CN115811640B

CN115811640B - Circuit board for camera module and corresponding camera module

Info

Publication number: CN115811640B
Application number: CN202111060876.1A
Authority: CN
Inventors: 诸海江; 朱亚飞; 陈永明; 范迪科; 杨祎; 俞丝丝; 劳益杭; 赵开开; 吴雨榕
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2021-09-10
Filing date: 2021-09-10
Publication date: 2024-07-09
Anticipated expiration: 2041-09-10
Also published as: CN115811640A

Abstract

The invention provides a circuit board for a camera module, which comprises a circuit board main body and at least two side connecting bands; the side connecting belt is led out from the side surface of the circuit board main body, is bent upwards, and extends to form a side connecting belt main body on the side surface of the camera module after being bent; the side connecting belts are provided with hard plates, the outer surface of the hard plate of one side connecting belt is provided with a plurality of bonding pads, the hard plate of the other side connecting belt is provided with a plurality of conductive through holes, and the hard plates of the two side connecting belts are overlapped; a bonding medium is attached to a sidewall of the conductive via and contacts the bonding pad through the conductive via. The invention also provides a corresponding camera module. The invention can reduce the moving resistance of the circuit board main body and the photosensitive chip, and has high yield and high production efficiency.

Description

Circuit board for camera module and corresponding camera module

Technical Field

The invention relates to the technical field of camera modules, in particular to a circuit board for a camera module and a corresponding camera module.

Background

The mobile phone camera module is one of important components of intelligent equipment, and the application range and the application amount of the mobile phone camera module in the market are continuously increased. Along with the progress of technology, both work and life are advocating the intellectualization, but one of the important preconditions for realizing the intellectualization is to be able to realize good interaction with the external environment, wherein one important way for realizing good interaction is visual perception, and the visual perception relies mainly on a camera module. It can be said that the camera module has been changed from silently-smelling intelligent equipment accessories to one of the key components of the intelligent equipment.

As the imaging quality requirement of the camera module of the mobile phone is higher, the volume and weight of the lens are larger, and the driving force requirement on the motor (i.e. the optical actuator) is higher. The volume of the camera module is also greatly limited by the current electronic equipment (such as a mobile phone), and the occupied volume of the motor is correspondingly increased along with the increase of the lens. In other words, in the trend of the lens toward larger volume and weight, the driving force provided by the motor is difficult to increase correspondingly. On the premise of limited driving force, the heavier the lens, the shorter the stroke of the motor capable of driving the lens to move, and the anti-shake capability is affected. On the other hand, the heavier the lens, the slower the motor can drive the lens to move, and the longer the lens reaches a predetermined compensation position, which also affects the anti-shake effect.

To overcome the above-mentioned drawbacks, the present inventors have proposed a dual OIS motor (OIS is an acronym for optical image stabilization, sometimes referred to as optical anti-shake), which has two parts, one for driving the optical lens to move and the other for driving the photosensitive chip to move, and simultaneously driving the optical lens and the photosensitive chip to move, so as to achieve a better anti-shake effect. However, in the conventional scheme, the photosensitive chip is attached to the circuit board, and the connection belt on the circuit board may cause a large resistance to the movement of the photosensitive chip. Specifically, in the conventional scheme, the circuit board is usually a rigid-flex board, wherein the rigid-flex board is a main body portion of the circuit board, and the flexible-flex board is led out from a side surface of the main body portion to form a connecting band, and a connector can be arranged at a tail end (i.e., a free end) of the connecting band for plugging with a mobile phone motherboard. For example, the connector at the tail end of the connecting belt can be in a pin array shape, a corresponding socket-shaped connector is arranged on the mobile phone main board, and the circuit board of the camera module is electrically connected with the mobile phone main board through the plug-in connection of the pins and the sockets. One end of the connecting belt of the traditional circuit board is fixed on the mobile phone motherboard, when the photosensitive chip moves, the circuit board main body also moves along with the connecting belt, and the connecting belt on the side surface of the circuit board main body is pulled by the connector end of the circuit board main body, so that larger resistance is formed. In the anti-shake movement, the resistance of the connection belt will cause the optical actuator to need to provide a larger driving force, which is disadvantageous for miniaturization of the camera module. On the other hand, the resistance of the connection belt is irregular, and may also cause a decrease in the accuracy of the anti-shake movement. Furthermore, the dual OIS motor has a more complex motor structure, resulting in an increase in the wiring area required for the circuit board, which would result in an increase in the height of the camera module if the conventional stacked more PCB layers were used to increase the wiring area.

Further, the applicant proposes a solution for respectively extracting the lateral connection strips at two symmetrical sides of the circuit board body, so as to overcome the above-mentioned drawbacks. The surfaces of the two side connecting belts are approximately perpendicular to the surface of the circuit board main body, the side connecting belts and the circuit board main body form a bending part through the upward bending soft board, and the side connecting belts can be hung on the fixing part of the optical actuator. The new design scheme of the circuit board can reduce the resistance caused by the movement of the circuit board main body by the connecting belt for connecting the mobile phone main board. However, the brand new circuit board structure still has a plurality of problems of low yield, insufficient production efficiency and the like during actual assembly. Therefore, it is necessary to further optimize the structure of the circuit board, so as to improve the yield and the production efficiency of the camera module while reducing the resistance of the connecting belt. For example, the circuit board structure can be designed into a form more suitable for automatic production, and the production efficiency can be improved through automatic production. And the forms of the camera module and the circuit board structure are improved by analyzing and searching main reasons influencing the yield of the camera module, so that the yield of the finished product of the camera module is improved.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a circuit board and a camera module solution which can reduce the moving resistance of a circuit board main body and a photosensitive chip, have high yield and have high production efficiency.

In order to solve the technical problems, the invention provides a circuit board for an image pickup module, which comprises a circuit board main body and at least two side connecting belts. The circuit board main body has a surface perpendicular to an optical axis of the image pickup module and a plurality of sides parallel to the optical axis. The side connecting belt is led out from the side surface of the circuit board main body, is bent upwards, and extends to form a side connecting belt main body on the side surface of the camera module after being bent; the side connecting belts are provided with hard plates, the outer surface of the hard plate of one side connecting belt is provided with a plurality of bonding pads, the hard plate of the other side connecting belt is provided with a plurality of conductive through holes, and the hard plates of the two side connecting belts are overlapped; a bonding medium is attached to a sidewall of the conductive via and contacts the bonding pad through the conductive via.

Wherein the plurality of sides includes a first side, a second side opposite the first side, a third side adjacent to the first side, and a fourth side opposite the third side. The side-mounted connection strap includes: a first connection strap including a first connection strap flexible board and a first connection strap rigid board, the first connection strap flexible board being led out from the first side of the circuit board main body and bent upward, then extending along the first side and then bent to the third side, the first connection strap rigid board being located at the third side and a side of the first connection strap rigid board being connected to the first connection strap flexible board, a surface of the first connection strap rigid board being parallel to the optical axis; the second connecting belt comprises a second connecting belt soft board and a second connecting belt hard board, the second connecting belt soft board is led out from the second side surface of the circuit board main body, is bent upwards, then extends along the second side surface and is bent to the third side surface, the second connecting belt hard board is positioned on the third side surface, the side surface of the second connecting belt hard board is connected with the second connecting belt soft board, and the surface of the second connecting belt hard board is parallel to the optical axis; the first connecting belt hard plate is positioned on the outer side of the second connecting belt hard plate, the first connecting belt hard plate is provided with a plurality of conductive through holes, the outer surface of the second connecting belt hard plate is provided with a plurality of bonding pads, the conductive through holes and the bonding pads are connected through welding media, the welding media are sprayed into and pass through the conductive through holes in a molten state, and are attached to the bonding pads and the conductive through holes after being cooled so as to electrically connect the conductive through holes and the bonding pads.

The first connecting belt hard plate and the second connecting belt hard plate are bonded through an adhesive medium; the first connecting strip stiffener has a gap of no more than 100 μm between an inner surface of the first connecting strip stiffener and an outer surface of the second connecting strip stiffener.

Wherein the soldering medium enters the conductive via and adheres to a sidewall of the conductive via in a molten state in a jet form, and passes through the conductive via and contacts the pad; and the welding medium, after curing, forms a connection that spans a gap between an inner surface of the first connecting strip stiffener and an outer surface of the second connecting strip stiffener; and a pore is reserved between the welding medium and a part of pore wall of the conductive through hole.

Wherein, the pore wall of the conductive through hole is attached with a metal layer, and the metal layer is a metal plating layer.

Wherein the metal layer is an annular metal layer.

The metal layer is attached to a part of the hole wall of the conductive through hole to form an unsealed metal layer.

In the first connecting strip hard plate, all the unsealed metal layers of the conductive through holes are all arranged on the same side of the conductive through holes.

In the first connecting strip hard plate, all the arc-shaped metal layers of the conductive through holes are all arranged on the lower sides of the conductive through holes.

Wherein the welding medium is tin or a tin-containing welding material.

The circuit board further comprises a third connecting band which is led out from the lower side face of the first connecting band hard plate and is bent outwards, the surface of the third connecting band is perpendicular to the optical axis, and the free end of the third connecting band is provided with a connector which is suitable for being spliced with a main board of electronic equipment carrying the camera module.

According to another aspect of the present application, there is also provided an image capturing module including: an outer frame, and an optical lens, an optical actuator, a photosensitive chip and the circuit board in any of the above schemes which are accommodated in the outer frame; the optical actuator is suitable for driving the optical lens and/or the photosensitive chip to move; the optical actuator includes an actuator fixing portion, and the side connection strap is disposed at a gap between the outer frame and the actuator fixing portion.

The photosensitive chip is attached to the upper surface of the circuit board main body; the upper surface of the circuit board is provided with an annular base, the annular base surrounds the periphery of the photosensitive chip, the top surface of the annular base is mounted on the optical filter, the annular base and the circuit board body form a closed cavity, and the photosensitive chip is packaged in the closed cavity.

The circuit board comprises a circuit board main body, a light sensing chip and a light guide plate, wherein the center of the circuit board main body is provided with a central through hole, the lower surface of the circuit board main body is attached with a reinforcing plate, the light sensing chip is attached to the upper surface of the reinforcing plate, and the light sensing chip is arranged in the central through hole; the circuit board comprises a circuit board body, wherein the upper surface of the circuit board body is provided with an annular base, the annular base surrounds the periphery of a photosensitive chip, the top surface of the annular base is arranged on an optical filter, the annular base, the circuit board body and a reinforcing plate form a closed cavity, and the photosensitive chip is packaged in the closed cavity.

The optical actuator further comprises a chip anti-shake movable part, a photosensitive packaging body formed by the circuit board main body, the optical filter, the annular base and the photosensitive chip is fixed on the chip anti-shake movable part, the photosensitive packaging body is suitable for being driven by the chip anti-shake movable part to move relative to the actuator fixing part, and the first connecting belt hard plate and the second connecting belt hard plate are both directly or indirectly fixed on the actuator fixing part.

The optical actuator further comprises a chip anti-shake movable part, the circuit board main body, the optical filter, the annular base, the reinforcing plate and the photosensitive packaging body formed by the photosensitive chip are fixed on the chip anti-shake movable part, the photosensitive packaging body is suitable for being driven by the chip anti-shake movable part to move relative to the actuator fixing part, and the first connecting belt hard plate and the second connecting belt hard plate are both directly or indirectly fixed on the actuator fixing part.

The optical actuator further comprises a lens driving movable part, and the optical lens is mounted on the lens driving movable part and is suitable for moving relative to the actuator fixing part under the driving of the lens driving movable part.

The outer side surface of the actuator fixing part is provided with a convex column protruding outwards, the hard plate of the side connecting belt is provided with a hanging hole, and the convex column penetrates through the hanging hole so as to hang the side connecting belt on the actuator fixing part.

Compared with the prior art, the application has at least one of the following technical effects:

1. In the application, the circuit board main body of the camera module is led out from different side edges to form a plurality of side connecting belts, the side connecting belts are closed at the side surfaces of the camera module, the hard plate of the side connecting belts can be hung on the actuator fixing part (the actuator fixing part can comprise a chip anti-shake fixing part and a lens driving fixing part which are fixed together), and the design can obviously reduce the resistance caused by the movement of the circuit board main body by the connecting belts, so that the camera module is particularly suitable for the camera module with the chip anti-shake function. Furthermore, in the application, the electrical connection at the closure of the side connecting belt is realized in an innovative non-plugging mode, so that the reduction of the imaging quality of the camera module caused by lateral extrusion of the optical actuator or the optical element in the plugging process is prevented.

2. In the application, for the two side connecting strips which need to be electrically connected, a welding medium can be injected from the outside in the form of high-temperature jet flow and passes through the conductive through holes, and after being cooled, the welding medium can be attached to the side walls of the conductive through holes and pass through the conductive through holes to contact the bonding pads, so that the electrical connection of the two side connecting strips on the side surfaces is realized in a non-plugging mode. Here, for various plate-like members disposed on the side of the image pickup module, the side thereof close to the optical axis of the image pickup module is the inner side, and the side thereof away from the optical axis is the outer side.

3. In some embodiments of the present application, the conductive via may have a conductive layer that is easily fused with the soldering medium disposed on only a portion of the hole wall, so that the soldering medium may be attached to only a portion of the hole wall of the conductive via, and the remaining portion may have a gap left, so as to observe whether the soldering medium contacts the pad from the outside through the gap, thereby helping to improve the yield.

4. In some embodiments of the present application, the hard plates of the two side connection bands may be bonded by double sided adhesive, and a gap of 100 μm or less may be provided between the two hard plates. That is, in the welding process, the two hard plates do not need to be pressed by an external apparatus, so that the reduction of the imaging quality of the camera module caused by lateral extrusion of the optical actuator or the optical element is avoided, meanwhile, the assembly is convenient, and the production efficiency is improved.

5. In some embodiments of the application, the soldering medium does not clog the conductive via, and the soldering medium does not connect the walls of the conductive via on at least one section of the walls of the conductive via. In this way, the soldering medium does not block the conductive through holes, so that the pads of the hard board located at the inner side can be exposed to the outside, thereby providing a viewing channel of the pad state. The operator can visually check whether the soldering medium effectively contacts the pad, and if not, can determine that the soldering medium is defective (NG).

6. In some embodiments of the present application, an image of a pad area may be captured by a capturing device disposed on the outside through a gap between the hole wall of the conductive through hole and the soldering medium, and whether the soldering medium contacts the pad may be automatically identified based on an AI algorithm, so that measures may be taken to improve the yield.

Drawings

FIG. 1 shows a perspective exploded view of a camera module according to one embodiment of the present application;

FIG. 2 is a schematic perspective view of an image capturing module according to an embodiment of the present application;

FIG. 3 shows a schematic perspective view of a chip driving portion of an optical actuator in one embodiment of the application;

fig. 4 is a perspective view showing a lens driving section of an optical actuator in one embodiment of the present application;

FIG. 5 shows a schematic perspective view of an optical actuator in one embodiment of the application;

FIG. 6 shows a schematic view of an optical actuator in a bottom view in one embodiment of the application;

FIG. 7 is a schematic perspective view of a suspension circuit board and a photosensitive chip mounted thereon according to an embodiment of the present application;

FIG. 8 is a perspective cross-sectional view of a suspension board and a light sensing chip mounted thereon according to an embodiment of the present application;

FIG. 9 is a schematic top view of a suspension circuit board and a photosensitive chip mounted thereon according to an embodiment of the present application;

FIG. 10 illustrates a top view of a suspended circuit board in a flattened state in accordance with one embodiment of the present application;

FIG. 11 is a perspective view of a camera module with an outer frame removed according to an embodiment of the present application; the positional relationship between the suspension circuit board and the optical actuator inside the outer frame is shown in the figure;

FIG. 12a shows a schematic of an inner and outer hard-sheet electrical connection of a conductive via with a ring-shaped metal layer in one embodiment of the application;

FIG. 12b is a schematic view of an inner and outer hard-sheet electrical connection with an open metal layer for a conductive via in another embodiment of the application;

FIG. 12c shows a schematic view of a stiffener having conductive vias that do not enclose a metal layer in another embodiment of the present application;

FIG. 13 is a schematic top view of a suspended circuit board with attached stiffening plates in a flattened state in accordance with one embodiment of the application;

FIG. 14 is a schematic side view of a stiffener and suspended circuit board in a folded state according to one embodiment of the present application;

Fig. 15 is a schematic perspective view showing a state after bending of the reinforcing plate and the suspension board in one embodiment of the present application;

FIG. 16 is a schematic perspective view of an imaging module with a side recess on a circuit board according to an embodiment of the application;

FIG. 17 illustrates a partial schematic view of a circuit board side recess in one embodiment of the application in electrical connection with a conductive pin of an optical actuator;

FIG. 18 is a schematic perspective view of a camera module with an outer frame according to one embodiment of the application;

FIG. 19 is a schematic perspective view of an image capturing module with a frame cover added thereto according to an embodiment of the present application;

FIG. 20 illustrates the positional relationship of a frame base plate and a suspension board in one embodiment of the application;

Fig. 21 shows the positional relationship of the conductive cloth, the frame base plate, and the suspension board in one embodiment of the present application.

Detailed Description

For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Accordingly, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.

The invention is further described below with reference to the drawings and specific embodiments.

As shown in fig. 1 to 21, an image pickup module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive member 30, an optical lens 10 held on a photosensitive path of the photosensitive member 30, a driving member 20 for driving the photosensitive member 30 to move, and an outer frame 40 for encapsulation. The bottom surface of the driving assembly 20 is fixedly connected with the photosensitive assembly 30 to drive the photosensitive assembly 30 to move, a through hole is formed in the middle of the driving assembly 20, the through hole of the driving assembly 20 is used for accommodating and fixing the optical lens 10, and a light passage of the optical lens 10 is provided, so that light refracted by the optical lens 10 passes through and is incident to the photosensitive assembly 30. Wherein the outer frame 40 encloses the driving assembly 20 and the photosensitive assembly 30 therein, and the driving assembly 20 is provided with a fixing position to fix the driving assembly 20, so that the photosensitive assembly 30 is suspended in the outer frame 40.

The optical lens 10 is held on the photosensitive path of the photosensitive assembly 30 to collect external imaging light. Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 mounted in the lens barrel 11, the lens group 12 including at least one optical lens, the number of the at least one optical lens being not limited.

The driving assembly 20 includes a chip driving part 21, the chip driving part 21 includes a chip anti-shake part 211, the chip anti-shake part 211 is adapted to drive the photosensitive assembly 30 to translate in the X-axis and Y-axis directions and/or rotate around the Z-axis direction, so as to implement translational anti-shake and/or rotational anti-shake of the photosensitive assembly 30; or the chip anti-shake part 211 is adapted to drive the photosensitive assembly 30 to rotate in the X-axis direction and in the Y-axis direction to realize oblique anti-shake of the photosensitive assembly 30. In one embodiment of the present application, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to a plane in which the X-axis direction and the Y-axis direction lie, in other words, the X-axis, the Y-axis, and the Z-axis form a three-dimensional coordinate system.

The chip anti-shake part 211 includes a chip anti-shake fixing part 2111, a chip anti-shake movable part 2112, and a driving element for driving the chip anti-shake movable part 2112 to move relative to the chip anti-shake fixing part 2111, wherein the driving element is respectively connected to the chip anti-shake movable part 2112 and the chip anti-shake fixing part 2111. The chip anti-shake movable portion 2112 is fixed to the photosensitive assembly 30, so that the driving element drives the photosensitive assembly 30 fixed to the chip anti-shake movable portion 2112 to move. Further, the chip anti-shake portion 211 may further include a suspension system by which the chip anti-shake movable portion 2112 is suspended in the chip anti-shake fixing portion 2111, and the suspension system may be implemented as a spring, a suspension wire, a ball, or the like, and embodiments of the present application are not limited by the type of suspension system.

In one embodiment of the present application, the chip anti-shake portion 211 may be a voice coil motor, a piezoelectric motor, an SMA (shape memory alloy ) motor, or the like type of driving motor.

