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CN118765082B - Porous rib heat dissipation method - Google Patents

Porous rib heat dissipation method Download PDF

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Publication number
CN118765082B
CN118765082B CN202410791932.6A CN202410791932A CN118765082B CN 118765082 B CN118765082 B CN 118765082B CN 202410791932 A CN202410791932 A CN 202410791932A CN 118765082 B CN118765082 B CN 118765082B
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fin
fin unit
unit
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temperature difference
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CN118765082A (en
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冯辉君
陈林根
刘晓业
戈延林
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Wuhan Institute of Technology
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/28—Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/08—Fluids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
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  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Mathematical Analysis (AREA)
  • Fluid Mechanics (AREA)
  • Algebra (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及一种多孔肋片散热方法,属于散热冷却领域，多孔肋片散热装置包括多个肋片单元，多个所述肋片单元并排设置，所述肋片单元包括基底和肋片，所述肋片的一端与所述基底的一端固定连接，每个所述基底的两侧均与相邻所述基底的一侧固定连接，所述肋片上间隔均匀分布有多个通孔，目的是提升散热装置的散热性能。

The present invention relates to a porous fin heat dissipation method, which belongs to the field of heat dissipation and cooling. The porous fin heat dissipation device comprises a plurality of fin units, which are arranged side by side. The fin units comprise a base and a fin, one end of the fin is fixedly connected to one end of the base, both sides of each base are fixedly connected to one side of an adjacent base, and a plurality of through holes are evenly distributed on the fin, so as to improve the heat dissipation performance of the heat dissipation device.

Description

Porous rib heat dissipation method
Technical Field
The invention relates to the field of heat dissipation and cooling, in particular to a porous rib heat dissipation method.
Background
Conventional thermal management techniques, such as air cooling, liquid cooling, and heat pipe cooling, while advantageous in different application scenarios, have limitations. For example, air-based thermal management techniques, while simple in structure and low in cost, are relatively inefficient in heat transfer and often difficult to meet cooling requirements when dealing with high heat flux density applications, resulting in low heat dissipation. Although the liquid cooling technology has high heat transfer efficiency, the liquid cooling technology occupies more space, and the system is complex and has high cost, so that the heat dissipation performance is low. Heat pipe technology performs well in some applications, but is heavy and requires the use of multiple heat pipes in combination, which not only places a large burden on the system, but also reduces heat dissipation.
Therefore, a porous fin heat dissipation method is provided to solve the problems set forth in the background art.
Disclosure of Invention
The invention provides a porous rib heat dissipation method for solving the technical problem, and aims to improve the heat dissipation performance of a heat dissipation device.
The technical scheme of the invention for solving the technical problems is that the porous rib heat dissipation method comprises the following steps that a porous rib heat dissipation device comprises a plurality of rib units, the plurality of rib units are arranged side by side, each rib unit comprises a substrate and a rib, one end of each rib is fixedly connected with one end of the substrate, two sides of each substrate are fixedly connected with one side of the adjacent substrate, and a plurality of through holes are uniformly distributed on each rib at intervals.
The invention has the beneficial effects that staff installs the substrates of the plurality of fin units on the surface of the electronic device or the heating body needing heat dissipation. The heat of the electronic device or the heating body can be quickly transferred to the fins from the substrate and radiated out through the plurality of through holes on the fins, so that the heat radiation performance of the thermal management technology is effectively improved.
On the basis of the technical scheme, the invention can be improved as follows.
Further, a plurality of the through holes are the same in size.
The further scheme has the advantages that the through holes can increase the contact surface area of the heat of the electronic device and the fins, and the heat of the electronic device can be rapidly and uniformly emitted.
Further, the base has a length of a, a width of b, and a height of c, the base has a volume V 1 =a×b×c, the fin has a length of a, a width of e, and a height of f, the fin has a volume V 2 =a×e×f, the fin unit has a spatial volume V T =a×b (c+f), and a ratio Φ of a sum of a volume V 1 of the base and a volume V 2 of the fin to a spatial volume V T of the fin unit is 0.5.
The adoption of the further scheme has the beneficial effects that when the ratio phi of the sum of the volume V 1 of the substrate and the volume V 2 of the rib to the space volume V T of the rib unit is 0.5, the existing rib geometric structure is optimized, and the optimal volume ratio of the inner structure of the rib unit is realized. The whole heat dissipation performance of the fin unit can be improved, and the local heat dissipation performance of the fin unit is also enhanced.
The porous rib heat dissipation method further comprises the following steps:
Inputting a preset number N, N of fin units determined according to the volume of an electronic device or a heat generating body into ANSYS Workbench software to solve, so as to obtain a temperature distribution table of the fin units and a pressure distribution table of air fluid, wherein the fixed length L of the fin units along the Y-axis direction, the porosity epsilon of a heat radiating material of the fin units, the volume parameters of the fin units and the inlet parameters of the air fluid are determined;
Obtaining a maximum temperature difference delta T between the highest temperature of the fin unit and the inlet temperature of the air fluid and a maximum pressure difference delta P between the average inlet pressure of the air fluid and the average outlet pressure of the air fluid based on the temperature distribution meter of the fin unit and the pressure distribution meter of the air fluid;
Presetting the mass flow rate of an air fluid inlet and the average density of the air fluid in advance, and calculating the pumping power consumption of the fin unit by combining the maximum pressure difference delta P of the air fluid;
Calculating an initial value of the pumping power of the fin unit based on the initial value of the maximum pressure difference of the fin unit, calculating the dimensionless pumping power of the fin unit according to the initial value of the pumping power of the fin unit and the pumping power of the fin unit, and calculating the dimensionless maximum temperature difference of the fin unit according to the initial value of the maximum temperature difference of the fin unit and the maximum temperature difference delta T of the fin unit;
And fifthly, carrying out linear weighting on the dimensionless pumping power consumption and the dimensionless maximum temperature difference of the fin units to obtain a composite function of the fin units, calculating composite values corresponding to different fin units according to the composite function of the fin units, selecting the number of the fin units corresponding to the minimum value from the composite values as the optimal number of the fin units in the heat dissipation device, and distributing the heat dissipation device according to the optimal number of the fin units.
The heat dissipation device with the optimal heat dissipation performance has the advantages that the optimal number of the fin units in the heat dissipation device can be obtained through the composite function of the fin units according to different electronic devices or heat generating bodies, and therefore the heat dissipation device with the optimal heat dissipation performance is achieved, and the production cost is controlled.
Further, in step one, the volume parameters of the fin unit include a volume of space V T of the fin unit, a volume V 1 of the base, and a ratio Φ of a volume V 2 of the fin to a volume of space V T of the fin unit, and the inlet parameters of the air fluid include a mass flow rate of the air fluid inletAnd the temperature of the air fluid inlet T in.
Further, in the third step, the formula for calculating the pumping power consumption of the fin unit is as follows:
Wherein, the power consumption of the W P pump is represented, Representing the mass flow rate of the air fluid inlet, Δp represents the maximum differential pressure Δp of the air fluid, ρ g represents the air fluid average density.
Further, in the fourth step, the formula for calculating the dimensionless pumping power of the fin unit is as follows:
Wherein, Represents the dimensionless pumping power of the fin unit, W p represents the pumping power of the fin unit, and W po represents the initial value of the pumping power of the fin unit.
Further, in the fourth step, the formula for calculating the dimensionless maximum temperature difference of the fin unit is as follows:
Wherein, Represents the dimensionless maximum temperature difference of the fin unit, Δt represents the maximum temperature difference of the fin unit, and Δt o represents the initial value of the maximum temperature difference of the fin unit.
Further, the formula of the composite function of the fin unit is as follows:
Where F tw denotes a complex value of the complex function, lambda o denotes a weighting coefficient, Represents the dimensionless maximum temperature difference of the fin unit, deltaT represents the maximum temperature difference of the fin unit, deltaT o represents the initial value of the maximum temperature difference of the fin unit,Represents the dimensionless pumping power of the fin unit, W p represents the pumping power of the fin unit, and W po represents the initial value of the pumping power of the fin unit.
Further, the initial value of the pumping power of the fin units is the pumping power when the preset number of the fin units is N=5, and the initial value of the maximum temperature difference of the fin units is the maximum temperature difference when the preset number of the fin units is N=5.
Drawings
FIG. 1 is a schematic diagram of a multi-hole fin heat sink of the present invention;
FIG. 2 is a schematic view of the structure of the fin unit of the present invention;
FIG. 3 is a schematic view of the structure of the rib of the present invention;
FIG. 4 is a schematic view of the structure of the substrate of the present invention;
FIG. 5 is a schematic view of the spatial volume of the fin unit of the present invention;
FIG. 6 is a graph showing the variation of the maximum temperature difference and the pump power consumption of the fin units in dimensionless manner and the number N of the fin units when the fin unit material is foam copper;
Fig. 7 is a graph showing the composite function versus the number N of fin units at different air fluid inlet mass flow rates when the fin unit material is copper foam.
In the drawings, the list of components represented by the various numbers is as follows:
1. the rib unit 101, the base 102, the rib 103 and the through hole.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
As shown in fig. 1 to 7, the present embodiment provides a porous fin heat dissipation method, where the porous fin heat dissipation device includes a plurality of fin units 1, where the fin units 1 are arranged side by side, the fin units 1 include a base 101 and a fin 102, one end of the fin 102 is fixedly connected with one end of the base 101, two sides of each base 101 are fixedly connected with one side of an adjacent base 101, and a plurality of through holes 103 are uniformly distributed on the fin 102 at intervals.
The worker mounts the bases 101 of the plurality of fin units 1 on the surface of the electronic device or the heat generating body requiring heat dissipation. The heat of the electronic device or the heat generating body can be quickly transferred from the substrate 101 to the rib 102 and radiated out through the plurality of through holes 103 on the rib 102, so that the heat radiation performance of the thermal management technology is effectively improved.
Specifically, as shown in fig. 1, in the present embodiment, the heat dissipating device includes a plurality of fin units 1, and 8 through holes 103 are uniformly distributed at intervals on each fin 102.
As shown in FIG. 2, the rib 102 has two rows of through holes, each row being spaced apart by four through holes. The staff can also set up different quantity of through-holes according to actual conditions, as long as guarantee that the clearance between every through-hole is the same. For example, three rows of holes may be provided in each fin 102, with four holes spaced apart from each other.
In addition, in the present embodiment, the substrate 101 is a rectangular parallelepiped. The substrate 101 may be provided as a polygonal body having a different shape, such as a square body or a cylinder, according to the surface shape of an actual electronic device or a heat generating body.
Specifically, the materials of the base 101 and the ribs 102 are heat dissipation materials, and the heat dissipation materials greatly increase the heat conductivity of the base 101 and the ribs 102, so that efficient heat exchange of the porous ribs is realized.
Wherein the heat dissipation material includes, but is not limited to, a metal foam such as copper foam, aluminum foam, or graphene foam. In this embodiment, the heat sink material of the fin 102 is copper foam.
On the basis of the scheme, the through holes 103 are the same in size.
The plurality of through holes 103 may increase the surface area of the electronic device that is in contact with the ribs 102 and may rapidly and uniformly dissipate the electronic device heat.
Specifically, as shown in fig. 2, the shape of the through hole 103 is square. The worker may set the through hole 103 to a different shape, such as a rectangle or a regular pentagon, according to the actual situation.
Wherein, the length of the through hole 103 along the Y-axis direction is equal to the width e of the rib 102, thus increasing the contact area between the air fluid and the rib 102, and realizing the enhanced heat dissipation of the porous rib surface.
On the basis of the above scheme, the length of the base 101 is a, the width is b, the height is c, the volume V 1 of the base 101=a×b×c, the length of the rib 102 is a, the width is e, the height is f, the volume V 2 =a×e×f of the rib 102, the spatial volume V T =a×b (c+f) of the rib unit 1, and the ratio Φ of the sum of the volume V 1 of the base 101 and the volume V 2 of the rib 102 to the spatial volume V T of the rib unit 1 is 0.5.
