CN118695554A - Nonstandard metal case - Google Patents

Abstract

The application discloses a nonstandard metal case, which comprises a metal case, wherein the metal case comprises a bottom plate and a side plate connected to the bottom plate, an accommodating space is formed between the side plate and the bottom plate, and a PCB (printed circuit board) is arranged in the accommodating space on the bottom plate; at least one end part of the metal heat dissipation block is connected with the side plate through a heat conduction piece; the top of the side plate is connected with a metal cover plate. The application provides an efficient heat dissipation scheme by connecting the metal cover plate and the side plate through a plurality of channels from the inside to the metal shell, so that the heat in the metal shell can be dissipated to the surrounding environment through the metal shell.

Description

A non-standard metal chassis

Technical Field

The present application relates to the technical field of PCB chassis, and in particular to a non-standard metal chassis.

Background Art

Non-standard metal chassis refer to metal shells or frames that do not meet conventional size, shape or design specifications, and are used to install electronic equipment, computer hardware, industrial control devices, etc. For general miniaturized non-standard metal chassis, due to its small size, it can only accommodate highly integrated PCB boards, and there is no space to install fans or large heat sinks. Basically, the power devices are installed on a heat sink of a certain size, and then the PCB circuit is installed in the case for packaging. The internal heat can only be dissipated in the case through the heat sink, and it is impossible to establish a direct heat dissipation channel with the case to conduct the heat out. If the PCB board has high power and cannot meet the heat dissipation requirements, it will cause circuit damage. Or the use of general heat dissipation modules increases the volume of the entire component, and it is impossible to achieve miniaturization and high integration.

Searching for relevant patents, papers, and literature for this invention, the existing invention patents are as follows: Application No. CN200710194381.1 discloses a heat dissipation module for cooling a microprocessor. The heat dissipation module includes a base, a guide tube, a plurality of heat dissipation blocks, and a fan. The heat is mainly dissipated by the fan. This type of heat dissipation module cannot meet the requirements of a small-sized chassis because it needs to install components such as a fan.

Summary of the invention

The purpose of the present application is to provide a non-standard metal chassis to solve the problem that small-sized chassis in the prior art cannot achieve good internal heat dissipation of the chassis.

In order to achieve the above objectives, this application is implemented by adopting the following technical solutions:

A non-standard metal chassis, comprising a metal casing, the metal casing comprising a bottom plate and a side plate connected to the bottom plate, a receiving space being formed between the side plate and the bottom plate, a PCB board being arranged on the bottom plate in the receiving space, a first metal boss being arranged on the bottom plate in the receiving space, a metal heat sink for mounting a power device being connected to the first metal boss;

At least one end of the metal heat dissipation block is connected to the side plate via a heat conducting member;

The top of the side plate is connected with a metal cover plate.

Furthermore, the metal heat dissipation block is fixed on the first metal boss by countersunk screws.

Furthermore, the heat conducting member is a heat conducting adhesive, and the space between the end of the metal heat dissipation block and the side plate is filled with the heat conducting adhesive.

Furthermore, the distance between the end of the metal heat dissipation block and the side plate is 0.3-0.6 mm.

Furthermore, a second metal boss is provided on the bottom plate and located in the accommodating space, and the bottom surface of the PCB board is connected to the second metal boss via a conducting portion.

Furthermore, the conducting part includes a copper coating arranged on the PCB board and a heat-conducting adhesive filled between the copper coating and the second metal boss.

Furthermore, the top of the side plate is provided with an inwardly bent portion, and the bent portion is provided with a plurality of screw holes;

The screw passes through the through hole of the metal cover plate and is connected to the screw hole.

Furthermore, the PCB board is connected to the bottom plate by screws.

Furthermore, a process hole is provided on the PCB board, and the first metal boss is sleeved in the process hole.

Furthermore, the metal heat dissipation block includes a heat dissipation main board and a plurality of parallel heat dissipation side boards connected to the side surfaces of the heat dissipation main board.

