be increased according to actual conditions.
(4) And (3) rotating the loading mechanism anticlockwise, sequentially enabling the second target side S2, the third target side S3 and the fourth target side S4 to be respectively identical to the first target side S1 in the step (3), and repeating the process of printing the first target side S1 to finish the lamination printing of the four target sides.
(5) The rotary loading mechanism makes the projection direction downward, the needle parallel to the central line of the first target angle A1, ① sets the angle printing offset distance, 300 μm, lowers the printing head to 60 μm height from the bottom, does not discharge the material, moves the printing head to the lifting starting point, lifts the printing head while discharging after a period of time from the lifting starting point, lifts the printing head to 500 μm height, then stops discharging, and lifts the printing head.
(6) And (3) sequentially enabling the second target angle A2, the third target angle A3 and the fourth target angle A4 to be respectively identical to the angle of the first target angle A1 in the step (5), and repeating the process of printing the first target angle A1 to finish the lamination printing of four target angles.
The embodiment also provides a device for preparing the chip sealing dam, which is used for realizing the embodiment and the preferred embodiment, and is not described again. As used below, the term "module" may be a combination of software and/or hardware that implements a predetermined function. While the means described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and contemplated.
This embodiment provides a chip seal dam preparation apparatus, as shown in fig. 12, in which a printing material is extruded from a printing head, and a dam is formed inside a sample wall on a loading mechanism, the apparatus comprising:
the parameter obtaining module 1201 is configured to obtain a dam parameter, and determine a plurality of target edges and a plurality of target angles according to the dam parameter.
A printhead position initialization module 1202 for controlling the printhead to rotate to a preset starting position.
The edge printing module 1203 is configured to control the loading mechanism to rotate, sequentially make the plurality of target edges perpendicular to the plane where the print head is located, and move the print head according to the first preset track requirement, so as to complete printing of the target edges in the dam.
And the angle printing module 1204 is used for controlling the loading mechanism to rotate, sequentially enabling the central lines of the plurality of target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
In some alternative embodiments, the edge print module 1203 includes:
The printing layer number determining unit is used for determining the dam surrounding height according to the dam surrounding parameters and determining the printing layer number according to the dam surrounding height and the preset layer height.
And the single-layer edge printing unit is used for determining a printing starting point and a printing end point of the target edge according to a first preset offset distance and a second preset offset distance if the number of printing layers is 1, controlling the printing head to perform single printing of the target edge from the printing starting point to the printing end point, wherein the first preset offset distance is the vertical distance between the printing starting point of the target edge and the corresponding sample wall edge, and the second preset offset distance is the vertical distance between the printing starting point of the target edge and the corresponding sample wall edge of the adjacent target edge.
And the laminated edge printing unit is used for determining a printing starting point and a printing end point corresponding to each printing layer of the target edge according to the first preset offset distance and the second preset offset distance if the number of printing layers is larger than 1, and controlling the printing head to perform reciprocating printing between the printing starting point and the printing end point corresponding to each printing layer.
In some alternative embodiments, the corner print module 1204 includes:
and the dam surrounding height determining unit is used for determining the dam surrounding height according to the dam surrounding parameters.
And the single-layer angle printing unit is used for carrying out single printing according to the position of the target angle if the number of printing layers is 1.
And the stacking angle printing unit is used for controlling the printing head to lift and print according to the position of the target angle and the height of the surrounding dam if the number of printing layers is greater than 1.
Further functional descriptions of the above respective modules and units are the same as those of the above corresponding embodiments, and are not repeated here.
The apparatus for preparing the sealing dam of the chip in this embodiment is presented as a functional unit, where the unit refers to an ASIC (Application SPECIFIC INTEGRATED Circuit) Circuit, a processor and a memory that execute one or more software or firmware, and/or other devices that can provide the above functions.
The embodiment of the invention also provides computer equipment, which is provided with the chip sealing dam preparation device shown in the figure 12.
