CN118693204B - A precise LED light panel packaging device based on machine vision - Google Patents

Abstract

The invention discloses a precise packaging device for LED lamp boards based on machine vision, belonging to the technical field of LED packaging devices, comprising: a PCB board supply system, which automatically transports and circulates PCB boards through a horizontal conveyor belt arranged inside; a solder paste printer is arranged on one side of the PCB board supply system, which is used to accurately apply the configured solder paste on the pad of the PCB board; an LED solid crystal system is arranged outside the PCB board supply system, and the LED solid crystal system fixes the LED chip on the printed solder paste of the PCB board; a reflow oven is arranged on one side of the LED solid crystal system, and an optical packaging system is arranged outside the reflow oven, and the optical packaging system performs glue filling and packaging on LED lamp beads; the invention can learn the solder paste printing state according to the collected image, so as to adopt the best pressing method for the packaging of LED lamp beads with different specifications, thereby improving the later adhesion effect.

Description

A precise LED light panel packaging device based on machine vision

Technical Field

The invention belongs to the technical field of LED packaging equipment, and in particular is a precise packaging equipment for LED lamp panels based on machine vision.

Background Art

LED light board packaging equipment is a key equipment used in the packaging process of LED light board manufacturing. Its main purpose is to fix LED chips, brackets and other components on the light board or PCB board, and connect them through solder to form a complete LED light board. At present, LED light board packaging generally goes through printing, mounting, reflow soldering, thermal curing and optical inspection processes. Among them, the mounting accuracy has a greater impact on the production quality of LED light boards. Traditional technologies mostly use high-precision servo control systems and precision guides to ensure that the mounting head can move quickly and accurately to the predetermined position, and accurately mount the LED chip or other components on the substrate. The equipment has high production efficiency and relatively neat quality specifications. However, for special LED light boards (different LED chips or lamp beads are mounted on the PCB board), it is difficult to ensure that LED chips of various specifications are better pressed on the solder paste using traditional equipment. The adhesion between the solder paste and the LED chip is not strong, resulting in poor stability of the LED chip in the subsequent reflow soldering.

Therefore, it is necessary to provide a precise LED light panel packaging device based on machine vision to solve the problems raised in the above background technology.

Summary of the invention

To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a machine vision-based LED lamp board precision packaging equipment, comprising: a PCB board supply system, which automatically transports and circulates PCB boards through a horizontal conveyor belt arranged inside, a solder paste printer is arranged on one side of the PCB board supply system, which is used to accurately apply the configured solder paste on the pad of the PCB board, an LED crystal bonding system is arranged outside the PCB board supply system, the LED crystal bonding system fixes the LED chip on the printed solder paste of the PCB board, a reflow soldering furnace is arranged on one side of the LED crystal bonding system, the reflow soldering furnace preheats the PCB board after crystal bonding, raises the temperature to the melting point of the solder and cools it, so that the solder paste melts and fixes the LED on the PCB board by welding, an optical packaging system is arranged outside the reflow soldering furnace, and the optical packaging system performs glue filling and packaging on the LED lamp beads;

The LED crystal bonding system comprises a crystal bonding platform, a transmission slot is provided in the middle of the upper end surface of the crystal bonding platform, a feeding conveyor chain is installed in the transmission slot, and each PCB board is horizontally transported one by one through the carrier in the feeding conveyor chain; a feeder is provided on one side of the feeding conveyor chain on the crystal bonding platform, a plurality of material troughs are distributed in the feeder, and LED lamp beads are arranged and transported in each of the material troughs; a three-axis driver is installed on the crystal bonding platform above the transmission slot, and a crystal bonding mechanism is vertically provided on the three-axis driver, and the crystal bonding mechanism sorts the LED lamp beads in the feeder and mounts them on the solder paste of the PCB board;

The three-axis driver is provided with a visual scanning module, which collects images of the PCB board through a high-definition camera to obtain each bonding point and the solder paste printing status; the bonding mechanism adopts a sorting action to locate the center of the LED lamp bead and contact it with the surface of the solder paste according to the loading height of the PCB board and the solder paste distribution image on the PCB board, and then the bonding mechanism adopts the best pressing action to press the LED lamp bead and the solder paste tightly based on the solder paste printing status and the shape specifications of the LED lamp bead.

