CN118174133B - Radiating block and radiating device - Google Patents

Abstract

The invention provides a radiating block and a radiating device, and relates to the technical field of lasers; a first converging cavity and a second converging cavity which are arranged at intervals along the up-down direction are arranged in the radiating block, and the first converging cavity and the second converging cavity are staggered in the up-down direction; the first opening is communicated with the first converging cavity, and the radiating block is also provided with a liquid inlet channel with one end opening communicated with the first converging cavity and the other end opening communicated with the surface of the radiating block; the second opening is communicated with the second converging cavity, one end opening of the radiating block is communicated with the second converging cavity, and the other end opening of the radiating block is communicated with the surface of the radiating block.

Description

Radiating block and radiating device

Technical Field

The invention relates to the technical field of lasers, in particular to a heat dissipation block and a heat dissipation device.

Background

In the existing laser, a plurality of chips which are arranged in an array are assembled on the radiating surface of the radiating device, the radiating device is internally provided with a cooling liquid flow channel, wherein the liquid inlet flow channel and the liquid outlet flow channel are positioned on the same layer, the heat transfer problem in the radiating device is obvious, namely, the cooling liquid in the liquid outlet flow channel which completes heat transfer transfers heat to the cooling liquid of the chips which do not act, so that the temperature of the cooling liquid flowing out from the liquid inlet flow channel is higher, and the heat transfer of the chips is influenced.

Disclosure of Invention

The invention aims to provide a radiating block and a radiating device, which are used for relieving the technical problem that a liquid inlet channel and a liquid return channel in the existing laser radiating block are arranged on the same layer, and cooling liquid is easy to generate heat transfer in a liquid inlet pipe.

In a first aspect, the invention provides a heat dissipation block, wherein a plurality of cooling areas are arranged on the upper surface of the heat dissipation block, and the cooling areas are provided with a first opening and a second opening;

A first converging cavity and a second converging cavity which are arranged at intervals along the up-down direction are arranged in the radiating block, and the first converging cavity and the second converging cavity are staggered in the up-down direction;

The first opening is communicated with the first converging cavity, and the radiating block is also provided with a liquid inlet channel with one end opening communicated with the first converging cavity and the other end opening communicated with the surface of the radiating block;

the second opening is communicated with the second converging cavity, one end opening of the radiating block is communicated with the second converging cavity, and the other end opening of the radiating block is communicated with the surface of the radiating block.

Further, the plurality of cooling areas are arranged in an array, cooling row groups are formed along the cooling areas distributed in the transverse direction of the array, and the same cooling row group shares a first converging cavity;

along the longitudinal direction of the array, there are at least two cooling rows.

Further, in any two cooling row groups, the flow Q1 of the cooling flow channel corresponding to the cooling row group with more bearing heat is used for bearing the flow Q2 of the cooling flow channel corresponding to the cooling row group with less bearing heat, and Q1 is larger than Q2.

Further, in any two cooling row groups, the cross section S1 of the first converging cavity corresponding to the cooling row group with more heat is carried, the cross section S2 of the first converging cavity corresponding to the cooling row group with less heat is carried, and S1 is larger than S2;

And/or, in any two cooling row groups, the cross section area S3 of the liquid inlet channel corresponding to the cooling row group with more bearing heat is larger than the cross section area S4 of the liquid inlet channel corresponding to the cooling row group with less bearing heat, and S3 is larger than S4.

Further, the heat dissipation block comprises a first cooling disc and a second cooling disc which are sequentially arranged along the up-down direction and are connected with each other, and the first cooling disc comprises a first surface and a second surface which face opposite to each other; the second cooling disc comprises a third surface and a fourth surface which face opposite to each other, and the third surface is attached to the second surface;

The cooling region is disposed on the first surface; the second surface is provided with a first converging groove extending along the array transversely, and the first converging groove and the third surface enclose the first converging cavity; the second surface is also provided with third openings which are in one-to-one correspondence with the second openings, and the third openings are communicated with the second openings;

The liquid inlet channel penetrates through the third surface and the fourth surface, and the upper port of the liquid inlet channel is communicated with the first confluence cavity; a second converging groove extending transversely along the array is arranged on the third surface, the second converging groove and the second surface enclose a second converging cavity, and the third opening is communicated with the second converging cavity; the liquid return channel is arranged on the second cooling disc;

The liquid inlet channel, the first converging cavity and the first opening are connected into a cooling flow channel; the second opening, the third opening, the second confluence cavity and the liquid return channel are connected into a backflow flow channel.

Further, at least one first cooling structure is arranged on the first surface, the first cooling structure is formed by two adjacent cooling row groups, wherein the two cooling row groups are respectively arranged into a first cooling row group and a second cooling row group, and the projection of a first converging cavity in the first cooling row group and a first converging cavity in the second cooling row group on the same horizontal reference plane is positioned between the projection of a second converging cavity in the first cooling row group and a second converging cavity in the second cooling row group on the horizontal reference plane.

Further, the first converging cavity in the first cooling row group is communicated with the first converging cavity in the second cooling row group into a whole.

Further, at least one second cooling structure is arranged on the first surface, the second cooling structure is formed by two adjacent cooling row groups, wherein the two cooling row groups are respectively arranged into a cooling row group III and a cooling row group IV, and the projection of a second converging cavity in the cooling row group III and a second converging cavity in the cooling row group IV on the same horizontal reference plane is positioned between the projection of a first converging cavity in the cooling row group III and a first converging cavity in the cooling row group IV on the horizontal reference plane;

and the second converging cavity in the third cooling row group is communicated with the second converging cavity in the fourth cooling row group into a whole.

Further, the heat dissipation block comprises a first cooling disc and a second cooling disc which are sequentially arranged along the up-down direction and are connected with each other, and the first cooling disc comprises a first surface and a second surface which face opposite to each other; the second cooling disc comprises a third surface and a fourth surface which face opposite to each other, and the third surface is attached to the second surface;

The second surface having a first sink extending transversely along the array; the first converging groove and the third surface enclose the first converging cavity; the second surface is also provided with third openings which are in one-to-one correspondence with the second openings, and the third openings are communicated with the second openings;

The liquid inlet channel penetrates through the third surface and the fourth surface, and the upper port of the liquid inlet channel is communicated with the first confluence cavity;

The second cooling disk is internally provided with the second converging cavity extending along the longitudinal direction of the array; the third surface is provided with a plurality of fourth openings which are distributed at intervals along the longitudinal direction of the array so as to avoid the first converging grooves; the fourth opening is respectively communicated with the second converging cavity and the third opening; the liquid return channel is arranged on the second cooling disc;

the liquid inlet channel, the first converging cavity and the first opening are connected into a cooling flow channel; the second opening, the third opening, the fourth opening, the second confluence cavity and the liquid return channel are connected into a backflow channel.

In a second aspect, the present invention provides a heat dissipating device, including the above heat dissipating block.

The invention has at least the following advantages or beneficial effects:

The upper surface of the radiating block is provided with a plurality of cooling areas, and the cooling areas are provided with a first opening and a second opening; a first converging cavity and a second converging cavity which are arranged at intervals along the up-down direction are arranged in the radiating block, and the first converging cavity and the second converging cavity are staggered in the up-down direction; the first opening is communicated with the first converging cavity, and the radiating block is also provided with a liquid inlet channel with one end opening communicated with the first converging cavity and the other end opening communicated with the surface of the radiating block; the second opening is communicated with the second converging cavity, one end opening of the radiating block is communicated with the second converging cavity, and the other end opening of the radiating block is communicated with the surface of the radiating block.

The cooling liquid flows into the first converging cavity from the liquid inlet channel, then gradually flows into each first opening in a branching way, the cooling liquid flowing out of the first opening and the heating device are subjected to heat exchange and then flow into the second opening, and the cooling liquid flowing out of each second opening is gathered into the second converging cavity and then flows out of the liquid return channel. In this scheme, first chamber and the second chamber that converges interval from top to bottom set up to still there is dislocation in the upper and lower direction, compare in prior art, with first chamber and the second chamber that converges set up in the coplanar, first chamber and the second chamber that converges in this scheme apart from having increased, be difficult for taking place heat transfer. Meanwhile, because the first converging cavity and the second converging cavity are vertically spaced and staggered, interference cannot be generated in the width direction, and therefore the first converging cavity and the second converging cavity can be wider, and the flow is increased.

The heat dissipation device provided by the invention comprises the heat dissipation block. Because the heat dissipating device provided by the invention refers to the heat dissipating block, the heat dissipating device provided by the invention also has the advantage of the heat dissipating block.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a bottom view of a heat dissipating block according to embodiment 1 of the present invention;

fig. 2 is a top view of a heat dissipating block according to embodiment 1 of the present invention;

fig. 3 is a schematic view of a cooling area of a heat dissipating block according to embodiment 1 of the present invention;

fig. 4 is a schematic view of a first cooling disc of a heat dissipating block according to embodiment 1 of the present invention;

fig. 5 is a schematic diagram of a second cooling plate of the heat dissipating block according to embodiment 1 of the present invention;

FIG. 6 is a cross-sectional view taken along the direction A-A in FIG. 2;

FIG. 7 is a cross-sectional view taken along the direction B-B in FIG. 2;

FIG. 8 is a cross-sectional view taken along the direction C-C in FIG. 2;

fig. 9 is a projection view of a first converging cavity and a second converging cavity of a heat dissipating block provided in embodiment 1 of the present invention on a horizontal reference plane;

Fig. 10 is a projection view of a first converging cavity and a second converging cavity of a heat dissipating block provided in embodiment 2 of the present invention on a horizontal reference plane;

Fig. 11 is a projection view of a first converging cavity and a second converging cavity of a heat dissipating block provided in embodiment 3 of the present invention on a horizontal reference plane;

fig. 12 is a projection view of a first converging cavity and a second converging cavity of a heat dissipating block provided in embodiment 4 of the present invention on a horizontal reference plane;

Fig. 13 is a top view of a heat dissipating block according to embodiment 5 of the present invention;

FIG. 14 is a cross-sectional view taken along the direction D-D in FIG. 13;

FIG. 15 is a cross-sectional view taken along the direction E-E in FIG. 13;

fig. 16 is a projection view of the first and second manifold cavities of the heat dissipating block according to embodiment 5 of the present invention on a horizontal reference plane.

Icon: 100-a first cooling plate; 110-a first opening; 120-a second opening; 130-a first confluence chamber; 131-a first sink; 140-a third opening; 150-a first surface; 160-a second surface; 170-electrodes;

200-a second cooling plate; 210-a second manifold chamber; 211-a second sink; 212-a fourth opening; 220-a liquid inlet channel; 230-a liquid return channel; 240-a third surface; 250-fourth surface.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

Example 1

As shown in fig. 1 to 9, the heat dissipation block provided by the invention can dissipate heat of a plurality of chips at the same time.

As shown in fig. 2 and 3, the upper surface of the heat dissipating block is provided with a plurality of cooling areas, each corresponding to one chip. The cooling area is provided with a first opening 110 and a second opening 120, and the cooling liquid flowing out of the first opening 110 is returned to the second opening 120 after heat exchange with the chip.

As shown in fig. 6-8, the heat dissipation block is internally provided with a first converging cavity 130 and a second converging cavity 210 which are arranged at intervals along the up-down direction, and the first converging cavity 130 and the second converging cavity 210 have a height difference, so that a space is formed vertically, and the distance between the two spaces is increased.

Further, the first converging cavity 130 and the second converging cavity 210 are staggered in the vertical direction, and in the first converging cavity 130 and the second converging cavity 210 corresponding to the same cooling area, the first converging cavity 130 is closer to the rear side of the heat dissipation block, and the second converging cavity 210 is closer to the front side of the heat dissipation block, so that a space is formed in the front-rear direction, the distance between the first converging cavity and the second converging cavity is further increased, and the heat conduction between the first converging cavity and the second converging cavity is not easy.

The first opening 110 is communicated with the first converging cavity 130, and the heat dissipation block is further provided with a liquid inlet channel 220 with one end opening communicated with the first converging cavity 130 and the other end opening communicated with the lower surface of the heat dissipation block. The feed liquor passageway 220 sets up at first conflux chamber 130 length direction's tip, and same first conflux chamber 130 can set up two feed liquor passageways 220, and two feed liquor passageways 220 set up respectively at first conflux chamber 130 length direction's both ends, and during the coolant liquid input, can annotate liquid to two feed liquor passageways 220 simultaneously to avoid the unidirectional notes liquid to lead to, the problem of other end pressure inadequately.

The second opening 120 is communicated with the second converging cavity 210, and the heat dissipating block is further provided with a liquid return channel 230 with one end opening communicated with the second converging cavity 210 and the other end opening communicated with the lower surface of the heat dissipating block. The liquid return channels 230 are disposed at the ends of the second converging cavity 210 in the length direction, two liquid return channels 230 may be disposed in the same second converging cavity 210, and two liquid return channels 230 are disposed at two ends of the second converging cavity 210 in the length direction, so as to accelerate the discharge of the cooling liquid.

The cooling liquid flows into the first confluence chamber 130 from the liquid inlet passage 220, then gradually flows in a branched manner to each first opening 110, the cooling liquid flowing out of the first opening 110 exchanges heat with the heat generating device (chip) and flows into the second opening 120, and the cooling liquid flowing out of each second opening 120 is collected into the second confluence chamber 210 and then flows out of the liquid return passage. In this scheme, interval setting about first conflux chamber 130 and the second conflux chamber 210 to still there is the dislocation in upper and lower direction, compare in prior art, set up first conflux chamber 130 and second conflux chamber 210 at the coplanar, first conflux chamber 130 and second conflux chamber 210 distance in this scheme has increased, is difficult for taking place heat transfer. Meanwhile, since the first and second confluence chambers 130 and 210 are spaced up and down and are offset, the width directions do not interfere with each other, and thus, the first and second confluence chambers 130 and 210 can be provided wider, increasing the flow rate.

In this embodiment, the heat dissipation block includes a first cooling plate 100 and a second cooling plate 200 which are sequentially disposed in the up-down direction and are connected to each other, and the shapes of the first cooling plate 100 and the second cooling plate 200 may be, but not limited to, circular, rectangular, or other irregular shapes.

The first cooling pan 100 is positioned above and includes a first surface 150 and a second surface 160 facing away from each other; the second cooling pan 200 is positioned below and includes third 240 and fourth 250 facing opposite surfaces, with the third surface 240 in sealing engagement with the second surface 160.

The cooling zone is disposed on the first surface 150. The plurality of cooling areas are arranged along an array which is staggered horizontally and longitudinally, and the number of the cooling areas of two adjacent horizontal rows can be the same or different; likewise, the number of cooling zones in adjacent columns may be the same or different.

As shown in fig. 4, the second surface 160 has a first converging groove 131 extending along the array in a transverse direction, and the first converging groove 131 and the third surface 240 enclose the first converging cavity 130. The second surface 160 is further provided with third openings 140 corresponding to the second openings 120 one by one, the second openings 120 and the third openings 140 are aligned vertically, and the third openings 140 are communicated with the second openings 120.

The liquid inlet channel 220 penetrates through the third surface 240 and the fourth surface 250, and is located at the outer side of the length direction of the first confluence cavity 130, and an upper port of the liquid inlet channel 220 is communicated with the first confluence cavity 130.

As shown in fig. 5, the third surface 240 is provided with a second converging groove 211 extending along the transverse direction of the array, the second converging groove 211 and the second surface 160 enclose the second converging cavity 210, the downward projections of the third openings 140 all fall into the second converging groove 211, and each third opening 140 arranged along the transverse direction of the array communicates with the same second converging cavity 210.

The liquid return passage is provided on the second cooling pan 200 and is located outside the end of the second confluence chamber 210. The liquid inlet channel 220, the first confluence cavity 130 and the first opening 110 are connected into a cooling flow channel; the second opening 120, the third opening 140, the second confluence chamber 210 and the return channel 230 are connected to form a return flow path.

The first cooling disc 100 and the second cooling disc 200 which are arranged on the upper layer and the lower layer are in butt joint, sealing is achieved, the sealing effect is good, the first converging cavity 130 and the second converging cavity 210 are staggered up and down, the first converging cavity 130 can be arranged larger, the flow is increased, and the heat dissipation effect is improved.