When the ratio phi of the sum of the volume V 1 of the base 101 and the volume V 2 of the rib 102 to the spatial volume V of the rib unit 1 is 0.5, the existing rib geometry is optimized to achieve the optimum volume ratio of the structure within the rib unit 1. Not only the overall heat radiation performance of the fin unit 1 can be improved, but also the local heat radiation performance of the fin unit 1 can be enhanced.
Specifically, the space volume V T of the fin unit 1 and the volume V 1 of the base 101 and the volume V 2 of the fin 102 are fixed, so that the material volume of the base 101 and the material volume of the fin 102 are fixed, facilitating control of the production cost of the fin unit 1.
The porous rib heat dissipation method further comprises the following steps:
inputting the preset number N, N of the fin units 1 determined according to the volume of an electronic device or a heat generating body into ANSYS Workbench software to solve, so as to obtain a temperature distribution table of the fin units 1 and a pressure distribution table of air fluid, wherein the fixed length L of the fin units 1 along the Y-axis direction, the porosity epsilon of a heat dissipation material of the fin units 1, the volume parameter of the fin units 1 and the inlet parameter of the air fluid are determined;
Obtaining a maximum temperature difference delta T between the highest temperature of the fin unit 1 and the inlet temperature of the air fluid and a maximum pressure difference delta P between the inlet average pressure of the air fluid and the outlet average pressure of the air fluid based on the temperature distribution table of the fin unit 1 and the pressure distribution table of the air fluid;
Presetting the mass flow rate of an air fluid inlet and the average density of the air fluid in advance, and calculating the pumping power consumption of the fin unit 1 by combining the maximum pressure difference delta P of the air fluid;
Calculating an initial value of the pumping power of the fin unit 1 based on the initial value of the maximum pressure difference of the fin unit 1, calculating the dimensionless pumping power of the fin unit 1 according to the initial value of the pumping power of the fin unit 1 and the pumping power of the fin unit 1, and calculating the dimensionless maximum temperature difference of the fin unit 1 according to the initial value of the maximum temperature difference of the fin unit 1 and the maximum temperature difference delta T of the fin unit 1;
And fifthly, carrying out linear weighting on the dimensionless pumping power consumption and the dimensionless maximum temperature difference of the fin units 1 to obtain a composite function of the fin units 1, calculating composite values corresponding to different fin units 1 according to the composite function of the fin units 1, selecting the fin units 1 corresponding to the minimum value from the composite values as the optimal number of the fin units 1 in the heat dissipation device, and distributing the heat dissipation device according to the optimal number of the fin units 1.
Aiming at different electronic devices or heat generating bodies, the optimal number of the fin units 1 in the heat dissipating device can be obtained through the composite function of the fin units 1, so that the heat dissipating device with optimal heat dissipating performance is realized, and the production cost is controlled.
In particular, three key assumptions are made in this example, firstly, that the air flow is considered to be a stable, incompressible laminar flow and there is no slippage when in contact with the electronics or heat generating body surface, secondly, that the physical properties of the air fluid and the foam metal remain unchanged throughout the process, and finally, that the effects of radiative heat transfer and energy dissipation due to viscosity on the system are ignored.
The air fluid can adopt cold air, and the flowing direction of the air fluid flows along the X-axis direction and wraps the whole heat dissipation device.
Specifically, since the temperature distribution of each fin unit 1 in the heat dissipating device is the same, when solving by ANSYS Workbench software, one fin unit 1 is selected for calculation in order to reduce the calculation amount. Therefore, the maximum temperature difference of one fin unit 1 is equal to the temperature difference of one fin 102, and is also equal to the maximum temperature difference of the entire heat sink.
Specifically, the number N of fin units, the length L, the porosity of the material epsilon, the fin volume and the air fluid inlet parameters all have an influence on the temperature of the fin units 1 and the pressure of the air fluid.
Specifically, as shown in fig. 6, at epsilon=0.8, phi=0.5,Under the condition that T in＝300K,L＝8mm,VT＝200mm3 is a fixed parameter, the preset number N of the fin units 1 determined according to the volume of an electronic device or a heating body is used as a variable parameter to be input into ANSYS Workbench software, and a change curve of dimensionless maximum temperature difference and dimensionless pump consumption power of the fin units 1 under the preset number N of different fin units 1 is obtained.
As can be seen from the change curve in fig. 6, the maximum dimensionless temperature difference of the fin unit 1 decreases with an increase in the preset number N of fin units 1, and the dimensionless pumping power of the fin unit 1 increases with an increase in the preset number N of fin units 1. Therefore, regardless of how the preset number N of fin units 1 varies, the dimensionless maximum temperature difference and the dimensionless pumping power of the fin units 1 are a pair of contradictory performances, the variation trend is opposite, and the design cannot be performed through single objective optimization, so that it is necessary to establish a composite function in the fifth step to study the heat transfer and flow comprehensive performance of the fin units 1.
In fig. six, in the case where l=8mm and v T＝200mm3 are fixed parameters, with the continuous change of the preset number N of fin units 1, the widths and heights of the base 101 and the fins 102 in each fin unit 1 are continuously changed, so as to drive the dimensional change of the through hole 103 in the fin 102, thereby realizing the influence of the fin units 1 with different volume parameters on the heat dissipation performance.
Specifically, as shown in fig. 7, in the case where ε=0.8, Φ=0.5, and t in＝300K,L＝8mm,VT＝200mm3 are fixed parameters, the preset number N of fin units 1 determined for the volume of the electronic device or the heat generating body is used as a variable parameter, and different air fluid inlet mass flow rates are respectively defined asAnd inputting into ANSYS Workbench software to obtain the change curves of the preset number N of the fin units 1, the dimensionless maximum temperature difference of the fin units 1 and the dimensionless pump consumption power under the three different air fluid inlet mass flow rates.
Wherein, as shown in FIG. 7, whenThe complex values F tw of the complex function are all lower than whenAndThe composite value of the composite function F tw.
However, inIn the composite value F tw of the composite function, when n=13, the composite value F tw of the composite function is at the lowest value, that is, n=13 is the optimal number of fin units 1, and the heat dissipation device is the optimal heat dissipation device at this time, so that the heat dissipation performance is optimal.
On the basis of the above, in the first step, the volume parameters of the fin unit 1 include the space volume V T of the fin unit 1, the volume V 1 of the base 101, and the ratio Φ of the volume V 2 of the fin 102 to the space volume V T of the fin unit 1, and the inlet parameters of the air fluid include the mass flow rate of the air fluid inletAnd the temperature of the air fluid inlet T in.
Specifically, according to the volume parameters of different fin units 1 and the inlet parameters of different air fluids, temperature distribution meters of different fin units and pressure distribution meters of different air fluids can be obtained through ANSYS Workbench software, so that the study on the heat dissipation performance of different heat dissipation devices is realized.
On the basis of the above-mentioned scheme, in step three, the formula for calculating the pumping power of the fin unit 1 is as follows:
Wherein, the power consumption of the W P pump is represented, Representing the mass flow rate of the air fluid inlet, Δp represents the maximum differential pressure Δp of the air fluid, ρ g represents the air fluid average density.
On the basis of the above-mentioned scheme, in step four, the formula for calculating the dimensionless pumping power of the fin unit 1 is as follows:
Wherein, Represents the dimensionless pumping power of the fin unit 1, W p represents the pumping power of the fin unit 1, and W po represents the initial value of the pumping power of the fin unit 1.
On the basis of the above-mentioned scheme, in the fourth step, the formula for calculating the dimensionless maximum temperature difference of the fin unit 1 is as follows:
Wherein, Represents the dimensionless maximum temperature difference of the fin unit 1, Δt represents the maximum temperature difference of the fin unit 1, and Δt o represents the initial value of the maximum temperature difference of the fin unit 1.
Based on the above scheme, the formula of the composite function of the fin unit 1 is as follows:
Where F tw denotes a complex value of the complex function, lambda o denotes a weighting coefficient, Represents the dimensionless maximum temperature difference of the fin unit 1, Δt represents the maximum temperature difference of the fin unit 1, Δt o represents the initial value of the maximum temperature difference of the fin unit 1,Represents the dimensionless pumping power of the fin unit 1, W p represents the pumping power of the fin unit 1, and W po represents the initial value of the pumping power of the fin unit 1.
Specifically, the staff may take the value of λ o according to the actual situation, for example, the value of λ o may be 0.2 or 0.3.
On the basis of the scheme, the initial value of the pumping power of the fin unit 1 is the pumping power when the preset number n=5 of the fin unit 1, and the initial value of the maximum temperature difference of the fin unit 1 is the maximum temperature difference when the preset number n=5 of the fin unit 1.
Specifically, in this embodiment, when the preset number n=5 of fin units 1 is the initial state of the heat dissipating device, and the side length L of the heat dissipating device formed by 5 fin units 1 is 8×8mm, the height c+f of the heat dissipating device is 2.19mm, the heat flux density value of the substrate 101 distributed uniformly is 16000W/m 2, the material of the fin units 1 is foam copper, the width b=1.6 mm of the substrate 101, the height f=0.457 mm of the fin 102, and the height c=0.94 mm of the substrate 101.
The staff inputs the parameters into ANSYS Workbench software to obtain a temperature distribution table of the fin unit 1 and a pressure distribution table of air fluid when the preset number N=5 of the fin units 1, and then obtain an initial value of the maximum temperature difference delta T of the fin units 1 and an initial value of the maximum pressure difference delta P of the fin units 1. By the formula for obtaining the pumping power consumption of the fin unit 1, the initial value of the pumping power consumption of the fin unit 1 is obtained.
As shown in Table 1 below, table 1 is whenWhen the heat dissipation device is used, the maximum temperature difference and the pumping power of the fin units in the optimal heat dissipation device (N=13), the initial heat dissipation device (N=5) and the optimal heat dissipation device without holes (N=13, but no through holes 103 are arranged on each fin 102) are compared.
TABLE 1
As can be seen from table 1, the maximum temperature difference of the optimal heat sink (n=13) is reduced by 54.6% compared to the initial heat sink (n=5), and the maximum temperature difference of the optimal heat sink (n=13) is reduced by 5.65% compared to the optimal heat sink (n=13) without holes (each rib 102 is not provided with a through hole 103). It can be seen that the optimal heat sink (n=13) greatly improves heat dissipation performance, but brings about a certain increase in pumping power.
In the description of the present invention, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.

Claims (7)

1. The porous fin heat dissipation method is characterized in that the porous fin heat dissipation device comprises a plurality of fin units (1), the fin units (1) are arranged side by side, the fin units (1) comprise a substrate (101) and fins (102), one end of each fin (102) is fixedly connected with one end of the substrate (101), two sides of each substrate (101) are fixedly connected with one side of the adjacent substrate (101), and a plurality of through holes (103) are uniformly distributed on the fin (102) at intervals;
The porous rib heat dissipation method comprises the following steps:
Inputting the preset number N, N of the fin units (1) determined according to the volume of an electronic device or a heat generating body into ANSYS Workbench software to solve, so as to obtain a temperature distribution table of the fin units (1) and a pressure distribution table of air fluid, wherein the fixed length L of the fin units (1) along the Y-axis direction, the porosity epsilon of a heat radiating material of the fin units (1), the volume parameter of the fin units (1) and the inlet parameter of the air fluid;
Obtaining a maximum temperature difference delta T between the highest temperature of the fin unit (1) and the inlet temperature of the air fluid and a maximum pressure difference delta P between the inlet average pressure of the air fluid and the outlet average pressure of the air fluid based on the temperature distribution meter of the fin unit (1) and the pressure distribution meter of the air fluid;
presetting the mass flow rate of an air fluid inlet and the average density of the air fluid in advance, and calculating the pumping power consumption of the fin unit (1) by combining the maximum pressure difference delta P of the air fluid;
Calculating an initial value of the pumping power consumption of the fin unit (1) based on the initial value of the maximum pressure difference of the fin unit (1), calculating the dimensionless pumping power consumption of the fin unit (1) according to the initial value of the pumping power consumption of the fin unit (1) and the pumping power consumption of the fin unit (1), and calculating the dimensionless maximum temperature difference of the fin unit (1) according to the initial value of the maximum temperature difference of the fin unit (1) and the maximum temperature difference delta T of the fin unit (1);
The dimensionless pump consumption power and the dimensionless maximum temperature difference of the fin units (1) are subjected to linear weighting to obtain a composite function of the fin units (1), composite values corresponding to the numbers of different fin units (1) are calculated according to the composite function of the fin units (1), the number of the fin units (1) corresponding to the minimum value is selected from the composite values to serve as the optimal number of the fin units (1) in the heat dissipating device, and the heat dissipating device is arranged according to the optimal number of the fin units (1);
A plurality of through holes (103) are the same size;
The base (101) has a length a, a width b, and a height c, the base (101) has a volume V 1 =a×b×c, the fin (102) has a length a, a width e, and a height f, the fin (102) has a volume V 2 =a×e×f, the fin unit (1) has a spatial volume V T =a×b (c+f), and a ratio Φ= (V 1+V2)/VT =0.5) of a sum of a volume V 1 of the base (101) and a volume V 2 of the fin (102) to a spatial volume V T of the fin unit (1).
2. A method of cooling a porous fin according to claim 1, wherein in step one, the volume parameters of the fin unit (1) include the volume V T of the fin unit (1), the volume V 1 of the base (101) and the ratio Φ of the volume V 2 of the fin (102) to the volume V T of the fin unit (1), and the inlet parameters of the air fluid include the mass flow rate of the air fluid inletAnd the temperature of the air fluid inlet T in.
3. A method of cooling a porous fin according to claim 1, wherein in step three, the formula for calculating the pumping power of the fin unit (1) is as follows:
Wherein, the power consumption of the W P pump is represented, Representing the mass flow rate of the air fluid inlet, Δp represents the maximum differential pressure Δp of the air fluid, ρ g represents the air fluid average density.
4. A method of cooling a porous fin according to claim 1, characterized in that in step four, the formula for calculating the dimensionless pumping power of the fin unit (1) is as follows:
Wherein, Represents the dimensionless pumping power of the fin unit (1), W p represents the pumping power of the fin unit (1), and W po represents the initial value of the pumping power of the fin unit (1).
5. A method of cooling a porous fin according to claim 1, wherein in step four, the formula for calculating the dimensionless maximum temperature difference of the fin unit (1) is as follows:
Wherein, Represents the dimensionless maximum temperature difference of the fin unit (1), Δt represents the maximum temperature difference of the fin unit (1), and Δt o represents the initial value of the maximum temperature difference of the fin unit (1).
6. A porous fin heat dissipation method according to claim 1, characterized in that the formula of the composite function of the fin unit (1) is as follows:
Where F tw denotes a complex value of the complex function, lambda o denotes a weighting coefficient, Represents the dimensionless maximum temperature difference of the fin unit (1), deltaT represents the maximum temperature difference of the fin unit (1), deltaTo represents the initial value of the maximum temperature difference of the fin unit (1),Represents the dimensionless pumping power of the fin unit (1), W p represents the pumping power of the fin unit (1), and W po represents the initial value of the pumping power of the fin unit (1).
7. The porous fin heat dissipation method according to claim 1, wherein in the fourth step, an initial value of the pumping power of the fin unit (1) is the pumping power when the preset number n=5 of the fin unit (1), and an initial value of the maximum temperature difference of the fin unit (1) is the maximum temperature difference when the preset number n=5 of the fin unit (1).
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