CN119159458A - A semiconductor wafer material grinding device - Google Patents
A semiconductor wafer material grinding device Download PDFInfo
- Publication number
- CN119159458A CN119159458A CN202411642274.0A CN202411642274A CN119159458A CN 119159458 A CN119159458 A CN 119159458A CN 202411642274 A CN202411642274 A CN 202411642274A CN 119159458 A CN119159458 A CN 119159458A
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- China
- Prior art keywords
- mounting
- center
- rotating
- rod
- mounting table
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing device for semiconductor wafer materials, which relates to the field of wafer material polishing equipment and comprises a receiving table, wherein a diversion trench is formed in the center of the top of the receiving table, a fixed column is vertically fixed in the center of the diversion trench, a top plate is rotatably embedded and installed at the top of the fixed column, a stepping motor for assisting the top plate to rotate is installed at the center of the top plate, hydraulic rods are symmetrically and vertically installed at two ends of the top plate, an installation plate is fixed at the extending end of the hydraulic rods, a vacuum negative pressure rotating module is installed at the bottom of the installation plate, a sucker is installed at the bottom of the vacuum negative pressure rotating module, and a wafer body is adsorbed and arranged on the sucker. According to the invention, the second mounting table can be adjusted to a corresponding angle according to different working requirements during subsequent working, and the mounting disc on the second mounting table is adjusted to a corresponding angle, so that the edge of the wafer material can be effectively polished, and the conditions of insufficient or uneven polishing of the edge part and the like are avoided as much as possible.
Description
Technical Field
The invention relates to the field of polishing equipment for wafer materials, in particular to a polishing device for semiconductor wafer materials.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form a cylindrical crystal silicon rod, and the silicon crystal rod is subjected to procedures of grinding, polishing, slicing and the like to form the silicon wafer, namely the wafer, so that grinding and polishing are one of important steps in the production process of the wafer, and in addition, the surface of the wafer is required to be ground and polished for recycling the wafer which is recycled or the wafer with scratches on the surface.
The existing wafer material polishing device generally has the problems of fixed polishing table angle and lack of flexible adjustment, the limitation is particularly remarkable in the polishing process of the wafer edge, insufficient or uneven polishing of the edge part is easily caused, and the additional secondary processing is often needed for correction, so that the complexity and time cost of the whole process are increased, and therefore, the polishing device for the semiconductor wafer material is needed to assist in solving the problem.
Disclosure of Invention
Based on the above, the invention aims to provide a polishing device for semiconductor wafer materials, so as to solve the problems of fixed angle and lack of flexible adjustment of a polishing table of the conventional polishing device for wafer materials, and the limitation is particularly remarkable in the polishing process of the wafer edge, which easily causes insufficient or uneven polishing of the edge part and often requires additional secondary processing for correction, thereby increasing the complexity of the whole process and the technical problem of time cost.
The polishing device for the semiconductor wafer material comprises a receiving table, wherein a diversion trench is formed in the center of the top of the receiving table, a fixed column is vertically fixed in the center of the diversion trench, a top plate is rotatably embedded in the top of the fixed column, a stepping motor for assisting the top plate to rotate is arranged in the center of the top plate, hydraulic rods are symmetrically and vertically arranged at two ends of the top plate, mounting plates are fixedly arranged at the extending ends of the hydraulic rods, a vacuum negative pressure rotating module is arranged at the bottom of the mounting plates, a sucker is arranged at the bottom of the vacuum negative pressure rotating module, and a wafer body is adsorbed on the sucker;
The bearing table is characterized in that the bearing table top is symmetrically provided with a first mounting table, the bearing of the first mounting table top is provided with a second mounting table, the center of the second mounting table top is provided with a rotating motor, the front end of a crankshaft of the rotating motor is provided with a rotating seat, the top of the rotating seat is clamped with a mounting disc, the top of the mounting disc is provided with a first grinding pad, and the top of the first grinding pad is provided with a second grinding pad matched with the wafer body for grinding.
