CN118899291A - A power module suitable for parallel connection - Google Patents

Abstract

The invention provides a power module suitable for parallel connection. The power module includes: the substrate, the first layer of the substrate is the wiring layer, the second layer is the insulating layer; the upper bridge arm is arranged on the wiring layer, comprises at least one power chip and is provided with a first pole and a second pole; the lower bridge arm is arranged on the wiring layer, comprises at least one power chip and is provided with a third pole and a fourth pole; the plastic package body is covered on the wiring layer to cover the upper bridge arm and the lower bridge arm; the DC+ terminal is connected with the first pole, the DC-terminal is connected with the fourth pole, the power AC terminal is simultaneously connected with the second pole and the third pole, and the parallel AC terminal is simultaneously connected with the second pole and the third pole; the length of the current path between the upper leg and the parallel AC terminal is less than the length of the current path between the upper leg and the power AC terminal. According to the invention, the problem that the gate voltage oscillation phenomenon exists when the existing power module is used in parallel can be solved.

Description

A power module suitable for parallel connection

Technical Field

The present invention belongs to the technical field of power modules, and more specifically, relates to a power module suitable for parallel connection.

Background Art

At present, power modules are widely used in many fields such as new energy vehicles, new energy power generation, smart grids and transportation electrification. Among them, in some fields, such as the controller of new energy vehicles, there are higher requirements for the power of power modules. In order to meet the high power requirements of power modules in the corresponding application fields, it is a common solution to use multiple power modules in parallel. However, since the existing power modules are not specifically designed for AC side output, if multiple power modules are used in parallel, a gate voltage oscillation phenomenon will occur due to the inconsistency of the conduction characteristics and reverse recovery characteristics of the body diode of the power chip, which will seriously affect the reliability of the power module.

Summary of the invention

The purpose of the present invention is to solve the problem of gate voltage oscillation when the existing power modules are used in parallel.

In order to achieve the above object, the present invention provides a power module suitable for parallel connection, the power module comprising:

A substrate, wherein the first layer of the substrate is a wiring layer, and the second layer of the substrate is an insulating layer;

An upper bridge arm is arranged on the wiring layer, the upper bridge arm includes at least one power chip and has a first pole and a second pole;

A lower bridge arm is arranged on the wiring layer, the lower bridge arm includes at least one power chip and has a third pole and a fourth pole;

A plastic package body, which is disposed on the wiring layer to cover the upper bridge arm and the lower bridge arm;

The DC+ terminal, DC- terminal, power AC terminal and parallel AC terminal are exposed relative to the plastic package, the DC+ terminal is connected to the first pole, the DC- terminal is connected to the fourth pole, the power AC terminal is connected to the second pole and the third pole at the same time, and the parallel AC terminal is connected to the second pole and the third pole at the same time;

A length of a current path between the upper bridge arm and the parallel AC terminal is smaller than a length of a current path between the upper bridge arm and the power AC terminal.

Optionally, the plastic package body has a first end surface and a second end surface opposite to each other in a first direction;

The DC-terminal extends out of the first end surface from the inside of the plastic package body;

The power AC terminal extends out from the inside of the plastic package body to the second end surface.

Optionally, the upper bridge arm and the lower bridge arm are arranged opposite to each other in the first direction;

The upper bridge arm is closer to the power AC terminal than the lower bridge arm;

The lower bridge arm is closer to the DC-terminal than the upper bridge arm.

Optionally, the parallel AC terminal is exposed relative to the upper surface of the plastic package body;

In the first direction, the parallel AC terminal is located between the power AC terminal and the upper bridge arm.

Optionally, the parallel AC terminal is exposed relative to the upper surface of the plastic package body;

In the first direction, the parallel AC terminal is located between the upper bridge arm and the lower bridge arm.

Optionally, the parallel AC terminal is exposed relative to the upper surface of the plastic package body;

In the first direction, the parallel AC terminal and the upper bridge arm are arranged in parallel.

Optionally, the parallel AC terminal is a conductive block extending beyond the upper surface of the plastic package;

Alternatively, the parallel AC terminal is formed on the wiring layer, and a window corresponding to the position of the parallel AC terminal is provided on the upper surface of the plastic package body.

Optionally, the upper bridge arm and the lower bridge arm each include N power chips;

When N is 1, the first pole is the first power electrode of the power chip in the upper bridge arm, the second pole is the second power electrode of the power chip in the upper bridge arm, the third pole is the first power electrode of the power chip in the lower bridge arm, and the fourth pole is the second power electrode of the lower bridge arm;

When N is greater than 1, the first pole is the common lead-out terminal of the first power electrodes of the N power chips in the upper bridge arm, the second pole is the common lead-out terminal of the second power electrodes of the N power chips in the upper bridge arm, the third pole is the common lead-out terminal of the first power electrodes of the N power chips in the lower bridge arm, and the fourth pole is the common lead-out terminal of the second power electrodes of the N power chips in the lower bridge arm.

Optionally, the power chip is connected to the wiring layer via a first solder layer;

The second pole of the upper bridge arm is connected to the wiring layer via a metal sheet and a second solder layer in sequence, or the second pole of the upper bridge arm is connected to the wiring layer via a metal sheet and a second solder layer in sequence, the metal sheet is part of the power AC terminal, or the second pole of the upper bridge arm is connected to the wiring layer via a binding wire.

Optionally, the power module further includes:

The signal terminal is exposed relative to the plastic package body.

Optionally, a metal heat dissipation layer is provided on a side of the insulation layer away from the wiring layer.

The beneficial effects of the present invention are:

The power module suitable for parallel connection of the present invention is designed with an independent parallel AC terminal, and the current flow distance from the upper bridge arm to the parallel AC terminal is shorter than the current flow distance from the upper bridge arm to the power AC terminal. When multiple power modules are used in parallel, the parallel AC terminals are connected by a copper busbar, thereby forming a low-inductance parallel path. The formation of this low-inductance parallel path can greatly reduce the amplitude of the induced voltage on the parasitic inductance of the power chip, and thus can effectively reduce the risk of gate voltage oscillation caused by the parallel use of multiple power modules. It can be seen that the use of the power module suitable for parallel connection of the present invention can effectively solve the problem of gate voltage oscillation when the existing power modules are used in parallel.

Other features and advantages of the present invention will be described in detail in the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to represent the same or similar components.

FIG1 shows a cross-sectional view of a power module suitable for parallel connection according to an embodiment of the present invention;

FIG2 shows a top perspective view of a power module suitable for parallel connection according to an embodiment of the present invention;

FIG3 shows a schematic structural diagram of a power module suitable for parallel connection according to an embodiment of the present invention, wherein the plastic package is not shown;

FIG4 shows a schematic structural diagram of another power module suitable for parallel connection according to an embodiment of the present invention, wherein the plastic package is not shown;

FIG5 shows a top perspective view of yet another power module suitable for parallel connection according to an embodiment of the present invention;

FIG. 6 shows a circuit schematic diagram of a power module suitable for parallel connection according to an embodiment of the present invention.

DETAILED DESCRIPTION

In order to enable those skilled in the art to more fully understand the technical solution of the present invention, the exemplary embodiments of the present invention will be described in more comprehensive and detailed in conjunction with the accompanying drawings below. Obviously, the one or more embodiments of the present invention described below are only one or more of the specific ways in which the technical solution of the present invention can be implemented, and are not exhaustive. It should be understood that other ways belonging to a general inventive concept can be used to implement the technical solution of the present invention, and should not be limited by the exemplary embodiments described. Based on one or more embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work should fall within the scope of protection of the present invention.

Embodiment: Figure 1 shows a cross-sectional view of a power module suitable for parallel connection according to an embodiment of the present invention; Figure 2 shows a top perspective view of a power module suitable for parallel connection according to an embodiment of the present invention; Figure 3 shows a structural schematic diagram of a power module suitable for parallel connection according to an embodiment of the present invention, wherein the plastic package is not shown; Figure 6 shows a circuit schematic diagram of a power module suitable for parallel connection according to an embodiment of the present invention.

1, 2, 3 and 6, a power module suitable for parallel connection according to an embodiment of the present invention includes:

A substrate 100, wherein the first layer of the substrate 100 is a wiring layer 110, and the second layer is an insulating layer 120;

The upper bridge arm 200 is disposed on the wiring layer 110 . The upper bridge arm 200 includes two power chips 210 and has a first pole 220 and a second pole 230 .

The lower bridge arm 300 is disposed on the wiring layer 110 . The lower bridge arm 300 includes two power chips 310 and has a third pole 320 and a fourth pole 330 .

The plastic package body 400 is disposed on the wiring layer 110 to cover the upper bridge arm 200 and the lower bridge arm 300;

The DC+ terminal 510, the DC-terminal 520, the power AC terminal 530 and the parallel AC terminal 540 are exposed relative to the plastic package body 400, the DC+ terminal 510 is connected to the first pole 220, the DC-terminal 520 is connected to the fourth pole 330, the power AC terminal 530 is connected to the second pole 230 and the third pole 320 at the same time, and the parallel AC terminal 540 is connected to the second pole 230 and the third pole 320 at the same time;

The length of the current path between the upper bridge arm 200 and the parallel AC terminal 540 is smaller than the length of the current path between the upper bridge arm 200 and the power AC terminal 530 .

Further, in the embodiment of the present invention, the plastic package body 400 has a first end surface 410 and a second end surface 420 that are opposite to each other in a first direction;

The DC-terminal 520 extends out of the first end surface 410 from the inside of the plastic package body 400;

The power AC terminal 530 extends out of the second end surface 420 from the inside of the plastic package body 400 .

Furthermore, in the embodiment of the present invention, the upper bridge arm 200 and the lower bridge arm 300 are arranged opposite to each other in the first direction;

The upper bridge arm 200 is closer to the power AC terminal 530 than the lower bridge arm 300;

The lower bridge arm 300 is closer to the DC-terminal 520 than the upper bridge arm 200 .

Furthermore, in the embodiment of the present invention, the parallel AC terminal 540 is exposed relative to the upper surface 430 of the plastic package body 400;

In the first direction, the parallel AC terminal 540 is located between the power AC terminal 530 and the upper bridge arm 200 .

Specifically, Fig. 4 shows a top perspective view of another power module suitable for parallel connection according to an embodiment of the present invention. Referring to Fig. 4, as an optional embodiment, in the embodiment of the present invention, the parallel AC terminal 540 is exposed relative to the upper surface 430 of the plastic package 400;

In the first direction, the parallel AC terminal 540 is located between the upper bridge arm 200 and the lower bridge arm 300 .

Specifically, as an optional implementation, in the embodiment of the present invention, the parallel AC terminal 540 is exposed relative to the upper surface 430 of the plastic package body 400;

In the first direction, the parallel AC terminal 540 is arranged in parallel with the upper bridge arm 200, that is, in this arrangement, the parallel AC terminal 540 is opposite to the first side of the upper bridge arm 200 and is spaced apart, or the parallel AC terminal 540 is opposite to the second side of the upper bridge arm 200 and is spaced apart, wherein the first side of the upper bridge arm 200 is opposite to the second side of the upper bridge arm 200 in the second direction, and the second direction is perpendicular to the first direction.

Furthermore, in the embodiment of the present invention, the parallel AC terminal 540 is a conductive block that extends beyond the upper surface 430 of the plastic package 400;

Alternatively, the parallel AC terminal 540 is formed on the wiring layer 110 , and a window corresponding to the position of the parallel AC terminal 540 is provided on the upper surface 430 of the plastic package body 400 .

Specifically, in the embodiment of the present invention, if the parallel AC terminal 540 is implemented by a conductive block extending beyond the upper surface 430 of the plastic package body 400 , the conductive block is made of conductive materials such as copper, aluminum, copper-molybdenum alloy, or aluminum silicon carbide.

Specifically, referring to FIG. 3 and FIG. 6 , in the embodiment of the present invention, the upper bridge arm 200 includes two power chips 210 , and the lower bridge arm 300 includes two power chips 310 ;

The first pole 220 is a common lead-out terminal of the first power electrodes of the two power chips 210 in the upper bridge arm 200 , and the second pole 230 is a common lead-out terminal of the second power electrodes of the two power chips 210 in the upper bridge arm 200 ;

The third pole 320 is a common lead-out terminal of the first power electrodes of the two power chips 310 in the lower bridge arm 300 , and the fourth pole 330 is a common lead-out terminal of the second power electrodes of the two power chips 310 in the lower bridge arm 300 .

Specifically, the power chip used in the power module suitable for parallel connection in the embodiment of the present invention may be one or more of a diode chip (Diode chip), a metal oxide semiconductor field effect transistor chip (MOSFET chip), an insulated gate bipolar transistor chip (IGBT chip), a high electron mobility transistor chip (HEMT chip), a junction field effect transistor chip (JFET chip), a bipolar junction transistor chip (BJT chip) or a thyristor chip (SCR chip).

Specifically, in an embodiment of the present invention, if the power chip 210 and the power chip 310 are both MOSFET chips, the first pole 220 is the common lead-out terminal of the drain of the two power chips 210 in the upper bridge arm, and the second pole 230 is the common lead-out terminal of the source of the two power chips 210 in the upper bridge arm; the third pole 320 is the common lead-out terminal of the drain of the two power chips 310 in the lower bridge arm, and the fourth pole 330 is the common lead-out terminal of the source of the two power chips 310 in the lower bridge arm.

Further, referring to FIG. 1 and FIG. 3 , in the embodiment of the present invention, the power chip 310 in the lower bridge arm 300 is connected to the wiring layer 110 through the first solder layer 610 ;

The second pole 230 of the upper bridge arm 200 is connected to the wiring layer 110 through the metal sheet 531 and the second solder layer 630 in sequence, and the metal sheet 531 is a part of the power AC terminal 530;

The power chip 210 in the upper bridge arm 200 is connected to the wiring layer 110 through the third solder layer 620 .

Specifically, as an optional implementation, in the embodiment of the present invention, the second pole 230 of the upper bridge arm 200 can be connected to the wiring layer 110 through an independent metal sheet and a second solder layer 630 in sequence;

The second pole 230 of the upper bridge arm 200 may also be connected to the wiring layer 110 via a binding wire, where the binding wire is a linear conductive structure such as an aluminum wire, an aluminum tape, a copper wire or a copper tape.

Specifically, in the embodiment of the present invention, the first solder layer 610 is a conductive connecting material such as sintered silver, solder or conductive silver paste, the second solder layer 630 is a conductive connecting material such as sintered silver, solder or conductive silver paste, and the third solder layer 620 is a conductive connecting material such as sintered silver, solder or conductive silver paste.

Further, referring to Figure 1, the power module of the embodiment of the present invention further includes:

The signal terminal 550 is exposed relative to the plastic package body 400 . The signal terminal 550 is a welding terminal or a crimping terminal led out from the first end surface 410 or the second end surface 420 of the plastic package body 400 .

Specifically, in the embodiment of the present invention, the signal terminal 550 can also be a welding terminal or a crimping terminal extending beyond the upper surface 430 of the plastic package body 400, or can be a conductive block extending beyond the upper surface 430 of the plastic package body 400, or can be formed above the wiring layer 110, and a window corresponding to the signal terminal 550 is provided at a corresponding position on the upper surface 430 of the plastic package body 400.

Specifically, in the embodiment of the present invention, the number of the parallel AC terminals 540 may be one or more than two; illustratively, when the number of the parallel AC terminals 540 is two, the arrangement of the parallel AC terminals 540 is shown in FIG. 5 .

Furthermore, in the embodiment of the present invention, the substrate 100 further includes a third layer, which is a metal heat dissipation layer. The metal heat dissipation layer is disposed on a side of the insulating layer 120 away from the wiring layer 110 .

Specifically, in the embodiment of the present invention, the insulating layer is made of insulating materials such as aluminum oxide, aluminum nitride, zirconium oxide, silicon nitride, epoxy resin or silicone.

Although one or more embodiments of the present invention are described above, it should be known to those skilled in the art that the present invention can be implemented in any other form without departing from its subject matter and scope. Therefore, the embodiments described above are illustrative rather than restrictive, and many modifications and substitutions are obvious to those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims (10)

1. A power module adapted for parallel connection, comprising:

the substrate comprises a first layer, a second layer and a third layer, wherein the first layer of the substrate is a wiring layer, and the second layer is an insulating layer;

The upper bridge arm is arranged on the wiring layer, comprises at least one power chip and is provided with a first pole and a second pole;

The lower bridge arm is arranged on the wiring layer, comprises at least one power chip and is provided with a third pole and a fourth pole;

the plastic package body is covered on the wiring layer to cover the upper bridge arm and the lower bridge arm;

The DC+ terminal is connected with the first pole, the DC-terminal is connected with the fourth pole, the power AC terminal is simultaneously connected with the second pole and the third pole, and the parallel AC terminal is simultaneously connected with the second pole and the third pole;

The length of the current path between the upper leg and the parallel AC terminals is less than the length of the current path between the upper leg and the power AC terminals.

2. The parallel power module of claim 1, wherein the parallel AC terminals are exposed with respect to an upper surface of the plastic package.

3. The power module of claim 2, wherein the plastic package has a first end face and a second end face opposite in a first direction;

the DC-terminal extends out of the first end face from the inside of the plastic package body;

The power AC terminal extends out of the second end face from the inside of the plastic package body.

4. The parallel-adapted power module of claim 3, wherein the upper leg and the lower leg are oppositely disposed in the first direction;

the upper bridge arm is close to the power AC terminal relative to the lower bridge arm;

The lower leg is proximate to the DC-terminal relative to the upper leg.

5. The parallel-adapted power module of claim 4, wherein in the first direction the parallel AC terminals are located between the power AC terminals and the upper leg, or in the first direction the parallel AC terminals are located between the upper leg and the lower leg, or in the first direction the parallel AC terminals are arranged in parallel with the upper leg.

6. The parallel power module of claim 2, wherein the parallel AC terminals are conductive blocks that extend beyond an upper surface of the plastic enclosure;

or the parallel AC terminals are formed on the wiring layer, and windows corresponding to the positions of the parallel AC terminals are arranged on the upper surface of the plastic package body.

7. The power module of claim 1, wherein the upper leg and the lower leg each comprise N power chips;

When N is 1, the first pole is a first power electrode of the power chip in the upper bridge arm, the second pole is a second power electrode of the power chip in the upper bridge arm, the third pole is a first power electrode of the power chip in the lower bridge arm, and the fourth pole is a second power electrode in the lower bridge arm;

When N is greater than 1, the first pole is a common lead-out end of the first power electrodes of the N power chips in the upper bridge arm, the second pole is a common lead-out end of the second power electrodes of the N power chips in the upper bridge arm, the third pole is a common lead-out end of the first power electrodes of the N power chips in the lower bridge arm, and the fourth pole is a common lead-out end of the second power electrodes of the N power chips in the lower bridge arm.

8. The power module of claim 1, wherein the power chip is connected to the wiring layer by a first solder layer;

The second pole of the upper bridge arm is connected with the wiring layer through a metal sheet and a second welding material layer in sequence, or the second pole of the upper bridge arm is connected with the wiring layer through a metal sheet and a second welding material layer in sequence, the metal sheet is a part of a power AC terminal, or the second pole of the upper bridge arm is connected with the wiring layer through a binding line.

9. The parallel-adapted power module of claim 1, further comprising:

and the signal terminal is exposed relative to the plastic package body.

10. The power module adapted for parallel connection according to claim 1, characterized in that a metallic heat dissipation layer is provided on the side of the insulating layer remote from the wiring layer.