When the chip anti-shake portion 211 is implemented as a voice coil motor, the driving element is implemented as a coil-magnet pair, that is, a driving force driving the chip anti-shake movable portion 2112 to move is generated by electromagnetic action between the coil and the magnet. The coil and the magnet of the coil-magnet pair are adapted to be disposed on the chip anti-shake movable portion 2112 and the chip anti-shake fixing portion 2111, respectively. That is, it may be that the coil of the coil-magnet pair is fixedly provided at the chip anti-shake movable portion 2112, and the magnet of the coil-magnet pair is fixedly provided at the chip anti-shake fixing portion 2111, so that the driving force demand for the driving element can be reduced; the magnets of the coil-magnet pair may be fixedly provided to the chip anti-shake movable portion 2112, and the coils of the coil-magnet pair may be fixedly provided to the chip anti-shake fixing portion 2111, so that the energization of the coils may be simplified. The number of the coil-magnet pairs may be one or more, and disposed around the chip anti-shake movable portion 2112, and preferably, the number of the coil-magnet pairs may be two, three or four, which are located at the side of the chip anti-shake movable portion 2112 adjacent thereto.

When the chip anti-shake portion 211 is implemented as an SMA motor, the driving element is implemented as an SMA (shape memory alloy) wire, and the shape memory alloy is an alloy material that can completely eliminate deformation thereof at a low temperature after heating up and restore its original shape before deformation. For example, when the shape memory alloy is subjected to a limited plastic deformation at a temperature below the phase transition temperature, it may be heated to return to its original shape prior to deformation, wherein heating of the SMA wire may be achieved by energizing the SMA wire.

As shown in fig. 3, in one embodiment of the present application, a set of SMA wires 2113 is provided on four sides of the chip anti-shake portion 211, each set of SMA wires 2113 includes at least one SMA wire, adjacent two sides of the four sides of the chip anti-shake portion 211 are disposed vertically (approximately vertically), and opposite two sides of the four sides of the chip anti-shake portion 211 are disposed in parallel (approximately parallel). Specifically, on each of four sides of the chip anti-shake portion 211, the chip anti-shake fixing portion 2111 has a first fixing end 21111, the chip anti-shake movable portion 2112 has a second fixing end 21121, two ends of the group of SMA wires 2113 are respectively fixed to the chip anti-shake fixing portion 2111 through the first fixing end 21111 and to the chip anti-shake movable portion 2112 through the second fixing end 21121, so that the group of SMA wires 2113 drives the chip anti-shake movable portion 2112 to move relative to the chip anti-shake fixing portion 2111, and thus the four groups of SMA wires 2113 located on four sides of the chip anti-shake portion 211 drive the chip anti-shake movable portion 2112 to translate relative to the chip anti-shake fixing portion 2111 in directions of an X axis and a Y axis perpendicular to each other, or may also drive the chip anti-shake movable portion 2112 to rotate relative to the chip anti-shake fixing portion 2111 around a Z axis perpendicular to a plane where the X axis and the Y axis are located, so that the chip anti-shake movable portion 2112 can be driven to rotate around the Z axis direction or the chip anti-shake fixing portion 21125. Further, the first fixing end 21111 and the second fixing end 21121 may have a conductive function to provide current to the SMA wire 2113 to heat the SMA wire, so that the SMA wire is deformed.

The chip anti-shake unit 211 further includes a chip anti-shake electrical connection portion 2114, and the chip electrical connection point is electrically connected to a driving element, that is, the SMA wire 2113, so that the chip anti-shake unit 211 driving power is provided through the chip anti-shake electrical connection portion 2114. The chip anti-shake electrical connection portion 2114 is located at one side of the chip anti-shake portion 211, and further includes a plurality of pins 21141, for example, the chip anti-shake electrical connection portion 2114 includes 5 pins 21141 located at one side of the chip anti-shake portion 211, and the plurality of pins 21141 are spaced apart from each other and are fixedly disposed at one side of the chip anti-shake fixing portion 2111 of the chip anti-shake portion 211 in an inverted "L" shape.

The drive assembly 20 further comprises a lens drive portion 22, the lens drive portion 22 being adapted to drive the optical lens 10 in motion. The lens driving portion 22 includes a lens focusing portion 221, and the lens focusing portion 221 is adapted to drive the optical lens 10 to translate in the Z-axis direction, so as to adjust a distance between the optical lens 10 and the photosensitive assembly 30, so as to implement a focusing function of the optical lens 10. Further, the lens driving part 22 may further include a lens anti-shake part 222, the lens anti-shake part 222 being adapted to drive the optical lens 10 to translate in the X-axis and Y-axis directions and/or rotate around the Z-axis direction to achieve translational anti-shake and/or rotational anti-shake of the optical lens 10; or the lens anti-shake part 222 is adapted to drive the optical lens 10 to rotate in the X-axis direction and in the Y-axis direction to achieve tilt anti-shake of the optical lens 10. Note that the lens driving section 22 may include only the lens focusing section 221 or the lens anti-shake section 222; the lens driving part 22 may further include both the lens focusing part 221 and the lens anti-shake part 222, so that the lens driving part 22 may implement not only a lens focusing function but also a lens anti-shake function.

In one embodiment of the present application, the lens focusing part 221 and the lens anti-shake part 222 may be voice coil motors, piezoelectric motors, SMA (shape memory alloy ) motors, or the like type of driving motors.

As shown in fig. 4, in one embodiment of the present application, the lens driving section 22 includes a lens driving fixed portion 2201, a lens driving movable portion 2202, and a driving element (not shown) for driving the lens driving movable portion 2202 to move relative to the lens driving fixed portion 2201, the driving element being connected to the lens driving movable portion 2202 and the lens driving fixed portion 2201, respectively. The lens driving movable portion 2202 is fixed to the optical lens 10, so that the driving element drives the optical lens 10 fixed to the lens driving movable portion 2202 to move. Further, the lens driving section 22 may further include a suspension system (not shown) by which the lens driving movable portion 2202 is suspended in the lens driving fixed portion 2201, and the suspension system may be implemented as one or more of a spring plate, a suspension wire, a ball, and the like, and the present application is not limited by the type of suspension system.

In one embodiment of the present application, the driving element drives the lens driving movable portion 2202 to move relative to the lens driving fixed portion 2201 to perform a lens focusing or lens anti-shake function, so that the driving element, the lens driving movable portion 2202 and the lens driving fixed portion 2201 constitute the aforementioned lens focusing portion 221 or the lens anti-shake portion 222. Alternatively, the lens driving movable part 2202 may further include a first lens driving movable part 2202, a second lens driving movable part 2202 located inside the first lens driving movable part 2202, and a driving element for driving the second lens driving movable part 2202 to move relative to the first lens driving movable part 2202. Thus, the driving element located between the lens driving fixed portion 2201 and the lens driving movable portion 2202 drives the lens driving movable portion 2202 to move to realize a lens anti-shake function, and the driving element located between the first lens driving movable portion 2202 and the second lens driving movable portion 2202 drives the second lens driving movable portion 2202 to move to realize a lens focusing function; alternatively, the driving element between the lens driving fixed portion 2201 and the lens driving movable portion 2202 may drive the lens driving movable portion 2202 to move so as to realize a lens focusing function, and the driving element between the first lens driving movable portion 2202 and the second lens driving movable portion 2202 may drive the second lens driving movable portion 2202 to move so as to realize a lens anti-shake function.

The lens driving part 22 includes a lens driving electric connection portion 2203 at a side surface, the lens driving electric connection portion 2203 being electrically connected to a driving element of the lens driving part 22 and providing a driving power source for the lens driving part 22. The lens driving electrical connection portion 2203 includes a plurality of lens driving pads 22031, and the plurality of lens driving pads 22031 are arranged in two rows to reduce the length of the lens driving electrical connection portion 2203, for example, the number of lens driving pads 22031 located in the upper row is 4, and the number of lens driving pads 22031 located in the lower row is also 4.

The lens driving fixing portion 2201 of the lens driving portion 22 further includes at least two hanging portions located at sides of the lens driving fixing portion 2201, and in one embodiment of the present application, the at least two hanging portions are located at the same side of the lens driving fixing portion 2201 as the lens driving electrical connection portion 2203. The number of the at least two suspending portions may be two, namely, a first suspending portion 22011 and a second suspending portion 22012, and the first suspending portion 22011 and the second suspending portion 22012 extend outwards from the lens driving fixing portion 2201 at two sides of the lens driving electrical connecting portion 2203. The function of the at least two suspension portions will be developed in the following description of the photosensitive assembly 30, and will not be repeated here.

In the present application, the lens driving part 22 and the chip driving part 21 may be separated from each other or fixed to each other, and the lens driving part 22 may be fixed to the chip driving part 21 by being fixed by adhesion or integrally formed between the lens driving fixing part 2201 and a chip driving fixing part (e.g., a chip anti-shake fixing part 2111) of the chip driving part 21.

Fig. 5-6 illustrate that in the present application, the driving assembly 20 may include the lens driving part 22 and the chip driving part 21. Four concave portions are formed in the four corner regions of the chip driving portion 21, so that four convex portions are formed in the four corner regions of the lens driving portion 22, and extend into the four concave portions of the chip driving portion 21, wherein a sensing magnet 2311 is fixed in each of the three concave portions of the four convex portions of the lens driving portion 22, that is, three sensing magnets 2311 are fixed in the four corner regions of the lens driving portion 22, the sensing magnet 2311 is used for providing a magnetic field of a position sensor 2312 on the photosensitive assembly 30 shown in fig. 7, so as to detect displacement of the photosensitive assembly 30, and the position sensor 2312 is adapted to determine a direction and a distance of the movement by sensing a change of the magnetic field. In other embodiments of the present application, the number of the sensing magnet 2311 may be one, two or four.

Fig. 5 further shows that the chip anti-shake electrical connection 2114 of the chip driving section 21 and the lens driving electrical connection 2203 of the lens driving section 22 are located on opposite sides of the driving assembly 20, respectively. As further shown in fig. 6, the lens focusing part 221 of the lens driving part 22 is located inside the lens anti-shake part 222, and the size of the through hole in the middle of the chip driving part 21 is larger than that of the through hole in the middle of the lens driving part 22, thereby providing a light-passing path where the optical lens 10 is not blocked, and thus reducing occurrence of a problem of a dark angle.

As shown in fig. 7-12, in one embodiment of the present application, the photosensitive assembly 30 includes a circuit board 31, a photosensitive chip 32, a base 34, and a filter element 35.

The photo-sensing chip 32 includes a photo-sensing area 321 and a non-photo-sensing area 322321, and the photo-sensing chip 32 is electrically connected to the circuit board 31 through a photo-sensing chip pad located in the non-photo-sensing area 322321, for example, the photo-sensing chip 32 may be electrically connected to the circuit board 31 by gold wire bonding, soldering, FC process (flip chip), RDL (re-wiring layer technology), or the like. The photosensitive chip 32 is adapted to be fixed on the upper surface of the circuit board 31 (the side of the circuit board 31 facing the lens is defined as the upper surface) through an adhesive medium, or the photosensitive chip 32 is disposed in the circuit board through hole 3111 of the circuit board 31, so as to reduce the influence of the thickness of the circuit board 31 on the thickness of the photosensitive assembly 30, and reduce the height of the camera module.

The base 34 is disposed on the chip photosensitive portion of the wiring board 31 for supporting other components. In a specific example of the application, the base 34 is embodied as a separately molded plastic bracket that is attached to the surface of the circuit board 31 by an adhesive medium and is used to support other components. Of course, in other examples of the present application, the base 34 may be formed on the circuit board 31 in other manners, for example, the base 34 may be implemented as a molded base integrally formed at a predetermined position of the circuit board 31 through a molding process, which is not limited to the present application.

In one embodiment of the present application, the filter element 35 is held in the photosensitive path of the photosensitive chip 32 for filtering the imaging light entering the photosensitive chip 32. In a specific example, the filter element 35 is mounted on the base 34 and corresponds to at least the photosensitive region 321 of the photosensitive chip 32. It should be noted that in other examples of the application, the filter element 35 may be indirectly mounted to the base 34 via other supports. In other examples of the present application, the filter element 35 may be mounted at other positions of the image capturing module 1, for example, the filter element 35 may be formed in the optical lens 10 (for example, as a filter film attached to a surface of a certain optical lens of the optical lens 10), which is not limited to the present application.

The wiring board 31 includes a wiring board main body 311, a connection tape, and a connector portion 314. The circuit board body 311 is used for mounting and electrically connecting the photosensitive chip 32 and the electronic component 33, the electronic component 33 comprises passive devices such as a capacitor and a resistor, and active devices such as a driving chip, the connection is electrically connected and fixed with the circuit board body 311 and the connector part 314, and the connector part 314 is used for electrically connecting with a mobile electronic device to derive image information output by the photosensitive chip 32.

The four corners of the circuit board body 311 of the circuit board 31 are further fixed with and electrically connected with position sensors 2312 for sensing the movement of the photosensitive assembly 30, the number and positions of the position sensors 2312 correspond to those of the sensing magnet 2311 of the driving assembly 20, for example, when the triangles of the four corners of the driving assembly 20 are respectively provided with one of the sensing magnet 2311, the positions of the photosensitive chips 32 of the circuit board 31 corresponding to the triangles of the four corners of the driving assembly 20 are respectively fixed with and electrically connected with one of the position sensors 2312.

Referring to fig. 7-8, in a specific example of the present application, the base 34 is fixed to the circuit board body 311 of the circuit board 31 by an adhesive medium and encapsulates the photo-sensing chip 32 therein, the photo-sensing chip 32 is located inside the base 34 (refer to being biased to one side of the photo-sensing chip 32), and the electronic component 33 is located outside the base 34, in other words, the base 34 encapsulates only the photo-sensing chip 32. Of course, in other examples of the present application, the base 34 may also encapsulate the photosensitive chip 32 and a part of the electronic component 33 therein, and another part of the electronic component 33 is located outside the base 34; or the base 34 may also encapsulate the photosensitive chip 32 and all the electronic components 33 therein. The base 34 can prevent dust possibly existing on the electronic component 33 from contaminating the photosensitive chip 32 when the base 34 only encapsulates the photosensitive chip 32 therein.

Further, as shown in fig. 7 to 9, the number of the electronic components 33 is plural and distributed around the photosensitive chip 32 and the mount 34, and the plural electronic components 33 are distributed in a circular area, which is related to the shape of the chip shake preventing movable portion 2112 of the chip shake preventing portion 211. The chip anti-shake movable portion 2112 has a cylindrical through hole, and when the chip anti-shake movable portion 2112 is fixed to the wiring board main body 311, a space reserved on the wiring board 31 is small, and therefore, the base 34 is used only for packaging the photosensitive chip 32, the plurality of electronic components 33 are distributed around the base 34, and further, the electronic components 33 can be distributed in a circular area. By the above design, the base 34 does not need to encapsulate the electronic component 33, so that the length dimension, width dimension and height dimension of the base are reduced, the cylindrical through hole of the chip anti-shake movable portion 2112 does not need to be further enlarged due to the dimension of the base 34 with rectangular design, and the plurality of electronic components 33 can be distributed in the base 34 and the cylindrical through hole of the chip anti-shake movable portion 2112, so that the lateral dimension of the camera module is reduced. The upper surface of the circuit board main body 311 may further be provided with dust-catching glue to catch dirt such as dust in the camera module, for example, the dust-catching glue may be annularly disposed on the periphery of the circular area or cover a plurality of the electronic components 33.

Further, a circuit board through hole 3111 is provided in the middle of the circuit board main body 311, preferably, the circuit board through hole 3111 is similar to the photosensitive chip 32, for example, the circuit board through hole 3111 is rectangular and is configured to accommodate the photosensitive chip 32, so as to reduce the height of the photosensitive assembly 30.

Further, the photosensitive assembly 30 further includes a reinforcing plate 37, where the reinforcing plate 37 is fixed to the back surface of the circuit board body 311 of the circuit board 31 (the side of the circuit board 31 away from the lens and opposite to the upper surface of the circuit board body) through an adhesive medium, so as to provide the supporting and reinforcing effects of the circuit board body 311, and the reinforcing plate 37 may be a metal plate such as a steel plate, a copper plate, or a plastic plate, which is not limited by the present application. In a specific example of the present application, the circuit board body 311 has a circuit board through hole 3111, the reinforcing plate 37 is fixed to the back surface of the circuit board body 311, the reinforcing plate 37 and the circuit board body 311 form a groove, the photo-sensing chip 32 is fixed to the reinforcing plate 37 by an adhesive medium and is accommodated in the circuit board through hole 3111 of the circuit board body 311, the reinforcing plate 37 may be thinner than the circuit board body 311 to reduce the height of the photo-sensing assembly 30, and the reinforcing plate 37 may provide a smoother surface for adhesive fixing of the photo-sensing chip 32 than the circuit board body 311.

The circuit board body 311 may be a hard board or a soft board, and the connection belt electrically connected to the photosensitive chip 32 is a hard-soft board. Specifically, the connection strips include a first connection strip 312 and a second connection strip 313, the first connection strip 312 and the second connection strip 313 are led out from two opposite sides of the circuit board main body 311 (for convenience of description, these two opposite sides may be referred to as a first side 301 and a second side 302, adjacent to the first side 301 and the second side 302 is a third side 303 and a fourth side 304, the third side 303 and the fourth side 304 are distributed oppositely, the first side 301, the third side 303, the second side 302 and the fourth side 304 are distributed in a clockwise direction) and bent upward (pointing upward in a direction away from the circuit board main body 311), and the first connection strip 312 further extends in a direction of the first side 301 toward the third side 303 and is bent toward the third side 302, the second connection strip 313 further extends in a direction of the second side 302 toward the third side 303 and is bent toward the third side 303, the first connection strip is further extended toward the third side 303, the second connection strip is further bent toward the third side 311 and is further extended toward the third side 311, the connection strip is further extended toward the third side 311 and is further extended toward the third side 311, the connection strip is further extended toward the third side 311 and is connected to the third side 311, the connection strip is further extended toward the third side 311 is electrically away from the third side 311, and the connection strip is connected to the third side main body is connected to the third side body, and the connection strip is further connected to the third connection strip is electrically connected to the third connection strip side main body 311. Through the above-mentioned connecting band structure and setting mode, when the drive assembly 20 drives the circuit board main part 311 removes, the resistance that the connecting band produced is less relatively, has solved the problem that the deflection of connecting band on the coplanar relative circuit board main part 311 can produce great resistance among the prior art.

The connector portion 314 may be a hard board or a soft board, and a connector 36 is electrically connected to the upper surface or the back surface of the connector portion 314, and the camera module 1 is electrically connected to a mobile electronic device through the connector 36 to derive the image information output by the photosensitive chip 32. In one example of the present application, the connector portion 314 may further electrically connect other electronic components to reduce the number of electronic components 33 electrically connected to the circuit board body 311.

Specifically, the first connection strap 312 includes a first connection strap flexible plate 3121, a first connection strap rigid plate 3122, and a third connection strap flexible plate 3123, the first connection strap flexible plate 3121 electrically connecting the circuit board main body 311 and the first connection strap rigid plate 3122, respectively, and the third connection strap flexible plate 3123 electrically connecting the first connection strap rigid plate 3122 and the connector portion 314, respectively. The first flexible connection board 3121 has a first bending portion 31211 and a second bending portion 31212, and the first flexible connection board 3121 is connected to the circuit board body 311 through the first bending portion 31211 and is bent upward from the first side 301 of the circuit board body 311, and is bent from the first side 301 to the third side 303 through the second bending portion 31212, so that the first flexible connection board 3121 is connected to the first rigid connection board 3122 located at the third side 303. The third flexible printed circuit board 3123 includes a third bending portion 31231, and the third flexible printed circuit board 3123 is connected to the lower portion of the first rigid printed circuit board 3122 through the third bending portion 31231 and is bent from the lower portion of the first rigid printed circuit board 3122 in a direction away from the circuit board main body 311, so that the third flexible printed circuit board 3123 is connected to the connector portion 314.

That is, the first bending portion 31211 is located near the intersection of the first side 301 and the bottom surface of the circuit board body 311, the second bending portion 31212 is located near the intersection of the first side 301 and the third side 303, and the third bending portion 31231 is located near the intersection of the third side 303 and the bottom surface of the circuit board body 311.

The second connection strap 313 includes a second connection strap soft board 3131 and a second connection strap hard board 3132, and the second connection strap soft board 3131 electrically connects the circuit board main body 311 and the second connection strap hard board 3132, respectively. The second flexible printed circuit board 3131 has a fourth bending portion 31311 and a fifth bending portion 31312, the second flexible printed circuit board 3131 is connected to the circuit board main body 311 through the fourth bending portion 31311 and is bent upward from the second side surface 302 of the circuit board main body 311, and is bent from the first side surface 301 to the third side surface 303 through the fifth bending portion 31312, so that the second flexible printed circuit board 3131 is connected to the second rigid printed circuit board 3132 located on the third side surface 303.

That is, the fourth bending portion 31311 is located near the intersection of the second side surface 302 and the bottom surface of the circuit board main body 311, and the fifth bending portion 31312 is located near the intersection of the second side surface 302 and the third side surface 303.