The invention is further characterized in that the bottom of the second installation table is of an arc-shaped structure, a limiting groove is formed in the bottom of the second installation table, the top of the first installation table is of an arc-shaped groove, sliding blocks are symmetrically fixed at the top of the first installation table and slide in a matched mode with the limiting groove, an adjusting cavity is formed in the first installation table, and an adjusting component for assisting in adjusting the angle of the second installation table is arranged in the adjusting cavity.
The invention further provides that the adjusting assembly comprises a fixed seat which is fixedly protruding on the outer side plate of the first mounting table, a rotating rod is transversely arranged in the fixed seat and the adjusting cavity in a penetrating mode, a sleeve ring is sleeved on the rotating rod, the rotating rod is in threaded fit with the sleeve ring, a sliding rod is fixedly arranged at the top of the sleeve ring, a sliding sleeve is sleeved on the sliding rod, the top of the sliding sleeve is hinged to the center of the bottom of the limiting groove, and a knob is fixedly arranged at one end, extending out of the fixed seat, of the rotating rod.
The invention is further characterized in that a scale plate is embedded and installed on one arc-shaped side of the second installation table, angle scale marks are symmetrically carved on the scale plate, a pointer is arranged on one arc-shaped side of the first installation table in a protruding mode, and the pointer and the scale plate are matched to point.
The invention is further characterized in that a clamping groove is formed in the outer edge of the top of the rotating seat, a clamping block is arranged at the bottom of the mounting disc in a protruding mode, and the clamping groove and the clamping block are matched and fixed.
The invention is further characterized in that the clamping grooves are arranged in four, the four clamping grooves are arranged in an annular array with the circle center of the rotating seat as the center, the four clamping blocks are arranged in four, and the circle centers of the four clamping blocks and the mounting disc are arranged in an annular array with the center as the center.
The invention is further arranged that the clamping groove comprises a penetrating opening for the clamping block to penetrate through and a chute for the clamping block to slide and clamp, and the whole clamping block is inverted T-shaped.
The vacuum negative pressure rotary module comprises a hollow shaft motor, wherein the sucker is arranged at the bottom machine shaft end of the hollow shaft motor, a negative pressure rotary connector is arranged at the top of the hollow shaft motor, one end of the negative pressure rotary connector is communicated with a negative pressure pump, and an air path at the other end of the negative pressure rotary connector is communicated with the sucker.
The invention is further characterized in that a mounting rod is vertically arranged on one side edge of the top of the bearing table, which corresponds to the first mounting table, a liquid spray nozzle is hinged to one end of the mounting rod, which faces the first mounting table, the mounting rod and the liquid spray nozzle are communicated through a conducting pipe, a lifting cavity is vertically arranged on the outer side edge of the mounting rod, and an auxiliary liquid spray nozzle adjusting lifting assembly is arranged in the lifting cavity.
The lifting assembly is further arranged in a way that the lifting assembly comprises a rotating rod vertically and rotatably arranged in a lifting cavity, a sliding block is sleeved on the rotating rod, the rotating rod is in threaded fit with the sliding block, a rotary table is fixed at the bottom of the rotating rod, one part of the rotary table extends out of the mounting rod, and a supporting rod is hinged between the sliding block and the liquid spraying nozzle.
