CN119421381A

CN119421381A - Phase change heat dissipation system and manufacturing method thereof

Info

Publication number: CN119421381A
Application number: CN202411493449.6A
Authority: CN
Inventors: 余怀强; 彭芸浩; 毛世平; 叶锋; 刘雨陇
Original assignee: CETC 26 Research Institute
Current assignee: CETC 26 Research Institute
Priority date: 2024-10-24
Filing date: 2024-10-24
Publication date: 2025-02-11

Abstract

The invention relates to the technical field of heat dissipation structures, in particular to a phase-change heat dissipation system and a manufacturing method thereof, wherein the phase-change heat storage system comprises a phase-change heat storage module; the liquid cooling runner is respectively contacted with the phase-change heat storage module and the heat source and forms a closed circulation loop, a cooling medium is arranged in the liquid cooling runner, the liquid cooling runner is used for absorbing heat of the heat source through the cooling medium and transmitting the heat to the phase-change heat storage module so as to radiate the heat source, and the driving module is arranged on the liquid cooling runner and is used for driving the cooling medium to flow in the liquid cooling runner. The size of the phase-change heat storage module can be adjusted according to the needs, so that the scheme can be applied in a narrow space. The heat of the heat source can be transferred to the phase-change heat storage module through the liquid cooling runner and the cooling medium, so that the problem of heat dissipation in a closed and adiabatic environment is solved.

Description

Phase-change heat dissipation system and manufacturing method thereof

Technical Field

The invention relates to the technical field of heat dissipation structures, in particular to a phase-change heat dissipation system and a manufacturing method thereof.

Background

In some industrial application scenarios, the heat source inside the electronic device needs to be placed in a closed, thermally insulating and space-limited environment for a certain period of time. Because the space is airtight, the heat of the heat source cannot be emitted, and the electronic equipment often adopts a phase-change heat storage mode to realize a better heat dissipation effect, so that the aim of controlling the temperature of the heat source not to exceed the target temperature in a specific time is fulfilled. However, the conventional phase-change heat storage module is often placed at a position far from the heat source, so that a heat transfer path from the heat source to the phase-change heat storage module is long, and the temperature rise of the heat source is high due to high thermal resistance, and even the reliability of the device is seriously affected. Therefore, the conventional phase-change heat dissipation means have difficulty in solving the heat dissipation problem of high-power chips and components in an environment where the space is limited and closed.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a phase-change heat dissipation system and a manufacturing method thereof, which are used for solving the problem that the prior art cannot effectively dissipate heat in a closed, adiabatic and narrow space environment.

To achieve the above and other related objects, the present invention provides a phase change heat dissipation system, comprising:

A phase change heat storage module;

the liquid cooling flow passage is respectively contacted with the phase-change heat storage module and the heat source and forms a closed circulation loop, a cooling medium is arranged in the liquid cooling flow passage, and the liquid cooling flow passage is used for absorbing heat of the heat source through the cooling medium and transmitting the heat to the phase-change heat storage module so as to radiate the heat source;

the driving module is arranged on the liquid cooling flow channel and used for driving the cooling medium to flow in the liquid cooling flow channel.

Optionally, the liquid cooling runner includes liquid cooling connecting tube, is used for the first heat conduction section to the heat source heat dissipation and is used for with heat transfer to the second heat conduction section of phase transition heat accumulation module, liquid cooling connecting tube will first heat conduction section and second heat conduction section head and tail communicate in proper order and form closed circulation return circuit.

Optionally, the first heat conduction section includes a first sub heat conduction section, the first sub heat conduction section sets up between two adjacent heat sources, be provided with a sub runner in the first sub heat conduction section, a sub runner with liquid cooling connecting tube intercommunication.

Optionally, the first heat conduction section further comprises a heat dissipation plate, a second sub-runner is arranged in the heat dissipation plate, and the first sub-runner is communicated with the liquid cooling connecting pipeline through the second sub-runner.

Optionally, the heat dissipation plate is a power feeding heat dissipation plate, and a signal connector is arranged in the power feeding heat dissipation plate.

Optionally, the second heat conduction section is disposed within the phase change heat storage module.

Optionally, the phase change heat storage module includes top casing and drain pan body, the top casing sets up on the drain pan body, be provided with phase change material between top casing and the drain pan body, the top casing with the opposite side of drain pan body is provided with first fin and the second fin that sets up along first direction interval respectively.

Optionally, the first fin and the second fin are respectively provided with a cavity, and cooling medium is respectively arranged in the cavity of the first fin and the cavity of the second fin.

Optionally, a thermal interface material is disposed on a side of the first sub-heat conducting section adjacent to the heat source.

The invention also provides a manufacturing method of the phase-change heat dissipation system, which comprises the following steps:

respectively manufacturing a top shell with a first fin and a bottom shell with a second fin of the phase-change heat storage module;

The first fins and the second fins are internally provided with embedded channel structures, and an upper layer micro-channel and a lower layer micro-channel are respectively formed;

Sealing the tops of the embedded channel structures of the first fins and the second fins by adopting a sealing cover;

Assembling the top shell and the bottom shell to prepare a first intermediate piece;

Assembling the phase change material baffle with the first intermediate piece to obtain a second intermediate piece, and forming a closed area for storing and filling the phase change material;

Assembling the liquid collecting pipeline and the second intermediate piece together to prepare a phase-change heat storage module, and filling phase-change materials in the phase-change heat storage module;

And installing the phase-change heat storage module, the liquid cooling runner and the driving module to obtain the phase-change heat dissipation system.

As described above, the phase-change heat dissipation system has the following beneficial effects:

And a cooling medium for absorbing heat of the heat source is arranged in the liquid cooling flow passage, and the liquid cooling flow passage is respectively contacted with the phase-change heat storage module and the heat source to form a closed circulation loop. The cooling medium flows in the liquid cooling flow channel under the drive of the driving module. When the cooling medium flows through the part of the liquid cooling flow channel contacted with the heat source, the cooling medium can absorb the heat of the heat source and continuously flow forwards in the liquid cooling flow channel. When the cooling medium absorbing the heat of the heat source flows through the part of the liquid cooling runner, which is contacted with the phase-change heat storage module, the cooling medium transfers the heat of the cooling medium to the phase-change heat storage module. The temperature of the cooling medium is reduced, and the cooling medium continuously flows forwards to absorb the heat of the heat source, and the cooling medium is circulated and reciprocated. The size of the phase-change heat storage module can be adjusted according to the needs, so that the scheme can be applied in a narrow space. The heat of the heat source can be transferred to the phase-change heat storage module through the liquid cooling runner and the cooling medium, so that the problem of heat dissipation in a closed and adiabatic environment is solved.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention;

FIG. 2 is a schematic longitudinal section of an embodiment of the present invention;

FIG. 3 is a schematic diagram of an embodiment of the present invention;

FIG. 4 is a schematic view of a portion of a structure of an embodiment of the present invention;

FIG. 5 is a schematic view of another angular portion of an embodiment of the present invention;

FIG. 6 is a side view of a portion of the structure of an embodiment of the present invention;

FIG. 7 is a bottom view of an embodiment of the present invention;

Fig. 8 is a schematic diagram of an internal structure of a first sub-heat conducting section according to an embodiment of the present invention;

FIG. 9 is a schematic view illustrating an internal structure of another first sub-heat conducting segment according to an embodiment of the present invention;

FIG. 10 is a schematic view illustrating an internal structure of a first sub-heat conducting segment according to an embodiment of the present invention;

FIG. 11 is a schematic view illustrating an internal structure of a first sub-heat conducting segment according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of an internal structure of a phase change heat storage module according to an embodiment of the present invention;

FIG. 13 is a schematic diagram of an internal structure of a phase change heat storage module according to an embodiment of the present invention;

FIG. 14 is a top view of a portion of a phase change thermal storage module according to an embodiment of the invention;

FIG. 15 is a cross-sectional view taken at A-A in FIG. 14;

FIG. 16 is a schematic view of top and bottom shell installations according to an embodiment of the invention;

FIG. 17 is a schematic diagram illustrating the processing of the top housing embedded channel structure according to an embodiment of the present invention;

FIG. 18 is a top housing cover mounting schematic view of an embodiment of the present invention;

FIG. 19 is a top housing cover mounting schematic view of another embodiment of the present invention;

FIG. 20 is a schematic view of the assembled top and bottom cases according to an embodiment of the present invention;

FIG. 21 is a schematic diagram of the structure of the top and bottom cases according to the embodiment of the present invention after the phase change material is introduced into the top and bottom cases;

FIG. 22 is a schematic diagram showing the structure of the upper and lower microchannels after being assembled according to an embodiment of the present invention;

FIG. 23 is a cross-sectional view of a manifold shell according to an embodiment of the present invention;

fig. 24 is a schematic view showing installation of the top case and the bottom case according to the embodiment of the present invention.

Description of the part reference numerals

1-Closed heat insulation limited space, 2-integrated carrier, 3-phase change heat storage module, 31-phase change heat storage module shell, 311-top shell, 311 a-first fin, 311 b-upper micro-channel, 311 c-sink, 311 d-cover, 312-bottom shell, 312 a-second fin, 312 b-lower micro-channel, 313-embedded channel, 32-phase change heat storage material storage area, 33-micro-channel array, 34-liquid collecting pipeline, 341-liquid collecting shell, 35-inlet/outlet, 36-phase change material baffle, 4-other functional module, 5-heat source, 51-power module, 52-wave control module, 53-feed heat dissipation plate, 53 a-second sub-channel, 54-T/R component, 55-phased array antenna, 6-first heat conduction section, 61-first sub-heat conduction section, 61 a-first sub-channel, 611-channel fin, 612-vortex column, 62-first section outlet connector, 63-first section inlet connector, 7-controller, 8-liquid cooling drive module and 9-heat conduction channel drive module.

Detailed Description

Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.

It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. The structures, proportions, sizes, etc. shown in the drawings herein are shown in detail for purposes of illustration only, and are not intended to limit the scope of the invention, which is defined in the claims, any structural modification, proportional change or size adjustment should still fall within the scope of the disclosure without affecting the efficacy and achievement of the present invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.

Referring to fig. 1 to 24, the present embodiment provides a phase-change heat dissipation system, which includes a phase-change heat storage module 3, a liquid cooling flow channel and a driving module 8. The liquid cooling runner is respectively contacted with the phase-change heat storage module 3 and the heat source to form a closed circulation loop, a cooling medium is arranged in the liquid cooling runner, and the liquid cooling runner is used for absorbing heat of the heat source 5 through the cooling medium and transmitting the heat to the phase-change heat storage module 3 so as to dissipate the heat of the heat source 5. The driving module 8 is disposed on the liquid cooling flow channel, and is used for driving the cooling medium to flow in the liquid cooling flow channel. The driving module 8 can be arranged in the airtight and adiabatic limited space 1 or outside the airtight and adiabatic limited space 1, and can be selected according to specific situations and requirements.

In this embodiment, a cooling medium for absorbing heat of the heat source 5 is disposed in the liquid cooling flow channel, and the liquid cooling flow channel is respectively contacted with the phase-change heat storage module 3 and the heat source 5 to form a closed circulation loop. The cooling medium flows in the liquid cooling flow passage by the driving of the driving module 8. The cooling medium can absorb heat of the heat source 5 and continue to flow forward in the liquid cooling flow passage while flowing through the portion of the liquid cooling flow passage in contact with the heat source 5. When the cooling medium that absorbs the heat of the heat source 5 flows through the portion of the liquid cooling flow passage that contacts the phase-change heat storage module 3, the cooling medium transfers its own heat to the phase-change heat storage module 3. The cooling medium is cooled down and continues to flow forward to absorb heat from the heat source 5, and is cycled. The dimensions of the phase change heat storage module 3 can be adjusted so that the present embodiment can be applied in a small space. The heat of the heat source 5 can be transferred to the phase change heat storage module 3 through the liquid cooling flow channel and the cooling medium, so as to solve the problem of heat dissipation in a closed and adiabatic environment.

The heat generated by the heat source 5 is effectively led out through the liquid cooling flow channel, and the heat led out from the heat source 5 is transferred to the phase-change heat storage module 3 for storage through the cooling medium in the liquid cooling flow channel, so that the temperature rise of the heat source 5 is effectively controlled. The driving module 8 comprises a controller, and the driving module 8 is arranged on the section of liquid cooling flow channel flowing to the heat source 5 and is used for driving and controlling the liquid cooling working medium. The phase-change heat storage module 3 can be placed at a position far away from the heat source 5, at this time, because the heat dissipation means is adopted in the phase-change heat dissipation system to conduct heat, various other functional modules 4 can be arranged between the heat source 5 and the phase-change heat storage module 3 according to the requirement of the phase-change heat dissipation system, and the heat transfer resistance can not be increased almost, so that the heat dissipation effect of the heat source 5 can not be influenced.

The driving module 8 may be a piezoelectric micropump, a micro rotor pump, or the like, for example, which is small in size and may be sized according to the size of the space in which it is located. The liquid cooling flow channel is provided with a controller 7 for controlling the pressure in the liquid cooling flow channel, and the controller 7 can be a piezoelectric micro valve, a micro rotor valve and the like. The pressure difference in the whole liquid cooling flow channel can be improved and controlled, so that the cooling medium can flow quickly, and the cooling of the heat source can be realized in a short time.

The phase change heat storage material comprises paraffin, wherein the paraffin has high phase change latent heat, almost no supercooling phenomenon, low vapor pressure during melting, difficult chemical reaction, good chemical stability, small phase change temperature and phase change latent heat change after heat absorption and release for many times, self-nucleation, no phase separation and corrosiveness. The phase-change heat storage material is changed into liquid state after being heated, and is poured into the shell after being perforated on the shell, and the holes on the shell are closed after being filled, so that the phase-change heat storage material can be filled in the shell, and the heat dissipation and energy storage effects of the phase-change heat storage material are improved.

The inner wall of the liquid cooling runner in contact with the heat source 5 is covered with a heat conducting material. The heat conducting material can be plated on the inner wall of the liquid cooling runner to form a layer of film, and the heat conducting material comprises graphene or diamond. The heat exchange efficiency between the cooling medium and the heat source 5, that is, the heat absorption efficiency of the cooling medium from the heat source 5 can be improved, and the heat radiation effect on the heat source 5 can be improved.

In one embodiment, as shown in fig. 1, the liquid cooling runner includes a liquid cooling connection pipe 9, a first heat conduction section 6 for radiating heat from the heat source 5, and a second heat conduction section for transferring heat to the phase change heat storage module 3, where the liquid cooling connection pipe 9 connects the first heat conduction section 6 and the second heat conduction section in order from end to end and forms a closed circulation loop. The first heat conducting section 6 is in contact with the heat source to absorb and carry away heat from the heat source 5. The second heat conduction section is in contact with the phase-change heat storage module 3, and heat absorbed from the heat source 5 is transferred to the phase-change heat storage module 3, so that the cooled cooling medium flows to the heat source 5 again to absorb heat, and heat dissipation is carried out on the heat source 5 in a circulating and reciprocating mode. The liquid cooling connecting pipe 9 is two sections, and is respectively connected between the first end of the first heat conduction section 6 and the second end of the second heat conduction section, and between the first end of the second heat conduction section and the second end of the first heat conduction section 6.

In one embodiment, as shown in fig. 2 to 6, the first heat conduction section 6 includes a first sub heat conduction section 61, the first sub heat conduction section 61 is disposed between two adjacent heat sources 5, a first sub flow passage 61a is disposed in the first sub heat conduction section 61, and the first sub flow passage 61a communicates with the liquid cooling connection pipe 9.

In one embodiment, as shown in fig. 2 to 6, the first heat conduction section 6 further includes a heat dissipation plate, in which the second sub-flow passage 53a is provided, and the first sub-flow passage 61a communicates with the liquid cooling connection pipe 9 through the second sub-flow passage.

Fig. 2 shows a longitudinal section through a phase-change heat dissipation system, in which a heat source 5, a first heat-conducting section 6, a phase-change heat storage module 3, other functional modules 4, etc. are assembled in a stacked manner from top to bottom.

The heat source 5 may be a high-power T/R component 54 working in microwave, millimeter wave, etc., or a phased array antenna 55 component composed of the high-power T/R component, an antenna radio frequency adapter plate, and an antenna module. The heat sources 5 may be formed into a one-dimensional linear array or a two-dimensional planar array.

The first heat conduction section 6 includes a first sub heat conduction section 61 and a heat dissipation plate, which is a power feeding heat dissipation plate. The first sub-heat conducting section 61 is spatially embedded inside the heat source 5, and the heat source 5 includes a microwave millimeter wave power amplifier chip, a DC/DC power chip, and the like. Taking the heat dissipation of a plurality of T/R assemblies 54 forming a two-dimensional planar array as an example, the antenna module is expanded into a two-dimensional planar array by a single phased array passive antenna unit, a plurality of T/R assemblies 54 form a two-dimensional planar array corresponding to the antenna module, an antenna radio frequency adapter plate is positioned between the antenna module and the plurality of T/R assemblies 54 and is used for realizing the transfer of signals fed in and fed out of the front ends of the antenna and radio frequency transceiver, a first sub heat conducting section 61 is tightly attached to the side wall of the T/R assembly 54 and is close to a high-power chip such as a heat source 5 microwave millimeter wave power amplifier, a DC/DC power supply and the like in the T/R assembly 54. The first sub heat conducting section can radiate heat from heat sources positioned on two sides of the first sub heat conducting section. In the actual installation process, the first sub heat conducting section 61 is installed and fixed on the side wall of one side of the heat source 5 by using screws, and the other side of the first sub heat conducting section 61 is tightly attached to the other heat source 5 by using a thermal interface material with ultra-low thermal resistance (such as nano heat conducting silicone grease, graphene heat conducting pad, diamond sheet, etc.). In this way, when the plurality of heat sources 5 form an array, the first sub heat conducting sections 61 also form an array, so that good heat exchange effect can be realized on the heat sources 5 on both sides of the array, and finally the overall heat dissipation effect is improved. In particular, the control of the temperature of the high power chip within the T/R assembly 54 and among the plurality of T/R assemblies 54 is highly beneficial, and the temperature uniformity and consistency of the entire array surface of the phased array antenna 55 can be effectively improved while the temperature rise is reduced. The first sub-heat-conducting section 61 is internally provided with a first sub-flow passage 61a, and the first sub-flow passage 61a is communicated with the liquid cooling connecting pipeline 9. The cooling medium flowing through the first sub-flow passage 61a exchanges heat with high efficiency with respect to the high-power chip.

In one embodiment, a second sub-flow passage is provided in the heat radiating plate, and the first sub-flow passage 61a communicates with the liquid cooling connection pipe 9 through the second sub-flow passage.

The structure of the first sub-heat conducting section 61 is seen in fig. 8, 9, 10, 11. In one embodiment, as shown in fig. 8 to 11, the first sub heat conducting section 61 is in a strip-shaped rectangular runner structure, and the runner fins 611 are in a strip shape.

In one embodiment, as shown in fig. 9, the first sub-heat-conducting segment 61 has a discontinuous rectangular runner structure, and the runner fin 611 has a discontinuous rectangular shape. The structure has the advantages of simple structure and easy processing, and the state of the refrigerant can be provided with stronger laminar flow when the refrigerant flows, so that the heat transfer efficiency of the flow channel is further enhanced.

In one embodiment, as shown in fig. 10, the first sub-heat conducting section 61 is a structure in which an intermittent elongated rectangular flow channel is combined with a circular spoiler column 612. When the cooling medium flows in such a structure, it flows in a laminar state in a rectangular region, and flows in a turbulent state in a circular spoiler 612 region with a probability, so that the refrigerant can sufficiently exchange heat, and the heat transfer efficiency is high. Whether the cooling medium can flow in a turbulent state in the region of the circular spoiler column 612 is related to its flow rate, and the higher the flow rate, the greater the probability that the cooling medium will be turbulent.

In one embodiment, as shown in fig. 11, the channel fins 611 of the first sub heat-conducting segment 61 of the present embodiment are processed into a groove structure, so as to accommodate more cooling medium and further enhance the heat dissipation capability thereof, compared to the intermittent rectangular channel structure. Besides the above-mentioned 4 flow channels, the first sub-heat-conducting segment 61 can also be applied to various flow channel structures with different forms so as to adapt to the heat dissipation requirement of the present embodiment.

