CN119024595A - Color filter and manufacturing method thereof, and display panel - Google Patents
Color filter and manufacturing method thereof, and display panel Download PDFInfo
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- CN119024595A CN119024595A CN202411389859.6A CN202411389859A CN119024595A CN 119024595 A CN119024595 A CN 119024595A CN 202411389859 A CN202411389859 A CN 202411389859A CN 119024595 A CN119024595 A CN 119024595A
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Abstract
The application discloses a color filter, a manufacturing method thereof and a display panel, wherein the color filter comprises: a substrate; a first color resistor and a second color resistor which are formed on the substrate and are arranged at intervals; forming a third color resistor on the surface of the substrate far away from the first color resistor and the second color resistor, and forming a flat layer on the surfaces of the first color resistor and the second color resistor; wherein the surface of the third resistor and the surface of the flat layer are positioned on the same horizontal plane. The method for flattening the color resistance layer instead of the flattening layer simplifies the process flow and thins the panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a color filter, a manufacturing method thereof and a display panel.
Background
In the field of display technology, liquid Crystal Displays (LCDs) are widely used in various electronic devices due to their light weight, low power consumption, no radiation, and the like. The main components of the LCD include a liquid crystal panel, a backlight source, a driving circuit, and the like. Among them, the liquid crystal panel is a core part of an LCD, and is composed of two glass substrates and a liquid crystal layer sandwiched therebetween. In order to ensure alignment uniformity of liquid crystal molecules, an alignment film needs to be formed on a glass substrate. In order to realize color display, it is also necessary to manufacture a color filter on a glass substrate. In the field of optical materials, color filters are generally composed of three color resists of red (R), green (G) and blue (B). The color resistance layers are manufactured on the glass substrate through a photoetching process to form specific patterns, so that color display is realized.
However, in the conventional color filter manufacturing process, an organic capping layer (OC layer) is often required to be used for planarization, which increases the complexity and cost of the process. In the technical field of film preparation, spin coating is a commonly used film-forming method, which makes a liquid coating uniformly coated on a substrate under the action of centrifugal force by rotating the substrate at a high speed. However, this method tends to cause a problem of uneven thickness when a film having a large area and high uniformity is produced.
The prior art solution is: existing solutions mainly achieve planarization by using an organic capping layer (OC layer). Although planarization can be achieved in this way, there are several problems: first, the use of an OC layer requires additional process steps, which increases the complexity and cost of the process. Secondly, the use of the OC layer can increase the thickness of the panel, which is not beneficial to the light and thin design of the product. Finally, the use of an OC layer also affects the optical properties of the color blocking layer, possibly affecting the display effect.
Disclosure of Invention
The application mainly solves the technical problems of providing a color filter, a manufacturing method thereof and a display panel, and the color filter is flattened by using a color resistance layer to replace a flattening layer, so that the manufacturing of the flattening layer is omitted, one manufacturing process is reduced, the material consumption is saved, and the whole panel can be thinned on the design level.
To solve the above problems, a first aspect of the present application provides a color filter, including: a substrate; a first color resistor and a second color resistor which are formed on the substrate and are arranged at intervals; forming a third color resistor on the surface of the substrate far away from the first color resistor and the second color resistor, and forming a flat layer on the surfaces of the first color resistor and the second color resistor; wherein the surface of the third resistor and the surface of the flat layer are positioned on the same horizontal plane.
In an embodiment, the material of the planarization layer and the third color resistor is at least partially the same.
In one embodiment, the third color resist is formed by ultraviolet curing of a third color resist; wherein the third photoresist comprises a third photoresist molecule.
In one embodiment, the planarizing layer is formed by curing the third photoresist from which the third photoresist molecules are deposited.
In one embodiment, the third photoresist comprises 20-40wt% of a polymer resin, 10-20wt% of a pigment, 2-3wt% of a photoinitiator, 0.1-0.5wt% of a crosslinking agent, and 40-60wt% of a solvent; wherein the third color resist molecule is the photoinitiator; the photoinitiator comprises bis- (P-methoxyphenyl) copper, spiropyran and spirooxazine.
In order to solve the above problems, a second aspect of the present application provides a method for manufacturing a color filter, the method for manufacturing a color filter comprising: providing a substrate; wherein, the substrate is provided with a first color resistor and a second color resistor; coating a third photoresist on the surface of the substrate; wherein the third photoresist covers the surfaces of the first color resistor and the second color resistor; pre-curing the third photoresist to obtain a semi-cured third photoresist; curing the third photoresist at the position of the substrate far away from the first color resistor and the second color resistor to form third color resistor, and separating out third color resistor molecules in the third photoresist covered on the surfaces of the first color resistor and the second color resistor; and removing third photoresist molecules precipitated on the surface of the third photoresist to obtain the color filter with a flat surface.
In one embodiment, the step of removing the third photoresist molecules deposited on the surface of the third photoresist further comprises: and curing the third photoresist from which the third color resist molecules are separated out to form a flat layer covering the surfaces of the first color resist and the second color resist, thereby obtaining the color filter with a flat surface.
In a specific embodiment, the thickness of the third color resistor is greater than the thickness of the first color resistor and the thickness of the second color resistor; the sum of the thicknesses of the first color resistor and the flat layer and the thickness of the second color resistor and the thickness of the flat layer are equal to the thickness of the third color resistor, so that the surface of the third color resistor and the surface of the flat layer are positioned on the same horizontal plane.
In one embodiment, the third photoresist comprises 20-40wt% of a polymer resin, 10-20wt% of a pigment, 2-3wt% of a small molecule photoinitiator, 0.1-0.5wt% of a crosslinking agent, and 40-60wt% of a solvent; wherein the third color resist molecule is the photoinitiator; the photoinitiator comprises bis- (P-methoxyphenyl) copper, spiropyran and spirooxazine.
In one embodiment, the step of curing the third photoresist at a position of the substrate far from the first color resistor and the second color resistor to form a third color resistor and precipitating third color resistor molecules in the third photoresist covering the surfaces of the first color resistor and the second color resistor includes: masking a third photoresist on the surfaces of the first color resist and the second color resist, and exposing at least a portion of the third photoresist at a location remote from the first color resist and the second color resist; and performing ultraviolet curing treatment on the exposed third photoresist to obtain the third photoresist.
In one embodiment, after the step of performing uv curing treatment on the exposed third photoresist to obtain the third photoresist, the method further includes: and performing precipitation treatment on the third photoresist on the surfaces of the first color resistor and the second color resistor so as to precipitate the third color resistor molecules on the surface of the third photoresist.
In one embodiment, the step of pre-curing the third photoresist to obtain a semi-cured third photoresist includes: baking the third photoresist at a first temperature for a first preset time to obtain a semi-cured third photoresist; the step of curing the third photoresist from which the third color resist molecules are separated out to form a flat layer covering the surfaces of the first color resist and the second color resist comprises the following steps: baking the third photoresist from which the third photoresist molecules are separated at a second temperature for a second preset time to completely cure the third photoresist; wherein the second temperature is greater than the first temperature and/or the second predetermined time is greater than the first predetermined time.
In order to solve the above problems, a third aspect of the present application provides a display panel, which includes an array substrate, a color film substrate, and a liquid crystal layer disposed between the array substrate and the color film substrate, wherein the color filter in any one of the embodiments of the first aspect is formed on the array substrate or the color film substrate.
The beneficial effects of the application are as follows: the first color resistor and the second color resistor are formed on the substrate, and then the third color resistor and the flat layer are formed on the substrate respectively, so that the surfaces of the third color resistor and the flat layer are positioned on the same horizontal plane, thicker flat layers are manufactured on the surfaces of the first color resistor, the second color resistor and the third color resistor, a color filter with a flat surface can be obtained, the manufacturing process can be reduced, the materials can be saved, the cost can be reduced, and the whole panel can be thinned.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a color filter according to an embodiment of the application;
FIG. 2 is a flowchart of a method for fabricating a color filter according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of an embodiment of step S11 in FIG. 2;
FIG. 4 is a schematic structural diagram of an embodiment of step S12 in FIG. 2;
FIG. 5 is a schematic structural diagram of an embodiment of step S13 in FIG. 2;
FIG. 6 is a schematic structural diagram of an embodiment of step S14 in FIG. 2;
FIG. 7 is a schematic structural diagram of an embodiment of step S15 in FIG. 2;
Fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the application.
10A substrate; 11 first color resistance; 12 a second color resistance; 13 third color resistance; 101 a planar layer; BM black matrix.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present application, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a color filter according to an embodiment of the application. As shown in fig. 1, the color filter includes: the substrate 10 has a first color resistor 11, a second color resistor 12 and a third color resistor 13 formed on the surface of the substrate 10 at intervals. The first color resistor 11, the second color resistor 12 and the third color resistor 13 are different colors. The colors in the figure do not represent the first color resistor 11, the second color resistor 12, and the third color resistor 13 as the fixed colors, but represent only the first color resistor 11, the second color resistor 12, and the third color resistor 13 as different colors. The surfaces of the first color resistor 11 and the second color resistor 12 are also covered with a flat layer 101 which is flush (i.e. of equal thickness) with the surface of the third color resistor 13, i.e. the surface of the third color resistor 13 is in the same horizontal plane as the surface of the flat layer 101.
Wherein the material of the planarization layer 101 and the third resistor 13 are at least partially the same. Specifically, the third color resist 13 is formed by ultraviolet curing of the third color resist. Wherein the third photoresist comprises a third photoresist molecule. The planarization layer 101 is formed by curing the third photoresist from which at least part of the third resist molecules are deposited, and preferably, by curing the third resist from which all the third resist molecules are deposited. Preferably, the planarization layer 101 is formed by thermal curing, so as to avoid the residual third resist molecules from being discolored by ultraviolet light curing as much as possible.
Since a portion of the third resist molecules may not be deposited on the planarization layer 101, the planarization layer 101 may be light blue when the third resist 13 is blue. After the whole surface of the B color resistor is coated, the B color resistor is half-cured after pre-baking, partial photosensitive agent chromophore is combined with high polymer resin to permanently color to form half-cured color resistor B ', so as to form a light blue layer, then the third display area is exposed to enable most of the photosensitive agent to be excited to combine with the resin to form the B color resistor, and finally the residual most of the unused photosensitive agent in the B' part is evaporated after subsequent high-temperature baking. Wherein the planarization layer 101 is a B' color resist.
In one embodiment, the first color resistor 11, the second color resistor 12 and the third color resistor 13 of the substrate 10 are provided with a black matrix BM for absorbing the mixed light. In other embodiments, the black matrix BM may not be provided.
In this embodiment, the planarization layer 101 also covers the spacers among the first color resistor 11, the second color resistor 12 and the third color resistor 13, so as to form a color filter with a flat surface.
In other embodiments, a planarization layer is further formed on the surfaces of the substrate 10 and the first, second and third color resists 11, 12 and 13. The planarization layer 101 in this embodiment is used as a planarization layer covering the entire surface of the color resist layer. Compared with the prior art, a flat layer is formed on the surfaces of the first color resistor 11, the second color resistor 12 and the third color resistor 13 to cover the surfaces of the first color resistor 11, the second color resistor 12 and the third color resistor 13, so that the thickness is increased, and at least one process is needed. The application replaces the second flat layer with the third color resistance layer which is not subjected to the photochromic permanent color as the surface covering the first color resistance 11 and the second color resistance 12, thereby reducing the manufacturing process and the thickness.
Wherein the sum of the thicknesses of the first color resistor 11 and the flat layer 101 on the surface thereof is equal to the thickness of the third color resistor 13, and the sum of the thicknesses of the second color resistor 12 and the flat layer 101 on the surface thereof is equal to the thickness of the third color resistor 13. The thicknesses of the first color resist 11 and the second color resist 12 may be different or the same, and are not limited herein.
The application provides a manufacturing method of a color filter. Specifically, referring to fig. 2, fig. 2 is a flow chart illustrating an embodiment of a method for manufacturing a color filter according to the present application. As shown in fig. 2, the manufacturing method includes:
Step S11: a substrate is provided.
The substrate may be an array substrate or a color film substrate. That is, the color resistance layer can be made on the array substrate or the color film substrate.
In this embodiment, the first color resist and the second color resist are already formed on the substrate. The first color resistor and the second color resistor are a first color resistor layer and a second color resistor layer, and are arranged on the surface of the substrate at intervals.
Specifically, the substrate surface includes at least first, second and third spaced apart display regions. The step specifically includes: coating a first photoresist on a first display area of a substrate, and curing the first photoresist to obtain a first color resistance; and coating a second photoresist on a second display area of the substrate, and curing the second photoresist to obtain a second color resistance. The first photoresist is a coating agent capable of forming a first color resistance after being cured, and the second photoresist is a coating agent capable of forming a second color resistance after being cured. The first color resistor and the second color resistor are color resistor layers with different colors and are used for transmitting light with different colors. Wherein, the curing includes but is not limited to ultraviolet curing.