Referring to fig. 13, fig. 13 is a schematic structural diagram of a computer device according to an alternative embodiment of the present invention, and as shown in fig. 13, the computer device includes one or more processors 10, a memory 20, and interfaces for connecting the components, including a high-speed interface and a low-speed interface. The various components are communicatively coupled to each other using different buses and may be mounted on a common motherboard or in other manners as desired. The processor may process instructions executing within the computer device, including instructions stored in or on memory to display graphical information of the GUI on an external input/output device, such as a display device coupled to the interface. In some alternative embodiments, multiple processors and/or multiple buses may be used, if desired, along with multiple memories and multiple memories. Also, multiple computer devices may be connected, each providing a portion of the necessary operations (e.g., as a server array, a set of blade servers, or a multiprocessor system). One processor 10 is illustrated in fig. 13.
The processor 10 may be a central processor, a network processor, or a combination thereof. The processor 10 may further include a hardware chip, among others. The hardware chip may be an application specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general-purpose array logic, or any combination thereof.
Wherein the memory 20 stores instructions executable by the at least one processor 10 to cause the at least one processor 10 to perform the methods shown in implementing the above embodiments.
The memory 20 may include a storage program area that may store an operating system, application programs required for at least one function, and a storage data area that may store data created according to the use of the computer device, etc. In addition, the memory 20 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, memory 20 may optionally include memory located remotely from processor 10, which may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The memory 20 may comprise volatile memory, such as random access memory, or nonvolatile memory, such as flash memory, hard disk or solid state disk, or the memory 20 may comprise a combination of the above types of memory.
The computer device also includes a communication interface 30 for the computer device to communicate with other devices or communication networks.
The embodiments of the present invention also provide a computer readable storage medium, and the method according to the embodiments of the present invention described above may be implemented in hardware, firmware, or as a computer code which may be recorded on a storage medium, or as original stored in a remote storage medium or a non-transitory machine readable storage medium downloaded through a network and to be stored in a local storage medium, so that the method described herein may be stored on such software process on a storage medium using a general purpose computer, a special purpose processor, or programmable or special purpose hardware. The storage medium may be a magnetic disk, an optical disk, a read-only memory, a random-access memory, a flash memory, a hard disk, a solid state disk, or the like, and further, the storage medium may further include a combination of the above types of memories. It will be appreciated that a computer, processor, microprocessor controller or programmable hardware includes a storage element that can store or receive software or computer code that, when accessed and executed by the computer, processor or hardware, implements the methods illustrated by the above embodiments.
Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope of the invention as defined by the appended claims.
Claims (10)
1. A method of preparing a chip seal dam, wherein a printing material is extruded from a printhead to form a dam inside a sample wall on a loading mechanism, the method comprising:
Acquiring a dam parameter, and determining a plurality of target edges and a plurality of target angles according to the dam parameter;
Controlling the printing head to rotate to a preset starting position;
the loading mechanism is controlled to rotate, a plurality of target edges are sequentially perpendicular to the plane where the printing head is located, the printing head is moved according to the first preset track requirement, and printing of the target edges in the dam is completed;
And controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
2. The method of claim 1, wherein moving the printhead to the first predetermined trajectory is required to complete printing of the target edge in the dam, comprising:
determining the dam height according to the dam parameters, and determining the printing layer number according to the dam height and the preset layer height;
If the number of printing layers is 1, determining a printing starting point and a printing end point of a target edge according to a first preset offset distance and a second preset offset distance, and controlling a printing head to perform single printing of the target edge from the printing starting point to the printing end point, wherein the first preset offset distance is a vertical distance between the printing starting point of the target edge and a corresponding sample wall edge, and the second preset offset distance is a vertical distance between the printing starting point of the target edge and the corresponding sample wall edge of an adjacent target edge;
If the number of printing layers is greater than 1, determining a printing starting point and a printing end point corresponding to each printing layer on the target side according to the first preset offset distance and the second preset offset distance, and controlling the printing head to perform reciprocating printing between the printing starting point and the printing end point corresponding to each printing layer.
3. The method of claim 2, wherein controlling the printhead to print reciprocally between a print start point and a print end point corresponding to each print layer comprises:
Printing of each layer is completed from the printing starting point to the printing end point of each layer in sequence according to the sequence that the plane distance from the loading mechanism is from small to large;
the distance between the printing start point of the current layer and the printing end point of the previous layer is the lifting height between the layers.