The heat source 5 may be provided with a liquid cooling channel inside, for example, a liquid cooling channel inside the heat source 5 casing, or a liquid cooling channel inside the high-power chip inside the heat source 5, which may be combined and communicated from different levels of the chip, the circuit board and the casing to realize integrated liquid cooling and heat dissipation from the chip to the casing, for example, the liquid cooling channels inside the heat source 5 casing and the circuit board inside the heat source 5 casing are communicated together to realize integrated liquid cooling and heat dissipation from the circuit board to the casing, and for example, the liquid cooling channel inside the heat source 5 casing, the liquid cooling channel inside the circuit board inside the heat source 5 casing and the liquid cooling channel inside the high-power chip are communicated together, or the liquid cooling channel inside the heat source 5 casing is communicated with the liquid cooling channel inside the high-power chip to realize integrated liquid cooling and heat dissipation from the chip, the circuit board and the casing. The first sub-flow channel 61a in the first sub-heat conducting section 61 can be communicated with the liquid cooling flow channel in the heat source 5, so that the integrated multi-layer high-efficiency heat exchange effect from the chip to the circuit board and then to the shell and the external system is realized.

In one embodiment, as shown in fig. 2, the heat sink may be a power feed heat sink including a signal connector, a second sub-flow channel 53a, a housing, and the like. The signal connector comprises a radio frequency connector and a low frequency connector. The radio frequency connectors include radio frequency connectors based on waveguide transmission structures, or based on coaxial transmission structures, as well as based on other transmission structures. The radio frequency and low frequency connector can be a button connector and has the characteristics of light weight and thin switching. The second sub flow path 53a of the feed heat dissipation plate communicates with the first sub flow path 61a inside the first sub heat conduction section 61. The second sub-flow path 53a of the feed heat dissipation plate plays a role of fan-out, which means that one cooling medium becomes a plurality of cooling mediums, and convergence, which means that a plurality of cooling mediums become one cooling medium. Specifically, the second sub-flow channels 53a of the heat-feeding plate fan out to the first sub-flow channels 61a inside the plurality of first sub-heat-conducting sections 61, and after exchanging heat with the heat source 5, the plurality of first sub-flow channels 61 are collected to the second sub-flow channels 53a. For example, for the phased array antenna 55, the plurality of first sub-heat-conducting segments 61 form an array as the T/R assembly 54, and the feed heat dissipation plate performs the functions of liquid cooling working medium fanning and converging for all the first sub-heat-conducting segments 61. That is, the liquid cooling channels fan out from the feed heat dissipation plate into the inside of each first sub heat conduction section 61, and then come out from the inside of the first sub heat conduction section 61 to be converged on the feed heat dissipation plate. The feed heat sink housing functions to carry the signal connector and the second sub-flow path 53a. The feed heat dissipation plate has the functions of radio frequency, low-frequency signal thinning, high-performance interconnection and transmission and also has the function of high-efficiency heat dissipation of an integrated liquid cooling channel.

In one embodiment, fig. 16 to 21, the second heat conduction section is provided in the phase-change heat storage module 3, which can improve the heat exchange effect with the phase-change heat storage module 3. The phase change heat storage module 3 includes a top case 311 and a bottom case 312, the top case 311 is disposed on top of the bottom case 312, and a phase change material is disposed between the top case 311 and the bottom case. The opposite sides of the top case 311 and the bottom case 312 are provided with first fins 311a and second fins 312a, respectively, which are spaced apart in the first direction. The phase change heat storage module 3 may be a phase change heat storage module 3 embedded with a second heat conduction section. The phase change heat storage module 3 includes a micro flow channel, a fin-shaped thin strip array, a phase change heat storage material storage area 32, a collection area, an inlet/outlet port 35, a housing, and the like, and the micro flow channel, the fin-shaped thin strip array, the area filled with the phase change material, the collection area, and the inlet/outlet port 35 form a second heat conduction section. The micro flow channel comprises an upper micro flow channel 311b and a lower micro flow channel 312b, the upper micro flow channel 311b is arranged in the first fin 311a, the lower micro flow channel 312b is arranged in the second fin 312a, the fin-shaped thin strip array comprises a top fin-shaped thin strip array and a bottom fin-shaped thin strip array, the top fin-shaped thin strip array is an array formed by arranging the first fin 311a along a first direction, the bottom fin-shaped thin strip array is an array formed by arranging the second fin 312a along the first direction, and the first direction is perpendicular to the flowing direction of the cooling medium. The top fin-shaped web array is disposed in the top housing 311 and the bottom fin-shaped web array is disposed in the bottom housing 312. The upper layer of microchannels 311b are disposed in a top fin-like web array with the top facing downward, while the lower layer of microchannels 312b are disposed in a bottom fin-like web array with the bottom facing upward. The micro flow channel, the first fin 311a and the second fin 312a may have rectangular cross sections, and the thicknesses of the first fin 311a and the second fin 312a may be extremely small. The void space between adjacent first fins 311a and second fins 312a is a region filled with a phase change material. The first fin 311a and the second fin 312a each have a cavity, a cooling medium is provided in each of the cavity of the first fin 311a and the cavity of the second fin 312a, the first fin 311a and the second fin 312a penetrate through each other along both ends in the cooling medium flowing direction, and the cooling medium can flow through the first fin 311a and the second fin 312a along the longitudinal direction of the first fin 311a and the second fin 312a (the cavity of the first fin 311a forms an upper layer micro flow channel 311b, and the cavity of the second fin 312a forms a lower layer micro flow channel 312 b). Because the upper layer and the lower layer micro-channels 312b all have good heat exchange performance, compared with the situation that no micro-channels are arranged or only single-sided micro-channels are arranged, the area for storing the phase change material can obtain good heat exchange performance, so that the whole phase change heat storage response is faster and the effect is better. The upper micro-channels 311b and the lower micro-channels 312b are in an interdigital shape, are densely arranged in the phase-change heat storage module 3 in a staggered manner like a zipper structure, and the upper micro-channels 311b and the lower micro-channels 312b are in a dog-tooth staggered manner, and are positioned between the adjacent first fins 311a and second fins 312a and filled with phase-change materials. The upper layer micro flow channels 311b and the lower layer micro flow channels 312b are collected in collecting areas at two ends of the phase change heat storage module 3. The top view of the collecting area can be triangle, semi-ellipse, rectangle, etc., the collecting area comprises a liquid collecting tube shell 341, a plurality of liquid collecting pipelines 34 are arranged in the liquid collecting tube shell 341, and then liquid inlet and liquid outlet of cooling working medium in the micro-channel are realized through a liquid inlet/outlet port 35.

In one embodiment, as shown in fig. 12 to 15, the phase-change heat storage module 3 includes a phase-change heat storage material storage region 32, a phase-change material baffle 36, an inlet/outlet port 35, and a phase-change heat storage module housing 31. The second heat conduction section is arranged in the phase-change heat storage module 3, and comprises a micro-channel array 33 and a liquid collecting pipeline 34 which are communicated in a one-to-one correspondence mode, and one end, deviating from the micro-channel, of the liquid collecting pipeline 34 is communicated with the liquid inlet/outlet 35. The micro flow channels in the micro flow channel array 33 are staggered in the vertical direction (i.e. the adjacent micro flow channels are arranged in a high-low manner, as shown in fig. 15, the liquid collecting pipeline 34 in the figure is an example of the collecting area of the above-mentioned "canine-staggered" upper layer micro flow channel 312b and the lower layer micro flow channel), gaps are formed between the adjacent micro flow channels, the phase change heat storage material storage area 32 is formed, and the phase change heat storage material is arranged in the phase change heat storage material storage area 32. The arrangement mode can improve the contact area between the cooling medium and the phase-change heat storage material, thereby improving the cooling and heat dissipation effects of the phase-change heat storage material. Therefore, a space structure of the phase-change heat storage material, namely the micro-flow channels and the phase-change heat storage material is formed, and each micro-flow channel with high heat exchange performance can be embedded into the phase-change heat storage material. The phase change heat storage material can be uniformly contacted with the cooling medium in the micro flow channel by arranging the adjacent micro flow channels in a high-low mode, so that the heat transfer effect of the cooling medium is improved, and the heat dissipation effect of a heat source is improved.

The width of the micro flow channel array 33 in the flowing direction of the cooling medium gradually becomes smaller toward the direction approaching the liquid collecting pipe 34, so that all the micro flow channels are gathered toward the middle in the horizontal direction and are collected to the liquid collecting pipe 34, and the micro flow channels which are distributed in a staggered manner in the vertical direction gradually become closer toward the middle as they approach the liquid collecting pipe 34, and finally become smaller toward the liquid collecting pipe 34 at the same horizontal level, that is, the width in the height direction of the micro flow channels also becomes smaller toward the direction approaching the liquid collecting pipe 34, as shown in fig. 13. The respective liquid collecting pipes 34 are drawn toward the middle in the horizontal direction so that the width of the respective liquid collecting pipes 34 in the flow direction of the cooling medium becomes gradually narrower as shown in fig. 12. The cooling medium is cooling liquid, the cooling liquid is incompressible liquid or weak compressible liquid, and under the condition of a certain volume of the cooling liquid, the structure can enable the cooling liquid to have high flow velocity in the area with smaller widths of the micro-channel array 33 and the liquid collecting pipeline 34 and have low flow velocity in the area with larger widths of the micro-channel array 33 and the liquid collecting pipeline 34. The cooling liquid can fully exchange heat with the phase-change heat storage material and cool in the area with low flow speed, so that the heat exchange effect between the cooling liquid and the phase-change heat storage material is improved, the cooling effect of the cooling liquid is improved, the cooling liquid can enter the first heat conduction section 6 at a higher speed in the area with high flow speed and exchange heat with the heat source in the high-power assembly, or the cooling liquid can enter the phase-change heat storage module 3 at a higher speed in the area with high flow speed to exchange heat with the phase-change heat storage material, and the moving speed of the cooling liquid is improved, so that the cooling and heat dissipation effects of the heat source are improved.

In one embodiment, as shown in fig. 12 to 15, a phase change material baffle 36 is disposed between the micro flow channel array 33 and the liquid collecting pipe 34, and grooves are correspondingly formed in the phase change material baffle 36 at the communicating positions of the array micro flow channels 33 and the liquid collecting pipe 34 so as to allow the cooling medium to circulate between the two. The phase change heat storage material may melt after absorbing the heat of the cooling medium, and the phase change material baffle 36 serves to block the phase change heat storage material and prevent the phase change heat storage material from flowing out of the phase change heat storage material storage area 32 and flowing into the space between the array micro flow channel 33 and the interior of the liquid collecting pipeline 34, so as to avoid system failure.

In one embodiment, the phase-change heat storage module 3 may be a phase-change heat storage module 3 without micro flow channels, and the phase-change heat storage module 3 without micro flow channels is composed of a fin-shaped thin strip array, a phase-change heat storage material storage area 32, and a phase-change heat storage module housing 31. The phase change heat storage module 3 without micro flow channels may be a structure in which micro flow channels, a collecting area and a liquid inlet/outlet 35 are removed on the basis of the phase change heat storage module 3. The fin-shaped thin strip array of the phase-change heat storage module 3 without micro-channels also comprises a top fin-shaped thin strip array and a bottom fin-shaped thin strip array, wherein the upper micro-channel 311b is arranged in the top fin-shaped thin strip array with the top facing downwards, the lower micro-channel 312b is arranged in the bottom fin-shaped thin strip array with the bottom facing upwards, and the fin-shaped thin strip array of the phase-change heat storage module 3 without micro-channels is internally provided with no micro-channels.

In one embodiment, as shown in fig. 5-7, the controller 7 includes micropumps, microvalves, etc. for fluid control. The micro valves and the micro pumps can be distributed on the feed heat dissipation plate and/or the phase change heat storage module 3 in the phase change heat dissipation system according to specific thermal control requirements. The bottom of the phase-change heat storage module 3 is integrated with a driving module 8 for driving the flow of the refrigerant and a controller 7 for controlling the flow direction of the refrigerant, and the driving force and intelligent control capability required by the phase-change heat dissipation system are realized by configuring the number and the positions of the fluid drivers and the controller 7. In this embodiment, the fluid driver may be a micro pump, the number of micro pumps may be 1, and the controller may be a micro valve, and the number of micro valves may be 3, wherein 2 micro valves respectively correspond to the two first heat conduction section outlet connectors 62, and the other 1 micro valve corresponds to the first heat conduction section inlet connector 63.

The liquid cooling connecting pipeline 9 is used for communicating the feed cooling plate and the phase-change heat storage module 3, and the feed cooling plate and the phase-change heat storage module 3 are communicated, so that an integrated leakage-proof blind plug or quick plug liquid cooling connector can be adopted, and a liquid cooling connector and liquid cooling connecting pipeline combination mode can be adopted, namely, the feed cooling plate is communicated with the far-end phase-change heat storage module 3 through the liquid cooling connecting pipeline 9. The liquid-cooled connecting pipes may also be integrated within the functional module housings rather than being discrete tubes.

The other functional modules 4 include a wave control module, a channel module, a power division network module, a signal processing module, a power supply module, and the like. For other functional modules 4 with high-power heat dissipation requirements, the first sub-heat-conducting section 61 and/or the feed heat dissipation plate can be arranged for heat management according to actual situations. The heat source 5 and the phase-change heat storage module 3 can be directly installed together by the feed heat dissipation plate and the phase-change heat storage module 3 without any other functional module 4, and the heat source 5 can be directly installed together by the first heat conduction section 6 and the phase-change heat storage module 3 to realize heat management.

In one embodiment, as shown in fig. 3 and 4, the phase-change heat dissipation system is highly coupled and tightly integrated in structure, so that heat in a region where heat is concentrated during operation of the heat source can be taken away, and the phase-change heat dissipation system can be structurally supported and reinforced. The heat source 5 may comprise a unitary body of phased array antenna 55, an array of T/R assemblies 54, wherein the array of T/R assemblies 54 generates the most heat and generates the most heat. The first sub-thermally conductive section 61 is embedded between the array of T/R assemblies 54 and is mounted as a unit with the feed heatsink 53. Other functional module 4 include power module 51 and ripples accuse module 52, and phase change heat storage module 3 is located the bottom of phase change cooling system, and phase change heat storage module 3 can make square or cuboid, conveniently stacks, stacks with other structures, improves the stability that phase change cooling system placed. The shape of the phase change heat storage module 3 is not limited at all, and may be any three-dimensional shape such as a cube, a cuboid, a cylinder, etc. The power supply module 51, the wave control module 52 and the feed heat dissipation plate 53 are sequentially stacked on the phase change heat storage module 3 from bottom to top. An array of T/R assemblies 54 is provided on top of the feed heatsink 53 and a phased array antenna 55 is provided on top of the array of T/R assemblies 54. The array of T/R assemblies 54 includes a plurality of T/R assemblies 54, each T/R assembly 54 being arranged along the length and/or width direction of the phase change thermal storage module 3.

The first sub heat conductive sections 61 are plural in number and are disposed between two T/R assemblies 54 adjacent in the length direction or the width direction. The number of the first heat conduction section outlet connectors 62 is two, and the two first heat conduction section outlet connectors are respectively arranged at two ends of the top of the phase change heat storage module 3 along the length direction. The first heat conduction section inlet joint 63 sets up at the middle part of phase change heat storage module 3 top along length direction, and the bottom of first heat conduction section outlet joint 62 and first heat conduction section inlet joint 63 all communicates with phase change heat storage module 3. The positional relationship between the first heat conduction section outlet connector 62 and the first heat conduction section inlet connector 63 can make the heat dissipation of the refrigerant to the T/R assembly 54 more uniform, avoid the large temperature difference phenomenon of the T/R assembly 54 array at the liquid inlet end and the liquid outlet end caused by the single flow direction of the refrigerant, further avoid the thermal stress buckling torsion deformation of the T/R assembly 54 array caused by the large temperature difference of the T/R assembly 54 array, and improve the structural stability and the service life of the T/R assembly 54 array.

The top of the first heat conduction section outlet connector 62 and the top of the first heat conduction section inlet connector 63 respectively penetrate through the power module 51 and the wave control module 52 in sequence, through holes are respectively formed in the corresponding positions of the power module 51 and the wave control module 52, the first heat conduction section outlet connector 62 and the first heat conduction section inlet connector 63, and the top of the first heat conduction section outlet connector 62 and the top of the first heat conduction section inlet connector 63 respectively penetrate through the through holes correspondingly. The inlet and outlet bus sections of the first sub heat conduction section are both provided in the feed heat dissipation plate 53 and do not interfere with each other. The inlet end of the inlet confluence section is communicated with the top ends of the first heat conduction section inlet connectors 63, the outlet end of the inlet confluence section is communicated with the inlet ends of the first sub heat conduction sections 61, the outlet end of the first sub heat conduction sections 61 is communicated with the inlet ends of the outlet confluence sections, and the outlet ends of the outlet confluence sections are respectively communicated with the top ends of the two first heat conduction section outlet connectors 62. The top end of the first heat conduction section outlet connector 62 is the inlet end thereof, the bottom end is the outlet end thereof, and the top end of the first heat conduction section inlet connector 63 is the outlet end thereof, and the bottom end is the inlet end thereof.

In one embodiment, the heat source, the first heat conduction section, the phase-change heat storage module, the controller, the liquid cooling connection pipeline, other functional modules and the like may not be vertically installed and stacked in the form of fig. 2, and may also be tiled on a two-dimensional plane, for example, the heat source, the first heat conduction section, the phase-change heat storage module 3, the controller, the liquid cooling connection pipeline, the other functional modules and the like are installed on a large carrier plate.

Specifically, the phase-change heat dissipation system comprises an integrated carrier 2, the integrated carrier 2 can be a carrier plate, and the carrier plate can be a stainless steel carrier plate or a silicon-based carrier plate, so that the heat exchange efficiency is high. The integrated carrier 2 has a first surface provided with a heat source, i.e. the top surface of the integrated carrier 2 is a first surface, which is a plane, on which the heat source is provided. The phase-change heat storage module 3, the fluid driver 8 and the controller 7 are all arranged on the first surface, namely the phase-change heat storage module 3, the liquid cooling connecting pipeline 9 and the driving module 8 are all arranged on the top surface of the integrated carrier 2. The phase-change heat dissipation system can be integrated integrally, the integration level is improved, the volume of the phase-change heat dissipation system is reduced, and the applicability of the phase-change heat dissipation system is wider and can be applied to smaller space.

The liquid-cooled connecting duct 9 comprises a cooling launder arranged on the first surface. The first surface is provided with a cold flow groove, the cold flow groove is connected end to end and closed, and the cold flow groove forms a liquid cooling connecting pipeline 9. The liquid cooling connecting pipeline 9 is integrated on the first surface, so that the integration level of the phase-change heat dissipation system can be further improved, the volume of the phase-change heat dissipation system is reduced, and the phase-change heat dissipation system can be widely applied to smaller space.

The first heat conducting section 6 comprises a first heat conducting groove or a first heat conducting pipe arranged between the heat source 5 and the first surface. A first heat conducting groove is arranged on the first surface of the bottom of the heat source, a first heat conducting section 6 is formed by the first heat conducting groove, and two ends of the first heat conducting groove are respectively communicated with the liquid cooling connecting pipeline 9. Or a first heat conduction pipe is arranged between the bottom of the high-power component and the first surface. The first heat pipe may be disposed in the liquid cooling connection pipe 9, and both ends of the first heat pipe are respectively communicated with the liquid cooling connection pipe 9. The material of the first heat conduction pipe is different from that of the integrated carrier 2, and can be stainless steel or silicon, and the first heat conduction pipe is made of high heat conduction material. The specific structure and form of the first heat conduction section 6 can be determined according to the specific application scene of the requirement, so that the application scene of the phase-change heat dissipation system is increased, and the adaptability of the embodiment is improved.

In one embodiment, the first heat conduction groove includes a plurality of first sub heat conduction grooves arranged side by side along the width direction thereof, so that the flow rate of the cooling medium in each first sub heat conduction groove can be increased, thereby improving the heat absorption effect of the cooling medium on the heat source 5.

In one embodiment, the second heat conducting section comprises a second heat conducting groove or a second heat conducting pipe provided within the phase change heat storage module 3. The second heat conduction groove is arranged in the phase-change heat storage module 3, so that the contact area between the cooling medium flowing through the second heat conduction groove and the phase-change heat storage module 3 can be increased, and the heat release efficiency of the cooling medium to the phase-change heat storage module 3 is improved. Or a second heat conduction pipe is arranged in the phase-change heat storage module 3, and two ends of the second heat conduction pipe are respectively communicated with the liquid cooling connecting pipeline 9. The material of the second heat conduction pipe is different from that of the integrated carrier 2, and can be stainless steel or silicon, and the second heat conduction pipe is made of high heat conduction material. The specific structure and form of the second heat conduction section can be determined according to the requirements, so that the application scene of the phase-change heat dissipation system is increased, and the adaptability of the embodiment is improved.

In one embodiment, the second heat conduction groove further includes a plurality of second sub heat conduction grooves arranged side by side along the width direction thereof, so that the flow velocity of the cooling medium in each second sub heat conduction groove can be increased, thereby improving the heat absorption effect of the cooling medium on the heat source 5.

In one embodiment, a fastening structure may be further disposed between the second heat pipe and the phase-change heat storage module 3, and the second heat pipe is disposed in the phase-change heat storage module 3 through the fastening structure. The stability of the connection between the second heat conduction pipe and the phase change heat storage module 3 is improved.

In one embodiment, the first and second heat conductive grooves may be rectangular, circular column, or three-dimensional manifold in shape.

In addition, the phase-change heat dissipation system can be installed by combining a two-dimensional plane and a three-dimensional stack, a heat source, a controller and a first heat conduction section which need heat dissipation are flatly installed on the phase-change heat storage module 3, and then are vertically stacked and installed with other functional modules.

As shown in fig. 16, this embodiment further provides a method for manufacturing a phase-change heat dissipation system, including:

A top shell 311 with a first fin 311a and a bottom shell 312 with a second fin 312a of the phase-change heat storage module 3 are manufactured respectively;

the first fin 311a and the second fin 312a are internally provided with embedded channels 313, and an upper micro-channel 311b and a lower micro-channel 312b are respectively formed;

sealing the tops of the embedded channel 313 structures of the first fin 311a and the second fin 312a by adopting a sealing cover 311 d;

assembling the top shell 311 and the bottom shell 312 to obtain a first intermediate piece;

the phase change material baffle 36 is assembled with the first intermediate piece to produce a second intermediate piece and form a closed area for storing the filled phase change material (phase change heat storage material storage area 32);

Assembling the liquid collecting pipeline 34 and the second middleware together to prepare the phase-change heat storage module 3, and filling phase-change materials in the phase-change heat storage module 3;

And the phase change heat storage module 3, the liquid cooling runner and the driving module 8 are installed to obtain the phase change heat dissipation system.

In particular, the method comprises the steps of,

1-1) A top shell 311 and a bottom shell 312 with fin-shaped thin strip arrays are firstly manufactured, the phase-change heat storage module shell 31 comprises the top shell 311 and the bottom shell 312, the top shell 311 and the bottom shell 312 are oppositely arranged from top to bottom in structure, and the top shell 311 and the bottom shell 312 are buckled up and down in space to form the phase-change heat storage module shell 31. The fin-shaped thin strip array is disposed inside the top shell 311 and the bottom shell 312, and the fin-shaped thin strip array includes a top fin-shaped thin strip array and a bottom fin-shaped thin strip array. The top fin-shaped web array is disposed on the top housing 311 and the bottom fin-shaped web array is disposed on the bottom housing 312. The top fin-shaped thin strip array and the bottom fin-shaped thin strip array are in an interdigital shape and closely arranged in the phase-change heat storage module 3 in a staggered mode like a zipper structure.

The top shell 311 and the bottom shell 312 with the fin-shaped thin strip array can be manufactured by adopting a precision machining mode, or can be manufactured by adopting additive manufacturing modes such as three-dimensional printing and the like. For the fin-shaped thin strip array with the thickness of micron level, a silicon-based MEMS (micro mechanical system) processing mode can be adopted, such as a DRIE deep silicon etching process, an anisotropic wet etching process, an electroplating process and the like. Preferably, a LIGA processing technology can be adopted, which is a micromachining technology based on an X-ray lithography technology, and mainly comprises the processing steps of X-ray deep synchrotron radiation lithography, electroforming, injection molding replication and the like, so that a 3D structure with a large aspect ratio structure, smooth side walls and deviation of parallelism in a submicron range can be manufactured. By utilizing the LIGA technology, not only can the fin-shaped thin strip array with micro-nano scale be manufactured, but also the fin-shaped thin strip array with millimeter scale can be processed.

1-2) An embedded channel 313 is formed inside the fin-shaped thin strip arrays of the top shell 311 and the bottom shell 312, a countersink 311c for placing a channel cover is formed at the top opening of the embedded channel 313, and fig. 17 is a schematic cross-sectional view of the finished top shell 311, and since the bottom shell 312 is similar to the top shell 311, a schematic view thereof is not shown here. The top fin-like web array and the bottom fin-like web array have embedded channel 313 structures inside. The cross section of the embedded channel 313 and the fin-shaped thin strip array can be rectangular, and the first fins 311a and the second fins 312a can be sheet-shaped, so that the thicknesses of the first fins 311a and the second fins 312a are smaller, and the thicknesses of the first fins 311a and the second fins 312a are far smaller than the lengths thereof. For example, the first fin 311a and the second fin 312a may have a height of 2 to 20mm, a thickness of 200 μm to 2mm, a depth of the embedded groove 313 may be 2 to 20mm, and a width of 100 μm to 1.8mm.

1-3) The top housing 311 and the top opening of the embedded channel 313 of the bottom housing 312 are sealed by a sealing cap 311 d. Specifically, a cover 311d is first manufactured to be matched with the size of the sinking groove 311c at the top opening of the embedded channel 313, the thickness of the cover 311d is the same as the depth of the sinking groove 311c and the shape is matched with the depth of the sinking groove 311c, then all the sinking grooves 311c are provided with the cover 311d, the embedded channel 313 is sealed, and a micro-channel structure is formed inside the fin-shaped thin strip array, as shown in fig. 18. The cover 311d is a top cover plate of the micro flow channel.

Of course, the manners of fixing the cover 311d inside the countersink 311c in the above 1-2) and 1-3) can make the outer portions of the top shell 311 and the bottom shell 312 smoother after the processing is completed, and are suitable for mounting components such as circuit boards. However, this is just an example of sealing the fin-shaped web array embedded channels 313 to form the micro channels, and in practice, other sealing methods may be used, such as sealing each embedded channel 313 directly by using a plurality of covers 311d in a one-to-one correspondence manner, or sealing the embedded channels 313 by using one or more covers 311d with larger dimensions, as shown in fig. 19, where a block of covers 311d seals the embedded channels 313.

The fixing manner of the cover 311d and the top case 311 and the bottom case 312 may be a laser sealing manner, a gold-tin eutectic welding manner, a tin soldering manner, or a MEMS processing method such as gold-gold bonding, copper-copper bonding, or silicon-silicon bonding. When adopting the gold-tin eutectic welding and tin soldering mode, the solder piece needs to be customized in advance for welding the sealing cover 311d and the sinking groove 311 c. By MEMS processing methods such as Jin Jinjian bonding, copper-copper bonding, silicon-silicon bonding, etc., the housing and the cover 311d can be made of silicon material. In addition, the fixing of the cover 311d and the top case 311 and the bottom case 312 may also be performed by thermal compression bonding, and the top case 311 and the bottom case 312 and the cover 311d may also be made of polymer materials such as SU-8 and PMMA. It should be noted that, under the condition that one or more sealing caps 311d with larger dimensions are used to seal the embedded channels 313, the method is not suitable for a laser sealing and fixing mode, mainly because the areas between the embedded channels 313 cannot be directly bonded and connected, so that after the cover plate is sealed and welded by the laser, the micro channels are communicated, and there is a risk of liquid leakage. Therefore, in this case, the method is more suitable for gold-tin eutectic soldering, tin soldering, and other methods, and MEMS processing methods such as gold-gold bonding, copper-copper bonding, silicon-silicon bonding, and the like can be used, so that the contact surfaces of the cover 311d and the top shell 311 and the bottom shell 312 can form good bonding connection, and the plurality of embedded channels 313 can be well isolated, thereby forming an independent micro-channel structure.