In summary, the invention has the advantages that through the cooperation between the first mounting table, the second mounting table, the adjusting component and the like which are arranged at the top of the bearing table, when the edge of the wafer body needs to be polished, the knob drives the rotating rod to rotate, and the rotating rod is in threaded cooperation with the lantern ring, so that the lantern ring integrally moves, the sliding rod is driven to move in the moving process of the lantern ring, the sliding sleeve is driven to be pushed or pulled, the integral inclination of the second mounting table is effectively adjusted, the second mounting table can be adjusted to a corresponding angle according to different working requirements during subsequent working, and the mounting disc on the second mounting table is adjusted to a corresponding angle, thereby effectively polishing the edge of the wafer material, and avoiding insufficient or uneven polishing of the edge part as much as possible;
Through the first polishing pad and the second polishing pad, when the crystal edge of the wafer body is pressed down, the blue pu foaming polishing pad with lower relative density can bend, so that the second polishing pad can bend downwards, the area contacting the crystal edge is larger, and a better crystal edge polishing effect is achieved;
Through the lifting assembly on the installation pole that sets up, can be at the during operation, rotate the carousel, the carousel drives the bull stick and wholly rotates, screw-thread fit between bull stick and the slider, thereby make slider bulk movement, and then drive branch and drive the hydrojet mouth and remove, and then remove appointed inclination with the hydrojet mouth, and then can realize different inclination's hydrojet processing at the in-process of polishing, guarantee going on smoothly of follow-up work of polishing, guarantee the position coincidence of polishing between hydrojet whereabouts position and wafer body and the second grinding pad, guarantee that follow-up wafer work of polishing goes on smoothly.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present invention;
FIG. 3 is an enlarged schematic view of the structure of the present invention at B in FIG. 1;
FIG. 4 is a longitudinal cross-sectional view of a first mounting station of the present invention;
fig. 5 is an enlarged schematic view of the structure of fig. 1C according to the present invention.
The device comprises a supporting table1, a supporting table2, a guide groove 3, a fixed column 4, a top plate 5, a stepping motor 6, a hydraulic rod 61, a mounting plate 7, a vacuum negative pressure rotating module 71, a hollow shaft motor 72, a negative pressure rotating connector 8, a sucker 9, a wafer body 10, a first mounting table 101, a pointer 102, a sliding block 11, a second mounting table 111, a scale plate 112, a limit groove 12, a rotating motor 13, a rotating seat 131, a clamping groove 14, a mounting plate 141, a first grinding pad 142, a second grinding pad 143, a clamping block 15, an adjusting component 151, a fixing seat 152, a knob 153, a rotating rod 154, a lantern ring 155, a sliding rod 156, a sliding sleeve 16, a mounting rod 17, a lifting component 18, a rotating rod 181, a rotating disc 19, a sliding block 20, a supporting rod 21, a liquid spraying nozzle 22 and a guide pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
The utility model provides a grinding device of semiconductor wafer material, as shown in fig. 1, including accepting the platform 1, accept platform 1 top center department and offered guiding gutter 2, can assist the water conservancy diversion after the grinding fluid blowout uses through guiding gutter 2 that sets up, guiding gutter 2's center department vertical fixation has fixed column 3, fixed column 3 top department rotates to inlay and establishes and install roof 4, roof 4 department center department installs supplementary roof 4 pivoted step motor 5, step motor 5 fixes in roof 4 top department, step motor 5's spindle front end is fixed in roof 4's top department, roof 4 top both ends symmetry vertical installation has hydraulic stem 6, hydraulic stem 6's extension end is fixed with mounting panel 61, be fixed with the guide bar on the mounting panel 61 vertically, the guide bar wears to establish and installs in roof 4 top department, through the guide bar that sets up, can guarantee that the circumstances such as rotation can not appear in the in-process of mounting panel 61 rising and descending at the during operation.
Referring to fig. 1 and 2, a vacuum negative pressure rotating module 7 is installed at the bottom of the mounting plate 61, a suction cup 8 is installed at the bottom of the vacuum negative pressure rotating module 7, the vacuum negative pressure rotating module 7 comprises a hollow shaft motor 71, the suction cup 8 is installed at the bottom machine shaft end of the hollow shaft motor 71, a negative pressure rotating connector 72 is installed at the top of the hollow shaft motor 71, one end of the negative pressure rotating connector 72 is communicated with a negative pressure pump, an air channel at the other end of the negative pressure rotating connector 72 is communicated with the suction cup 8, and a wafer body 9 is adsorbed on the suction cup 8.
Through the rotatory module 7 of vacuum negative pressure that sets up, can guarantee at the during operation that wafer body 9 can obtain stable absorption, enable sucking disc 8 simultaneously and stably rotate, make things convenient for follow-up drive wafer body 9 whole rotation to polish.
Referring to fig. 1, 3 and 4, a first mounting table 10 is symmetrically mounted on the top of the bearing table 1, a second mounting table 11 is mounted on the top of the first mounting table 10, a rotating motor 12 is mounted at the center of the top of the second mounting table 11, a rotating seat 13 is mounted at the front end of a shaft of the rotating motor 12, a mounting plate 14 is mounted at the top of the rotating seat 13 in a clamping manner, a first grinding pad 141 is mounted at the top of the mounting plate 14, the first grinding pad 141 is a low-density PU foaming grinding pad, a second grinding pad 142 matched with the wafer body 9 for grinding is mounted at the top of the first grinding pad 141, and a plurality of grooves which are crisscross are distributed on the upper surface of the second grinding pad 142.
Through the first polishing pad 141 and the second polishing pad 142 that set up, through setting up the first polishing pad 141 as the PU foaming polishing pad of low density, when the crystal limit of wafer body 9 pushes down, the lower pressure of wafer body 9, the lower blue PU foaming polishing pad of relative density can produce crooked, makes the second polishing pad 142 can be crooked downwards to the area of contact crystal limit is bigger, reaches better grinding crystal limit effect.
The outer edge of the top of the rotating seat 13 is provided with four clamping grooves 131, the four clamping grooves 131 are arranged in an annular array with the center of the rotating seat 13 as the center, the bottom of the mounting disc 14 is provided with four clamping blocks 143 in a protruding mode, the four clamping blocks 143 and the center of the mounting disc 14 are arranged in an annular array with the center as the center, the clamping grooves 131 and the clamping blocks 143 are matched and fixed, the clamping grooves 131 comprise penetrating openings for the clamping blocks 143 to penetrate through and sliding grooves for the clamping blocks 143 to slide and clamp, and the clamping blocks 143 are in an inverted T shape as a whole.
Through the detachable design between the clamping groove 131 and the clamping block 143 that set up, can be according to the difference of work demand of polishing at the during operation, carry out quick dismantlement change processing to first grinding pad 141 and second grinding pad 142, guarantee that follow-up work goes on smoothly.
The bottom of the second installation table 11 is of an arc structure, a limit groove 112 is formed in the bottom of the second installation table 11, the top of the first installation table 10 is of an arc groove shape, a sliding block 102 is symmetrically fixed at the top of the first installation table 10, the sliding block 102 and the limit groove 112 are matched to slide, an adjusting cavity is formed in the first installation table 10, an adjusting component 15 assisting in adjusting the angle of the second installation table 11 is arranged in the adjusting cavity, the adjusting component 15 comprises a fixing seat 151 protruding and fixed on the outer side plate of the first installation table 10, a rotating rod 153 transversely penetrates through the fixing seat 151 and is arranged in the adjusting cavity, a sleeve ring 154 is sleeved on the rotating rod 153, a sliding rod 155 is fixedly arranged at the top of the sleeve ring 154 in a threaded fit mode, a sliding sleeve 156 is sleeved on the sliding rod 155, the top of the sliding sleeve 156 is hinged to be installed at the center of the bottom of the limit groove 112, and one end of the rotating rod 153 extending out of the fixing seat 151 is fixedly provided with a knob 152.
According to the invention, through the cooperation between the first mounting table 10, the second mounting table 11, the adjusting component 15 and the like which are arranged at the top of the bearing table 1, when the edge of the wafer body 9 needs to be polished, the knob 152 drives the rotating rod 153 to rotate, and the rotating rod 153 is in threaded fit with the lantern ring 154, so that the lantern ring 154 integrally moves, the sliding rod 155 is driven to move in the moving process of the lantern ring 154, the sliding sleeve 156 is pushed or pulled, the integral inclination of the second mounting table 11 is effectively adjusted, the second mounting table 11 can be adjusted to a corresponding angle according to different working requirements in the subsequent working process, and the mounting disc 14 on the second mounting table can be adjusted to a corresponding angle, thereby effectively polishing the edge of the wafer material, and avoiding insufficient or uneven polishing of the edge part as much as possible.
Further, the scale plate 111 is embedded and installed on the arc-shaped side edge of the second installation table 11, angle scale marks are symmetrically carved on the scale plate 111, the pointer 101 is protruding and arranged on the arc-shaped side edge of the first installation table 10, and the pointer 101 and the scale plate 111 are matched to point.