4. The method of claim 1, wherein moving the printhead to the second predetermined trajectory requirement to effect printing of the target angle in the dam comprises:
Determining the dam surrounding height according to the dam surrounding parameters;
if the number of printing layers is 1, printing for one time according to the position of the target angle;
If the number of printing layers is greater than 1, controlling the printing head to lift and print according to the position of the target angle and the height of the surrounding dam.
5. The method of claim 4, wherein the target angle position and dam height control printhead lift printing comprises:
Determining a lifting starting point and a lifting ending point of the printing head according to the position of the target angle and the height of the dam;
Controlling the printing head to move to a lifting starting point, and discharging for a preset time;
and controlling the printing head to perform lifting printing from the lifting starting point to the lifting ending point according to the preset discharging speed and the printing head moving speed.
6. The method of claim 1, wherein controlling the loading mechanism to rotate sequentially moves the print head in a first predetermined trajectory perpendicular to a plane in which the print head is located, and printing the target edge in the dam comprises:
controlling the loading mechanism to rotate, enabling the initial target edge to be perpendicular to the plane where the printing head is located, and calculating the rotation angle of the rest target edges relative to the initial target edge;
sorting the other target edges from small to large according to the rotation angle of the other target edges relative to the initial target edge to obtain an edge sorting result;
and according to the edge sequencing result, sequentially enabling the other target edges to be perpendicular to the plane where the printing head is located, and moving the printing head according to the first preset track requirement to finish printing of the target edges in the surrounding dam.
7. The method of claim 1, wherein the target angle is not less than 90 °, the loading mechanism is controlled to rotate, the centerlines of the plurality of target angles are sequentially aligned with the print head, the print head is moved according to a second predetermined trajectory requirement, and printing of the target angle in the dam is completed, comprising:
controlling the loading mechanism to rotate, enabling the central line of the initial target angle to be in the same plane with the printing head, and calculating the rotation angle of the central line of the rest target angles relative to the central line of the initial target angle;
Sorting the rest target angles from small to large according to the rotation angle of the rest target angle central line relative to the initial target angle central line, and obtaining an angle sorting result;
and according to the angle sequencing result, sequentially enabling the central lines of the other target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the surrounding dam.
8. A chip seal dam preparation apparatus in which a printing material is extruded from a print head to form a dam inside a sample wall on a loading mechanism, the apparatus comprising:
the parameter acquisition module is used for acquiring the dam parameters and determining a plurality of target edges and a plurality of target angles according to the dam parameters;
The printing head position initializing module is used for controlling the printing head to rotate to a preset starting position;
the edge printing module is used for controlling the loading mechanism to rotate, sequentially enabling a plurality of target edges to be perpendicular to the plane where the printing head is located, moving the printing head according to the first preset track requirement, and finishing printing of the target edges in the dam;
And the angle printing module is used for controlling the loading mechanism to rotate, sequentially enabling the central lines of the target angles to be in the same plane with the printing head, and moving the printing head according to the second preset track requirement to finish printing of the target angles in the dam.
9. A computer device, comprising:
a memory and a processor in communication with each other, the memory having stored therein computer instructions which, upon execution, cause the processor to perform the method of any of claims 1 to 7.