Further, as a preference, the crystal fixing mechanism includes a machine base, inside which a plurality of sorting lever arms are arranged, each of the sorting lever arms is vertically connected to the machine base, a connecting plate is horizontally fixed to the lower end surface of the machine base, one end of the sorting lever arm is inserted into the connecting plate; a negative pressure cylinder is installed at the lower end of the sorting lever arm, a suction nozzle is provided at the suction end of the negative pressure cylinder, and a plurality of solid pressure power units are provided in the crystal fixing mechanism, and the solid pressure power units correspond one-to-one to the sorting lever arms.

Further, as a preference, the solid pressure power unit comprises a fixed cylinder, a piston is sealingly and slidably arranged in the fixed cylinder, a shaft is fixed below the piston, the shaft is slidably connected to the fixed cylinder, and the lower end of the shaft is connected to the sorting rod arm; a hydraulic pipe is connected below one side of the fixed cylinder;

A sealing plug is slidably connected above the piston in the fixed cylinder, an inner rod is connected to the center of the sealing plug, a hollow structure is arranged in the shaft rod, the inner rod is slidably connected in the shaft rod, a sleeve is slidably connected in the connecting plate, the sorting rod arm is fixed to the sleeve, and is slidably connected to the connecting plate through the sleeve, the upper end of the negative pressure cylinder is slidably connected to the sleeve through a spring support rod, and one end of the inner rod is fixed to the spring support rod; the upper end of the fixed cylinder is connected to a pneumatic tube;

The LED lamp beads under the suction nozzle are pressed downward with the solder paste, and the spring support rod on the negative pressure cylinder is gradually contracted.

Further, as a preferred embodiment, during the sorting action of the crystal bonding mechanism, the solid pressure power unit gradually pumps hydraulic oil into the fixed cylinder through the hydraulic pipe, so that the shaft rod below the piston slides downward; at the same time, the air pressure pipe transports the oil into the fixed cylinder, and the inner rod on the sealing plug slides downward synchronously with the shaft rod, so that the negative pressure cylinder below the inner rod gradually approaches the PCB board, and the LED lamp bead below the suction nozzle contacts the solder paste;

During the pressing action of the crystal bonding mechanism, the air pressure pipe of the solid pressure power unit conveys and adjusts the air pressure in the fixed cylinder, so that the LED lamp bead is pressed and fixed on the solder paste along with the inner rod.

Further, as a preference, a mounting plate is fixed below the machine base, a sliding sleeve is slidably connected in the mounting plate, the center of the sorting lever arm is connected in the sliding sleeve, and an adjusting sleeve is coaxially arranged on the sliding sleeve;

The side wall of the adjusting sleeve is provided with a plurality of guide grooves, and a pin is fixed on the side wall of the inner rod, and the pin slides along the inner wall of the guide groove.

Further, preferably, a sealing cavity is formed between the sealing plug and the piston, and the sealing cavity is filled with protective gas.

Further, as a preference, the adjustment sleeve is rotatably connected to the sliding sleeve, a micro motor is fixed on the sliding sleeve, an output end of the micro motor is connected to the adjustment sleeve for transmission through gear meshing, and the adjustment sleeve is rotatably mounted on the sorting lever arm;

The sealing plug is rotatably connected to a rotating disk, and the inner rod is slidably connected to the sealing plug via the rotating disk. The cross section of one of the guide grooves is an oblique structure, and the inner rod generates synchronous rotation during downward sliding adjustment through the sliding action of the pin shaft and the guide groove.

Further, preferably, the cross-sections of the remaining guide grooves are arc-shaped or corrugated.

Compared with the prior art, the present invention has the following beneficial effects:

The LED die bonding system used in the precise packaging of the LED lamp board of the present invention can not only obtain the die bonding point (i.e., the solder paste printing position) by scanning with a visual scanning module, thereby facilitating the precise mounting of the LED lamp beads, but can also obtain the solder paste printing status according to the collected image, so as to adopt the best pressing method for the packaging of LED lamp beads of different specifications, thereby improving the later adhesion effect, flexibly adapting to diversified production needs, and reducing the defective product rate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the overall process structure of the present invention;

FIG2 is a schematic diagram of the structure of the LED die bonding system of the present invention;

FIG3 is a schematic diagram of the structure of a crystal bonding mechanism in the present invention;

FIG4 is an internal cross-sectional view of the structure at position A in FIG3 ;

FIG5 is a schematic diagram of the structure of the mounting plate and the sorting lever arm in the present invention;

FIG6 is a schematic diagram of the structure of the adjustment sleeve in the present invention;

FIG7 is a schematic diagram of a guide groove with an oblique structure in the present invention;

FIG8 is a schematic diagram of a guide groove of a corrugated structure in the present invention;

FIG9 is a schematic diagram of an arc-shaped guide groove in the present invention;

In the figure: 1. LED crystal bonding system; 11. Crystal bonding table; 12. Feeding conveyor chain; 13. Feeder; 14. Three-axis drive; 2. Crystal bonding mechanism; 21. Machine base; 22. Sorting rod arm; 23. Connecting plate; 24. Negative pressure cylinder; 25. Suction nozzle; 26. Sleeve; 27. Spring support rod; 31. Fixed cylinder; 32. Piston; 33. Shaft rod; 34. Hydraulic pipe; 35. Sealing plug; 36. Inner rod; 37. Air pressure pipe; 4. Mounting plate; 41. Sliding sleeve; 42. Adjusting sleeve; 43. Guide groove; 44. Micro motor.

DETAILED DESCRIPTION

Please refer to Figures 1 to 9. In the embodiment of the present invention, a precise packaging device for LED lamp boards based on machine vision includes: a PCB board supply system, which automatically transports and circulates PCB boards through a horizontal conveyor belt arranged inside, a solder paste printer is arranged on one side of the PCB board supply system, which is used to accurately apply the configured solder paste on the pads of the PCB board, an LED crystal bonding system 1 is arranged outside the PCB board supply system, and the LED crystal bonding system 1 fixes the LED chip on the printed solder paste of the PCB board, a reflow soldering furnace is arranged on one side of the LED crystal bonding system 1, and the reflow soldering furnace preheats the PCB board after crystal bonding, raises the temperature to the melting point of the solder and cools it, so that the solder paste melts and fixes the LED on the PCB board by welding, and an optical packaging system is arranged outside the reflow soldering furnace, and the optical packaging system performs glue filling and packaging on the LED lamp beads;

The LED crystal bonding system 1 comprises a crystal bonding platform 11, a transmission slot is provided in the middle of the upper end surface thereof, a feeding conveyor chain 12 is installed in the transmission slot, and each PCB board is horizontally transported one by one through the carrier plate in the feeding conveyor chain 12; a feeder 13 is provided on the crystal bonding platform 11 at one side of the feeding conveyor chain 12, and a plurality of material troughs are distributed in the feeder 13, and LED lamp beads are arranged and transported in each of the material troughs; a three-axis driver 14 is installed on the crystal bonding platform 11 above the transmission slot, and a crystal bonding mechanism 2 is vertically provided on the three-axis driver 14, and the crystal bonding mechanism 2 sorts the LED lamp beads in the feeder 13 and mounts them on the solder paste of the PCB board;

The three-axis driver 14 is provided with a visual scanning module, which collects images of the PCB board through a high-definition camera to obtain each bonding point and the solder paste printing status; the bonding mechanism 2 uses a sorting action to locate the center of the LED lamp bead and contact it with the solder paste surface according to the PCB board loading height and the solder paste distribution image on the PCB board, and then the bonding mechanism 2 uses the best pressing action based on the solder paste printing status and the shape specifications of the LED lamp bead to press the LED lamp bead and the solder paste tightly, which has the following significant advantages:

First, the image acquisition and processing technology of the high-definition camera can accurately identify the die bonding points and solder paste status on the PCB board, ensuring that the LED lamp beads are accurately positioned at the target position, improving the accuracy and consistency of mounting;

Second, the die bonding mechanism can adjust its action according to the actual height of the PCB board and the distribution of solder paste. Therefore, even if the board surface is uneven or there is a slight difference in solder paste printing during the production process, the system can automatically optimize the die bonding process to maintain high-quality assembly results.

Third, combined with the solder paste printing status and the specific specifications of the LED lamp beads, the crystal bonding mechanism performs the best pressing action, which not only ensures the firm bonding of the LED lamp beads and the solder paste, but also avoids solder paste overflow or lamp bead damage caused by excessive pressure, thereby improving the welding quality and yield rate.

In the present embodiment, the solid crystal mechanism 2 comprises a machine base 21, inside which a plurality of sorting lever arms 22 are arranged, each of the sorting lever arms 22 is vertically connected to the machine base 21, a connecting plate 23 is horizontally fixed to the lower end surface of the machine base 21, one end of the sorting lever arm 22 is connected to the connecting plate 23; a negative pressure cylinder 24 is installed at the lower end of the sorting lever arm 22, a suction nozzle 25 is provided at the suction end of the negative pressure cylinder 24, and a plurality of solid pressure power units are provided in the solid crystal mechanism 2, and the solid pressure power units correspond one to one with the sorting lever arms 22, that is, the solid pressure power units can control the sorting lever arms 22 to slide up and down, so that the LED lamp beads adsorbed by the negative pressure on the negative pressure cylinder are pressed and mounted one by one.

As a preferred embodiment, the solid pressure power unit includes a fixed cylinder 31, a piston 32 is sealed and slidably arranged in the fixed cylinder, a shaft 33 is fixed below the piston 32, the shaft 33 is slidably connected to the fixed cylinder 31, and the lower end of the shaft 33 is connected to the sorting lever arm 22; a hydraulic pipe 34 is connected below one side of the fixed cylinder 31; wherein, when the hydraulic pipe delivers hydraulic oil into the fixed cylinder, the sorting lever arm 22 slides upward along with the shaft 33;

A sealing plug 35 is slidably connected above the piston 32 in the fixed cylinder 31, and an inner rod 36 is connected to the center of the sealing plug 35. A hollow structure is arranged in the shaft rod 33, and the inner rod 36 is slidably connected in the shaft rod 33. A sleeve 26 is slidably connected in the connecting plate 23. The sorting lever arm 22 is fixed to the sleeve 26 and slidably connected to the connecting plate 23 through the sleeve 26. The upper end of the negative pressure cylinder 24 is slidably connected to the sleeve 26 through the spring support rod 27, and one end of the inner rod 36 is fixed to the spring support rod 27; the upper end of the fixed cylinder 31 is connected to the air pressure pipe 37;

As the LED lamp bead under the suction nozzle 25 is pressed downward with the solder paste, the spring support rod 27 on the negative pressure cylinder 24 gradually contracts, that is, the spring support rod is configured as a two-section retractable structure, and a spring is disposed on the outer sleeve of the rod. Therefore, when the LED lamp bead is pressed downward, the spring support rod is elastically retracted by the spring.

In this embodiment, during the sorting action of the crystal bonding mechanism 2, the solid pressure power unit gradually pumps hydraulic oil into the fixed cylinder 31 through the hydraulic pipe 34, so that the shaft rod 33 below the piston 32 slides downward; at the same time, the air pressure pipe 37 transports the fixed cylinder 31, and the inner rod 36 on the sealing plug 35 slides downward synchronously with the shaft rod 33, so that the negative pressure cylinder 24 below the inner rod 36 gradually approaches the PCB board, and the LED lamp bead below the suction nozzle 25 contacts the solder paste;

When the solid-pressing power unit is in the solid-crystal fixing mechanism 2 solidifying action, the air pressure tube 37 conveys and adjusts the air pressure in the fixed cylinder 31, so that the LED lamp beads are pressed onto the solder paste along with the inner rod 36. Therefore, for the solidification of LED lamp beads of different specifications, the air pressure tube 37 can be used to control the inner rod 36 to slide to different heights, so as to adjust the solidification force of the LED lamp beads.

In this embodiment, a mounting plate 4 is fixed below the base 21, a sliding sleeve 41 is slidably connected inside the mounting plate 4, the center of the sorting lever arm 22 is connected inside the sliding sleeve 41, and an adjusting sleeve 42 is coaxially arranged on the sliding sleeve 41;

The side wall of the adjustment sleeve 42 is provided with a plurality of guide grooves 43 , and a pin is fixed on the side wall of the inner rod 36 . The pin slides along the inner wall of the guide groove 43 , so that the inner rod 36 can deflect during the sliding between the pin and the guide groove 43 .

In this embodiment, a sealed cavity is formed between the sealing plug 35 and the piston 32, and the sealed cavity is filled with protective gas. Especially during the pressing of the LED lamp beads, the protective gas in the sealed cavity can be gradually compressed during the sliding of the sealing plug 35, so that the sliding accuracy of the inner rod 36 becomes higher and higher, forming a protective effect during the pressing of the LED lamp beads, and preventing excessive displacement of the inner rod from causing the pressing force to exceed the threshold.