2) Assembling a top shell 311 with a fin-shaped thin strip array and a bottom shell 312 with a micro-channel structure together to prepare a first intermediate piece to form an array micro-channel structure;

Specifically, the top shell 311 with the fin-shaped thin strip array having the micro-channel structure and the bottom shell 312 are aligned and fastened together, and then the joint of the top shell 311 and the bottom shell 312 is sealed and welded to form a hollow array micro-channel structure, as shown in fig. 20. The void space between the top fin-like web array and the bottom fin-like web array is the area filled with phase change material. The array micro flow channel structure includes an upper micro flow channel 311b located in the top case 311 and a lower micro flow channel 312b located in the bottom case 312 (see fig. 2). The joint between the top shell 311 and the bottom shell 312 can be sealed by laser sealing, or by gold-tin eutectic welding, soldering, or MEMS processing methods such as gold-gold bonding, copper-copper bonding, and silicon-silicon bonding. For better alignment, the joint of the top shell 311 and the inner shell may be designed with a corresponding concave-convex step structure (as shown in fig. 24), or may be designed into a mortise-tenon structure, so that when the alignment is buckled together, the combination with accurate positioning can be realized, the sealing and welding precision is convenient to be improved, and meanwhile, the operability is increased.

3) The phase change material baffle 36 is assembled with the first intermediate piece to produce a second intermediate piece forming a closed area for storing the filled phase change material;

The shape of the phase change material baffle 36 is determined mainly by the top fin-like web array and the bottom fin-like web array, and as can be seen from the cross-sectional schematic view of the first intermediate member, the shape of the phase change material baffle 36 is the shape remaining after the top, bottom and side walls of the housing, top and bottom fin-like web arrays, are removed from the cross-section of the entire first intermediate member. The phase change material baffle 36 may be shaped as an "S" type structure, as shown in FIG. 20. For the first intermediate piece, which is designed by converging the upper micro flow channel 311b and the lower micro flow channel 312b, the phase change material baffle 36 may be rectangular with rectangular holes, as shown in fig. 12, which are the inlets and outlets of the upper micro flow channel 312b and the lower micro flow channel 312 b. To achieve a better seal, the shape of the phase change material baffle 36 is slightly larger than the shape remaining after the entire first intermediate section has had the top, bottom and side walls of the housing removed, the top and bottom fin-like arrays of thin strips, the top fin-like array of thin strips being obscured by the phase change material baffle 36 in the edge regions of the bottom fin-like array of thin strips. The phase change material baffle 36 and the first intermediate member may be assembled by laser sealing, gold-tin eutectic welding, tin soldering, etc., and MEMS processing methods such as gold-gold bonding, copper-copper bonding, silicon-silicon bonding, etc.

4) Assembling the liquid collecting pipeline and the second intermediate piece together to obtain the phase-change heat storage module 3;

Specifically, the upper micro flow channel 311b and the lower micro flow channel 312b are collected in the collection areas inside the collection pipes 34 at both ends of the phase change heat storage module. The top view of the collection area may be triangular, semi-elliptical, rectangular, etc. And then the liquid inlet and the liquid outlet of the cooling working medium in the micro-channel are realized through the liquid inlet and the liquid outlet. The two liquid collecting pipelines (comprising a liquid inlet and a liquid outlet) and the second intermediate piece can be assembled by adopting a laser seal welding mode, a gold-tin eutectic welding mode, a tin welding mode and the like, and MEMS processing methods such as gold-gold bonding, copper-copper bonding, silicon-silicon bonding and the like can also be adopted. The joint of the liquid collecting pipeline 34 and the second middle piece mounting surface can be designed similar to the joint of the top shell 311 and the inner shell side wall, such as a concave-convex step structure, a mortise-tenon structure and the like, when the two liquid collecting pipelines 34 and the second middle piece are aligned and buckled together, the combination with accurate positioning can be realized, the sealing and welding precision is convenient to improve, and meanwhile, the operability is improved.

5) And filling the phase change material into the phase change heat storage module to finish the preparation of the phase change heat storage module.

Two or more than two round small holes, rectangular holes and other openings for filling phase change materials are designed on the top surface, the bottom surface or the side walls of the two sides of the second middle part shell, and the phase change materials are filled in the phase change heat storage module through the openings. The phase change material can be paraffin material, the temperature of the middle shell of the whole phase change heat storage module can be heated to be higher than the melting point of paraffin, then the liquid paraffin material is filled into the module, and the heating temperature of the shell is 10-20 ℃ higher than the melting point of paraffin in general. Finally, the opening is sealed, the opening can be sealed by adopting a laser seal welding mode, gold-tin eutectic welding, tin welding and other modes, and MEMS processing methods such as gold-gold bonding, copper-copper bonding, silicon-silicon bonding and the like can also be adopted. Finally, the preparation of the micro-channel phase-change heat storage module is completed.

And installing the phase-change heat storage module, the liquid cooling runner, the driving module and other components to finally obtain the phase-change heat dissipation system.

The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A phase change heat dissipation system, comprising:

A phase change heat storage module;

2. The phase-change heat dissipation system of claim 1, wherein the liquid-cooled runner comprises a liquid-cooled connecting pipe, a first heat conduction section for dissipating heat from a heat source, and a second heat conduction section for transferring heat to the phase-change heat storage module, and the liquid-cooled connecting pipe connects the first heat conduction section and the second heat conduction section in sequence end to end and forms a closed circulation loop.

3. The phase-change heat dissipation system of claim 2, wherein the first heat conduction segment comprises a first sub-heat conduction segment disposed between two adjacent heat sources, wherein a first sub-flow channel is disposed in the first sub-heat conduction segment, and wherein the first sub-flow channel is in communication with the liquid-cooled connecting conduit.

4. A phase-change heat dissipation system as defined in claim 3, wherein the first heat conduction section further comprises a heat dissipation plate, a second sub-runner is disposed in the heat dissipation plate, and the first sub-runner is communicated with the liquid cooling connection pipeline through the second sub-runner.

5. The phase-change heat dissipation system of claim 4, wherein the heat dissipation plate is a feed heat dissipation plate having a signal connector disposed therein.

6. The phase-change heat dissipation system of claim 2, wherein the second thermally conductive section is disposed within the phase-change heat storage module.

7. The phase-change heat dissipation system of claim 6, wherein the phase-change heat storage module comprises a top housing and a bottom housing, the top housing is disposed on the bottom housing, a phase-change material is disposed between the top housing and the bottom housing, and first fins and second fins disposed at intervals along a first direction are disposed on opposite sides of the top housing and the bottom housing, respectively.

8. The phase-change heat dissipation system of claim 7, wherein the first fin and the second fin each have a cavity therein, and wherein the first fin and the second fin each have a cooling medium disposed therein.

9. A phase change heat dissipation system as defined in claim 3, wherein a side of said first sub-conductive segment adjacent to the heat source is provided with a thermal interface material.

10. A method of manufacturing a phase change heat dissipation system, comprising: