[go: up one dir, main page]

CN216795164U - Portable WiFi - Google Patents

Portable WiFi Download PDF

Info

Publication number
CN216795164U
CN216795164U CN202220088372.4U CN202220088372U CN216795164U CN 216795164 U CN216795164 U CN 216795164U CN 202220088372 U CN202220088372 U CN 202220088372U CN 216795164 U CN216795164 U CN 216795164U
Authority
CN
China
Prior art keywords
circuit board
wifi
hole
heat dissipation
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220088372.4U
Other languages
Chinese (zh)
Inventor
胡丽
毛彩立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiangyan Intelligent Technology Co ltd
Original Assignee
Shanghai Jiangyan Intelligent Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jiangyan Intelligent Technology Co ltd filed Critical Shanghai Jiangyan Intelligent Technology Co ltd
Priority to CN202220088372.4U priority Critical patent/CN216795164U/en
Application granted granted Critical
Publication of CN216795164U publication Critical patent/CN216795164U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本实用新型公开一种随身WiFi,该随身WiFi包括壳体、电路板及散热组件,壳体内设有安装腔;电路板设于安装腔,且电路板的表面设有电子元件;散热组件设于安装腔,并与电路板围合形成有容置腔,电子元件位于容置腔内,且散热组件的两侧分别与电子元件和壳体贴合,以将电子元件产生的热量传导至壳体并散发至外界。本实用新型技术方案提高了随身WiFi内部电子元件的散热效率。

Figure 202220088372

The utility model discloses a portable WiFi. The portable WiFi comprises a casing, a circuit board and a heat dissipation component. The casing is provided with an installation cavity; the circuit board is arranged in the installation cavity, and the surface of the circuit board is provided with electronic components; The mounting cavity is enclosed with the circuit board to form an accommodating cavity, the electronic components are located in the accommodating cavity, and the two sides of the heat dissipation assembly are respectively attached to the electronic components and the casing, so as to conduct the heat generated by the electronic components to the casing and distributed to the outside world. The technical scheme of the utility model improves the heat dissipation efficiency of the internal electronic components of the portable WiFi.

Figure 202220088372

Description

随身WiFiPocket WiFi

技术领域technical field

本实用新型涉及路由器技术领域,特别涉及一种随身WiFi。The utility model relates to the technical field of routers, in particular to a portable WiFi.

背景技术Background technique

WiFi(无线保真),是一种可以将个人电脑、手持设备(如PDA、手机)等终端以无线方式互相连接的技术。随着技术的发展,随身WiFi应运而生。随身WiFi是将电脑有线网络分享为WiFi热点,以便让身边的手机、PAD、笔记本等设备实现免费上网。相关技术中,为了保证WiFi高速上网,并且尽可能覆盖范围更广,往往需要将产品的发射功率调到一个比较高的水平,从而导致工作电流偏大,设备上的电子元件很容易发热。当电子元件发热到一定程度,就会因为高温而启动软件保护机制,强制降低功率,降低上网速度,影响用户体验。WiFi (Wireless Fidelity) is a technology that can wirelessly connect terminals such as personal computers and handheld devices (such as PDAs, mobile phones) to each other. With the development of technology, portable WiFi came into being. Portable WiFi is to share the computer's wired network as a WiFi hotspot, so that mobile phones, PADs, notebooks and other devices around you can access the Internet for free. In the related art, in order to ensure high-speed WiFi access and wider coverage as possible, it is often necessary to adjust the transmit power of the product to a relatively high level, which results in a high operating current and the electronic components on the device are prone to heat. When the electronic components heat up to a certain level, the software protection mechanism will be activated due to the high temperature, forcibly reducing the power, reducing the Internet speed, and affecting the user experience.

实用新型内容Utility model content

本实用新型的主要目的是提供一种随身WiFi,旨在提高随身WiFi内电子元件的散热效率。The main purpose of the utility model is to provide a portable WiFi, which aims to improve the heat dissipation efficiency of the electronic components in the portable WiFi.

为实现上述目的,本实用新型提出的随身WiFi包括:In order to achieve the above-mentioned purpose, the portable WiFi proposed by the present utility model includes:

壳体,所述壳体内设有安装腔;a casing, wherein an installation cavity is arranged in the casing;

电路板,所述电路板设于所述安装腔,且所述电路板的表面设有电子元件;及a circuit board, the circuit board is arranged in the mounting cavity, and the surface of the circuit board is provided with electronic components; and

散热组件,所述散热组件设于所述安装腔,并与所述电路板围合形成有容置腔,所述电子元件位于所述容置腔内,且所述散热组件的两侧分别与所述电子元件和所述壳体贴合,以将所述电子元件产生的热量传导至所述壳体并散发至外界。A heat-dissipating assembly, the heat-dissipating assembly is arranged in the installation cavity, and forms an accommodating cavity enclosed with the circuit board, the electronic components are located in the accommodating cavity, and two sides of the heat-dissipating assembly are respectively connected with The electronic components are attached to the casing, so as to conduct the heat generated by the electronic components to the casing and dissipate it to the outside.

可选地,所述散热组件包括:Optionally, the heat dissipation assembly includes:

安装架,所述安装架设于所述电路板,所述安装架开设有过孔,所述电子元件部分穿设于所述过孔;和a mounting rack, the mounting rack is mounted on the circuit board, the mounting rack is provided with a via hole, and the electronic component is partially penetrated through the via hole; and

屏蔽盖,所述屏蔽盖罩盖所述安装架,并与所述安装架连接,所述电子元件部分穿过所述过孔与所述屏蔽盖贴合;a shielding cover, the shielding cover covers the mounting frame and is connected with the mounting frame, and the electronic component part passes through the through hole and is attached to the shielding cover;

其中,所述安装架、所述屏蔽盖及所述电路板围合形成所述容置腔。Wherein, the mounting frame, the shielding cover and the circuit board are enclosed to form the accommodating cavity.

可选地,所述电路板的表面间隔设有多个所述电子元件,所述安装架开设有多个所述过孔,每一所述电子元件部分穿设于一所述过孔设置。Optionally, the surface of the circuit board is provided with a plurality of the electronic components at intervals, the mounting frame is provided with a plurality of the via holes, and each of the electronic components is partially disposed through one of the via holes.

可选地,所述安装架面向所述电路板表面的一侧凸设有多个凸筋,每一所述凸筋设于相邻的两个所述过孔之间,用于隔开相邻的两个所述电子元件。Optionally, a plurality of ribs are protruded from the side of the mounting frame facing the surface of the circuit board, and each of the ribs is provided between two adjacent via holes for separating phases. two adjacent electronic components.

可选地,所述安装架的侧壁开设有通孔,所述屏蔽盖设有容纳槽,所述安装架至少部分容纳于所述容纳槽内,所述容纳槽的侧壁对应所述通孔设有凸起,所述屏蔽盖罩盖所述安装架时,所述凸起穿设于所述通孔。Optionally, the side wall of the mounting frame is provided with a through hole, the shielding cover is provided with a receiving groove, the mounting frame is at least partially contained in the receiving groove, and the side wall of the receiving groove corresponds to the through hole. The holes are provided with protrusions, and when the shielding cover covers the mounting frame, the protrusions pass through the through holes.

可选地,所述通孔呈圆孔状,且所述凸起呈半球型;Optionally, the through hole is in the shape of a round hole, and the protrusion is in the shape of a hemisphere;

且/或,所述安装架设有多个所述通孔,多个所述通孔环绕所述安装架设置,所述屏蔽盖设有多个所述凸起,每一所述凸起穿设于一所述通孔。And/or, the mounting frame is provided with a plurality of the through holes, the plurality of the through holes are arranged around the mounting frame, the shielding cover is provided with a plurality of the protrusions, each of the protrusions passes through in one of the through holes.

可选地,所述电子元件和所述屏蔽盖之间涂覆有导热硅胶;Optionally, thermally conductive silica gel is coated between the electronic components and the shielding cover;

且/或,所述屏蔽盖的材质为金属材质。And/or, the material of the shielding cover is a metal material.

可选地,所述散热组件还包括石墨烯散热片,所述石墨烯散热片设于所述屏蔽盖与所述壳体之间。Optionally, the heat dissipation assembly further includes a graphene heat sink, and the graphene heat sink is provided between the shielding cover and the housing.

可选地,所述电路板的两侧均设有所述电子元件,所述随身WiFi包括两个所述散热组件,两个所述散热组件分别设于所述电路板的两侧。Optionally, the electronic components are provided on both sides of the circuit board, and the portable WiFi includes two of the heat dissipation assemblies, and the two heat dissipation assemblies are respectively disposed on both sides of the circuit board.

