CN119153423A - Two-phase jet flow heat exchange structure and chip package - Google Patents
Two-phase jet flow heat exchange structure and chip package Download PDFInfo
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- CN119153423A CN119153423A CN202411634343.3A CN202411634343A CN119153423A CN 119153423 A CN119153423 A CN 119153423A CN 202411634343 A CN202411634343 A CN 202411634343A CN 119153423 A CN119153423 A CN 119153423A
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- 238000001816 cooling Methods 0.000 claims abstract description 73
- 238000001704 evaporation Methods 0.000 claims abstract description 44
- 230000008020 evaporation Effects 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 239000012809 cooling fluid Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 50
- 238000009413 insulation Methods 0.000 claims description 27
- 238000012546 transfer Methods 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 13
- 230000008859 change Effects 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 239000012530 fluid Substances 0.000 description 11
- 239000002826 coolant Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000005514 two-phase flow Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a two-phase jet flow heat exchange structure and chip packaging, wherein the two-phase jet flow heat exchange structure comprises a carrier and cooling fluid, the carrier is provided with a heat exchange end, a heat exchange chamber, a liquefaction chamber, an evaporation flow passage and a cooling flow passage, the heat exchange chamber is arranged at the heat exchange end, the liquefaction chamber is arranged above the heat exchange chamber at intervals, the evaporation flow passage is communicated with the upper end of the heat exchange chamber and the liquefaction chamber, the cooling flow passage is communicated with the heat exchange chamber and the liquefaction chamber, the cooling fluid circularly flows between the heat exchange chamber and the liquefaction chamber, and can absorb heat and gasify in the heat exchange chamber and dissipate heat and liquefy in the liquefaction chamber. Compared with the traditional air convection cooling mode, the heat transfer coefficient of the scheme is generally higher, the more uniform surface cooling can be realized, local hot spots are avoided, the scheme has better stability and reliability, the efficient heat transfer can be realized on a unit area through a phase change process, and the heat dissipation requirement of increasingly highly integrated electronic chips is met.
Description
Technical Field
The invention relates to the technical field of electronic chip cooling, in particular to a two-phase jet flow heat exchange structure and chip packaging.
Background
The performance of the electronic component is very sensitive along with the temperature change, the service life of the electronic component is reduced by half every 10 ℃ when the electronic component is increased, and the reliability of the electronic component is reduced by 5% every 1 ℃ when the electronic component is increased by 70 ℃ to 80 ℃. In the conventional cooling methods, such as natural convection and forced air cooling, they are widely used in the field of electronic components.
For example, patent CN215299235U discloses a chip heat dissipating device, which comprises a PCB board, a chip, heat conducting silica gel, a heat dissipating shell, a fan and a temperature sensor, wherein the heat conducting silica gel is arranged on the upper surface of the chip, and heat dissipating fins are arranged on the heat dissipating shell, so that heat is radiated into the outside air through heat exchange of the heat conducting silica gel and the heat dissipating fins to achieve the effect of passive heat dissipation, and the heat dissipating fan can be started to be turned into active heat dissipation from passive heat dissipation, thereby improving the heat dissipating efficiency.
However, with the rapid development of the electronic industry, electronic chips are developed toward high integration, micro-size, high sensitivity, and versatility, and micro-scale electronic devices and high integrated circuits are widely used. According to Moore's law, the crystal density on an integrated circuit doubles and the performance doubles every 18 months. The increase of the crystal density in the electronic element inevitably leads to the continuous increase of the power and heat flux density required by the electronic element, the heating power is also continuously increased, the heat conductivity coefficient of air is smaller, and the heat dissipation requirement of the increasingly high-integration electronic chip is difficult to meet.
Disclosure of Invention
The invention aims to overcome the technical defects, provides a two-phase jet flow heat exchange structure and a chip package, and solves the technical problem that the air heat dissipation in the prior art is difficult to meet the heat dissipation requirement of an increasingly high-integration electronic chip.
In order to achieve the technical purpose, the invention adopts the following technical scheme:
In a first aspect, the present invention provides a two-phase jet heat exchange structure comprising:
The carrier is provided with a heat exchange end used for contacting a heat source, and is provided with a heat exchange chamber, a liquefaction chamber, an evaporation flow passage and a cooling flow passage, wherein the heat exchange chamber is positioned at the heat exchange end, the liquefaction chamber is arranged above the heat exchange chamber at intervals, the evaporation flow passage is communicated with the upper end of the heat exchange chamber and the liquefaction chamber, the cooling flow passage is communicated with the heat exchange chamber and the liquefaction chamber, and
The cooling fluid circularly flows between the heat exchange chamber and the liquefaction chamber, can absorb heat and gasify in the heat exchange chamber, and radiates heat and liquefies in the liquefaction chamber.
In one embodiment, the cooling flow channel comprises a liquid inlet section, a connecting section and a liquid outlet section which are sequentially connected along the direction close to the heat exchange end, the upper end of the liquid inlet section is communicated with the liquefaction chamber, the lower end of the liquid outlet section is communicated with the heat exchange chamber, the inner diameter of the liquid outlet section is smaller than that of the liquid inlet section, and the connecting section is in tapered arrangement along the direction close to the liquid outlet section.
In one embodiment, the bottom wall of the heat exchange chamber is provided with a heat dissipation groove, and one end of the cooling flow passage, which is communicated with the heat exchange chamber, extends into the heat dissipation groove.
In one embodiment, the heat exchange end is further provided with a micro-channel communicated with the heat exchange chamber.
In one embodiment, the carrier is further provided with a heat insulation cavity between the heat exchange cavity and the liquefaction cavity, and a heat insulation layer is arranged on the upper side of the inner wall of the heat exchange cavity.
In one embodiment, the cooling flow channel and the evaporating flow channel are respectively arranged in the heat insulation cavity in a penetrating mode, and a first heat insulation plate is arranged on the part, located in the heat insulation cavity, of the evaporating flow channel in a surrounding mode.
In one embodiment, the evaporation flow channel comprises a steam chamber, an evaporation pipeline and a circulation pipeline, wherein the steam chamber is positioned between the liquefaction chamber and the heat exchange chamber, the evaporation pipeline is communicated with the upper end of the heat exchange chamber and the steam chamber, and the circulation pipeline is communicated with the upper end of the liquefaction chamber and the steam chamber.
In one embodiment, the cooling runner penetrates through the steam chamber, and a second heat insulation plate is arranged on the part of the cooling runner, which is located in the steam chamber, in a surrounding mode.
In one embodiment, the cooling flow channels and the evaporating flow channels are respectively provided with a plurality of cooling flow channels and a plurality of evaporating flow channels, which are sequentially and alternately arranged along the horizontal direction.
In a second aspect, the present invention also provides a chip package, including a two-phase fluidic heat exchange structure as described in any one of the above.
Compared with the prior art, in the two-phase jet flow heat exchange structure provided by the invention, the heat exchange end at the lower end of the carrier is contacted with the heat source of the chip, the heat exchange end is provided with the heat exchange chamber, and the liquefaction chamber is arranged above the heat exchange chamber. The liquid in the liquefaction chamber can flow from the cold night runner to the heat exchange chamber under the driving of the dead weight, and the liquid has a certain speed to form jet flow when moving downwards to the heat exchange chamber and impact on the inner wall of the heat exchange chamber. When the liquid is impacted on the inner wall of the heat exchange chamber, the heat of the heat source transferred by the heat exchange end is absorbed to dissipate heat of the heat source, and the gasified fluid can be discharged from the evaporation flow passage to the liquefaction chamber to take away the heat and circulate to the liquefaction chamber, and the gasified fluid is subjected to heat dissipation and liquefaction in the liquefaction chamber and is circulated and conveyed to the heat exchange chamber again to restart the cooling process, so that efficient heat transfer is realized on unit area through the phase change process, and the heat dissipation requirement of increasingly highly integrated electronic chips is met.
Drawings
FIG. 1 is a schematic diagram of a two-phase jet heat exchange structure provided by an embodiment of the present invention;
FIG. 2 is a cross-sectional view of A-A of the two-phase jet heat exchange structure of FIG. 1;
FIG. 3 is a schematic diagram of the operation of the two-phase jet heat exchange structure of FIG. 1;
FIG. 4 is a schematic view of the cooling flow channel of FIG. 2;
FIG. 5 is a partial schematic view of the two-phase jet heat exchange structure of FIG. 2;
fig. 6 is a temperature comparison diagram of the two-phase jet heat exchange structure of fig. 1 and the two-phase jet heat exchange structure of fig. 1 without being provided in the chip package.
