CN119072084A - A microchannel heat sink structure with upper and lower heterogeneity - Google Patents

Abstract

The invention belongs to the technical field of heat exchanger heat dissipation and micromachining, and particularly relates to an up-down heterogeneous micro-channel heat radiator structure which comprises a straight channel plate and a pillar fin flow channel plate arranged opposite to the straight channel plate, wherein a plurality of straight channels are arranged on the straight channel plate, a plurality of pillar fins are arranged on the pillar fin flow channel plate, a cooling cavity is formed between the straight channel plate and the pillar fin flow channel plate when the straight channel plate and the pillar fin flow channel plate are aligned, one side of the cooling cavity is provided with a fluid inlet, and the other side of the cooling cavity is provided with a fluid outlet. According to the invention, through the design of the upper heterogeneous micro-flow channels and the lower heterogeneous micro-flow channels, the heat exchange efficiency is improved, the heat transfer performance in the micro-flow channels is enhanced, and the heat radiator is prepared by using silicon carbide, so that the service life of an electronic system can be prolonged.

Description

Micro-channel radiator structure with upper and lower isomerism

Technical Field

The invention belongs to the technical field of heat dissipation and micromachining of heat exchangers, and particularly relates to a micro-channel radiator structure with upper and lower isomerism.

Background

With the trend of high power and high performance of electrical chips in electronic systems, optical chips in semiconductor lasers, and laser crystals in solid state lasers, thermal management of electronic systems and lasers has become a great challenge. If the temperature of the electrical chip, optical chip or laser crystal is too high, it can affect the service life of the electronic system and laser, and seriously damage the electronic system and laser.

Therefore, the realization of higher heat dissipation efficiency has positive influence on the electric chip, the optical chip and the laser crystal, and has great significance on the reliability of electronic systems and laser applications. However, conventional cooling techniques such as natural convection and contact heating do not allow for efficient heat dissipation from high power, high integration electronic systems and lasers.

The micro-channel radiator has larger heat transfer area and heat transfer coefficient, and can realize high-efficiency heat dissipation of high-power and high-integration electronic systems and lasers. However, the temperature rise of the coolant in the flow direction affects the temperature uniformity of the chip and the crystal in the conventional straight micro flow channel, thereby affecting the use of the electronic system and the laser.

Disclosure of Invention

Aiming at various defects in the prior art, the inventor researches and designs a micro-channel radiator structure with upper and lower isomerism in long-term practice, which is used for solving the difficult problem of temperature uniformity of a chip and a laser caused by uneven dispersion of cooling liquid in a heat exchanger and prolonging the service life of an electronic system.

In order to achieve the above purpose, the present invention provides the following technical solutions:

A micro-channel radiator structure with upper and lower heterogeneous structures comprises a straight channel plate and a pillar fin channel plate which is aligned with the straight channel plate. The straight flow channel plate is provided with a plurality of straight flow channels, and the pillar fin flow channel plate is provided with a plurality of pillar fins. The plurality of straight flow channels are distributed in an array along the width direction of the straight flow channel plate, and the intervals are equal. A direct current channel is formed between every two direct current channels. The plurality of pillar fins are distributed in an array along a width direction of the pillar fin runner plate.

Each row of straight channels is aligned with a corresponding row of fins on the fin flow field plate in the width direction of the flow field plate. And longitudinal pillar fin channels are formed between every two rows of pillar fins in the width direction of the pillar fin runner plate. And a transverse pillar fin channel is formed between every two rows of pillar fins along the length direction of the pillar fin flow channel plate. A cooling cavity is formed among the longitudinal pillar fin channels, the transverse pillar fin channels and the direct current channels. One side of the cooling cavity is a fluid inlet, and the other side of the cooling cavity, which is far away from the fluid inlet, is a fluid outlet.

Further, the plurality of pillar fins includes a plurality of rectangular parallelepiped pillar fins and a plurality of cylindrical pillar fins or prismatic pillar fins.

Further, a plurality of cuboid pillar fins are arranged on two sides of the pillar fin runner plate in the length direction, and are uniformly distributed along the length direction of the pillar fin runner plate, and the intervals are equal.

Further, a plurality of cylindrical pillar fins are arranged between the two rows of the rectangular pillar fins, and the plurality of cylindrical pillar fins are arrayed along the length direction of the pillar fin runner plate.

Further, two adjacent columns of the cylindrical pillar fins are aligned, and the rectangular pillar fin is aligned with one column of the cylindrical pillar fin adjacent to the rectangular pillar fin.