In this embodiment, the plurality of cooling areas are arranged in an array, cooling rows are formed along the cooling areas distributed in the transverse direction of the array, and the same cooling row group shares a first converging cavity 130, and the first converging cavity 130 extends in the transverse direction of the array. Along the longitudinal direction of the array, there are at least two cooling rows. In this embodiment, the array has 18 rows and 18 columns and is arranged in a generally circular configuration.

The flow Q1 of the cooling flow channel corresponding to the cooling row group with more bearing heat in any two cooling row groups, the flow Q2 of the cooling flow channel corresponding to the cooling row group with less bearing heat, and Q1 is larger than Q2. The amount of heat carried can be related to the number of cooling areas in the cooling bank, and when the amount of heat output by the heated device of each cooling area is the same, the cooling bank having a larger number of cooling areas carries a larger amount of heat. When the heat output by the heated devices in the cooling areas is different, the bearing heat of the row of cooling rows is equal to the sum of the heat output by the heated devices in all the cooling areas of the row. In this embodiment, taking the same heat output by the heated device of each cooling area as an example, the load heat is related to the number of cooling areas.

Because the arrays are arranged in a circle, there are different numbers of cooling areas in the two cooling row groups, for example, in the present embodiment, the number of cooling areas in the first row of cooling row groups on the rearmost side is 6, and the number of cooling areas in the next row is 10. Therefore, in the two rows, the overall heat dissipation capacity required by the upper row is weaker than that of the lower row, and the cooling flow channels of the upper row and the lower row are different, so that the flow Q1 of the cooling flow channels corresponding to the cooling row groups with more cooling areas is realized, the flow Q2 of the cooling flow channels corresponding to the cooling row groups with fewer cooling areas is realized, and the flow Q1 is larger than the flow Q2, thereby realizing the purpose of uniformly dissipating heat of each chip.

Specifically, in one embodiment, under the condition that other parameters are the same, in any two cooling row groups, the cross section S1 of the first converging cavity 130 corresponding to the cooling row group with more cooling areas, the cross section S2 of the first converging cavity 130 corresponding to the cooling row group with less cooling areas, and S1 is greater than S2. The larger the cross section, the larger the flow, and the better the heat dissipation effect.

Further, the depth or width of the first converging groove 131 may be set to be different for the setting of the cross-sectional area of the first converging chamber 130. The depth h1 of the first converging groove 131 corresponding to the cooling row group with more cooling areas, the depth h2 of the first converging groove 131 corresponding to the cooling row group with less cooling areas, and h1 may be greater than h2. Similarly, the width L1 of the first converging groove 131 corresponding to the cooling row group with more cooling areas, and the depth L2 of the first converging groove 131 corresponding to the cooling row group with less cooling areas may be greater than L2. Thereby realizing different flow rates of the cooling row groups of different numbers of cooling areas.

In another embodiment, in any two cooling row groups, the cooling row group with more cooling areas corresponds to the cross-sectional area S3 of the inlet channel 220, and the cooling row group with less cooling areas corresponds to the cross-sectional area S4 of the inlet channel 220, and S3 is greater than S4. The thicker the liquid inlet channel 220 is, the more liquid inlet amount is, and the better the heat dissipation effect is, so that the purpose of uniformly dissipating heat of each chip is achieved.

As shown in fig. 9, in the present embodiment, all the projection positions of the first and second manifold chambers 130 and 210 on the horizontal reference plane are alternately distributed from the back to the front.

Example 2

As shown in fig. 10, in the present embodiment, a manner in which the first manifold chambers 130 of adjacent cooling bar groups are arranged close to each other is adopted, unlike the manner in which the first manifold chambers 130 and the second manifold chambers 210 are arranged in embodiment 1.

Specifically, at least one first cooling structure is present on the first surface 150, where the first cooling structure is formed by two adjacent cooling row groups, where the two cooling row groups are respectively set as a first cooling row group and a second cooling row group, and a projection of the first converging cavity 130 in the first cooling row group and the first converging cavity 130 in the second cooling row group on the same horizontal reference plane is located between a projection of the second converging cavity 210 in the first cooling row group and a projection of the second converging cavity 210 in the second cooling row group on the horizontal reference plane. In embodiment 1, the projection of one first converging cavity 130 on the horizontal reference plane falls between the projections of two second converging cavities 210, i.e., one converging cavity is sandwiched between two second converging cavities 210, whereas in this embodiment, the projection of one first converging cavity 130 on the horizontal reference plane falls between the projection of one second converging cavity 210 and the projection of the other first converging cavity 130, i.e., the second converging cavity 210 is present on only one side of the first converging cavity 130, thereby further reducing the heat transfer influence from the second converging cavity 210 to which the first converging cavity 130 is subjected.

Example 3

As shown in fig. 11, further, on the basis of embodiment 2, the groove walls between the first converging cavity 130 in the first cooling row group and the first converging cavity 130 in the second cooling row group are removed, so that the first converging cavity and the second converging cavity are communicated as a whole, and the liquid inlet amount is further increased.

Example 4

As shown in fig. 12, the embodiment 2 or embodiment 3 is based on the above. At least one second cooling structure is present on the first surface 150, wherein the second cooling structure and the first cooling structure may share the same cooling row group.

The second cooling structure is formed by two adjacent cooling row groups, wherein the two cooling row groups are respectively set into a cooling row group III and a cooling row group IV, and the projection of the second converging cavity 210 in the cooling row group III and the projection of the second converging cavity 210 in the cooling row group IV on the same horizontal reference plane are positioned between the projection of the first converging cavity 130 in the cooling row group III and the projection of the first converging cavity 130 in the cooling row group IV on the horizontal reference plane. The second manifold chamber 210 in the third cooling bar set and the second manifold chamber 210 in the fourth cooling bar set are communicated as a whole, and the groove walls between the second manifold chamber 210 in the third cooling bar set and the second manifold chamber 210 in the fourth cooling bar set are removed, so that the cross-sectional area of the passage is increased, and the liquid discharge amount is increased, as in the principle of embodiment 3.

Example 5

As shown in fig. 13-16, the cooling area is generally in a positive direction, the first opening 110 and the second opening 120 are respectively disposed at diagonal positions, and the other diagonal position is provided with an electrode 170 connected to the chip, and the motor needs to extend downward to the inside of the heat sink. While the first and second confluence chambers 130 and 210, each extending in the lateral direction, may affect the arrangement of the electrodes 170 such that the first and second confluence chambers 130 and 210 cannot be disposed too widely.

As shown in fig. 16, in the present embodiment, the extending directions of the first and second confluence chambers 130 and 210 are not the same, but are disposed perpendicular to each other, so that a sufficient space position can be left for the electrode 170.

Specifically, the heat dissipation block includes a first cooling plate 100 and a second cooling plate 200 that are sequentially disposed in an up-down direction and connected to each other, and the first cooling plate 100 includes a first surface 150 and a second surface 160 facing opposite; the second cooling plate 200 includes a third surface 240 and a fourth surface 250 facing opposite, and the third surface 240 conforms to the second surface 160. The second surface 160 has a first sink 131 extending transversely along the array; the first converging groove 131 and the third surface 240 enclose the first converging cavity 130; the second surface 160 is further provided with third openings 140 corresponding to the second openings 120 one by one, the third openings 140 are communicated with the second openings 120, and the structure of the first cooling disc 100 is the same as that of embodiment 1.

The liquid inlet channel 220 penetrates through the third surface 240 and the fourth surface 250, and an upper port of the liquid inlet channel 220 is communicated with the first confluence cavity 130.

The difference from embodiment 1 is that the second cooling pan 200 is internally provided with the second confluence chamber 210 extending in the longitudinal direction of the array. The third surface 240 is provided with fourth openings 212, and the number of the fourth openings 212 is the same as the number of the cooling rows at the position along the longitudinal direction of the array, and corresponds to one. Adjacent two fourth openings 212 are spaced apart to avoid the first converging groove 131. The fourth opening 212 communicates with the second and third manifold chambers 210 and 140, respectively; the liquid return passage is provided on the second cooling pan 200. The liquid inlet channel 220, the first confluence cavity 130 and the first opening 110 are connected into a cooling flow channel; the second opening 120, the third opening 140, the fourth opening 212, the second confluence chamber 210 and the return channel 230 are connected to form a return flow path.