Reference numerals illustrate:
1. The heat-insulating device comprises a carrier, a heat exchange chamber, a 1b, a liquefaction chamber, a 1c, a heat insulation chamber, a 1d, a heat dissipation groove, 11, a heat exchange end, 2, an evaporation runner, 21, an evaporation pipeline, 22, a steam chamber, 23, a circulation pipeline, 3, a cooling runner, 31, a liquid inlet section, 32, a connecting section, 33, a liquid outlet section, 4, a heat insulation layer, 5, a first heat insulation plate, 6, a second heat insulation plate and 7, and a heat source.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In order to solve the technical problem that air heat dissipation in the prior art is difficult to meet the heat dissipation requirement of increasingly high-integration electronic chips, the invention provides a two-phase jet flow heat exchange structure which can realize relatively uniform surface cooling, avoid local hot spots, has relatively good stability and reliability, realizes high-efficiency heat transfer on a unit area through a phase change process and meets the heat dissipation requirement of increasingly high-integration electronic chips.
It should be noted that, the two-phase jet heat exchange structure of the present invention is used for, but not limited to, chip packaging, etc., and for convenience of description, in the present invention, only the application of the two-phase jet heat exchange structure to chip packaging is taken as an example for description, and the principle of the application of the two-phase jet heat exchange structure to other types of devices is substantially the same as the principle of the application to chip packaging, and is not described in detail herein.
Referring to fig. 1 to 3, fig. 1 to 3 are schematic structural diagrams of a two-phase jet heat exchange structure according to an embodiment of the invention, wherein the two-phase jet heat exchange structure comprises a carrier 1 and a cooling fluid, the carrier 1 is provided with a heat exchange end 11 for contacting a heat source 7, and is provided with a heat exchange chamber 1a, a liquefaction chamber 1b, an evaporation flow channel 2 and a cooling flow channel 3, the heat exchange chamber 1a is positioned at the heat exchange end 11, the liquefaction chamber 1b is arranged above the heat exchange chamber 1a at intervals, the evaporation flow channel 2 is communicated with the upper end of the heat exchange chamber 1a and the liquefaction chamber 1b, the cooling flow channel 3 is communicated with the heat exchange chamber 1a and the liquefaction chamber 1b, and the cooling fluid circularly flows between the heat exchange chamber 1a and the liquefaction chamber 1b and can absorb heat and gasify in the heat exchange chamber 1a and radiate and liquefy in the liquefaction chamber 1 b. Specifically, in this embodiment, the heat exchange end 11 is located at the lower end of the carrier 1.
In the two-phase jet flow heat exchange structure provided by the invention, a heat exchange end 11 positioned at the lower end of a carrier 1 is in contact with a heat source 7 of a chip, a heat exchange chamber 1a is arranged at the heat exchange end 11, and a liquefaction chamber 1b is arranged above the heat exchange chamber 1 a. Therefore, the liquid in the liquefaction chamber 1b can flow into the heat exchange chamber 1a from the cold night runner under the driving of the dead weight, and the liquid has a certain speed to form jet flow when moving downwards into the heat exchange chamber 1a and impact on the inner wall of the heat exchange chamber 1a, and the jet flow impact can destroy a boundary layer and increase the heat transfer efficiency of a cooling surface, so that compared with the traditional air convection cooling mode, the heat transfer coefficient is generally higher, more uniform surface cooling can be realized, local hot spots are avoided, and the heat exchange device has better stability and reliability. When the liquid is impacted on the inner wall of the heat exchange chamber 1a, the heat of the heat source 7 transferred by the heat exchange end 11 is absorbed to dissipate heat of the heat source 7, the gasified fluid is discharged from the evaporation flow channel 2 to the liquefaction chamber 1b to take away the heat and circulated into the liquefaction chamber 1b, the gasified fluid is cooled and liquefied in the liquefaction chamber 1b and circulated again to the heat exchange chamber 1a, and the cooling process is restarted, so that efficient heat transfer is realized on unit area through the phase change process, and the heat dissipation requirement of increasingly high-integration electronic chips is met.
It will be appreciated that in this embodiment, when the chip generates heat, the liquid is heated to boiling, the generated vapor takes away the heat, and the vapor is subsequently condensed and recycled to restart the cooling process, i.e. by using the simultaneous presence of liquid and gas (typically liquid coolant and vapor) by a two-phase cooling technique, efficient heat transfer is achieved per unit area by a phase change process (e.g. boiling or condensing). Compared with single-phase fluid, the two-phase flow cooling can remarkably improve the heat transfer coefficient, so that higher heat load processing capacity is realized under the same size and working condition. Due to the nature of the phase change process, two-phase flow cooling can effectively reduce the temperature gradient across the hot surface, thereby achieving a more uniform temperature distribution, which is critical to reducing thermal stress, improving system life and performance stability.
In one embodiment, referring to fig. 4, the cooling flow channel 3 includes a liquid inlet section 31, a connecting section 32 and a liquid outlet section 33 connected in sequence along the direction approaching the heat exchange end 11, the upper end of the liquid inlet section 31 is communicated with the liquefaction chamber 1b, the lower end of the liquid outlet section 33 is communicated with the heat exchange chamber 1a, the inner diameter of the liquid outlet section is smaller than that of the liquid inlet section 31, and the connecting section 32 is tapered along the direction approaching the liquid outlet section 33.
In this embodiment, in the present embodiment, the cooling flow channel 3 is configured as the liquid inlet section 31, the connecting section 32 and the liquid outlet section 33 as described above, so that the flow cross-sectional area of the liquid decreases in the process of moving down along the cooling flow channel 3, so as to accelerate the flow rate of the liquid, improve the impact capability of the liquid on the inner wall of the heat exchange chamber 1a, enable the liquid to break the boundary layer at the moment of impacting the inner wall of the heat exchange chamber 1a, and increase the heat transfer efficiency of the cooling surface.
In one embodiment, referring to fig. 5, a bottom wall of the heat exchange chamber 1a is provided with a heat dissipation groove 1d, and one end of the cooling flow channel 3, which is communicated with the heat exchange chamber 1a, extends into the heat dissipation groove 1 d.
In this embodiment, a heat dissipation groove 1d is further disposed on the bottom wall of the heat exchange chamber 1a to enlarge the surface area of the bottom wall of the heat exchange chamber 1a, thereby enlarging the contact area between the liquid and the bottom wall of the heat exchange chamber, and improving the heat exchange capability. Specifically, in this scheme, still stretch into cooling runner 3 in the heat dissipation groove 1d, and evaporation runner 2 is located the upper end of heat transfer cavity 1a, the gas-liquid separation of being convenient for in the self-evaporation runner 2 that steam can be better is gone into liquefaction cavity 1 b.
In one embodiment, the heat exchange end 11 is further provided with a micro channel communicating with the heat exchange chamber 1 a.
In this embodiment, the combination of microchannels, which provide a high surface area density, helps to transfer heat rapidly from the heat source 7 to the fluid, and jet cooling, which effectively removes heat from the fluid, allows for a higher heat transfer efficiency. The micro-channel has compact structure, and the whole system can be designed in a lightweight way when being used in an environment with limited space.
It should be noted that, in the technical principle of the present solution, the "two-phase impingement jet cooling" technology is to directly construct the micro-channel filled with the liquid inside the microchip package, when the chip body generates heat, the liquid in the carrier 1 is heated to boil, the generated steam takes away the heat, and then the steam is condensed and circulated again, and the cooling process is restarted. Wherein, the structure of the micro-channel can effectively increase the surface area, thereby improving the heat exchange rate. In jet impingement cooling, these structures may more effectively enhance the contact of the coolant with the hot surface, thereby enhancing the cooling effect. In addition, the structure of the micro-channels can also adjust the flow characteristics of the fluid on the surface, and change the speed, the turbulence degree and the flow direction, so as to optimize the heat transfer and cooling effect of the coolant. Such a design is particularly important for improving jet impingement cooling because it increases the residence time and heat transfer of the coolant on the chilled surface.
In addition, the heat dissipation technology is not just simply punching holes, and comprises a micro-structure design of multi-layer micro-nano processing, so that a very complex multi-layer gas-liquid transportation distribution system is formed, and the design can not only efficiently dissipate heat, but also reduce liquid flow resistance. The specific construction and principles of the micro-channels are prior art and are not described in detail herein.