By the cooperation between the provided scale plate 111 and the pointer 101, the overall inclination of the second mounting table 11 can be effectively determined and interpreted after the second mounting table 11 is adjusted.
Referring to fig. 1 and 5, a mounting rod 16 is vertically mounted on one side edge of the top of the bearing table 1 corresponding to the first mounting table 10, a liquid spray nozzle 21 is hinged to one end of the mounting rod 16 facing the first mounting table 10, the mounting rod 16 and the liquid spray nozzle 21 are communicated through a conducting pipe 22, a lifting cavity is vertically formed on the outer side edge of the mounting rod 16, an auxiliary liquid spray nozzle 21 is mounted in the lifting cavity to adjust a lifting assembly 17, the lifting assembly 17 comprises a rotating rod 18 vertically arranged in the lifting cavity, a sliding block 19 is sleeved on the rotating rod 18, threads are matched between the rotating rod 18 and the sliding block 19, a rotary table 181 is fixed at the bottom of the rotating rod 18, a part of the rotary table 181 extends out of the mounting rod 16, and a supporting rod 20 is hinged between the sliding block 19 and the liquid spray nozzle 21.
Through the lifting assembly 17 on the installation pole 16 that sets up, can be at the during operation, rotate carousel 181, carousel 181 drives the bull stick 18 and wholly rotates, screw-thread fit between bull stick 18 and the slider 19, thereby make slider 19 wholly remove, and then drive branch 20 and drive hydrojet mouth 21 and remove, and then remove appointed inclination with hydrojet mouth 21, and then can realize different inclination's hydrojet processing at the in-process of polishing, guarantee follow-up polishing work go on smoothly, guarantee that hydrojet whereabouts position coincides with the polishing position between wafer body 9 and the second grinding pad 142, guarantee that follow-up wafer polishing work goes on smoothly.
In a specific operation, the liquid spraying nozzle 21 can spray out grinding liquid or polishing liquid, wherein the grinding liquid is slurry containing hard grinding particles with the granularity of 500-5000 meshes, the hard grinding particles are one or more of silicon carbide, aluminum oxide, boron carbide and diamond powder, and the polishing liquid is slurry containing silica sol with the granularity of 80-140 nm.
The working principle of the invention is as follows:
Before the work, when needs adsorb wafer body 9, rotate connector 72 intercommunication negative pressure pump with the negative pressure, and then carry out supplementary absorption processing to wafer body 9 through sucking disc 8, rotate carousel 181, carousel 181 drives bull stick 18 and wholly rotates, screw thread fit between bull stick 18 and the slider 19 to make slider 19 wholly remove, and then drive branch 20 and drive hydrojet mouth 21 and remove, and then remove appointed inclination with hydrojet mouth 21.
During operation, the hydraulic rod 6 is integrally extended, the mounting plate 61 is driven to move in the extending process of the hydraulic rod 6, the vacuum negative pressure rotating module 7 is driven to move downwards, the wafer body 9 is attached to the top of the second grinding pad 142, the hollow shaft motor 71 is started, the hollow shaft motor 71 drives the sucking disc 8 to rotate and drives the wafer body 9 to integrally rotate anticlockwise, meanwhile, the rotating motor 12 drives the rotating seat 13 to rotate clockwise, the rotating seat 13 drives the mounting plate 14 to rotate, and the second grinding pad 142 on the mounting plate 14 is used for carrying out auxiliary grinding treatment on the wafer body 9.
When the edge of the wafer body 9 needs to be polished, the knob 152 is rotated, the knob 152 drives the rotating rod 153 to rotate, and the rotating rod 153 is in threaded fit with the collar 154, so that the collar 154 integrally moves, the sliding rod 155 is driven to move in the moving process of the collar 154, the sliding sleeve 156 is pushed or pulled, the whole inclination of the second mounting table 11 is effectively adjusted, when the mounting plate 14 is in an inclined state, the edge of the wafer body 9 is pressed on the top of the second polishing pad 142, and the first polishing pad 141 is pressed down when encountering the pressure of the wafer body 9, so that the second polishing pad 142 is wrapped on the outer edge of the wafer body 9, and the auxiliary polishing treatment is performed on the outer edge of the wafer body 9.
After preliminary polishing, the stepping motor 5 is rotated, the stepping motor 5 drives the top plate 4 to rotate 180 degrees, so that the wafer body 9 rotates to the top of the other mounting plate 14, and further secondary fine polishing is performed on the wafer body 9.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (10)
1. The polishing device for the semiconductor wafer material comprises a bearing table (1) and is characterized in that a guide groove (2) is formed in the center of the top of the bearing table (1), a fixing column (3) is vertically fixed in the center of the guide groove (2), a top plate (4) is rotatably embedded in the top of the fixing column (3), a stepping motor (5) for assisting the top plate (4) to rotate is installed in the center of the top plate (4), hydraulic rods (6) are symmetrically and vertically installed at two ends of the top plate (4), a mounting plate (61) is fixed at the extending end of the hydraulic rods (6), a vacuum negative pressure rotating module (7) is installed at the bottom of the mounting plate (61), a sucker (8) is installed at the bottom of the vacuum negative pressure rotating module (7), and a wafer body (9) is adsorbed and arranged on the sucker (8).
The bearing table is characterized in that a first mounting table (10) is symmetrically mounted at the top of the bearing table (1), a second mounting table (11) is mounted at the top of the first mounting table (10), a rotating motor (12) is mounted at the center of the top of the second mounting table (11), a rotating seat (13) is mounted at the front end of a machine shaft of the rotating motor (12), a mounting disc (14) is mounted at the top of the rotating seat (13) in a clamping manner, a first grinding pad (141) is mounted at the top of the mounting disc (14), and a second grinding pad (142) matched with the wafer body (9) for grinding is mounted at the top of the first grinding pad (141).
2. The polishing device of semiconductor wafer materials as set forth in claim 1, wherein the bottom of the second mounting table (11) is of an arc structure, a limiting groove (112) is formed in the bottom of the second mounting table (11), the top of the first mounting table (10) is of an arc groove shape, sliding blocks (102) are symmetrically fixed on the top of the first mounting table (10), the sliding blocks (102) slide with the limiting groove (112) in a matched mode, an adjusting cavity is formed in the first mounting table (10), and an adjusting component (15) for assisting in adjusting the angle of the second mounting table (11) is arranged in the adjusting cavity.
3. The polishing device for semiconductor wafer materials according to claim 2, wherein the adjusting assembly (15) comprises a fixed seat (151) which is fixedly arranged on the outer side plate of the first mounting table (10) in a protruding mode, a rotating rod (153) is transversely arranged in the fixed seat (151) and the adjusting cavity in a penetrating mode, a lantern ring (154) is sleeved on the rotating rod (153), the rotating rod (153) is in threaded fit with the lantern ring (154), a sliding rod (155) is fixedly arranged at the top of the lantern ring (154), a sliding sleeve (156) is sleeved on the sliding rod (155), the top of the sliding sleeve (156) is hinged to the bottom center of the limiting groove (112), and one end, extending out of the fixed seat (151), of the rotating rod (153) is fixedly provided with a knob (152).
4. A polishing device for semiconductor wafer materials according to claim 3 is characterized in that a scale plate (111) is embedded and installed on one arc-shaped side of the second installation table (11), angle scale marks are symmetrically carved on the scale plate (111), a pointer (101) is arranged on one arc-shaped side of the first installation table (10) in a protruding mode, and the pointer (101) and the scale plate (111) are in a matched pointing mode.
5. The polishing device of semiconductor wafer materials as set forth in claim 1, wherein a clamping groove (131) is formed in the outer edge of the top of the rotating seat (13), a clamping block (143) is arranged at the bottom of the mounting plate (14) in a protruding mode, and the clamping groove (131) and the clamping block (143) are fixed in a matched mode.
6. The polishing device of a semiconductor wafer material according to claim 5, wherein four clamping grooves (131) are formed, the four clamping grooves (131) are arranged in an annular array with a center of a circle of the rotating base (13) as a center, the four clamping blocks (143) are arranged in an annular array with the center of the circle of the mounting plate (14) as the center, and the four clamping blocks (143) are arranged in the annular array with the center of the circle of the mounting plate (14) as the center.
7. The polishing device of a semiconductor wafer material as set forth in claim 5, wherein the clamping groove (131) comprises a through hole for the clamping block (143) to pass through and a chute for the clamping block (143) to slide and clamp, and the clamping block (143) is inverted T-shaped as a whole.
8. The polishing device for semiconductor wafer materials according to claim 1, wherein the vacuum negative pressure rotating module (7) comprises a hollow shaft motor (71), the sucker (8) is arranged at the bottom machine shaft end of the hollow shaft motor (71), a negative pressure rotating connector (72) is arranged at the top of the hollow shaft motor (71), one end of the negative pressure rotating connector (72) is communicated with a negative pressure pump, and an air path at the other end of the negative pressure rotating connector (72) is communicated with the sucker (8).
9. The polishing device of semiconductor wafer materials according to claim 1, wherein a mounting rod (16) is vertically arranged on one side edge of the top of the carrying table (1) corresponding to the first mounting table (10), a liquid spraying nozzle (21) is hinged to one end of the mounting rod (16) facing the first mounting table (10), the mounting rod (16) is communicated with the liquid spraying nozzle (21) through a conducting pipe (22), a lifting cavity is vertically formed on the outer side edge of the mounting rod (16), and an auxiliary liquid spraying nozzle (21) is arranged in the lifting cavity to adjust a lifting assembly (17).
10. The polishing device of a semiconductor wafer material according to claim 9, wherein the lifting assembly (17) comprises a rotating rod (18) vertically rotatably arranged in a lifting cavity, a sliding block (19) is sleeved on the rotating rod (18), the rotating rod (18) is in threaded fit with the sliding block (19), a rotary table (181) is fixed at the bottom of the rotating rod (18), a part of the rotary table (181) extends out of the mounting rod (16), and a supporting rod (20) is hinged between the sliding block (19) and the liquid spraying nozzle (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411642274.0A CN119159458A (en) | 2024-11-18 | 2024-11-18 | A semiconductor wafer material grinding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411642274.0A CN119159458A (en) | 2024-11-18 | 2024-11-18 | A semiconductor wafer material grinding device |
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| CN202411642274.0A Pending CN119159458A (en) | 2024-11-18 | 2024-11-18 | A semiconductor wafer material grinding device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159361A (en) * | 2008-07-18 | 2011-08-17 | 3M创新有限公司 | Polishing pad with floating elements and method of making and using same |
| CN103846770A (en) * | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | Polishing system and polishing method |
| KR20230077511A (en) * | 2021-11-25 | 2023-06-01 | 한미반도체 주식회사 | Strip grinding aparatus and grinding method thereof |
| CN117647466A (en) * | 2023-11-15 | 2024-03-05 | 上海理工大学 | Magnetorheological fluid viscosity measuring device under multiple magnetic fields |
| CN118809433A (en) * | 2024-08-30 | 2024-10-22 | 上海华力集成电路制造有限公司 | Semiconductor polishing equipment |
-
2024
- 2024-11-18 CN CN202411642274.0A patent/CN119159458A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159361A (en) * | 2008-07-18 | 2011-08-17 | 3M创新有限公司 | Polishing pad with floating elements and method of making and using same |
| CN103846770A (en) * | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | Polishing system and polishing method |
| KR20230077511A (en) * | 2021-11-25 | 2023-06-01 | 한미반도체 주식회사 | Strip grinding aparatus and grinding method thereof |
| CN117647466A (en) * | 2023-11-15 | 2024-03-05 | 上海理工大学 | Magnetorheological fluid viscosity measuring device under multiple magnetic fields |
| CN118809433A (en) * | 2024-08-30 | 2024-10-22 | 上海华力集成电路制造有限公司 | Semiconductor polishing equipment |
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