The heat dissipation device provided by the invention comprises the heat dissipation block. Because the heat dissipating device provided by the invention refers to the heat dissipating block, the heat dissipating device provided by the invention also has the advantage of the heat dissipating block.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1. A heat sink, characterized in that the upper surface of the heat sink is provided with a plurality of cooling areas, the cooling areas being provided with a first opening (110) and a second opening (120);

a first converging cavity (130) and a second converging cavity (210) which are arranged at intervals along the up-down direction are arranged in the radiating block, and the first converging cavity (130) and the second converging cavity (210) are staggered in the up-down direction;

The first opening (110) is communicated with the first converging cavity (130), and the radiating block is also provided with a liquid inlet channel (220) with one end opening communicated with the first converging cavity (130) and the other end opening communicated with the surface of the radiating block;

The second opening (120) is communicated with the second converging cavity (210), and the radiating block is also provided with a liquid return channel (230) with one end opening communicated with the second converging cavity (210) and the other end opening communicated with the surface of the radiating block;

The plurality of cooling areas are arranged in an array, cooling row groups are formed along the cooling areas distributed in the transverse direction of the array, and the same cooling row group shares a first confluence cavity (130);

Along the longitudinal direction of the array, there are at least two cooling row groups;

The heat dissipation block comprises a first cooling disc (100) and a second cooling disc (200) which are sequentially arranged along the up-down direction and are connected with each other, and the first cooling disc (100) comprises a first surface (150) and a second surface (160) which face opposite to each other; the second cooling disk (200) comprises a third surface (240) and a fourth surface (250) facing away from each other, and the third surface (240) is attached to the second surface (160);

The cooling region is disposed on the first surface (150); the second surface (160) is provided with a first converging groove (131) extending along the array transversely, and the first converging groove (131) and the third surface (240) enclose the first converging cavity (130); the second surface (160) is further provided with third openings (140) corresponding to the second openings (120) one by one, and the third openings (140) are communicated with the second openings (120);

The liquid inlet channel (220) penetrates through the third surface (240) and the fourth surface (250), and an upper port of the liquid inlet channel (220) is communicated with the first confluence cavity (130); a second converging groove (211) extending along the transverse direction of the array is arranged on the third surface (240), the second converging groove (211) and the second surface (160) enclose a second converging cavity (210), and the third opening (140) is communicated with the second converging cavity (210); the liquid return channel is arranged on the second cooling disc (200);

The liquid inlet channel (220), the first converging cavity (130) and the first opening (110) are connected into a cooling flow passage; the second opening (120), the third opening (140), the second confluence cavity (210) and the liquid return channel (230) are connected into a backflow channel.

2. The heat dissipating block of claim 1 wherein, in any two cooling rows, the flow Q1 of the cooling channel corresponding to the cooling row with the higher heat is greater than the flow Q2 of the cooling channel corresponding to the cooling row with the lower heat, and Q1 is greater than Q2.

3. The heat dissipating block according to claim 2, wherein, in any two cooling row groups, a cross section S1 of the first converging cavity (130) corresponding to the cooling row group carrying more heat, and a cross section S2, S1 of the first converging cavity (130) corresponding to the cooling row group carrying less heat are larger than S2;

and/or, in any two cooling row groups, the cross section area S3 of the liquid inlet channel (220) corresponding to the cooling row group with more bearing heat is larger than the cross section area S4 of the liquid inlet channel (220) corresponding to the cooling row group with less bearing heat, and S3 is larger than S4.

4. The heat sink according to claim 1, wherein at least one first cooling structure is present on the first surface (150), the first cooling structure being formed by two adjacent cooling bar groups, wherein the two cooling bar groups are respectively provided as a first cooling bar group and a second cooling bar group, and wherein the projection of the first busbar cavity (130) in the first cooling bar group and the first busbar cavity (130) in the second cooling bar group on the same horizontal reference plane is located between the projection of the second busbar cavity (210) in the first cooling bar group and the second busbar cavity (210) in the second cooling bar group on the horizontal reference plane.

5. The heat sink of claim 4, wherein the first manifold chamber (130) of the first cooling bank group and the first manifold chamber (130) of the second cooling bank group communicate as a single unit.