10. A computer readable storage medium having stored thereon computer instructions for causing a computer to perform the method of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510039747.6A CN119458915B (en) | 2025-01-10 | A chip sealing dam preparation method, device, equipment and medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510039747.6A CN119458915B (en) | 2025-01-10 | A chip sealing dam preparation method, device, equipment and medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119458915A true CN119458915A (en) | 2025-02-18 |
| CN119458915B CN119458915B (en) | 2025-04-11 |
Family
ID=
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006013553A (en) * | 2005-09-22 | 2006-01-12 | Renesas Technology Corp | Semiconductor ic device |
| JP2010125757A (en) * | 2008-11-28 | 2010-06-10 | Mimaki Engineering Co Ltd | Inkjet printer |
| WO2016149032A1 (en) * | 2015-03-13 | 2016-09-22 | President And Fellows Of Harvard College | Printhead and method for 3d printing of multiple materials |
| KR101739683B1 (en) * | 2016-01-05 | 2017-05-24 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package using 3D printing technology and method for manufacturing the same |
| CN108748977A (en) * | 2018-05-16 | 2018-11-06 | 西安交通大学 | A kind of high pore structure is without supporting and space 3D printing device and Method of printing |
| CN208774066U (en) * | 2018-08-23 | 2019-04-23 | 东莞市群飞自动化设备有限公司 | 3D printer test equipment |
| US20190381739A1 (en) * | 2017-03-03 | 2019-12-19 | Zhuhai Sailner 3D Technology Co., Ltd. | Support structure, and printing method and printing system therefor |
| CN110757787A (en) * | 2019-11-18 | 2020-02-07 | 温州大学 | 3D printer with online laser leveling detection device |
| US20220009163A1 (en) * | 2012-08-29 | 2022-01-13 | Continuous Composites Inc. | Control methods for additive manufacturing system |
| US11343904B1 (en) * | 2020-06-08 | 2022-05-24 | United States Of America As Represented By The Administrator Of Nasa | Multi-functional nanomaterial sensor platform |
| CN114571725A (en) * | 2022-03-03 | 2022-06-03 | 芯体素(杭州)科技发展有限公司 | Printing equipment of LED encapsulation barricade |
| CN115632032A (en) * | 2022-12-21 | 2023-01-20 | 芯体素(杭州)科技发展有限公司 | Electronic device packaging structure and manufacturing method thereof |
| CN117690811A (en) * | 2023-12-14 | 2024-03-12 | 芯体素(杭州)科技发展有限公司 | Method and device for controlling size of dam packaging and electronic equipment |
| WO2024114256A1 (en) * | 2022-11-29 | 2024-06-06 | 珠海赛纳三维科技有限公司 | 3d ink-jet printing device, and model material utilization amount determination method and apparatus |
| CN118437576A (en) * | 2024-04-26 | 2024-08-06 | 芯体素(杭州)科技发展有限公司 | Chip dispensing method and device thereof |
| US20240332144A1 (en) * | 2023-03-29 | 2024-10-03 | Nexperia B.V. | Method for manufacturing a semiconductor package assembly as well as a semiconductor package assembly obtained with this method |
| WO2024244723A1 (en) * | 2023-05-26 | 2024-12-05 | 深圳市创想三维科技股份有限公司 | 3d printing method, electronic device, and computer readable storage medium |
| US20240416590A1 (en) * | 2022-09-15 | 2024-12-19 | Xi’an Jiaotong University | Composite Manufacturing Method based on Powder Bed and Five-Axis Additive and Subtractive Materials |
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006013553A (en) * | 2005-09-22 | 2006-01-12 | Renesas Technology Corp | Semiconductor ic device |
| JP2010125757A (en) * | 2008-11-28 | 2010-06-10 | Mimaki Engineering Co Ltd | Inkjet printer |
| US20220009163A1 (en) * | 2012-08-29 | 2022-01-13 | Continuous Composites Inc. | Control methods for additive manufacturing system |
| WO2016149032A1 (en) * | 2015-03-13 | 2016-09-22 | President And Fellows Of Harvard College | Printhead and method for 3d printing of multiple materials |
| KR101739683B1 (en) * | 2016-01-05 | 2017-05-24 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package using 3D printing technology and method for manufacturing the same |
| US20190381739A1 (en) * | 2017-03-03 | 2019-12-19 | Zhuhai Sailner 3D Technology Co., Ltd. | Support structure, and printing method and printing system therefor |
| CN108748977A (en) * | 2018-05-16 | 2018-11-06 | 西安交通大学 | A kind of high pore structure is without supporting and space 3D printing device and Method of printing |
| CN208774066U (en) * | 2018-08-23 | 2019-04-23 | 东莞市群飞自动化设备有限公司 | 3D printer test equipment |
| CN110757787A (en) * | 2019-11-18 | 2020-02-07 | 温州大学 | 3D printer with online laser leveling detection device |
| US11343904B1 (en) * | 2020-06-08 | 2022-05-24 | United States Of America As Represented By The Administrator Of Nasa | Multi-functional nanomaterial sensor platform |
| CN114571725A (en) * | 2022-03-03 | 2022-06-03 | 芯体素(杭州)科技发展有限公司 | Printing equipment of LED encapsulation barricade |
| US20240416590A1 (en) * | 2022-09-15 | 2024-12-19 | Xi’an Jiaotong University | Composite Manufacturing Method based on Powder Bed and Five-Axis Additive and Subtractive Materials |
| WO2024114256A1 (en) * | 2022-11-29 | 2024-06-06 | 珠海赛纳三维科技有限公司 | 3d ink-jet printing device, and model material utilization amount determination method and apparatus |
| CN115632032A (en) * | 2022-12-21 | 2023-01-20 | 芯体素(杭州)科技发展有限公司 | Electronic device packaging structure and manufacturing method thereof |
| US20240332144A1 (en) * | 2023-03-29 | 2024-10-03 | Nexperia B.V. | Method for manufacturing a semiconductor package assembly as well as a semiconductor package assembly obtained with this method |
| WO2024244723A1 (en) * | 2023-05-26 | 2024-12-05 | 深圳市创想三维科技股份有限公司 | 3d printing method, electronic device, and computer readable storage medium |
| CN117690811A (en) * | 2023-12-14 | 2024-03-12 | 芯体素(杭州)科技发展有限公司 | Method and device for controlling size of dam packaging and electronic equipment |
| CN118437576A (en) * | 2024-04-26 | 2024-08-06 | 芯体素(杭州)科技发展有限公司 | Chip dispensing method and device thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李仲明;李斌;武思蕊;赵梁成;: "基于3D打印技术制造柔性传感器研究进展", 化工进展, no. 05, 5 May 2020 (2020-05-05), pages 234 - 242 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6898235B2 (en) | Manufacturing method, manufacturing equipment, data processing method, data processing equipment, data carrier | |
| US10434717B2 (en) | Fabricating three-dimensional objects with overhang | |
| US8784723B2 (en) | Method and system for three-dimensional fabrication | |
| US7369915B2 (en) | Device, system and method for accurate printing of three dimensional objects | |
| JP3436705B2 (en) | How to form a three-dimensional object | |
| US9751261B2 (en) | Stereolithography machine for producing a three-dimensional object and stereolithograpy method applicable to said machine | |
| US8172562B2 (en) | Device and method for producing a three-dimensional object by means of a generative production method | |
| CN113681898B (en) | Three-dimensional object printing method, data processing device and computer equipment | |
| US20130287933A1 (en) | Three-dimensional (3d) printing | |
| EP3575061B1 (en) | Three-dimensional printing device | |
| EP3219470B1 (en) | Three dimensional printing apparatus | |
| JP6728415B2 (en) | Method for improving flatness of 3D printing surface | |
| JP2018517594A (en) | Apparatus and method for applying a flowable material on a stage rotatable about a rotation axis | |
| US20140374949A1 (en) | Three-dimensional printing apparatus and pringing method thereof | |
| CN113522671B (en) | Dispensing control method and device | |
| US20180194070A1 (en) | 3d printing using preformed reuseable support structure | |
| CN119458915B (en) | A chip sealing dam preparation method, device, equipment and medium | |
| WO2018064892A1 (en) | Method and system for fixed-area printing of 3d object | |
| JP6498233B2 (en) | Three-dimensional printing apparatus and printing method therefor | |
| CN104890242A (en) | Coating type photocuring 3D printer and printing method thereof | |
| CN119458915A (en) | Chip sealing dam preparation method, device, equipment and medium | |
| US12226952B2 (en) | Additive manufacturing apparatus, system and method | |
| JP2018183890A (en) | Molding method for three-dimensional structure, molding apparatus for three-dimensional structure, and program for molding apparatus of three-dimensional structure | |
| CN108927990A (en) | Three-dimensional printing method | |
| CN113442438B (en) | Orthodontic model stacking and printing method and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |