CN118866823B - Gallium nitride device and gallium nitride packaging structure - Google Patents
Gallium nitride device and gallium nitride packaging structure Download PDFInfo
- Publication number
- CN118866823B CN118866823B CN202411092001.3A CN202411092001A CN118866823B CN 118866823 B CN118866823 B CN 118866823B CN 202411092001 A CN202411092001 A CN 202411092001A CN 118866823 B CN118866823 B CN 118866823B
- Authority
- CN
- China
- Prior art keywords
- gallium nitride
- frame
- packaging
- fixedly arranged
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a gallium nitride device and a gallium nitride packaging structure, and particularly relates to the technical field of gallium nitride packaging, comprising a gallium nitride device body, wherein the gallium nitride device body comprises a bottom packaging piece, a second packaging frame is arranged at the bottom end of the bottom packaging piece, and a gallium nitride chip is arranged between the bottom packaging piece and the second packaging frame; according to the invention, the bottom module is arranged, the first packaging mechanism and the second packaging mechanism are matched for use, the heat radiation bottom plate and the plurality of connecting pins are fixed in a plastic packaging mode to form the bottom packaging piece, the first-stage packaging of the bottom of the gallium nitride device is realized, the bottom packaging piece and the gallium nitride chip are fixed in a plastic packaging mode, the second-stage packaging of the gallium nitride device is realized, the gallium nitride device is fixed in a packaging mode by adopting the first-stage packaging mode and the second-stage packaging mode, the connection and the fixation of all parts in the gallium nitride device are facilitated, the subsequent independent disassembly of the second packaging frame is facilitated for overhauling the gallium nitride chip, and the packaging effect in the gallium nitride device is improved.
Description
Technical Field
The invention relates to the technical field of gallium nitride packaging, in particular to a gallium nitride device and a gallium nitride packaging structure.
Background
Gallium nitride devices are electronic devices based on gallium nitride materials, gallium nitride is a wide bandgap semiconductor material, which has a very wide direct bandgap, a very high breakdown field strength, a very high thermal conductivity and very good physical and chemical stability, and in addition, as with nitrides of other groups of elements, nickel nitride has a low sensitivity to ionizing radiation and a high stability.
When traditional gallium nitride device is packaged, many people place the device chip in plastic packaging mould one by one, then, transport the mould to extrusion molding equipment department and extrude, plastics fill whole mould, then, carry out the compound die design to encapsulate whole gallium nitride device, carry out the drawing of patterns again after the encapsulation is ended, artifical material, the drawing of patterns are more troublesome and cause the damage to the device chip easily, thereby have influenced the encapsulation quality and the efficiency of gallium nitride, for this reason, we propose a gallium nitride device and gallium nitride packaging structure and be used for solving above-mentioned problem.
Disclosure of Invention
The present invention is directed to a gallium nitride device and a gallium nitride packaging structure, so as to solve the problems set forth in the background art.
In order to achieve the aim, the invention provides the technical scheme that the gallium nitride device comprises a gallium nitride device body, wherein the gallium nitride device body comprises a bottom packaging piece, a second packaging frame is arranged at the bottom end of the bottom packaging piece, and a gallium nitride chip is arranged between the bottom packaging piece and the second packaging frame;
The bottom package piece comprises a heat dissipation bottom plate, a plurality of pin grooves which are evenly distributed are formed in two sides of the top end of the heat dissipation bottom plate, connecting pins are movably clamped in the pin grooves, a first package frame is arranged on the outer sides of the heat dissipation bottom plate and the plurality of connecting pins, a clamping groove is formed in the middle of the first package frame, a gallium nitride chip is movably clamped in the clamping groove, the lower surface of the gallium nitride chip is contacted with the upper surface of the heat dissipation bottom plate, connecting protrusions which correspond to the connecting pins are arranged at the bottom end of the gallium nitride chip, the connecting protrusions are movably clamped in the corresponding pin grooves, the connecting protrusions are electrically connected with the corresponding connecting pins, an extension protrusion is uniformly formed at the side end of the first package frame, an inner groove which corresponds to the extension protrusion is formed at the side end of the second package frame, and the extension protrusion is fixedly clamped in the corresponding inner groove, and the lower surface of the second package frame is contacted with the upper surface of the gallium nitride chip.
The utility model provides a gallium nitride packaging structure of gallium nitride device, includes the base, the top fixed mounting of base has sharp electric rail, the drive end fixed mounting of sharp electric rail has the bottom module, the top fixed mounting of base has the support frame, one side fixed mounting of support frame has first encapsulation mechanism, one side fixed mounting that the support frame kept away from first encapsulation mechanism has second encapsulation mechanism.
As a preferable technical scheme of the invention, the bottom die comprises a bottom die plate, the bottom die plate is fixedly arranged at the driving end of the linear electric rail, the top end of the bottom die plate is fixedly provided with a molding outer frame, the gallium nitride device body is movably clamped in the molding outer frame, the middle part of the top end of the bottom die plate is provided with a positioning groove, the bottom of the heat dissipation bottom plate is movably clamped in the positioning groove, the top end of the bottom die plate is provided with a guiding groove corresponding to the connecting pin, and the bottom of the connecting pin is movably clamped in the corresponding guiding groove.
As a preferable technical scheme of the invention, a through groove is formed in the positioning groove, a first ring and a second ring are respectively and fixedly clamped at the bottom and the middle of the through groove, a top bulge is movably clamped at the middle of the first ring and the second ring, the top of the top bulge is movably clamped at the top of the through groove, a third ring is arranged on the upper surface of the first ring and fixedly arranged at the outer side of the top bulge, a spring is arranged between the top end of the third ring and the bottom end of the second ring, the spring is movably sleeved at the outer side of the top bulge, the bottom of the top bulge extends out of the bottom end of the bottom template, and a ball is arranged at the bottom of the top bulge in a rolling way.
As a preferable technical scheme of the invention, a driving plate is fixedly arranged on one side of the top end of the base, which is far away from the second packaging mechanism, the position of the driving plate corresponds to the position of the top protrusion, and a driving protrusion is integrally formed on one side of the top end of the driving plate, which is far away from the second packaging mechanism.
As a preferred technical scheme of the invention, the first packaging mechanism comprises a plurality of first lifting cylinders, the first lifting cylinders are fixedly arranged on one side of the supporting frame, a first injection molding frame is fixedly arranged at the driving end of each first lifting cylinder, a first cooling frame is fixedly arranged at the bottom end of each first injection molding frame, a plurality of injection molding openings which are uniformly distributed are formed in the bottom end of each first injection molding frame, the injection molding openings are positioned on the outer side of each first cooling frame, two first pipes are fixedly arranged at the top end of each first cooling frame, the first pipes movably penetrate through the first injection molding frame, a first heat insulation pad is arranged between the top end of each first cooling frame and the bottom end of each first injection molding frame, a first heat insulation sleeve is fixedly clamped in each first injection molding frame, a first connecting head is fixedly clamped at the top end of each first pipe, a first through groove is formed in the side end of each first injection molding frame, a first material guide pipe is fixedly arranged at the outer side of each first injection molding frame, and a first material guide pipe is movably arranged at the outer side of each first guide pipe, and a first fixing valve is arranged at the outer side of each first guide frame.
As a preferable technical scheme of the invention, the second packaging mechanism comprises a plurality of second lifting cylinders, the second lifting cylinders are fixedly arranged on one side, far away from the first packaging mechanism, of the supporting frame, a second injection molding frame is fixedly arranged at the driving end of each second lifting cylinder, a second cooling frame is fixedly arranged at the bottom end of each second injection molding frame, two second pipes are fixedly arranged at the top end of each second cooling frame, each second pipe movably penetrates through the corresponding second injection molding frame, a second connector is fixedly arranged at the top end of each second pipe, a second heat insulation pad is arranged at the top end of each second cooling frame and the bottom end of each second injection molding frame, a second heat insulation sleeve is movably sleeved at the outer side of each second pipe, each second heat insulation sleeve is fixedly clamped in the corresponding second injection molding frame, a plurality of injection molding pipes are fixedly arranged at the bottom end of each second injection molding frame, each third heat insulation sleeve is fixedly clamped in the corresponding second cooling frame, each second heat insulation sleeve is fixedly arranged at the outer side of each second injection molding frame, each second heat insulation sleeve is fixedly clamped in the corresponding second cooling frame, each second heat insulation sleeve is fixedly arranged at the middle part of each second heat insulation sleeve, and a second guide pipe is fixedly arranged at the outer side of each second injection molding frame.
As a preferable technical scheme of the invention, the end parts of the first valve and the second valve are fixedly provided with first guide pipes, the opposite ends of the first guide pipes are fixedly provided with first hoses, a three-way pipe is fixedly arranged between the two first hoses, and the end parts of the three-way pipe are fixedly provided with first connecting pipes.
As a preferable technical scheme of the invention, a connecting frame is fixedly arranged on the outer side of the three-way pipe, and the connecting frame is fixedly arranged on the supporting frame.
As a preferable technical scheme of the invention, the top ends of the second connectors are fixedly provided with second guide pipes, the top ends of the first connectors are fixedly provided with third guide pipes, one of the second guide pipes and one of the third guide pipes are fixedly provided with second hoses, one end of each third guide pipe, which is far away from the second hose, is fixedly provided with a second connecting pipe, and one end of each second connecting pipe, which is far away from the third guide pipe, is fixedly clamped on the support frame.
Compared with the prior art, the invention has the beneficial effects that:
1. Through setting up the bottom module, the cooperation uses first encapsulation mechanism and second encapsulation mechanism, carry out plastic envelope to radiating bottom plate, a plurality of connection pin fixedly, form bottom package spare, realize the one-level encapsulation of gallium nitride device bottom, and carry out plastic envelope to bottom package spare, gallium nitride chip and fix, realize the second packaging of gallium nitride device, through adopting one-level encapsulation, the form of second packaging is fixed to the encapsulation of gallium nitride device, be convenient for connect fixedly between each part in the gallium nitride device, and be convenient for follow-up dismantlement second encapsulation frame alone carries out the maintenance of gallium nitride chip, and the encapsulation effect in the gallium nitride device has been promoted.
2. Through setting up the bottom module, the cooperation uses drive plate, drive protruding, and whole gallium nitride device encapsulation is accomplished the back, and control bottom module removes to one side of drive plate, and at this moment, ball and the upper surface contact of drive plate continue to remove the bottom module, and the ball removes to the drive protruding from the drive plate, and the protruding automatic jack-up top of drive is protruding to the extrusion spring, and the automatic jack-up of top protruding carries out automatic drawing of patterns unloading to the gallium nitride device after the encapsulation is accomplished, has promoted the whole machining efficiency of gallium nitride device.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a gallium nitride device according to the present invention.
Fig. 2 is a schematic structural view of a midsole package according to the present invention.
Fig. 3 is a schematic diagram of the structure of the gallium nitride device according to the invention after being detached.
Fig. 4 is a schematic view of another angle structure of the gallium nitride device according to the invention after being detached.
Fig. 5 is a schematic structural diagram of a gan package structure according to the present invention.
Fig. 6 is a schematic structural view of the middle sole module according to the present invention.
Fig. 7 is an enlarged view of the invention at a in fig. 6.
Fig. 8 is an enlarged view of the invention at B in fig. 7.
Fig. 9 is a schematic structural view of a first packaging mechanism and a second packaging mechanism in the present invention.
Fig. 10 is a schematic structural diagram of a first packaging mechanism in the present invention.
Fig. 11 is a schematic structural diagram of a second packaging mechanism in the present invention.
1, A gallium nitride device body; 11, a bottom package; 101, a clamping groove; 102, extension pins, 12, gallium nitride chips, 121, connection pins, 111, heat dissipation bottom plates, 1111, pin grooves, 112, connection pins, 113, first packaging frames, 13, second packaging frames, 131, inner grooves, 2, bases, 3, linear electric rails, 4, bottom mold pieces, 5, support frames, 6, first packaging mechanisms, 7, second packaging mechanisms, 8, driving plates, 81, driving pins, 9, first guide pipes, 91, first hoses, 92, three-way pipes, 921, connecting frames, 93, first connecting pipes, 94, second guide pipes, 95, second guide pipes, 96, third guide pipes, 97, second connecting pipes, 41, bottom templates, 42, plastic frames, 401, positioning grooves, 402, guiding grooves, 403, penetrating grooves, 43, first rings, 431, second rings, 44, top pins, 45, third rings, 46, springs, 47, balls, 61, first lifting cylinders, 601, first through grooves, 62, first injection molding frames, 621, first guide pipes, 622, second guide pipes, 96, third guide pipes, 97, second connecting pipes, heat insulation sleeves, 71, heat insulation sleeves, 401, positioning grooves, 402, guiding grooves, 403, penetrating grooves, 43, first rings, 431, second rings, 44, top pins, 45, third rings, 46, spring rings, 47, 651, first lifting cylinders, 601, first through grooves, 62, first injection molding frames, heat insulation sleeves, and second, heat insulation sleeves.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
1-11, The invention provides a gallium nitride device, which comprises a gallium nitride device body 1, wherein the gallium nitride device body 1 comprises a bottom packaging piece 11, a second packaging frame 13 is arranged at the bottom end of the bottom packaging piece 11, and a gallium nitride chip 12 is arranged between the bottom packaging piece 11 and the second packaging frame 13;
The bottom package 11 comprises a heat dissipation bottom plate 111, a plurality of pin grooves 1111 are uniformly distributed on two sides of the top end of the heat dissipation bottom plate 111, connecting pins 112 are movably clamped in the pin grooves 1111, a first package frame 113 is arranged on the outer sides of the heat dissipation bottom plate 111 and the plurality of connecting pins 112, primary packaging of the bottom of the gallium nitride device is carried out, and the heat dissipation bottom plate 111 and the plurality of connecting pins 112 are fixed;
The clamping groove 101 is formed in the middle of the first packaging frame 113, the gallium nitride chip 12 is movably clamped in the clamping groove 101, the lower surface of the gallium nitride chip 12 is in contact with the upper surface of the radiating bottom plate 111, the radiating bottom plate 111 is arranged to radiate heat of the gallium nitride chip 12, the using effect of the whole gallium nitride device is improved, the connecting convex 121 corresponding to the connecting pin 112 is arranged at the bottom end of the gallium nitride chip 12, the connecting convex 121 is movably clamped in the corresponding pin groove 1111, the connecting convex 121 is electrically connected with the corresponding connecting pin 112, the gallium nitride chip 12 and the connecting pin 112 are electrically connected, the side end of the first packaging frame 113 is uniformly formed with the extension convex 102, the side end of the second packaging frame 13 is provided with the inner groove 131 corresponding to the extension convex 102, the lower surface of the second packaging frame 13 is in contact with the upper surface of the gallium nitride chip 12, the second packaging of the top of the gallium nitride device is performed, the bottom packaging piece 11 and the gallium nitride chip 12 are fixed, the gallium nitride device is packaged in a first packaging mode and a second packaging mode, the gallium nitride device is fixed, the gallium nitride devices are independently packaged in the second packaging mode, the gallium nitride device is convenient to detach, and the gallium nitride device is detached independently, and the gallium nitride device is packaged in the subsequent packaging frame is convenient to detach.
The utility model provides a gallium nitride packaging structure of gallium nitride device, includes base 2, and the top fixed mounting of base 2 has sharp electric rail 3, and the fixed bottom module 4 that has of drive end of sharp electric rail 3 controls to open sharp electric rail 3 drive bottom module 4 and carries out stable translation, and the top fixed mounting of base 2 has support frame 5, and one side fixed mounting of support frame 5 has first encapsulation mechanism 6, and one side fixed mounting that support frame 5 kept away from first encapsulation mechanism 6 has second encapsulation mechanism 7.
The bottom module 4 comprises a bottom template 41, the bottom template 41 is fixedly arranged at the driving end of the linear electric rail 3, a molding outer frame 42 is fixedly arranged at the top end of the bottom template 41, a gallium nitride device body 1 is movably clamped in the molding outer frame 42, a positioning groove 401 is formed in the middle of the top end of the bottom template 41, the bottom of a heat dissipation base plate 111 is movably clamped in the positioning groove 401, a guide groove 402 corresponding to a connecting pin 112 is formed in the top end of the bottom template 41, the bottom of the connecting pin 112 is movably clamped in the corresponding guide groove 402, when the gallium nitride device is packaged, the heat dissipation base plate 111 provided with a plurality of connecting pins 112 is clamped in the molding outer frame 42, the bottom of the heat dissipation base plate 111 is movably clamped in the positioning groove 401, the bottoms of the connecting pins 112 are movably clamped in the corresponding guide grooves 402, and the heat dissipation base plate 111 and the plurality of connecting pins 112 are positioned;
The first packaging mechanism 6 comprises a plurality of first lifting cylinders 61, the first lifting cylinders 61 are fixedly arranged on one side of the supporting frame 5, a first injection molding frame 62 is fixedly arranged at the driving end of the first lifting cylinders 61, a first cooling frame 63 is fixedly arranged at the bottom end of the first injection molding frame 62, a plurality of evenly distributed injection molding openings 623 are formed at the bottom end of the first injection molding frame 62, the injection molding openings 623 are positioned at the outer side of the first cooling frame 63, two first pipes 64 are fixedly arranged at the top end of the first cooling frame 63, the first pipes 64 movably penetrate through the first injection molding frame 62, a first heat insulation pad 65 is arranged between the top end of the first cooling frame 63 and the bottom end of the first injection molding frame 62, a first heat insulation sleeve 651 is movably sleeved at the outer side of the first pipes 64, the first heat insulation sleeve 651 is fixedly clamped in the first injection molding frame 62, a first connecting joint 66 is fixedly clamped at the top end of the first pipes 64, a first through groove 601 is formed at the side end of the first injection molding frame 62, a first material guiding pipe 621 is fixedly arranged at the outer side of the first injection molding frame 62, a first valve 622 is fixedly arranged at one end of the first material guiding pipe 621, which is far away from the first injection molding frame 62, a heat dissipation bottom plate 111 and a plurality of connecting pins 112 are positioned, after the bottom module 4 is controlled to move to drive the heat dissipation bottom plate 111 and the plurality of connecting pins 112 to move to the lower part of the first packaging mechanism 6, then a plurality of first lifting cylinders 61 are controlled to be opened to drive the first injection molding frame 62 and the first cooling frame 63 to move downwards, the first injection molding frame 62 and the first cooling frame 63 are movably clamped in the plastic outer frame 42 until the lower surface of the first cooling frame 63 is contacted with the upper surface of the heat dissipation bottom plate 111, at this time, the lower surface of the first cooling frame 63 covers a part of the connecting pins 112 so as to facilitate the connection of the subsequent gallium nitride chip 12, then the first valve 622 is opened, the packaging plastic is led into the first injection molding frame 62 through the first material guiding pipe 621, then flows out through the plurality of injection molding openings 623, is exhausted through the first through groove 601, and is used for packaging the heat dissipation base plate 111 and the plurality of connecting pins 112, meanwhile, cooling of the packaging plastic is accelerated through cooling liquid circulated in the first cooling frame 63 until the packaging plastic is solidified, so as to form the first packaging frame 113, the extending protrusion 102 is formed at the position of the first through groove 601, the clamping groove 101 is formed at the position of the first cooling frame 63, and the bottom packaging piece 11 is formed, so that primary packaging of the bottom of the gallium nitride device is realized, and the heat dissipation base plate 111 and the plurality of connecting pins 112 are fixed.
The second packaging mechanism 7 comprises a plurality of second lifting cylinders 71, the second lifting cylinders 71 are fixedly arranged on one side of the supporting frame 5 far away from the first packaging mechanism 6, a second injection molding frame 72 is fixedly arranged at the driving end of each second lifting cylinder 71, a second cooling frame 73 is fixedly arranged at the bottom end of each second injection molding frame 72, two second pipes 731 are fixedly arranged at the top end of each second cooling frame 73, each second pipe 731 movably penetrates through each second injection molding frame 72, a second connector 732 is fixedly arranged at the top end of each second pipe 731, a second heat insulation pad 74 is arranged at the top end of each second cooling frame 73 and the bottom end of each second injection molding frame 72, a second heat insulation sleeve 741 is movably sleeved outside each second pipe 731, each second heat insulation sleeve 741 is fixedly clamped in each second injection molding frame 72, a plurality of injection molding pipes 721 are fixedly arranged at the bottom end of each second injection molding frame 72, each injection molding pipe 721 movably penetrates through each second cooling frame 73, the outer side of the injection molding pipe 721 is movably sleeved with a third heat insulation sleeve 742, the third heat insulation sleeve 742 is fixedly clamped in the second cooling frame 73, a second through groove 701 is formed in the middle of the second injection molding frame 72, a second material guiding pipe 723 is fixedly arranged on the outer side of the second injection molding frame 72, a second valve 722 is fixedly arranged at one end of the second material guiding pipe 723 far away from the second injection molding frame 72, after primary packaging, the bottom module 4 is controlled to drive the bottom packaging piece 11 to move to the lower side of the second packaging mechanism 7, meanwhile, the gallium nitride chip 12 is movably clamped in the clamping groove 101, the connecting lug 121 is movably clamped in the corresponding pin groove 1111, the connecting lug 121 is electrically connected with the corresponding connecting pin 112, then, a plurality of second lifting cylinders 71 are controlled to be started, the second injection molding frame 72 and the second cooling frame 73 are driven to descend, the second injection molding frame 72 and the second cooling frame 73 are movably clamped in the plastic frame 42, and a certain distance is reserved between the second cooling frame 73 and the gallium nitride chip 12, then, a second valve 722 is opened, packaging plastic is led into the second injection molding frame 72 through a second material guiding pipe 723, then, the packaging plastic flows out through a plurality of injection molding pipes 721, the exhaust is carried out through the opened second through groove 701, the packaging plastic is used for carrying out plastic packaging on the bottom packaging piece 11 and the gallium nitride chip 12, meanwhile, cooling of the packaging plastic is accelerated through cooling liquid circulated in the second cooling frame 73 until the packaging plastic is solidified, a second packaging frame 13 is formed, the second packaging frame 13 and the first packaging frame 113 are fixedly connected, so that the secondary packaging of the gallium nitride device is realized, and the bottom packaging piece 11 and the gallium nitride chip 12 are fixed.
The ends of the first valve 622 and the second valve 722 are fixedly provided with first guide pipes 9, the opposite ends of the first guide pipes 9 are fixedly provided with first hoses 91, a three-way pipe 92 is fixedly arranged between the two first hoses 91, the end part of the three-way pipe 92 is fixedly provided with a first connecting pipe 93, the outer side of the three-way pipe 92 is fixedly provided with a connecting frame 921, the connecting frame 921 is fixedly arranged on the supporting frame 5, and when the packaging plastic agent packaging machine is used, the end part of the first connecting pipe 93 is connected with an output port of a packaging plastic agent output system, the opening of the packaging plastic agent output system is controlled, and packaging plastic agent is led into the first guide pipes 9 on two sides through the first connecting pipe 93, the three-way pipe 92 and the first hoses 91 on two sides.
The top end of the second connector 732 is fixedly provided with a second conduit 94, the top end of the first connector 66 is fixedly provided with a third conduit 96, a second hose 95 is fixedly arranged between one of the second conduit 94 and one of the third conduit 96, one end of the third conduit 96, which is far away from the second hose 95, is fixedly provided with a second connecting pipe 97, one end of the second connecting pipe 97, which is far away from the third conduit 96, is fixedly clamped on the support frame 5, and when in use, the two second connecting pipes 97 are respectively connected with an output port and an input port of a cooling liquid circulation system, the cooling liquid circulation system is controlled to be started, cooling liquid is led into the first cooling frame 63 and the second cooling frame 73 through one group of the second connecting pipes 97, the third conduit 96, the second hose 95, the second conduit 94 and the second connector 732, and is led into the cooling liquid circulation system through the other group of the second connector, the second hose 95, the third conduit 96 and the second connecting pipe 97, so that the circulation of cooling liquid in the first cooling frame 63 and the second cooling frame 73 is carried out.
The positioning groove 401 is internally provided with a through groove 403, a first ring 43 and a second ring 431 are fixedly clamped at the bottom and the middle of the through groove 403 respectively, a top protrusion 44 is movably clamped at the middle of the first ring 43 and the second ring 431, the top of the top protrusion 44 is movably clamped at the top of the through groove 403, the upper surface of the top protrusion 44 is flush with the inner lower wall of the positioning groove 401, the upper surface of the first ring 43 is provided with a third ring 45, the third ring 45 is fixedly arranged at the outer side of the top protrusion 44, a spring 46 is arranged between the top end of the third ring 45 and the bottom end of the second ring 431, the spring 46 is movably sleeved at the outer side of the top protrusion 44, the bottom of the top protrusion 44 extends out of the bottom end of the bottom template 41, balls 47 are arranged at the bottom rolling clamp of the top protrusion 44, one side of the top 2 top end far away from the second packaging mechanism 7 is fixedly provided with a driving plate 8, the position of the driving plate 8 corresponds to the position of the top protrusion 44, one side of the driving plate 8 far away from the second packaging mechanism 7 is integrally formed with a driving protrusion 81, after the whole gallium nitride device is packaged, the bottom module 4 is controlled to move towards one side of the driving plate 8, the balls 47 are automatically pushed up, the top protrusion 4 is automatically contacted with the top protrusion 47, the balls are continuously pushed up from the top protrusion 4, the top protrusion 44 is automatically, the top protrusion is automatically pressed, and the top protrusion 4 is automatically moved, and the top gallium nitride device is automatically pressed, the top protrusion is continuously, and the top protrusion is continuously pressed from the top protrusion 4 is automatically, and the top protrusion is continuously pressed, and the top protrusion is upwards, and the top 4 is automatically, and the top 4 is upwards, and the top is automatically moved.
When the packaging plastic agent packaging machine is used, the end part of the first connecting pipe 93 is connected with the output port of the packaging plastic agent output system, the packaging plastic agent output system is controlled to be started, and packaging plastic agent is led into the first guide pipes 9 at the two sides through the first connecting pipe 93, the three-way pipe 92 and the first hoses 91 at the two sides;
The two second connecting pipes 97 are respectively connected with an output port and an input port of the cooling liquid circulation system, the cooling liquid circulation system is controlled to be started, cooling liquid is led into the first cooling frame 63 and the second cooling frame 73 through one group of the second connecting pipes 97, the third guide pipe 96, the second hose 95, the second guide pipe 94 and the second connector 732, and cooling liquid is led into the cooling liquid circulation system through the other group of the second connector 732, the second guide pipe 94, the second hose 95, the third guide pipe 96 and the second connecting pipe 97, so that cooling liquid is circulated in the first cooling frame 63 and the second cooling frame 73;
Then, packaging the gallium nitride device, clamping the heat dissipation bottom plate 111 provided with a plurality of connection pins 112 into the molding outer frame 42, movably clamping the bottom of the heat dissipation bottom plate 111 into the positioning groove 401, movably clamping the bottom of the connection pins 112 into the corresponding guiding grooves 402, and positioning the heat dissipation bottom plate 111 and the plurality of connection pins 112;
After the heat dissipation bottom plate 111 and the plurality of connection pins 112 are positioned, the bottom module 4 is controlled to move to drive the heat dissipation bottom plate 111 and the plurality of connection pins 112 to move to the lower part of the first packaging mechanism 6, then, the plurality of first lifting cylinders 61 are controlled to be started, the first injection molding frame 62 and the first cooling frame 63 are driven to move downwards, the first injection molding frame 62 and the first cooling frame 63 are movably clamped in the molding frame 42 until the lower surface of the first cooling frame 63 is contacted with the upper surface of the heat dissipation bottom plate 111, at this time, the lower surface of the first cooling frame 63 covers a part of the connection pins 112 so as to connect with the subsequent gallium nitride chips 12, then, the first valve 622 is opened, introducing packaging plastic into the first injection molding frame 62 through the first material guide pipe 621, then, flowing out through the plurality of injection molding openings 623, exhausting air through the first through grooves 601, packaging the heat dissipation base plate 111 and the plurality of connection pins 112 by the packaging plastic, simultaneously, accelerating cooling of the packaging plastic through cooling liquid circulated in the first cooling frame 63 until the packaging plastic is solidified to form a first packaging frame 113, forming an extension boss 102 at the position of the first through grooves 601, forming a clamping groove 101 at the position of the first cooling frame 63, and forming a bottom packaging piece 11, thereby realizing primary packaging of the bottom of the gallium nitride device, and fixing the heat dissipation base plate 111 and the plurality of connection pins 112;
After primary packaging, the bottom module 4 is controlled to drive the bottom packaging piece 11 to move to the lower part of the second packaging mechanism 7, meanwhile, the gallium nitride chip 12 is movably clamped in the clamping groove 101, the connecting convex 121 is movably clamped in the corresponding pin groove 1111, the connecting convex 121 is electrically connected with the corresponding connecting pin 112, then, the second lifting cylinders 71 are controlled to be started, the second injection molding frame 72 and the second cooling frame 73 are driven to descend, the second injection molding frame 72 and the second cooling frame 73 are movably clamped in the plastic outer frame 42, a certain distance is reserved between the second cooling frame 73 and the gallium nitride chip 12, then, the second valve 722 is opened, packaging agent is led into the second injection molding frame 72 through the second guide pipe 723, then, the packaging agent is discharged through the plurality of injection molding pipes 721, the packaging agent is used for packaging the bottom packaging piece 11 and the gallium nitride chip 12, and simultaneously, cooling of the packaging agent is accelerated through cooling liquid circulated in the second cooling frame 73 until the packaging agent is solidified, the second packaging frame 13 is formed, the second packaging frame 13 and the first packaging piece 11 are fixedly packaged, and the second packaging device is fixedly packaged;
After the whole gallium nitride device is packaged, the bottom module 4 is controlled to move to one side of the driving plate 8, at the moment, the balls 47 are contacted with the upper surface of the driving plate 8, the bottom module 4 is continuously moved, the balls 47 move from the driving plate 8 to the driving protrusions 81, the driving protrusions 81 automatically jack up the jacking protrusions 44 and squeeze the springs 46, the gallium nitride device after the jacking protrusions 44 automatically jack up and package is automatically demolded and discharged, and the overall processing efficiency of the gallium nitride device is improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The gallium nitride device comprises a gallium nitride device body (1) and is characterized in that the gallium nitride device body (1) comprises a bottom packaging piece (11), a second packaging frame (13) is arranged at the bottom end of the bottom packaging piece (11), and a gallium nitride chip (12) is arranged between the bottom packaging piece (11) and the second packaging frame (13);
The bottom package (11) comprises a heat dissipation bottom plate (111), a plurality of pin grooves (1111) which are evenly distributed are formed in the two sides of the top end of the heat dissipation bottom plate (111), connecting pins (112) are movably clamped in the pin grooves (1111), a first package frame (113) is arranged on the outer side of the heat dissipation bottom plate (111) and the plurality of connecting pins (112), a clamping groove (101) is formed in the middle of the first package frame (113), a gallium nitride chip (12) is movably clamped in the clamping groove (101), the lower surface of the gallium nitride chip (12) is contacted with the upper surface of the heat dissipation bottom plate (111), connecting protrusions (121) which correspond to the connecting pins (112) are arranged at the bottom end of the gallium nitride chip (12), the connecting protrusions (121) are movably clamped in the corresponding pin grooves (1111), the side ends of the first package frame (113) are uniformly formed with extension protrusions (102), the side ends of the second package frame (13) are provided with corresponding inner grooves (131) which correspond to the inner grooves (131) of the second package frame (13).
2. A gallium nitride packaging structure using the gallium nitride device according to claim 1, comprising a base (2), and characterized in that a linear electric rail (3) is fixedly arranged at the top end of the base (2), a bottom module (4) is fixedly arranged at the driving end of the linear electric rail (3), a supporting frame (5) is fixedly arranged at the top end of the base (2), a first packaging mechanism (6) is fixedly arranged at one side of the supporting frame (5), and a second packaging mechanism (7) is fixedly arranged at one side of the supporting frame (5) far away from the first packaging mechanism (6).
3. The gallium nitride packaging structure of a gallium nitride device according to claim 2, wherein the bottom die piece (4) comprises a bottom die plate (41), the bottom die plate (41) is fixedly arranged at the driving end of the linear electric rail (3), a molding outer frame (42) is fixedly arranged at the top end of the bottom die plate (41), the gallium nitride device body (1) is movably clamped in the molding outer frame (42), a positioning groove (401) is formed in the middle of the top end of the bottom die plate (41), the bottom of the heat dissipation bottom plate (111) is movably clamped in the positioning groove (401), a guiding groove (402) corresponding to the connecting pin (112) is formed in the top end of the bottom die plate (41), and the bottom of the connecting pin (112) is movably clamped in the corresponding guiding groove (402).
4. A gallium nitride packaging structure of a gallium nitride device is characterized in that a through groove (403) is formed in a positioning groove (401), a first ring (43) and a second ring (431) are fixedly clamped at the bottom and the middle of the through groove (403) respectively, a top protrusion (44) is movably clamped at the middle of the first ring (43) and the middle of the second ring (431), the top of the top protrusion (44) is movably clamped at the top of the through groove (403), a third ring (45) is arranged on the upper surface of the first ring (43), the third ring (45) is fixedly arranged on the outer side of the top protrusion (44), a spring (46) is arranged between the top end of the third ring (45) and the bottom end of the second ring (431), the spring (46) is movably sleeved on the outer side of the top protrusion (44), the bottom of the top protrusion (44) extends out of the bottom end of a bottom template (41), and a ball (47) is arranged on the bottom rolling clamp of the top protrusion (44).
5. A gallium nitride packaging structure of a gallium nitride device according to claim 4, wherein a driving plate (8) is fixedly arranged on one side of the top end of the base (2) far away from the second packaging mechanism (7), the position of the driving plate (8) corresponds to the position of the top protrusion (44), and a driving protrusion (81) is integrally formed on one side of the top end of the driving plate (8) far away from the second packaging mechanism (7).
6. The gallium nitride packaging structure of gallium nitride device according to claim 2, wherein the first packaging mechanism (6) comprises a plurality of first lifting cylinders (61), the first lifting cylinders (61) are fixedly arranged on one side of the supporting frame (5), first injection molding frames (62) are fixedly arranged at the driving ends of the first lifting cylinders (61), first cooling frames (63) are fixedly arranged at the bottom ends of the first injection molding frames (62), a plurality of evenly distributed injection molding openings (623) are formed at the bottom ends of the first injection molding frames (62), the injection molding openings (623) are positioned on the outer sides of the first cooling frames (63), two first pipes (64) are fixedly arranged at the top ends of the first cooling frames (63), first heat insulation pads (65) are arranged between the top ends of the first cooling frames (63) and the bottom ends of the first injection molding frames (62), first heat insulation frames (62) are movably sleeved with first sleeves (651), first connection ends (621) are fixedly arranged at the first connection ends (62) of the first connection frames (62), first connection ends (621) are fixedly arranged at the first connection ends (62), one end of the first material guide pipe (621) far away from the first injection molding frame (62) is fixedly provided with a first valve (622).
7. The gallium nitride packaging structure of gallium nitride device according to claim 6, wherein the second packaging mechanism (7) comprises a plurality of second lifting cylinders (71), the second lifting cylinders (71) are fixedly arranged on one side of the supporting frame (5) far away from the first packaging mechanism (6), a second injection molding frame (72) is fixedly arranged at the driving end of each second lifting cylinder (71), a second cooling frame (73) is fixedly arranged at the bottom end of each second injection molding frame (72), two second pipes (731) are fixedly arranged at the top end of each second cooling frame (73), a second connector (732) is fixedly arranged at the top end of each second pipe (731), a second heat insulation pad (74) is arranged at the top end of each second cooling frame (73) and the bottom end of each second injection molding frame (72), a second heat insulation sleeve (741) is movably sleeved outside each second pipe (741), two second heat insulation pipes (731) are fixedly clamped in the second injection molding frame (72), a plurality of second heat insulation pipes (721) are movably arranged at the bottom end of each second pipe (731), a plurality of heat insulation pipes (721) are movably arranged at the bottom end of each second pipe (721), the third heat insulation sleeve (742) is fixedly clamped in the second cooling frame (73), a second through groove (701) is formed in the middle of the second injection molding frame (72), a second material guide pipe (723) is fixedly arranged on the outer side of the second injection molding frame (72), and a second valve (722) is fixedly arranged at one end, far away from the second injection molding frame (72), of the second material guide pipe (723).
8. The gallium nitride packaging structure of a gallium nitride device according to claim 7, wherein the ends of the first valve (622) and the second valve (722) are fixedly provided with first guide pipes (9), the opposite ends of the first guide pipes (9) are fixedly provided with first hoses (91), a three-way pipe (92) is fixedly arranged between the two first hoses (91), and the ends of the three-way pipe (92) are fixedly provided with first connecting pipes (93).
9. The gallium nitride packaging structure of a gallium nitride device according to claim 8, wherein a connecting frame (921) is fixedly arranged on the outer side of the three-way pipe (92), and the connecting frame (921) is fixedly arranged on the supporting frame (5).
10. A gallium nitride packaging structure of a gallium nitride device according to claim 7, wherein the top ends of the second connectors (732) are fixedly provided with second guide pipes (94), the top ends of the first connectors (66) are fixedly provided with third guide pipes (96), one of the second guide pipes (94) and one of the third guide pipes (96) are fixedly provided with second hoses (95), one ends, far away from the second hoses (95), of the third guide pipes (96) are fixedly provided with second connecting pipes (97), and one ends, far away from the third guide pipes (96), of the second connecting pipes (97) are fixedly clamped on the support frame (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411092001.3A CN118866823B (en) | 2024-08-09 | 2024-08-09 | Gallium nitride device and gallium nitride packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411092001.3A CN118866823B (en) | 2024-08-09 | 2024-08-09 | Gallium nitride device and gallium nitride packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118866823A CN118866823A (en) | 2024-10-29 |
| CN118866823B true CN118866823B (en) | 2025-02-11 |
Family
ID=93171015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411092001.3A Active CN118866823B (en) | 2024-08-09 | 2024-08-09 | Gallium nitride device and gallium nitride packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118866823B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172286A (en) * | 2022-07-04 | 2022-10-11 | 富芯微电子有限公司 | Automatic silicon controlled rectifier chip packaging structure and process thereof |
| CN219419009U (en) * | 2023-03-21 | 2023-07-25 | 宽兆科技(深圳)有限公司 | Packaging structure of gallium nitride chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6421050B2 (en) * | 2015-02-09 | 2018-11-07 | 株式会社ジェイデバイス | Semiconductor device |
| US20240120321A1 (en) * | 2022-10-05 | 2024-04-11 | Nxp Usa, Inc. | Power amplifier packages containing electrically-routed lids and methods for the fabrication thereof |
-
2024
- 2024-08-09 CN CN202411092001.3A patent/CN118866823B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172286A (en) * | 2022-07-04 | 2022-10-11 | 富芯微电子有限公司 | Automatic silicon controlled rectifier chip packaging structure and process thereof |
| CN219419009U (en) * | 2023-03-21 | 2023-07-25 | 宽兆科技(深圳)有限公司 | Packaging structure of gallium nitride chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118866823A (en) | 2024-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3017470B2 (en) | Resin molding method and resin molding device | |
| CN105228805B (en) | Resin molding machine and resin molding method | |
| JP4484329B2 (en) | Resin sealing method and resin sealing device | |
| CN118866823B (en) | Gallium nitride device and gallium nitride packaging structure | |
| KR20180081129A (en) | Resin sealing apparatus and resin sealing method | |
| CN113478731B (en) | Semiconductor packaging injection mold | |
| KR20100001690A (en) | Molding apparatus for manufacturing semi-conductor package | |
| CN219705860U (en) | Quick cooling molding plastic envelope press | |
| CN219040477U (en) | TO-LL packaging lead frame and packaging structure | |
| CN216372960U (en) | Plastic mold for efficient cooling forming | |
| CN217955814U (en) | Chip sintering machine | |
| KR20120094657A (en) | Heating/cooling apparatus for wafer chuck and wafer bonder comprising the same | |
| CN214797363U (en) | Camera module photosensitive chip encapsulation positioning device | |
| CN115662820A (en) | Full-automatic keyboard scissors foot aluminum plate equipment pressfitting line | |
| TWI737380B (en) | Resin plastic mould | |
| CN210860703U (en) | Booth is apart from LED module equipment tool | |
| CN210388195U (en) | Efficient lifting and feeding mechanism for bowl-shaped plug | |
| CN220400536U (en) | Semiconductor heat dissipation packaging mechanism | |
| KR101233220B1 (en) | Lead frame transfer apparatus for die bonder | |
| CN110561693B (en) | Plastic package mold capable of achieving rapid demolding | |
| CN213107948U (en) | Automobile door plate injection mold | |
| CN221983776U (en) | A thyristor foot cutting machine | |
| CN215550198U (en) | Mold structure for light emitting diode packaging piece | |
| KR900001657B1 (en) | Forming apparatus for semiconductor resin sealing | |
| CN219338382U (en) | Semiconductor packaging mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |