CN119450184A - Chip driving assembly and camera module - Google Patents
Chip driving assembly and camera module Download PDFInfo
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- CN119450184A CN119450184A CN202310975127.4A CN202310975127A CN119450184A CN 119450184 A CN119450184 A CN 119450184A CN 202310975127 A CN202310975127 A CN 202310975127A CN 119450184 A CN119450184 A CN 119450184A
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- Prior art keywords
- circuit board
- movable
- chip
- package
- frame
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- 229910000679 solder Inorganic materials 0.000 claims description 20
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- 238000013519 translation Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 230000003014 reinforcing effect Effects 0.000 description 7
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- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a chip driving assembly and an image pickup module, wherein the chip driving assembly comprises a circuit board, a movable carrier, a packaging body and an anti-shake conductive part, the packaging body is integrally combined with the front surface of the circuit board, the movable carrier is attached to the attaching surface of the packaging body, the circuit board through holes of the circuit board, an optical window of the packaging body and the carrier through holes of the movable carrier correspond to each other, the anti-shake conductive part comprises a fixed circuit board, a movable circuit board and at least one flexible connecting part, the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connecting part is connected with the fixed circuit board, the inner end of the flexible connecting part is connected with the movable circuit board, the front surface of the movable circuit board is attached to the back surface of the circuit board, and the circuit board and the flexible connecting part are provided with overlapping parts so as to increase the attaching surface area of the packaging body for reliably attaching the movable carrier in a top view.
Description
Technical Field
The present disclosure relates to camera modules, and particularly to a chip driving assembly and a camera module.
Background
With the popularity of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices (e.g., smart phones) for helping users acquire images have been rapidly developed and advanced. Currently, in the market, consumers have increasingly high and diversified requirements on functions and performances of camera modules configured in mobile electronic devices, for example, consumers require the camera modules to have anti-shake functions. The reason is that when the handheld mobile electronic device is used for shooting, the imaging effect of the shooting module is reduced due to physiological tremble with a certain frequency and shake generated by movement of a human body under normal conditions, so that the mobile electronic device is generally configured with an anti-shake motor to drive an optical lens and/or a photosensitive chip to realize an anti-shake function. However, along with the development trend of the large image plane of the photosensitive chip, the requirement of the camera shooting module for the driving force of the anti-shake motor is higher and higher, and the current mobile electronic device needs to simultaneously satisfy the development trend of light and thin, which generates larger limitation on the size and volume of the camera shooting module, so that the anti-shake motor cannot be correspondingly increased along with the increase of the size of the photosensitive chip. Therefore, how to provide an image capturing module which can realize a good optical anti-shake function, has a smaller size and meets the trend of light and thin mobile electronic equipment is a technical problem which the inventor of the present invention aims to solve.
Disclosure of Invention
An objective of the present invention is to provide a chip driving assembly and a camera module, wherein the camera module can achieve a good optical anti-shake effect and has a smaller size so as to satisfy the development trend of light and thin mobile electronic devices.
An object of the present invention is to provide a chip driving assembly and an image pickup module, in which at least one frame of a circuit board of the chip driving assembly has a wide size such that at least one frame of a package body integrally coupled to the circuit board has a wide size, and thus, an area of a mounting surface of the package body can be increased to facilitate reliable and stable mounting of a movable carrier.
An object of the present invention is to provide a chip driving assembly and an image capturing module, in which an anti-shake conductive portion of the chip driving assembly provides a movable circuit board, a fixed circuit board surrounding the periphery of the movable circuit board, and at least one flexible conductive portion connecting between the movable circuit board and the fixed circuit board, the flexible conductive portion enables the movable circuit board and the circuit board connected to the movable circuit board to translate relative to the fixed circuit board, so as to provide basic conditions for realizing an optical anti-shake function, thereby improving imaging quality.
An object of the present invention is to provide a chip driving assembly and an image capturing module, in which the flexible connection part is bent between the movable circuit board and the fixed circuit board for a plurality of times to allow the flexible circuit board to deform along with the translation of the movable circuit board, and in this process, the reactive force generated by the flexible circuit board is small to avoid affecting the anti-shake effect of the image capturing module.
An object of the present invention is to provide a chip driving assembly and an image pickup module, in which an outer edge of the circuit board is located outside an outer edge of the movable wiring board on at least one side of the chip driving assembly, such that the circuit board has a wider size on the side of the chip driving assembly to increase a width dimension of the package on the side, thereby increasing an area of a top surface of the package.
An object of the present invention is to provide a chip driving assembly and an image capturing module, wherein the circuit board and the flexible connection part of the anti-shake conductive part have an overlapping portion in a top view, so as to facilitate increasing an area of a top surface of the package. Preferably, the circuit board and the fixed wiring board of the anti-shake conductive portion have overlapping portions.
It is an object of the present invention to provide a chip driving assembly and an image pickup module, in which in some embodiments, bonding positions of bonding pads of the circuit board and bonding pads of the photosensitive chip are provided with glue, so that not only solder can be protected, but also connection strength of the circuit board and the photosensitive chip can be enhanced, and stress of the bonding positions during dropping can be reduced.
An object of the present invention is to provide a chip driving assembly and an image pickup module, in which in some embodiments, a bonding position between a bonding pad of the movable circuit board and a bonding pad of the photosensitive chip is provided with glue, so that not only can solder be protected, but also the connection strength between the movable circuit board and the photosensitive chip is enhanced, and the stress of the bonding arrangement during dropping is reduced.
According to one aspect of the present invention, there is provided a chip driving assembly, comprising:
a circuit board having a circuit board through hole;
a movable carrier having a carrier perforation;
A driving unit configured to drive the movable carrier to move;
A package having an optical window and a mounting surface surrounding a top opening of the optical window, wherein the package is integrally bonded to a front surface of the circuit board, the movable carrier is mounted to the mounting surface of the package, the circuit board through-hole of the circuit board, the optical window of the package and the carrier through-hole of the movable carrier correspond to each other, and
The anti-shake conductive part comprises a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the periphery of the movable circuit board, the outer end of the flexible connection part is connected with the fixed circuit board, the inner end of the flexible connection part is connected with the movable circuit board, the front surface of the movable circuit board is mounted on the back surface of the circuit board, and the packaging body and the flexible connection part are provided with overlapping parts from the overlooking view.
According to an embodiment of the present invention, the package and the fixed wiring board have overlapping portions in a plan view.
According to one embodiment of the invention, the distance between the outer edge of the package and the central axis of the chip driving assembly is greater than the distance between the outer edge of the movable wiring board and the central axis of the chip driving assembly on at least one side of the chip driving assembly.
According to one embodiment of the invention, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the outer edge of the movable wiring board and the central axis of the chip driving assembly on at least one side of the chip driving assembly.
According to one embodiment of the invention, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the inner edge of the stationary circuit board and the central axis of the chip driving assembly on at least one side of the chip driving assembly.
According to one embodiment of the invention, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the inner edge of the stationary wiring board and the central axis of the chip driving assembly on each side of the chip driving assembly.
According to one embodiment of the invention, the outer end and the inner end of the flexible connection part are connected to non-corresponding sides of the fixed circuit board and the movable circuit board, respectively.
According to another aspect of the present invention, the present invention further provides an image capturing module, which includes:
a photosensitive chip;
An optical lens held in a photosensitive path of the photosensitive chip, and
A chip driving assembly, further comprising:
a circuit board having a circuit board through hole;
a movable carrier having a carrier perforation;
A package having an optical window and a mounting surface surrounding a top opening of the optical window, wherein the package is integrally bonded to a front surface of the circuit board, the movable carrier is mounted to the mounting surface of the package, the circuit board through-hole of the circuit board, the optical window of the package and the carrier through-hole of the movable carrier correspond to each other, and
The anti-shake conductive part comprises a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the periphery of the movable circuit board, the outer end of the flexible connection part is connected with the fixed circuit board, the inner end of the flexible connection part is connected with the movable circuit board, the front surface of the movable circuit board is mounted on the back surface of the circuit board, the circuit board and the flexible connection part are provided with overlapping parts in a overlook view, the photosensitive chip is positioned on the back surface of the circuit board, and the photosensitive chip is configured to translate along with the translation of the circuit board.
According to one embodiment of the present invention, the movable wiring board has a movable wiring board through hole, the movable wiring board through hole of the movable wiring board corresponds to the circuit board through hole of the circuit board, wherein the photosensitive chip is mounted on a back surface of the movable wiring board, and a photosensitive area of the photosensitive chip corresponds to the movable wiring board through hole of the movable wiring board.
According to one embodiment of the invention, the photosensitive chip is mounted on the back surface of the circuit board, and the photosensitive area of the photosensitive chip corresponds to the circuit board through hole of the circuit board.
According to one embodiment of the present invention, the pads of the movable wiring board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.
According to one embodiment of the present invention, the pads of the circuit board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.
According to one embodiment of the invention, bonding positions of the bonding pads of the movable wiring board and the bonding pads of the photosensitive chip are provided with glue.
According to one embodiment of the invention, bonding positions of the bonding pads of the circuit board and the bonding pads of the photosensitive chip are provided with glue.
Drawings
Fig. 1 is a schematic perspective view of an image capturing module according to a preferred embodiment of the present invention.
Fig. 2 is an exploded view of the camera module according to the above preferred embodiment of the present invention.
Fig. 3 is an exploded view of another view angle of the camera module according to the above preferred embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of the camera module according to the above preferred embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of the camera module according to another embodiment of the present invention.
Fig. 6 is an enlarged schematic view of a portion of fig. 5.
Fig. 7 is a schematic cross-sectional view of a modification of the camera module according to the above preferred embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view of another modification of the camera module according to the above preferred embodiment of the present invention.
Detailed Description
Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms "mounted," "connected," "supported," and "coupled" and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Furthermore, "connected" and "coupled" are not restricted to physical or mechanical connections or couplings.
Also, in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the azimuth or positional relationships indicated in the drawings, which are merely for convenience of description and to simplify the description, and do not denote or imply that the apparatus or elements in question must have a particular azimuth, be configured and operated in a particular azimuth, and thus the terms should not be construed as limiting the invention, and in the second aspect, the terms "a" and "an" should be construed as "at least one" or "one or more," i.e., in one embodiment, the number of one element may be one, while in another embodiment, the number of the element may be plural, and the term "a" should not be construed as limiting the number.
Referring to fig. 1 to 6 of the drawings, a camera module according to a preferred embodiment of the present invention will be disclosed and described in the following description, wherein the camera module includes a chip driving assembly 10, a photosensitive chip 20, and an optical lens 30, the photosensitive chip 20 is connected to the chip driving assembly 10, and the optical lens 30 is held in a photosensitive path of the photosensitive chip 20. The incident light reaches the photosensitive chip 20 after passing through the optical lens 30, and the photosensitive chip 20 performs photoelectric conversion to form an image, wherein the chip driving assembly 10 is configured to translate the photosensitive chip 20 to implement an optical anti-shake function of the camera module.
It should be noted that, the phrase "the chip driving assembly 10 is configured to translate the photosensitive chip 20" in the present invention means that the photosensitive chip 20 can drive the photosensitive chip 20 to move in a direction perpendicular to the optical axis of the camera module, so as to implement the optical anti-shake function of the camera module. For example, referring to fig. 1, the optical axis direction of the image capturing module is the Z-axis direction in the coordinate system, and the chip driving assembly 10 is configured to drive the photosensitive chip 20 to move along the X-axis and Y-axis directions, so as to implement the optical anti-shake function of the image capturing module.
Specifically, referring to fig. 2 to 5, the chip driving assembly 10 includes a circuit board 11, a package 12, an anti-shake conductive portion 13, and a movable carrier 14, wherein the circuit board 11 is mounted on the anti-shake conductive portion 13, the package 12 is integrally combined with the circuit board 11, and the movable carrier 14 is mounted on the package 12.
More specifically, the circuit board 11 has a circuit board front 111, a circuit board back 112, and a circuit board through hole 113, the circuit board front 111 and the circuit board back 112 corresponding to define a thickness dimension of the circuit board 11, the circuit board through hole 113 extending from the circuit board front 111 to the circuit board back 112, i.e., the circuit board through hole 113 penetrates opposite sides of the circuit board 11.
In some embodiments of the present invention, the circuit board 11 is a square board, for example, the projection pattern of the circuit board 11 on the projection plane perpendicular to the optical axis of the camera module may be square or rectangular, so that the circuit board 11 is a square board, and the circuit board through hole 113 of the circuit board 11 is a square through hole whose shape and size match those of the photosensitive area of the photosensitive chip 20, so that the circuit board 11 has four circuit board frames 114 connected end to end.
For ease of understanding and description, the four circuit board rims 114 of the circuit board 11 are sequentially defined as a circuit board first rim 1141, a circuit board second rim 1142, a circuit board third rim 1143, and a circuit board fourth rim 1144, the circuit board first rim 1141 and the circuit board third rim 1143 are located at a pair of opposite sides of the circuit board through hole 113 of the circuit board 11, the circuit board second rim 1142 and the circuit board fourth rim 1144 are located at another pair of opposite sides of the circuit board through hole 113 of the circuit board 11, and opposite ends of the circuit board first rim 1141 are respectively extended to be connected to one end of the circuit board second rim 1142 and one end of the circuit board fourth rim 1144, and opposite ends of the circuit board third rim 1143 are respectively extended to be connected to the other end of the circuit board second rim 1142 and the other end of the circuit board fourth rim 1144, the circuit board first rim 1141 and the circuit board fourth rim 1144 are formed around the circuit board 1142, the circuit board 1143 and the circuit board 1144.
The package 12 is integrally combined with the front surface 111 of the circuit board 11, the package 12 has an optical window 121 and a mounting surface 122 surrounding the top opening of the optical window 121, the optical window 121 of the package 12 corresponds to the through hole 113 of the circuit board 11, the incident light entering the camera module through the optical lens 30 reaches the photosensitive chip 20 after sequentially passing through the optical window 121 of the package 12 and the through hole 113 of the circuit board 11, and the photosensitive chip 20 performs photoelectric conversion to image.
In some embodiments of the camera module of the present invention, the package body 12 may be integrally bonded to the circuit board front surface 111 of the circuit board 11 through a molding process, in which the light window 121 and the mounting surface 122 of the package body 12 are formed at the same time as the package body 12 is molded, and the mounting surface 122 of the package body 12 has good flatness by virtue of a mold advantage. In addition, compared with the conventional scheme of mounting the lens seat on the circuit board, in the camera module of the present invention, the package body 12 may be integrally combined with the circuit board front surface 111 of the circuit board 11 through a molding process, on one hand, no glue is needed between the package body 12 and the circuit board 11, so as to facilitate reducing the height dimension of the camera module, and on the other hand, the height dimension of the package body 12 may be smaller than the lens seat, so as to facilitate reducing the height dimension of the camera module.
Specifically, the package 12 has a square frame shape with four package frames 123 connected end to end, the four package frames 123 are sequentially defined as a package first frame 1231, a package second frame 1232, a package third frame 1233, and a package fourth frame 1234, the package first frame 1231 and the package third frame 1233 are located at one pair of opposite sides of the light window 121 of the package 12, the package second frame 1232 and the package fourth frame 1234 are located at the other pair of opposite sides of the light window 121 of the package 12, and opposite ends of the package first frame 1231 are respectively extended to be connected to one end of the package second frame 1232 and one end of the package fourth frame 1234, opposite ends of the package third frame 1233 are respectively extended to be connected to the other end of the package second frame 1232 and the other end of the package fourth frame 1234, and the other ends of the package third frame 1231 and the package fourth frame 1234 are respectively extended to be connected to each other end of the package second frame 1232 and the package fourth frame 1234.
The larger the width dimension of the first package frame 1231 of the package 12 is, the larger the area of the portion of the mounting surface 122 of the package 12 formed on the top of the first package frame 1231 is, the more easily and stably mounting the movable carrier 14, and the carrier perforation 141 of the movable carrier 14 corresponds to the optical window 121 of the package 12, so that in the image pickup module of the present invention, the larger the width dimension of the first package frame 1141 is, the larger the width dimension of the first package frame 1231 is, and thus the more reliably and stably mounting the movable carrier 14 on the mounting surface 122 of the package 12, for example, the more reliably and stably mounting the movable carrier 14 on the mounting surface 122 of the package 12 can be performed by increasing the width dimension of the first package frame 1141 of the circuit board 11, and in the image pickup module of the present invention, the carrier perforation 141 of the movable carrier 14 corresponds to the optical window 121 of the package 12. Accordingly, the area of the mounting surface 122 of the package body 12 can be increased by increasing the width of the circuit board second frame 1142 of the circuit board 11, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12, the area of the mounting surface 122 of the package body 12 can be increased by increasing the width of the circuit board third frame 1143 of the circuit board 11, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12, and the area of the mounting surface 122 of the package body 12 can be increased by increasing the width of the circuit board fourth frame 1144 of the circuit board 11, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12.
Referring to fig. 2 to 6, the anti-shake conductive portion 13 further includes a fixed circuit board 131, a movable circuit board 132, and at least one flexible connection portion 133. The fixed circuit board 131 has a fixed circuit board front surface 1311, a fixed circuit board back surface 1312, and a fixed circuit board through hole 1313, the fixed circuit board front surface 1311 and the fixed circuit board back surface 1312 correspond to define a thickness dimension of the fixed circuit board 131, and the fixed circuit board through hole 1313 extends from the fixed circuit board front surface 1311 to the fixed circuit board back surface 1312, i.e., the fixed circuit board through hole 1313 penetrates opposite sides of the fixed circuit board 131. Accordingly, the movable circuit board 132 has a front movable circuit board 1321, a back movable circuit board 1322 and a through movable circuit board 1323, the front movable circuit board 1321 and the back movable circuit board 1322 correspond to define a thickness dimension of the movable circuit board 132, and the through movable circuit board 1323 extends from the front movable circuit board 1321 to the back movable circuit board 1322, i.e. the through movable circuit board through hole 1323 penetrates opposite sides of the movable circuit board 132. The movable circuit board 132 and the flexible connection part 133 are both positioned at the fixed circuit board through hole 1313 of the fixed circuit board 131, and opposite ends of the flexible connection part 133 extend to and are connected to the fixed circuit board 131 and the movable circuit board 132, respectively, so as to allow the flexible connection part 133 to suspend the movable circuit board 132 from the fixed circuit board through hole 1313 of the fixed circuit board 131. That is, the movable wiring board 132 is disposed inside the fixed wiring board 131, and the movable wiring board 132 is connected to the fixed wiring board 131 through the flexible connection part 133.
The movable wiring board front surface 1321 of the movable wiring board 132 is attached to the circuit board back surface 112 of the circuit board 11, the movable wiring board through hole 1323 of the movable wiring board 132 corresponds to the circuit board through hole 113 of the circuit board 11, for example, the movable wiring board front surface 1321 of the movable wiring board 132 and the circuit board back surface 112 of the circuit board 11 may be bonded by glue so that the movable wiring board front surface 1321 of the movable wiring board 132 is attached to the circuit board back surface 112 of the circuit board 11. The photosensitive chip 20 is mounted on the back 1322 of the movable circuit board 132, the through hole 1323 of the movable circuit board 132 corresponds to the photosensitive area of the photosensitive chip 20, so that the incident light entering the camera module through the optical lens 30 passes through the carrier through hole 141 of the movable carrier 14, the optical window 121 of the package 12 and the through hole 113 of the circuit board 11 in order, and then reaches the photosensitive chip 20, and the photosensitive chip 20 performs photoelectric conversion to image.
When the movable carrier 14 drives the package 12, the circuit board 11, the movable circuit board 132, and the photosensitive chip 20 to translate, so as to realize the optical anti-shake function of the camera module, the flexible connection portion 133 can deform and always connect the movable circuit board 132 and the fixed circuit board 131.
In some specific examples of the present invention, the flexible connection part 133 is bent between the fixed circuit board 131 and the movable circuit board 132 a plurality of times to allow the flexible connection part 133 to deform with the translation of the movable circuit board 132, and in this process, the reactive force generated by the flexible connection part 133 is small to avoid affecting the optical anti-shake effect of the camera module.
In this specific example of the camera module of the present invention shown in fig. 1 to 6, the fixed wiring board 131 and the movable wiring board 132 of the anti-shake conductive part 13 are each a square frame, and the fixed wiring board 131 surrounds the outside of the movable wiring board 132, wherein one end of the flexible connection part 133 is connected to one side of the movable wiring board 132, and the other end of the flexible connection part 133 is connected to the non-corresponding side of the fixed wiring board 131, so as to reduce the generation of reactive force of the flexible connection part 133 when the movable wiring board 132 translates. That is, each side of the movable wiring board 132 faces the corresponding side of the fixed wiring board 131, the flexible connection part 133 is provided with at least three bending positions, one of which is close to one end of the flexible connection part 133 connected to the movable wiring board 132, the other of which is close to one end of the flexible connection part 133 connected to the fixed wiring board 131, and the other of which spans the corner of the movable wiring board 132, such that one end of the flexible connection part 133 is connected to one side of the movable wiring board 132 and the other end of the flexible connection part 133 is connected to the non-corresponding side of the fixed wiring board 131.
More specifically, referring to fig. 2, 3, 5 and 6, the fixed-wiring board 131 has four fixed-wiring board frames 1314 which are defined as a fixed-wiring board first frame 13141, a fixed-wiring board second frame 13142, a fixed-wiring board third frame 13143 and a fixed-wiring board fourth frame 13144 in this order, the fixed-wiring board first frame 13141 and the fixed-wiring board third frame 13143 being located at one pair of opposite sides of the fixed-wiring board through hole 1313 of the fixed-wiring board 131, the fixed-wiring board second frame 13142 and the fixed-wiring board fourth frame 13144 being located at the other pair of opposite sides of the fixed-wiring board through hole 1313 of the fixed-wiring board 131, and the opposite ends of the fixed-wiring board first frame 13141 being respectively extended to be connected to one end portion of the fixed-wiring board second frame 13142 and the other end portion of the fixed-wiring board fourth frame 13144, the fixed-wiring board third frame 43 being respectively extended to be connected to the other end portion of the fixed-wiring board 3742.
The movable wiring board 132 has four movable wiring board frames 1324 connected end to end, which are defined as a movable wiring board first frame 13241, a movable wiring board second frame 13242, a movable wiring board third frame 13243, and a movable wiring board fourth frame 13244 in this order, the movable wiring board first frame 13241 and the movable wiring board third frame 13243 are located at one pair of opposite sides of the movable wiring board through hole 1323 of the movable wiring board 132, the movable wiring board second frame 13242 and the movable wiring board fourth frame 13244 are located at the other pair of opposite sides of the movable wiring board through hole 1323 of the movable wiring board 132, and the opposite ends of the movable wiring board first frame 13241 are respectively extended to be connected to one end portion of the movable wiring board second frame 13242 and one end portion of the movable wiring board fourth frame 13244, and the opposite ends of the movable wiring board third frame 13243 are respectively extended to be connected to the other pair of opposite sides of the movable wiring board through hole 1323 of the movable wiring board 132.
The positions of the fixed wiring board first frame 13141, the fixed wiring board second frame 13142, the fixed wiring board third frame 13143, and the fixed wiring board fourth frame 13144 of the fixed wiring board 131 correspond to the positions of the movable wiring board first frame 13241, the movable wiring board second frame 13242, the movable wiring board third frame 13243, and the movable wiring board fourth frame 13244 of the movable wiring board 132, and the positions of the movable wiring board first frame 13241, the movable wiring board second frame 13242, the movable wiring board third frame 13243, and the movable wiring board fourth frame 13244 correspond to the positions of the circuit board first frame 1141, the circuit board second frame 1142, the circuit board third frame 1143, and the circuit board fourth frame 1144 of the circuit board 11, respectively. That is, the movable circuit board first frame 13241 of the movable circuit board 132 may be attached to the circuit board first frame 1141 of the circuit board 11 by glue, the movable circuit board second frame 13242 may be attached to the circuit board second frame 1142 by glue, the movable circuit board third frame 13243 may be attached to the circuit board third frame 1143 by glue, and the movable circuit board fourth frame 13244 may be attached to the circuit board fourth frame 1144 by glue.
The number of flexible connection units 133 is four, which are defined as a first flexible connection unit 1331, a second flexible connection unit 1332, a third flexible connection unit 1333, and a fourth flexible connection unit 1334 in sequence. The inner end of the first flexible connection part 1331 is connected to the movable wiring board first frame 13241 of the movable wiring board 132, and the outer end of the first flexible connection part 1331 is connected to the fixed wiring board second frame 13142 of the fixed wiring board 131, so that the first flexible connection part 1331 is used to connect the fixed wiring board 131 and the non-corresponding side of the movable wiring board 132; the inner end of the second flexible connection part 1332 is connected to the movable wiring board second frame 13242 of the movable wiring board 132, the outer end of the second flexible connection part 1332 is connected to the fixed wiring board third frame 13143 of the fixed wiring board 131, such that the second flexible connection part 1332 is used for connecting the fixed wiring board 131 and the non-corresponding side of the movable wiring board 132, the inner end of the third flexible connection part 1333 is connected to the movable wiring board third frame 13243 of the movable wiring board 132, the outer end of the third flexible connection part 1333 is connected to the fixed wiring board fourth frame 13144 of the fixed wiring board 131, such that the third flexible connection part 1333 is used for connecting the fixed wiring board 131 and the non-corresponding side of the movable wiring board 132, the inner end of the fourth flexible connection part 1334 is connected to the movable wiring board third frame 13244 of the movable wiring board 132, the outer end of the fourth flexible connection part 1334 is connected to the fixed wiring board 131, such that the movable wiring board 12 is connected to the carrier 11 of the movable wiring board 131, such that the carrier 11 is connected to the fixed wiring board 131 and the movable wiring board 11 by the carrier 11, when the movable circuit board 132 and the photosensitive chip 20 translate to realize the optical anti-shake function of the camera module, the first flexible connection part 1331, the second flexible connection part 1332, the third flexible connection part 1333 and the fourth flexible connection part 1334 can generate smaller reactive force so as to avoid affecting the optical anti-shake effect of the camera module.
Alternatively, in other examples of the camera module of the present invention, the inner end of the first flexible connection part 1331 is connected to the movable wiring board first frame 13241 of the movable wiring board 132, and the outer end of the first flexible connection part 1331 may be connected to the fixed wiring board third frame 13143 or the fixed wiring board fourth frame 13144 of the fixed wiring board 131. Accordingly, the inner end of the second flexible connection part 1332 is connected to the movable circuit board second frame 13242 of the movable circuit board 132, the outer end of the second flexible connection part 1332 may be connected to the movable circuit board fourth frame 13144 or the movable circuit board first frame 13141 of the movable circuit board 131, the inner end of the third flexible connection part 1333 is connected to the movable circuit board third frame 13243 of the movable circuit board 132, the outer end of the third flexible connection part 1333 may be connected to the fixed circuit board first frame 13141 or the fixed circuit board second frame 13142 of the movable circuit board 131, the inner end of the fourth flexible connection part 1334 is connected to the movable circuit board fourth frame 13244 of the movable circuit board 132, the outer end of the fourth flexible connection part 1334 may be connected to the fixed circuit board second frame 13142 or the fixed circuit board third frame 43 of the movable circuit board 132, and thus the optical pickup device can be prevented from being affected by the optical shake-preventing function of the movable circuit board 12, the flexible connection part 1334, the optical pickup device can be prevented from being connected to the flexible circuit board 1, the optical module and the flexible circuit board 1.
Referring to fig. 4 and 5, the flexible connection part 133 of the package body 12 and the anti-shake conductive part 13 has an overlapping portion in a top view, so that at least one of the package frames 123 of the package body 12 may have a wider size to increase the mounting area of the mounting face 122 of the package body 12, thereby facilitating reliable and stable mounting of the movable carrier 14.
With continued reference to fig. 4 and 5, the package 12 is integrally bonded to the circuit board front 111 of the circuit board 11, the width dimension of the package frame 123 of the package 12 is limited by the width dimension of the circuit board frame 114 of the circuit board 11, that is, on the same side of the camera module, the width dimension of the package frame 123 of the package 12 is smaller than or equal to the dimension of the circuit board frame 114 of the circuit board 11, the movable circuit board front 1321 of the movable circuit board 132 of the anti-shake conductive part 13 is attached to the circuit board back 112 of the circuit board 11, in the camera module of the invention, at least one of the circuit board frames 114 of the circuit board 11 extends outwardly above the flexible connection part 133 of the anti-shake conductive part 13, i.e., in such a way that the at least one of the circuit board frames 114 of the circuit board 11 can have a wider dimension that does not affect the flexible connection part 133, and the flexible connection part 12 can be stably attached to the package frame 12 in a plane of the carrier 122, and the area of the package can be increased, as a result, in the area of the attached package can be stably attached to the package 12, and the area of the carrier 122 can be increased.
For example, referring to fig. 4, the first circuit board frame 1141 of the circuit board 11 extends outward above the first flexible connection part 1331 and is not in contact with the first flexible connection part 1331, that is, the outer edge of the first circuit board frame 1141 of the circuit board 11 is located outside the outer edge of the first movable circuit board frame 13241 of the movable circuit board 132, so that the distance L2 between the outer edge of the first circuit board frame 1141 and the central axis of the chip driving assembly 10 is greater than the distance L1 between the outer edge of the first movable circuit board frame 13241 and the central axis of the chip driving assembly 10, so that the first circuit board frame 1141 of the circuit board 11 may have a wider dimension and does not affect the deformation of the first flexible connection part 1331, so that the first package frame 1321 of the package 12 may also have a wider dimension, for example, the distance L2 between the outer edge of the first circuit board frame 1141 of the package 12 and the central axis of the chip driving assembly 10 may be increased and the distance L1 between the outer edge of the first package 12 and the central axis of the chip driving assembly 10 may be mounted on the carrier 14.
In some specific examples of the camera module of the present invention, referring to fig. 4 and 5, the circuit board first frame 1141 of the circuit board 11 extends outwardly above the first flexible connection part 1331 and is not in contact with the first flexible connection part 1331, the circuit board second frame 1142 of the circuit board 11 extends outwardly above the second flexible connection part 1332 and is not in contact with the second flexible connection part 1332, the circuit board third frame 1143 of the circuit board 11 extends outwardly above the third flexible connection part 1333 and is not in contact with the third flexible connection part 1333, the circuit board fourth frame 1144 of the circuit board 11 extends outwardly above the fourth flexible connection part 1334 and is not in contact with the fourth flexible connection part 1334, in this way, the package body first frame 1231, the package body second frame 1232, the package body frame 1233 and the package body frame have a larger size than the package body and the fourth flexible connection part 1333, the package frame 1231 and the package body have a larger size, and the package body can overlap with the third frame 1231 and the fourth flexible connection part 1333, and the package frame 1234 has a larger than the fourth flexible connection part 1334.
With continued reference to fig. 4, the circuit board first frame 1141 of the circuit board 11 extends outwardly above the fixed circuit board first frame 13141 of the fixed circuit board 131 and is not in contact with the first flexible connection 133, i.e., the outer edge of the circuit board first frame 1141 of the circuit board 11 is located outside the inner edge of the fixed circuit board first frame 13141 of the fixed circuit board 131, such that the distance L2 between the outer edge of the circuit board first frame 1141 and the central axis of the chip driving assembly 10 is greater than the distance L3 between the inner edge of the fixed circuit board first frame 13141 and the central axis of the chip driving assembly 10, the first frame 13141 of the fixed circuit board is retracted to facilitate reducing the width of the camera module, and meanwhile, the first frame 1141 of the circuit board 11 may have a wider dimension without affecting the deformation of the first flexible connection portion 1331, so that the first frame 1231 of the package 12 may also have a wider dimension, for example, the first frame 1231 of the package 12 may also extend outwards above the first frame 13141 of the fixed circuit board 131, thereby increasing the mounting area of the mounting surface 122 of the package 12, so as to facilitate reliable and stable mounting of the movable carrier 14.
In some specific examples of the camera module of the present invention, referring to fig. 4 and 5, the circuit board first frame 1141 of the circuit board 11 extends outwardly above the fixed circuit board first frame 13141 of the fixed circuit board 131 and is not in contact with the first flexible connection part 1331, the circuit board second frame 1142 of the circuit board 11 extends outwardly above the fixed circuit board second frame 13142 of the fixed circuit board 131 and is not in contact with the second flexible connection part 1332, the circuit board third frame 1143 of the circuit board 11 extends outwardly above the fixed circuit board third frame 13143 of the fixed circuit board 131 and is not in contact with the third flexible connection part 1333, the circuit board fourth frame 1144 of the circuit board 11 extends outwardly above the fixed circuit board fourth frame 13144 of the fixed circuit board 131 and is not in contact with the fourth flexible connection part 1334, in this way, the first and second fixed circuit board frames 13141, 13142, 13143 and 13144 are all retracted to facilitate reducing the length and width dimensions of the camera module, while the first and second package frames 1231, 1232, 1233 and 1234 of the package 12 have wider dimensions, for example, the first package frame 1231 may extend outwardly above the first fixed circuit board frame 13141, the second package frame 1232 may extend outwardly above the second fixed circuit board frame 13142, the third package frame 1233 may extend outwardly above the third fixed circuit board frame 13143, the fourth package frame 1234 may extend outward above the fixed circuit board frame 13144, so as to increase the mounting area of the mounting surface 122 of the package 12, so as to facilitate reliable and stable mounting of the movable carrier 14.
With continued reference to fig. 4 and 5, the chip driving assembly 10 further includes at least one electronic component 15, which may be a passive electronic component such as a resistor, a capacitor, or an active electronic component such as a driving chip, a memory chip, etc., where the electronic component 15 is mounted on the front surface 111 of the circuit board 11, and the electronic component 15 is covered by the package 12, so that the package 12 protects the electronic component 15 from moisture and oxidation. In some specific examples of the camera module of the present invention, at least one of the circuit board first frame 1141, the circuit board second frame 1142, the circuit board third frame 1143, and the circuit board fourth frame 1144 of the circuit board 11 is provided with the electronic component 15.
Referring to fig. 4 to 6, the movable wiring board 132 has at least one row of wiring board pads 1325, the wiring board pads 1325 are disposed on the movable wiring board back surface 1322 of the movable wiring board 132 and adjacent to the movable wiring board through holes 1323 of the movable wiring board 132, the photosensitive chip 20 has at least one row of chip pads 21, the chip pads 21 are disposed on the non-photosensitive area of the photosensitive chip 20 and adjacent to the photosensitive area, wherein the solder of the wiring board pads 1325 of the movable wiring board 132 and the chip pads 21 of the photosensitive chip 20 is thermally press-bonded to attach the photosensitive chip 20 to the movable wiring board back surface 1322 of the movable wiring board 132 and conduct the photosensitive chip 20 and the movable wiring board 132.
That is, the camera module of the present invention adopts flip-chip bonding to connect and conduct between the photosensitive chip 20 and the movable circuit board 132. The flip bonding mode enables the camera module to cancel the lead space, so that the length and width dimensions of the camera module can be reduced, for example, in a specific example of the camera module, the length and width dimensions of the camera module can be reduced by 0.7mm-1.075mm on one side. In addition, compared with a wire connection mode, the movable circuit board bonding pad 1325 of the movable circuit board 132 of the camera module and the chip bonding pad 21 of the photosensitive chip 20 are directly connected by thermocompression bonding, so that an interconnection line is short and impedance is small. In addition, the camera module of the present invention adopts a flip-chip bonding manner to realize connection and conduction between the photosensitive chip 20 and the movable circuit board 132, so that the photosensitive chip 20 moves down to a position lower than the movable circuit board 132, which is favorable for reducing the height dimension of the camera module, and the design of the height dimension of the package 12 does not need to consider the photosensitive chip 20, so that the height dimension of the package 12 can be consistent with the height dimension of the electronic component 15 protruding from the circuit board front 111 of the circuit board 11. It will be appreciated that in embodiments of the camera module where the package 12 is not required to encapsulate the electronic component 15, the height dimension of the package 12 may be further reduced to reduce the height dimension of the camera module.
It should be noted that the bonding material between the circuit board pads 1325 of the movable circuit board 132 and the chip pads 21 of the photosensitive chip 20 may be selected as required. For example, in some embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the movable circuit board 132 and the chip pads 21 of the photosensitive chip 20 may be gold-gold material, that is, the solder of the circuit board pads 1325 of the movable circuit board 132 is gold, the solder of the chip pads 21 of the photosensitive chip 20 is gold, and the two solders are bonded by hot pressing, so as to achieve connection and conduction between the movable circuit board 132 and the photosensitive chip 20. In other embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the movable circuit board 132 and the chip pads 21 of the photosensitive chip 20 may be a tin-gold material, that is, the solder of the circuit board pads 1325 of the movable circuit board 132 is tin, the solder of the chip pads 21 of the photosensitive chip 20 is gold, and the two solders are bonded by hot pressing, so as to achieve connection and conduction between the movable circuit board 132 and the photosensitive chip 20.
With continued reference to fig. 5, the bonding locations of the movable circuit board pads 1325 of the movable circuit board 132 and the chip pads 21 of the photosensitive chip 20 are provided with glue 16, so that not only solder can be protected, but also the connection strength of the movable circuit board 132 and the photosensitive chip 20 can be enhanced, and the stress of the bonding locations in the dropping process can be reduced.
With continued reference to fig. 2 to 5, the camera module further includes a filter element 40, where the filter element 40 is mounted on the mounting surface 122 of the package 12, and the filter element 40 is held between the optical lens 20 and the photosensitive chip 20, and the filter element 40 is used for filtering stray light in the incident light entering the camera module through the optical lens 20, so as to improve the imaging quality of the camera module.
Referring to fig. 4 and 5, the filter element 40 may be attached to the inner side of the attaching surface 122 of the package 12 by glue, the movable carrier 14 may be attached to the outer side of the attaching surface 122 of the package 12 by glue, and the filter element 40 is located at the carrier through hole 14 of the movable carrier 14, so that the movable carrier 14 surrounds the filter element 40, so that the movable carrier 14 can protect the filter element 40 when the camera module is assembled, and the filter element 40 is disposed without increasing the height of the camera module.
It should be noted that, in the camera module of the present invention, the circuit board 11 may extend outward above the flexible connection portion 133 of the anti-shake conductive portion 13 so that the width dimension of at least one of the circuit board frames 114 of the circuit board 11 can be increased, thereby enabling the width dimension of at least one of the package frames 123 of the package 12 to be increased, that is, the width dimension of the portion of the mounting surface 122 of the package 12 formed on this package frame 123 to be increased, so that the optical filter element 40 may be mounted on the inner side of the mounting surface 122 of the package 12 and the movable carrier 145 may be mounted on the outer side of the mounting surface 122 of the package 12.
With continued reference to fig. 1 to 5, the image capturing module includes a base 50 and a housing 60, the optical lens 20 is disposed on the base 50, the base 50 is accommodated in the housing 60, and the housing 60 is attached to the fixed circuit board 131 of the anti-shake conductive portion 13, so that the optical lens 20 is held on a photosensitive path of the photosensitive chip 20 by the base 50.
The anti-shake conductive portion 13 further includes a reinforcing frame 134, the reinforcing frame 134 is attached to the back surface 1312 of the fixed circuit board 131, for example, the reinforcing frame 134 may be attached to the back surface 1312 of the fixed circuit board 131 by glue, wherein the reinforcing frame 134 is used for reinforcing the strength of the fixed circuit board 131 and improving the flatness of the reinforcing frame 134. The reinforcement frame 134 is disposed to prevent the base 50 attached to the fixed circuit board 131 from being inclined, so as to ensure coaxiality of the camera module.
Referring to fig. 4 and 5, the chip driving assembly 10 includes a driving unit 17, and the driving unit 17 is configured to drive the movable carrier 14. In this specific example of the camera module of the present invention, the driving unit 17 includes at least one driving coil 171 and at least one driving magnet 172, one of the driving coil 171 and the driving magnet 172 is disposed on the movable carrier 14, and the other is disposed on the base 50, when the driving coil 171 is energized, based on electromagnetic principles, the driving coil 171 and the driving magnet 172 interact to drive the movable carrier 14 to drive the package 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate so as to realize the optical anti-shake function of the camera module.
In this specific example of the camera module of the present invention, the driving unit 17 further includes a driving circuit board 173 and at least one pin 174, the driving circuit board 173 is disposed on the movable carrier 14, the pin 174 extends downward from the driving circuit board 173 to and is connected to the circuit board 11, wherein the driving coil 171 is mounted on the driving circuit board 173 or the driving coil 171 is formed on the driving circuit board 173 to dispose the driving circuit board 173 on the movable carrier 14, and wherein the driving magnet 172 is disposed on the base 50. When the circuit board 11 supplies power to the driving coil 171 through the pins 174 and the driving circuit board 173, the driving coil 171 generates a magnetic field, which cooperates with the driving magnet 172 to drive the movable carrier 14 to drive the package 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate, so as to realize the optical anti-shake function of the camera module.
Further, referring to fig. 4 and 5, the movable carrier 14 has a carrier recess 142, and the driving circuit board 63 and the driving coil 171 are located in the carrier recess 142 of the movable carrier 14, so as to avoid the driving coil 171 protruding from the top of the movable carrier 14, which is beneficial to reducing the height dimension of the camera module. The base 50 has at least one mounting groove 51, and the driving magnet 172 is mounted in the mounting groove 51 of the base 50, so as to set the driving magnet 172 on the base 50 and prevent the driving magnet 172 from protruding out of the bottom of the base 50, which is beneficial to reducing the height dimension of the camera module.
Still further, with continued reference to fig. 4 and 5, the driving unit 17 includes at least one magnetic conductive plate 175, and the magnetic conductive plate 75 is located on a side of the driving magnet 172 away from the driving coil 171, where the magnetic conductive plate 175 is used to gather the magnetic field of the driving magnet 172 toward the driving coil 171, so as to increase the driving force of the driving unit 17. In some specific examples of the camera module of the present invention, the magnetic plate 175 and the driving magnet 172 are mounted to the mounting groove 51 of the base 50 in a stacked manner.
With continued reference to fig. 1 to 6, the camera module further includes a base 70, and the reinforcing frame 134 of the anti-shake conductive portion 13 is attached to the base 70, so that the movable circuit board 132 and the flexible connection portion 133 of the anti-shake conductive portion 13 are sealed by the base 70 and the photosensitive chip 20 is hidden, so that the movable circuit board 132 and the flexible connection portion 133 of the anti-shake conductive portion 13 and the photosensitive chip 20 are prevented from being visually seen.
In some specific examples of the camera module of the present invention, the base 70 has a base groove 71, and the photosensitive chip 20 corresponds to the base groove 71 of the base 70, so as to avoid the photosensitive chip 20 touching the base 70 when being driven to translate, and improve the reliability of the camera module.
Fig. 7 shows a modified example of the camera module of the above preferred embodiment of the present invention, unlike the camera module shown in fig. 1 to 6, in this specific example of the camera module of the present invention shown in fig. 7, the photo-sensing chip 20 is flip-chip bonded to the circuit board back surface 112 of the circuit board 11. In other words, the photosensitive chip 20 is mounted on the inner side of the circuit board back surface 112 of the circuit board 11, the movable wiring board 132 of the anti-shake conductive portion 13 is mounted on the outer side of the circuit board back surface 112 of the circuit board 11, and the movable wiring board 132 surrounds the periphery of the photosensitive chip 20.
In some specific examples of the camera module of the present invention, the bonding positions of the chip pads 21 of the photosensitive chip 20 and the circuit board pads of the circuit board 11 are provided with glue 16, so that not only can solder be protected, but also the connection strength of the circuit board 11 and the photosensitive chip 20 can be enhanced, and the stress of the bonding positions in the dropping process can be reduced.
In some specific examples of the camera module of the present invention, the manufacturing process of the chip driving assembly 10 includes the steps of firstly providing the electronic component 15 on the circuit board front 111 of the circuit board 11, secondly integrally bonding the package 12 on the circuit board front 111 of the circuit board 11, the package 12 covering the electronic component 15, thirdly cutting the portion of the circuit board 11 exposed to the light window 121 of the package 12 to form the circuit board through hole 113 of the circuit board 11, the size and shape of the circuit board through hole 113 of the circuit board 11 being matched to the size and shape of the photosensitive area of the photosensitive chip 20, and fourthly disposing solder at the circuit board pad 21 of the circuit board 11 and the chip pad 20, and thermocompression bonding to attach the photosensitive chip 20 to the circuit board 11 and to the circuit board 11, and conducting the circuit board 11, and fifth attaching the movable wire 14 to the movable wire carrier 12 to the movable carrier-attached portion 132 of the circuit board 11.
Fig. 8 shows a modified example of the camera module of the above preferred embodiment of the present invention, unlike the camera module shown in fig. 1 to 6, in this specific example of the camera module of the present invention shown in fig. 8, the filter element 40 is attached to the circuit board front surface 111 of the circuit board 11 to hold the filter element 40 between the optical lens 30 and the photosensitive chip 20 by the circuit board 11.
That is, in this specific example of the camera module of the present invention shown in fig. 8, the package 12 is integrally bonded to the outside of the circuit board front face 111 of the circuit board 11, the filter element 40 is attached to the inside of the circuit board front face 111 of the circuit board 11, and the filter element 40 is located at the light window 121 of the package 12 such that the package 12 surrounds the filter element 40, so that the package 12 can protect the filter element 40 when the camera module is assembled, and the filter element 40 is disposed without increasing the height dimension of the camera module.
It should be noted that, in the camera module of the present invention, the circuit board 11 may extend outward above the flexible connection portion 133 of the anti-shake conductive portion 13 so that the width dimension of at least one of the circuit board frames 114 of the circuit board 11 can be increased, so that the mounting surface 122 of the package 12 may have a larger mounting area to reliably and stably mount the movable carrier 14 in a case where the package 12 is integrally bonded to the outside of the circuit board front 111 of the circuit board 11 and the filter element 40 is mounted to the inside of the circuit board front 111 of the circuit board 11.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.
Claims (14)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310975127.4A CN119450184A (en) | 2023-08-03 | 2023-08-03 | Chip driving assembly and camera module |
| PCT/CN2024/109779 WO2025026453A1 (en) | 2023-08-03 | 2024-08-05 | Chip driving assembly and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310975127.4A CN119450184A (en) | 2023-08-03 | 2023-08-03 | Chip driving assembly and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119450184A true CN119450184A (en) | 2025-02-14 |
Family
ID=94394140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310975127.4A Pending CN119450184A (en) | 2023-08-03 | 2023-08-03 | Chip driving assembly and camera module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN119450184A (en) |
| WO (1) | WO2025026453A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571377A (en) * | 2016-09-20 | 2017-04-19 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
| CN108174078A (en) * | 2018-03-14 | 2018-06-15 | 欧菲影像技术（广州）有限公司 | Camera module and its wiring board mechanism |
| CN109686749B (en) * | 2018-11-30 | 2020-11-13 | 中国电子科技集团公司第五十八研究所 | Image sensor chip packaging structure and preparation method thereof |
| CN214544466U (en) * | 2021-03-18 | 2021-10-29 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN215420436U (en) * | 2021-05-22 | 2022-01-04 | 江西晶浩光学有限公司 | Camera module and electronic equipment |
-
2023
- 2023-08-03 CN CN202310975127.4A patent/CN119450184A/en active Pending
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2024
- 2024-08-05 WO PCT/CN2024/109779 patent/WO2025026453A1/en unknown
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| WO2025026453A1 (en) | 2025-02-06 |
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