CN119178461B - Anti-interference infrared detection chip packaging structure - Google Patents
Anti-interference infrared detection chip packaging structure Download PDFInfo
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- CN119178461B CN119178461B CN202411675960.8A CN202411675960A CN119178461B CN 119178461 B CN119178461 B CN 119178461B CN 202411675960 A CN202411675960 A CN 202411675960A CN 119178461 B CN119178461 B CN 119178461B
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- detection chip
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/26—Windows; Cover glasses; Sealings therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
本发明涉及微电子封装技术领域，具体涉及一种抗干扰红外探测芯片封装结构，包括管壳和切断组件，所述管壳连接有排气管，所述排气管的内部滑动设有密封组件，所述密封组件包括连接板，连接板上沿前后方向设有两组以上隔断组，各隔断组均包括隔断挡板和密封台，隔断挡板与排气管的内壁密封滑动连接，所述密封台位于隔断挡板的前方，所述密封台与排气管的内壁之间具有间隙，所述密封台的后方且靠近连接板的位置设有密封槽；所述切断组件用于将排气管的特定位置切断并压扁，当排气管切断并压扁后，推动密封组件整体向后移动，能够使排气管的端部插入密封槽内，从而使密封台与排气管的端部形成密封，多次密封能够降低成本。
The present invention relates to the field of microelectronic packaging technology, and specifically to an anti-interference infrared detection chip packaging structure, comprising a tube shell and a cutting component, wherein the tube shell is connected to an exhaust pipe, and a sealing component is slidably provided inside the exhaust pipe, wherein the sealing component comprises a connecting plate, and two or more partition groups are provided on the connecting plate along the front-to-back direction, and each partition group comprises a partition baffle and a sealing platform, and the partition baffle is sealingly slidably connected to the inner wall of the exhaust pipe, and the sealing platform is located in front of the partition baffle, and there is a gap between the sealing platform and the inner wall of the exhaust pipe, and a sealing groove is provided behind the sealing platform and close to the connecting plate; the cutting component is used to cut and flatten a specific position of the exhaust pipe, and when the exhaust pipe is cut and flattened, the sealing component is pushed to move backward as a whole, so that the end of the exhaust pipe can be inserted into the sealing groove, so that the sealing platform and the end of the exhaust pipe form a seal, and multiple sealing can reduce costs.
Description
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to an anti-interference infrared detection chip packaging structure.
Background
The anti-interference infrared detection chip needs to work in a vacuum environment, and usually the chip and other components are vacuum-packaged in a tube shell, and an oxygen-free copper tube is welded on the side wall of the tube shell to enable the inside and outside of the tube shell to be communicated. In the packaging process, vacuum exhaust is carried out through the oxygen-free copper pipe, and finally, cold pressing and shearing are carried out on the oxygen-free copper pipe by adopting a special shearing tool, so that a closed independent high-vacuum device is formed.
The patent document with publication number CN102522343B discloses a vacuum packaging exhaust device and method for micro devices, in which a welded exhaust pipe is cancelled on the side wall of a tube shell, instead, a hole is formed in the bottom of the tube shell for vacuum exhaust, and a hollow cylinder structure is used for airtight sealing by adopting solder, but since a small amount of gas is released by a chip and other components, and the risk of air leakage still exists in the welding sealing, the vacuum effect of the chip packaging structure cannot be ensured.
Disclosure of Invention
Based on the above, it is necessary to provide an anti-interference infrared detection chip packaging structure aiming at the technical problem that the vacuum effect cannot be ensured by the current vacuum packaging and exhausting device.
The above purpose is achieved by the following technical scheme:
The anti-interference infrared detection chip packaging structure comprises a pipe shell and a cutting-off assembly, wherein the pipe shell is connected with an exhaust pipe, a sealing assembly is slidably arranged in the exhaust pipe, the sealing assembly comprises a connecting plate, more than two groups of partition groups are arranged on the connecting plate along the front-rear direction, each partition group comprises partition baffles and a sealing table, the partition baffles and the sealing tables of the same group are arranged at intervals, the partition baffles are in sealing sliding connection with the inner wall of the exhaust pipe and are elastic plates, and can shrink along the radial direction of the exhaust pipe;
when the exhaust pipe is cut off and flattened, the whole sealing assembly is pushed to move backwards, and the end part of the exhaust pipe can be inserted into the sealing groove, so that the sealing platform and the end part of the exhaust pipe form a seal.
Further, the cross section of the partition baffle is V-shaped, and the V-shaped opening of the partition baffle faces forward.
Further, the sealing platform is conical, the sealing platform is provided with a conical surface and a bottom surface, the conical surface is arranged forwards, and the sealing groove is arranged on the bottom surface.
Further, the bottom surface is a conical surface, the bottom surface is inclined backwards from a position far away from the connecting plate to a position close to the connecting plate, and the end part of the exhaust pipe can slide along the bottom surface in a sealing way.
Further, the cutting assembly comprises two cutting plates, protrusions are arranged on the side faces of the cutting plates, and the protrusions can squeeze the sealing table along the radial direction of the exhaust pipe, so that the rear end of the sealing table is folded.
Further, a sealant is coated between the end of the exhaust pipe and the sealing table.
Further, the sealing platform is provided with ventilation holes at the position close to the inner wall of the exhaust pipe.
Further, a stop ring is arranged at the rear end of the connecting plate, an annular step is arranged on the inner wall of the exhaust pipe, and the stop ring is in stop fit with the annular step.
Further, the partition baffle, the sealing table and the connecting plate are integrally formed.
Further, the partition baffle plate of the partition group positioned at the front is contacted with the sealing platform of the partition group positioned at the rear.
The beneficial effects of the invention are as follows:
According to the anti-interference infrared detection chip packaging structure provided by the invention, the negative pressure suction device is used for vacuumizing the inside of the tube shell through the exhaust tube, and the plurality of partition baffles can radially shrink in the suction process, so that gas can smoothly pass through the partition baffles and the sealing table, after the inside of the tube shell becomes negative pressure, the partition baffles elastically reset to realize sliding sealing with the inner wall of the exhaust tube, at the moment, the end part of the exhaust tube is cut off by using the cutting assembly, and then the sealing assembly is pushed to integrally slide backwards, so that the end part of the exhaust tube can enter the sealing groove of the sealing table, and the sealing table forms sealing with the end part of the exhaust tube. The partition groups are provided with more than two groups, so that when the sealing of the front partition group fails or the released gas in the tube shell is no longer negative pressure, the sealing is formed again at the rear partition group; therefore, the anti-interference infrared detection chip packaging structure can form sealing for multiple times, the cost is reduced, and the vacuum effect in the tube shell is ensured.
Secondly, after sealing platform and the tip seal of blast pipe became invalid, outside gas can get into in the blast pipe, and then makes between sealing platform and the partition baffle become the malleation, because the rear side of partition baffle is the negative pressure, thereby make sealing assembly wholly have the trend of backward movement, and then sealing platform can compress tightly the tip of blast pipe, slows down outside gas's entering, and partition baffle can radial expansion simultaneously, makes the inner wall contact of partition baffle and blast pipe inseparabler, reduces gas backward flow, guarantees sealed effect.
Third, be equipped with the arch on the cutting board, the radial extrusion sealing platform of blast pipe can be followed to the arch, makes the rear end of sealing platform draw in to sealing platform can compress tightly with the tip of blast pipe, avoids blast pipe tip gas leakage, further improves sealed effect.
Drawings
Fig. 1 is a schematic perspective view of an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 2 is a top view of an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is an enlarged view of the portion I of FIG. 3;
FIG. 5 is a schematic structural diagram of a seal assembly in an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of an exhaust pipe and a sealing assembly in an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating an initial operating state of an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating a second working state of an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating a third working state of an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a cutting component in an anti-interference infrared detection chip package structure according to an embodiment of the present invention;
Fig. 11 is a state diagram of cutting and flattening an end portion of an exhaust pipe in an anti-interference infrared detection chip package structure according to an embodiment of the present invention.
Wherein:
100. The pipe shell, 210, the exhaust pipe, 212, the first closing section, 213, the second closing section, 220, the connecting plate, 230, the partition baffle, 240, the sealing table, 250, the sealing groove, 260, the air holes, 270, the sealant, 280, the stop ring, 310, the cutting plate, 320 and the bulge.
Detailed Description
The present invention will be further described in detail below with reference to examples, which are provided to illustrate the objects, technical solutions and advantages of the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The numbering of components herein, such as "first," "second," etc., is used merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1 to 11, an anti-interference infrared detection chip packaging structure provided by an embodiment of the invention includes a tube shell 100, the tube shell 100 is connected with an exhaust pipe 210, a sealing assembly is slidably disposed in the exhaust pipe 210, the sealing assembly includes a connecting plate 220, two or more sets of partition groups are disposed on the connecting plate 220 along a front-rear direction, each partition group includes a partition baffle 230 and a sealing table 240, the partition baffle 230 and the sealing table 240 of the same set are disposed at intervals, the partition baffle 230 is slidably connected with an inner wall of the exhaust pipe 210 in a sealing manner, the partition baffle 230 is an elastic plate and can shrink along a radial direction of the exhaust pipe 210 when the exhaust pipe 210 is vacuumized, the sealing table 240 is located in front of the partition baffle 230, a gap is formed between the sealing table 240 and the inner wall of the exhaust pipe 210, and a sealing groove 250 is disposed at a position behind the sealing table 240 and close to the connecting plate 220.
The anti-interference infrared detection chip packaging structure further comprises a cutting assembly, wherein the cutting assembly is used for cutting and flattening specific positions of the exhaust pipe 210, the specific positions are positioned between the partition baffles 230 of each partition group and the sealing table 240, and after the exhaust pipe 210 is cut off and flattened, the sealing assembly is pushed to integrally move backwards, so that the end part of the exhaust pipe 210 can be inserted into the sealing groove 250, and the sealing table 240 and the end part of the exhaust pipe 210 form a seal. The exhaust pipe 210 is an oxygen-free copper pipe.
In one embodiment, the cross section of the partition wall 230 is V-shaped, and the V-shaped opening of the partition wall 230 faces forward. In this embodiment, the partition plate 230 is two obliquely arranged plates. In other embodiments, the partition wall 230 is a tapered wall.
In one embodiment, the sealing platform 240 is conical, the sealing platform 240 has a conical surface and a bottom surface, the conical surface is disposed forward, and the sealing groove 250 is disposed on the bottom surface.
In one embodiment, the bottom surface is a tapered surface, the bottom surface is inclined backward from a position far from the connection plate 220 to a position near to the connection plate 220, and the end of the exhaust pipe 210 can slide along the bottom surface in a sealing manner. As shown in fig. 4, the angle α between the bottom surface and the inner wall of the exhaust pipe 210 is less than 90 degrees. Thus, after the end of the exhaust pipe 210 is cut off, the end of the exhaust pipe 210 is mutually extruded with the bottom surface, so that external air is prevented from entering the inside of the exhaust pipe 210, and meanwhile, the end of the exhaust pipe 210 pushes the sealing table 240 to slide forwards, so that a reserved space is reserved for the subsequent backward movement of the sealing table 240.
In an embodiment, the cutting assembly includes two cutting plates 310, as shown in fig. 10, a protrusion 320 is disposed on a side surface of the cutting plate 310, and the protrusion 320 can press the sealing table 240 along a radial direction of the exhaust pipe 210, so that the rear end of the sealing table 240 is folded, and the sealing table 240 can be tightly pressed against an end of the exhaust pipe 210, thereby avoiding air leakage at the end of the exhaust pipe 210, and further improving the sealing effect.
In one embodiment, a sealant 270 is applied between the end of the exhaust pipe 210 and the sealing table 240. As shown in fig. 11, the end portion of the exhaust pipe 210 has a first closing section 212 and a second closing section 213 after being cut and flattened, the first closing section 212 is located at two ends of the exhaust pipe 210, so as to compress the two ends of the exhaust pipe 210, the second closing section 213 is located at a middle position of the exhaust pipe 210, the second closing section 213 has an opening, and the connection plate 220 is located in the opening.
In one embodiment, the sealing table 240 is provided with ventilation holes 260 near the inner wall of the exhaust pipe 210. In other embodiments, the diameter of the sealing land 240 is smaller than the diameter of the exhaust pipe 210, so that gas flow is achieved through the gap between the sealing land 240 and the inner wall of the exhaust pipe 210.
In one embodiment, a stop ring 280 is disposed at the rear end of the connecting plate 220, and an annular step is disposed on the inner wall of the exhaust pipe 210, and the stop ring 280 is in stop fit with the annular step. Providing the stop ring 280 and annular step can prevent the seal assembly from entering the curve of the exhaust pipe 210.
In one embodiment, the partition plate 230, the sealing table 240 and the connecting plate 220 are integrally formed and made of elastic metal materials. In other embodiments, the partition plate 230 and the sealing table 240 are each snap-fitted to the connection plate 220.
In one embodiment, the partition baffles 230 of the front partition group are disposed in contact with the sealing lands 240 of the rear partition group. The middle of the partition plate 230 is cut off more easily after being placed in contact with the sealing table 240, which facilitates the manufacture of the sealing assembly in different lengths. In other embodiments, a distance exists between the partition baffles 230 of the front partition group and the sealing lands 240 of the rear partition group.
In combination with the above embodiment, the use principle and the working process of the anti-interference infrared detection chip packaging structure provided by the embodiment of the invention are as follows:
First, the seal assembly is inserted into the exhaust pipe 210 and the stop ring 280 is brought into stop engagement with the annular step in the exhaust pipe 210 to effect positioning of the seal assembly. The exhaust pipe 210 is then connected to a negative pressure suction device (not shown in the drawings, belonging to the prior art) to evacuate the interior of the envelope 100. As shown in fig. 7 to 9, the plurality of partition baffles 230 are radially contracted in the suction process, so that gas can smoothly pass through the partition baffles 230 and the ventilation holes 260 of the sealing table 240, after the inside of the pipe shell 100 is changed into negative pressure, both sides of the partition baffles 230 are negative pressure, the partition baffles 230 elastically reset to realize sliding sealing with the inner wall of the exhaust pipe 210, at the moment, the end of the exhaust pipe 210 is cut off by using the cutting assembly, the end of the exhaust pipe 210 can hermetically slide towards the connecting plate 220 along the bottom surface of the sealing table 240 until the cutting assembly presses the end of the exhaust pipe 210 on the connecting plate 220, and because the bottom surface of the sealing table 240 is a conical surface, the end of the exhaust pipe 210 can push the whole sealing table 240 to move forwards to provide a reserved space for subsequent backward movement of the sealing table 240, and when the end of the exhaust pipe 210 corresponds to the position of the sealing groove 250, the whole sealing assembly is pushed to slide backwards, so that the end of the exhaust pipe 210 can enter the sealing groove 250 of the sealing table 240 to form sealing for the end opening of the exhaust pipe 210, and then the end of the cutting assembly is further pressed against the end of the exhaust pipe 210, and the end 320 can be further pressed against the connecting plate 220, and the end of the sealing table 210 can be prevented from being pressed against the sealing table 240. After the sealing platform 240 and the end part of the exhaust pipe 210 are in failure, external air can enter the exhaust pipe 210, and then the sealing platform 240 and the partition baffle 230 become positive pressure, and the rear side of the partition baffle 230 is negative pressure, so that the whole sealing assembly has a backward moving trend, the sealing platform 240 can press the end part of the exhaust pipe 210, the entry of the external air is slowed down, and meanwhile, the partition baffle 230 can radially expand, so that the partition baffle 230 is in closer contact with the inner wall of the exhaust pipe 210, the backward flow of the air is reduced, and the sealing effect of the pipe shell 100 is ensured.
When the sealing of the front partition group fails, for example, the sealing glue 270 leaks or the released gas in the pipe shell 100 is no longer kept in a negative pressure state, the sealing glue 270 is removed firstly, then the sealing table 240 is clamped to drive the sealing assembly to integrally slide forwards along the exhaust pipe 210, so that the end part of the exhaust pipe 210 is expanded to restore the original circular state by the partition baffle 230 and the rear adjacent sealing table 240, the gas in the pipe shell 100 can flow outwards, then the sealing assembly is inserted into the exhaust pipe 210 again and is matched with the annular step in the exhaust pipe 210 in a blocking manner, the pipe shell 100 is vacuumized again by a negative pressure air suction device, the exhaust pipe 210 corresponding to the adjacent rear partition group is cut off and pressed on the connecting plate 220 by the cutting assembly, the end part of the exhaust pipe 210 can push the sealing assembly to integrally slide forwards again, when the end part of the exhaust pipe 210 corresponds to the sealing groove 250, the end part of the exhaust pipe 210 is pushed to integrally slide backwards again, the end part of the exhaust pipe 210 enters the sealing groove 250 of the adjacent rear sealing table 240 again, the end part of the exhaust pipe 210 is sealed again, finally, the rear end part of the cutting assembly is pressed against the end part of the exhaust pipe 210 again, the end part of the sealing table 240 is pressed against the end part of the exhaust pipe 210, the end part of the exhaust pipe 210 is pressed against the end part of the exhaust pipe 210 by the annular step, and the sealing table 240 is prevented from being in contact with the sealing table 230. Due to the fact that the plurality of groups of partition groups are arranged, the anti-interference infrared detection chip packaging structure can form sealing for multiple times, cost is reduced, and vacuum effect in the tube shell 100 is guaranteed.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of the invention should be assessed as that of the appended claims.
Claims (9)
1. The anti-interference infrared detection chip packaging structure is characterized by comprising a pipe shell and a cutting-off assembly, wherein the pipe shell is connected with an exhaust pipe, a sealing assembly is slidably arranged in the exhaust pipe, the sealing assembly comprises a connecting plate, more than two groups of partition groups are arranged on the connecting plate along the front-rear direction, each partition group comprises partition baffles and a sealing table, the partition baffles and the sealing tables of the same group are arranged at intervals, the partition baffles are in sealed sliding connection with the inner wall of the exhaust pipe, and are elastic plates and can shrink along the radial direction of the exhaust pipe;
When the exhaust pipe is cut off and flattened, the sealing assembly is pushed to move backwards integrally, so that the end part of the exhaust pipe can be inserted into the sealing groove, and the sealing platform and the end part of the exhaust pipe form a seal.
2. The anti-interference infrared detection chip packaging structure according to claim 1, wherein the cross section of the partition baffle is V-shaped, and the V-shaped opening of the partition baffle faces forward.
3. The anti-interference infrared detection chip packaging structure according to claim 2, wherein the sealing table is conical, the sealing table is provided with a conical surface and a bottom surface, the conical surface is arranged forward, and the sealing groove is arranged on the bottom surface.
4. The anti-interference infrared detection chip packaging structure according to claim 3, wherein the bottom surface is a conical surface, the bottom surface is inclined backwards from a position far away from the connecting plate to a position close to the connecting plate, and the end part of the exhaust pipe can slide along the bottom surface in a sealing manner.
5. The anti-interference infrared detection chip packaging structure according to claim 1, wherein a sealant is coated between the end part of the exhaust pipe and the sealing table.
6. The anti-interference infrared detection chip packaging structure according to claim 1, wherein the sealing table is provided with ventilation holes at positions close to the inner wall of the exhaust pipe.
7. The anti-interference infrared detection chip packaging structure according to claim 1, wherein a stop ring is arranged at the rear end of the connecting plate, an annular step is arranged on the inner wall of the exhaust pipe, and the stop ring is matched with the annular step in a stop mode.
8. The anti-interference infrared detection chip packaging structure according to claim 1, wherein the partition baffle, the sealing table and the connecting plate are integrally formed.
9. The anti-interference infrared detection chip packaging structure according to claim 1, wherein the partition baffle plate of the partition group positioned at the front is in contact with the sealing table of the partition group positioned at the rear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202411675960.8A CN119178461B (en) | 2024-11-22 | 2024-11-22 | Anti-interference infrared detection chip packaging structure |
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| CN202411675960.8A CN119178461B (en) | 2024-11-22 | 2024-11-22 | Anti-interference infrared detection chip packaging structure |
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| CN119178461B true CN119178461B (en) | 2025-03-07 |
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| CN103824817A (en) * | 2013-12-19 | 2014-05-28 | 无锡微奇科技有限公司 | Vacuum ceramic packaging structure of sensor |
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| DE4126310C2 (en) * | 1990-08-14 | 1994-08-25 | Klaus Stefanutti | Device for the rehabilitation of pipes laid in the ground |
| JPH0771685A (en) * | 1993-09-03 | 1995-03-17 | Ishikawajima Harima Heavy Ind Co Ltd | Gas shutoff device for pipe |
| CN2285393Y (en) * | 1997-05-08 | 1998-07-01 | 常州飞机制造厂 | High vacuum sealing device |
| JP2001242013A (en) * | 2000-02-25 | 2001-09-07 | Fujitsu Ltd | Infrared detector |
| JP2003106895A (en) * | 2001-10-01 | 2003-04-09 | Nec Corp | Thermal infrared detecting element and method of manufacturing the same |
| KR20130044993A (en) * | 2011-10-25 | 2013-05-03 | 오수창 | Automatic movement fire prevention damper of building ventilation duct |
| CN208111449U (en) * | 2018-05-24 | 2018-11-16 | 山西国惠光电科技有限公司 | A kind of oblate formula infrared detector vacuum encapsulation structure |
| CN111524821A (en) * | 2020-06-05 | 2020-08-11 | 河北美泰电子科技有限公司 | Eutectic welding platform and eutectic welding method for microwave chip |
| CN114203743A (en) * | 2021-12-10 | 2022-03-18 | 山东东仪光电仪器有限公司 | Design method of integrated semiconductor refrigeration heat dissipation packaging structure |
| CN219938533U (en) * | 2023-02-17 | 2023-10-31 | 歌尔股份有限公司 | Air extraction sealing device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824817A (en) * | 2013-12-19 | 2014-05-28 | 无锡微奇科技有限公司 | Vacuum ceramic packaging structure of sensor |
| CN108779996A (en) * | 2016-03-11 | 2018-11-09 | 日立金属株式会社 | Thermal type mass flow sensor, the manufacturing method of the thermal type mass flow sensor and the thermal mass flow meter using the thermal type mass flow sensor |
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| CN119178461A (en) | 2024-12-24 |
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