CN119181595A - Electronic component manufacturing device and electronic component manufacturing method - Google Patents
Electronic component manufacturing device and electronic component manufacturing method Download PDFInfo
- Publication number
- CN119181595A CN119181595A CN202410605561.8A CN202410605561A CN119181595A CN 119181595 A CN119181595 A CN 119181595A CN 202410605561 A CN202410605561 A CN 202410605561A CN 119181595 A CN119181595 A CN 119181595A
- Authority
- CN
- China
- Prior art keywords
- ceramic green
- electronic component
- suction
- lamination
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 239000000919 ceramic Substances 0.000 claims abstract description 103
- 238000003475 lamination Methods 0.000 claims abstract description 92
- 238000001179 sorption measurement Methods 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 239000011247 coating layer Substances 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 48
- 206010040844 Skin exfoliation Diseases 0.000 description 18
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000002994 raw material Substances 0.000 description 16
- 230000006837 decompression Effects 0.000 description 10
- 239000002003 electrode paste Substances 0.000 description 9
- 238000013459 approach Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004804 winding Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Provided are an apparatus for manufacturing an electronic component and a method for manufacturing an electronic component, wherein a ceramic green sheet is less likely to remain on the surface of a lamination head. The electronic component manufacturing apparatus (100) is provided with a lamination head (40) for conveying ceramic green sheets (21) and a lamination table (150) for laminating the conveyed ceramic green sheets (21), and is characterized in that the lamination head (40) is provided with an adsorption surface (40 a) for adsorbing and conveying the ceramic green sheets (21), the adsorption surface (40 a) is positioned opposite to the lamination table (150), a plurality of suction holes (41) are formed in the adsorption surface (40 a), and a coating (50) is arranged on at least a part of the adsorption surface (40 a).
Description
Technical Field
The present invention relates to an apparatus and a method for manufacturing an electronic component.
Background
As a method for manufacturing electronic components such as a laminated ceramic capacitor, there is known a method in which ceramic green sheets obtained by shaping a ceramic material before firing into a sheet form are laminated, press-molded, and then fired/singulated, thereby mass-producing small-sized electronic components at a time.
As a manufacturing apparatus used for manufacturing such an electronic component, for example, patent document 1 discloses a manufacturing apparatus for a laminated electronic component, which includes a table for holding a carrier film having ceramic green sheets formed on an upper surface thereof by suction, a cutter for cutting the ceramic green sheets on the carrier film to a predetermined size, and a suction head for holding the ceramic green sheets obtained after cutting to a predetermined size by suction and peeling them from the carrier film.
The suction holes are provided on the surface of the suction head that contacts the ceramic green sheet, and suction is performed through the suction holes to suck the ceramic green sheet, so that the ceramic green sheet can be peeled from the carrier film.
Prior art literature
Patent literature
Patent document 1 Japanese patent laid-open No. 9-129502
Disclosure of Invention
Problems to be solved by the invention
An internal electrode is sometimes printed on the ceramic green sheet.
When such a ceramic green sheet is adsorbed, if the surface on which the internal electrode is printed is adsorbed, the internal electrode paste may adhere to the surface of the adsorption head (also referred to as a lamination head) to cause an adsorption failure, failure in peeling of the ceramic green sheet, generation of wrinkles in the ceramic green sheet, or lamination failure.
Further, the fragments of the ceramic green sheet generated by cutting the ceramic green sheet may adhere to the surface of the lamination head, resulting in suction failure and lamination failure.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an apparatus for manufacturing an electronic component in which a ceramic green sheet is less likely to remain on the surface of a lamination head.
Means for solving the problems
The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus including a lamination head for conveying ceramic green sheets and a lamination stage for laminating the conveyed ceramic green sheets, wherein the lamination head includes an adsorption surface for adsorbing and conveying the ceramic green sheets, the adsorption surface is located at a position facing the lamination stage, a plurality of suction holes are provided in the adsorption surface, and a coating layer is disposed on at least a part of the adsorption surface.
Effects of the invention
According to the present invention, it is possible to provide an apparatus for manufacturing an electronic component in which a ceramic green sheet is broken and an internal electrode paste is less likely to remain on the surface of a lamination head.
Drawings
Fig. 1 is a diagram schematically showing an example of an apparatus for manufacturing an electronic component according to the present invention.
Fig. 2 is a plan view of the electronic component manufacturing apparatus shown in fig. 1 with an enlarged cut region and a stacked region.
Fig. 3 is a cross-sectional view schematically showing an example of the lamination head.
Fig. 4 is a cross-sectional view schematically showing a state when ceramic green sheets are stacked on a stacking table using a stacking head.
Fig. 5 is an exploded perspective view schematically showing the configuration of another example of the lamination head.
Fig. 6 is a cross-sectional view of the lamination head shown in fig. 5.
Description of the reference numerals
10, A resin film;
20, ceramic green sheets;
21, cutting to obtain ceramic green sheets;
23, printed internal electrode paste (internal electrode pattern);
25, an internal electrode sheet;
30, raw material tablets;
40, stacking heads;
40a, the first main surface (suction surface) of the lamination head;
40b, the 2 nd main surface of the lamination head;
41, suction holes;
41a, wall surface of suction hole;
42, decompression chamber (suction mechanism);
50, coating;
100, a manufacturing device of an electronic component;
110, a rolling-out mechanism;
120, a coiling mechanism;
130, cutting off the table;
140, stripping table;
150, a lamination stage;
210 a head main body;
210a, the surface of the head main body;
211, suction holes (2 nd suction holes);
213, suction tube;
220 mesh member;
230, an adsorption plate;
230a, the 1 st main surface of the adsorption plate;
231, suction holes (1 st suction holes);
235, bending part;
240, stacking heads;
Cutting off the area;
and L is a lamination area.
Detailed Description
The apparatus for manufacturing an electronic component according to the present invention will be described below. However, the present invention is not limited to the following configuration, and can be appropriately modified and applied within a range not changing the gist of the present invention. The present invention also provides a structure in which 2 or more preferred structures of the present invention described below are combined.
In the present specification, terms indicating the relationship between elements (for example, "opposed", "orthogonal", etc.) and terms indicating the shape of the elements (for example, "rectangular parallelepiped", etc.) are not only expressions indicating strict meanings, but also expressions indicating substantially equivalent ranges including, for example, differences of about several percent.
The drawings shown below are schematic views, and the dimensions, aspect ratios, etc. thereof may be different from actual products.
[ Apparatus for manufacturing electronic component ]
The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus including a lamination head for conveying ceramic green sheets and a lamination stage for laminating the conveyed ceramic green sheets, wherein the lamination head includes an adsorption surface for adsorbing and conveying the ceramic green sheets, the adsorption surface is located at a position facing the lamination stage, a plurality of suction holes are provided in the adsorption surface, and a coating layer is disposed on at least a part of the adsorption surface.
Fig. 1 is a diagram schematically showing an example of an apparatus for manufacturing an electronic component according to the present invention.
In the manufacturing apparatus 100 of the electronic component shown in fig. 1, the raw material sheet 30 is wound out from the winding-out mechanism 110 and wound up by the winding-up mechanism 120 to be conveyed. In fig. 1, an arrow from the winding-out mechanism 110 toward the winding mechanism 120 indicates a direction in which the raw material sheet 30 is conveyed.
The raw sheet 30 passes through the cutting area C and the laminating area L while being conveyed from the winding mechanism 110 to the winding mechanism 120.
Tension control means such as a suction roller may be provided midway.
Fig. 2 is a plan view of the electronic component manufacturing apparatus shown in fig. 1 with an enlarged cut region and a stacked region.
The raw material sheet 30 is formed by laminating the ceramic green sheet 20 on the resin film 10 serving as a support, and is conveyed to pass through the cutting region C and the lamination region L.
A cutting stage 130 is disposed in the cutting region C, and a peeling stage 140 and a lamination stage 150 are disposed in the lamination region L.
Thus, the raw material sheet 30 is conveyed to pass over the cutting stage 130 and the peeling stage 140.
The resin film 10 constituting the raw material sheet 30 is arranged so as to be in contact with the cutting stage 130 and the peeling stage 140 when passing over the cutting stage 130 and the peeling stage 140, and the ceramic green sheet 20 is arranged so as not to be in contact with the cutting stage 130 and the peeling stage 140. Thus, it can be said that the ceramic green sheet 20 is exposed on the upper surface of the raw material sheet 30.
A cutting table 130 is provided in the cutting region C.
The ceramic green sheet 20 is cut in a predetermined shape (rectangular shape shown by a single-dot chain line) at the cutting stage 130.
The method of cutting the ceramic green sheet 20 is not particularly limited, but, for example, a method of pressing a cutting tool against the surface of the ceramic green sheet 20 may be mentioned. The ceramic green sheet 20 may be cut by rotating a roll-shaped cutter.
In addition, the ceramic green sheet may be cut by a laser or the like without using a cutter.
In addition, it is preferable that the resin film 10 serving as a support is not completely cut when the ceramic green sheet 20 is cut.
The ceramic green sheet 20 in the cutting region C may be cut while the conveyance of the raw sheet 30 is stopped, or may be cut while the raw sheet 30 is being conveyed.
The ceramic green sheet 21 obtained by cutting the ceramic green sheet in a predetermined shape in the cutting region C is transported as a raw material sheet 30 to a lamination region L described later together with the resin film 10 serving as a support by the operations of the winding-out mechanism 110 and the winding-up mechanism 120.
Meanwhile, a new raw material sheet 30 is supplied from the winding-out mechanism 110 side to the cutting area C. The ceramic green sheet 20 constituting the new raw material sheet 30 is a ceramic green sheet that has not been cut.
The lamination area L is an area having the peeling stage 140 and the lamination stage 150.
In the peeling stage 140, the ceramic green sheet 21 obtained after cutting in the cutting region C is peeled from the resin film 10 by a lamination head (not shown).
At this time, the resin film 10 constituting the raw material sheet 30 may be adsorbed on the surface of the peeling table 140 on the raw material sheet 30 side. By adsorbing the resin film 10 to the peeling table 140, peeling failure in which the resin film 10 as a support is lifted at the same time can be easily prevented when the ceramic green sheet 21 obtained after cutting is peeled from the raw material sheet 30.
The ceramic green sheet 21 obtained after cutting may be peeled from the raw sheet 30 while the conveyance of the raw sheet 30 is stopped, or may be peeled while the raw sheet 30 is being conveyed.
The ceramic green sheet 21 separated from the resin film 10 by the lamination head and cut is conveyed to the lamination stage 150 and then laminated.
The lamination stage 150 may also include a heating mechanism. In this case, the heating temperature is preferably 50 ℃ or more and 80 ℃ or less. The ceramic green sheet 21 obtained after cutting is heated at a temperature within the above range as long as the softening point of the binder contained in the ceramic green sheet 21 is not less than the softening point, and the ceramic green sheet 21 obtained after cutting can be easily stacked.
When the ceramic green sheets 21 obtained after cutting are laminated on the lamination stage 150, pressure is applied to the ceramic green sheets 21 obtained after cutting by the lamination head. By applying pressure to the ceramic green sheets 21 obtained after cutting and laminating, positional displacement of the ceramic green sheets 21 obtained after cutting can be prevented.
The ceramic green sheet 21 obtained after cutting may be directly stacked on the stacking table 150, or may be stacked on a plate-like jig or the like placed on the stacking table 150.
After the cut ceramic green sheet 21 is transferred from the peeling stage 140 to the lamination stage 150, the resin film 10 is formed as a trace of the peeled ceramic green sheet on the peeling stage 140.
In this state, the raw material sheet 30 is conveyed by the operations of the winding-out mechanism 110 and the winding mechanism 120, whereby the exposed portion of the resin film 10 is conveyed toward the winding mechanism 120 side, and the raw material sheet 30 including the ceramic green sheet 21 cut in a predetermined shape in the cutting region C and the resin film 10 supporting the same is conveyed again on the peeling table 140.
The cutting of the ceramic green sheet 20 in the cutting region C and the peeling, conveying, and stacking of the ceramic green sheet 21 obtained after the cutting in the stacking region L may be performed simultaneously.
At the time point when both cutting of the ceramic green sheet 20 in the cutting region C and lamination of the ceramic green sheet 21 obtained after cutting in the lamination region L are completed, the raw sheet 30 is conveyed by the operations of the winding-out mechanism 110 and the winding-up mechanism 120, whereby the ceramic green sheet 21 obtained after cutting in the cutting region C is supplied onto the peeling stage 140, and a new ceramic green sheet 20 that has not been cut is supplied onto the cutting stage.
By repeating the above operation, the ceramic green sheet 21 obtained after cutting can be laminated on the lamination stage 150.
[ Laminating head ]
Next, the lamination head will be described.
Fig. 3 is a cross-sectional view schematically showing an example of the lamination head.
As shown in fig. 3, the lamination head 40 has a substantially plate-like shape including a1 st main surface 40a and a2 nd main surface 40b facing each other in the thickness direction.
A plurality of suction holes 41 are formed in the surface of the 1 st main surface 40 a.
The plurality of suction holes 41 are all connected to the decompression chamber 42.
By depressurizing the depressurization chamber 42, air is sucked from the suction holes 41, and the ceramic green sheet can be adsorbed. Therefore, the 1 st main surface 40a is also referred to as an adsorption surface. The decompression chamber 42 is also referred to as a suction mechanism.
The decompression chamber 42 serving as the suction means is disposed on the 2 nd main surface 40b side of the lamination head 40.
The decompression chamber 42 is connected to, for example, a vacuum pump (not shown) provided outside the lamination head 40, and air in the decompression chamber 42 is sucked by the vacuum pump, whereby the air is sucked through the suction holes 41.
The 1-stage head may include a plurality of decompression chambers. In this case, the suction air or the non-suction air can be switched for each suction hole group connected to each decompression chamber.
Fig. 4 is a cross-sectional view schematically showing a state when ceramic green sheets are stacked on a stacking table using a stacking head.
Fig. 4 shows a state in which 1 ceramic green sheet 21 has been laminated on the lamination stage 150, and another ceramic green sheet 21 is laminated on the surface of the ceramic green sheet 21. The other ceramic green sheet 21 is an internal electrode sheet 25 having an internal electrode pattern 23 printed on the surface thereof.
As shown in fig. 4, the internal electrode sheets 25 having the internal electrode patterns 23 printed on the surface of the ceramic green sheet 21 obtained after cutting are adsorbed on the 1 st main surface 40a of the lamination head 40. The ceramic green sheet 21 constituting the internal electrode sheet 25 is stacked on the ceramic green sheet 21 stacked on the stacking table 150 by further moving the stacking head 40 downward from the position shown in fig. 4. Then, the suction of the internal electrode sheets 25 by the lamination head 40 is released, and the lamination head 40 is moved upward. When the lamination head 40 moves upward, the internal electrode sheets 25 are not attracted to the lamination head 40, and are thus laminated on the lamination stage 150.
Through the above steps, the ceramic green sheet 21 or the internal electrode sheet 25 can be stacked on the stacking table 150 using the stacking head 40.
At this time, the internal electrode sheets 25 may be pressed against the ceramic green sheet 21 by pressing the lamination head 40 toward the lamination stage 150, if necessary.
The 1 st main surface 40a of the lamination head 40 faces the lamination stage 150. Thus, the 1 st main surface 40a of the lamination head 40 is an adsorption surface.
As shown in fig. 4, the ceramic green sheet 21 obtained after cutting may be printed with the internal electrode pattern 23 as needed. In this case, the lamination head 40 may directly adsorb the surface of the ceramic green sheet 21 obtained after cutting (i.e., the portion where the internal electrode pattern 23 is not formed), or may adsorb the surface of the internal electrode pattern 23.
A plurality of suction holes 41 are formed in the 1 st main surface 40a as the suction surface.
A coating layer 50 is disposed on at least a part of the 1 st main surface 40a as the adsorption surface. The coating layer 50 may be disposed on only a part of the 1 st main surface 40a or may be disposed on all of the 1 st main surface 40 a.
When the coating layer 50 is disposed on at least a part of the 1 st main surface 40a as the suction surface, the cut pieces of the ceramic green sheet and the internal electrode paste are less likely to remain on the suction surface of the lamination head. Therefore, the adsorption failure and lamination failure can be suppressed.
Preferably, the coating layer 50 is also disposed on at least a part of the surface of the wall surface 41a constituting the suction hole 41.