In this embodiment, the first color resistor, the second color resistor, and the third color resistor may also be referred to as a first color resistor layer, a second color resistor layer, and a third color resistor layer.
Specifically, referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of step S11 in fig. 2. As shown in fig. 3, a first color resist 11 and a second color resist 12 are formed on a substrate 10 at intervals.
Step S12: and coating a third photoresist on the surface of the substrate.
Wherein, this step includes coating the uniform third photoresist on the whole surface of the base plate. So that the third photoresist covers the surfaces of the first color resistor and the second color resistor, the interval area between the first color resistor and the second color resistor, the third display area of the substrate, and the like. It should be noted that the first display area, the second display area and the third display area each include a plurality of light emitting areas corresponding to the first sub-pixel, the second sub-pixel and the third sub-pixel respectively.
Specifically, referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of step S12 in fig. 2. As shown in fig. 4 a, a uniform third photoresist 103 is coated on the entire surface of the substrate 10, and the third photoresist 103 covers the surfaces of the first color resist 11 and the second color resist 12 and the space between the first color resist 11 and the second color resist 12. At this time, the third photoresist 103 is not irradiated with light and is in a colorless/transparent liquid state. Referring to fig. 4B, the B color resist pigment (third photoresist) contains a photosensitizer (photoinitiator), a resin, a solution, a crosslinking agent, and other additives. Wherein the photosensitizer is a small molecule reagent such as bis- (P-methoxyphenyl) copper, spiropyran, spirooxazine and the like, and the color changes after the photosensitizer is contacted with light or heat to change to obtain energy; the resin is third-color-resistance resin, and is cured under the actions of other assistants, temperature and illumination.
Step S13: and performing pre-curing treatment on the third photoresist to obtain the semi-cured third photoresist.
The method specifically comprises the following steps: and placing the substrate coated with the third photoresist at a first temperature and baking for a first preset time to perform semi-solidification treatment on the third photoresist so as to semi-solidify the third photoresist. In this embodiment, the third photoresist is semi-cured by high temperature baking, but in other embodiments, the third photoresist may be semi-cured by other methods, which is not limited herein.
Specifically, referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of step S13 in fig. 2. As shown in fig. 5 a, the third photoresist 103 on the substrate 10 is pre-cured, so that the third photoresist 103 covers the surfaces of the first color resist 11 and the second color resist 12 and the surface of the substrate 10 in the third display area, and the third photoresist 103 is further disposed at the interval between the first color resist 11 and the second color resist 12. The color-B-type resist pigment contains a photosensitizer, a resin, a solution, a crosslinking agent, and other auxiliaries. Wherein the photosensitizer is a small molecule reagent such as bis- (P-methoxyphenyl) copper, spiropyran, spirooxazine and the like, and the color changes after the photosensitizer is contacted with light or heat to change to obtain energy; the resin is B-color resistance resin, and is cured under the action of other auxiliary agents, temperature and illumination. At this time, the third photoresist 103 is changed from a transparent viscous liquid to a bluish colloidal solid under light. Referring to fig. 5 b, the resin in the third color resist is grafted under the action of the photosensitizer and the crosslinking agent after the pre-baking process. At this time, most of the photosensitizer is uniformly dispersed in the color resist without change, and a small part of the photosensitizer is heated to obtain energy to change color, and meanwhile, chemical activity is grafted in the third color resist resin. The color resistance at this time was changed from a transparent viscous liquid to a slightly bluish gummy solid.
Step S14: and curing the third photoresist at the position of the substrate far away from the first color resistor and the second color resistor to form a third color resistor, and separating out third color resistor molecules in the third photoresist covered on the surfaces of the first color resistor and the second color resistor.
The method comprises the following steps: and performing full curing treatment on the third photoresist in the third display area of the substrate, so that the photosensitizer in the third photoresist is excited to be combined with the resin, and the third photoresist layer is formed by curing.
