CN118743006A - Component push-up device and component mounting device - Google Patents

Abstract

The component pushing-up device includes: a pushing-up tool having an adsorption surface of a wafer bonding sheet and a pushing-up pusher; a pushing-up head having a tool mounting portion on which these pushing-up tools are mounted; and a tool transfer mechanism having a holding member capable of holding the pushing-up tool, the holding member holding the pushing tool and conveying the pushing tool, and mounting and dismounting the pushing tool on the tool mounting portion. The tool mounting portion is formed so that the pushing tool can be mounted and dismounted by relatively moving the pushing tool along a first direction. The holding member has a head portion for holding the pushing tool, and a head support portion for supporting the head portion in a manner capable of elastically displacing in a second direction perpendicular to the first direction.

Description

Component push-up device and component mounting device

Technical Field

The present invention relates to a component push-up device and a component mounting device equipped with the component push-up device. When picking up a bare die (bare chip) from a wafer attached to a wafer bonding sheet, the component push-up device pushes up the bare die from below the wafer bonding sheet to peel the bare die off.

Background Art

Conventionally, there is a component mounting device that picks up bare dies (bare chips) from a cut wafer and mounts them on a substrate. In the component mounting device, the following actions are repeatedly performed: a wafer camera photographs a wafer at a specified position (component arrangement area) brought into the machine by a wafer supply machine, and performs wafer recognition, and then a head member having a bare die holding function is used to pick up the bare die.

The component mounting device is provided with a component pushing device, which pushes up the bare die from the wafer bonding sheet from below the wafer bonded to the wafer bonding sheet, and peels the bare die from the wafer bonding sheet before picking up the bare die. The component pushing device includes a cylindrical adsorption shell and one or more push-up pins that can be retracted and arranged in the center part of the adsorption shell. When the adsorption shell is used to adsorb the wafer bonding sheet from the bottom surface with negative pressure, the bare die is pushed up from the bottom by the push-up pins.

The sizes of bare chips vary, and it is necessary to use a suction housing and a push pin that are suitable for the size of the bare chips. Therefore, the operator replaces the suction housing and the push pin manually. In recent years, a component push-up device having a suction housing and a push pin has been proposed, as in Patent Document 1. The component push-up device puts a plurality of push-up tools (peeling promotion heads) on standby and automatically replaces the push-up tools for the push-up unit (chip peeling promotion unit).

The component pushing device is a type of component pushing device in which the component pushing unit pushes up the bare die while moving relative to the wafer. The pushing unit is provided with a pushing head (stripping promotion head mounting portion) that can rotate between a vertical posture and a horizontal posture, and a pushing tool can be detachably mounted on the tool mounting portion of the pushing head. The pushing tool in standby is arranged horizontally. When replacing the pushing tool, the pushing head shifts from a vertical posture to a horizontal posture, and the pushing head moves to the standby position of the pushing tool while moving in the up-down and horizontal directions. Then, the pushing tool installed on the tool mounting portion is first stopped by the stopping arm, and in this state, the pushing head retreats, thereby removing the pushing tool from the tool mounting portion. Next, the pushing head moves to the position of the pushing tool of the replacement object, thereby installing the pushing tool on the tool mounting portion. Then, the pushing head is reset from the horizontal posture to the vertical posture, thereby completing the replacement of the pushing tool.

It is believed that in the component push-up device of Patent Document 1 described above, individual differences and/or movement errors of the push-up tool may cause a center offset between the tool mounting portion (mounting hole) and the push-up tool, thereby hindering the smooth installation and removal of the head from the tool mounting portion. This phenomenon may lead to a deterioration of the fitting state and/or a shortened life of these components due to the wear of the push-up tool and/or the tool mounting portion, and further affect the push-up performance of the bare die, so countermeasures need to be taken. However, Patent Document 1 does not mention this point.

Prior art literature

Patent Literature

Patent Document 1: Japanese Patent Publication No. 2008-258524

Summary of the invention

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology that facilitates smooth attachment and detachment of a push-up tool to a tool mounting portion in a component push-up device capable of automatically replacing a push-up tool.

The component pushing-up device according to one aspect of the present invention pushes up a bare die from below a wafer adhered to a wafer pasting sheet, thereby peeling the bare die from the wafer pasting sheet, the component pushing-up device comprising: a pushing-up tool having a suction surface for sucking up the lower surface of the wafer pasting sheet with negative pressure, and a pushing-up thrust capable of emerging from the suction surface to the side of the wafer pasting sheet; a pushing-up head having a tool mounting portion on which the pushing-up tool is mounted; and a tool transfer mechanism having a holding member capable of holding the pushing-up tool, the holding member holding the pushing tool and conveying the pushing tool, and mounting and dismounting the pushing tool to the tool mounting portion, wherein the tool mounting portion is formed so that the pushing tool can be mounted and dismounted by relatively moving the pushing tool along a first direction, the holding member having a head portion for holding the pushing tool, and a head support portion for supporting the head portion in a manner capable of elastically shifting in a second direction perpendicular to the first direction.

In addition, another aspect of the present invention relates to a component mounting device that includes: a component supply unit for configuring a wafer that is in a state of being cut and pasted on a wafer pasting sheet; a head member for picking up a bare chip from the wafer configured in the component supply unit and transferring the bare chip; and a component pushing-up device according to any one of claims 1 to 6, which pushes up the bare chip from below the wafer pasting sheet when the head member picks up the bare chip.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing a device body of a component mounting device according to the present invention (a component mounting device provided with a component pushing-up device according to the present invention).

FIG. 2 is a plan view showing a wafer stage and a wafer stage driving mechanism.

FIG. 3 is a schematic perspective view of the push-up unit and the tool storage unit.

FIG. 4 is a cross-sectional view of the distal end portion of the upper push head.

FIG. 5 is a cross-sectional view of the push-up tool and the head body in a separated state.

FIG. 6 is a perspective view of the head body of the push-up head, the push-up tool, and the tool storage stand.

FIG. 7 is a diagram showing a support structure of a chuck on a base frame, wherein (a) is a perspective view and (b) is a plan view.

FIG. 8 is a diagram for explaining the operation of each part when replacing the push-up tool.

FIG. 9 is a diagram for explaining the operation of each part when replacing the push-up tool.

FIG. 10 is a diagram for explaining the operation of each part when replacing the push-up tool.

11 is a schematic side view of the chuck during the tool installation action.

DETAILED DESCRIPTION

[Description of Component Mounting Device 1]

1 is a top plan view showing a device body 100 of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a hybrid component mounting device that can mount, in addition to finished components such as transistors and capacitors, bare chips 7a (components) cut from a wafer 7 on a substrate P. In order to clarify the directional relationship, XYZ rectangular coordinates are shown in the drawings.

The device body 100 includes a base 2, a conveyor 3, a head component unit 4, a component supply unit 5, a push-up unit 40, and a tool storage unit 60. The base 2 is a base for mounting various devices provided in the device body 100. The conveyor 3 is a conveying line for the substrate P, which is extended along the X direction on the base 2. The conveyor 3 carries the substrate P from outside the machine to a designated installation operation position, and after the installation operation, carries the substrate P out of the machine from the installation operation position. In addition, the position where the substrate P is shown in FIG. 1 is the installation operation position. The component supply unit 5 is respectively arranged on the -Y side and the +Y side across the conveyor 3.

The head component unit 4 picks up components in the component supply section 5, moves to the above-mentioned installation operation position, and installs the components on the substrate P. The head component unit 4 includes a plurality of head components 4H, each of which has a suction nozzle that absorbs and holds the components with negative pressure during the above-mentioned picking. The head component 4H can move forward and backward (up and down) in the Z direction and rotate around the axis relative to the head component unit 4. A substrate recognition camera 12 for photographing the substrate P is mounted in the head component unit 4. Based on the image captured by the substrate recognition camera 12, the reference mark attached to the substrate P is recognized.

The device body 100 includes a head component unit driving mechanism D1, which can move the head component unit 4 in the horizontal direction (XY direction) between the component supply part 5 and the substrate P maintained at the installation operation position. The head component unit driving mechanism D1 includes a pair of Y-axis rails 13, a Y-axis motor 14 and a ball screw shaft 15, which are respectively arranged on the overhead frame 11 and located on the +X side and the -X side, and a support beam 16 mounted on the pair of Y-axis rails 13. The ball screw shaft 15 is screwed with a nut arranged on the support beam 16. In addition, the head component unit driving mechanism D1 includes a guide member not shown in the figure, an X-axis motor 17 and a ball screw shaft 18 mounted on the support beam 16. The guide member supports the head component unit 4 so that it can move along the X direction, and the ball screw shaft 18 is screwed with a nut not shown in the figure arranged on the head component unit 4.

Based on the operation of the head component unit driving mechanism D1, the head component unit 4 moves in the horizontal direction. That is, the ball screw shaft 15 is driven and rotated by the Y-axis motor 14, and the head component unit 4 moves in the Y direction together with the support beam 16, and the ball screw shaft 18 is driven and rotated by the X-axis motor 17, and the head component unit 4 moves in the X direction relative to the support beam 16.

The component supply section 5 includes a first component supply section 5A located on the -Y axis of the conveyor 3 and a second component supply section 5B located on the +Y side. In the first component supply section 5A, a plurality of tape feeders 19 are arranged in parallel along the conveyor 3. The tape feeder 19 is a type of component supply device that supplies while feeding a tape containing finished components such as transistors and capacitors at predetermined intervals.

The second component supply unit 5B includes: a wafer supply device 6 that supplies a plurality of bare chips 7a in the form of a wafer 7; a component transfer unit 33 that picks up the bare chips 7a from the wafer 7 and transfers them to a designated delivery position for the head component unit 4; a wafer camera 39; and a component recognition camera 10.

The wafer supply device 6 includes a wafer storage elevator 22, a wafer stage 20, and a wafer extraction unit 23. The wafer storage elevator 22 stores wafers 7 in multiple layers up and down while holding the wafer bonding sheet 8a to which the wafers 7 are bonded by the wafer holding seat 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple layers as a whole, and arranges any wafer 7 at a height corresponding to the height of the wafer stage 20.

The wafer stage 20 is disposed on the -Y side of the wafer storage elevator 22. The wafer stage 20 is a component removal work table that holds the wafer holder 8 (wafer 7). The wafer supply device 6 includes a wafer stage driving mechanism D2 that allows the wafer stage 20 to move in the horizontal direction (XY direction).

2 is a top view showing a wafer table 20 and a wafer table driving mechanism D2. The wafer table driving mechanism D2 includes an X-axis rail 30, an X-axis motor 31, and a ball screw shaft 32, which are located on the +Y side and the -Y side, and a plate-shaped support member 26 mounted on the pair of X-axis rails 30. The ball screw shaft 32 is screwed with a nut provided on the support member 26. In addition, the wafer table driving mechanism D2 includes a Y-axis rail 27, a Y-axis motor 28, and a ball screw shaft 32, which are located on the +X side and the -X side, and are provided on the support member 26. The ball screw shaft 32 is screwed with a nut provided on the wafer table 20.

Based on the operation of the wafer stage driving mechanism D2, the wafer stage 20 moves in the horizontal direction. That is, the ball screw shaft 32 is driven and rotated by the X-axis motor 31, so that the wafer stage 20 and the support member 26 move in the X direction as a whole, and the ball screw shaft 29 is driven and rotated by the Y-axis motor 28, so that the wafer stage 20 moves relative to the support member 26 in the Y direction. When the transfer head 34 described later picks up the bare die 7a, based on the movement of the wafer stage 20, the target bare die 7a is arranged at a designated pickup position P1 defined by the XY coordinates.

The wafer extraction unit 23 takes and places the wafer holder 8 between the wafer storage elevator 22 and the wafer stage 20. The wafer extraction unit 23 includes an extraction head 24 capable of locking the wafer holder 8 and an extraction head driving device 25 for moving the extraction head 24 in the Y direction.

The wafer extraction unit 23 moves the extraction head 24 in the Y direction while the extraction head 24 is locked to the wafer holder 8, thereby moving the wafer holder 8. That is, the wafer 7 is put into the wafer storage elevator 22 together with the wafer holder 8, or is taken out from the wafer storage elevator 22. The wafer holder 8 can be taken in and out by arranging the wafer stage 20 at a designated wafer placement position close to and facing the -Y side of the wafer storage elevator 22.

The component transfer unit 33 includes: a transfer head 34 for picking up the die 7a arranged at the pickup position P1 from the wafer 7; a transfer stage 38 for transferring the die 7a to the head member unit 4; and a transfer head driving mechanism D3 for moving the transfer head 34.

The transfer head 34 includes a suction nozzle 34a that holds the die 7a by suction with negative pressure. The transfer head 34 picks up the die 7a by suctioning the die 7a with negative pressure at the pickup position P1. The suction nozzle 34a can move forward and backward (up and down) in the Z direction relative to the base portion of the transfer head 34 and rotate around the horizontal axis. By rotating the transfer head 34 around the horizontal axis, the posture of the die 7a can be turned upside down.

The transfer stage 38 is a delivery stage for delivering the bare die 7a held by the suction nozzle 34a to the head member 4H of the head member unit 4. The transfer stage 38 is arranged at a designated delivery position close to the mounting work position.

The transfer head driving mechanism D3 includes a rail 37 that supports the transfer head 34 in a movable manner, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35. The ball screw shaft 36 is screwed with a nut provided on the transfer head 34. The transfer head driving mechanism D3 drives the ball screw shaft 36 to rotate by the motor 35, so that the transfer head 34 moves in the space between the pickup position P1 and the transfer stage 38.

The wafer camera 39 captures a portion of the wafer 7 held on the wafer stage 20 at the pickup position P1, that is, a bare die 7a within the camera field of view, from above. Based on the captured image, the position of the bare die 7a to be picked up is identified. The wafer camera 39 is supported by an overhead frame (not shown) so as to be located above the transfer head 34 when the transfer head 34 is arranged at the pickup position P1. In this way, interference with the transfer head 34 is avoided.

The component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer stage 38. Before mounting the substrate P, the component recognition camera 10 captures the components (bare chips 7a and finished components) adsorbed by the head member 4H of the head member unit 4 from the bottom side. Based on the captured image, the adsorption state of the head member 4H on the components is recognized.

Fig. 3 is a schematic three-dimensional view of the push-up unit 40 and the tool storage unit 60. In this example, these push-up unit 40 and the tool storage unit 60 are equivalent to the "component push-up device" of the present invention, and in the following description, the push-up unit 40 and the tool storage unit 60 are sometimes referred to as the "component push-up device".

As shown in FIGS. 2 and 3 , the push-up unit 40 and the tool storage unit 60 are arranged below the component supply unit 5, specifically, below the support 26 of the wafer table driving mechanism D2. A circular opening 20a is provided on the wafer table 20, and an opening (not shown) is provided at a position of the support 26 that can overlap with the opening 20a. The push-up unit 40 is arranged below these openings. That is, if the wafer holder 8 is held on the wafer table 20, the wafer 7 is arranged on the inner side of the opening 20a. The push-up unit 40 pushes up the bare die 7a through the support 26 and the openings of the wafer table 20.

The push-up unit 40 includes a push-up head 41 and a push-up head driving mechanism D6. As shown in Fig. 3 and Fig. 4 (a), the push-up head 41 includes an axial head body 42 extending in the Z direction and a push-up tool 45 installed at its upper end. In addition, Fig. 4 (a) is a cross-sectional view of the distal end portion of the push-up head 41.

The push-up head 41 is arranged so that the head main body 42 is located at the pickup position P1. The head main body 42 is cylindrical and includes a push-up spindle 44 at the center thereof that moves forward and backward (up and down) in the Z direction.

The push-up tool 45 includes an adsorption shell 46 (sometimes also referred to as an "adsorption dome") for adsorbing the wafer bonding sheet 8a from below and a pin holding seat 48 disposed inside the shell. The adsorption shell 46 is a cylindrical member with a top, including an adsorption surface 46a and a cylindrical portion 46b extending downward from the periphery of the adsorption surface 46a, wherein the adsorption surface 46a has a circular adsorption surface when viewed from above for adsorbing the wafer bonding sheet 8a with negative pressure. A plurality of pin holes 47 are formed in a specified arrangement on the adsorption surface 46a.

The push-up tool 45 is detachably mounted on the distal end (upper end) of the head body 42 through the adsorption shell 46. Specifically, a tool mounting portion 43 having a smaller diameter than other portions is formed at the distal end of the head body 42, and the push-up tool 45 is mounted on the head body 42 by the cylindrical portion 46b of the adsorption shell 46 being engaged with the tool mounting portion 43. In other words, the push-up tool 45 is configured to be able to be mounted and disassembled on the tool mounting portion by moving the push-up tool 45 relative to the tool mounting portion 43 in the Z direction (equivalent to the "first direction" of the present invention). The mounting structure of the push-up tool 45 on the head body 42 may also be a structure in which, for example, a circular recess is formed at the distal end of the head body 42 as the tool mounting portion 43, and the push-up tool 45 is engaged with the circular recess. In addition, in the following description, for the sake of convenience, it is sometimes recorded that the push-up tool 45 is mounted on the push head 41.

The pin holding seat 48 is a component in which one or more upper push pins 50 are uprightly arranged on a disc-shaped pin base 49, and is held in the adsorption shell 46 in a state where it can move in the Z direction along the inner circumferential surface of the cylindrical portion 46b. As shown in FIG4 (b), based on the forward (ascending) movement of the push-up spindle 44, the pin holding seat 48 is pushed upward relative to the adsorption shell 46. Accordingly, the upper push pin 50 protrudes upward from the adsorption surface portion 46a through the pin hole 47. If the push-up spindle 44 moves backward (descending), the pin holding seat 48 descends relative to the adsorption shell 46 based on its own weight or by utilizing the force of an elastic member (spring, etc.) not shown in the figure. As a result, the upper push pin 50 retreats into the adsorption shell 46 (pin hole 47). That is, the upper push pin 50 is arranged in a manner that it can appear and disappear upward from the adsorption surface portion 46a.

When picking up the bare die 7a, negative pressure is supplied to the inside of the suction housing 46 through the head main body 42. The negative pressure is used to suction the wafer bonding sheet 8a through the pin holes 47. That is, in a state where the wafer bonding sheet 8a is suctioned by the suction surface 46a of the suction housing 46 with negative pressure, the push pin 50 protrudes from the suction surface 46a, so that the bare die 7a is pushed up through the wafer bonding sheet 8a.

In addition, the number, configuration, size (diameter, length) and distal end shape of the push pins 50 are different in specifications according to the size of the die 7a and the circuit formed thereon. A plurality of push-up tools 45 of different specifications are maintained and stored in the tool storage unit 60 described later. When picking up the die 7a, the push-up tools 45 pre-specified for each type of the die 7a (wafer 7) are installed on the push head 41.

As shown in FIG5 , a tapered portion 461 is formed at the opening edge of the cylindrical portion 46b of the push-up tool 45 (adsorption shell 46), and a tapered portion 431 is formed at the distal outer peripheral surface of the tool mounting portion 43. According to this structure, when the push-up tool 45 is mounted on the tool mounting portion 43, the push-up tool 45 is guided in such a manner that the center of the tool mounting portion 43 coincides with the center of the push-up tool 45. In addition, FIG5 is a cross-sectional view of the push-up tool and the head body in a separated state.

The upper push head driving mechanism D6 includes, for example, a cylinder mechanism that uses air as a driving source. Based on the operation of the upper push head driving mechanism D6, the upper push head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, it moves forward and backward between a specified upper push height position where the adsorption surface 46a abuts against the lower surface of the wafer bonding sheet 8a and a specified standby height position (the position shown in FIG. 3 ) that retreats downward from the upper push height position. In addition, a first tool detection sensor Se1 that can detect whether there is a push tool 45 at the distal end of the upper push head 41 is arranged on the -Y side of the upper push head 41 arranged at the standby height position.

As shown in Fig. 2 and Fig. 3, the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40. The tool storage unit 60 includes a tool storage portion 60A and a tool transfer mechanism 60B. The tool storage portion 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage portion 60A.

The tool storage section 60A includes: a tool storage stand 61 for holding the push-up tool 45; a storage stand driving mechanism D4 for moving the tool storage stand 61; and a code reading sensor Se3.

As shown in FIGS. 2 and 3 , the tool storage platform 61 is arranged at a position adjacent to the +X side relative to the head body 42 of the push-up head 41. The tool storage platform 61 is elongated in the X direction and is rectangular when viewed from above, and has a plurality of tool holding portions 62 on the upper surface. The tool holding portion 62 is a circular recess formed on the upper surface of the tool storage platform 61. The inner diameter of the tool holding portion 62 is set to a size that allows the push-up tool 45 (adsorption shell 46) to be embedded, and the push-up tool 45 is supported on the tool storage platform 61 in a state where its lower end portion is loosely fitted in the tool holding portion 62.

In this example, three tool holding portions 62 arranged in a row at equal intervals in the X direction are provided on the tool storage table 61. As shown in FIG. 2 , when viewed from above, each tool holding portion 62 is provided in such a manner that its center is located on a straight line L1 extending along the X direction through the center of the head body portion 42 of the upper push head 41. In addition, the first tool 45A is stored in the tool holding portion 62 at the -X side end (appropriately referred to as the first tool holding portion 62A), the second tool 45B is stored in the tool holding portion 62 in the middle (appropriately referred to as the second tool holding portion 62B), and the third tool 45C is stored in the tool holding portion 62 at the +X side end (appropriately referred to as the third tool holding portion 62C). In addition, in FIG. 2 and FIG. 3 , the first tool 45A is mounted on the upper push head 41, so the first tool holding portion 62A is empty.

FIG6 is a three-dimensional view showing the head body 42 of the push-up head 41, the push-up tool 45, and the tool storage table 61. As shown in FIG6, a positioning protrusion 43a is provided on the outer peripheral surface of the tool mounting portion 43 of the head body 42, and a positioning recess 56 is provided on the outer peripheral surface of the push-up tool 45 (adsorption shell 46). The push-up tool 45 is installed on the tool mounting portion 43 in a state of being positioned around the vertical axis based on the engagement of these positioning protrusions 43a with the positioning recess 56. On the other hand, a positioning protrusion 63 is provided on the inner peripheral surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 is held on the tool holding portion 62 in a state of being positioned around the vertical axis based on the engagement of the positioning protrusion 63 with the positioning recess 56.

Here, the positioning protrusion 43a of the head body 42 and the positioning protrusions 63 of each tool holding part 62 are both located on the straight line L when viewed from above, and are both arranged on the -X side. That is, the push-up tool 45 is held on the tool storage table 61 in the same posture as when it is mounted on the tool mounting part 43 of the head body 42 (in this example, the position in the up-down direction and the position around the axis are the same). In addition, a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, which can detect whether there is a push-up tool 45 in each tool holding part 62.

The storage table drive mechanism D4 includes, for example, a screw feed mechanism using a motor as a driving source. Based on the operation of the storage table drive mechanism D4, the tool storage table 61 moves horizontally in the X direction, so that the push-up tools 45 (45A to 45B) held on the tool storage table 61 are selectively arranged at the designated tool pick-up and placement positions P2 defined by the XY coordinates. In addition, the storage table drive mechanism D4 may also include a cylinder mechanism using air as a driving source.

The code reading sensor Se3 is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is arranged on the -Y side of the tool placement position P2, and reads the identification information recorded in the identification information recording unit provided on the side of the push-up tool 45 arranged at the tool placement position P2.

Specifically, as shown in FIG6 , a notched code plane portion 52 is formed on the outer peripheral portion of the −Y side of the cylindrical portion 46 b of the push-up tool 45 (adsorption housing 46), and a one-dimensional or two-dimensional identification code 54 is provided as an identification information recording portion on the code plane portion 52. The code reading sensor Se3 reads the identification code 54. Thus, the push-up tool 45 held by each tool holding portion 62 is identified.

As shown in Fig. 2 and Fig. 3, the tool transfer mechanism 60B includes a chuck 65 and a chuck driving mechanism D5 that moves the chuck 65 in the Z direction and the X direction. The chuck 65 is an electric or pneumatic parallel opening and closing type chuck device having a pair of claws 66 that can be opened and closed in the X direction on the side surface of the head main body 65a on the -Y side of a substantially rectangular parallelepiped shape. The chuck 65 holds the push-up tool 45 by clamping the push-up tool 45 from both sides in the X direction using the pair of claws 66.

The chuck driving mechanism D5 includes, for example, a slide 72 that moves in the X direction by a screw feed mechanism using a motor as a driving source, and a base frame 68 that moves in the Z direction by a screw feed mechanism also using a motor as a driving source. The base frame 68 is a block-shaped structure that is flat in the vertical direction, and the chuck 65 is supported by the base frame 68. Based on the operation of the chuck driving mechanism D5, the base frame 68 moves in the X direction together with the slide 72, and the base frame 68 moves in the Z direction relative to the slide 72. Accordingly, the chuck 65 moves in the X direction and the Z direction. In addition, the chuck driving mechanism D5 can also be a structure that uses a cylinder mechanism using air as a driving source to move the slide 72 and the base frame 68.

FIG7( a ) is a perspective view showing a supporting structure of the chuck 65 on the base frame 68 . As shown in this figure, the chuck 65 is supported on the upper surface of the base frame 68 via a connecting portion 80 and a plurality of positioning portions 82 .

The connection part 80 is located between the base frame 68 and the chuck 65 and connects them. The connection part 80 allows the chuck 65 to be displaced in the XY direction (i.e., the horizontal direction/equivalent to the "second direction" of the present invention) relative to the base frame 68 by elastic deformation of a part or the whole. The connection part 80 includes, for example, a shaft portion fixed to one of the lower surface of the head body 65a and the upper surface of the base frame 68, a cylinder portion fixed to the other side and into which the shaft portion is inserted, and an elastic body such as rubber, resin, or spring provided between the shaft portion and the cylinder portion. The displacement of the chuck 65 in the XY direction is allowed by elastic deformation of the elastic body.

The positioning portion 82 is used to position the chuck 65 relative to the base frame 68 in the XY direction. The positioning portion 82 includes a positioning protrusion 84 provided on the upper surface of the base frame 68 and a positioning recess 87 provided on the lower surface side of the chuck 65.

The positioning protrusion 84 includes, for example, a well-known positioning ball plug, which has a cylinder portion 85a arranged upright on the upper surface of the base frame 68, a ball 85b that appears and disappears at its distal end (upper end) and is held to roll freely, and a coil spring 85c that presses the ball 85b toward the distal end of the cylinder portion 85a. The positioning recess 87 is provided on the lower surface of a positioning block 86 fixed to the lower surface of the chuck 65. The positioning recess 87 is an upwardly concave concave portion whose inner diameter gradually decreases from bottom to top, and the distal end of the positioning protrusion 84, that is, the ball 85b, is pressed against its center portion. As a result, the chuck 65 is positioned at a position where the center of the positioning recess 87 coincides with the center of the positioning protrusion 84.

FIG. 7 (b) is a schematic top view showing the configuration of the connection portion 80 and the positioning protrusion 84. As shown in the figure, when the chuck 65 is viewed from above, for example, the connection portion 80 is configured at the center position of the head body 65a, and the positioning portion 82 is configured at four locations around the connection portion 80. Each positioning portion 82 is configured so that the linear distance d1 between their center C2 and the center C1 of the connection portion 80 is equal, and the linear distance d2 between the centers of the positioning portions adjacent to each other in the X direction and the Y direction is equal. In addition, the position where the elastic body of the connection portion 80 does not deform is set as the reference position Rp of the chuck 65, and the chuck 65 is positioned at the reference position Rp using the positioning portion 82.

2 , the pair of claws 66 are arranged at positions intersecting the straight line L in a plan view, and the chuck driving mechanism D5 operates to move the chuck 65 in the X direction and the Z direction. Therefore, the chuck 65 clamps the push-up tool 45 on the straight line L.

A notched chuck flat surface portion 53 is provided on the +X side and the outer peripheral portion of the -X axis in the cylindrical portion 46b of the push-up tool 45 held in the tool holding portion 62. Each chuck flat surface portion 53 is a surface parallel to each other. On the other hand, each claw 66 has a clamping surface parallel to the flat surface portion 53, and the chuck 65 clamps the chuck flat surface portion 53 of the push-up tool 45 using the clamping surface of the pair of claws 66. Therefore, the push-up tool 45 is held and transported by the chuck 65 in a state where it is placed on the tool holding portion 62.

In addition, in this example, the chuck 65, the base frame 68, the connecting portion 80 and the positioning portion 82 are equivalent to the "head holding member" of the present invention, the chuck 65 is equivalent to the "head portion" of the present invention, the base frame 68, the connecting portion 80 and the positioning portion 82 are equivalent to the "head supporting portion" of the present invention, and the base frame 68 is equivalent to the "base" of the present invention.

[Basic Operation of Component Mounting Device 1]

The basic operation of mounting the bare die 7a on the substrate P in the above component mounting device 1 is as follows. First, the wafer stage 20 is arranged at the wafer placement position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer stage 20 by the wafer extraction unit 23. Thus, the wafer bonding sheet 8a to which the aggregate (wafer 7) of the plurality of bare die 7a, 7a, ... is bonded is arranged on the wafer stage 20.

Next, the wafer stage 20 moves, and the die 7a to be picked up is placed at the pickup position P1, and the die 7a is photographed by the wafer camera 39. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pickup position P1. The wafer camera 39 photographs the die 7a to be sucked by the transfer head 34 in the subsequent pickup operation.

When the photographing of the die 7a is completed, the transfer head 34 is configured at the pickup position P1, and the suction nozzle 34a picks up the die 7a identified by the photographing of the wafer camera 39. At this time, the die 7a is pushed up by the upper push head 41. In detail, the upper push head 41 shifts (rises) from the standby height position to the upper push height position, and uses the suction surface 46a to suck the wafer bonding sheet 8a with negative pressure. Then, based on the operation of the upper push spindle 44, the upper push pin 50 protrudes from the suction surface 46a, thereby the die 7a is pushed up through the wafer bonding sheet 8a.

After picking up the bare die 7a, the transfer head 34 moves from above the wafer stage 20 to above the transfer stage 38. Here, while the bare die 7a is directly handed over to the head component unit 4 while being sucked by the suction nozzle 34a, the bare die 7a is released onto the transfer stage 38. Then, the transfer head 34 retreats from above the transfer stage 38, and the head component unit 4 moves to above the transfer stage 38, and the bare die 7a is picked up from the transfer stage 38 by the head component 4H. After picking up the bare die 7a, the head component unit 4 passes above the component recognition camera 10 and moves to above the substrate P at the installation operation position and descends. As a result, the bare die 7a is installed on the substrate P.

On the other hand, when the bare chip 7a is handed over to the head component unit 4 in a posture that is reversed from the suction posture of the suction nozzle 34a, for example, the suction nozzle 34a rotates and moves above the transfer platform 38, thereby causing the posture of the bare chip 7a to be reversed up and down. Then, the head component unit 4 moves to the top of the transfer head 34, and the bare chip 7a is directly picked up from the suction nozzle 34a by the head component 4H. After picking up the bare chip 7a, the head component unit 4 passes above the component recognition camera 10 and moves to the top of the substrate P at the installation operation position in the same way as described above. As a result, the bare chip 7a is installed on the substrate P.

Thereafter, the wafer stage 20 is moved so that the pickup target die 7a is arranged at the pickup position P1, while the pickup of the die 7a by the transfer head 34 and the mounting of the die 7a on the substrate P by the head member 4H are repeated.

As described above, the optimal specifications of the push-up tool 45 used when picking up the die 7a vary depending on the size of the die 7a, the circuit formed thereon, etc. Therefore, when the type of the die 7a is changed, the push-up tool 45 mounted on the push-up head 41 is replaced accordingly.

[Replacement Action and Effect of Push-up Tool 45]

Next, the replacement action of the push-up tool 45 is described with reference to Figures 8 to 12. Here, the action starting from the state of the push-up unit 40 and the tool storage unit 60 shown in Figures 3 and 8 is described. Figure 8 is an action description diagram of each part when replacing the push-up tool, (a) is a top view, and (b) is a side view observed from the -Y side, schematically showing the push-up unit 40 and the tool storage unit 60, respectively.

In Fig. 3 and Fig. 8, the first tool 45A is mounted on the upper push head 41, so the first tool holding portion 62A of the tool storage table 61 is empty. The tool storage unit 60 is configured so that the second tool holding portion 62B is located at the tool placement position P2, and the chuck 65 is configured at a standby position above the tool placement position P2.

First, as shown in FIG. 9 (a), the chuck 65 moves from the standby position to the upper position of the upper push head 41 and descends from the position, and clamps the first tool 45A mounted on the upper push head 41 with the claw 66. Accordingly, the chuck 65 holds the first tool 45A. Next, as shown in FIG. 9 (b), the chuck 65 rises while holding the first tool 45A, moves to the standby position, i.e., above the tool placement position P2, and descends. In this case, the empty tool holding portion 62 (i.e., the first tool holding portion 62A) is detected based on the presence or absence of a signal output from the second tool detection sensor Se2, and when the empty tool holding portion 62 is not configured at the tool placement position P2, the tool storage table 61 moves in such a manner that the empty tool holding portion 62 is configured at the tool placement position P2.

Next, as shown in Fig. 9(c), the chuck 65 releases the first tool 45A to the first tool holding portion 62A and then moves upward. As a result, the first tool 45A is returned to the tool storage table 61 (first tool holding portion 62A), and the tool returning operation is completed.

In addition, in the tool returning action, the first tool 45A is held by the chuck 65 in the same posture as when it is installed on the upper push head 41 by clamping the chuck flat surface portion 53 with the claws 66. Therefore, the first tool 45A returned to the first tool holding portion 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, and can be held by the first tool holding portion 62A in the same posture as when it is installed on the upper push head 41.

When the first tool 45A is returned to the tool storage table 61 , the process shifts to the tool installation operation. First, as shown in FIG. 10A , the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be installed is placed at the tool placement position P2 .

If the third tool 45C is placed at the tool placement position P2, as shown in Fig. 10(b) and (c), the chuck 65 descends from the standby position to hold the third tool 45C, rises and moves to the top of the head body 42 of the upper push head 41, and then descends. Thus, the third tool 45C is mounted on the upper push head 41.

The operation of the chuck 65 at this time will be described in detail with reference to Fig. 11. Fig. 11 is a schematic side view of the chuck during the tool mounting operation.

For example, when the third tool 45C is mounted on the tool mounting portion 43, it is estimated that due to the movement error of the chuck 65, as shown in FIG. 11 (a), the center axis Ax1 of the cylindrical portion 46b of the third tool 45C and the center axis Ax2 of the tool mounting portion 43 are offset from each other in the XY direction. In this case, if the third tool 45C approaches the head body 42, the third tool 45C is guided in such a manner that the center axes Ax1 and Ax2 are aligned with each other by using the tapered portion 461 of the third tool 45C and the tapered portion 431 of the tool mounting portion 43. Due to this guidance, a lateral (XY direction) load is applied to the third tool 45C. At this time, as described above, the chuck 65 is supported in a manner that allows elastic displacement relative to the base frame 68 in the XY direction, so that the load of the third tool 45C is input as an external force, and is displaced together with the third tool 45C as shown in FIG. 11 (b). That is, the chuck 65 is displaced from the reference position relative to the base 68 together with the third tool 45C so that the load acting on the third tool 45C is eliminated.

Therefore, when the third tool 45C is mounted on the tool mounting portion 43 , it is suppressed or prevented that the third tool 45C is forcibly mounted on the tool mounting portion 43 in a state where a load is applied to the third tool 45C.

When the mounting of the third tool 45C is completed, the chuck 65 moves to the aforementioned standby position above the tool placement position P2 as shown in Fig. 10(d) . Thus, the tool return operation is completed.

When the third tool 45C is mounted and the claws 66 are opened, the third tool 45C is released from the chuck 65 , and the chuck 65 is reset to the reference position as shown in FIG. 11C by the elastic force of the connection portion 80 (elastic body).

As described above, in the component push-up device (the push-up unit 40 and the tool storage unit 60) of the component mounting device 1, if a load is generated on the push-up tool 45 when the push-up tool 45 is mounted on the head body 42 (the tool mounting portion 43), the chuck 65 is displaced in the XY direction together with the push-up tool 45 in order to eliminate the load. Thus, the push-up tool 45 is mounted in a state where the load on the push-up tool 45 is suppressed or eliminated.

This situation also occurs when removing the push-up tool 45 mounted on the head body 42. That is, as shown in FIG9 (a) and (b), when the push-up tool 45 is held by the chuck 65, if the opening and closing center of the pair of claws 66 is offset from the center of the push-up tool 45 to the left or right (X direction), a lateral load (XY direction) may be generated on the push-up tool 45 when the push-up tool 45 is clamped. In this case, the chuck 65 is also displaced in the XY direction relative to the base frame 68 so that the load is eliminated.

Therefore, according to the component pushing-up device, the installation and removal of the pushing-up tool 45 of the head main body 42 become smoother. That is, the replacement of the pushing-up tool 45 is carried out more smoothly. Therefore, it is possible to effectively suppress or prevent the undesirable conditions caused by the installation and removal of the pushing-up tool 45 under the condition where the load is generated, such as the wear of the pushing-up tool 45 and the head main body 42 (tool mounting part 43) causing the mating state to deteriorate, thereby reducing the pushing-up performance of the bare chip.

In this case, since the chuck 65 is provided so as to be elastically displaceable relative to the base frame 68 , the load can be eliminated by displacing the chuck 65 by the minimum required movement amount corresponding to the magnitude of the load.

In addition, in the above-mentioned component push-up device, the chuck 65 is positioned at the reference position Rp by the positioning portion 82, and the positioning state is released only when the above-mentioned load is applied, and the chuck 65 moves. Therefore, the movement of the chuck 65 can be controlled based on the reference position Rp, and the chuck 65 can be displaced as described above only when necessary, and the position accuracy is suppressed from being affected due to the unstable position of the chuck 65 during the conveyance of the push-up tool 45.

In addition, in the component push-up device, if the chuck 65 is displaced from the reference position Rp in the XY direction, the chuck 65 is reset to the reference position Rp not only by the elastic force of the connection portion 80 (elastic body) but also by the force of the positioning portion 82. Therefore, the chuck 65 displaced from the reference position Rp can be reset to the reference position Rp more reliably. In detail, the diameter of the positioning recess 87 of the positioning portion 82 is set based on the estimated value of the core offset so that the ball 85b of the positioning protrusion 84 is located in the positioning recess 87. Accordingly, within the range in which the chuck 65 is displaced relative to the base frame 68 due to the load, the positioning portion 82 is configured so that the ball 85b is always pressed against the inclined surface of the positioning recess 87 by the elastic force of the coil spring 85c. That is, the positioning portion 82 is configured to generate a force that presses the chuck 65 displaced from the reference position Rp toward the reference position Rp. Therefore, according to this component pushing-up device, the chuck 65 displaced from the reference position Rp can be reliably returned to the reference position Rp.

Furthermore, as shown in FIG. 7B , since the four positioning portions 82 are arranged so as to evenly surround the connection portion 80 , the chuck 65 can be stably positioned at the reference position Rp due to the centering effect.

The component mounting device 1 described above is an example of an embodiment of the component mounting device involved in the present invention (a component mounting device equipped with the component pushing device of the present invention), and the specific structure of the component mounting device 1 and the component pushing device (the pushing unit 40 and the tool storage unit 60) can be appropriately changed within the scope of the main purpose of the present invention.

For example, the configuration that enables the chuck 65 to be elastically displaced in the XY directions relative to the base frame 68 and the configuration that positions the chuck 65 at the reference position Rp are not limited to the configurations of the embodiment and can be modified as appropriate.

In addition, in the above-mentioned component mounting device 1, the upper push head 41 is configured at the picking position P1, and the wafer 7 moves in the XY direction relative to the upper push head 41, so that the picked-up object bare chip 7a is configured at the picking position P1. However, it can also be an opposite configuration. That is, it can also be a configuration in which the upper push head 41 moves in the XY direction relative to the fixedly configured wafer 7 and is configured below the picked-up object bare chip 7a. In this case, the tool storage unit 60 can be configured at a position adjacent to the tool replacement area in such a way that the upper push head 41 is moved to a designated tool replacement area and the tool of the upper push head 41 configured in the tool replacement area is replaced.

[Inventions included in the above-mentioned embodiments]

The component pushing-up device according to one aspect of the present invention pushes up a bare die from below a wafer adhered to a wafer pasting sheet, thereby peeling the bare die from the wafer pasting sheet, the component pushing-up device comprising: a pushing-up tool having a suction surface for sucking up the lower surface of the wafer pasting sheet with negative pressure, and a pushing-up thrust capable of emerging from the suction surface to the side of the wafer pasting sheet; a pushing-up head having a tool mounting portion on which the pushing-up tool is mounted; and a tool transfer mechanism having a holding member capable of holding the pushing-up tool, the holding member holding the pushing tool and conveying the pushing tool, and mounting and dismounting the pushing tool to the tool mounting portion, wherein the tool mounting portion is formed so that the pushing tool can be mounted and dismounted by relatively moving the pushing tool along a first direction, the holding member having a head portion for holding the pushing tool, and a head support portion for supporting the head portion in a manner capable of elastically shifting in a second direction perpendicular to the first direction.

According to the structure of the component pushing-up device, for example, when a pushing-up tool held by a holding member is installed on a tool mounting portion, the head of the pushing-up tool is held and displaced in the second direction relative to the head support portion together with the pushing tool in a manner that the pushing tool is fitted into the tool mounting portion without load. Similarly, when the pushing tool is held by the holding member and removed from the tool mounting portion, the head is also displaced in the second direction in a manner that the pushing tool is removed without load. Therefore, the tool mounting portion can be more smoothly installed and removed.

In the above-mentioned element pushing device, it can be constructed as follows: the head support part has a base, and a connecting part which is arranged between the base member and the head and connects them, and the connecting part is elastically deformed in part or in whole, thereby causing the head to shift in the second direction relative to the base member.

In the structure of the component pushing device, the head is displaced in the second direction by elastic deformation of the connection part provided between the base and the head. According to this structure, if a load is generated on the pushing tool when it is engaged with the tool mounting part (external force input in the second direction), the connection part is deformed according to the magnitude of the load in such a way that the load is eliminated. In other words, the head is displaced in the second direction by an amount corresponding to the magnitude of the load.

In the above-mentioned element pushing device, it can be constructed as follows: the head support part also has a positioning part for positioning the head at a specified reference position relative to the base in the two directions, and the positioning part allows: when an external force along the second direction is input to the head, the head is displaced in the second direction.

According to the structure of the component push-up device, if a load is generated on the push-up tool when the component is engaged with the tool mounting portion (external force in the second direction is input), the head is displaced from the reference position to the second direction, and in other cases, the head is positioned at the reference position by the positioning portion. Therefore, the position accuracy of the head can be maintained, and the head is displaced only when a load is generated on the push-up tool when the component is engaged with the tool mounting portion.

In this case, the positioning portion may be configured to generate a force that presses the head toward the reference position in a state where the positioning portion is displaced from the reference position in the second direction.

According to the structure of this component pushing-up device, the head part displaced from the reference position in the second direction can be more reliably restored to the reference position.

In the above-mentioned component pushing-up device, the positioning portion may be provided at a plurality of positions around the connecting portion. According to this configuration, the head portion displaced from the reference position to the second direction can be more accurately reset to the reference position.

In the above-mentioned element pushing device, it can be constructed as: it also includes a tool storage table, which can support each pushing tool of the plurality of pushing tools, wherein the tool transfer mechanism performs a tool returning action in which the pushing tool installed on the pushing head is removed by the holding component and the pushing tool is returned to the tool storage table, and/or performs a tool installation action in which the pushing tool supported on the tool storage table is held by the holding component and the pushing tool is installed on the tool installation part of the pushing head.

According to the structure of this component pushing-up device, the pushing-up tool of the tool mounting portion can be smoothly attached and detached during the tool returning action and the tool mounting action.

In the above-mentioned component push-up device, the tool mounting portion may be formed in such a way that the push-up tool can be fitted into the tool mounting portion. In this case, a tapered portion for guiding the push-up tool to the tool mounting portion is provided on at least one of the tool mounting portion and the push-up tool.

According to the structure of the component pushing-up device, when the pushing-up tool is mounted on the tool mounting portion, the pushing-up tool can be smoothly fitted into the tool mounting portion while being guided in a manner such that their centers are aligned.

In addition, another aspect of the present invention relates to a component mounting device that includes: a component supply unit for configuring wafers that are in a state of being cut and pasted on a wafer pasting sheet; a head member for picking up a bare chip from the wafer configured in the component supply unit and transferring the bare chip; and the component pushing device for pushing up the bare chip from below the wafer pasting sheet when the head member picks up the bare chip.

According to the structure of this component mounting device, since it is provided with the component pushing-up device as described above, it is possible to more smoothly attach and detach the pushing-up tool to and from the tool mounting portion.

Claims (8)

1. A component pushing-up device for pushing up a die from below a wafer attached to a wafer attachment sheet so as to peel the die from the wafer attachment sheet, the component pushing-up device comprising:

A pushing-up tool having an adsorption surface for adsorbing the lower surface of the wafer adhesive sheet with negative pressure, and a pushing-up pin capable of being pulled out from the adsorption surface to the wafer adhesive sheet side;

A push-up head provided with a tool mounting part to which the push-up tool is mounted; and

A tool transfer mechanism including a holding member capable of holding the push-up tool, the holding member holding the push-up tool and carrying the push-up tool, and attaching and detaching the push-up tool to and from the tool mounting portion,

The tool mounting portion is formed as: the push-up tool can be attached and detached by relatively moving the push-up tool in the 1 st direction,

The holding member includes a head portion that holds the push-up tool, and a head support portion that supports the head portion so as to be elastically displaceable in a 2 nd direction perpendicular to the 1 st direction.

2. The component pushing-up device according to claim 1, wherein,

The head support portion includes a base portion and a connecting portion provided between the base member and the head portion and connecting them,

The connecting portion is elastically deformed by a part or all of the connecting portion, thereby displacing the head portion with respect to the base member in the 2 nd direction.

3. Element pushing-up device according to claim 2, characterized in that,

The head support portion further includes a positioning portion for positioning the head portion at a predetermined reference position with respect to the base portion in the 2-direction,

The positioning portion allows: when an external force in the 2 nd direction is input to the head, the head is displaced in the 2 nd direction.

4. The component pushing-up device according to claim 3, wherein,

The positioning portion generates a biasing force that biases the head toward the reference position in a state of being displaced from the reference position in the 2 nd direction.

5. Element pushing-up device according to claim 3 or 4, characterized in that,

The positioning portions are provided at a plurality of positions around the connecting portion.

6. The component push-up device according to any one of claims 1 to 5, characterized by further comprising:

a tool storage table capable of supporting each of the plurality of pushing tools, wherein,

The tool transfer mechanism performs a tool returning operation of removing the push-up tool attached to the push-up head by the holding member and returning the push-up tool to the tool storage table, and/or a tool mounting operation of holding the push-up tool supported by the tool storage table by the holding member and mounting the push-up tool to the tool mounting portion of the push-up head.

7. Element pushing-up device according to any of the claims 1 to 6, characterized in that,

The tool mounting portion is formed in such a manner that the push-up tool can be fitted to the tool mounting portion,

A tapered portion for guiding the push-up tool to the tool mounting portion is provided on at least one of the tool mounting portion and the push-up tool.

8. A component mounting apparatus characterized by comprising:

a component supply unit for disposing the wafer in a state of being stuck to the wafer adhesive sheet after being cut;

A head member for picking up a die from a wafer arranged in the element supply section and transferring the die; and

The component pushing-up device of any one of claims 1 to 7, pushing up the die from below the die attach pad when the head member picks up the die.