可选地,所述电路板开设有多个限位孔,多个所述限位孔沿所述电路板的周缘环绕设置,所述安装腔的内壁凸设有多个定位柱,每一所述定位柱穿设于一所述限位孔。Optionally, the circuit board is provided with a plurality of limit holes, the plurality of limit holes are arranged around the periphery of the circuit board, and the inner wall of the installation cavity is protruded with a plurality of positioning posts, each of which is The positioning column is penetrated through one of the limiting holes.

本实用新型技术方案通过将电路板安装在壳体的安装腔内,由壳体对电路板进行防护。电路板上设有实现相应功能的电子元件,设置散热组件与电路板围合形成容置腔,使得电子元件容置于容置腔内,并使得散热组件分别与电子元件和壳体贴合,当电子元件产生热量时,由散热组件整体传导该部分热量至壳体,以将热量散发至外界,从而实现散热,保证随身WiFi的上网速度。The technical scheme of the utility model is to install the circuit board in the installation cavity of the casing, so that the circuit board is protected by the casing. The circuit board is provided with electronic components to achieve corresponding functions, and the heat dissipation component is set to enclose the circuit board to form an accommodating cavity, so that the electronic components are accommodated in the accommodating cavity, and the heat dissipation component is respectively attached to the electronic component and the shell. When the electronic components generate heat, the heat dissipation component conducts the heat to the casing as a whole, so as to dissipate the heat to the outside, so as to achieve heat dissipation and ensure the Internet speed of the portable WiFi.

附图说明Description of drawings

为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.

图1为本实用新型随身WiFi一实施例的结构示意图;1 is a schematic structural diagram of an embodiment of the portable WiFi of the present invention;

图2为本实用新型随身WiFi一实施例的爆炸图;2 is an exploded view of an embodiment of the portable WiFi of the present invention;

图3为本实用新型随身WiFi一实施例中安装架和屏蔽盖的结构示意图。3 is a schematic structural diagram of a mounting frame and a shielding cover in an embodiment of the portable WiFi of the present invention.

附图标号说明:Description of reference numbers:

标号label 名称name 标号label 名称name 100100 随身WiFiPocket WiFi 22twenty two 限位孔Limit hole 11 壳体case 33 散热组件Cooling components 1111 上壳upper shell 3131 安装架Mount 1212 下壳lower shell 311311 过孔via 121121 定位柱positioning post 312312 通孔through hole 1313 端盖end cap 3232 屏蔽盖shield cover 22 电路板circuit board 321321 凸起bulge 21twenty one 电子元件Electronic component 3333 石墨烯散热片Graphene heat sink

本实用新型目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.

具体实施方式Detailed ways

下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型的一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, but not all of them. Example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

需要说明,本实用新型实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the difference between the various components under a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

另外,在本实用新型中涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本实用新型要求的保护范围之内。In addition, the descriptions involving "first", "second", etc. in the present invention are only for description purposes, and should not be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present utility model.

本实用新型提出一种随身WiFi100。The utility model provides a portable WiFi 100.

请结合参照图1和图2,在本实用新型实施例中,该随身WiFi100包括壳体1、电路板2及散热组件3,壳体1内设有安装腔;电路板2设于安装腔,且电路板2的表面设有电子元件21;散热组件3设于安装腔,并与电路板2围合形成有容置腔,电子元件21位于容置腔内,且散热组件3的两侧分别与电子元件21和壳体1贴合,以将电子元件21产生的热量传导至壳体1并散发至外界。Please refer to FIG. 1 and FIG. 2 in conjunction. In the embodiment of the present invention, the portable WiFi 100 includes a casing 1, a circuit board 2 and a heat dissipation component 3. The casing 1 is provided with an installation cavity; the circuit board 2 is arranged in the installation cavity, And the surface of the circuit board 2 is provided with electronic components 21; the heat dissipation component 3 is arranged in the installation cavity, and is enclosed with the circuit board 2 to form a accommodating cavity, the electronic component 21 is located in the accommodating cavity, and the two sides of the heat dissipation component 3 are respectively It is attached to the electronic component 21 and the casing 1 to conduct the heat generated by the electronic component 21 to the casing 1 and dissipate it to the outside.

本实施例中,壳体1包括上壳11和下壳12,上壳11和下壳12连接并围合形成安装腔,将电路板2装设在安装腔内,由上壳11和下壳12进行防护。同时,上壳11和下壳12的一端还围合形成有连通口,随身WiFi100还包括USB接口,USB接口设于电路板2的一端,并与电路板2电连接,且USB接口穿设于连通口,用于与外部设备连接。此外,壳体1还包括端盖13,端盖13盖合于连通口处,并与上壳11和下壳12卡接,以罩盖USB接口。In this embodiment, the casing 1 includes an upper casing 11 and a lower casing 12. The upper casing 11 and the lower casing 12 are connected and enclosed to form an installation cavity, and the circuit board 2 is installed in the installation cavity. 12 for protection. At the same time, one end of the upper shell 11 and the lower shell 12 is also formed with a communication port, and the portable WiFi 100 also includes a USB interface. The USB interface is arranged at one end of the circuit board 2 and is electrically connected to the circuit board 2. Connection port for connecting with external devices. In addition, the housing 1 further includes an end cover 13, the end cover 13 is closed at the communication port, and is snapped with the upper shell 11 and the lower shell 12 to cover the USB interface.

可以理解的,电子元件21可以通过点锡膏焊接在电路板2上,电子元件21可以是电源管理芯片、控制芯片、信号发射模块等。设置散热组件3扣盖在电子元件21上,并与电路板2连接且围合形成容置腔,其连接方式可以是粘接或者焊接等,以使得散热组件3内侧与电子元件21贴合。可以理解的,电子元件21发热时,可将热量传导至与其接触的散热组件3上,散热组件3的大小大于电子元件21的大小,散热面积更大,由散热组件3将热量传导至外壳并散发至外界,提高了散热效率。It can be understood that the electronic component 21 can be soldered on the circuit board 2 by solder paste, and the electronic component 21 can be a power management chip, a control chip, a signal transmission module and the like. The heat dissipating assembly 3 is clasped on the electronic component 21 and connected with the circuit board 2 to form a accommodating cavity. It can be understood that when the electronic component 21 generates heat, the heat can be conducted to the heat dissipation component 3 in contact with it. The size of the heat dissipation component 3 is larger than that of the electronic component 21, and the heat dissipation area is larger. Dissipate to the outside, improve the heat dissipation efficiency.

本实施例中,散热组件3可以为一体成型的金属壳或是涂覆有金属材质的非金属壳,散热组件3与电路板2围合形成封闭的容置腔,将电子元件21设置在容置腔内,可防止外界的电磁波干扰。In this embodiment, the heat dissipation component 3 can be an integrally formed metal shell or a non-metallic shell coated with a metal material. The heat dissipation component 3 and the circuit board 2 are enclosed to form a closed accommodating cavity, and the electronic components 21 are arranged in the container. It is placed in the cavity to prevent external electromagnetic wave interference.

本实用新型技术方案通过将电路板2安装在壳体1的安装腔内,由壳体1对电路板2进行防护。电路板2上设有实现相应功能的电子元件21,设置散热组件3与电路板2围合形成容置腔,使得电子元件21容置于容置腔内,并使得散热组件3分别与电子元件21和壳体1贴合,当电子元件21产生热量时,由散热组件3整体传导该部分热量至壳体1,以将热量散发至外界,从而实现散热,保证随身WiFi100的上网速度。In the technical solution of the present invention, the circuit board 2 is protected by the casing 1 by installing the circuit board 2 in the installation cavity of the casing 1 . The circuit board 2 is provided with electronic components 21 that realize corresponding functions, and the heat dissipation component 3 is set to enclose the circuit board 2 to form an accommodating cavity, so that the electronic components 21 are accommodated in the accommodating cavity, and the heat dissipation component 3 and the electronic components are respectively formed. 21 is attached to the housing 1. When the electronic component 21 generates heat, the heat dissipation component 3 conducts the heat to the housing 1 as a whole, so as to dissipate the heat to the outside, so as to achieve heat dissipation and ensure the Internet speed of the portable WiFi 100.

请结合参照图2和图3,在一实施例中,散热组件3包括安装架31和屏蔽盖32,安装架31设于电路板2,安装架31开设有过孔311,电子元件21部分穿设于过孔311;屏蔽盖32罩盖安装架31,并与安装架31连接,电子元件21部分穿过过孔311与屏蔽盖32贴合;其中,安装架31、屏蔽盖32及电路板2围合形成容置腔。Please refer to FIG. 2 and FIG. 3 , in one embodiment, the heat dissipation assembly 3 includes a mounting frame 31 and a shielding cover 32 , the mounting frame 31 is arranged on the circuit board 2 , the mounting frame 31 is provided with a via hole 311 , and a part of the electronic component 21 penetrates The shielding cover 32 covers the mounting frame 31 and is connected to the mounting frame 31. Part of the electronic components 21 passes through the through hole 311 and is attached to the shielding cover 32; wherein, the mounting frame 31, the shielding cover 32 and the circuit board 2 is enclosed to form an accommodating cavity.

本实施例中,安装架31笼罩在电子元件21上方,并对应电子元件21开设有过孔311,过孔311的形状与电子元件21相适配,以供电子元件21穿过,同时,屏蔽盖32罩盖于安装架31,使得电子元件21穿过过孔311与屏蔽盖32贴合。可以理解的,安装架31用于支撑稳固屏蔽盖32,由屏蔽盖32传导热量至壳体1上。屏蔽盖32与安装架31的连接方式可以是粘接、卡接或者焊接等,在此不做限定。在此,可设置电子元件21的上表面与安装架31的上表面齐平,当屏蔽盖32支撑于安装架31上时,即可与电子元件21的上表面贴合,以实现热量传导。In this embodiment, the mounting frame 31 covers the electronic component 21, and a via hole 311 is formed corresponding to the electronic component 21. The shape of the via hole 311 is adapted to the electronic component 21 so that the electronic component 21 can pass through. The cover 32 covers the mounting frame 31 , so that the electronic component 21 passes through the through hole 311 and is attached to the shielding cover 32 . It can be understood that the mounting bracket 31 is used to support the stable shielding cover 32 , and the shielding cover 32 conducts heat to the casing 1 . The connection method between the shielding cover 32 and the mounting frame 31 may be bonding, clamping or welding, etc., which is not limited herein. Here, the upper surface of the electronic component 21 can be set to be flush with the upper surface of the mounting frame 31. When the shielding cover 32 is supported on the mounting frame 31, it can be attached to the upper surface of the electronic component 21 to realize heat conduction.

本实施例中,为了提高导热效率,可在屏蔽盖32和电子元件21之间涂覆导热硅胶,只需将导热硅胶涂覆在对应过孔311的位置处即可,减少导热硅胶的浪费。此外,还可设置屏蔽盖32由金属材质制成,并通过电路板2给屏蔽盖32通电导通,以实现电磁屏蔽效果,屏蔽外界的电磁波干扰。In this embodiment, in order to improve the thermal conductivity, thermally conductive silica gel can be coated between the shielding cover 32 and the electronic components 21 , and the thermally conductive silica gel only needs to be coated at the positions corresponding to the via holes 311 to reduce waste of the thermally conductive silica gel. In addition, the shielding cover 32 can also be set to be made of metal material, and the shielding cover 32 is energized through the circuit board 2 to achieve electromagnetic shielding effect and shield external electromagnetic wave interference.

如图2所示,在一实施例中,电路板2的表面间隔设有多个电子元件21,安装架31开设有多个过孔311,每一电子元件21部分穿设于一过孔311设置。As shown in FIG. 2 , in one embodiment, the surface of the circuit board 2 is provided with a plurality of electronic components 21 at intervals, the mounting frame 31 is provided with a plurality of through holes 311 , and each electronic component 21 is partially penetrated through a through hole 311 set up.

本实施例中,多个电子元件21可以分别是信号处理芯片、控制芯片、电源管理芯片等实现相应功能的元件,设置每一电子元件21对应一过孔311进行穿设,可减小各电子元件21之间的热量干扰。例如控制芯片发热较严重时散发的热量会比信号处理芯片多,设置控制芯片和信号处理芯片分别穿过不同的过孔311,可减少控制芯片产生的热量朝向信号处理芯片处散发,避免信号处理芯片不必要的热量增加。In this embodiment, the plurality of electronic components 21 may be components that implement corresponding functions, such as a signal processing chip, a control chip, a power management chip, etc., and arranging each electronic component 21 to pass through a via hole 311 can reduce the number of electronic components. Thermal interference between elements 21 . For example, when the control chip is seriously heated, it will dissipate more heat than the signal processing chip. Setting the control chip and the signal processing chip to pass through different vias 311 can reduce the heat generated by the control chip and dissipate toward the signal processing chip, avoiding signal processing. Unnecessary heat gain of the chip.

在一实施例中,安装架31面向电路板2表面的一侧凸设有多个凸筋,每一凸筋设于相邻的两个过孔311之间,用于隔开相邻的两个电子元件21。In one embodiment, the side of the mounting frame 31 facing the surface of the circuit board 2 is protruded with a plurality of ribs, and each rib is arranged between two adjacent via holes 311 for separating the two adjacent through holes 311 . 21 electronic components.

可以理解的,为了进一步减小各电子元件21之间的热量相互干扰,安装架31上设置有凸筋,以间隔开相邻的两个电子元件21。It can be understood that, in order to further reduce the mutual heat interference between the electronic components 21 , the mounting frame 31 is provided with ribs to separate two adjacent electronic components 21 .

如图3所示,在一实施例中,安装架31的侧壁开设有通孔312,屏蔽盖32设有容纳槽,安装架31至少部分容纳于容纳槽内,容纳槽的侧壁对应通孔312设有凸起321,屏蔽盖32罩盖安装架31时,凸起321穿设于通孔312。As shown in FIG. 3 , in one embodiment, the side wall of the mounting bracket 31 is provided with a through hole 312 , the shielding cover 32 is provided with an accommodating slot, the mounting bracket 31 is at least partially accommodated in the accommodating slot, and the side wall of the accommodating slot corresponds to the through hole 312 . The hole 312 is provided with a protrusion 321 . When the shielding cover 32 covers the mounting frame 31 , the protrusion 321 penetrates through the through hole 312 .

本实施例中,安装架31由安装板和多个侧板围合形成,多个侧板沿安装板的周缘环绕设置,且过孔311开设于安装板,同时,通孔312开设于侧板。屏蔽盖32由底板和多个围板围合形成,多个围板沿底板的周缘环绕设置,由底板与电子元件21贴合,底板与安装架31的安装板贴合,且围板与安装架31的侧板贴合。在围板上对应通孔312设有凸起321,凸起321由围板朝向容纳槽内凸设,以使得屏蔽盖32罩盖安装架31时,凸起321穿设于通孔312,以提高安装架31与屏蔽盖32的连接稳定性。In this embodiment, the mounting frame 31 is formed by enclosing a mounting plate and a plurality of side plates, the plurality of side plates are arranged around the periphery of the mounting plate, and the through holes 311 are opened in the mounting plate, and at the same time, the through holes 312 are opened in the side plates . The shielding cover 32 is formed by enclosing a base plate and a plurality of enclosure plates. The multiple enclosure plates are arranged around the periphery of the base plate. The base plate is attached to the electronic components 21 . The side panels of the frame 31 are fitted together. A protrusion 321 is provided on the enclosure plate corresponding to the through hole 312 , and the protrusion 321 is protruded from the enclosure plate toward the receiving groove, so that when the shielding cover 32 covers the mounting frame 31 , the protrusion 321 penetrates through the through hole 312 to prevent The connection stability between the mounting bracket 31 and the shielding cover 32 is improved.

在一实施例中,通孔312呈圆孔状,且凸起321呈半球型;如此,在装设屏蔽盖32于安装架31时,凸起321可凭借球面滑动穿设进入通孔312内,安装更方便。In one embodiment, the through hole 312 is in the shape of a round hole, and the protrusion 321 is in the shape of a hemisphere; in this way, when the shielding cover 32 is installed on the mounting frame 31 , the protrusion 321 can slide through the through hole 312 by virtue of the spherical surface. , the installation is more convenient.

可选地,安装架31设有多个通孔312,多个通孔312环绕安装架31设置,屏蔽盖32设有多个凸起321,每一凸起321穿设于一通孔312。由多个凸起321分别穿设于多个通孔312,进一步提高安装架31和屏蔽盖32的连接稳定性。Optionally, the mounting frame 31 is provided with a plurality of through holes 312 , and the plurality of through holes 312 are arranged around the mounting frame 31 , the shielding cover 32 is provided with a plurality of protrusions 321 , and each protrusion 321 passes through a through hole 312 . The plurality of protrusions 321 are respectively penetrated through the plurality of through holes 312 to further improve the connection stability of the mounting frame 31 and the shielding cover 32 .

如图2所示,在一实施例中,散热组件3还包括石墨烯散热片33,石墨烯散热片33设于屏蔽盖32与壳体1之间。本实施例中,石墨烯散热片33有助于屏蔽盖32与壳体1之间的热量传导,从而提高散热效率。As shown in FIG. 2 , in one embodiment, the heat dissipation component 3 further includes a graphene heat sink 33 , and the graphene heat sink 33 is disposed between the shielding cover 32 and the casing 1 . In this embodiment, the graphene heat sink 33 helps to conduct heat between the shielding cover 32 and the casing 1, thereby improving the heat dissipation efficiency.

在一实施例中,电路板2的两侧均设有电子元件21,随身WiFi100包括两个散热组件3,两个散热组件3分别设于电路板2的两侧。可以理解的,为了节省装配空间,减小电路板2的体积,在电路板2的两侧均设有电子元件21,如此,设置两个散热组件3分别对两侧的电子元件21进行散热,提高散热效率。In one embodiment, electronic components 21 are provided on both sides of the circuit board 2 , and the portable WiFi 100 includes two heat dissipation components 3 , which are respectively disposed on both sides of the circuit board 2 . It can be understood that, in order to save the assembly space and reduce the volume of the circuit board 2, electronic components 21 are provided on both sides of the circuit board 2. In this way, two heat dissipation assemblies 3 are provided to dissipate heat from the electronic components 21 on both sides, respectively. Improve heat dissipation efficiency.

在一实施例中,电路板2开设有多个限位孔22,多个限位孔22沿电路板2的周缘环绕设置,安装腔的内壁凸设有多个定位柱121,每一定位柱121穿设于一限位孔22。In one embodiment, the circuit board 2 is provided with a plurality of limiting holes 22 , the plurality of limiting holes 22 are arranged around the periphery of the circuit board 2 , and a plurality of positioning posts 121 are protruded from the inner wall of the installation cavity. 121 passes through a limiting hole 22 .

本实施例中,定位柱121可凸设于下壳12,并用于穿过电路板2上的限位孔22,以对电路板2进行限位安装,同时,可在上壳11上对应定位柱121设置定位槽,由定位柱121穿过限位孔22的一端插设于定位槽内,以提高连接稳定性。In this embodiment, the positioning posts 121 can be protruded from the lower shell 12 and used to pass through the limiting holes 22 on the circuit board 2 to limit the installation of the circuit board 2 , and at the same time, can be positioned on the upper shell 11 correspondingly The post 121 is provided with a positioning slot, and one end of the positioning post 121 passing through the limiting hole 22 is inserted into the positioning slot, so as to improve the connection stability.

以上仅为本实用新型的优选实施例,并非因此限制本实用新型的专利范围,凡是在本实用新型的发明构思下,利用本实用新型说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本实用新型的专利保护范围内。The above are only the preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model's patent. Under the inventive concept of the present utility model, the equivalent structure transformation made by using the contents of the present utility model description and accompanying drawings, or direct/ Indirect applications in other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. An on-body WiFi, the on-body WiFi comprising:
the device comprises a shell, a first connecting piece and a second connecting piece, wherein a mounting cavity is arranged in the shell;
the circuit board is arranged in the mounting cavity, and an electronic element is arranged on the surface of the circuit board; and
the heat dissipation assembly is arranged in the installation cavity and is surrounded with the circuit board to form an accommodating cavity, the electronic element is located in the accommodating cavity, two sides of the heat dissipation assembly are respectively attached to the electronic element and the shell, and heat generated by the electronic element is conducted to the shell and dissipated to the outside.
2. The on-body WiFi of claim 1, wherein the heat dissipation assembly comprises:
the mounting rack is arranged on the circuit board, a through hole is formed in the mounting rack, and the electronic element part penetrates through the through hole; and
the shielding cover covers the mounting frame and is connected with the mounting frame, and the electronic element part is attached to the shielding cover through the through hole;
the mounting rack, the shielding cover and the circuit board are enclosed to form the accommodating cavity.
3. The WiFi module as recited in claim 2, wherein a plurality of the electronic components are spaced apart from each other on the surface of the circuit board, the mounting bracket defines a plurality of the vias, and each of the electronic components partially penetrates one of the vias.
4. The wearable WiFi of claim 3, wherein a side of the mounting bracket facing the circuit board surface is provided with a plurality of protruding ribs, each protruding rib is provided between two adjacent vias for separating two adjacent electronic components.
5. The WiFi device as claimed in claim 2, wherein the sidewall of the mounting bracket has a through hole, the shielding cover has a receiving groove, the mounting bracket is at least partially received in the receiving groove, the sidewall of the receiving groove has a protrusion corresponding to the through hole, and the protrusion is inserted into the through hole when the shielding cover covers the mounting bracket.
6. The personal WiFi of claim 5, wherein the through hole is circular and the protrusion is hemispherical;
and/or, the mounting bracket is equipped with a plurality ofly the through-hole, it is a plurality of the through-hole encircles the mounting bracket sets up, the shielding lid is equipped with a plurality ofly the arch, each the arch is worn to locate one the through-hole.
7. The on-body WiFi of claim 2, characterized in that a heat conductive silica gel is coated between the electronic component and the shielding lid;
and/or the shielding cover is made of metal.
8. The on-body WiFi of claim 2, wherein the heat dissipation component further comprises a graphene heat sink disposed between the shielding lid and the housing.
9. The WiFi-on-body of any of claims 1 to 8, wherein the electronic components are disposed on both sides of the circuit board, and the WiFi-on-body comprises two heat dissipation assemblies, and the two heat dissipation assemblies are disposed on both sides of the circuit board respectively.
10. The personal WiFi of any one of claims 1-8, wherein the circuit board is provided with a plurality of limiting holes, the limiting holes are circumferentially arranged along the periphery of the circuit board, a plurality of positioning posts are convexly arranged on the inner wall of the mounting cavity, and each positioning post penetrates through one limiting hole.
CN202220088372.4U 2022-01-13 2022-01-13 Portable WiFi Active CN216795164U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220088372.4U CN216795164U (en) 2022-01-13 2022-01-13 Portable WiFi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220088372.4U CN216795164U (en) 2022-01-13 2022-01-13 Portable WiFi

Publications (1)

Publication Number Publication Date
CN216795164U true CN216795164U (en) 2022-06-21

Family

ID=82012930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220088372.4U Active CN216795164U (en) 2022-01-13 2022-01-13 Portable WiFi

Country Status (1)

Country Link
CN (1) CN216795164U (en)

Similar Documents

Publication Publication Date Title
JP6574024B1 (en) Electronics
CN110459512B (en) Cooling motherboard and optical module
CN104866047A (en) A kind of CPU cooling structure and terminal
US11099616B2 (en) Heat dissipating housing and pluggable electronic device having the same
CN109219307B (en) Heat radiation structure and electronic device with same
CN213880402U (en) Heat radiation assembly of small laminated PCB
CN118450670A (en) Heat dissipating device and electronic equipment
TWI495423B (en) Thermal module and electronic device incorporating the same
CN108770296B (en) Shell assembly and electronic device
CN106413335B (en) Heat dissipation buffering shielding composite structure of mobile electronic device
CN216795164U (en) Portable WiFi
CN108633213B (en) Electronic device
CN215647962U (en) Mobile phone heat dissipation mainboard based on copper material
CN212696447U (en) Shielding heat dissipation structure, single board and terminal
CN106507651B (en) Electronic equipment
CN211297517U (en) Heat radiation structure
CN212846547U (en) Notebook computer
CN116247013A (en) Chip packaging module and electronic equipment
US20170042018A1 (en) Dual Layer Shielding Cover and Terminal
CN222434377U (en) Heat-dissipation copper foil adhesive tape for heat dissipation of mobile phone
CN220733348U (en) Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment
CN221930542U (en) Electronic equipment
CN218042197U (en) Terminal equipment's heat radiation structure and terminal equipment
EP1785807B1 (en) Cooling of a small electronic device with a USB connector
CN214014844U (en) Liquid cooling heat dissipation protective shell

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Portable WiFi

Granted publication date: 20220621

Pledgee: Industrial Bank Co.,Ltd. Shanghai Hongqiao Business District Sub branch

Pledgor: Shanghai Jiangyan Intelligent Technology Co.,Ltd.

Registration number: Y2025310000051

PE01 Entry into force of the registration of the contract for pledge of patent right