The method specifically comprises the following steps: and shielding the third photoresist on the surfaces of the first color resistor and the second color resistor, and exposing at least the third photoresist at a position far away from the first color resistor and the second color resistor, namely exposing the third photoresist of the third display area, so as to facilitate forming the third color resistor in the third display area. And performing ultraviolet curing treatment on the exposed third photoresist by using ultraviolet light to obtain the third photoresist. I.e., curing the third photoresist in the third display area. In one embodiment, the third photoresist may be partially masked with a photomask. In other embodiments, the third photoresist may be partially masked with a dry film that absorbs light, which is not limited herein.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of step S14 in fig. 2, as shown in fig. 6a, a photomask or a mask 20 is disposed on at least the surfaces of the third photoresist 13 on the surfaces of the first color resist 11 and the second color resist 12, so as to at least shield the third photoresist 13 on the surfaces of the first color resist 11 and the second color resist 12, at least expose the third photoresist 13 in the third display area, and illuminate the third photoresist 13 in the third display area, so that the third photoresist 13 forms the third color resist 13. Further, the light may be irradiated also to the third color resist 13 between the first color resist 11 and the second color resist 12, and the formed third color resist 13 may perform a filtering function to mix light between the first color resist 11 and the second color resist 12, and in other embodiments, only the third color resist 13 of the third display area may be exposed, which is not limited herein. Referring to fig. 6b, a part of the light passes through the photo-mask, and most of the photosensitizer and crosslinking agent at the light position obtain energy in the light irradiation, so that the activity is enhanced, and the crosslinking degree of the resin at the part is increased to become dark blue hard block (blue block as third color block). The other parts have no color and hardness change due to no illumination stimulus, but the photosensitizer in the resin is precipitated in the resin due to compatibility problem and is concentrated on the surface of the resin.
The method further comprises the following steps: and performing precipitation treatment on third photoresist molecules in the third photoresist covered on the surfaces of the first color resistor and the second color resistor. Specifically, the third photoresist may be deposited before curing, or may be deposited simultaneously, or may be deposited after curing. Preferably, the third resist molecules in the third resist are cured, and the blocked third resist molecules in the third resist slowly precipitate due to incompatibility, and after the third resist is cured, in order to accelerate precipitation of the third resist molecules on the surfaces of the first and second resists, the precipitation of the third resist molecules can be further accelerated by a technical means. Specifically, the precipitation of the third resist molecule can be induced by a chemical agent that is compatible or compatible with the polarity of the third resist molecule, so that the third resist molecule is precipitated onto the surface of the third resist.
Step S15: and removing third photoresist molecules precipitated on the surface of the third photoresist to obtain the color filter with a flat surface.
The method specifically comprises the following steps: and removing the third photoresist molecules on the surface of the third photoresist by using a chemical etching process. The photosensitizer in the third photoresist is incompatible with the resin matrix, so that the photosensitizer can be removed under the action of etching after being precipitated on the surface of the resin layer. The etching can be whole-surface etching, the whole resin surface is etched under the action of etching, and the redundant photosensitizer is removed, so that a stable and flat color resistance layer can be obtained.
The method further comprises the following steps: and further performing curing treatment on the third photoresist on which the third color resist molecules are separated out, so as to form a flat layer covering the surfaces of the first color resist and the second color resist, and further obtain the color filter with a flat surface. The method specifically comprises the following steps: and placing the third photoresist from which the third photoresist molecules are separated out at a second temperature and baking for a second preset time to enable the third photoresist to be completely solidified to form a resin layer which is also a flat layer. Wherein the second temperature is greater than the first temperature and/or the second predetermined time is greater than the first predetermined time. Preferably, the first temperature is 80 degrees and the second temperature is 200 degrees; the first predetermined time is 30 minutes and the second predetermined time is 60 minutes, which is not limited herein. In other embodiments, the first temperature may be greater than the second temperature, and the second predetermined time may be substantially greater than the first predetermined time, such as baking at 200 degrees for 1 minute, fixing, etc., which is not limited herein.
The third photoresist, in which the third resist molecules are deposited, is an approximately transparent resin layer, and the resin layer is cured to form a flat surface.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment of step S15 in fig. 2, in which, as shown in fig. 7a, a mask or a reticle on the surface of the third photoresist 103 is etched to remove the third photoresist molecules on the surface of the third photoresist at the same time, so as to convert the third photoresist 103 into the planarization layer 101. Referring to fig. 7b, the whole resin surface is etched under the etching action, and the excessive photosensitizer is released, so as to obtain a stable and flat color resist layer.
The application also provides a third photoresist, which comprises 20-40wt% (weight percent) of high polymer resin, 10-20wt% of pigment, 2-3wt% of small molecule photoinitiator (also called photosensitizer), 0.1-0.5wt% of cross-linking agent and 40-60wt% of solvent. Wherein the photoinitiator is a third photoresist molecule in a third photoresist, is a small molecule subjected to (grinding) treatment, and can permanently change color under ultraviolet irradiation. It should be noted that the small molecules after treatment can be better fused with other solvents in the third photoresist. The small molecule photoinitiator can be separated out in the photoresist due to high polarity. The photoresist contains a photoinitiator, which is colorless or has other color resistances, and changes in color after contacting light to form a third color resistance with color. Specifically, the photoinitiator may be bis- (P-methoxyphenyl) copper, spiropyran, spirooxazine, or the like.
It should be noted that the content ratio of each component of the third photoresist is a preferred embodiment, and is not limited thereto. It is understood that the third photoresist may be in other proportions, and the content ratio is only optimal, so that the requirement of the third photoresist can be met, and a large amount of uncured third photoresist molecules can be separated out, thereby forming an approximately transparent resin layer. And the resin layer is used for replacing the flat layer, so that materials and procedures are saved.
In one embodiment, the third color resistor is a blue color resistor, and the first color resistor and the second color resistor are red color resistors or green color resistors. When the first color resistor is red, the second color resistor is green, and when the first color resistor is green, the second color resistor is red. In other embodiments, the third color resistor may be a red color resistor or a green color resistor, which is not limited herein. It should be noted that the third color resist is preferably a blue color resist because the blue color resist itself requires a larger aperture ratio or a higher thickness due to influence of sensitivity of human eyes.
In this embodiment, the thickness of the third color resistor is greater than the thickness of the first color resistor and also greater than the thickness of the second color resistor. The sum of the thicknesses of the first color resistor and the third photoresist formed on the surface of the first color resistor is equal to the thickness of the third color resistor, and the sum of the thicknesses of the second color resistor and the third photoresist formed on the surface of the second color resistor is also equal to the thickness of the third color resistor, so that a color resistor layer with equal thickness is formed, and an OC layer is not required to be manufactured on the surfaces of the first color resistor, the second color resistor and the third color resistor.
Further, when the first color resistor, the second color resistor and the third color resistor are formed on the color film substrate, the method further includes providing a black matrix layer on the substrate before step S11. The black matrix layer is disposed at the interval position of each display area, that is, the non-light-emitting area of the corresponding sub-pixel, which is not particularly limited herein.
The present application further provides a display panel, and in particular, referring to fig. 8, fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the present application. As shown in fig. 8, the display panel includes: the color film comprises an array substrate 100, a color film substrate 200 and a liquid crystal layer 300 arranged between the array substrate 100 and the color film substrate 200, wherein a first transparent electrode 110 is arranged on one side of the array substrate 100 close to the liquid crystal layer 300, and a second transparent electrode 210 is arranged on one side of the color film substrate 200 close to the liquid crystal layer 300. The color filter may be disposed on the array substrate 100 or on the color film substrate 200, specifically, the color filter is disposed on a side of the first transparent electrode 110 or the second transparent electrode 210 away from the liquid crystal layer 300, and may be a position layer as shown by a dotted line in fig. 8.
The beneficial effects of this embodiment are: the RGB color resistance layer is used for replacing the OC layer to complete planarization, so that one process is reduced in the process level, the material consumption is saved, the cost is reduced, and meanwhile, the whole panel can be thinned in the design level.
The foregoing is only illustrative of the present application and is not to be construed as limiting the scope of the application, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the present application and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the application.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202411389859.6A CN119024595A (en) | 2024-09-30 | 2024-09-30 | Color filter and manufacturing method thereof, and display panel |
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| CN202411389859.6A CN119024595A (en) | 2024-09-30 | 2024-09-30 | Color filter and manufacturing method thereof, and display panel |
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| CN119024595A true CN119024595A (en) | 2024-11-26 |
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| CN202411389859.6A Pending CN119024595A (en) | 2024-09-30 | 2024-09-30 | Color filter and manufacturing method thereof, and display panel |
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