Further, the cylindrical pillar fin on the pillar fin runner plate is identical to the rectangular pillar fin in height, and meanwhile, the direct current channel depth of the direct current channel plate is identical to the pillar fin of the pillar fin runner plate in height.

Further, a plurality of prismatic pillar fins are arranged between the two rows of the rectangular pillar fins, and the prismatic pillar fins are arrayed along the length direction of the pillar fin runner plate.

Further, two adjacent columns of the prismatic pillar fins are aligned, and the cuboid pillar fin is aligned with one adjacent column of the prismatic pillar fin.

Further, the direct current channel plate and the pillar fin channel plate are rectangular and equal in size.

Further, the straight flow channel plate, the pillar fin flow channel plate, the straight flow channel and the pillar fin are all made of silicon carbide. The beneficial effects of the invention are as follows:

1. The straight flow channel plate is provided with a plurality of straight flow channels, so that smaller hydraulic diameter can be ensured, thermal resistance is effectively reduced, heat transfer coefficient is enhanced, heat transfer characteristics are improved, more flow channels can be allowed to be designed by adopting the straight flow channel structure under the same-size heat sink structure, heat transfer surface area is increased, heat exchange efficiency is improved, and therefore the temperature of the laser is obviously reduced.

2. The pillar fin flow channel plate is provided with a plurality of pillar fins, so that the flow resistance of the cooling liquid in the cavity is greatly improved, the flow speed of the whole flow is gradually reduced, and the heat transfer performance in the micro-channel is enhanced. Meanwhile, the existence of the pillar fin enlarges the heat transfer area of the fluid medium and the micro-flow channel, so that the micro-flow channel with the pillar fin structure has large heat transfer area and good heat transfer performance.

Drawings

FIG. 1 is a schematic diagram of a prior art microchannel heat exchanger;

FIG. 2 is a schematic diagram of the structure of the present invention;

FIG. 3 is an exploded view of the present invention;

FIG. 4 is a schematic diagram of a fin runner plate of the present invention;

FIG. 5 is a top view of a fin field plate of the present invention;

FIG. 6 is an enlarged schematic view of the invention at A;

FIG. 7 is an enlarged schematic view of the invention at B;

FIG. 8 is a schematic view of the structure of the present invention with the straight flow field plate disposed below;

FIG. 9 is an exploded view of the present invention with the sprue plate disposed therebelow;

FIG. 10 is a schematic diagram of another embodiment of a fin field plate of the present invention;

FIG. 11 is an enlarged schematic view of the invention at C;

Fig. 12 is an enlarged schematic view of the invention at D.

In the accompanying drawings:

A 1-straight flow channel plate, a 2-pillar fin flow channel plate, 3-pillar fins, a 4-fluid inlet and a 5-fluid outlet.

Detailed Description

In order to enable those skilled in the art to better understand the present application, the following description will make clear and complete descriptions of the technical solutions according to the embodiments of the present application with reference to the accompanying drawings. It will be apparent that the described embodiments are merely some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the application herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present application and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present application will be understood by those of ordinary skill in the art according to the specific circumstances. In addition, the term "plurality" shall mean two as well as more than two. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.

The invention will be further described with reference to the drawings and preferred embodiments.

Example 1:

Referring to fig. 2-9, a micro-channel radiator structure with heterogeneous top and bottom in this embodiment includes a straight channel plate 1 and a pillar fin runner plate 2 aligned with the straight channel plate 1. The straight flow channel plate 1 is provided with a plurality of straight flow channels which are arranged in an array manner, and the pillar fin flow channel plate 2 is provided with a plurality of pillar fins 3 which are arranged in an array manner. The dc runner plate 1 of the present embodiment may be disposed above the fin runner plate 2, or may be disposed below the fin runner plate 2. Therefore, the dc link plate 1 is within the scope of the present embodiment, regardless of whether it is disposed above or below.

Referring to fig. 3 and 9, a plurality of straight flow channels are distributed in an array along the width direction of the straight flow channel plate 1, the intervals are equal, and a straight flow channel is formed between every two straight flow channels.

Referring to fig. 3 to 9, the pillar fin 3 of the present embodiment may be a cylinder or a prism. The heat dissipation effects of the different pillar fins 3 will also be different, and in this regard, the rectangular dc-channel straight-channel plate 1 and the pillar fin runner plates 2 of the four pillar fins 3 with different shapes are established by three-dimensional software. The pillar fin 3 is respectively a cylinder, an inclined cylinder, a cuboid and an inclined cuboid, and the variation of the highest temperature of the heat source along with the mass flow of the inlet under different micro-channel structures is compared through simulation.