As a preferred embodiment, the adjusting sleeve 42 is rotatably connected to the sliding sleeve 41, a micro motor 44 is fixed on the sliding sleeve 41, the output end of the micro motor 44 is connected to the adjusting sleeve 42 for transmission through gear meshing, and the adjusting sleeve 42 is rotatably mounted on the sorting lever arm 22; thus, different guide grooves 43 on the adjusting sleeve 42 can be controlled by rotation to move to the pin shaft, so that the pin shaft slides along the designated guide groove 43;

The sealing plug 35 is rotatably connected to a rotating disk, and the inner rod 36 is slidably connected to the sealing plug 35 via the rotating disk. The cross section of one of the guide grooves 43 is an oblique structure, and the inner rod 36 generates synchronous rotation through the sliding action of the pin shaft and the guide groove 43 during downward sliding adjustment.

In this embodiment, the cross-section of the remaining guide grooves 43 is an arc-shaped structure or a corrugated structure;

When the pin shaft slides with the guide groove 43 of the oblique structure, the inner rod 36 slides downward so that the LED lamp bead is gradually pressed and fixed on the solder paste. At the same time, the inner rod 36 deflects at a corresponding angle along the guide groove 43 of the oblique structure through the pin shaft, so that the solder paste under the LED lamp bead is completely diffused, and the LED lamp bead is mounted in the original position in an oblique direction.

When the pin shaft slides with the guide groove 43 of the arc structure, the inner rod 36 slides downward so that the LED lamp bead is gradually pressed and fixed on the solder paste. At the same time, the inner rod 36 deflects and resets at a corresponding angle along the guide groove 43 of the arc structure through the pin shaft, so that the solder paste under the LED lamp bead is completely diffused, and the LED lamp bead is mounted in the original position in the positive direction.

When the pin shaft slides with the guide groove 43 of the corrugated structure, the inner rod 36 slides downward so that the LED lamp bead is gradually pressed onto the solder paste. At the same time, the inner rod 36 generates a small-amplitude and high-frequency deflection reset along the guide groove 43 of the corrugated structure through the pin shaft, so that the solder paste under the LED lamp bead is evenly diffused in a small range, and the LED lamp bead is mounted in the original position in the positive direction.

What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims (5)

1. LED lamp plate precision packaging equipment based on machine vision, its characterized in that: it comprises the following steps: the PCB board supply system is used for automatically carrying and circulating the PCB board through a horizontal conveying belt arranged inside, one side of the PCB board supply system is provided with a solder paste printer for accurately coating the prepared solder paste on a bonding pad of the PCB board, an LED crystal fixing system (1) is arranged outside the PCB board supply system, an LED chip is fixed on the printed solder paste of the PCB board by the LED crystal fixing system (1), one side of the LED crystal fixing system (1) is provided with a reflow oven, the reflow oven preheats and heats the PCB board after crystal fixing to a soldering tin melting point and cools the soldering tin melting point so that the soldering tin melting point is used for fixing the LED welding on the PCB board, and an optical packaging system is arranged outside the reflow oven and used for encapsulating LED lamp beads;

The LED die bonding system (1) comprises a die bonding table (11), wherein a transmission slot is arranged in the middle of the upper end surface of the die bonding table, a feeding conveying chain (12) is arranged in the transmission slot, and each PCB is horizontally conveyed one by one through a carrier plate in the feeding conveying chain (12); a feeder (13) is arranged on one side of the die bonding table (11) positioned on the feeding conveying chain (12), a plurality of material grooves are distributed in the feeder (13), and LED lamp beads are distributed and conveyed in each material groove; a triaxial driver (14) is arranged above the transmission slot position on the die bonding table (11), a die bonding mechanism (2) is vertically arranged on the triaxial driver (14), and the die bonding mechanism (2) sorts and pastes LED lamp beads in the feeder (13) on solder paste of a PCB;

The three-axis driver (14) is provided with a visual scanning module, and the visual scanning module acquires images of the PCB through a high-definition camera so as to acquire each die bonding point and a solder paste printing state; the LED lamp beads are positioned at the center and contacted with the surface layer of the solder paste by the die bonding mechanism (2) according to the loading height of the PCB and the solder paste distribution image on the PCB, and then the LED lamp beads and the solder paste are pressed by the die bonding mechanism (2) by adopting the optimal pressing and bonding action based on the solder paste printing state and the shape specification of the LED lamp beads;

The die bonding mechanism (2) comprises a base (21), a plurality of sorting lever arms (22) are arranged in the base (21), each sorting lever arm (22) is vertically connected in the base (21), a connecting plate (23) is horizontally fixed on the lower end face of the base (21), and one end of each sorting lever arm (22) is connected in the connecting plate (23) in a penetrating mode; the lower end of the sorting lever arm (22) is provided with a negative pressure cylinder (24), the air suction end of the negative pressure cylinder (24) is provided with a suction nozzle (25), a plurality of solid compression power units are arranged in the solid crystal mechanism (2), and the solid compression power units are in one-to-one correspondence with the sorting lever arm (22);

The fixed pressure power unit comprises a fixed cylinder (31), a piston (32) is arranged in the fixed cylinder (31) in a sealing sliding manner, a shaft lever (33) is fixed below the piston (32), the shaft lever (33) is connected to the fixed cylinder (31) in a sliding and penetrating manner, and the lower end of the shaft lever (33) is connected with the sorting lever arm (22); a hydraulic pipe (34) is connected below one side of the fixed cylinder (31);

a sealing plug (35) is further connected to the upper portion of the piston (32) in the fixed cylinder (31) in a sliding manner, an inner rod (36) is connected to the upper center of the sealing plug (35), a hollow structure is arranged in the shaft rod (33), the inner rod (36) is connected to the shaft rod (33) in a sliding manner, a sleeve (26) is connected to the connecting plate (23) in a sliding manner, the sorting lever arm (22) is fixed to the sleeve (26) and is connected to the connecting plate (23) in a sliding manner through the sleeve (26), the upper end of the negative pressure cylinder (24) is connected to the sleeve (26) in a sliding manner through a spring strut (27), and one end of the inner rod (36) is fixed to the spring strut (27); the upper end of the fixed cylinder (31) is connected with a pneumatic tube (37);

In the process that the LED lamp beads below the suction nozzle (25) are downwards pressed and fixed with solder paste, a spring support rod (27) on the negative pressure cylinder (24) is gradually contracted;

A mounting disc (4) is fixed below the base (21), a sliding sleeve (41) is connected in a sliding manner in the mounting disc (4), the center of the sorting lever arm (22) is connected in the sliding sleeve (41), and an adjusting sleeve (42) is coaxially arranged on the sliding sleeve (41);

The side wall of the adjusting sleeve (42) is provided with a plurality of guide grooves (43), a pin shaft is fixed on the side wall of the inner rod (36), and the pin shaft slides along the inner wall of the guide grooves (43).

2. The machine vision-based precise LED lamp panel packaging device according to claim 1, wherein: in the sorting action of the die bonding mechanism (2), the die bonding power unit pumps hydraulic oil into the fixed cylinder (31) step by step through the hydraulic pipe (34) so that the shaft lever (33) below the piston (32) slides downwards; simultaneously, the air pressure pipe (37) conveys the inside of the fixed cylinder (31), and the inner rod (36) on the sealing plug (35) and the shaft rod (33) synchronously slide downwards, so that the negative pressure air cylinder (24) below the inner rod (36) gradually approaches the PCB, and the LED lamp beads below the suction nozzle (25) are in contact with solder paste;

In the die bonding action of the die bonding mechanism (2), the air pressure pipe (37) conveys and adjusts the air pressure in the fixed cylinder (31) so that the LED lamp beads are pressed and fixed on the solder paste along with the inner rod (36).

3. The machine vision-based precise LED lamp panel packaging device according to claim 1, wherein: a sealing cavity is formed between the sealing plug (35) and the piston (32), and the sealing cavity is filled with protective gas.

4. The machine vision-based precise LED lamp panel packaging device according to claim 1, wherein: the adjusting sleeve (42) is rotationally connected with the sliding sleeve (41), a micro motor (44) is fixed on the sliding sleeve (41), the output end of the micro motor (44) is in transmission connection with the adjusting sleeve (42) through a gear meshing effect, and the adjusting sleeve (42) is rotationally arranged on the sorting lever arm (22);

the rotary disc is rotationally connected to the sealing plug (35), the inner rod (36) is in sliding connection with the sealing plug (35) through the rotary disc, the cross section of one guide groove (43) is of a diagonal structure, and the inner rod (36) synchronously rotates under the sliding action of the pin shaft and the guide groove (43) in downward sliding adjustment.

5. The machine vision-based precise LED lamp panel packaging device according to claim 4, wherein: the cross section of the rest of the guide grooves (43) is of an arc-shaped structure or a corrugated structure.