In one embodiment, the carrier 1 is further provided with a heat insulation chamber 1c between the heat exchange chamber 1a and the liquefaction chamber 1b, and the upper side of the inner wall of the heat exchange chamber 1a is provided with a heat insulation layer 4.
In this embodiment, a heat insulation cavity 1c is further disposed in the heat exchange cavity 1a and the liquefaction cavity 1b, and a heat insulation layer 4 is correspondingly disposed to block heat in the heat exchange cavity 1a from being transferred into the liquefaction cavity 1b, so as to ensure that the liquefaction cavity 1b is in a relatively low-temperature environment, and enable the gasification fluid to be rapidly liquefied when entering the liquefaction cavity 1b.
In one embodiment, the cooling flow channel 3 and the evaporating flow channel 2 are respectively arranged in the heat insulation cavity 1c in a penetrating manner, and a first heat insulation plate 5 is arranged on the part of the evaporating flow channel 2 located in the heat insulation cavity 1c in a surrounding manner.
In this embodiment, the cooling flow channel 3 and the evaporating flow channel 2 are respectively penetrated by the heat insulation cavity 1c, so that the overall structure is relatively compact, and the integration is convenient to realize. In addition, a first heat insulation plate 5 is arranged at the periphery of the part of the evaporation flow passage 2 corresponding to the heat insulation cavity 1c so as to prevent heat in the evaporation flow passage 2 from being dissipated outwards and radiate into the cooling flow passage 3. In one embodiment, the walls of the cooling flow channel 3 and the evaporating flow channel 2 are made of heat insulating materials.
In one embodiment, the evaporation flow channel 2 includes a vapor chamber 22, an evaporation pipe 21 and a circulation pipe 23, the vapor chamber 22 is located between the liquefaction chamber 1b and the heat exchange chamber 1a, the evaporation pipe 21 communicates the upper end of the heat exchange chamber 1a with the vapor chamber 22, and the circulation pipe 23 communicates the upper end of the liquefaction chamber 1b with the vapor chamber 22.
In this embodiment, the evaporation flow channel 2 is configured in the form of a steam chamber 22, an evaporation pipeline 21 and a circulation pipeline 23, so that the circulation stroke of steam is prolonged, the steam can dissipate heat gradually in the process of flowing to the liquefaction chamber 1b, and is condensed into liquid in the liquefaction chamber 1b, so as to realize stable gas-liquid circulation. In this embodiment, the circulation pipe 23 is connected to the upper end of the liquefaction chamber 1b, so that the liquid in the liquefaction chamber 1b is prevented from flowing back to the steam chamber 22. In one embodiment, the circulation pipe 23 is wrapped around the carrier 1, so that the ends of the circulation pipe, which are connected to the vapor chamber 22 and the liquefaction chamber 1b, are respectively located at two opposite ends of the carrier 1 in the horizontal direction.
In one embodiment, the cooling flow channel 3 is arranged through the steam chamber 22, and the part of the cooling flow channel positioned in the steam chamber 22 is surrounded by the second heat insulation plate 6.
In this embodiment, the liquid inlet section 31 of the cooling flow channel 3 is further disposed through the steam chamber 22, and the second heat insulation board 6 is disposed around the portion of the liquid inlet section 31 located in the steam chamber 22, so as to avoid heat exchange between the liquid and the steam in the cooling flow channel 3 and reduce the heat exchange efficiency in the heat exchange chamber 1 a.
In one embodiment, a plurality of cooling channels 3 and evaporating channels 2 are respectively provided, and the plurality of cooling channels 3 and evaporating channels 2 are alternately arranged in sequence along the horizontal direction.
In this embodiment, the cooling flow channels 3 and the evaporating flow channels 2 are respectively provided in plurality, and the cooling flow channels 3 and the evaporating flow channels 2 are sequentially and alternately provided, so that the heat dissipation capability is improved and the structure can dissipate heat uniformly. Specifically, in the present embodiment, the cooling flow channels 3 and the evaporation flow channels 2 are alternately arranged in order along the width direction and the length direction of the carrier 1, respectively.
In addition, the invention also provides a chip package, which comprises the two-phase jet flow heat exchange structure. It should be noted that, the detailed structure of the two-phase jet flow heat exchange structure of the chip package may refer to the embodiment of the two-phase jet flow heat exchange structure and will not be described herein, and because the two-phase jet flow heat exchange structure is used in the chip package of the present invention, the embodiment of the chip package of the present invention includes all the technical solutions of all the embodiments of the two-phase jet flow heat exchange structure, and the achieved technical effects are also completely the same and will not be described herein.
For a better understanding of the present invention, the following details of the technical solution of the present invention are described with reference to fig. 1 to 6:
In the scheme, the two-phase cooling technology realizes high-efficiency heat transfer through the phase change process of liquid and gas, obviously improves the heat transfer coefficient and realizes higher heat load processing capacity. The micro-channel is combined with the jet cooling technology, the high surface area density of the micro-channel is utilized for fast heat transfer, the jet cooling is efficient for taking away heat, and the higher heat transfer efficiency is realized. The micro-channel has compact structure, is suitable for space-limited environment, and can be used for designing a system in a lightweight manner. The jet impact cooling technology utilizes high-speed fluid to impact the heating surface, realizes high heat transfer coefficient and uniform cooling, avoids local hot spots, improves the stability and reliability of equipment, and has high-efficiency heat transfer and accurate local cooling. The micro structure enhances jet impact cooling effect, increases the surface area, enhances the contact of the coolant with the hot surface, adjusts the fluid flow characteristic, prolongs the residence time of the coolant and heat transfer, optimizes the cooling effect and improves the heat exchange efficiency. It should be noted that, in fig. 6, the temperature of the chip package at the boundary line is compared with the temperature of the chip package at the boundary line, wherein the distance from the boundary line is larger and the distance from the heat source of the chip is closer, the comparison group is the temperature distribution of the chip package without the two-phase jet flow heat exchange structure in the present solution, and the invention group is the temperature distribution of the chip package with the two-phase jet flow heat exchange structure in the present solution.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any other corresponding changes and modifications made in accordance with the technical idea of the present invention shall be included in the scope of the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411634343.3A CN119153423B (en) | 2024-11-15 | 2024-11-15 | A two-phase jet heat exchange structure and chip packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411634343.3A CN119153423B (en) | 2024-11-15 | 2024-11-15 | A two-phase jet heat exchange structure and chip packaging |
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| Publication Number | Publication Date |
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| CN119153423A true CN119153423A (en) | 2024-12-17 |
| CN119153423B CN119153423B (en) | 2025-03-18 |
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| WO2006088247A1 (en) * | 2005-02-18 | 2006-08-24 | Showa Denko K.K. | Heat exchanger |
| US20120111538A1 (en) * | 2010-11-09 | 2012-05-10 | Wang Ching-Tu | Heat dissipation structure |
| CN112118705A (en) * | 2019-06-19 | 2020-12-22 | 百度（美国）有限责任公司 | Enhanced cooling device |
| CN114740962A (en) * | 2022-03-31 | 2022-07-12 | 四川农业大学 | Gravity backflow cooling device utilizing micro-boiling of bubbles |
| CN117476573A (en) * | 2023-11-13 | 2024-01-30 | 西安交通大学 | A manifold-microchannel cold plate for power chip heat dissipation and heat dissipation method |
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2024
- 2024-11-15 CN CN202411634343.3A patent/CN119153423B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006088247A1 (en) * | 2005-02-18 | 2006-08-24 | Showa Denko K.K. | Heat exchanger |
| US20120111538A1 (en) * | 2010-11-09 | 2012-05-10 | Wang Ching-Tu | Heat dissipation structure |
| CN112118705A (en) * | 2019-06-19 | 2020-12-22 | 百度（美国）有限责任公司 | Enhanced cooling device |
| CN114740962A (en) * | 2022-03-31 | 2022-07-12 | 四川农业大学 | Gravity backflow cooling device utilizing micro-boiling of bubbles |
| CN117476573A (en) * | 2023-11-13 | 2024-01-30 | 西安交通大学 | A manifold-microchannel cold plate for power chip heat dissipation and heat dissipation method |
Non-Patent Citations (1)
| Title |
|---|
| 雷俊禧;朱冬生;王长宏;胡韩莹;: "电子芯片液体冷却技术研究进展", 科学技术与工程, no. 15, 1 August 2008 (2008-08-01) * |
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| CN119153423B (en) | 2025-03-18 |
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