When the pillar fin 3 of the pillar fin runner plate 2 is cylindrical, the overall speed distribution of the pillar fin runner plate is more uniform relative to other structures under the same inlet flow, and along with the improvement of the inlet mass flow, the increase degree of the convective heat transfer coefficient and the knoop number of the cylindrical pillar fin runner structure is higher, and the total thermal resistance is smaller than that of other structures, so that the overall heat transfer effect is better than that of other pillar fin runner structures with other shapes. Under different micro-channel inlet flows, the flow pressure drop and friction factor of the cylindrical pillar fin micro-channel structure are lower than those of other pillar fin micro-channel structures.

Therefore, considering comprehensively, the pillar fin runner plate 2 of the embodiment adopts a cylindrical pillar fin runner structure, so as to achieve a better comprehensive heat dissipation effect with smaller pressure loss.

Referring to fig. 4 to 7, the plurality of pillar fins 3 of the present embodiment include a plurality of rectangular parallelepiped pillar fins and a plurality of cylindrical pillar fins. Specifically, a plurality of cuboid pillar fins are arranged on two sides of the pillar fin flow channel plate 2 in the length direction, and are uniformly distributed along the length direction of the pillar fin flow channel plate 2, and the intervals are equal. A plurality of cylindrical pillar fins are arranged between the two rows of cuboid pillar fins, and are arrayed along the length direction of the pillar fin runner plate 2. Two adjacent columns of cylindrical pillar fins are aligned, and the cuboid pillar fins are aligned with one adjacent column of cylindrical pillar fins.

In this embodiment, the sprue plate 1 and the fin runner plate 2 are rectangular and have equal dimensions, and the sprue plate 1 is provided with a plurality of sprue reinforcing heat exchange holes, and the fin runner plate 2 is provided with a plurality of fins 3 to increase turbulence. When the sprue plate 1 and the fin runner plate 2 are aligned, each column of sprue is aligned with a corresponding column of fins 3 on the fin runner plate 2 in the width direction of the sprue plate 1. Longitudinal pillar fin channels are formed between every two rows of pillar fins 3 along the width direction of the pillar fin flow channel plate 2, transverse pillar fin channels are formed between every two rows of pillar fins 3 along the length direction of the pillar fin flow channel plate 2, and cooling cavities are formed among the longitudinal pillar fin channels, the transverse pillar fin channels and the direct current channels.

One side of the cooling cavity is provided with a fluid inlet 4, cooling fluid flows into the radiator from the fluid inlet 4 to exchange heat for the chip, the other side of the cooling cavity, which is far away from the fluid inlet 4, is provided with a fluid outlet 5, and the cooling fluid flows out from the fluid outlet 5 after the heat exchange is completed.

Preferably, the cylindrical pillar fin on the pillar fin runner plate 2 is identical to the rectangular pillar fin in height, and at the same time, the straight runner depth of the straight runner plate 1 is identical to the height of the pillar fin 3 of the pillar fin runner plate 2.

In the selection of radiator materials, at present, three common materials for manufacturing heat sinks are copper, silicon and silicon carbide. The semiconductor material of silicon and silicon carbide has strong processability, can be etched or laser processed, can manufacture hundred-micrometer micro-channels, is limited by a manufacturing process, can only manufacture micro-channels with the width of 500um in a limited state, and has fewer heat sink channels of copper materials and poor heat dissipation effect compared with heat sinks of silicon or silicon carbide materials under the same size.

The thermal conductivity of silicon is about 0.21W/mK, while the thermal conductivity of silicon carbide is about 83.6W/mK. This means that the thermal conductivity of silicon carbide is about 400 times that of silicon. This significant difference provides silicon carbide with significant advantages in high temperature and high power applications because it more efficiently transfers heat from one part of the device to another, thereby improving the overall thermal management efficiency and stability of the device. Therefore, silicon carbide is selected to manufacture the micro-flow channel on the selection of materials. In this embodiment, the dc runner plate 1, the pillar fin runner plate 2, the dc runner and the pillar fin 3 are preferably made of silicon carbide.

Example 2:

Referring to fig. 10 to 12, this embodiment is the same as embodiment 1 except that the plurality of pillar fins 3 of this embodiment include a plurality of rectangular parallelepiped pillar fins and a plurality of prism pillar fins. Specifically, a plurality of cuboid pillar fins are arranged on two sides of the pillar fin flow channel plate 2 in the length direction, and are uniformly distributed along the length direction of the pillar fin flow channel plate 2, and the intervals are equal. A plurality of prismatic pillar fins are arranged between the two rows of cuboid pillar fins, and are arrayed along the length direction of the pillar fin runner plate 2. The prismatic pillar fins of two adjacent columns are aligned, and the cuboid pillar fin is aligned with the prismatic pillar fin of one adjacent column.

The prism pillar fin in this embodiment is perpendicular to the bottom surface of the pillar fin flow channel plate in the vertical direction, and in the horizontal direction, the prism may be set in this embodiment mode, or may be set by rotating at any angle, which is included in the protection scope of this embodiment.

The foregoing detailed description of the application has been presented for purposes of illustration and description, but is not intended to limit the scope of the application, i.e., the application is not limited to the details shown and described.

Claims (10)

1. The micro-channel radiator structure with the upper and lower isomerism comprises a straight-channel plate (1) and a pillar fin runner plate (2) which is aligned with the straight-channel plate (1), and is characterized in that a plurality of straight-channel plates are arranged on the straight-channel plate (1), and a plurality of pillar fins (3) are arranged on the pillar fin runner plate (2);

the plurality of straight flow channels are distributed in an array along the width direction of the straight flow channel plate (1) with equal intervals, and a direct flow channel is formed between every two straight flow channels;

The plurality of pillar fins (3) are distributed in an array along the width direction of the pillar fin flow channel plate (2);

Each row of straight flow channels is aligned with a corresponding column of pillar fins (3) on the pillar fin flow channel plate (2) in the width direction of the straight flow channel plate (1);

Longitudinal pillar fin channels are formed between every two rows of pillar fins (3) in the width direction of the pillar fin flow channel plate (2), and transverse pillar fin channels are formed between every two rows of pillar fins (3) in the length direction of the pillar fin flow channel plate (2);

A cooling cavity is formed among the longitudinal pillar fin channels, the transverse pillar fin channels and the direct current channels;

One side of the cooling cavity is provided with a fluid inlet (4), and the other side of the cooling cavity, which is far away from the fluid inlet (4), is provided with a fluid outlet (5).

2. The up-down heterogeneous micro flow channel heat sink structure according to claim 1, wherein the plurality of pillar fins (3) includes a plurality of rectangular parallelepiped pillar fins and a plurality of cylindrical pillar fins or prism pillar fins.

3. The up-down heterogeneous micro-channel radiator structure according to claim 2, wherein a plurality of cuboid fins are arranged along two sides of the fin runner plate (2) in the length direction, and the plurality of cuboid fins are uniformly distributed along the fin runner plate (2) in the length direction and have equal intervals.

4. The up-down heterogeneous micro flow channel radiator structure according to claim 3, wherein a plurality of cylindrical pillar fins are arranged between two rows of the rectangular pillar fins, and the plurality of cylindrical pillar fins are arrayed along the length direction of the pillar fin flow channel plate (2).

5. The up-down heterogeneous microchannel heat sink structure according to claim 4, wherein two adjacent columns of the cylindrical fins are aligned, and the rectangular parallelepiped fins are aligned with one of the adjacent columns of the cylindrical fins.

6. The up-down heterogeneous micro flow channel radiator structure according to claim 5, wherein the cylindrical pillar fin on the pillar fin flow channel plate (2) is identical to the rectangular pillar fin in height, and meanwhile, the direct flow channel depth of the direct flow channel plate (1) is identical to the pillar fin (3) of the pillar fin flow channel plate (2).

7. The up-down heterogeneous micro flow channel radiator structure according to claim 3, wherein a plurality of prismatic pillar fins are arranged between two rows of the rectangular pillar fins, and the prismatic pillar fins are arrayed along the length direction of the pillar fin flow channel plate (2).

8. The up-down heterogeneous microchannel heat sink structure according to claim 7, wherein two adjacent columns of the prismatic fins are aligned, and the rectangular parallelepiped fins are aligned with one of the adjacent columns of the prismatic fins.

9. The up-down heterogeneous micro-channel radiator structure according to claim 1, wherein the direct-current channel plate (1) and the pillar fin channel plate (2) are rectangular and have equal dimensions.

10. The up-down heterogeneous micro-channel heat radiator structure according to claim 7, wherein the direct-current channel plate (1), the pillar fin channel plate (2), the direct-current channel and the pillar fin (3) are all made of silicon carbide.