The beneficial effects of this application are:

In the present application, a first metal boss is set on the base plate, and a metal heat sink is connected thereto, providing a direct and efficient heat dissipation path for the power device, and a first heat dissipation channel from the inside to the metal casing is established by connecting the metal heat sink and the first metal boss on the base plate; the end of the metal heat sink of the present application is connected to the side plate through a heat conductor, thereby establishing a second heat dissipation channel from the inside to the metal casing; the present application uses multiple channels from the inside to the metal casing and connects the metal cover plate and the side plate, so that the internal heat can be dissipated to the surrounding environment through the metal chassis, providing an efficient heat dissipation solution.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a top view of the metal chassis assembly of the present application;

FIG2 is a cross-sectional view of the metal chassis assembly of the present application

FIG. 3 is a schematic diagram of the structure of the metal casing in the present application.

Among them: 1. metal casing; 2. thermal conductive adhesive; 3. power device; 4. second metal boss; 5. metal heat sink; 6. first metal boss; 7. PCB board; 8. metal cover; 9. first screw; 10. second screw.

DETAILED DESCRIPTION

In order to make the technical means, creative features, objectives and effects achieved by this application easy to understand, this application is further explained below in conjunction with specific implementation methods.

It should be noted that in the description of the present application, the directions or positional relationships indicated by the terms "front", "rear", "left", "right", "up", "down", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application rather than requiring that the present application must be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. The terms "front", "rear", "left", "right", "up", and "down" used in the description of the present application refer to the directions in the accompanying drawings, and the terms "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

The metal chassis of the present invention is used to install a high-power PCB board. The design idea of the present application is: the metal casing 1 and the metal cover plate 8 are fastened in a packaging form using countersunk screws. In this scheme, the four corners of the PCB board are installed on the bosses of the bottom plate of the metal casing 1 by screws, and the heating device 3 on the PCB board is installed on the metal heat sink 5 by screws. The metal heat sink 5 is connected to the first metal boss 6 of the bottom plate by the screws at the bottom of the casing to establish a heat dissipation channel; the copper is applied to the vacant area where the PCB circuit is heated and connected to the second metal boss 4 of the bottom plate by thermal conductive glue to establish a heat dissipation channel. At the same time, the heat sink is customized, the length of the heat sink is controlled, and the heat sink is close to the side wall of the casing to establish a heat dissipation channel through thermal conductive glue and other thermal conductive materials. The heavier internal heat sink is fixed to the casing by screws, which improves reliability and meets high impact requirements. The heat dissipation problem of miniaturized and highly concentrated casing modules is solved in the above manner, the processing difficulty is reduced, and the reliability is improved.

The present application is described below through specific embodiments.

A non-standard metal chassis includes a metal casing 1, wherein the metal casing 1 includes a bottom plate and a side plate connected to the bottom plate, wherein a receiving space is formed between the side plate and the bottom plate, wherein a PCB board 7 is provided on the bottom plate in the receiving space, and wherein the metal casing 1 is characterized in that a first metal boss 6 is provided on the bottom plate in the receiving space, wherein a metal heat sink 5 for mounting a power device 3 is connected to the first metal boss 6; at least one end of the metal heat sink 5 is connected to the side plate via a heat conductor; and a metal cover plate 8 is connected to the top of the side plate.

The assembly process of the present application is as follows: First, install the PCB board 7 into the accommodation space on the bottom plate, and install the power device 3 on the metal heat sink 5 by an appropriate fixing method to ensure good contact to facilitate heat conduction. The metal heat sink 5 is installed on the first metal boss 6, and at least one end of the metal heat sink 5 is connected to the side plate by a heat conductive member (such as thermal adhesive, thermal grease, thermal gasket, etc.) to form a continuous heat dissipation path from the power device 3 to the side plate, thereby improving the heat dissipation efficiency. Finally, fix the metal cover plate 8 on the top of the side plate to complete the assembly of the entire chassis. The metal cover plate 8 not only helps to protect the internal components from the influence of the external environment, but also may provide additional heat dissipation area to further enhance the overall heat dissipation capability.

The present application forms an effective heat conduction path by directly mounting the power device 3 on the metal heat sink 5 and connecting it to the side plate using a heat conductor, which significantly improves the heat dissipation efficiency and helps to extend the service life of the power device and the stability of the system. The first metal boss 6 serves as a mounting base for the power device 3 and the metal heat sink 5 and can serve as a continuous heat dissipation path. The combination of the metal housing, the metal heat sink and the metal cover provides good mechanical protection, while also enhancing the shielding effect against electromagnetic interference, which helps to protect sensitive electronic components.

In some embodiments, a process hole is provided on the PCB board 7, and the first metal boss 6 is sleeved in the process hole. The first metal boss 6 is sleeved in the process hole, and its top end protrudes outward from the process hole to enable the installation of the metal heat sink 5 and provide support for the metal heat sink 5. On the other hand, the process hole of the PCB board 7 is sleeved on the outer periphery of the first metal boss, which can limit the position of the PCB board 7.

Furthermore, the first metal boss 6 can be designed as a two-stage step, the outer diameter of the lower section is larger than the outer diameter of the upper section, the outer diameter of the lower section is larger than the diameter of the process hole on the PCB board 7, and the outer diameter of the upper section is smaller than the diameter of the process hole on the PCB board. In this case, the PCB board can be installed on the top of the lower section. The support of the PCB board 7 by the first metal boss 6 and the connection of the end PCB board 7 to the bottom plate by screws jointly ensure the stability of the PCB board 7. A heat insulation pad can be set at the connection between the first metal boss 6 and the PCB board 7 to prevent the PCB board from overheating.

In a further embodiment, the metal heat sink 5 is fixed to the first metal boss 6 by a countersunk screw. The design of the countersunk screw allows the screw head to be completely embedded in the surface of the metal heat sink 5 or the first metal boss 6, avoiding protruding parts, thereby reducing the overall height, which is particularly important in a small-volume chassis. In addition, the metal countersunk screw can effectively transfer heat.

In one embodiment, the distance between the end of the metal heat sink 5 and the side plate is 0.3-0.6 mm. This design makes the distance between the metal heat sink 5 and the side plate small, and the heat conductor can be placed. The heat conductor is a thermal conductive adhesive, and the end of the metal heat sink 5 and the side plate are filled with thermal conductive adhesive. On the one hand, the thermal conductive adhesive can achieve a good heat transfer effect, and on the other hand, it can establish a connection between the metal heat sink 5 and the side plate to ensure the stability of the connection of the metal heat sink 5.

In one embodiment, a second metal boss 4 is provided on the bottom plate in the accommodation space, and the bottom surface of the PCB board 7 is connected to the second metal boss 4 through a conducting part. The conducting part includes a copper coating provided on the PCB board 7 and a heat conductive adhesive filled between the copper coating and the second metal boss 4. This design enables the heat of the PCB board 7 to be transferred to the outside of the chassis in a timely manner.

The power device 3 inside the chassis generates a lot of heat, and the heat is dissipated by the metal heat sink to the bottom plate, and the heat is dissipated by the metal heat sink 5 to the side plate. The PCB board 7 generates less heat, and the heat is dissipated through the second metal boss 4 to the heat dissipation channel of the bottom plate.

Furthermore, the metal heat sink 5 includes a heat sink main board and a plurality of parallel heat sink side plates connected to the side of the heat sink main board. There is a certain heat sink gap between the plurality of parallel heat sink side plates. This design can ensure the contact area between the air and the metal heat sink 5, and improve the heat dissipation effect of the metal heat sink 5.

In one embodiment, the top of the side plate is provided with an inwardly bent portion, and the bent portion is provided with a plurality of screw holes; screws are connected to the screw holes by passing through the through holes of the metal cover plate 8. The screws are preferably countersunk screws made of metal material, and the countersunk screws and the metal cover plate 8 are connected to ensure the flatness and small size of the chassis. The metal screws can effectively transfer heat. In addition, the countersunk screws contact the metal cover plate 8 in an embedded manner, and the heat dissipation is ensured by increasing the contact area of the metal cover plate 8.

In the present application, the power device 3 is installed on the metal heat sink block by screws through a thermal pad, so that the heat emitted by the device is conducted to the metal heat sink block. According to the circuit layout, the metal heat sink block is customized, and the length of the metal heat sink block is controlled at the same time, so that the heat sink block is close to the side wall of the casing, and the metal heat sink block 5 is connected to the side wall of the metal casing by thermal conductive glue, and the heat is directly conducted to the casing and dissipated. Due to the small contact surface, the heat dissipated is limited. Copper is applied to the spare area where the PCB circuit is heated, and a corresponding boss is designed on the bottom plate of the metal casing. The copper is connected to the base boss by thermal conductive glue to establish a heat conduction channel, which can conduct part of the heat to the chassis.

A heat dissipation channel is established between the metal heat dissipation block 5 and the bottom plate of the metal housing, a boss is designed on the bottom plate, which is in direct contact with the metal heat dissipation block, and the bottom plate and the metal heat dissipation block are connected and fixed by relatively thick countersunk screws, so that a large amount of heat on the metal heat dissipation block 5 can be conducted to the metal housing through the boss and the screws, achieving a heat dissipation effect. The metal housing and the metal cover are fastened and connected by screws to form a complete and highly reliable heat dissipation module.

Through the above special methods, a heat dissipation channel is established, which solves the problem that heat cannot be conducted to the base of the casing and improves reliability.

The casing is connected to the heat sink by screws, which can achieve heat dissipation and increase installation reliability and impact resistance. The PCB copper plate and the bottom plate boss establish a heat dissipation channel, which is flexible in position and can utilize the effective area. The metal heat sink 5 is connected to the metal casing side plate by thermal conductive glue, which fully improves the heat dissipation capacity.

It is known from common technical knowledge that the present application can be implemented by other embodiments that do not deviate from its spirit or essential features. Therefore, the above disclosed embodiments are only illustrative in all respects and are not exclusive. All changes within the scope of the present application or within the scope equivalent to the present application are included in the present application.

Claims (10)

1. A non-standard metal chassis, comprising a metal casing (1), the metal casing (1) comprising a bottom plate and a side plate connected to the bottom plate, a receiving space being formed between the side plate and the bottom plate, a PCB board (7) being arranged on the bottom plate and located in the receiving space, characterized in that a first metal boss (6) is arranged on the bottom plate and located in the receiving space, a metal heat sink (5) for mounting a power device (3) being connected to the first metal boss (6); At least one end of the metal heat dissipation block (5) is connected to the side plate via a heat conducting member; The top of the side plate is connected with a metal cover plate (8). 2. The non-standard metal chassis according to claim 1, characterized in that the metal heat sink (5) is fixed to the first metal boss (6) by countersunk screws. 3. The non-standard metal chassis according to claim 1, characterized in that the heat conducting member is a heat conducting adhesive, and the end of the metal heat dissipation block (5) and the space between the side plate are filled with the heat conducting adhesive. 4. The non-standard metal chassis according to claim 3, characterized in that the distance between the end of the metal heat sink (5) and the side plate is 0.3-0.6 mm. 5. The non-standard metal chassis according to claim 1, characterized in that a second metal boss (4) is provided on the bottom plate in the accommodating space, and the bottom surface of the PCB board (7) is connected to the second metal boss (4) via a conducting part. 6. The non-standard metal chassis according to claim 5, characterized in that the conducting part comprises a copper coating provided on the PCB board (7) and a heat-conducting adhesive filled between the copper coating and the second metal boss (4). 7. The non-standard metal chassis according to claim 1, characterized in that the top of the side plate is provided with an inwardly bent portion, and the bent portion is provided with a plurality of screw holes; The screw passes through the through hole of the metal cover plate (8) and is connected to the screw hole. 8. The non-standard metal chassis according to claim 1, characterized in that the PCB board (7) is connected to the bottom plate by screws. 9. The non-standard metal chassis according to claim 1, characterized in that a process hole is provided on the PCB board (7), and the first metal boss (6) is sleeved in the process hole. 10. The non-standard metal chassis according to any one of claims 1 to 9, characterized in that the metal heat dissipation block (5) comprises a heat dissipation main board and a plurality of parallel heat dissipation side boards connected to the sides of the heat dissipation main board.