6. The heat sink according to claim 4 or 5, characterized in that at least one second cooling structure is present on the first surface (150), which second cooling structure is formed by two adjacent cooling row groups, wherein the two cooling row groups are respectively provided as cooling row group three and cooling row group four, and the projection of the second busbar chamber (210) in the cooling row group three and the second busbar chamber (210) in the cooling row group four on the same horizontal reference plane is located between the projection of the first busbar chamber (130) in the cooling row group three and the first busbar chamber (130) in the cooling row group four on the horizontal reference plane;

And the second converging cavity (210) in the third cooling row group and the second converging cavity (210) in the fourth cooling row group are communicated into a whole.

7. A heat sink, characterized in that the upper surface of the heat sink is provided with a plurality of cooling areas, the cooling areas being provided with a first opening (110) and a second opening (120);

a first converging cavity (130) and a second converging cavity (210) which are arranged at intervals along the up-down direction are arranged in the radiating block, and the first converging cavity (130) and the second converging cavity (210) are staggered in the up-down direction;

The first opening (110) is communicated with the first converging cavity (130), and the radiating block is also provided with a liquid inlet channel (220) with one end opening communicated with the first converging cavity (130) and the other end opening communicated with the surface of the radiating block;

The second opening (120) is communicated with the second converging cavity (210), and the radiating block is also provided with a liquid return channel (230) with one end opening communicated with the second converging cavity (210) and the other end opening communicated with the surface of the radiating block;

The plurality of cooling areas are arranged in an array, cooling row groups are formed along the cooling areas distributed in the transverse direction of the array, and the same cooling row group shares a first confluence cavity (130);

Along the longitudinal direction of the array, there are at least two cooling row groups;

The heat dissipation block comprises a first cooling disc (100) and a second cooling disc (200) which are sequentially arranged along the up-down direction and are connected with each other, and the first cooling disc (100) comprises a first surface (150) and a second surface (160) which face opposite to each other; the second cooling disk (200) comprises a third surface (240) and a fourth surface (250) facing away from each other, and the third surface (240) is attached to the second surface (160);

The second surface (160) has a first sink (131) extending transversely along the array; the first converging groove (131) and the third surface (240) enclose the first converging cavity (130); the second surface (160) is further provided with third openings (140) corresponding to the second openings (120) one by one, and the third openings (140) are communicated with the second openings (120);

the liquid inlet channel (220) penetrates through the third surface (240) and the fourth surface (250), and an upper port of the liquid inlet channel (220) is communicated with the first confluence cavity (130);

-said second cooling plate (200) is internally provided with said second converging cavity (210) extending in the longitudinal direction of said array; the third surface (240) is provided with a plurality of fourth openings (212), and the fourth openings (212) are distributed at intervals along the longitudinal direction of the array so as to avoid the first converging groove (131); the fourth opening (212) is respectively communicated with the second confluence cavity (210) and the third opening (140); the liquid return channel is arranged on the second cooling disc (200);

The liquid inlet channel (220), the first converging cavity (130) and the first opening (110) are connected into a cooling flow passage; the second opening (120), the third opening (140), the fourth opening (212), the second confluence cavity (210) and the liquid return channel (230) are connected into a backflow flow channel.

8. The heat dissipating block of claim 7 wherein, of any two cooling rows, the cooling row with more heat has a flow Q1 of the cooling channel corresponding to the cooling row, and the cooling row with less heat has a flow Q2, Q1 greater than Q2 of the cooling channel corresponding to the cooling row.

9. The heat dissipating block of claim 8 wherein, of any two cooling row groups, the cross section S1 of the first manifold chamber (130) corresponding to the cooling row group carrying the greater heat, the cross section S2, S1 of the first manifold chamber (130) corresponding to the cooling row group carrying the lesser heat is greater than S2;

and/or, in any two cooling row groups, the cross section area S3 of the liquid inlet channel (220) corresponding to the cooling row group with more bearing heat is larger than the cross section area S4 of the liquid inlet channel (220) corresponding to the cooling row group with less bearing heat, and S3 is larger than S4.

10. A heat sink comprising the heat sink of any one of claims 1-6 or the heat sink of any one of claims 7-9.