CN119000716A - Chip detection method and chip detection auxiliary jig - Google Patents
Chip detection method and chip detection auxiliary jig Download PDFInfo
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- CN119000716A CN119000716A CN202411397245.2A CN202411397245A CN119000716A CN 119000716 A CN119000716 A CN 119000716A CN 202411397245 A CN202411397245 A CN 202411397245A CN 119000716 A CN119000716 A CN 119000716A
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- carrier tape
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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Abstract
The invention belongs to the technical field of electronic product detection, and discloses a chip detection method and a chip detection auxiliary jig, wherein the chip detection method comprises the following steps: positioning a carrier tape carrying chips, and enabling the first surface of each chip in the carrier tape to be in a detectable state; detecting appearance defects on the first surface of each chip; turning over the carrier tape to remove and reload each chip from the carrier tape so as to expose the second surface of each chip; detecting appearance defects on the second surfaces of the chips; wherein the cover film of the carrier tape is removed after positioning the carrier tape, or the cover film of the carrier tape is removed before turning the carrier tape. The invention provides a chip detection method and a chip detection auxiliary jig which can have higher detection efficiency.
Description
Technical Field
The invention relates to the technical field of electronic product detection, in particular to a chip detection method and a chip detection auxiliary jig.
Background
Before the wafer (also called a chip) is mounted on an electronic product, quality detection is required to ensure the quality of the chip and the electronic product, and the reworking times can be reduced, so that the assembly efficiency is improved. At present, a wafer unit which is cut is picked up from a cutting adhesive film by using a thimble and a suction nozzle, and then is subjected to wafer surface defect detection and defective screening by using optical lenses and picture recognition system software through a series of conveying units. And then placing and loading the wafer into a pocket of the carrier tape by utilizing a suction nozzle and a vacuum system with the front face downwards, and finally sealing the cover tape on the surface of the carrier tape by utilizing a thermal sealing technology to realize the encapsulation of the wafer in the carrier tape. After the carrier tape packaging is completed, the product needs to be subjected to spot check for quality verification.
In the prior art, the wafer encapsulated on the carrier tape is detected by the following methods: first, an operator manually places the carrier tape horizontally on the upper surface of the support plate. The operator then manually secures the carrier tape to the support plate, typically securing both ends of the carrier tape. Then, the operator horizontally places the support plate with the carrier tape fixed on the microscope stage, and slowly moves the support plate in the horizontal direction, thereby detecting the back surface of the wafer in the carrier tape.
After the back surfaces of all the wafers on the carrier tape are detected, the wafers are manually stuck out by using the adhesive tape, the front surfaces of the wafers face upwards, and then the front surfaces of the wafers are detected one by one, so that the operation is inconvenient and the detection efficiency is low. Furthermore, the carrier tape is fixed on the support plate by using the adhesive tape to detect, so that instability exists, namely, the carrier tape is softer, the adhesive tape is possibly deformed, the levelness of the carrier tape fixation cannot be guaranteed, and the detection accuracy is poor.
Disclosure of Invention
The invention aims to provide a chip detection method and a chip detection auxiliary jig, which are used for solving the problems of more detection steps and lower detection efficiency in the prior art.
The technical scheme adopted by the invention is as follows:
one of the purposes of the present invention is to provide a chip detection method, comprising the following steps:
s1, positioning a carrier tape carrying chips, and enabling the first surface of each chip in the carrier tape to be in a detectable state;
s2, detecting appearance defects of the first surfaces of the chips;
s3, turning over the carrier tape to enable the chips to be removed from the carrier tape and reloaded so as to expose the second surfaces of the chips;
s4, detecting appearance defects of the second surfaces of the chips;
Wherein the cover film of the carrier tape is removed after the carrier tape is positioned in the step S1, or the cover film of the carrier tape is removed before the carrier tape is turned in the step S3.
Optionally, the step S1 of positioning the carrier tape carrying the chip includes the following steps:
s11, adjusting the orientation of a carrier tape carrying chips so that each chip is laid on the carrier tape;
and S12, pulling or pushing the carrier tape to move along the length direction of the carrier tape so as to limit the edge of the carrier tape in the width direction of the carrier tape in the thickness direction of the carrier tape.
Optionally, in step S12, an area where the cover film is provided to the carrier tape is avoided when restricting the edge of the carrier tape;
Preferably, the edges of the carrier tape are restrained by means of abutment.
Optionally, in step S3, the carrier tape is turned over, so that each chip is synchronously turned over and removed from the carrier tape and reloaded;
preferably, each chip is removed from the carrier tape under its own weight and reloaded.
Optionally, when the step S1 locates the carrier tape carrying the chips, flattening the carrier tape; and/or flattening the carrier tape when the carrier tape is turned over in the step S3.
The second object of the present invention is to provide a chip inspection auxiliary jig, which is applied to the chip inspection method as described above, wherein the chip inspection auxiliary jig includes a jig body and a cover body that are detachably connected, the jig body is configured to carry the carrier tape and enable the first surface of each chip in the carrier tape to be in a detectable state, and the cover body is configured to load each chip that is flipped out from the carrier tape and enable the second surface of each chip to be exposed.
Optionally, a boss is provided on a surface of the cover body, and in a state that the jig body is connected with the cover body, the boss is configured to load each chip that is turned out from the carrier tape and enable a second surface of each chip to be exposed.
Optionally, a slot is arranged on the surface of the jig body, and the slot extends to at least one end face of the jig body;
Both groove side walls in the width direction of the slot are provided with limiting grooves, and the limiting grooves are configured to limit edges in the width direction of the carrier tape in the thickness direction of the carrier tape.
Optionally, at least a portion of the boss extends into the slot and is capable of flattening the carrier tape.
Optionally, the jig body and/or the cover body are provided with a first index structure, and the first index structure is used for guiding the orientation of the carrier tape bearing the chip when the carrier tape is positioned.
The invention has the beneficial effects that:
According to the chip detection method and the chip detection auxiliary jig, the carrier tape carrying the chips is positioned, the first surface of each chip in the carrier tape is in a detectable state, then appearance defect detection is carried out on the first surface of each chip, after the carrier tape carrying the chips is positioned or after the appearance defect detection on the first surface of the chips is finished, the cover film of the carrier tape is removed, then the carrier tape is turned over, each chip is moved out of the carrier tape and reloaded, the second surface of the chip is exposed, so that appearance defect detection can be carried out on the second surface of each chip, and compared with a mode of turning over each chip one by one, the carrier tape is turned over simultaneously, so that appearance defect detection can be carried out on the first surface and the second surface of each chip, detection operation steps are reduced, and higher appearance defect detection efficiency is achieved. Secondly, detect auxiliary jig and can make the carrier band keep level, can not appear crookedly, easy operation, it is more efficient, reduce the cost of labor.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.
FIG. 1 is a flow chart of a chip detection method provided by an embodiment of the invention;
Fig. 2 is a schematic structural diagram of an auxiliary fixture for chip detection according to an embodiment of the present invention;
FIG. 3 is a side view of an auxiliary fixture for chip inspection according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a cover according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fixture body according to an embodiment of the present invention;
FIG. 6 is a reference diagram of the usage status of the auxiliary jig for chip inspection according to the embodiment of the present invention;
FIG. 7 is a cross-sectional view of a carrier tape with a cover film provided by an embodiment of the present invention;
FIG. 8 is a schematic view of a carrier tape according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a carrier tape with a cover film according to an embodiment of the present invention.
In the figure:
11. a jig body; 111. a slot; 112. a limit groove; 12. a cover body; 121. a boss; 122. positioning holes; 13. a first index structure; 14. a positioning structure;
100. A carrier tape; 200. a pocket structure; 300. a chip; 400. a second index structure; 500. and (5) covering the film.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. In the description of the present embodiment, unless specifically stated otherwise, "a plurality of" means two or more.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
In a first aspect, as shown in fig. 1, the present embodiment provides a chip detection method for detecting an appearance defect of a chip 300, which has a high detection efficiency.
The chip 300 has a first surface and a second surface opposite to each other, and the first surface and the second surface have patterns, and the appearance defect detection is used for detecting whether the patterns of the first surface and the second surface have defects.
The chip detection method comprises the following steps:
s1, positioning a carrier tape 100 carrying chips 300, and enabling a first surface of each chip 300 in the carrier tape 100 to be in a detectable state;
S2, detecting appearance defects on the first surface of each chip 300;
s3, turning the carrier tape 100 to enable each chip 300 to be removed from the carrier tape 100 and reloaded, so as to expose the second surface of each chip 300;
And S4, detecting appearance defects on the second surface of each chip 300.
Before step S1, the chips 300 are placed one by one in the carrier tape 100, wherein, as shown in fig. 6 to 9, the carrier tape 100 is provided with pocket structures 200, the pocket structures 200 are provided in plurality, and the plurality of pocket structures 200 are arranged at intervals along the length direction of the carrier tape 100. The chip 300 is disposed in the pocket structure 200, and in this embodiment, a plurality of chips 300 are disposed, and the chips 300 are disposed in the pocket structure 200 in a one-to-one correspondence. The top surface of the carrier tape 100 is covered with a cover film 500, and the cover film 500 covers the pocket structure 200 to form a space for accommodating the chip 300 in cooperation with the pocket structure 200. As shown in fig. 9, the cover film 500 does not cover the entire top surface of the carrier tape 100. The cover film 500 is a transparent film, and the defect detecting device may detect the appearance of the chip 300 through the cover film 500. When the chip 300 is located in the pocket structure 200, the first surface of the chip 300 faces the cover film 500.
In step S1, by positioning the carrier tape 100, indirect positioning of the chip 300 can be achieved, so that the chip 300 cannot move during appearance detection, thereby improving detection accuracy. The fact that the first surface of the chip 300 is in a detectable state specifically means that the first surface of the chip 300 faces the detection lens of the defect detection device, and no shielding object exists between the first surface and the detection lens, so that the detection lens can clearly acquire the image of the first surface.
In step S2, the first side of each chip 300 may be subjected to appearance defect detection using a defect detection apparatus. Since the first surface of each chip 300 is in a detectable state, in step S2, it is only necessary to detect the plurality of first surfaces one by one, and it is not necessary to flip the chip 300 halfway. The principle of the defect inspection apparatus for inspecting the chip 300 and the specific structure of the defect inspection apparatus can be referred to in the prior art, and the detailed description of the present embodiment is omitted here.
In some alternative embodiments, the cover film 500 of the carrier tape 100 is removed after the carrier tape 100 is positioned at step S1. When positioning the carrier tape 100, the cover film 500 is still attached to the carrier tape 100, so as to avoid polluting the first surface of the chip 300 during positioning the carrier tape 100, and improve the cleanliness of the chip 300. After positioning the carrier tape 100 in step S1, the cover film 500 of the carrier tape 100 is removed, so that when appearance defects are detected on the first surface of each chip 300, the cover film 500 on the carrier tape 100 is removed, and no cover film 500 exists between the first surface of the chip 300 and the detection lens, so that the detection lens can obtain the image of the first surface more clearly, the detection accuracy and precision are further improved, the risk that the chip 300 with unqualified quality flows into the next process is reduced, and the probability of missing detection is further reduced. In this embodiment, the cover film 500 may be removed from the carrier tape 100 by tearing, peeling, or the like, but this embodiment is not limited thereto.
In other alternative embodiments, instead of removing the cover film 500 before the first surface defect detection, the cover film 500 of the carrier tape 100 may be removed after the first surface of each chip 300 is subjected to the appearance defect detection in step S2 and before the carrier tape 100 is flipped in step S3. Since the cover film 500 is transparent, the cover film 500 does not affect the detection result when the first surface is detected.
In this embodiment, when the length of the carrier tape 100 is short, the cover film 500 on the whole carrier tape 100 can be removed to perform defect detection on the chips 300 on the carrier tape 100.
It will be understood, of course, that when the carrier tape 100 is generally long, the carrier tape 100 may be segmented during inspection, and the chip inspection method provided in this embodiment may be used for each segment to perform appearance defect inspection, so as to prevent the problem that the chip 300 is exposed for too long and is contaminated. In this embodiment, the cover film 500 on the carrier tape 100 is removed, specifically, the cover film 500 on the section of the carrier tape 100 to be tested is removed, instead of the cover film 500 on the whole section of the carrier tape 100, so that the chips 300 in the carrier tape 100 in the non-test section will not drop out but are carried by the cover film 500 when the carrier tape 100 is turned over in step S3. When the carrier tape 100 is turned over, only a section of the carrier tape 100 to be detected may be turned over, or the entire carrier tape 100 may be turned over, which is not limited in this embodiment.
In step S3, the carrier tape 100 is turned over, so that the chips 300 in the carrier tape 100 are removed from the carrier tape 100 and reloaded, i.e., the chips 300 are supported again after being turned over along with the carrier tape 100, at this time, the first surface of the chips 300 is in contact with the support, and the second surface of the chips 300 is exposed, so that the appearance defect detection is performed on the second surface of the chips 300 in the following.
Optionally, in step S3, after the carrier tape 100 is turned over and the chip 300 is reloaded, the chip 300 is separated from the carrier tape 100, and at this time, the carrier tape 100 may be removed, so that no carrier tape 100 exists between the second surface of the chip 300 and the inspection lens.
In step S4, the method of detecting the appearance defect of the second surface of the chip 300 is the same as the method of detecting the appearance defect of the first surface, and the embodiment is not described herein again.
According to the chip detection method provided by the embodiment, the carrier tape 100 carrying the chips 300 is positioned, the first surface of each chip 300 in the carrier tape 100 is in a detectable state, then, the first surface of each chip 300 is subjected to appearance defect detection, after the carrier tape 100 carrying the chips 300 is positioned or after the detection of the appearance defects of the first surface of the chips 300 is completed, the cover film 500 of the carrier tape 100 is removed, then, the carrier tape 100 is turned over, each chip 300 is removed from the carrier tape 100 and reloaded, and the second surface of each chip 300 is exposed, so that the appearance defects of the second surface of each chip 300 can be detected, and compared with the mode of adsorbing each chip 300 one by one, the turning over of the carrier tape 100 can be realized, so that the appearance defects of the first surface and the second surface of each chip 300 can be detected, the operation steps of the detection of the chips 300 are reduced, and the efficiency of appearance defect detection is higher.
Optionally, step S1 locates the carrier tape 100 carrying the chips 300, including the steps of:
S11, adjusting the orientation of the carrier tape 100 carrying the chips 300 so that each chip 300 lies on the carrier tape 100;
s12, the carrier tape 100 is pulled or pushed along the length direction of the carrier tape 100 to move, so as to limit the edges of the carrier tape 100 in the width direction in the thickness direction of the carrier tape 100.
In step S11, the orientation of the carrier tape 100 may be manually adjusted, or the orientation of the carrier tape 100 may be adjusted by a device such as a robot, which is not limited in this embodiment. After the orientation of the carrier tape 100 is adjusted, each chip 300 lies in the pocket structure 200 of the carrier tape 100, and the first surface of each chip 300 faces the cover film 500, and the second surface contacts the bottom of the pocket structure 200, so that the chips 300 can be stably supported on the carrier tape 100.
In step S12, after the orientation of the carrier tape 100 is adjusted, the carrier tape 100 can be pulled or pushed along the length direction of the carrier tape 100 to move, and the edges of the carrier tape 100 in the width direction of the carrier tape 100 are limited by the chip detection auxiliary jig or other jigs in the thickness direction of the carrier tape 100, so as to position the carrier tape 100, so that the carrier tape 100 cannot move in the thickness direction of the carrier tape 100, and further, the problem of the inclination of the chip 300 caused by the inclination of the carrier tape 100 is reduced, and further, the chip 300 can directly face the detection lens, thereby improving the detection efficiency and the detection accuracy. By restricting the edges of the width of the carrier tape 100, the occurrence of the shielding of the chip 300 can be prevented, and the feasibility of appearance defect detection can be improved. It should be noted that, in the process of pulling or pushing the carrier tape 100 along the length direction of the carrier tape 100, the chip detection auxiliary jig or other jigs may gradually limit the carrier tape 100.
Alternatively, the limitation of the edges in the width direction of the carrier tape 100 in the thickness direction of the carrier tape 100 may be clamping, pressing, or perforation positioning of the edges in the width direction of the carrier tape 100, and the like, which is not limited in this embodiment. Preferably, the edge of the carrier tape 100 is limited by pressing, so that a good limiting effect can be achieved.
In some alternative embodiments, in step S12, the area where the cover film 500 is disposed on the carrier tape 100 is avoided when the edge of the carrier tape 100 is limited, so that the difficulty of removing the cover film 500 is prevented from being increased due to the limitation of the auxiliary jig or other jigs for chip inspection, the removal of the cover film 500 is facilitated, and the operation difficulty is reduced.
Optionally, in step S3, the carrier tape 100 is flipped so that each chip 300 is synchronously flipped out of the carrier tape 100 and reloaded. By synchronously turning and moving out each chip 300 from the carrier tape 100, the surface changing speed and surface changing efficiency of the plurality of chips 300 can be further improved, and the appearance defect detection efficiency can be further improved.
In some alternative embodiments, each chip 300 is removed from carrier tape 100 under its own weight and reloaded. Each chip 300 moves out of the carrier tape 100 under the action of self gravity, so that after the carrier tape 100 is turned over, the chip 300 does not need to be moved by an additional tool, the automatic movement of the chip 300 and the automatic reloading of the chip 300 on a support are realized, and the appearance defect detection efficiency is further improved.
In this embodiment, optionally, when positioning the carrier tape 100 carrying the chips 300 in step S1, the carrier tape 100 is flattened, so that the carrier tape 100 is relatively flat, so as to avoid the problem of bending or arching of the carrier tape 100, and the chips 300 are located on the same plane, which is convenient for subsequent overturning on one hand, and for detecting the first surfaces of the chips 300 by the defect detection device on the other hand, without focusing for multiple times.
It will be understood, of course, that carrier tape 100 may be flattened during step S3 to ensure that chips 300 in carrier tape 100 are able to move out of carrier tape 100 under their own weight and to expose the second side.
The chip detection method provided by the embodiment is simple to operate, more efficient and capable of reducing labor cost. In addition, the flatness requirements of the carrier tape 100 and the chip 300 can be satisfied, and the detection accuracy can be improved. In addition, the risk of damaging the chip 300 is also eliminated, the safety is high, and the stable first-side sample detection and the stable second-side sample detection can be performed, so that the detection is comprehensive.
In a second aspect, the present embodiment further provides an auxiliary jig for chip detection, which is applied to the method for detecting a chip in the first aspect, and can improve convenience and efficiency of detecting an appearance defect of the chip 300.
As shown in fig. 2 to 6, the auxiliary jig for chip inspection includes a jig body 11 and a cover 12 which are detachably connected. The jig body 11 and the cover 12 have a connection state and a separation state, and can be converted into different states according to actual requirements when the chip detection method is implemented.
Optionally, the materials of the jig body 11 and the cover 12 include, but are not limited to, stainless steel, cast iron, copper, aluminum, plastic, etc.
Optionally, the shape of the chip detection auxiliary fixture may be cuboid, cube, cylinder or other geometric shapes.
The jig body 11 in this embodiment is configured to carry the carrier tape 100 and enable the first surface of each chip 300 in the carrier tape 100 to be in a detectable state, and the cover 12 is configured to load each chip 300 flipped out from the carrier tape 100 and enable the second surface of each chip 300 to be exposed.
The jig body 11 can position the carrier tape 100 carrying the chip 300.
Optionally, when the carrier tape 100 is turned over, the auxiliary jig may be detected by turning over the chip, so as to turn over the carrier tape 100.
According to the chip detection auxiliary jig provided by the embodiment, the carrier tape 100 carrying the chips 300 is carried and positioned through the jig body 11, so that the first face of each chip 300 in the carrier tape 100 is in a detectable state, when the carrier tape 100 is turned over, the chip detection auxiliary jig can be turned over, and then the turning over of the carrier tape 100 is realized, so that each chip 300 is moved out of the carrier tape 100 and reloaded, and the second face of the chip 300 is exposed.
Optionally, in a state where the jig body 11 and the cover 12 are connected, as shown in fig. 3 and 4, a boss 121 is provided on a surface of the cover 12 facing the jig body 11. The boss 121 is configured to load each chip 300 flipped out of the carrier tape 100, that is, after the chip 300 is flipped, the first surface of the chip 300 contacts the boss 121 and is supported by the boss 121. The bumps 121 are further configured to expose the second side of each chip 300 to facilitate appearance defect detection of the second side of the chip 300.
For example, referring to fig. 3 and 5, in the connected state of the jig body 11 and the cover 12, the surface of the jig body 11 facing the cover 12 is provided with a slot 111, and the slot 111 extends to at least one end surface of the jig body 11, so that the carrier tape 100 is conveniently inserted into the slot 111 from the notch of the end surface of the jig body 11. The slot 111 is used for accommodating the carrier tape 100.
In some alternative embodiments, the slot 111 extends along the length of the jig body 11, that is, the length of the slot 111 is the same as the length of the jig body 11. The slots 111 have notches on two opposite end surfaces of the jig body 11 in the length direction, that is, the slots 111 penetrate through the jig body 11 in the length direction of the jig body 11, so that the carrier tape 100 can be conveniently inserted into and penetrated out.
The depth direction of the slot 111 is the same as the height direction of the jig body 11, and the surface of the jig body 11 facing the cover 12 is one surface in the height direction of the jig body 11. The width direction of the slot 111 is the same as the width direction of the jig body 11. For example, the slot 111 may be a U-shaped slot, a V-shaped slot, a trapezoid slot, or the like, which is not limited in this embodiment.
As shown in fig. 5, both groove side walls in the width direction of the slot 111 are provided with a stopper groove 112, and the stopper groove 112 is configured to restrict the edges in the width direction of the carrier tape 100 in the thickness direction of the carrier tape 100. For example, two edges of the carrier tape 100 in the width direction extend into the two limiting grooves 112 in a one-to-one correspondence, and the limiting grooves 112 limit the carrier tape 100, for example, the edges of the carrier tape 100 may be pressed against to limit the movement of the carrier tape 100 in the thickness direction thereof. The region of the carrier tape 100 where the cover film 500 is provided is not inserted into the limiting groove 112, that is, the region of the jig body 11 where the cover film 500 is provided to avoid the carrier tape 100 when limiting the edge of the carrier tape 100.
Alternatively, the size of the limit groove 112 in the width direction of the slot 111 may be larger to enable limitation of the carrier tape 100 having different widths, with a larger application range.
It should be further noted that, the distance between the limiting groove 112 and the groove bottom wall of the slot 111 is greater than the height of the chip 300, so that the carrier tape 100 carrying the chip 300 can be located in the slot 111 without squeezing the chip 300, thereby improving the detection safety.
Optionally, at least part of the boss 121 protrudes into the slot 111 and is capable of flattening the carrier tape 100, i.e. flattening the carrier tape 100 by the boss 121 when positioning the carrier tape 100 carrying the chips 300 in step S1 and when flipping the carrier tape 100 in step S3.
In some alternative embodiments, as shown in fig. 5, the jig body 11 is provided with a first index structure 13, where the first index structure 13 is used to guide the orientation of the carrier tape 100 when positioning the carrier tape 100 carrying the chips 300, so as to facilitate adjustment of the orientation of the carrier tape 100, and enable each chip 300 to lie on the carrier tape 100. In this embodiment, the first index structure 13 is disposed on one side in the width direction of the slot 111, and the second index structure 400 is disposed on one side of the pocket structure 200 in the width direction of the carrier tape 100, so that the first index structure 13 and the second index structure 400 can be positioned on the same side of the slot 111 when the carrier tape 100 is inserted into the slot 111, so that the carrier tape 100 can be inserted into the slot 111 in a correct orientation. The index structure in this embodiment may be a through hole, a groove, a protrusion, a pattern, or the like, which is not limited in this embodiment. The number of the first index structures 13 and the number of the second index structures 400 may be one or more, which is not limited in this embodiment.
It will be understood, of course, that the cover 12 may also be provided with the first index structure 13, which is not limited in this embodiment. The first index structure 13 on the cover 12 and the first index structure 13 on the jig body 11 may be different in size so as to distinguish the jig body 11 from the cover 12.
Alternatively, one of the jig body 11 and the cover 12 is provided with a positioning structure 14, and the other is provided with a positioning hole 122, and the positioning structure 14 may be a positioning pin. When the jig body 11 and the cover 12 are connected, the positioning structure 14 is inserted into the positioning hole 122 to realize positioning assembly of the jig body 11 and the cover 12, so that the boss 121 can be smoothly inserted into the slot 111 and can smoothly support the chip 300. In this embodiment, the positioning structure 14 is disposed on the jig body 11, and the positioning hole 122 is disposed on the cover 12. After the jig body 11 and the cover body 12 are buckled and connected, the jig can be locked through a locking structure so as to avoid the separation of the jig body and the cover body without force.
The specific way of detecting the appearance of the chip 300 by using the chip detection auxiliary jig provided in this embodiment is as follows:
In the initial state, the jig body 11 is buckled and connected with the cover body 12. The second index structure 400 of the carrier tape 100 is aligned with the first index structure 13 of the jig body 11 or the cover 12, and the carrier tape 100 carrying the chips 300 is inserted into the slots 111 with a correct orientation. The cover body 12 is separated from the jig body 11, specifically, the jig body 11 is placed on a horizontal plane, the jig body 11 is motionless, the cover body 12 moves away from the jig body 11, the first index structure 13 and the second index structure 400 are kept close to an operator, the cover tape is torn off, or after the appearance defect detection of the first surface of the chip 300 is completed, the cover tape is torn off. Then, the positioning structure 14 and the positioning hole 122 are aligned, and the cover 12 and the jig body 11 are closed, and at this time, the first index structure 13 is still close to the operator. Then, the chip detection auxiliary jig is turned over 180 degrees, so that the cover body 12 is supported on the horizontal plane, and the first index structure 13 is far away from an operator. In the overturning process, the carrier tape 100 overturns along with the jig body 11, and the chip 300 is reloaded on the boss 121 of the cover body 12. The cover 12 is controlled to be stationary, the jig body 11 is moved away from the cover 12 to expose the second surface of the chip 300, and then the second surface is subjected to appearance defect detection.
The auxiliary jig for chip detection provided by the embodiment realizes foolproof operation of an operator, can ensure that the carrier tape 100 is put in to meet the flatness requirement, and improves the detection precision. And, carry carrier tape 100 that bears a plurality of chips 300 through chip detection auxiliary jig and fix a position, later tear out the covering film 500 on the carrier tape 100 to make the first face of chip 300 expose, so that carry out appearance defect detection to the second face, through upset chip detection auxiliary jig, realize the simultaneous upset to a plurality of chips 300 on carrier tape 100 and carrier tape 100, need not to overturn every chip 300 one by one, only need to carry out appearance defect detection to the second face of chip 300 can, the step when having reduced chip 300 defect detection, defect detection's efficiency has been improved.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202411397245.2A CN119000716A (en) | 2024-10-08 | 2024-10-08 | Chip detection method and chip detection auxiliary jig |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202411397245.2A CN119000716A (en) | 2024-10-08 | 2024-10-08 | Chip detection method and chip detection auxiliary jig |
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| CN119000716A true CN119000716A (en) | 2024-11-22 |
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| CN202411397245.2A Pending CN119000716A (en) | 2024-10-08 | 2024-10-08 | Chip detection method and chip detection auxiliary jig |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210808110U (en) * | 2018-05-14 | 2020-06-19 | 株式会社富士 | With automatic handling means |
| CN111758308A (en) * | 2018-03-22 | 2020-10-09 | 株式会社富士 | Inspection device for automatic loading type feeder and electronic component mounting machine |
| CN214952971U (en) * | 2021-04-23 | 2021-11-30 | 钜祥精密模具（苏州）有限公司 | Carrier band product quality detection device |
| CN215623249U (en) * | 2021-05-10 | 2022-01-25 | 苏州朗阔自动化设备有限公司 | Carrier band dyestripping mechanism in advance |
| CN218629478U (en) * | 2022-11-15 | 2023-03-14 | 吉光半导体(绍兴)有限公司 | Chip inspection jig |
| CN218786150U (en) * | 2022-12-22 | 2023-04-04 | 深圳市恒鸿电子有限公司 | Film tearing device for simple chip carrier tape |
| CN220501508U (en) * | 2023-08-03 | 2024-02-20 | 苏州共进微电子技术有限公司 | Bearing belt |
-
2024
- 2024-10-08 CN CN202411397245.2A patent/CN119000716A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111758308A (en) * | 2018-03-22 | 2020-10-09 | 株式会社富士 | Inspection device for automatic loading type feeder and electronic component mounting machine |
| CN210808110U (en) * | 2018-05-14 | 2020-06-19 | 株式会社富士 | With automatic handling means |
| CN214952971U (en) * | 2021-04-23 | 2021-11-30 | 钜祥精密模具（苏州）有限公司 | Carrier band product quality detection device |
| CN215623249U (en) * | 2021-05-10 | 2022-01-25 | 苏州朗阔自动化设备有限公司 | Carrier band dyestripping mechanism in advance |
| CN218629478U (en) * | 2022-11-15 | 2023-03-14 | 吉光半导体(绍兴)有限公司 | Chip inspection jig |
| CN218786150U (en) * | 2022-12-22 | 2023-04-04 | 深圳市恒鸿电子有限公司 | Film tearing device for simple chip carrier tape |
| CN220501508U (en) * | 2023-08-03 | 2024-02-20 | 苏州共进微电子技术有限公司 | Bearing belt |
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