CN114203743A - Design method of integrated semiconductor refrigeration heat dissipation packaging structure - Google Patents
Design method of integrated semiconductor refrigeration heat dissipation packaging structure Download PDFInfo
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- H10F39/80—Constructional details of image sensors
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
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Abstract
The invention provides a design method of an integrated semiconductor refrigeration heat dissipation packaging structure, which belongs to the technical field of semiconductor packaging, and simultaneously considers the mutual influence of a refrigeration device, an image sensor and the packaging structure, and designs the refrigeration device, the image sensor and the packaging structure on the same platform by taking the refrigeration property, the air tightness, the reliability and the heat dissipation as design objectives; the refrigerating device adopts a semiconductor refrigerator, and the type selection of the semiconductor refrigerator is completed by combining the size of a chip and the refrigerating working condition; designing a signal output structure of the image sensor; the design of the integrated shell and the radiator is determined by the size of the semiconductor refrigerator, a signal output structure, the distance between the optical lens and the image sensor, a vacuum interface and the integrated radiator; designing the size and material of the optical window; designing a sealing process; and performing vacuum treatment to form a vacuum packaging structure. The packaging shell and the radiator are integrated through 3D printing, the thermal resistance is minimum, and the radiating effect is optimal.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a design method of an integrated semiconductor refrigeration and heat dissipation packaging structure.
Background
With the continuous improvement of the comprehensive performance requirement of the electron multiplying EMCCD and the miniaturization requirement of the physical size of the appearance in practical application, the existing design method does not consider the long-term reliability work, especially the mutual influence between the coupling with a radiator and the packaging, so the original design method has the defects of low reliability, large volume and the like.
Disclosure of Invention
The technical task of the invention is to solve the defects of the prior art and provide a design method of an integrated semiconductor refrigeration heat dissipation packaging structure.
The technical scheme of the invention is realized in the following way, and the design method of the integrated semiconductor refrigeration heat dissipation packaging structure simultaneously considers the mutual influence of a refrigeration device, an image sensor and the packaging structure, takes refrigeration performance, air tightness, reliability and heat dissipation as design objectives, and designs the refrigeration device, the image sensor and the packaging structure on the same platform;
the refrigeration device adopts a semiconductor refrigerator, the model selection condition of the semiconductor refrigerator takes into account the environmental temperature used by the device, the low temperature to be reached by the cooled object, the temperature difference between the environment temperature and the low temperature, the total amount of the calculated heat load and the cold loss, the number of stages of the refrigerator, the number of the refrigerator electric piles, the heating power consumption of the cooled object, the heat radiation and the cold loss generated by the bonding lead wire are accurately calculated, and the model selection of the semiconductor refrigerator is completed by combining the chip size and the characteristic curve of the refrigeration working condition;
designing a signal output structure of the image sensor; the distance between signal output ends of the image sensor, the distribution and the size of parts;
integrated housing and heat sink design; the size of the integrated shell is determined by the size of the semiconductor refrigerator, the signal output structure, the distance between the optical lens and the image sensor, the vacuum interface and the integrated radiator;
optical window size and material design: the size design of the optical window needs to be matched with the sizes of the image sensor and the refrigeration packaging structure; the material of the optical window needs to meet the requirements of sealing reliability and mechanical strength;
and (3) sealing process design: packaging parts of the whole structure, and selecting a sealing material and a sealing mode;
and (3) vacuum treatment: and after the whole structure is assembled and the image sensor is packaged, performing vacuum exhaust to form a vacuum packaging structure.
The method comprises the following steps:
firstly, accurately calculating according to the heating power consumption and the generated cold loss of the image sensor, and finishing the type selection of the semiconductor refrigerator by combining the chip size and the characteristic curve of the refrigeration working condition;
secondly, according to the physical size of the semiconductor refrigerator, the structure and the physical size design of the cavity are completed by combining the distance between the image sensor and the optical window, and meanwhile, the size design of the integrated radiator is completed by referring to the size of the bottom of the shell;
then, according to the distribution characteristics of the bonding pads of the image sensor chip and the airtight packaging design rule, the overall dimension of the ceramic ring frame and the design of the space between output pins are completed;
and finally, combining the outline dimensions of the ceramic ring frame according to the airtight packaging design rule to complete the dimension design of the optical window.
The image sensor employs an electron multiplying EMCCD.
In the design method:
<1> design of refrigeration packaging structure:
the method adopts AUTOCAD design method, simultaneously considers the mutual influence of a refrigerated semiconductor refrigerator device, an optical device EMCCD of an image sensor and a packaging structure, and designs the refrigerated semiconductor refrigerator device, the optical device EMCCD of the image sensor and the packaging structure on the same platform, thereby achieving the purposes of refrigeration, air tightness, reliability and heat dissipation design;
<2> the model selection principle of the semiconductor refrigerator is as follows:
(1) determining the working state of the refrigerator; the refrigerating, heating and constant temperature performance of the refrigerator is determined according to the direction and the size of the working current;
(2) determining the actual temperature of a hot end during refrigeration; because the refrigerator is a temperature difference device, the refrigerator must be arranged on the radiator to achieve the optimal refrigeration effect, and the actual temperature of the hot end of the refrigerator is determined according to the heat dissipation condition; the actual temperature of the hot end of the refrigerator is higher than the surface temperature of the radiator due to the influence of the temperature gradient; similarly, besides the heat dissipation gradient at the hot end, a temperature gradient also exists between the cooled space and the cold end of the refrigerator;
(3) determining the working environment and atmosphere of the refrigerator; determining whether the working environment is in a vacuum condition or in a normal-temperature normal-pressure atmospheric environment; determining the atmosphere environment as dry nitrogen or other protective gas, static or flowing air and ambient temperature, thereby taking heat preservation or insulation measures into consideration and determining the influence of heat leakage;
(4) determining the sizes of a refrigerator working object, a heat load and cold loss; in addition to the influence of the temperature at the heating end, the lowest temperature or the maximum temperature difference which can be reached by the refrigerator is determined under the conditions of no load and heat insulation, and actually, the refrigerator cannot achieve the real heat insulation and has heat load;
(5) determining the number of stages of the refrigerator; the selection of the refrigerator stage number must meet the requirement of the actual temperature difference, and the nominal temperature difference of the refrigerator must be higher than the temperature difference required actually to meet the design requirement; selecting the number of stages and considering the cost;
(6) specification of the refrigerator; after the stage number of the refrigerator is selected, the specification of the refrigerator, particularly the working current of the refrigerator, can be selected; because the type and the working condition of the image sensor are determined, a refrigerator with the minimum working current is usually selected;
(7) determining the number of the electric piles; the total refrigerating power of the refrigerator which can meet the requirement of temperature difference is determined, and the total refrigerating capacity of the refrigerator is ensured to be larger than the total power of the heat load of a working object at the working temperature.
Selecting a semiconductor refrigerator:
(1) the used environment temperature Th;
(2) calculating the temperature difference delta T of the cooled object at the low temperature Tc DEG C;
(3) calculating the total amount of heat load Q and cold loss;
(4) determining the number of refrigerator stages;
(5) after the model is determined, looking up the thermoelectric refrigeration characteristic curve of the model, determining the hot end temperature of the refrigerator by using environment and a heat dissipation mode to obtain similar low-temperature, looking up the refrigerating capacity of a cold end Qc in a corresponding characteristic curve graph, and finally dividing the required refrigerating capacity by the refrigerating capacity Qc generated by each galvanic pile to obtain the required number of the galvanic piles, wherein N is Q/Qc, and the parameter determines the overall performance of the refrigerator;
(6) accurately calculating the heating power consumption, the heat radiation and the cold loss generated by a bonding lead of the EMCCD, and finishing the type selection of the semiconductor refrigerator by combining the chip size and the characteristic curve of the refrigeration working condition;
<3> design of integrated refrigeration and heat dissipation packaging structure:
the packaging structures are respectively an optical window, a signal output structure, a semiconductor refrigerator, an integrated shell and a radiator from top to bottom;
firstly, accurately calculating according to the heating power consumption and the generated cold loss of the EMCCD, and finishing the type selection of the semiconductor refrigerator by combining the chip size and the characteristic curve of the refrigeration working condition;
secondly, according to the physical size of the semiconductor refrigerator, the structure and the physical size design of the cavity are completed by combining the distance between the EMCCD and the optical window, and meanwhile, the size design of the integrated radiator is completed by referring to the size of the bottom of the shell;
then, according to the distribution characteristics of pads of the EMCCD chip and the airtight packaging design rule, the overall dimension of the ceramic ring frame and the design of the space between output pins are completed;
finally, according to the airtight packaging design rule, combining the overall dimension of the ceramic ring frame to complete the dimension design of the optical window;
wherein:
(1) integrated shell and radiator
The size of the shell is determined by the size of the semiconductor refrigerator, the signal output structure, the distance between the optical lens and the EMCCD, the vacuum interface and the integrated radiator,
a. from the installation point of view:
the length and width of the inner cavity of the shell are larger than those of the semiconductor refrigerator; the two are matched;
the height of the shell is higher than that of the TCE so as to avoid the contact of the EMCCD with the optical window and the lead after packaging;
b. starting from comprehensive heat dissipation and rigidity performances:
designing and determining the thickness of a bottom plate of the shell; the shell is provided with a glass insulator and a fusion-sealed lead wire, so that the electrode of the semiconductor refrigerator is electrified;
the oxygen-free copper is designed and used as a vacuum pipeline and matched with a vacuum treatment system, the direct outer diameter of the vacuum pipeline is designed and determined, and the oxygen-free copper material has high ductility, is easy to cold cut and is convenient to realize vacuum sealing;
c. mounting holes are designed for the lens support combination in a matching way for matching connection;
in order to reduce the thermal resistance to the maximum extent and improve the heat dissipation effect, the radiator and the shell are designed into a whole;
d. from the point of view of thermal conductivity, rigidity and workability:
the shell is made of metal aluminum, the shell and the radiator are manufactured in a 3D printing mode, and a lead and a vacuum pipeline are assembled at the later stage;
(2) optical window size and material
From the perspective of matching with the refrigeration packaging structure:
the size of the optical window is integrally larger than that of the sealed inner cavity of the ceramic ring, and the width of a single-side sealed area is determined;
from the viewpoint of sealing reliability:
the optical window material is sapphire, so that the mechanical strength is improved;
(3) sealing process
Because the ceramic ring and the optical window sealing area are not designed with metallization, the sealing process is finished in a glue sealing mode;
the shell, the ceramic ring and the optical window are sealed by using double-component epoxy resin as a sealant, and after room temperature curing and temperature resistance of-60 ℃ to +100 ℃, the sealant is cured, the adhesive force with a bonded article is high, and the leakage rate index of air tightness detection can meet the project assessment requirement;
(4) vacuum treatment
After the shell is assembled, performing vacuum exhaust operation after EMCCD packaging and photoelectric parameter screening; and when the vacuum degree meets the requirement of the expected vacuum degree, shearing the vacuum pipeline by using a pipe wrench, and forming vacuum inside the shell.
Compared with the prior art, the invention has the following beneficial effects:
the design content of the existing image sensor refrigeration packaging structure comprises the following contents:
(1) and (3) packaging structure: and designing a refrigeration packaging structure by combining packaging bonding, surface mounting, sealing and vacuum treatment processes according to the requirements of electrical output and an optical lens.
(2) The heat dissipation structure comprises: the fins are matched according to the size of the bottom of the packaging shell, the heat dissipation area is enlarged to improve the heat dissipation effect, and the condition of large heat dissipation size or insufficient heat dissipation capacity exists.
(3) Selecting a semiconductor refrigerator: according to the application requirement, respective parameters of an energy conservation formula are substituted into the formula:
and matching, wherein Q is the power consumption or the heating value of the chip, Delta T is the refrigeration temperature difference, Qmax is the maximum refrigeration power consumption of the semiconductor refrigerator, and Delta Tmax is the maximum refrigeration temperature difference of the semiconductor refrigerator. Q and delta T are known parameters, delta Tmax is subjected to extreme value substitution according to the environmental requirements, Qmax is calculated, and then screening and model selection are carried out in a semiconductor refrigerator product library.
The semiconductor refrigerator model selection method has the defect of large deviation, and the maximum refrigeration power consumption of the semiconductor refrigerator is easily caused to exceed the practical application, so that the semiconductor refrigerator is unnecessarily overloaded to work.
According to the design method of the integrated semiconductor refrigeration heat dissipation packaging structure, the sealed shell integrating refrigeration and heat dissipation is adopted relative to the independent structures of the refrigeration sealed shell and the radiator, and the packaging structure with certain reliability and use value is provided.
Through EMCCD's the consumption of generating heat, heat radiation, the cold loss that bonding lead produced calculates and AUTOCAD design, synthesized semiconductor cooler performance, image sensor and encapsulation shell structure's interact, improved design accuracy and practicality.
Compared with the full-metallization vacuum packaging form, the refrigeration packaging structure has the advantages of low cost, high cost performance and certain reliability.
On the whole, this design compact structure, encapsulation duty cycle are big, sealed effectual, and encapsulation casing and radiator pass through 3D and print and form an organic whole, and the thermal resistance is minimum, and the radiating effect is best.
From the application point of view, the invention belongs to fixed vacuum, can not be disassembled after packaging, and needs to package the EMCCD chip with qualified photoelectric performance of primary screening into the interior.
The design method of the integrated semiconductor refrigeration heat dissipation packaging structure is reasonable in design, simple in structure, safe, reliable, convenient to use, easy to maintain and good in popularization and use value.
Drawings
FIG. 1 is a diagram of an integrated refrigeration heat dissipation package of the present invention;
FIG. 2 is a signal output architecture of the present invention;
FIG. 3 is a schematic structural diagram of an integrated housing and heat sink according to the present invention;
FIG. 4 is a schematic structural diagram of an integrated housing and heat sink according to the present invention;
FIG. 5 is a schematic structural view of a ceramic ring frame of the present invention;
FIG. 6 is a schematic structural view of a ceramic ring frame of the present invention;
FIG. 7 is a schematic structural view of a ceramic ring frame of the present invention;
fig. 8 is a schematic structural view of a ceramic ring frame of the present invention.
The reference numerals in the drawings denote:
1. an optical window 2, a signal output structure 3, a semiconductor refrigerator 4, an integrated shell 5, a radiator,
6. short circuit ring, 7, bonding pad, 8, pin, 9 and alumina ceramic.
Detailed Description
The following describes a design method of an integrated semiconductor cooling and heat dissipating package structure according to the present invention in detail with reference to the accompanying drawings.
As shown in the attached drawings, the design method of the integrated semiconductor refrigeration and heat dissipation packaging structure of the invention comprises the following steps:
1. the refrigeration packaging structure is designed as follows:
the AUTOCAD design method is adopted, the mutual influence of the refrigeration (semiconductor refrigerator device), the image sensor (optical device) and the packaging (structure) is considered at the same time, and the three are designed on the same platform, so that the purposes of refrigeration, air tightness, reliability and heat dissipation design are achieved.
2. Selecting a semiconductor refrigerator:
1) the ambient temperature Th used.
2) The temperature difference delta T is calculated according to the low temperature Tc ℃ which is to be reached by the cooled object.
3) The total amount of heat load Q and cold loss was calculated.
4) A chiller stage number is determined.
5) After the model is determined, the thermoelectric refrigeration characteristic curve of the model is consulted, the hot end temperature of the refrigerator is determined according to the use environment and the heat dissipation mode to obtain the similar low-temperature, the refrigerating capacity of the cold end Qc is consulted in the corresponding characteristic curve graph, finally the required refrigerating capacity is divided by the refrigerating capacity Qc generated by each electric pile to obtain the required electric pile number, N is Q/Qc, and the parameter determines the overall performance of the refrigerator.
6) And accurately calculating the heating power consumption, the heat radiation and the cold loss generated by the bonding lead of the EMCCD, and finishing the type selection of the semiconductor refrigerator by combining the chip size and the characteristic curve of the refrigeration working condition.
Compared with the independent structure of the refrigeration sealed shell and the radiator, the invention adopts the sealed shell integrating refrigeration and heat dissipation, and has a packaging structure with certain reliability and use value.
The materials of the packaging structure from top to bottom are respectively an optical window, a signal output structure, a semiconductor refrigerator, an integrated shell and a radiator.
Firstly, accurately calculating according to the heating power consumption and the generated cold loss of the EMCCD, and finishing the type selection of the semiconductor refrigerator by combining the chip size and the characteristic curve of the refrigeration working condition;
secondly, according to the physical size of the semiconductor refrigerator, the structure and the physical size design of the cavity are completed by combining the distance between the EMCCD and the optical window, and meanwhile, the size design of the integrated radiator is completed by referring to the size of the bottom of the shell;
then, according to the distribution characteristics of pads of the EMCCD chip and the airtight packaging design rule, the overall dimension of the ceramic ring frame and the design of the space between output pins are completed;
and finally, combining the outline dimensions of the ceramic ring frame according to the airtight packaging design rule to complete the dimension design of the optical window.
At present, the semiconductor chip is cooled passively by three methods, such as stirling cooler, joule-thomson cooler and semiconductor cooler (hereinafter referred to as semiconductor cooler). The former two are generally applied to the technical field of deep refrigeration, the refrigeration temperature can reach-196 ℃, and the former two are generally applied to the field of infrared imaging devices, such as indium antimonide materials and mercury cadmium telluride material image sensors. The semiconductor refrigerator is applied to the technical field of shallow refrigeration, and is suitable for the requirements of more than 80 ℃ below zero, such as silicon-based CCD and CMOS image sensors.
For EMCCD (electron multiplying CCD), it is necessary to work in a low temperature environment, such as-40 ℃ under vacuum. Therefore, in order to ensure the normal imaging or detection of the EMCCD, a closed structure needs to be designed and manufactured for the image sensor to work in a low-temperature environment. The refrigeration packaging structure comprises a cover plate, a conductor refrigerator, a signal output structure, an integrated shell and a radiator, an optical window size, the integrated shell and the radiator, a sealing process and vacuum treatment which are respectively explained below.
1. A semiconductor refrigerator:
(1) the operating state of the refrigerator is determined. The refrigerating, heating and constant temperature performance of the refrigerator can be determined according to the direction and the size of the working current.
(2) And determining the actual temperature of the hot end during cooling. Because the refrigerator is a temperature difference device, the refrigerator must be installed on a good radiator to achieve the best refrigerating effect, and the actual temperature of the hot end of the refrigerator during refrigeration is determined according to the heat dissipation condition. Due to the influence of the temperature gradient, the actual temperature of the hot end of the refrigerator is higher than the surface temperature of the radiator, usually, the temperature is a few tenths of degrees less, and the temperature is a few tenths of degrees more. Similarly, in addition to the thermal dissipation gradient at the hot end, a temperature gradient also exists between the cooled space and the cold end of the refrigerator.
(3) The refrigerator working environment and atmosphere are determined. This includes whether operating in a vacuum condition or in the normal atmosphere, dry nitrogen or other protective gases, static or flowing air and ambient temperature, thereby taking into account insulation measures and determining the effect of heat leakage.
(4) And determining the working objects of the refrigerators, the heat load and the cold loss. In addition to the effect of the hot end temperature, the minimum temperature or maximum temperature difference that can be reached by the refrigerator is determined under both no-load and adiabatic conditions, and in practice, the refrigerator cannot be truly adiabatic, as well as thermally loaded.
(5) The number of refrigerator stages is determined. The number of refrigerator stages must be selected to meet the actual temperature differential, and the nominal temperature differential of the refrigerator must be higher than the actual temperature differential, otherwise the requirement is not met. But not too many stages because the price of the refrigerator increases greatly as the number of stages increases.
(6) Specification of the refrigerator. The specification of the refrigerator, in particular the operating current of the refrigerator, can be selected by selecting the number of stages of the refrigerator. There are several refrigerators capable of meeting the requirement of temperature difference and refrigeration, but the refrigerator with the smallest working current is usually selected because of different working conditions.
(7) The number of the electric stacks is determined. This is determined by the total refrigeration power of the refrigerators that can meet the temperature difference requirement, which must ensure that the total refrigeration capacity of the refrigerators at the operating temperature is greater than the total power of the thermal load of the work object.
Firstly, the heat required to be taken away by refrigeration includes the self-heating power consumption of the EMCCD, heat radiation and cold loss generated by a bonding wire. In the invention patent, because the vacuum packaging is adopted, the cold loss caused by convection is not considered.
The thermal radiation generated by the EMCCD chip in a vacuum environment is in accordance with formula 1.
QRIs the heat loss from the radiation in w;
s represents the Stefan-Boltzmann constant, 5.67X 10-8W/m2K4；
A is the exposed surface area in m2；
εxtIs the emissivity of the exposed surface, see equation 2;
ε1，ε2emissivity of a high temperature, low temperature surface;
F12is the angular coefficient from surface 1 to surface 2;
This the absolute temperature of the hot end surface in K;
Tcis the absolute temperature of the cold end surface in K.
The invention relates to an EMCCD surface size of 34mm multiplied by 22 mm; the chip and the optical window are parallel, then F12The angular coefficient is 1; t ishThe absolute temperature of the hot end surface is usually 313K (40 ℃ C.), TcThe absolute temperature of the cold end surface is 233K (-40 ℃); epsilon1The window emissivity is 0.94, epsilon2If the radiation coefficient of the chip is 0.94, the radiation coefficient is substituted into epsilon in formula 2xtThe emissivity of the exposed surface is 0.633, and the heat radiation Q is substituted into formula 1RThe value was 0.18W.
The cold loss from the bonding wire is due to thermal conduction and should be in accordance with equation 3.
Wherein Q represents the heat of conduction across the material in w;
k represents the thermal conductivity of the material and has the unit of W/m ℃;
a represents the cross-sectional area of the material in m2；
x represents the thickness or length of the material in m;
Δ T represents the temperature difference between the cold and hot end faces of the material, in degrees Celsius.
The invention relates to a method for preparing a bonding wire, which is characterized in that a bonding wire material is an aluminum wire, and the heat conductivity of K is 240W/m ℃; diameter of 25 μm and area A of 1.13X10-9m2(ii) a The length of the lead is 0.002mm, and the number of the leads is 24; the temperature difference is 80 ℃, and the cold loss Q generated by the bonding wire is 0.26W.
The invention relates to a design value of the self heating power consumption of an EMCCD (electron-multiplying charge coupled device), and the total heat quantity which needs to be taken away by a semiconductor refrigerator is 0.94W.
Secondly, the number of the refrigerating devices is determined according to the refrigerating temperature or the refrigerating temperature difference,
the steps for selecting a refrigerator according to the above principles are as follows:
1) the ambient temperature used, Th c, was determined.
2) The temperature difference delta T is calculated according to the low temperature Tc ℃ which is to be reached by the cooled object.
3) The total amount of heat load Q and cold loss was calculated.
4) The number of chiller stages is determined and the maximum refrigeration temperature differential provided with reference to table 1 corresponds to the number of chiller stages.
TABLE 1 maximum refrigeration temperature difference corresponds to refrigerator stage number
| Number of stages | Maximum refrigeration temperature difference (DEG C)/nitrogen @1atm | Maximum refrigeration temperature difference (DEG C)/ |
| 1 | 64 | 67 |
| 2 | 84 | 91 |
| 3 | 95 | 109 |
| 4 | 101 | 115 |
| 5 | —— | 121 |
| 6 | —— | 127 |
(5) After the model is determined, the thermoelectric refrigeration characteristic curve of the model is consulted, the hot end temperature of the refrigerator is determined according to the use environment and the heat dissipation mode to obtain the similar low-temperature, the refrigerating capacity of the cold end Qc is consulted in the corresponding characteristic curve graph, and finally the required number of the galvanic piles can be obtained by dividing the required refrigerating capacity by the refrigerating capacity Qc generated by each galvanic pile, wherein N is Q/Qc.
(6) And the formula (4) can be used for preliminarily judging whether the selected refrigerator meets the application requirement.
2. Signal output structure
The signal output structure is shown in fig. 2.
Fig. 2 is a schematic diagram of an output structure, wherein the spacing, distribution and size of the output ends are recorded, and the structural reasonableness is shown.
The technical requirements of the signal output structure are as follows:
1. the one-way cross-hatched area represents the metallized area, and the metal part and the exposed metallized area are plated with nickel firstly and then plated with gold.
The cross section line area of the cross section of the porcelain piece is shown.
2. Electrical connection: bonding fingers PAD 1-PAD 52 are correspondingly connected with PINs PIN 1-PIN 52.
3. The thickness of the plating layer is 1.3-8.9 μm; the thickness of the gold layer is 1.3-5.7 μm.
4. The lead resistance is less than or equal to 1.5 omega; insulation resistance of not less than 1 × 109/Ω(100V DC)。
5. Sealing property: r1 is less than or equal to 1 x10-3/Pa·cm3/s(He)。
6. The ceramic dimensional tolerance is according to grade 6 of SJ/T10742-1996; the tolerance of the metal piece is in the f level of GB/T1804-2000, and the fillet and the metallization size are not used as the finished product inspection size.
3. Integrated shell and radiator
The size of the shell is determined by the size of the semiconductor refrigerator, the signal output structure, the distance between the optical lens and the EMCCD, the vacuum interface and the integrated radiator, for example, as follows:
from the installation angle, the length and width of the inner cavity of the shell are 2-6 mm larger than the size of the semiconductor refrigerator; the height of the shell is 2 mm-5 mm higher than that of the TCE, so that the EMCCD is prevented from being in contact with the optical window and the lead after packaging; the heat dissipation and rigidity performance are integrated, and the thickness of a bottom plate of the shell is 2 mm; the shell is provided with a glass insulator/a fusion sealing lead wire to realize the electrification of the electrode of the semiconductor refrigerator; the oxygen-free copper is used as a vacuum pipeline, is matched with the existing vacuum processing system, has a direct outer diameter of 4mm, and more importantly, has high ductility, is easy to cold cut and is convenient to realize vacuum sealing; 4 mounting holes are designed for combining the lens bracket; in order to reduce the thermal resistance to the maximum extent and improve the heat dissipation effect, the radiator and the shell are integrated. The integrated housing and heat sink are schematically shown in fig. 3 and 4.
The technical requirements are as follows:
1 air leakage rate less than or equal to 1 x10-3/Pa·cm3/s；
2 the insulation resistance between leads is more than or equal to 1 multiplied by 109/Ω；
3, surface coating: ni: 3.00-8.90 μm;
ni is not plated in the copper pipe;
4 tolerance according to GB/T1804-m.
From heat conduction, rigidity and workable angle, metal aluminium is chooseed for use to the casing material, and the casing passes through 3D printing mode with the radiator and realizes the preparation, later stage assembly lead wire and vacuum pipe.
4. Optical window size and material
From the angle of matching with the refrigeration packaging structure, the size of the light window is integrally larger than that of the sealing inner cavity of the ceramic ring by 5-8 mm, and the width of the single-side sealing area is 2-4 mm, for example as follows:
the size of the sealed inner cavity of the ceramic ring is 40mm multiplied by 28mm, the external dimension is 50mm multiplied by 39mm, and the size of the optical window is designed to be 47mm multiplied by 35mm multiplied by 1mm (length) multiplied by 35mm (width).
From the perspective of sealing reliability, the light window material is made of sapphire, and the mechanical strength of the light window material is higher than that of a quartz material.
5. Sealing process
Because the ceramic ring and the light window sealing area are not designed with metallization, the structure adopts a glue sealing mode to complete the sealing process.
The shell, the ceramic ring and the optical window are sealed by using two-component epoxy resin as sealant, and the two-component epoxy resin is cured at room temperature and resists the temperature of minus 60 ℃ to plus 100 ℃. After curing, the adhesive force with the bonding article is high, and the leakage rate index of air tightness detection can meet the project assessment requirements, and a successful example has been provided in the sealing of photoelectric imaging devices.
6. Vacuum treatment
After the shell is assembled, the vacuum exhaust operation can be carried out through the photoelectric parameter screening after the EMCCD is packaged. And when the vacuum degree meets the expected requirement, shearing the vacuum pipeline by using a pipe clamp, and forming vacuum inside the shell.
The vacuum pipeline is made of oxygen-free copper, and has excellent mechanical property, extensibility and sealing property. After the pipe tongs are used for shearing, the oxygen-free copper pipeline is folded to achieve the effect of interatomic bonding and form a closed state.
On the whole, this design compact structure, encapsulation duty cycle are big, sealed effectual, and encapsulation casing and radiator pass through 3D and print and form an organic whole, and the thermal resistance is minimum, and the radiating effect is best. From the perspective of application, this belongs to fixed vacuum, and the encapsulation back is undetachable, needs to screen the qualified EMCCD chip of photoelectric properties preliminary to inside.
The physical object designed and manufactured according to the refrigeration packaging structure is subjected to packaging operation, and is subjected to thermal, mechanical and 1000-hour gain aging test verification according to component level examination standards, so that the EMCCD and the refrigeration component can normally work, the internal vacuum is kept, and certain use and practical values are achieved.
In contrast, the cost of the structure only accounts for one tenth of the cost of the full-metallization vacuum package, and the structure has obvious price advantage and market competitiveness.
The volume of the structure is one tenth smaller than that of a Dewar in a live vacuum form (a shell with a vacuum inside), and the structure is suitable for more scenes.
Claims (5)
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| CN119178461A (en) * | 2024-11-22 | 2024-12-24 | 山西创芯光电科技有限公司 | Anti-interference infrared detection chip packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207820427U (en) * | 2017-12-28 | 2018-09-04 | 比亚迪股份有限公司 | A kind of radiator |
| CN110752198A (en) * | 2019-10-28 | 2020-02-04 | 中国电子科技集团公司第四十四研究所 | Back-illuminated avalanche gain type EMCCD refrigeration packaging structure and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207820427U (en) * | 2017-12-28 | 2018-09-04 | 比亚迪股份有限公司 | A kind of radiator |
| CN110752198A (en) * | 2019-10-28 | 2020-02-04 | 中国电子科技集团公司第四十四研究所 | Back-illuminated avalanche gain type EMCCD refrigeration packaging structure and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119178461A (en) * | 2024-11-22 | 2024-12-24 | 山西创芯光电科技有限公司 | Anti-interference infrared detection chip packaging structure |
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