CN106653899A - Packaging structure for photovoltaic battery for high temperature environment - Google Patents
Packaging structure for photovoltaic battery for high temperature environment Download PDFInfo
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- CN106653899A CN106653899A CN201610812498.0A CN201610812498A CN106653899A CN 106653899 A CN106653899 A CN 106653899A CN 201610812498 A CN201610812498 A CN 201610812498A CN 106653899 A CN106653899 A CN 106653899A
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- photovoltaic
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000009461 vacuum packaging Methods 0.000 claims abstract description 4
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 238000011084 recovery Methods 0.000 abstract description 2
- 239000002918 waste heat Substances 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
- H10F77/68—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling using gaseous or liquid coolants, e.g. air flow ventilation or water circulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
一种用于高温环境的光伏电池的封装结构,本发明涉及废热回收热光伏系统技术领域;它包含金属基板、环氧树脂胶黏层、铝基底、铜制水冷结构和真空封装;金属基板通过环氧树脂胶黏层与铝基底连接,铝基底的一侧设有铜制水冷结构,铜制水冷结构上设有进水口;所述的真空封装包设在太阳能电池片组件的外部;所述的金属基板包含电气层、电绝缘层和金属基层;所述的太阳能电池片组件中的太阳能电池片贴设在电气层上,电气层的另一侧设有电绝缘层,电绝缘层的另一侧设有金属基层。能够保证在1500摄氏度以上高温环境下光伏电池的工作温度处于室温,保证光伏电池的正常工作和转换效率。
A packaging structure for photovoltaic cells used in high-temperature environments. The invention relates to the technical field of waste heat recovery thermal photovoltaic systems; it includes a metal substrate, an epoxy resin adhesive layer, an aluminum substrate, a copper water-cooling structure, and vacuum packaging; the metal substrate passes through The epoxy resin adhesive layer is connected to the aluminum base, and one side of the aluminum base is provided with a copper water-cooling structure, and a water inlet is provided on the copper water-cooling structure; the vacuum packaging is arranged on the outside of the solar cell assembly; the said The metal substrate comprises an electrical layer, an electrical insulating layer and a metal base layer; the solar battery sheet in the solar cell assembly is attached to the electrical layer, the other side of the electrical layer is provided with an electrical insulating layer, and the other side of the electrical insulating layer is One side has a metal base. It can ensure that the operating temperature of the photovoltaic cell is at room temperature in a high temperature environment above 1500 degrees Celsius, ensuring the normal operation and conversion efficiency of the photovoltaic cell.
Description
技术领域technical field
本发明涉及废热回收热光伏系统技术领域,具体涉及一种用于高温环境的光伏电池的封装结构。The invention relates to the technical field of waste heat recovery thermal photovoltaic systems, in particular to a packaging structure of photovoltaic cells used in high temperature environments.
背景技术Background technique
在热光伏系统中,为了提高转换效率,要求热光伏的热端-热辐射体升温到1000-1500摄氏度以上的温度,或者热源本身就处在这样的高温环境,如炼钢或轧钢的生产线上的高温钢坯热源。而热辐射体的再辐射光谱需要使用光伏电池进行转换,我们把光伏电池所在一端称为冷端。为了提高热辐射光谱的转换效率和缩小系统体积,处于冷端的光伏电池需离热端较近,距离越近光谱转换效率越高。但所带来的问题是,热端如此高的温度会通过空气对流、热传导和热辐射的方式向冷端热传递,从而使冷端器件产生弯曲变形等,而光伏电池则不能正常工作。因此,要在热端产生一定的高温,与光伏器件的窄带光谱相匹配,且光伏器件在正常的工作温度范围内,才能达到较好的转换效率。这就需要避免从热端到冷端的对流传导,而将不可避免的对流传导热及热辐射光子能量小于光伏电池材料带隙而无法热电转换所产生的热量带走,需要设计良好热导率的封装冷却系统。In a thermo-photovoltaic system, in order to improve conversion efficiency, it is required that the hot end of thermo-photovoltaic heat radiation body be heated to a temperature above 1000-1500 degrees Celsius, or the heat source itself is in such a high-temperature environment, such as a steelmaking or steel rolling production line High temperature billet heat source. The reradiation spectrum of the thermal radiator needs to be converted by photovoltaic cells. We call the end where the photovoltaic cells are located as the cold end. In order to improve the conversion efficiency of the thermal radiation spectrum and reduce the volume of the system, the photovoltaic cell at the cold end needs to be closer to the hot end, and the closer the distance, the higher the spectral conversion efficiency. But the problem is that such a high temperature at the hot end will transfer heat to the cold end through air convection, heat conduction, and heat radiation, which will cause bending and deformation of the cold end device, and the photovoltaic cells will not work properly. Therefore, a certain high temperature must be generated at the hot end to match the narrow-band spectrum of the photovoltaic device, and the photovoltaic device must be within the normal operating temperature range to achieve better conversion efficiency. This requires avoiding convective conduction from the hot end to the cold end, and taking away the unavoidable convective conduction heat and thermal radiation photon energy that is smaller than the band gap of the photovoltaic cell material and cannot generate heat from thermoelectric conversion. It is necessary to design a good thermal conductivity Encapsulated cooling system.
发明内容Contents of the invention
本发明的目的在于针对现有技术的缺陷和不足,提供一种结构简单,设计合理、使用方便的用于高温环境的光伏电池的封装结构,能够保证在1500摄氏度以上高温环境下光伏电池的工作温度处于室温,保证光伏电池的正常工作和转换效率。The object of the present invention is to aim at the defects and deficiencies of the prior art, and provide a simple structure, reasonable design, and convenient packaging structure for photovoltaic cells in high-temperature environments, which can ensure the operation of photovoltaic cells in high-temperature environments above 1500 degrees Celsius. The temperature is at room temperature to ensure the normal operation and conversion efficiency of photovoltaic cells.
为实现上述目的,本发明采用的技术方案是:它包含金属基板、环氧树脂胶黏层、铝基底、铜制水冷结构和真空封装;金属基板通过环氧树脂胶黏层与铝基底连接,铝基底的一侧设有铜制水冷结构,铜制水冷结构上设有进水口和出水口;所述的真空封装包设在太阳能电池片组件的外部;所述的金属基板包含电气层、电绝缘层和金属基层;所述的太阳能电池片组件中的太阳能电池片贴设在电气层上,电气层的另一侧设有电绝缘层,电绝缘层的另一侧设有金属基层。In order to achieve the above object, the technical solution adopted in the present invention is: it comprises a metal substrate, an epoxy resin adhesive layer, an aluminum substrate, a copper water cooling structure and a vacuum package; the metal substrate is connected to the aluminum substrate through an epoxy resin adhesive layer, One side of the aluminum substrate is provided with a copper water-cooling structure, and the copper water-cooling structure is provided with a water inlet and a water outlet; the vacuum package is arranged outside the solar cell assembly; the metal substrate includes an electrical layer, an electrical An insulating layer and a metal base; the solar cells in the solar cell assembly are pasted on the electrical layer, an electrical insulating layer is provided on the other side of the electrical layer, and a metal base is provided on the other side of the electrical insulating layer.
所述的太阳能电池片的透光面一侧设有石英玻璃窗。A quartz glass window is provided on one side of the light-transmitting surface of the solar battery sheet.
所述的石英玻璃窗可以替换为蓝宝石玻璃窗。The quartz glass window can be replaced by a sapphire glass window.
所述的电气层为铜箔片。The electrical layer is copper foil.
所述的金属基层为1mm厚度的铜板。The metal base layer is a copper plate with a thickness of 1mm.
所述的铝基底的厚度为10mm。The thickness of the aluminum substrate is 10mm.
所述的环氧树脂胶黏层的热导率为κ=1.25Wm-1K-1。The thermal conductivity of the epoxy resin adhesive layer is κ=1.25Wm -1 K -1 .
所述的覆盖的绝缘材料的热导率κ=3.0Wm-1K-1。The thermal conductivity of the covering insulating material κ=3.0 Wm −1 K −1 .
所有的电气层位于太阳能电池片的背面。All electrical layers are located on the backside of the solar cell.
采用上述结构后,本发明有益效果为:本发明所述的一种用于高温环境的光伏电池的封装结构,能够保证在1500摄氏度以上高温环境下光伏电池的工作温度处于室温,保证光伏电池的正常工作和转换效率,本发明具有结构简单,设置合理,制作成本低等优点。After adopting the above structure, the beneficial effects of the present invention are: the packaging structure of a photovoltaic cell used in a high-temperature environment according to the present invention can ensure that the operating temperature of the photovoltaic cell is at room temperature in a high-temperature environment above 1500 degrees Celsius, and ensure the stability of the photovoltaic cell. Normal operation and conversion efficiency, the present invention has the advantages of simple structure, reasonable setting, and low production cost.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings without any creative effort.
图1是本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.
图2是本发明的结构剖视图。Fig. 2 is a structural sectional view of the present invention.
图3是本发明中金属基板与太阳能电池板的连接关系示意图。Fig. 3 is a schematic diagram of the connection relationship between the metal substrate and the solar cell panel in the present invention.
图4是实施例的测试曲线图。Fig. 4 is a test graph of the embodiment.
附图标记说明:Explanation of reference signs:
金属基板1、电气层1-1、电绝缘层1-2和金属基层1-3、环氧树脂胶黏层2、铝基底3、铜制水冷结构4、进水口4-1、真空封装5、太阳能电池片组件6、太阳能电池片6-1、石英玻璃窗7。Metal substrate 1, electrical layer 1-1, electrical insulation layer 1-2 and metal base layer 1-3, epoxy resin adhesive layer 2, aluminum base 3, copper water cooling structure 4, water inlet 4-1, vacuum packaging 5 , solar cell assembly 6, solar cell 6-1, quartz glass window 7.
具体实施方式detailed description
下面结合附图对本发明作进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings.
参看如图1-图3所示,本具体实施方式采用的技术方案是:它包含金属基板1、环氧树脂胶黏层2、铝基底3、铜制水冷结构4和真空封装5;金属基板1通过环氧树脂胶黏层2与铝基底3连接,铝基底3的一侧设有铜制水冷结构4,铜制水冷结构4上设有进水口4-1;所述的真空封装5包设在太阳能电池片组件6的外部;所述的金属基板1包含电气层1-1、电绝缘层1-2和金属基层1-3;所述的太阳能电池片组件6中的太阳能电池片6-1贴设在电气层1-1上,电气层1-1的另一侧设有电绝缘层1-2,电绝缘层1-2的另一侧设有金属基层1-3。Referring to Figures 1-3, the technical solution adopted in this specific embodiment is: it includes a metal substrate 1, an epoxy resin adhesive layer 2, an aluminum substrate 3, a copper water cooling structure 4 and a vacuum package 5; the metal substrate 1 is connected to the aluminum base 3 through an epoxy resin adhesive layer 2, and one side of the aluminum base 3 is provided with a copper water cooling structure 4, and the copper water cooling structure 4 is provided with a water inlet 4-1; the vacuum package 5 packs Located outside the solar cell assembly 6; the metal substrate 1 includes an electrical layer 1-1, an electrical insulating layer 1-2 and a metal base layer 1-3; the solar cell sheet 6 in the solar cell assembly 6 -1 is pasted on the electrical layer 1-1, the other side of the electrical layer 1-1 is provided with an electrical insulating layer 1-2, and the other side of the electrical insulating layer 1-2 is provided with a metal base layer 1-3.
所述的金属基板1采用高热导率的铜材料为金属基层1-3。The metal substrate 1 adopts copper material with high thermal conductivity as the metal base layer 1-3.
所述的太阳能电池片6-1的透光面一侧设有石英玻璃窗7。A quartz glass window 7 is provided on one side of the light-transmitting surface of the solar battery sheet 6-1.
所述的电气层1-1为铜箔片。The electrical layer 1-1 is copper foil.
所述的金属基层1-3为1mm厚度的铜板。The metal base layer 1-3 is a copper plate with a thickness of 1mm.
所述的铝基底3的厚度为10mm。The thickness of the aluminum substrate 3 is 10mm.
所述的环氧树脂胶黏层2的热导率为κ=1.25Wm-1K-1。The thermal conductivity of the epoxy resin adhesive layer 2 is κ=1.25Wm -1 K -1 .
所述的太阳能电池片组件6中除太阳能电池片6-1以外均采用绝缘材料覆盖,避免短路,且覆盖的绝缘材料的热导率κ=3.0Wm-1K-1,且厚度为38μm。The solar cell assembly 6 is covered with insulating material except the solar cell 6-1 to avoid short circuit, and the thermal conductivity of the covered insulating material is κ=3.0Wm -1 K -1 , and the thickness is 38μm.
所述的电气层1-1上除电气连接以外的绝缘部分均采用热导率κ=0.60Wm-1K-1,125μm厚电绝缘压敏胶带(如8805胶带)包裹,而其余要求电接触部分采用混合银的润滑脂(如AREMCO Heat-Away 641-EV)。The insulating parts on the electrical layer 1-1 except for the electrical connection are all wrapped with thermal conductivity κ=0.60Wm -1 K -1 , 125μm thick electrical insulating pressure-sensitive tape (such as 8805 tape), while the rest require electrical contact Some greases mixed with silver (such as AREMCO Heat-Away 641-EV) are used.
所述的铝基底3与其热沉之间采用热导率κ=5.58Wm-1K-1导热胶薄层粘接。The aluminum base 3 and its heat sink are bonded with a thin layer of thermally conductive adhesive with a thermal conductivity of κ=5.58Wm −1 K −1 .
所述的电气层1-1位于太阳能电池片的背面,避免挡光引起的损耗。The electrical layer 1-1 is located on the back of the solar battery sheet to avoid loss caused by light blocking.
所述的真空封装5的边框和太阳能电池片组件6之间的缝隙处利用硅酮树脂填充,且各边框之间用角件连接。The gap between the frame of the vacuum package 5 and the solar cell assembly 6 is filled with silicone resin, and the frames are connected with corner fittings.
本具体实施方式的工作原理:将太阳能电池片安装在金属基板1上,金属基板1是金属基板材料,能制成各种形状和厚度,电气部分结构和尺寸可以根据要求设计;金属基板1以板材的形式供应,材料选择基于导热、绝缘和机械应用需求;金属基板1是一种具有良好散热功能的覆铜板,它由独特的三层结构所组成,分别是电气层1-1、电绝缘层1-2和金属基层1-3;金属基板1能够将热阻降至最低,使基板具有极好的热传导性能;机械性能又极为优良;金属基板1有助于有效的热量管理;太阳能电池片表面贴装在电气层1-1,运行时所产生的热量通过电绝缘层1-2传导到金属基层1-3,然后由金属基层1-3扩散到模块外部,实现对电池片的散热;金属基板1外部采用铝基底热沉,利用高热导率的环氧树脂与金属基板1相粘结,实现良好热导率;在铝基底热沉外面,进一步加装铜制水冷结构4,通过循环水冷却系统将热量有效带走,使太阳能电池片在高温环境保持在室温工作。The working principle of this specific embodiment: the solar cell is installed on the metal substrate 1, the metal substrate 1 is a metal substrate material, and can be made into various shapes and thicknesses, and the structure and size of the electrical part can be designed according to requirements; The form of plate supply, material selection is based on heat conduction, insulation and mechanical application requirements; metal substrate 1 is a copper clad laminate with good heat dissipation function, which is composed of a unique three-layer structure, which are electrical layer 1-1, electrical insulation Layer 1-2 and metal base layer 1-3; metal substrate 1 can minimize thermal resistance, making the substrate have excellent thermal conductivity; mechanical properties are extremely good; metal substrate 1 contributes to effective heat management; solar cells The surface of the chip is mounted on the electrical layer 1-1, and the heat generated during operation is conducted to the metal base layer 1-3 through the electrical insulation layer 1-2, and then diffused from the metal base layer 1-3 to the outside of the module to realize heat dissipation of the battery sheet ; The exterior of the metal substrate 1 adopts an aluminum base heat sink, and the epoxy resin with high thermal conductivity is bonded to the metal substrate 1 to achieve good thermal conductivity; outside the aluminum base heat sink, a copper water-cooling structure 4 is further installed, through The circulating water cooling system effectively takes away the heat, so that the solar cells can work at room temperature in a high temperature environment.
采用上述结构后,本具体实施方式有益效果为:本具体实施方式所述的一种用于高温环境的光伏电池的封装结构,能够保证在1500摄氏度以上高温环境下光伏电池的工作温度处于室温,保证光伏电池的正常工作和转换效率,本发明具有结构简单,设置合理,制作成本低等优点。After adopting the above structure, the beneficial effects of this specific embodiment are: the packaging structure of a photovoltaic cell used in a high-temperature environment described in this specific embodiment can ensure that the operating temperature of the photovoltaic cell is at room temperature in a high-temperature environment above 1500 degrees Celsius, To ensure the normal operation and conversion efficiency of the photovoltaic cell, the invention has the advantages of simple structure, reasonable setting, and low manufacturing cost.
实施例:Example:
本实施例的封装结构采用ASTM D5470标准进行导热性能测试,包括热导率k和热阻Rθ的测试。The packaging structure of this embodiment is tested for thermal conductivity using the ASTM D5470 standard, including testing of thermal conductivity k and thermal resistance R θ .
ASTM D5470标准是薄型热导性固体电工绝缘材料传热性的试验方法,是目前国内外最常用的标准测试方法,特别适合实际使用工况下的热导率测量以及各种热接触材料和接触热阻的测量。测试曲线详见图4,测试计算公式如下:The ASTM D5470 standard is a test method for the heat transfer of thin thermally conductive solid electrical insulating materials. It is the most commonly used standard test method at home and abroad. Measurement of thermal resistance. The test curve is shown in Figure 4, and the test calculation formula is as follows:
测试完成后,根据测试运算结果,产品导热性能符合要求。After the test is completed, according to the test calculation results, the thermal conductivity of the product meets the requirements.
以上所述,仅用以说明本发明的技术方案而非限制,本领域普通技术人员对本发明的技术方案所做的其它修改或者等同替换,只要不脱离本发明技术方案的精神和范围,均应涵盖在本发明的权利要求范围当中。The above is only used to illustrate the technical solution of the present invention and not to limit it. Other modifications or equivalent replacements made by those skilled in the art to the technical solution of the present invention should be considered as long as they do not depart from the spirit and scope of the technical solution of the present invention. fall within the scope of the claims of the present invention.
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