When the coating layer 50 is disposed on at least a part of the surface of the wall surface 41a constituting the suction hole 41, the ceramic green sheet and the internal electrode paste can be prevented from remaining in the vicinity of the suction hole 41, and the suction failure and lamination failure can be further suppressed.
Further, even if the ceramic green sheet and the internal electrode paste remain in the vicinity of the suction hole, they can be easily removed by blowing out air from the suction hole.
The suction hole 41 is preferably tapered in shape such that the aperture gradually decreases from the 1 st main surface 40a to the 2 nd main surface 40 b.
Preferably, the thickness of the coating layer 50 formed on the surface of the wall surface 41a constituting the suction hole 41 is thicker as it approaches the 1 st main surface 40a and thinner as it approaches the 2 nd main surface 40 b.
If the suction hole has the tapered shape, and the thickness of the coating layer is thicker as it approaches the 1 st main surface and thinner as it approaches the 2 nd main surface, clogging of the suction hole due to formation of the coating layer can be suppressed.
The wall surface 41a constituting the suction hole 41 includes all surfaces which are exposed on the surface of the 1 st main surface 40a and are not parallel to the 1 st main surface 40 a.
The thickness of the coating layer on the adsorption surface is not particularly limited, but is, for example, preferably 1 μm or less, more preferably 0.1 μm or more and 1 μm or less, and still more preferably 0.1 μm or more and 0.5 μm or less.
Preferably, the coating layer is formed on 95% to 100% of the area of the 1 st main surface. However, the area of the wall surface of the suction hole is not included in the calculation of the area.
Preferably, the coating layer is provided with a1 st coating layer containing carbon as an element.
The coating layer may be 1 layer or 2 layers or more.
Preferably, the coating layer includes a 2 nd coating layer having fluorine and silicon as elements.
Preferably, the 1 st coating layer containing carbon as an element and the 2 nd coating layer containing fluorine and silicon as elements are laminated in this order from the adsorption surface.
Instead of the 2 nd coating layer containing fluorine and silicon as elements, a2 nd coating layer containing iron and carbon as elements may be formed.
When the coating layer includes a plurality of layers, the total thickness of the coating layer is preferably 0.1 μm or more and 1 μm or less. When the total thickness of the coating layers is less than 0.1 μm, the effects of the ceramic green sheet being broken and the internal electrode paste being less likely to remain on the surface of the laminated head may not be sufficiently exhibited. In addition, when the total thickness of the coating layers exceeds 1 μm, the movement of static electricity from the coating layers to the lamination head main body is not easily induced, and therefore static electricity may be easily accumulated in the coating layers.
The average thickness of the coating layer disposed on the surface of the wall surface constituting the suction hole is not particularly limited, but is preferably 1 μm or less, more preferably 0.1 μm or more and 1 μm or less, and still more preferably 0.1 μm or more and 0.5 μm or less.
The average thickness of the coating layer disposed on the surface of the wall surface constituting the suction hole was determined by the following method.
First, the length of the coating layer formed on the wall surface constituting the suction hole in the thickness direction of the lamination head was obtained. Next, a position at which the coating layer is divided into two in the thickness direction of the lamination head, that is, a middle position of the coating layer distributed in the thickness direction is determined. Finally, a perpendicular line is drawn from the wall surface constituting the suction hole toward the coating layer at the intermediate position, and the length of the perpendicular line up to the surface of the coating layer is set to the average thickness of the coating layer.
The coating layer can be formed, for example, by placing the lamination head in an atmosphere containing a component to be the coating layer. As time passes, the components forming the coating layer enter the suction holes and advance, so that the coating layer can be made thinner in the deep portions of the suction holes, and the thickness of the coating layer becomes thicker as the coating layer approaches the 1 st main surface and becomes thinner as the coating layer approaches the 2 nd main surface.
The shape of the lamination head is not particularly limited as long as it has a planar shape as the suction surface, but for example, a plate-like shape having a1 st main surface as the suction surface and a 2 nd main surface facing the 1 st main surface is exemplified.
The material constituting the laminated head is not particularly limited, but is preferably metal.
The lamination head is preferably a metal plate having a1 st main surface and a2 nd main surface facing each other in the thickness direction and having a thickness of 0.5mm or less.
In this case, the 1 st main surface is preferably an adsorption surface, and the 2 nd main surface side is preferably provided with a suction mechanism.
The length of the suction hole is not particularly limited.
The number of the suction holes and the interval between the suction holes are not particularly limited.
The lamination head may be provided with a heating mechanism. Preferably, the heating means is a means capable of heating the 1 st main surface of the lamination head to a temperature of 50 ℃ or more and 80 ℃ or less.
By heating the ceramic green sheet to a temperature of 50 ℃ or more and 80 ℃ or less, it is easy to laminate the ceramic green sheet.
Fig. 5 is an exploded perspective view schematically showing the configuration of another example of the lamination head.
In the laminated head 240 shown in fig. 5, a suction plate 230 is disposed on a surface 210a of a head main body 210 having a suction mechanism and suction holes 211 via a mesh member 220.
The suction mechanism includes a suction tube 213 led out from a side surface of the head main body 210, and a decompression chamber (not shown) formed inside the head main body 210 and connected to the suction hole 211 inside the head main body 210. Such a configuration is also an example in which the suction mechanism is provided on the 2 nd principal surface side of the lamination head. The 1 st main surface and the 2 nd main surface of the laminated head described later.
The suction hole 231 is provided in the 1 st main surface 230a of the suction plate 230. Thus, the 1 st main surface 230a of the suction plate 230 provided with the suction holes 231 is the 1 st main surface of the lamination head 240, and is the suction surface.
The suction plate 230 has a 1 st main surface 230a provided with suction holes 231 and a bent portion 235 where the suction holes 231 are not provided, and is fixed to the head main body 210 by the bent portion 235.
In order to distinguish the suction holes 211 provided on the surface 210a of the head main body 210 from the suction holes 231 provided on the 1 st main surface 230a of the suction plate 230, the suction holes are also referred to as 1 st suction holes. The suction holes 211 provided in the surface 210a of the head main body 210 are also referred to as the 2 nd suction holes.
When the air in the decompression chamber is sucked by the suction pipe 213, the air is sucked from the 1 st suction hole 231 through the 2 nd suction hole 211, and the ceramic green sheet can be sucked onto the 1 st main surface 230a of the suction plate 230 (the suction surface of the lamination head 240).
The length of the 1 st suction hole 231 is not particularly limited, but is preferably 0.1mm or more and 0.5mm or less.
A coating may be formed on at least a part of the surface 210a of the head main body 210 where the 2 nd suction hole 211 is formed.
Further, a coating layer may be formed on the surface of the inner wall of the opening of the 2 nd suction hole 211.
Further, the shape of the 2 nd suction hole 211 may be a tapered shape in which the aperture gradually decreases from the surface 210a to the opposite side in the thickness direction.
The mesh member 220 is a mesh-shaped structure, and can homogenize air flowing between the 1 st suction hole 231 and the 2 nd suction hole 211.
Therefore, even when the aperture of the 2 nd suction hole 211 is larger than the aperture of the 1 st suction hole 231, and when the aperture number of the 2 nd suction hole 211 is larger than the aperture number of the 1 st suction hole 231, the flow of air can be uniformed by the mesh member 220, and uniform suction can be performed by the 1 st suction hole 231.
As the mesh member 220, for example, a metal or the like can be used.
Fig. 6 is a cross-sectional view of the lamination head shown in fig. 5.
As shown in fig. 6, the 1 st main surface 230a of the suction plate 230 constituting the lamination head 240 is provided with the coating layer 50 and the 1 st suction holes 231.
The 1 st main surface 230a of the suction plate 230 is also a suction surface of the lamination head 240.
Preferably, the interval at which the 2 nd suction holes 211 provided in the head main body 210 are arranged is longer than the interval at which the 1 st suction holes 231 provided in the 1 st main surface 230a of the suction plate 230 are arranged.
Further, the 2 nd suction hole 211 provided in the head main body 210 preferably has a larger aperture than the 1 st suction hole 231 provided in the 1 st main surface 230a of the suction plate 230.
In addition, the adsorption plate 230 is detachable.
Accordingly, the suction plate can be replaced with another suction plate in which the diameter, the number of the suction holes 231 provided in the 1 st main surface 230a of the suction plate 230 and the arrangement pattern are optimized in accordance with the characteristics of the ceramic green sheet to be conveyed.
The ceramic green sheet contains, for example, ceramic particles containing Ba and Ti, and is formed by applying a slurry containing a binder, a dispersant, and the like to a resin film and drying the same.
The coating method is not particularly limited, and various coating methods such as gravure coating and stamp coating can be used.
The thickness of the ceramic green sheet is not particularly limited, but is about 0.2 μm or more and 3.0 μm or less.
The internal electrode pattern may be printed on the surface of the ceramic green sheet as needed. The ceramic green sheet printed with the internal electrode pattern is also referred to as an internal electrode sheet.
The internal electrode pattern can be formed by printing an internal electrode paste in which metal particles, a binder, an organic solvent, and a dispersant are mixed on a ceramic green sheet.
The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.
The thickness of the internal electrode pattern is not particularly limited, but is about 0.1 μm or more and 3.0 μm or less.
The ceramic green sheet may be processed in a state of being wound into a roll as a state (raw material sheet) laminated on a resin film serving as a support.
In this case, the resin film is rolled out by the rolling-out mechanism, cut in a predetermined shape at or near the peeling region, peeled off from the surface of the resin film by the pressure-bonding joint, and laminated on the lamination stage.
[ Method for manufacturing electronic component ]
The method for manufacturing an electronic component according to the present invention is characterized in that ceramic green sheets are laminated using the apparatus for manufacturing an electronic component according to the present invention.
When the electronic component manufacturing apparatus of the present invention is used, a ceramic green sheet can be stacked on a stacking table. In this case, the ceramic green sheet fragments and the internal electrode paste are less likely to remain on the surface of the lamination head, and thus the suction failure and lamination failure are less likely to occur.
Therefore, in the method for manufacturing an electronic component according to the present invention using the apparatus for manufacturing an electronic component according to the present invention, it is possible to suppress the defects of the electronic component due to the suction defect and the lamination defect.
In the present specification, the following matters are described.
The present disclosure (1) is an apparatus for manufacturing an electronic component, comprising a lamination head for conveying ceramic green sheets and a lamination stage for laminating the conveyed ceramic green sheets,
The lamination head includes an adsorption surface for adsorbing and conveying the ceramic green sheet, the adsorption surface is positioned opposite to the lamination table,
A plurality of suction holes are arranged on the suction surface,
A coating layer is disposed on at least a portion of the adsorption surface.
The present disclosure (2) is the electronic component manufacturing apparatus according to the present disclosure (1), wherein the coating layer is further disposed on at least a part of the surface of the wall surface constituting the suction hole.
The present disclosure (3) is an apparatus for manufacturing an electronic component according to the present disclosure (1) or (2), wherein the coating layer includes a1 st coating layer containing carbon as an element.
The present disclosure (4) is an apparatus for manufacturing an electronic component according to the present disclosure (3), wherein the coating further includes a2 nd coating layer containing fluorine and silicon as elements,
And the 1 st coating and the 2 nd coating are sequentially arranged from the adsorption surface.
The present disclosure (5) is an apparatus for manufacturing an electronic component according to any one of the present disclosure (1) to (4), wherein the lamination head is a metal plate having a1 st main surface and a2 nd main surface facing each other in a thickness direction and having a thickness of 0.5mm or less,
The first principal surface of the metal plate is the suction surface,
The metal plate is provided with a suction mechanism on the 2 nd main surface side.
The present disclosure (6) is the electronic component manufacturing apparatus according to any one of the present disclosure (1) to (5), wherein the thickness of the coating layer on the adsorption surface is 0.1 μm or more and 1 μm or less.
The present disclosure (7) is a method for manufacturing an electronic component, characterized in that a ceramic green sheet is laminated using the electronic component manufacturing apparatus described in any one of the present disclosure (1) to (6).
Claims (7)
1. An apparatus for manufacturing an electronic component, comprising a lamination head for conveying ceramic green sheets and a lamination stage for laminating the conveyed ceramic green sheets,
The lamination head includes an adsorption surface for adsorbing and conveying the ceramic green sheet, the adsorption surface is positioned opposite to the lamination table,
A plurality of suction holes are arranged on the suction surface,
A coating layer is disposed on at least a portion of the adsorption surface.
2. The apparatus for manufacturing an electronic component according to claim 1, wherein,
The coating layer is also disposed on at least a part of the surface of the wall surface constituting the suction hole.
3. The apparatus for manufacturing an electronic component according to claim 1 or 2, wherein,
The coating is provided with a1 st coating layer containing carbon as an element.
4. The apparatus for manufacturing an electronic component according to claim 3, wherein,
The coating is further provided with a2 nd coating comprising fluorine and silicon as elements,
And the 1 st coating and the 2 nd coating are sequentially arranged from the adsorption surface.
5. The apparatus for manufacturing an electronic component according to any one of claims 1 to 4, wherein,
The lamination head is a metal plate having a1 st main surface and a2 nd main surface which are opposite to each other in the thickness direction and having a thickness of 0.5mm or less,
The first principal surface of the metal plate is the suction surface,
The metal plate is provided with a suction mechanism on the 2 nd main surface side.
6. The apparatus for manufacturing an electronic component according to any one of claims 1 to 5, wherein,
The thickness of the coating layer on the adsorption surface is 0.1 μm or more and 1 μm or less.
7. A method for manufacturing an electronic component, characterized in that,
A ceramic green sheet laminated by using the electronic component manufacturing apparatus according to any one of claims 1 to 6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023102561A JP2025002398A (en) | 2023-06-22 | 2023-06-22 | Manufacturing apparatus for electronic components and manufacturing method for electronic components |
| JP2023-102561 | 2023-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119181595A true CN119181595A (en) | 2024-12-24 |
Family
ID=93901864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410605561.8A Pending CN119181595A (en) | 2023-06-22 | 2024-05-15 | Electronic component manufacturing device and electronic component manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2025002398A (en) |
| CN (1) | CN119181595A (en) |
-
2023
- 2023-06-22 JP JP2023102561A patent/JP2025002398A/en active Pending
-
2024
- 2024-05-15 CN CN202410605561.8A patent/CN119181595A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2025002398A (en) | 2025-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20020085741A (en) | Manufacturing method and manufacturing apparatus of thin film laminated article | |
| JP3740991B2 (en) | Green sheet laminating apparatus, green sheet laminating method, and multilayer ceramic electronic component manufacturing method | |
| WO2004095479A1 (en) | Method for manufacturing multilayer unit for multilayer electronic component | |
| US7182899B2 (en) | Manufacturing method of ceramic electronic components and its manufacturing equipment | |
| CN119181595A (en) | Electronic component manufacturing device and electronic component manufacturing method | |
| JP3435060B2 (en) | Ceramic green sheet laminating apparatus and laminating method | |
| JPH08244019A (en) | Lamination of ceramic green sheet | |
| JP4371261B2 (en) | Ceramic green sheet crimping device | |
| JP4863028B2 (en) | Green sheet manufacturing method, green sheet laminate manufacturing method, and green sheet manufacturing apparatus | |
| JPH0256802B2 (en) | ||
| JP2008147470A (en) | Electronic component manufacturing method and manufacturing apparatus used therefor | |
| JP2025002016A (en) | Manufacturing apparatus of electronic component and manufacturing method of electronic component | |
| JP3567802B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP3789170B2 (en) | Ceramic green sheet cutting and laminating method | |
| JP3417376B2 (en) | Manufacturing method and manufacturing apparatus for multilayer ceramic electronic component | |
| JP2772301B2 (en) | Method for manufacturing multilayer wiring ceramic substrate | |
| JP4438361B2 (en) | Ceramic laminate manufacturing apparatus and ceramic laminate manufacturing method | |
| JPH11297581A (en) | Method and device for manufacturing multilayer electronic component | |
| JP2002179470A (en) | Production process of ceramic electronic component and spray device for fusion inhibitor | |
| JPH0558216U (en) | Laminating device for laminated ceramic electronic components | |
| JP4147948B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP2002100527A (en) | Method of manufacturing laminated ceramic electronic component | |
| JPH06114817A (en) | Jig for laminate and method for laminating green sheet | |
| JP4629296B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP4889192B2 (en) | Manufacturing method of multilayer ceramic electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |