CN119165599A

CN119165599A - An optical module

Info

Publication number: CN119165599A
Application number: CN202310739097.7A
Authority: CN
Inventors: 孙飞龙; 杨行勇; 朱彦军
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2023-06-20
Filing date: 2023-06-20
Publication date: 2024-12-20

Abstract

The optical module comprises a circuit connecting plate and an optical receiving part, wherein the optical receiving part respectively comprises a tube shell, a notch is formed at the end part of the circuit connecting plate, and the surface of the notch comprises a first side wall, a second side wall and a connecting surface arranged between the first side wall and the second side wall. One end of the tube shell is provided with an avoidance hole, the bottom surface is provided with a first step, a second step, a third step and a fourth step, the heights of which are sequentially increased, and different optical elements are arranged through the steps with different heights. The avoidance hole is used for enabling the circuit connecting plate to extend into the tube shell until the notch comprises the periphery of the second step, the first step is used for supporting the circuit connecting plate, and the second step is used for supporting the light receiving chip and the TIA. The surface of breach comprises first lateral wall, second lateral wall and locates the junction surface between first lateral wall and the second lateral wall, and the position and the region that the pad set up can be increased to the breach of this kind of form, do benefit to the routing of overall arrangement light receiving chip and TIA, and shorten the length of routing.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the progress of optical communication technology is becoming more important. In the development of optical communication technology, the optical module is required to be continuously improved in data transmission rate as one of key devices in optical communication equipment, so that photoelectric signal conversion can be realized.

In some optical modules, the optical element is supported by a support such as a ceramic substrate, which is less reliable in mounting, thereby reducing the coupling accuracy of the optical module.

Disclosure of Invention

The embodiment of the application provides an optical module, which is used for ensuring the coupling precision of the optical module.

The optical module provided by the application comprises:

the circuit connecting plate is provided with a notch at the end part, and the surface of the notch comprises a first side wall, a second side wall and a connecting surface arranged between the first side wall and the second side wall;

A light receiving member electrically connected to the circuit connection board, comprising:

One end of the tube shell is provided with an avoidance hole, and the bottom surface of the tube shell is respectively provided with a first step, a second step, a third step and a fourth step with the heights sequentially increased to set different optical elements, wherein the avoidance hole is used for enabling the circuit connecting plate to extend into the tube shell until the notch wraps the periphery of the second step;

The light receiving chip is arranged on the surface of the second step in an array mode and is electrically connected with the surface of the first side wall or the surface of the second side wall;

TIA locates the second step surface, locates between junction surface and the light receiving chip, TIA and light receiving chip electricity are connected, TIA and junction surface's surface electricity are connected.

The application provides an optical module, which comprises a circuit connecting plate and an optical receiving part, wherein the optical receiving part respectively comprises a tube shell, a notch is formed at the end part of the circuit connecting plate, and the surface of the notch comprises a first side wall, a second side wall and a connecting surface arranged between the first side wall and the second side wall. One end of the tube shell is provided with an avoidance hole, the bottom surface is provided with a first step, a second step, a third step and a fourth step, the heights of which are sequentially increased, and different optical elements are arranged through the steps with different heights. The avoidance hole is used for enabling the circuit connecting plate to extend into the tube shell until the notch comprises the periphery of a second step, the first step is used for supporting the circuit connecting plate, and the second step is used for supporting the light receiving chip and the TIA. The surface of the notch is composed of a first side wall, a second side wall and a connecting surface arranged between the first side wall and the second side wall, the notch in the form can increase the direction and the area of the arrangement of the bonding pads, particularly, when the light receiving chips are arranged in an array mode, TIAs are arranged between the light receiving chips and the connecting surface, each light receiving chip in the light receiving chip array can be selected to be connected with bonding pads on the surface of the first side wall or the surface of the second side wall in a wire bonding mode nearby, the electric connection between the light receiving chips and a circuit connecting plate is achieved, the bonding pads are arranged on the surfaces of the first side wall and the second side wall, wire bonding distribution of the light receiving chips is facilitated, the wire bonding length between the light receiving chips and the circuit connecting plate is shortened, and the wire bonding length between the TIAs and the circuit connecting plate is shortened, so that the transmission of high-frequency signals is facilitated. Meanwhile, in the application, the photoelectric elements are arranged on different steps in the tube shell, and the steps with different heights enable the optical axes of the optical elements to be positioned on the same axis, so that ceramic support plates adopted in some embodiments are omitted, the production cost is reduced, the step surfaces with different heights are integrally formed in the tube shell, and the ceramic support plates are prevented from being fixed in a patch mode, thereby improving the reliability of products and the optical coupling precision. Meanwhile, the height of each step is reasonably set, so that the height of the optical axis of the optical element is ensured, and the normal operation of the optical element is further ensured.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a partial architectural diagram of an optical communication system according to some embodiments;

FIG. 2 is a partial block diagram of a host computer according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

Fig. 5 is a block diagram of a first light receiving member according to some embodiments;

Fig. 6 is a block diagram of a cartridge in accordance with some embodiments;

fig. 7 is a second block diagram of a cartridge according to some embodiments;

Fig. 8 is a schematic cross-sectional view of a cartridge according to some embodiments;

Fig. 9 is a cross-sectional structural view of a first light receiving member according to some embodiments;

fig. 10 is a second cross-sectional structural view of the first light receiving member according to some embodiments;

Fig. 11 is a cross-sectional structural view III of a first light receiving member according to some embodiments;

fig. 12 is a cross-sectional structural view of a first light receiving member according to some embodiments;

Fig. 13 is a cross-sectional structural view fifth of a first light receiving part according to some embodiments;

fig. 14 is a cross-sectional structural view sixth of a first light receiving part according to some embodiments;

fig. 15 is a block diagram of a second light receiving member according to some embodiments;

Fig. 16 is a cross-sectional view of a second light receiving member according to some embodiments;

fig. 17 is an exploded cross-sectional view of a second light receiving member according to some embodiments;

fig. 18 is a schematic cross-sectional view of another cartridge according to some embodiments;

fig. 19 is a schematic cross-sectional view of a second cartridge according to some embodiments;

Fig. 20 is a cross-sectional view of a third light receiving element according to some embodiments;

Fig. 21 is a cross-sectional exploded view of a third light receiving member according to some embodiments;

fig. 22 is a second cross-sectional view of a third light receiving member according to some embodiments;

fig. 23 is a third cross-sectional view of a third light receiving member according to some embodiments.

Detailed Description

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal, a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal, a second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected, or fixedly connected, with the optical module 200. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the upper computer 100 through the network cable 103, the upper computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the upper computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the optical fiber 101, where the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an Optical line terminal (Optical LINE TERMINAL, OLT), an Optical network device (Optical Network Terminal, ONT), a data center server, or the like, in addition to the Optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to be connected to an electrical port of the optical module 200, and the heat sink 107 has a convex structure such as a fin that increases a heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. Furthermore, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the light receiving part 500.

The housing comprises an upper housing 201 and a lower housing 202, the upper housing 201 being folded over the lower housing 202 to form the above-described housing with two openings 204 and 205, the outer contour of the housing generally assuming a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on two sides of the bottom plate 2021 and perpendicular to the bottom plate 2021, and the upper housing 201 includes a cover 2011, where the cover 2011 covers the two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed at two sides of the bottom plate 2021 and perpendicular to the bottom plate 2021, the upper housing 201 includes a cover 2011, and two upper side plates disposed at two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper housing 201 covers the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the opening 204 and is inserted into the electrical connector of the host computer 100, and the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 connects the light emitting part 400 and the light receiving part 500 in the optical module 200.

The circuit board 300, the light emitting part 400, the light receiving part 500, etc. are conveniently mounted in the upper case 201 and the lower case 202 by adopting the combined assembly mode, and the upper case 201 and the lower case 202 can perform encapsulation protection on the devices. In addition, when the circuit board 300, the light emitting part 400, the light receiving part 500, and the like are assembled, the disposition of the positioning part, the heat dissipating part, and the electromagnetic shielding part of these devices is facilitated, and the automated production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging member of the unlocking member 600, and when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the optical module, so that the connection relationship between the engaging member and the host computer is changed, the fixation of the optical module 200 and the host computer is released, and the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a limiting amplifier (LIMITING AMPLIFIER), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips, and the hard circuit board can also be inserted into an electric connector in the cage 106 of the upper computer 100.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to provide more pins, thereby being suitable for occasions with high pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to realize power supply, grounding, two-wire synchronous serial (Inter-INTEGRATED CIRCUIT, I2C) signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

At least one of the light emitting part 400 or the light receiving part 500 is located at a side of the circuit board 300 remote from the gold finger.

In some embodiments, the light emitting part 400 and the light receiving part 500 are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

In some embodiments, at least one of the light emitting component or the light receiving component may be disposed directly on the circuit board 300. For example, at least one of the light emitting part or the light receiving part may be provided on the surface of the circuit board 300 or the side of the circuit board 300.

Fig. 5 is a block diagram of a first light receiving member according to some embodiments. As shown in fig. 5, in some embodiments, the light receiving component 500 includes a package 510a, a light demultiplexing component 520, a lens, a mirror, a light receiving chip, and a TIA560. The optical demultiplexing module 520, lens, mirror, TIA560 are disposed within the package 510a, respectively. The lens is positioned in the light emitting direction of the optical demultiplexing component 520 to receive each beam of optical signals generated by the optical demultiplexing component 520, the reflector is positioned in the light emitting direction of the lens to receive each beam of optical signals transmitted from the lens, and the light receiving chip is positioned in the light emitting direction of the reflector to receive the optical signals reflected by the reflector.

The optical demultiplexing component 520 is configured to receive an optical signal transmitted from the outside of the optical module to the package 510a and decompose the optical signal into a plurality of optical signals with different wavelengths, and the lens is illustratively a converging lens configured to convert each optical signal from divergent light to convergent light, the reflector is configured to reflect the optical signal transmitted by the lens, change the transmission direction of the optical signal, turn the optical signal downward, and reflect the optical signal to the optical receiving chip, the optical receiving chip converts the optical signal into a current signal, and the TIA560 is configured to convert the current signal into a voltage signal and amplify the voltage signal. Illustratively, the light receiving chips are arranged in an array to receive the respective light signals generated by the decomposition of the light demultiplexing assembly 520 by the respective light receiving chips.

The light receiving member 500 has one end connected to the optical fiber adapter and one end electrically connected to the circuit connection board 300 a. One end of the circuit connection board 300a extends into the interior of the package 510 a. In some embodiments, the circuit board 300a may be the circuit board 300 of the optical module, where one end of the circuit board 300a extends into the package 510a, and the other end is electrically connected to the host through an electrical port. In some embodiments, the circuit connection board 300a may be a sub-circuit board, illustratively a printed circuit board or a ceramic connection board, having one end protruding into the interior of the package 510a and the other end electrically connected to the circuit board 300 of the optical module through a flexible circuit board. In some embodiments, the circuit connection board 300a may be a flexible circuit board having one end protruding into the interior of the package 510a and the other end electrically connected to the circuit board 300 of the optical module.

Fig. 6 is a block diagram of a cartridge according to some embodiments. As shown in fig. 6, in some embodiments, one end of the cartridge 510a is provided with a relief hole 515, and the relief hole 515 is used to allow the circuit board 300a to extend into the interior of the cartridge 510a, and then the circuit board 300a is electrically connected to the TIA 560. The light receiving chip 550 converts the received light signal into a photocurrent signal, the TIA560 converts the photocurrent signal into a voltage signal, and simultaneously amplifies the voltage signal, and then transmits the voltage signal through the circuit connection board 300 a. The light receiving chip 550 and the TIA560 are disposed on the surface of the second step 512, and the light receiving chip 550 is electrically connected to the TIA 560.

Fig. 7 is a block diagram of a cartridge, according to some embodiments. As shown in fig. 7, in some embodiments, the other end of the tube housing 510a is provided with a boss 516, the boss 516 having an optical window therein, through which boss 516 an optical connection with the fiber optic adapter is made.

Fig. 8 is a schematic cross-sectional view of a cartridge according to some embodiments. As shown in fig. 8, in some embodiments, the bottom surface of the tube housing 510a is formed with stepped surfaces having different heights, including a first step 511, a second step 512, a third step 513, and a fourth step 514, respectively. Illustratively, the heights of the first step 511, the second step 512, the third step 513, and the fourth step 514 sequentially increase. In some embodiments, a gap exists between the fourth step 514 and the end surface of the tube shell 510a provided with the optical window, so as to avoid the optical window, and of course, no gap may be provided, so long as the optical window is ensured to be avoided.

In some embodiments, the bottom surface of the tube shell 510a is respectively formed with step surfaces with different heights, and the step surfaces are integrally formed with the body structure of the tube shell 510a, so that the reliability of each step can be increased, compared with the case that in some embodiments, by pasting a ceramic substrate, then, as the ceramic substrate plays the role of these step surfaces, the present application forms steps inside the package 510a, avoiding the chip, thereby increasing the reliability of the steps, increasing the optical reliability of the optical elements, and thus improving the optical coupling accuracy.

Fig. 9 is a cross-sectional structural view of a first light receiving member according to some embodiments, and fig. 10 is a cross-sectional structural view of a second light receiving member according to some embodiments. As shown in fig. 9 and 10, the end of the circuit connection board 300a near the tube shell 510a is provided with a notch 301a, and the notch 301a is a U-shaped notch, for example.

The circuit connection board 300a extends into the tube shell 510a from the escape hole 515 until the notch 301a wraps the outer periphery of the second step 512, and the first step 511 supports the circuit connection board 300a, so that the circuit connection board 300a is fixed. Illustratively, the notch 301a wraps around the outer periphery of the second step 512, meaning that the notch 301a surrounds the outer periphery of the remaining three surfaces of the second step 512 except for its interface with the third step 513.

The surface of the second step 512 is provided with a light receiving chip 550 and a TIA560, respectively. Illustratively, a certain interval is provided between the light receiving chip 550 and the TIA560, so as to avoid the problems of light path pollution caused by the glue overflowed during the adhesion and fixation.

The surface of the third step 513 is provided with a lens. The reflecting mirror includes a light incident surface, an inclined surface, and a light emergent surface, wherein the light incident surface faces the lens, the inclined surface is used for reflecting the light signal transmitted by the lens, and the light emergent surface faces the second step 512. In some embodiments, the lens and mirror may be connected together or may be separately provided, depending on the scene. In the present application, the lens is fixed to the surface of the third step 513, and the stability of the lens is stronger than that in some embodiments, the lens is provided between the mirror and the light receiving chip.

The lens is disposed on the surface of the third step 513, the mirror is not disposed on the surface of any one of the steps, and the mirror is disposed above the second step.

The lens is arranged opposite to the reflector so as to enable the optical signal transmitted by the lens to be incident into the reflector, the focal length of the lens is required to be enough to enable the optical signal transmitted by the lens to be reflected by the reflector and then focused on the surface of the light receiving chip, and therefore the size of a light spot is reduced, and the optical signal is enabled to fall in the light receiving range of the light receiving chip.

The surface of the fourth step 514 is provided with an optical demultiplexing component 520, and the set height of the fourth step 514 has a preset height, so that the optical axis of the optical demultiplexing component 520 and the optical port of the optical module are located on the same axis, thereby increasing the optical coupling efficiency.

When the optical demultiplexing component 520 selects the standard specification, the height of the optical demultiplexing component is smaller than that of the lens, so that the optical demultiplexing component 520 is arranged on the surface of the fourth step 514 with higher relative position, the lens is arranged on the surface of the third step 513 with lower relative position, and the optical axis of the optical demultiplexing component 520 and the optical axis of the lens are in the same straight line.

In some embodiments, the circuit connection board 300a, the TIA560 and the light receiving chip 550 are sequentially disposed, and the TIA560 and the light receiving chip 550 are electrically connected to the circuit connection board 300a, respectively, and since the TIA560 is disposed between the light receiving chip 550 and the circuit connection board 300a, the wire bonding length between the light receiving chip 550 and the circuit connection board 300a is relatively long, which is not beneficial to the transmission of high-frequency signals, and since the light receiving chip 550 is disposed in an array, that is, includes a plurality of light receiving chips, the wire bonding difficulty between the light receiving chip and the circuit connection board 300a is further increased.

Illustratively, the end of the circuit connection board 300a is provided with a notch 301a, the notch 301a includes a first side wall 301a1, a second side wall 301a2 and a connection surface 301a3 for connecting the first side wall 301a1 and the second side wall 301a2, and the first side wall 301a1 and the second side wall 301a2 of the notch 301a can increase the pad setting area and the pad setting direction, especially for when the light receiving chips are arranged in an array form, and a TIA is arranged between the light receiving chips and the connection surface, illustratively, each light receiving chip in the light receiving chip array can be selectively connected with the bonding pad on the surface of the first side wall or the second side wall in a wire bonding manner.

Illustratively, the surfaces of the first sidewall 301a1 and the second sidewall 301a2 are provided with pads electrically connected to the light receiving chips 550, which increases the pad arrangement direction and is beneficial to shortening the routing length, for example, when eight light receiving chips are included in the light receiving chip array, the surface of the first sidewall 301a1 is provided with 4 pads to realize the electrical connection with the 4 light receiving chips, and the surface of the second sidewall 301a2 is provided with 4 pads to realize the electrical connection with the other 4 light receiving chips, so that when the pads electrically connected to the light receiving chips 550 are arranged on the surfaces of the first sidewall 301a1 and the second sidewall 301a2, the layout of routing is beneficial to shortening the routing length and the high-frequency signal transmission is beneficial to shortening the routing length.

Illustratively, the surface of the connection surface 301a3 is provided with a pad electrically connected to the TIA560, so as to implement wire bonding between the light receiving chip 550 and the circuit connection board 300a, and since the TIA560 is disposed adjacent to the connection surface 301a3, the wire bonding length between the circuit connection board 300a and the TIA560 can be shortened at this time, which is advantageous for high-frequency signal transmission.

In some embodiments, the lens includes a first lens 530a and the mirror includes a first mirror 540a. The first lens 530a is a converging lens. The light incident surface of the first lens 530a is a curved surface, and the light emergent surface is a plane.

Each light beam emitted by the optical demultiplexing component 520 is converged by the first lens 530a, coupled to the first reflector 540a, reflected by the first reflector 540a, and then the light path is turned downwards to the surface of the light receiving chip 550, and the focal length of the first lens 530a meets the requirement that a light spot formed by the optical signal falls on the surface of the light receiving chip 550.

The first reflecting mirror 540a includes a light incident surface, a first inclined surface 540a1, and a light emergent surface, wherein the light incident surface faces the first lens 530a, the first inclined surface 540a1 has a predetermined inclination angle, so that the light signal incident thereon is totally reflected to the surface of the light receiving chip 550, and the light emergent surface faces the surface of the light receiving chip 550.

In some embodiments, the first lens 530a is disposed on the surface of the third step 513, and the first reflecting mirror 540a is not disposed on the surface of any step, so in order to fix the first reflecting mirror 540a, the first reflecting mirror 540a may be carried by the first lens 530a, and the first lens 530a and the first reflecting mirror 540a are adhered together, and, for example, the light emitting surface of the first lens 530a and the light incident surface of the first reflecting mirror 540a are adhered together by optical cement, where the first reflecting mirror 540a is suspended relative to the surface of the step.

Since the light emitting surface of the first lens 530a is a plane, a larger contact surface between the light emitting surface of the first lens 530a and the light incident surface of the first reflecting mirror 540a can be ensured, so that the adhesion stability of the first reflecting mirror 540a is ensured. When the first lens 530a and the first reflecting mirror 540a are adhered together, the first lens 530a is fixed on the surface of the third step 513 by a high-precision chip mounter, and the first reflecting mirror 540a is not required to be fixed by the high-precision chip mounter, so that the chip mounting process is simplified, the light emitting surface of the first lens 530a and the light entering surface of the first reflecting mirror 540a are not required to be fixed by the high-precision chip mounter, and the optical cement is manually coated and adhered and fixed, so that the chip mounting process is simplified when the first lens 530a and the first reflecting mirror 540a are adhered together, and the efficiency is improved.

In some embodiments, when the circuit board 300a is a circuit board or a printed circuit board or a flexible circuit board of an optical module, the bonding pads on the surface of the TIA560 and the bonding pads on the surface of the circuit board 300a may be directly connected by wire bonding, and when the circuit board 300a is a ceramic board, wire bonding capacitors are disposed on the surface of the ceramic board, then the bonding pads on the surface of the TIA560 are electrically connected with the wire bonding capacitors, and then the wire bonding capacitors are wire bonded with the bonding pads on the surface of the ceramic board.

Fig. 11 is a cross-sectional structural view three of a first light receiving member according to some embodiments. As shown in fig. 11, the inner bottom surface of the envelope 510a is formed with a first step 511, a second step 512, a third step 513 and a fourth step 514, respectively. The first step 511 is used for supporting the circuit connection board 300a, the TIA560 and the light receiving chip 550 are disposed on the surface of the second step 512, the first lens 530a is disposed on the surface of the third step 513, the light emitting surface of the first mirror 540a faces the light receiving chip 550 on the surface of the second step 512, and the light demultiplexing component 520 is disposed on the surface of the fourth step 514.

In the embodiment of the application, the heights of the steps are reasonably set to ensure the light path of the optical element, so that the normal operation of the optical element is ensured. Illustratively, the second step 512 is at a predetermined height that is required to make the surface of the TIA560 flush with the surface of the circuit board 300a to shorten the wire bonding between the TIA560 and the circuit board 300 a.

Illustratively, the third step 513 has a predetermined height that is required to satisfy the working distance of the first lens 530a, and also to align the optical axis of the first lens 530a with the optical axis of the optical demultiplexing device 520. For example, if the height of the third step 513 is too low and the optical axes of the first lens 530a and the first mirror 540a are required to be kept in the same line with the optical axis of the optical demultiplexing device 520, and the height of the first mirror 540a is kept fixed, the distance between the first mirror 540a and the light receiving chip 550 is relatively large, and may exceed the working distance of the first lens 530a, so that the magnification of the first lens 530a cannot be ensured, and the normal operation of the first lens 530a cannot be satisfied. If the height of the third step 513 is too low and the optical axes of the first lens 530a and the first reflecting mirror 540a are required to be kept in the same line with the optical axis of the optical demultiplexing device 520, the distance between the first reflecting mirror 540a and the light receiving chip 550 is relatively small, so as to interfere with the operations such as wire bonding of the light receiving chip 550. Therefore, the third step 513 has a predetermined height, and the predetermined height needs to satisfy the working distance of the first lens 530a, and meanwhile, the optical axis of the first lens 530a and the optical axis of the optical demultiplexing component 520 are on the same line.

Illustratively, the height of the fourth step 514 has a predetermined height, where the predetermined height is required to satisfy that the optical axis of the optical demultiplexing component 520 on the surface is on the same axis as the optical port of the optical module, so as to ensure optical coupling power.

Fig. 12 is a cross-sectional structural view of a first light receiving member according to some embodiments. As shown in fig. 12, in some embodiments, when the first lens 530a is attached to the first reflecting mirror 540a, the bottom surface of the first lens 530a is on the same surface as the bottom surface of the first reflecting mirror 540a, and at this time, the optical axes of the first lens 530a and the first reflecting mirror 540a are on the same line.

The light receiving chip 550 and the TIA560 are both disposed on the surface of the second step 512, the first lens 530a is disposed on the surface of the third step 513, and the optical demultiplexing device 520 is disposed on the surface of the fourth step 514.

In some embodiments, the third step 513 and the fourth step 514 may be disposed in a plane, and the optical demultiplexing component 520 and the first lens 530a may be sized such that the optical axis of the optical demultiplexing component 520 is on the same axis as the optical axis of the first lens 530 a.

Fig. 13 is a cross-sectional structural view fifth of a first light receiving part according to some embodiments. As shown in fig. 13, in some embodiments, when the first lens 530a is adhered to the first mirror 540a, the bottom surface of the first lens 530a is disposed on the surface of the third step 513, and then the bottom surface of the first lens 540a is not on the same surface as the bottom surface of the first lens 530a, but is closer to the light receiving chip 550 than the bottom surface of the first lens 530a, so that the bottom surface of the first lens 530a is offset from the bottom surface of the first mirror 540a relatively, because when the first lens 530a is adhered, the excessive glue may overflow to the bottom surface of the first mirror 540a, reducing the transmittance of the bottom surface of the first mirror 540a, and when the bottom surface of the first lens 530a is offset from the bottom surface of the first mirror 540a relatively, the step surface formed by the offset may block the glue, thereby avoiding the glue from overflowing to the bottom surface of the first mirror 540a and ensuring the transmittance of the bottom surface of the first mirror 540 a.

In some embodiments, when the first lens 530a is attached to the first reflecting mirror 540a, the bottom surface of the first lens 530a is disposed on the surface of the third step 513, and then the bottom surface of the first reflecting mirror 540a is not on the same surface as the bottom surface of the first lens 530a, but is further upward away from the light receiving chip 550 relative to the bottom surface of the first lens 530 a. When the first reflecting mirror 540a is further away from the light receiving chip 550, a gap between the first reflecting mirror 540a and the light receiving chip 550 may be increased, leaving a sufficient safety space for wire bonding on the surface of the light receiving chip 550, attaching a capacitor near the light receiving chip 550, and the like.

Fig. 14 is a cross-sectional structural view sixth of a first light receiving part according to some embodiments. As shown in fig. 14, the TIA560 is disposed on the surface of the second step 512 and disposed in the notch 301a of the circuit board 300a, and the notch 301a wraps the TIA560.

The light emitting surface of the first lens 530a and the light entering surface of the first reflecting mirror 540a are adhered together by optical cement, so that the adhering process is simplified, meanwhile, the working distance of the first lens 530a is shorter, and the working distance pressure of the first lens 530a is reduced.

In some embodiments, when the working distance of the first lens 530a is determined, for example, when the first lens 530a is disposed separately from the first mirror 540a in some scenes, if the first lens 530a is disposed directly separately from the first mirror 540a, in order to ensure that the working distance of the first lens 530a is unchanged, the first mirror 540a needs to be disposed downward close to the light receiving chip 550, and since the optical axes of the first lens 530a and the first mirror 540a are on the same line, the first lens 530a should be disposed downward at this time, which may cause the optical axis of the first lens 530a and the optical axis of the optical demultiplexing component 520 to be not on the same axis, which affects the optical coupling efficiency, and therefore, when the working distance of the first lens 530a is determined, it is not appropriate that the first lens 530a is disposed separately from the first mirror 540 a.

In some embodiments, when the working distance of the first lens 530a is determined, for example, when the first lens 530a is separated from the first mirror 540a in some situations, if the first lens 530a is directly separated from the first mirror 540a, in order to ensure that the working distance of the first lens 530a is unchanged, the height of the surface of the second step 512 may be increased to shorten the chip between the first mirror 540a and the light receiving chip 550, and at this time, the thickness of the circuit connection board 300a needs to be reduced to ensure that the surface of the TIA560 on the surface of the second step 512 is on the same surface as the circuit connection board 300 a.

In some embodiments, when the first lens 530a is disposed separately from the first mirror 540a in some scenarios, for example, if the first lens 530a is disposed directly separately from the first mirror 540a, in order to ensure that the thickness of the circuit connection board 300a is unchanged, and that the surface of the TIA560 on the surface of the second step 512 is on the same surface as the circuit connection board 300a, the working distance of the first lens 530a should be adjusted, and in an exemplary embodiment, the working distance of the first lens 530a is increased.

Fig. 15 is a structural view of a second light receiving part according to some embodiments. As shown in fig. 15, as described above, in some embodiments, the circuit connection board 300a may be a flexible circuit board having one end extending into the interior of the package 510a and the other end electrically connected to the circuit board 300 of the optical module.

Illustratively, the circuit connection board 300a is in the form of a flexible circuit board 300b. Since the flexible circuit board 300b has a certain flexibility, the flexible circuit board 300b is supported by the reinforcing plate 300 c. The flexible circuit board 300b and the reinforcing plate 300c pass through the escape hole 515 and extend into the tube case 510 a.

In some embodiments, the flexible circuit board 300b and the stiffener 300c are stacked, and the flexible circuit board 300b and the stiffener 300c are provided with notches, respectively, in the form of notches of the aforementioned circuit connection board 300a, and the notches of the flexible circuit board 300b and the stiffener 300c also surround the second step 512.

Fig. 16 is a cross-sectional view of a second light receiving member according to some embodiments, and fig. 17 is an exploded cross-sectional view of a second light receiving member according to some embodiments. As shown in fig. 16 and 17, the notches of the flexible circuit board 300b and the reinforcing plate 300c also surround the second step 512. The stiffener 300c supports the flexible circuit board 300b. The surface of the first step 511 is used to support the stiffener 300c and the flexible circuit board 300b.

The surface of the fourth step 514 is provided with an optical demultiplexing component 520, the surface of the third step 513 is provided with a first lens 530a, the first lens 530a is connected with a first reflecting mirror 540a, and the first reflecting mirror 540a is used for reflecting the optical signal transmitted by the first lens 530a and turning the optical signal downwards to the surface of the optical receiving chip 550.

The surface of the second step 512 is provided with a light receiving chip 550 and a TIA560, respectively. The light receiving chip 550 and TIA560 are electrically connected. The light receiving chip 550 converts an optical signal into a current signal, and the TIA560 converts the current signal into a voltage signal and amplifies the voltage signal.

Fig. 18 is a schematic cross-sectional view of another cartridge according to some embodiments. As shown in fig. 18, another cartridge 510b is provided in some embodiments that is different from cartridge 510a described above.

In the tube case 510b, a relief hole 515 is provided at one end, and a boss 516 is provided at the other end. The relief holes 515 in the cartridge 510b serve the same purpose as the relief holes 515 in the cartridge 510a, and are used to allow the circuit board 300a to extend into. The boss 516 in the cartridge 510b functions in the same manner as the boss 516 in the cartridge 510a, both for coupling with the fiber optic adapter.

A first step 511, a second step 512, a third step 513, and a fourth step 514, which are sequentially increased in height, are formed on the inner bottom surface of the package 510b, respectively. By arranging the corresponding optical elements on the surfaces of the steps with different heights, reasonable arrangement of the optical axis can be realized, and reasonable design of the optical path can be realized.

Fig. 19 is a schematic cross-sectional view of a second cartridge according to some embodiments. As shown in fig. 19, in some embodiments, a first supporting protrusion 517 and a second supporting protrusion 518 are formed at both ends of an interface of the second step 512 and the third step 513, respectively. The first supporting protrusion 517 and the second supporting protrusion 518 are designed as a clamping groove, the clamping groove is clamped on the surface of the second step 512, and then the side surface is connected with the interface between the second step 512 and the third step 513, so that the first supporting protrusion 517 and the second supporting protrusion 518 are fixedly connected. Illustratively, the surface of the first supporting protrusion 517 is formed with a first clamping groove, the surface of the second supporting protrusion 518 is formed with a second clamping groove, and the first clamping groove and the second clamping groove are respectively clamped at two sides of the interface between the second step 512 and the third step 513.

Illustratively, the top surfaces of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the surface of the third step 513, and thus the heights of the first supporting protrusion 517 and the second supporting protrusion 518 are higher than the height of the third step 513.

Since the first supporting protrusions 517 and the second supporting protrusions 518 are spaced apart from each other at both ends, the top surface thereof may be provided with an optical element, and the optical element may be disposed under the optical element.

Fig. 20 is a cross-sectional view of a third light receiving member according to some embodiments. As shown in fig. 20, each step surface in the package 510b is provided with a corresponding optical element, in some embodiments, the fourth step 514 surface is provided with a light demultiplexing component 520, the third step 513 surface is provided with a lens, the lens is a converging lens, the other side of the lens is provided with a reflecting mirror, the reflecting mirror is used for reflecting the light signal transmitted by the lens, the second step 512 surface is respectively provided with a light receiving chip 550 and a TIA560, the light receiving chip 550 and the TIA560 are electrically connected, and the light receiving chip 550 and the TIA560 are electrically connected by wire bonding, for example. The mirror reflects the optical signal to the surface of the light receiving chip 550, the light receiving chip 550 converts the optical signal into a current signal, and the TIA560 converts the current signal into a voltage signal while amplifying the voltage signal. TIA560 is electrically connected to circuit board 300a, and illustratively, pads on the surface of TIA560 are electrically connected to pads on the surface of circuit board 300 a.

In some embodiments, the lens includes a second lens 530b, the mirror includes a second mirror 540b, the second mirror 540b has a second inclined surface 540b1 on a surface thereof, and the second inclined surface 540b1 has a predetermined inclination angle, so that the optical signal incident on the surface of the second mirror 540b is totally reflected to the surface of the light receiving chip 550.

The light incident surface of the second lens 530b faces the optical demultiplexing component 520, the light emergent surface faces the second reflecting mirror 540b, the light incident surface of the second reflecting mirror 540b faces the second lens 530b, and the light emergent surface faces the light receiving chip 550 on the surface of the second step 512.

In some embodiments, the second lens 530b is disposed on the surface of the third step 513, and the second reflecting mirror 540b is not disposed on the surface of any one of the steps, and then the second reflecting mirror 540b may be supported and fixed by the first supporting protrusion 517 and the second supporting protrusion 518 in order to fix the second reflecting mirror 540b. Illustratively, the second lens 530b is disposed apart from the second reflecting mirror 540b, that is, the second lens 530b is spaced apart from the second reflecting mirror 540b, both ends of the second reflecting mirror 540b are respectively disposed across the surfaces of the first supporting protrusion 517 and the second supporting protrusion 518, the first supporting protrusion 517 and the second supporting protrusion 518 support the second reflecting mirror 540b, and then the light receiving chip 550 is disposed under the second reflecting mirror 540b. The second reflecting mirror 540b is disposed on the top surface thereof and the light receiving chip 550 is disposed under the second reflecting mirror by the first supporting protrusion 517 and the second supporting protrusion 518 which are disposed at a distance from each other, so that the second reflecting mirror 540b and the light receiving chip 550 are disposed up and down, thereby transmitting the light signal reflected by the second reflecting mirror 540b to the surface of the light receiving chip 550.

Fig. 21 is a cross-sectional exploded view of a third light receiving member according to some embodiments. As shown in fig. 21, the end of the circuit connection plate 300a is likewise provided with a recess which protrudes into the housing 510b through the relief opening 515 until the recess surrounds the outer circumference of the second step 512.

Fig. 22 is a second cross-sectional view of a third light receiving member according to some embodiments, and fig. 23 is a third cross-sectional view of a third light receiving member according to some embodiments. As shown in fig. 22 and 23, the surface of the fourth step 514 is provided with a light demultiplexing component 520, the surface of the third step 513 is provided with a second lens 530b, a second reflecting mirror 540b is provided above the second step 512, the second reflecting mirror 540b is disposed opposite to the light receiving chip 550, and the light signal transmitted by the second lens 530b is reflected to the surface of the light receiving chip 550 by the second reflecting mirror 540 b. The light receiving chip 550 and the TIA560 are disposed on the surface of the second step 512.

In some embodiments, the second lens 530b is disposed separately from the second mirror 540b, facilitating coupling as compared to disposing the two in contact. When the two are in contact, joint tone coupling is needed, and the joint tone coupling efficiency is low, so that the two can be separately arranged and then separately coupled. Illustratively, the second mirror 540b is coupled first, followed by the second lens 530 b. Meanwhile, in order to facilitate coupling of the second lens 530b, a space between the second lens 530b and the second mirror 540b is large, thereby leaving a sufficient space for coupling of the second lens 530 b.

In some embodiments, the distance between the second mirror 540b and the light receiving chip 550 may be set larger in order not to interfere with the wire bonding between the light receiving chip 550 and the TIA 560.

In order to increase the distance between the second reflecting mirror 540b and the light receiving chip 550, since the height of the second step 512 where the light receiving chip 550 is located should ensure that the surface of the TIA560 is flush with the surface of the circuit connection board 300a, the height of the second step 512 should remain unchanged, and thus the height of the light receiving chip 550 is kept unchanged, at this time, the distance between the second reflecting mirror 540b and the light receiving chip 550 may be increased by adjusting the second reflecting mirror 540 b.

Since the height of the optical axis of the second reflecting mirror 540b should be kept unchanged, the position of the second inclined surface 540b1 should be kept unchanged, so that the operations such as wire bonding can be facilitated by reducing the dimension of the second reflecting mirror 540b along the height direction of the package 510b, that is, reducing the height of the second reflecting mirror 540b in the up-down direction, while ensuring the position of the second inclined surface 540b1, thereby increasing the distance between the second reflecting mirror 540b and the light receiving chip 550. Accordingly, the dimension of the first reflecting mirror 540a in the height direction of the package 510a is larger than the dimension of the second reflecting mirror 540b in the height direction of the package 510a, that is, the dimension of the second reflecting mirror 540b in the up-down direction is smaller than the dimension of the first reflecting mirror 540a in the up-down direction, and it is understood that the "up-down direction" refers to the direction from the second reflecting mirror 540b toward the light receiving chip 550. At this time, the distance from the first reflecting mirror 540a to the corresponding light receiving chip 550 is smaller than the distance from the second reflecting mirror 540b to the corresponding light receiving chip 550.

Illustratively, the cross section of the first reflecting mirror 540a in the up-down direction is trapezoidal plus rectangular, the cross section of the second reflecting mirror 540b in the up-down direction is trapezoidal, and the dimension of the second reflecting mirror 540b in the up-down direction is smaller than the dimension of the first reflecting mirror 540a in the up-down direction. When the cross section of the first reflecting mirror 540a in the up-down direction is trapezoidal plus rectangular, the rectangular shape provided below the first inclined surface 540a1 prevents the first inclined surface 540a1 from forming a sharp corner, which easily causes a broken corner. When the cross section of the second reflecting mirror 540b in the up-down direction is trapezoidal, the distance between the second reflecting mirror 540b and the light receiving chip 550 may be increased, facilitating operations such as wire bonding of the light receiving chip 550.

In some embodiments, when the optical port position is unchanged, the height of the optical axis of the optical demultiplexing component 520 should be unchanged, and further, the height of the optical axis of the second mirror 540b should be kept unchanged, and then the height of the top surface of the second mirror 540b is the same as the height of the top surface of the first mirror 540a, so the first supporting protrusion 517 and the second supporting protrusion 518 have a preset height, so that the height of the top surface of the second mirror 540b is the same as the height of the top surface of the first mirror 540 a.

When the dimension of the first reflecting mirror 540a in the height direction of the package 510a is larger than the dimension of the second reflecting mirror 540b in the height direction of the package 510a, that is, the dimension of the second reflecting mirror 540b in the up-down direction is smaller than the dimension of the first reflecting mirror 540a in the up-down direction, the optical path from the second lens 530b to the corresponding light receiving chip 550 is shorter than the optical path from the first lens 530a to the corresponding light receiving chip 550, the distance of the optical signal transmitted by the second reflecting mirror 540b is smaller than the distance of the optical signal transmitted by the first reflecting mirror 540a, and when the reflecting mirror is the second reflecting mirror 540b, the distance of the optical signal transmitted in the air is longer than the distance of the reflecting mirror transmitted by the first reflecting mirror 540a, because the refractive index of the air is small, the optical path from the second lens 530b to the corresponding light receiving chip 550 is shorter than the optical path from the first lens 530a to the corresponding light receiving chip 550, and at this time, the working distance of the second lens 530b is smaller than the working distance of the first lens 530 a.

In order to secure the coupling effect, the gap between the second lens 530b and the second mirror 540b is large, and illustratively, the gap is larger than a dimension difference, which refers to a difference between the dimension of the second mirror 540b in the height direction of the package 510b and the dimension of the first mirror 540a in the height direction of the package 510a, and at this time, although the dimension of the second mirror 540b in the up-down direction is smaller than the dimension of the first mirror 540a in the up-down direction, the gap between the second lens 530b and the second mirror 540b is large, and thus, the working distance of the second lens 530b may be larger than the working distance of the first lens 530 a.

In the application, the lens is fixed on the surface of the third step to increase the stability of the lens, and meanwhile, the reflector is arranged above the second step, and the light receiving chip is arranged on the surface of the second step, so that the space in the vertical direction of the tube shell is fully utilized. In the application, the focal length of the lens enables the optical signal transmitted from the lens to be reflected by the reflecting mirror and then focused on the surface of the light receiving chip, thereby reducing the size of the light spot and enabling the optical signal to fall in the light receiving range of the light receiving chip. In the application, the photoelectric elements are arranged on different steps in the tube shell, and the steps with different heights enable the optical axes of the optical elements to be positioned on the same axis, so that ceramic support plates adopted in some embodiments are omitted, thereby reducing the production cost, and the ceramic support plates are integrally formed on the step surfaces with different heights in the tube shell, thereby avoiding fixing the ceramic support plates in a patch mode, and further improving the reliability of products and the optical coupling precision. Meanwhile, the height of each step is reasonably set, so that the height of the optical axis of the optical element is ensured, and the normal operation of the optical element is further ensured.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. An optical module, comprising:

One end of the tube shell is provided with an avoidance hole, and the bottom surface of the tube shell is respectively provided with a first step, a second step, a third step and a fourth step with the heights sequentially increased, so as to arrange different optical elements, wherein the avoidance hole is used for enabling the circuit connecting plate to extend into the tube shell until the notch wraps the periphery of the second step;

the light receiving chips are arranged on the surface of the second step in an array mode and are electrically connected with the surfaces of the first side wall or the second side wall;

and the TIA is arranged on the surface of the second step, between the connecting surface and the light receiving chip, and is electrically connected with the light receiving chip.

2. The light module of claim 1 wherein the light receiving means further comprises:

The optical demultiplexing component is arranged on the surface of the fourth step and is used for decomposing the optical signals transmitted to the tube shell into a plurality of optical signals;

the lens is arranged on the surface of the third step and used for converging a plurality of light signals respectively;

the reflecting mirror is arranged on the light emitting direction of the lens, the reflecting mirror is not positioned on the bottom surface of the tube shell, the reflecting mirror comprises a light incident surface, an inclined surface and a light emitting surface, the light incident surface faces the lens, the inclined surface is used for reflecting the light signal emitted by the lens, and the light emitting surface faces the second step;

The light receiving chip faces the reflecting mirror, and the surface of the light receiving chip and the light emitting surface of the reflecting mirror have a preset distance so as to meet the working distance of the lens; the optical receiving chip is arranged in an array form to receive each beam of optical signals reflected by the reflecting mirror and convert the optical signals into electric signals, wherein the focal length of the lens enables the optical signals transmitted by the lens to be focused on the surface of the optical receiving chip after being reflected by the reflecting mirror;

the surface of the TIA is flush with the surface of the circuit connecting plate;

The second step has a preset height so that the TIA surface is flush with the surface of the circuit connecting plate, the third step has a preset height so as to meet the working distance of the lens and enable the optical axis of the lens to be located on the same axis with the optical axis of the optical demultiplexing component, and the fourth step has a preset height so that the optical axis of the optical demultiplexing component and the optical port of the optical module are located on the same axis.

3. The light module of claim 2 wherein the lens comprises a first lens and the mirror comprises a first mirror, a surface of the first mirror being formed with a first bevel;

the light emergent surface of the first lens is connected with the light incident surface of the first reflecting mirror through optical cement.

4. A light module as recited in claim 3, wherein the lens comprises a second lens, the mirror comprises a second mirror, and a surface of the second mirror is formed with a second bevel; the second lens and the second reflecting mirror are arranged separately, and the central axis of the second inclined plane and the central axis of the first inclined plane are positioned on the same axis;

A first supporting protrusion and a second supporting protrusion are respectively formed at the interface of the second step and the third step, and the first supporting protrusion and the second supporting protrusion are used for supporting the second reflecting mirror;

the first supporting protrusion and the second supporting protrusion have preset heights respectively, so that the central axis of the second inclined plane and the optical axis of the second lens are located on the same axis.

5. The optical module of claim 4, wherein a surface of the first support protrusion is formed with a first clamping groove, and a surface of the second support protrusion is formed with a second clamping groove;

The first clamping groove and the second clamping groove are respectively clamped at two sides of the interface between the second step and the third step.

6. The light module of claim 4 wherein the first mirror has a dimension along the height of the package that is greater than the dimension of the second mirror along the height of the package;

the distance from the first reflecting mirror to the corresponding light receiving chip is smaller than the distance from the second reflecting mirror to the corresponding light receiving chip.

7. A light module as recited in claim 3, wherein a bottom surface of the first lens is on a same surface as a bottom surface of the reflector;

Or, the bottom surface of the first lens is lower relative to the bottom surface of the reflector, so as to avoid glue from overflowing to the bottom surface of the reflector when the first lens is attached;

Or, the bottom surface of the first lens is higher relative to the bottom surface of the reflecting mirror to increase the distance between the reflecting mirror and the light receiving chip.

8. The optical module of claim 1, wherein the circuit board is a circuit board of the optical module, or wherein the circuit board is a flexible circuit board, one end of the flexible circuit board extends into the tube shell, and the other end of the flexible circuit board is electrically connected with the circuit board of the optical module, or wherein the circuit board is a printed circuit board, one end of the printed circuit board extends into the tube shell, and the other end of the printed circuit board is electrically connected with the circuit board of the optical module, or wherein the circuit board is a ceramic connection board, one end of the ceramic connection board extends into the tube shell, and the other end of the ceramic connection board is electrically connected with the circuit board of the optical module through the flexible circuit board.

9. The light module of claim 4 wherein the surfaces of the first and second support protrusions are higher than the surface of the third step.

10. A light module as recited in claim 3, wherein the light incident surface of the first lens is a curved surface and the light exit surface is a plane surface.