The direction perpendicular to the first side 301 or the second side 302 is taken as an X-axis direction, the direction perpendicular to the third side 303 and the fourth side 304 is taken as a Y-axis direction, the X-axis direction is perpendicular to the Y-axis direction, and the direction perpendicular to the plane in which the X-axis direction and the Y-axis direction are located (i.e., the plane in which the circuit board main body 311 is located) is taken as a Z-axis direction. The first bending part 31211 and the fourth bending part 31311 are adapted to bend in the Y-axis direction to reduce resistance of the connection strap when the circuit board body 311 is driven to move in the X-axis direction by the driving assembly 20; the second bending portion 31212 and the fifth bending portion 31312 are adapted to bend along the Z-axis direction to reduce the resistance of the connection strap when the circuit board body 311 is driven to move in the Y-axis direction by the driving assembly 20. The first bending portion 31211, the fourth bending portion 31311, the second bending portion 31212 and the fifth bending portion 31312 are further adapted to reduce resistance of the connection strap (including the first connection strap 312 and the second connection strap 313) when the circuit board body 311 is driven to rotate around the X-axis direction, the Y-axis direction or the Z-axis direction by the driving assembly 20.

The first flexible web 3121 further includes two first horizontal portions 31213 and one first inclined portion 31214 between the first bent portion 31211 and the second bent portion 31212. The first inclined portion 31214 connects the two first horizontal portions 31213, and the first connecting strip flexible sheet 3121 is extended from the first bending portion 31211 to the second bending portion 31212 and extended upward by the first inclined portion 31214, and a height difference exists between the two first horizontal portions 31213; and/or, the first flexible connecting strip 3121 extends from the first bending portion 31211 to the second bending portion 31212 and outwards (away from the direction of the main body of the circuit board) through the first inclined portion 31214, a space exists between planes of the two first horizontal portions 31213, and planes of the two first horizontal portions 31213 are parallel to or intersect with each other. With the above structure, an avoidance space is provided to avoid the driving assembly 20 or the outer frame 40, so as to avoid interference therebetween, and at the same time, help to reduce resistance when the driving assembly 20 drives the circuit board main body 311 to move.

The second connection tape flexible sheet 3131 further includes two second horizontal portions 31223 and one second inclined portion 31224 between the fourth bending portion 31311 and the fifth bending portion 31312. The second inclined portion 31224 connects the two second horizontal portions 31223, and the second connecting tape flexible board 3131 is extended from the fourth bending portion 31311 to the fifth bending portion 31312 and extended upward by the second inclined portion 31224, and there is a height difference between the two second horizontal portions 31223; and/or, the second flexible printed circuit board 3131 extends from the fourth bending portion 31311 to the fifth bending portion 31312 and extends outwards (away from the main body direction of the circuit board) through the second inclined portion 31224, and a space exists between planes of the two second horizontal portions 31223, and planes of the two second horizontal portions 31223 are parallel to or intersect with each other. With the above structure, an avoidance space is provided to avoid the driving assembly 20 or the outer frame 40, so as to avoid interference therebetween, and at the same time, help to reduce resistance when the driving assembly 20 drives the circuit board main body 311 to move.

Further, in one embodiment of the present application, the inner side and/or the outer side of the first bending part 31211 and the fourth bending part 31311 are adhered with a shaping layer so that the first connection band 312 is kept bent at the first bending part 31211 and the second connection band 313 is kept bent at the fourth bending part 31311; shaping layers are attached to the inner side and/or the outer side of the second bending part 31212 and the fifth bending part 31312 so that the first connection strap 312 is kept bent at the second bending part 31212 and the second connection strap 313 is kept bent at the fifth bending part 31312. The shaping layer may be copper foil or other thin and shaping component.

Further, fig. 10 shows the bottom surface of the wiring board 31 in a flattened state in one embodiment of the present application, the wiring board 31 including a wiring board main body 311, a first connection strap 312, a second connection strap 313, and a connector portion 314. The circuit board body 311 has a rectangular circuit board through hole 3111 for accommodating the photosensitive chip 32, the first side 301 of the circuit board body 311 is electrically connected to the first connection strap 312, and the second side 302 of the circuit board body 311 is electrically connected to the second connection strap 313.

The first connection strap 312 includes the first connection strap flexible board 3121, a first connection strap rigid board 3122 and the third connection strap flexible board 3123, the first connection strap flexible board 3121 includes a first bending portion 31211 and a second bending portion 31212, the first connection strap flexible board 3121 is connected with the circuit board main body 311 through the first bending portion 31211 and is connected with the first connection strap rigid board 3122 through the second bending portion 31212, and the first bending portion 31211 and the second bending portion 31212 are adapted to bend the first connection strap flexible board 3121 by bending; the third flexible connection board 3123 includes a third bending portion 31231, the third flexible connection board 3123 is connected to the first rigid connection board 3122 through the third bending portion 31231, and the third bending portion 31231 is adapted to bend the third flexible connection board 3123 by bending.

The second connection strap 313 includes the second connection strap flexible board 3131 and the second connection strap rigid board 3132, and the second connection strap flexible board 3131 includes a fourth bending portion 31311 and a fifth bending portion 31312. The second flexible printed circuit board 3131 is connected to the circuit board main body 311 through the fourth bending portion 31311, and the second flexible printed circuit board 3131 and the first flexible printed circuit board 3121 are distributed on two opposite sides of the circuit board main body 311; the second connecting strip flexible board 3131 is connected to the second connecting strip hard board 3132 through the fifth bending portion 31312. The fourth bending portion 31311 and the fifth bending portion 31312 are adapted to bend the second flexible printed circuit board 3131.

The first and second rigid connection boards 3122 and 3132 are fixed to and electrically connected to the third side 303 of the circuit board body 311 by bending the first and second flexible connection boards 3121 and 3131. Fig. 11 shows a structure in which the first and second connection band flexible plates 3121 and 3131 of the circuit board 31 are bent. Wherein the first rigid connection strap 3122 is located outside, that is, the second rigid connection strap 3132 is located between the driving assembly 20 and the first rigid connection strap 3122, the second rigid connection strap 3132 is located on the side surface (i.e. the third side surface 303) of the driving assembly 20 through at least two through holes of the second rigid connection strap 3132 and at least two hanging parts on the driving assembly 20, and the first rigid connection strap 3122 is located on the outside of the second rigid connection strap 3132 located on the side surface (i.e. the third side surface 303) of the driving assembly 20 through at least two through holes of the first rigid connection strap 3122 and at least two hanging parts on the driving assembly 20. The at least two suspension portions on the driving assembly 20 include a first suspension portion 22011 and a second suspension portion 22012 extending outwardly from the lens driving fixing portion 2201 at two sides of the lens driving electric connection portion 2203, respectively, the first suspension portion 22011 passes through the through hole on the second connecting strap stiffener 3132 and the through hole on the first connecting strap stiffener 3122, and the second suspension portion 22012 passes through the through hole on the first connecting strap stiffener 3122 and the through hole on the first connecting strap stiffener 3122, which are the first connecting strap stiffener 3122 and the second connecting strap stiffener 3132 positioned on the driving assembly 20.

The first and second rigid connection boards 3122 and 3132 are adapted to be adhered and fixed by an adhesive medium, such as a UV adhesive, a UV thermosetting adhesive, a double sided adhesive, or the like.

Further, the second connection strap stiffener 3132 is electrically connected to the first connection strap stiffener 3122 such that the second connection strap 313 is electrically conductive to the third connection strap stiffener 3123, and thus to the connector portion 314, through the first connection strap stiffener 3122. Fig. 8-12c show a specific example of the present application, the second rigid board 3132 includes a plurality of rigid board pads 31321, and the rigid board pads 31321 are located on the side of the second rigid board 3132 adjacent to the first rigid board 3122 after the circuit board 31 is bent, in other words, on the same side of the second rigid board 3132 as the bottom surface of the circuit board main body 311 in the flattened view of the circuit board 31 shown in fig. 10. The first circuit board 31 hard board includes a plurality of conductive through holes, the plurality of conductive through holes includes a plurality of first conductive through holes 31221 and a plurality of second conductive through holes 31222, when the first connection strap and the second connection strap 313 of the circuit board 31 are bent, the plurality of first conductive through holes 31221 of the first connection strap hard board 3122 are respectively opposite to the plurality of connection strap pads 31321 of the second connection strap hard board 3132, thereby being suitable for electrically connecting the plurality of first conductive through holes 31221 and the plurality of connection strap pads 31321 by providing a dielectric 31322 in the plurality of first conductive through holes 31221, so as to realize electrical conduction between the first connection strap hard board 3122 and the second connection strap hard board 3132. The dielectric 31322 may be solder such as solder ball, and the dielectric 31322 is fixed to the first conductive via 31221 by laser welding, and fixed to the connection strap pad 31321, that is, the first connection strap stiffener 3122 and the second connection strap stiffener 3132 are electrically connected by welding. The first connection strap stiffener 3122 and the second connection strap stiffener 3132 are electrically connected by the above-described welding method, so that the process of pressing the connector can be avoided compared with the conventional connection method by a connector, thereby avoiding the pressing of the driving component and reducing the generation of the bad driving component.

In particular, fig. 12 a-12 b show a schematic structure of the first rigid connection board 3122 and the second rigid connection board 3132 welded through the dielectric 31322.

As shown in fig. 12a, the connection strap pad 31321 is located between the second connection strap stiffener 3132 and the first connection strap stiffener 3122, the first conductive through hole 31221 of the first connection strap stiffener 3122 has an annular conductive side 312211 therein, and the conductive side 312211 of the first conductive through hole 31221 is fixed to and electrically connected to the connection strap pad 31321 through the dielectric 31322, thereby electrically conducting the first connection strap stiffener 3122 and the second connection strap stiffener 3132, wherein the annular conductive side 312211 may be implemented by a metal plating layer disposed in the first conductive through hole 31221.

Fig. 12b-12c show another structure of the first conductive via 31221, where the first conductive via 31221 is composed of a conductive side 312211 and an insulating side 312212, in other words, the metal plating layer disposed in the first conductive via 31221 is distributed only on a part of the side of the first conductive via 31221 (as shown in fig. 12c, the conductive side 312211 and the insulating side 312212 are respectively located at two sides as viewed perpendicular to the first circuit board 31), and further, the electrical connection medium 31322 is biased to the conductive side 312211 during soldering, and the electrical connection medium 31322 is only contacted, fixed and electrically connected with the conductive side 312211 of the first conductive via 31221, so that the connection contact condition of the electrical connection medium 31322 and the connection strap pad 31321 can be observed from the insulating side 312212 of the first conductive via 31221 to the conductive side 312211, and whether the problem of cold soldering exists is observed, so as to reduce the bad camera module. Preferably, in one of the first conductive through holes 31221, the ratio of the occupied area of the conductive side 312211 to the insulating side 312212 is between 0.8 and 1.25, for example, the occupied area of the conductive side 312211 to the insulating side 312212 is equal, so that it is possible to ensure electrical connection between the first connection strap stiffener 3122 and the second connection strap stiffener 3132 while also facilitating observation of a problem of cold solder joint.

Further, in order to facilitate the observation of the soldering condition between the plurality of first conductive through holes 31221 and the connection tape pad 31321, preferably, in a preferred embodiment of the present application, the conductive sides 312211 of the plurality of first conductive through holes 31221 are all located on the same side, and the insulating sides 312212 of the plurality of first conductive through holes 31221 are all located on the other side, for example, the insulating sides 312212 of the plurality of first conductive through holes 31221 are all located on the upper side (i.e., the side away from the circuit board main body 311), so that the soldering condition is easily observed from the upper side of the camera module. Of course, the insulating sides 312212 of the plurality of first conductive vias 31221 may be located on the lower side, the left side, or the right side of the camera module, or may be located between the left side and the upper side, so that visual inspection of the welding condition may be achieved.

During soldering, the electrical connection medium 31322, such as tin, needs to be heated to a melting point, and is in contact reaction with the connection tape pad 31321 and the first conductive via 31221, and if the temperature is insufficient, the conductive connection medium 31322 cannot react with the connection tape pad 31321 and the first conductive via 31221, thereby creating a problem of cold joint. When the dielectric 31322 is sprayed between the connection tape pad 31321 and the first conductive via 31221 by a laser welding process, the excessively long distance between the connection tape pad 31321 and the first conductive via 31221 may cause the dielectric 31322 to cool, and thus, preferably, the gap between the connection tape pad 31321 and the first conductive via 31221 is less than 100 μm and the gap between the first connection tape hard plate 3122 and the second connection tape hard plate 3132 is less than 100 μm.

In order to reduce the foregoing cold joint problem, it is further ensured that the electrical connection medium 31322 and the connection strap pad 31321 and the electrical connection medium 31322 and the first conductive via 31221 may react with each other by secondary heating, so as to combine with each other, thereby avoiding the cold joint problem.

Or the problem of cold joint can be reduced by pre-tinning. The pre-soldering means that solder (or other electrical connection medium) is directly disposed on the connection tape pad 31321, so that the solder reacts with and combines with the pad, and then the melted solder is disposed between the connection tape pad 31321 and the first conductive via 31221 through the first conductive via 31221, so as to realize electrical conduction. The material of the connection strap pad 31321 is generally different from that of the electrical connection medium 31322, during soldering, the two are required to react at the contact surface to ensure stable bonding, and the reacting process has high requirement on temperature, but in one embodiment of the present application, a layer of tin can be provided on the surface of the connection strap pad 31321 by pre-soldering, so that during the subsequent soldering process, the tin on the surface of the solder strap pad 31321 is easy to bond, and the distance between the surface of the solder strap pad 31321 and the first conductive via 31221 is also pulled, the temperature of the solder can still be kept high when the solder is distributed on the surface of the connection strap pad 31321, so that a better soldering effect is obtained, and the requirement on the soldering process can be reduced, preferably, the thickness of the solder is between 10 μm and 50 μm, so as to maintain a good soldering effect.

Further, in an embodiment of the present application, the electrical connection between the driving assembly 20 and the circuit board 31 may also be achieved by means of the first conductive via-pad soldering described above. As shown in fig. 4-5 and 10-11, the second rigid connecting strap 3132 has a concave portion, so that when the second rigid connecting strap 3132 is bent and suspended on the first suspension portion 22011 and the second suspension portion 22012, the lens driving electric connection portion 2203 of the driving assembly 20 is avoided, and the lens driving electric connection portion 2203 is exposed, so as to be suitable for being electrically connected to the first rigid connecting strap 3122. Specifically, the plurality of lens driving pads 22031 on the lens driving electrical connection portion 2203 correspond to the plurality of second conductive vias 31222 on the first connection strap stiffener 3122 and are electrically connected through the electrical connection medium 31322.

The plurality of lens driving pads 22031 on the lens driving electrical connection portion 2203 are arranged in two rows to reduce the length of the lens driving electrical connection portion 2203, for example, the number of lens driving pads 22031 located above is 4, and the number of lens driving pads 22031 located below is also 4. Further, in order to reduce the size of the lens driving electrical connection portion 2203 in the Z-axis direction, the upper and lower rows of lens driving pads 22031 are staggered with each other, and in order to improve the utilization rate of the area of the lens driving electrical connection portion 2203, the lens driving pad 22031 is in a shape with a large size on one side and a small size on the other side, that is, a "gourd" type pad, and the size of the lens driving pad 22031 close to one side of the edge of the lens driving electrical connection portion 2203 is relatively larger.

The lens driving electrical connection portion 2203 is a rigid-flexible board, the flexible board portion of the lens driving electrical connection portion 2203 is electrically connected with the driving element of the lens driving portion 22 and the rigid board portion of the lens driving electrical connection portion 2203, the plurality of lens driving pads 22031 are located on the rigid board portion of the lens driving electrical connection portion 2203, and the rigid board portion of the lens driving electrical connection portion 2203 is fixed on the side surface of the lens driving fixing portion 2201 of the lens driving portion 22, so as to maintain the stability of the electrical connection between the lens driving electrical connection portion 2203 and an external power supply. Further, the outer surface of the lens driving pad 22031 is lower than the outer surface of the hard board portion of the lens driving electrical connection portion 2203, so as to provide protection for the lens driving pad 22031, and prevent the lens driving pad 22031 from being scratched, which affects the yield of electrical connection.

In one embodiment of the present application, the plurality of second conductive vias 31222 on the first connection strap stiffener 3122 are also comprised of a conductive side 312211 and an insulating side 312212, so as to facilitate viewing of the soldering between the second conductive vias 31222 and the lens drive pad 22031. Preferably, the conductive sides 312211 of the plurality of second conductive vias 31222 are all located on the same side, the insulating sides 312212 of the plurality of second conductive vias are all located on the other side, for example, the conductive sides 312211 of the plurality of second conductive vias 31222 are all located on the lower side (i.e., the side near the circuit board main body 311), so as to facilitate the observation of the soldering condition from the upper side of the camera module. Of course, the conductive sides 312211 in the second conductive vias 31222 may be located on the upper side, the left side, or the right side of the camera module, or may be located between the right side and the lower side, so that visual inspection of the welding condition may be achieved.

In order to improve the soldering yield between the second conductive via 31222 and the lens driving pad 22031 and reduce the risk of cold soldering, the gap between the second conductive via 31222 and the lens driving pad 22031 is preferably less than 100 μm, i.e., the gap between the first connection strap stiffener 3122 and the lens driving connection is less than 100 μm. And, the second conductive via 31222 and the lens driving pad 22031 may be soldered by secondary heating or pre-soldering, and when soldering is performed by pre-soldering, the thickness of the solder is set to be between 10 μm and 50 μm, so as to maintain a good soldering effect.

That is, the structure of the conductive via-pad bonding according to the present application may be applied to the electrical connection between the driving unit 20 and the wiring board 31. The driving assembly 20 includes a driving electrical connection portion (e.g., lens driving electrical connection portion 2203) located at a side of the driving assembly 20, and a plurality of pads (e.g., lens driving pads 22031) on the driving electrical connection portion are electrically connected to a plurality of conductive vias on a hard board portion (e.g., first connection strap hard board 3122) of the circuit board through electrical connection dielectrics disposed in the conductive vias.

The structure for welding the conductive through hole and the bonding pad can be applied when the electric connection part of the camera module is arranged on the side surface of the camera module, so as to avoid the defect of the camera module caused by the compression of the camera module during electric conduction. The electrical connection part is disposed on the side of the camera module, or the electrical connection part of the driving assembly 20 is disposed on the side, or the electrical connection part of the photosensitive assembly 30 is disposed on the side, and is soldered to the electrical connection part through a circuit board 31 having a conductive through hole, so as to electrically connect the driving assembly 20 or the photosensitive assembly 30 with the mobile electronic device.

Further, to maintain the shape of the circuit board 31 after bending, particularly the bending of the first bending portion 31211 and the fourth bending portion 31311, the reinforcing plate 37 may also be bent to maintain the bending of the first flexible printed circuit board 3121 at the first bending portion 31211 and the bending of the second flexible printed circuit board 3131 at the fourth bending portion 31311.

Specifically, fig. 13-15 show schematic diagrams of the stiffener 37 attached to the bottom surface of the circuit board main body 311, where the stiffener 37 includes a stiffener main body 371, a first stiffener side 372, and a second stiffener side 373, and the stiffener main body 371, the first stiffener side 372, and the second stiffener side 373 may be integrally formed. The first stiffener side 372 further includes a first stiffener bent portion 3721, the second stiffener side 373 further includes a second stiffener bent portion 3731, the stiffener is attached and fixed to the bottom surface of the circuit board main body 311 by the stiffener main body 371, so that the stiffener main body 371 and the circuit board main body 311 having the circuit board through hole 3111 form a groove for accommodating the photosensitive chip 32, the first stiffener side 372 is fixedly connected to one side of the stiffener main body 371 (the same side as the first connecting strip flexible board 3121, i.e. the first side 301) by the first stiffener bent portion 3721, and the second stiffener side 373 is fixedly connected to the other side (the same side as the second connecting strip flexible board 3131, i.e. the second side 302) of the stiffener main body 371 opposite to the first stiffener side 372 by the second stiffener bent portion 3731. Preferably, the reinforcing plate 37 is made of a metal material such as stainless steel or copper suitable for bending.

The first stiffener side 372 is bent and extended upward along the first side 301 of the stiffener body 371 by bending the first stiffener bend 3721, and the second stiffener side 373 is bent and extended upward along the second side 302 of the stiffener body 371 by bending the second stiffener bend 3731. The shape of the first and second stiffener sides 372 and 373 after bending is not easy to change, so that the first and second stiffener sides 372 and 373 are adapted to maintain the bending of the first and fourth bending portions 31211 and 31311 and maintain the shape of the first and second connection strap flexible plates 3121 and 3131 after bending, thereby reducing the resistance of the first and second connection straps 312 and 313 when the driving assembly 20 drives the circuit board body 311 to move.

The width of the first stiffener curved portion 3721 is smaller than the width of the first stiffener side 372, so as to reduce the difficulty of bending the first stiffener curved portion 3721, and further, the first stiffener curved portion 3721 further has a through hole, so as to further reduce the resistance of bending the first stiffener curved portion 3721. The width of the second reinforcing plate bending portion 3731 is smaller than that of the second reinforcing plate side portion 373, so as to reduce the difficulty of bending the second reinforcing plate bending portion 3731, and further, the second reinforcing plate bending portion 3731 further has a through hole, so as to further reduce the resistance of bending the second reinforcing plate bending portion 3731.

As shown in fig. 16-17, in one embodiment of the present application, the chip anti-shake electrical connection portion 2114 of the chip anti-shake portion 211 is electrically connected to the circuit board main body 311 by pin soldering.

Specifically, in the assembly of the camera module 1, the optical lens 10 is assembled to the driving assembly 20, and the driving assembly 20 is fixed to the circuit board body 311 and electrically connected to the circuit board body 311, thereby reducing the height of the camera module. The driving assembly 20 is fixed on the circuit board main body 311, and may be assembled by an HA process or an AA process, where the HA process refers to that the driving assembly 20 and the circuit board 31 are directly adhered and fixed by an adhesive medium after the parallelism is adjusted, which generally requires that a gap between the driving assembly 20 and the circuit board main body 311 is reserved by about 0.03mm; the AA process refers to an active calibration process, which is to assemble the optical lens 10 on the driving component 20 to form a semi-finished product of the camera module, then adjust the positional relationship between the semi-finished product of the camera module and the circuit board main body 311 according to the imaging quality of the image formed by the light received by the semi-finished product of the camera module by the photosensitive component 30, and then adhere and fix the semi-finished product of the camera module and the circuit board main body 311 through an adhesive medium, which generally requires that a gap of about 0.16mm is reserved between the driving component 20 and the circuit board main body 311. Therefore, when the driving assembly 20 is adhesively fixed to the circuit board main body 311 in order to reduce the height of the camera module, the gap between the driving assembly 20 and the circuit board main body 311 is low, regardless of whether the HA process or the AA process is performed.

In one embodiment of the present application, the chip anti-shake electrical connection portion 2114 includes a plurality of pins 21141, the pins 21141 include a lateral portion 211411 fixedly connected to the chip anti-shake fixing portion 2111 and a vertical portion 211412 integrally formed with the lateral portion 211411 and perpendicular (substantially perpendicular) to the lateral portion 211411, the vertical portion 211412 of the pins 21141 determines the height of the pins 21141, and a common pin size is 0.5mm, which is far beyond the gap between the driving assembly 20 and the circuit board main body 311. In the conventional camera module, the pins are usually soldered on the circuit board 31, and a gap of 0.2mm is reserved between the pins and the circuit board 31, which results in an increase in the gap between the driving assembly 20 and the circuit board body 311, for the present application, so that the height of the camera module is increased, which is not consistent with the requirement of reducing the height of the camera module.

Thus, in some embodiments of the present application, the circuit board body 311 has a plurality of side recesses 3112, the plurality of side recesses 3112 are located at positions corresponding to the plurality of pins 21141 of the chip anti-shake connection portion on one side of the circuit board body 311, the pins 21141 pass through the circuit board body 311 through the side recesses 3112, and the pins 21141 and the side recesses 3112 are electrically connected by laying out a dielectric connection medium. Specifically, the side recess 3112 has a metal plating layer on the surface thereof so as to be soldered to and electrically connected to the dielectric connection medium. Through the above structure, the gap between the driving assembly 20 and the circuit board main body 311 is not limited by the size of the pins 21141 and the soldering process, so that the height of the camera module is reduced.

Fig. 17 is a schematic diagram showing a relative positional relationship between the pins 21141 and the circuit board main body 311 according to an embodiment of the present application. The vertical portion 211412 of the pin 21141 preferably protrudes out of the bottom surface of the circuit board body 311 (i.e., the back surface of the circuit board body 311), that is, the bottom surface of the vertical portion 211412 of the pin 21141 is lower than the bottom surface of the circuit board body 311, so that the electrical connection medium can have a larger contact area with the side surface of the pin 21141, thereby improving the yield of soldering and ensuring the electrical connection effect. When a reinforcing plate is further attached to the bottom surface of the board main body 311, it is preferable that the reinforcing plate 37 is not attached to the bottom surface of the side recess 3112, and the bottom surface of the vertical portion 211412 of the pin 21141 does not protrude from the bottom surface of the reinforcing plate 37, that is, it is preferable that the bottom surface of the vertical portion 211412 of the pin 21141 is between the bottom surface of the board main body 311 and the bottom surface of the reinforcing plate 37, so that the reinforcing plate 37 can protect the pin 21141 and reduce the risk of short circuit or the like caused by contact between the pin 21141 and other components. It should be noted that, in other embodiments of the present application, the bottom surface of the vertical portion 211412 of the pin 21141 may protrude from the bottom surface of the stiffener 37, or the bottom surface of the vertical portion 211412 of the pin 21141 may not protrude from the bottom surface of the circuit board body 311, that is, the bottom surface of the vertical portion 211412 of the pin 21141 may be higher than the bottom surface of the circuit board body 311, and may be located between the upper surface and the bottom surface of the circuit board body 311.

Further, the angle between the vertical portion 211412 and the transverse portion 211411 is between 80 ° and 100 °, and the angle between the vertical portion 211412 and the transverse portion 211411 is 90 ° when the vertical portion 211412 is perpendicular to the transverse portion 211411. In a preferred embodiment of the present application, the vertical portion 211412 has an inclination angle greater than 0 ° and less than 10 ° with respect to the perpendicular line of the transverse portion 211411, so that the length of the vertical portion 211412 can be longer at the same height, and the difficulty in the manufacturing process of the pin is reduced.

From the overall view of the camera module, the first flexible connection board 3121 is located on the first side 301 of the camera module 1, the second flexible connection board 3131 is located on the second side 302 of the camera module 1, the lens driving electric connection portion 2203 of the lens driving portion 22, the first rigid connection board 3122 and the second rigid connection board 3132 are located on the third side 303 of the camera module 1, and the chip anti-shake electric connection portion 2114 of the chip driving portion 21 is located on the fourth side 304 of the camera module 1.

Fig. 18 to 21 show a schematic view of an outer frame 40 of the present application, the outer frame 40 including a frame main body 41, a frame cover 42, and a frame base plate 43.

The frame body 41 has a through hole to accommodate the driving assembly 20, and the driving assembly 20 is fixed to the frame body 41 through an adhesive medium to provide a supporting position of the driving assembly 20.

The frame bottom plate 43 is fixed to the bottom surface of the frame body 41 to protect the photosensitive assembly 30, and a gap exists between the frame bottom plate 43 and the bottom surface of the photosensitive assembly 30, so that the frame bottom plate 43 does not interfere with the movement of the photosensitive assembly 30 when the photosensitive assembly 30 is driven by the chip anti-shake portion 211 of the driving assembly 20. Further, the frame bottom plate 43 may further have a through hole, where the through hole of the frame bottom plate 43 corresponds to the chip anti-shake electrical connection portion 2114 of the chip anti-shake portion 211 of the driving assembly 20, so as to provide a larger space for the pins 21141, avoid contact between the pins 21141 and the frame bottom plate 43, and reduce risks of interference and short circuit between each other.

The frame cover 42 is fixed to the top surface of the frame body 41, thereby encapsulating the driving assembly 20 with the frame body 41, and reducing the risk of dirt such as dust falling between the driving assembly 20 and the frame body 41. The frame cover 42 has a through hole, and the through hole of the frame cover 42 is adapted to provide incident light to the optical lens 10, and the optical lens 10 can be passed through, so that the optical lens 10 protrudes out of the frame cover 42.

Further, as shown in fig. 20 to 21, the outer frame 40 further includes a conductive cloth 44, and the conductive cloth 44 is attached to the bottom surface of the frame base 43. The conductive cloth 44 may cover the through holes of the frame base 43, so that dirt such as dust may not enter the camera module. The conductive cloth 44 may further include a conductive cloth side 441, and the conductive cloth 44 is further attached to the side surface of the frame body 41 through the conductive cloth side 441, and when the frame body 41 is made of metal such as aluminum, stainless steel, etc., the conductive cloth 44 may be electrically connected to the frame body 41, so that effects such as conduction and electromagnetic shielding may be achieved. The conductive cloth 44 may include one or more conductive cloth sides 441, and in one specific example of the present application, the number of the conductive cloth sides 441 is 4 and is respectively distributed on four sides of the frame body 41.

Further, as shown in fig. 18, the outer frame 40 further includes an insulating sheet 45, and the insulating sheet 45 is disposed between the first connecting band hard plate 3122 and the frame body 41. When the frame body 41 is made of a conductive material, there is a risk that the first hard plate is short-circuited due to contact between the frame body 41 and the first hard plate, so that the above risk can be reduced by disposing the insulating sheet 45 between the first connecting strip hard plate 3122 and the frame body 41. Specifically, the insulating sheet 45 may be fixed to the inner side of the frame body 41 by adhesion, may be fixed to the outer side of the first rigid connection band 3122 by adhesion, or the insulating sheet 45 may be placed only between the first rigid connection band 3122 and the frame body 41.

In the present application, the main body portions of the first and second connection bands are arranged on the peripheral side of the optical element of the image pickup module, and thus may be referred to as side connection bands. In the side connection strap, a portion bent upward from the side of the circuit board main body may be referred to as a bent portion (or an upward bent portion, which may be regarded as a portion of the side connection strap). The portion disposed on the peripheral side of the image pickup module optical element may be referred to as a side-set connection tape main body. The surface of the side-mounted connector strip body may be substantially perpendicular to the surface of the circuit board body. In some embodiments, the side connecting strap and the circuit board body may be integrally formed, for example, the side connecting strap and the circuit board body may be integrally formed by a manufacturing process of a rigid-flex board. The circuit board body may be a hard board (e.g., a PCB board), the bending portion of the side connection strap may be a soft board (e.g., an FPC board), and the side connection strap body may include a portion of the soft board and a portion of the hard board. Wherein portions of the stiffener can be used to suspend the side-mounted connection strap from a static member of the optical actuator (e.g., the actuator mount).

In the present application, the optical element means an element for constituting an imaging optical system, and generally includes a plurality of lenses for imaging and a photosensitive element (typically a photosensitive chip). A plurality of lenses for imaging and supporting members thereof (e.g., lens barrels) may constitute the optical lens. The photosensitive element is located in the photosensitive assembly.

In the foregoing embodiment, the drive assembly 20 constitutes an optical actuator. The optical actuator may be a dual OIS optical actuator, i.e. the optical actuator has a lens driving portion and a chip driving portion. The optical actuator may include an actuator fixing portion and an actuator movable portion. The actuator fixing part may include a lens driving fixing part and a chip anti-shake fixing part, which may be fixed together. The actuator movable part may include a lens driving movable part and a chip anti-shake movable part.

In the present application, the surface of the hard sheet or the connecting tape means a surface perpendicular to the thickness direction of the hard sheet or the connecting tape (i.e., the normal direction of the surface coincides with the thickness direction of the hard sheet). Each stiffener or connecting strip includes two surfaces, an inner surface on the inner side (i.e., on the side facing the optical axis) and an outer surface on the outer side (i.e., on the side facing away from the optical axis).

In the present application, the photosensitive chip and/or the optical actuator of the camera module generally have circuits for supplying power and/or implementing a certain corresponding function, and these circuits may be arranged on one or more circuit boards, and for convenience of description, all the substrates and the connection members of these substrates for supplying power and/or arranging functional circuits in the camera module will be referred to herein as a circuit board structure.

In some embodiments of the present application, a camera module includes an optical actuator, an optical lens, and a photosensitive assembly; wherein the optical actuator has a chip anti-shake portion. At least one side of the chip anti-shake part is provided with a plurality of conductive pins, at least one side of the circuit board main body is provided with a plurality of side concave parts, each side concave part is formed by concave inward side of the side surface of the circuit board main body, and the conductive pins extend into the side concave parts and are electrically connected with the side concave parts through welding media. The chip anti-shake part comprises a chip anti-shake fixing part and a chip anti-shake movable part, and in a preferred embodiment, the plurality of conductive pins are led out from at least one side surface of the chip anti-shake movable part. In the preferred embodiment, the conductive pins are led out from the chip anti-shake movable part and are electrically connected with the side concave part of the circuit board main body, so that the chip anti-shake movable part can be well adapted to chip anti-shake movement while the chip anti-shake part is electrically connected with the circuit board main body. In the chip anti-shake moving process, the chip anti-shake movable part and the circuit board main body move together, namely the chip anti-shake movable part and the circuit board main body are relatively static. It should be noted that in fig. 3 of the present application, some lines of the chip anti-shake fixing portion and the chip anti-shake movable portion are omitted for simplifying the drawing, and in fact, in the preferred embodiment of the present application, the conductive pins for electrically connecting with the side recesses are led out from the side of the chip anti-shake movable portion (instead of the chip anti-shake fixing portion).

Further, in some embodiments of the present application, the frame base plate has pin relief through holes; the pin avoidance through hole can be positioned right below the side concave part, the size of the pin avoidance through hole is larger than that of the side concave part under the angle of elevation, and the distance between the contour line of the pin avoidance through hole and the contour line of the side concave part is not smaller than 15 mu m; the depth of the side concave part is 15-25 μm. The depth of the side concave portion is a distance recessed inward from the side face of the circuit board main body.

Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and are not limiting. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the appended claims.

Claims

1. The circuit board for the camera module is characterized by comprising a circuit board main body and at least two side connecting belts;

the circuit board main body is provided with a surface perpendicular to the optical axis of the camera module and a plurality of side surfaces parallel to the optical axis; the plurality of sides includes a first side, a second side opposite the first side, a third side adjacent the first side, and a fourth side opposite the third side;

The side connecting belt is led out from the side surface of the circuit board main body, is bent upwards, and extends to form a side connecting belt main body on the side surface of the camera module after being bent; the side connecting belts are provided with hard plates, the outer surface of the hard plate of one side connecting belt is provided with a plurality of bonding pads, the hard plate of the other side connecting belt is provided with a plurality of conductive through holes, and the hard plates of the two side connecting belts are overlapped; a soldering medium is attached to the side wall of the conductive through hole and passes through the conductive through hole to contact the bonding pad;

wherein, the side connection area includes:

A first connection strap including a first connection strap flexible board and a first connection strap rigid board, the first connection strap flexible board being led out from the first side of the circuit board main body and bent upward, then extending along the first side and then bent to the third side, the first connection strap rigid board being located at the third side and a side of the first connection strap rigid board being connected to the first connection strap flexible board, a surface of the first connection strap rigid board being parallel to the optical axis; and

The second connecting belt comprises a second connecting belt soft board and a second connecting belt hard board, the second connecting belt soft board is led out from the second side surface of the circuit board main body, is bent upwards, then extends along the second side surface and is bent to the third side surface, the second connecting belt hard board is positioned on the third side surface, the side surface of the second connecting belt hard board is connected with the second connecting belt soft board, and the surface of the second connecting belt hard board is parallel to the optical axis;

The circuit board further comprises a third connecting band which is led out from the lower side face of the first connecting band hard plate and is bent outwards, the surface of the third connecting band is perpendicular to the optical axis, and the free end of the third connecting band is provided with a connector which is suitable for being inserted into a main board of electronic equipment carrying the camera module.

2. The wiring board for an image pickup module according to claim 1, wherein the first connection strap stiffener is located outside the second connection strap stiffener, the first connection strap stiffener has a plurality of conductive vias, an outer surface of the second connection strap stiffener has a plurality of pads, the conductive vias and the pads are connected by a soldering medium, the soldering medium is injected into and through the conductive vias in a molten state, and is attached to the pads and the conductive vias after cooling to electrically connect the conductive vias and the pads.

3. The wiring board for an image pickup module according to claim 2, wherein the first connection-tape hard plate and the second connection-tape hard plate are bonded by an adhesive medium; the first connecting strip stiffener has a gap of no more than 100 μm between an inner surface of the first connecting strip stiffener and an outer surface of the second connecting strip stiffener.

4. A wiring board for an image pickup module according to claim 3, wherein the soldering medium enters the conductive via and adheres to a side wall of the conductive via in a molten state in a jet form, and passes through the conductive via and contacts the pad; and the welding medium, after curing, forms a connection that spans a gap between an inner surface of the first connecting strip stiffener and an outer surface of the second connecting strip stiffener;

And a pore is reserved between the welding medium and a part of pore wall of the conductive through hole.

5. The circuit board for camera module of claim 3, wherein a metal layer is attached to a hole wall of the conductive via, and the metal layer is a metal plating layer.

6. The circuit board for an imaging module of claim 5, wherein the metal layer is a ring-shaped metal layer.

7. The circuit board for an imaging module according to claim 5, wherein the metal layer is attached to a portion of a wall of the conductive via to form an unsealed metal layer.

8. The wiring board for an imaging module of claim 7, wherein in the first connecting strip stiffener, all of the non-closed metal layers of the conductive vias are disposed on the same side of the conductive vias.

9. The circuit board for a camera module of claim 8, wherein in the first connecting strip hard plate, all of the metal layers of the conductive vias are arc-shaped metal layers, and the arc-shaped metal layers are disposed on the lower sides of the conductive vias.

10. A circuit board for an imaging module according to claim 3, wherein the soldering medium is tin or a tin-containing soldering material.

11. A camera module, comprising: an outer frame and an optical lens, an optical actuator, a photosensitive chip and the wiring board of any one of claims 1 to 10 accommodated in the outer frame;

The optical actuator is suitable for driving the optical lens and/or the photosensitive chip to move; the optical actuator includes an actuator fixing portion, and the side connection strap is disposed at a gap between the outer frame and the actuator fixing portion.

12. The camera module of claim 11, wherein the photosensitive chip is attached to an upper surface of the circuit board body; the upper surface of the circuit board is provided with an annular base, the annular base surrounds the periphery of the photosensitive chip, the top surface of the annular base is mounted on the optical filter, the annular base and the circuit board body form a closed cavity, and the photosensitive chip is packaged in the closed cavity.

13. The camera module according to claim 11, wherein the center of the circuit board main body is provided with a central through hole, a reinforcing plate is attached to the lower surface of the circuit board main body, the photosensitive chip is attached to the upper surface of the reinforcing plate, and the photosensitive chip is arranged in the central through hole; the circuit board comprises a circuit board body, wherein the upper surface of the circuit board body is provided with an annular base, the annular base surrounds the periphery of a photosensitive chip, the top surface of the annular base is arranged on an optical filter, the annular base, the circuit board body and a reinforcing plate form a closed cavity, and the photosensitive chip is packaged in the closed cavity.

14. The camera module according to claim 12, wherein the optical actuator further comprises a chip anti-shake movable portion, a photosensitive package formed by the circuit board main body, the optical filter, the annular base, and the photosensitive chip is fixed to the chip anti-shake movable portion, the photosensitive package is adapted to move relative to the actuator fixing portion under the driving of the chip anti-shake movable portion, and the first connecting strap stiffener and the second connecting strap stiffener are both directly or indirectly fixed to the actuator fixing portion.

15. The camera module of claim 12, wherein the optical actuator further comprises a chip anti-shake movable portion, a stiffening plate is attached to a lower surface of the circuit board main body, and a photosensitive package formed by the circuit board main body, the optical filter, the annular base, the stiffening plate and the photosensitive chip is fixed to the chip anti-shake movable portion, and is adapted to move relative to the actuator fixing portion under the driving of the chip anti-shake movable portion, and the first connecting strap stiffener and the second connecting strap stiffener are both directly or indirectly fixed to the actuator fixing portion.

16. The image capturing module of claim 14 or 15, wherein the optical actuator further comprises a lens driving movable portion, the optical lens being mounted to the lens driving movable portion and adapted to move relative to the actuator fixing portion under the drive of the lens driving movable portion.

17. The camera module of claim 11, wherein the outer side of the actuator fixing portion has a protrusion protruding outward, the hard plate of the side connection strap has a hanging hole, and the protrusion passes through the hanging hole to hang the side connection strap to the actuator fixing portion.