CN118534171B - Probe repair method - Google Patents
Probe repair method Download PDFInfo
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- CN118534171B CN118534171B CN202410995142.XA CN202410995142A CN118534171B CN 118534171 B CN118534171 B CN 118534171B CN 202410995142 A CN202410995142 A CN 202410995142A CN 118534171 B CN118534171 B CN 118534171B
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- Prior art keywords
- probe
- damaged
- needle
- epoxy resin
- replacement
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- 239000000523 sample Substances 0.000 title claims abstract description 243
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 79
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 79
- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000000227 grinding Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 29
- 238000012360 testing method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
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- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C73/00—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
- B29C73/02—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using liquid or paste-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C73/00—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
- B29C73/24—Apparatus or accessories not otherwise provided for
- B29C73/26—Apparatus or accessories not otherwise provided for for mechanical pretreatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C73/00—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
- B29C73/24—Apparatus or accessories not otherwise provided for
- B29C73/26—Apparatus or accessories not otherwise provided for for mechanical pretreatment
- B29C2073/264—Apparatus or accessories not otherwise provided for for mechanical pretreatment for cutting out or grooving the area to be repaired
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
本发明实施例公开了一种探针修复方法。该探针修复方法包括如下步骤：S1、确认受损探针的位置；S2、制作替换探针；S3、确认入刀位置；S4、刀片沿着受损探针的延伸方向切割环氧树脂；S5、将受损探针的受损针体部分切除出与其延伸方向呈设定角度的第一斜面；S6、将替换探针的替换针头放入到受损针体所在的环氧树脂的针槽内；S7、在刀片切割的位置回填液态的环氧树脂。通过本发明实施例，解决了悬臂式探针在环氧树脂内断裂后修复困难的问题，实现了在探针受损后，通过切开环氧树脂以及更换针头的方式完成受损探针的修复工作，从而显著地减少报废探针环的情况，极大的方便了受损探针的更换与维修工作，明显节省大量的时间成本和物料成本。
The embodiment of the present invention discloses a probe repair method. The probe repair method includes the following steps: S1, confirming the position of the damaged probe; S2, making a replacement probe; S3, confirming the cutting position; S4, the blade cutting the epoxy resin along the extension direction of the damaged probe; S5, cutting out the damaged needle body part of the damaged probe to form a first inclined surface at a set angle to its extension direction; S6, placing the replacement needle head of the replacement probe into the needle groove of the epoxy resin where the damaged needle body is located; S7, backfilling the liquid epoxy resin at the position where the blade cuts. Through the embodiment of the present invention, the problem of the difficulty in repairing the cantilever probe after it is broken in the epoxy resin is solved, and after the probe is damaged, the damaged probe can be repaired by cutting the epoxy resin and replacing the needle head, thereby significantly reducing the situation of scrapping the probe ring, greatly facilitating the replacement and maintenance of the damaged probe, and obviously saving a lot of time and material costs.
Description
Technical Field
The invention relates to the technical field of semiconductor chip testing, in particular to a probe repairing method.
Background
In the actual testing process of the semiconductor chip, as the probe tip needs to be in contact with the test point of the test chip and maintain a certain contact pressure, after a period of actual testing, the probe tip is broken due to physical fatigue or burnt due to carrying excessive current, so that damaged probes have to be replaced. For the cantilever type probe card, as each probe is wrapped by the epoxy resin with very strong hardness after baking, when the common cantilever type probe card bumps against the broken probe and is positioned at a deeper position of the epoxy resin, the probe ring has to be scrapped to manufacture a new probe ring, and the maintenance cost is very high.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a probe repairing method to reduce the scrapped probe ring, thereby saving time cost and material cost.
The invention provides a probe repairing method, which comprises the following steps:
s1, confirming the position of a damaged probe;
S2, obtaining parameters of the damaged probe, and manufacturing a replacement probe according to the parameters;
S3, confirming the knife-entering position;
s4, cutting the epoxy resin along the extending direction of the damaged probe by the blade until the broken position of the damaged probe is leaked;
S5, removing the damaged needle head of the damaged probe, cutting a first inclined surface which is formed by a set angle with the extending direction of the damaged needle body of the damaged probe, and cutting a matched second inclined surface at a position corresponding to the replaced probe so as to enable the replaced needle head of the replaced probe to be matched with the damaged needle head of the damaged probe;
S6, placing a replacement needle head of the replacement probe into a needle groove of epoxy resin where the damaged needle body is located, aligning and propping a second inclined plane on the replacement needle head with a first inclined plane on the damaged needle body, and smearing conductive adhesive at the joint of the second inclined plane and the first inclined plane;
s7, backfilling liquid epoxy resin at the cutting position of the blade, and baking the backfilled epoxy resin until hardening;
s8, finishing repair work.
According to the probe repairing method provided by the invention, after the probe is damaged, the repairing work of the damaged probe can be completed by cutting the epoxy resin and replacing the needle head, so that the condition of scrapping a probe ring is remarkably reduced, the replacement and maintenance work of the damaged probe are greatly facilitated, a great amount of time cost and material cost are remarkably saved, meanwhile, the condition that the replaced needle head is connected with a damaged needle body can be ensured to meet the use standard, and the repairing effect of the probe is remarkably improved.
In one embodiment of the above probe repairing method, the step S2 is specifically to obtain parameters of the damaged probe, including bending parameters, through design drawing or measurement and calculation, wherein the number of the manufactured replacement probes is 1 to 3.
In one embodiment of the above probe repairing method, step S3 is specifically to check the distance between the probe on both sides of the damaged probe and the probe after determining the position of the damaged probe;
If the distance between the probes at the two sides of the damaged probe is not equal to the distance between the probes, taking the probe with larger distance from the damaged probe and the damaged probe as a knife-inserting position;
if the distance between the probes at two sides of the damaged probe is equal to the distance between the probes, a knife-entering position is arranged between the probes at any side and the damaged probe.
In one embodiment of the above-mentioned probe repairing method, the step S4 is specifically that, when the blade cuts the epoxy, at least part of the epoxy is reserved for accommodating the needle groove of the damaged needle head for fixing the damaged probe.
In one embodiment of the above-mentioned probe repairing method, the step S4 is specifically that if the breaking position of the damaged probe is close to the end of the epoxy resin facing the tip of the damaged needle, the set position of the blade cutting is set to the middle position of the damaged probe in the epoxy resin, and if the breaking position of the damaged probe is close to the end of the epoxy resin facing the tail of the damaged needle, the set position of the blade cutting is set to the breaking position.
In one embodiment of the probe repair method described above, when the damaged probe is located on any of the cross-layers of the cantilever probe card;
the step S3 is specifically that the knife entering surface is the side surface of the cross-layer of the damaged probe facing the needle point of the damaged needle head;
In step S4, if the breaking position of the damaged probe is close to the end of the cross-layer epoxy resin located at the end of the damaged probe facing the needle point of the damaged needle, the set position of the blade cutting is set to the middle position of the cross-layer epoxy resin located at the damaged probe, and if the breaking position of the damaged probe is close to the end of the cross-layer epoxy resin located at the end of the damaged probe facing the needle tail of the damaged needle body, the set position of the blade cutting is set to the breaking position.
In one embodiment of the above-mentioned probe repairing method, the step S4 is specifically that the blade cuts from the damaged needle head of the damaged probe toward the damaged needle body, and when the blade cuts to the set position, the blade continues to cut toward the tail of the damaged needle body for 1 to 3mm.
In an embodiment of the foregoing probe repairing method, in step S5, the first inclined plane forms an angle of 40 to 50 degrees with the extending direction of the damaged needle body.
In one embodiment of the above-mentioned probe repairing method, step S5 is specifically that after the damaged needle body is excised, the damaged needle with the third bevel formed simultaneously with the first bevel is taken out, and the damaged needle is used as a reference, and a replacement needle with the second bevel is cut out at a position corresponding to the third bevel of the replacement probe.
In one embodiment of the above probe repairing method, in step S6, the conductive adhesive is applied to ensure that the height of the conductive adhesive is lower than the surface height of the epoxy resin.
In one embodiment of the above probe repairing method, the step S7 specifically includes the following steps:
S71, pre-baking the backfilled epoxy resin to enable the backfilled epoxy resin to be in a sticky state, and starting fine adjustment of a replacement needle head on the damaged probe;
s72, after confirming that the position of the replacement needle head on the damaged probe is accurate, starting to bake the backfilled epoxy resin according to the process hardening temperature;
S73, after the epoxy resin is cooled, measuring whether the resistance between the damaged needle body and the replacement needle head on the damaged probe meets the standard or not;
And S74, grinding the height of the replacement needle head on the damaged probe to a position consistent with the height of other needle heads.
The above-described one or more embodiments of the present invention have at least one or more of the following advantages:
The probe repairing method provided by the invention can finish repairing work of the damaged probe by cutting the epoxy resin and replacing the needle after the probe is damaged, thereby remarkably reducing the condition of scrapping a probe ring, greatly facilitating the replacement and maintenance work of the damaged probe, remarkably saving a great amount of time cost and material cost, simultaneously ensuring that the replacement needle is connected with the damaged needle body, and being in accordance with the use standard, and remarkably improving the repairing effect of the probe.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The present disclosure will become more readily understood with reference to the accompanying drawings. It is to be understood by persons of ordinary skill in the art that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention. Moreover, like numerals in the figures are used to designate like parts, wherein:
FIG. 1 is a process flow diagram of a probe repair method according to an embodiment of the application;
FIG. 2 is a schematic view of a damaged needle when not removed in a probe repair according to an embodiment of the application;
Fig. 3 is a schematic structural diagram of a probe after repair according to an embodiment of the present application.
Description of the reference numerals
1. Damaged probe, 11 parts of damaged needle body, 111 parts of first inclined plane, 12 parts of damaged needle head, 121 parts of third inclined plane, 2 parts of epoxy resin, 31 parts of replacement needle head, 311 parts of second inclined plane and 4 parts of conductive adhesive.
Detailed Description
Some embodiments of the invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these examples are merely for explaining the technical principles of the present invention and are not intended to limit the scope of the present invention.
In the actual testing process of the semiconductor chip, as the probe tip needs to be in contact with the test point of the test chip and maintain a certain contact pressure, after a period of actual testing, the probe tip is broken due to physical fatigue or burnt due to carrying excessive current, so that damaged probes have to be replaced. For the cantilever type probe card, as each probe is wrapped by the epoxy resin with very strong hardness after baking, when the common cantilever type probe card bumps against the broken probe and is positioned at a deeper position of the epoxy resin, the probe ring has to be scrapped to manufacture a new probe ring, and the maintenance cost is very high.
Based on the above, the embodiment provides a probe repairing method, which can complete repairing work of a damaged probe by cutting epoxy resin and replacing a needle after the probe is damaged, thereby remarkably reducing the condition of scrapping a probe ring, greatly facilitating the replacement and maintenance work of the damaged probe, remarkably saving a great amount of time cost and material cost, simultaneously ensuring that the replaced needle and a damaged needle body are connected and can meet the use standard, and remarkably improving the repairing effect of the probe.
The present invention will be specifically illustrated by the following examples.
Referring to fig. 1 to 3, the method for repairing a probe according to the present embodiment includes the following steps:
s1, confirming the position of the damaged probe 1, wherein the position of the damaged probe 1 damaged or fused by external force can be confirmed by the on-off condition of a test circuit or by using detection modes such as X-ray;
S2, acquiring parameters of the damaged probe 1, and manufacturing a replacement probe;
S3, confirming the knife-entering position;
S4, cutting the epoxy resin 2 along the extending direction of the damaged probe 1 by a blade until the damaged probe 1 leaks out of the breaking position, and cleaning up scraps, burrs and the like of the epoxy resin 2 surrounding the damaged position of the damaged probe 1 completely, so that the epoxy resin 2 surrounding the damaged probe 1 is prevented from influencing the replacement work of the damaged needle 12;
S5, cutting off a first inclined plane 111 which is formed by forming a set angle with the extending direction of the damaged needle body 11 of the damaged probe 1 partially, cutting off a second inclined plane 311 which is matched with the first inclined plane 111 at a position corresponding to the replacement probe so as to enable the replacement needle head 31 of the replacement probe to be matched with the damaged needle body 11 of the damaged probe 1, and through the arrangement of the first inclined plane 111 and the second inclined plane 311, the contact area between the replacement needle head 31 and the damaged needle body 11 can be remarkably improved, and signal transmission problems caused by poor connection or parasitic impedance caused by the connection position of the replacement needle head 31 and the damaged needle body 11 can be reduced;
S6, placing the replacement needle head 31 of the replacement probe into a needle groove of epoxy resin 2 where the damaged needle body 11 is located, forming a guiding and positioning effect on the replacement needle head 31 by utilizing the original needle groove, aligning and propping a second inclined surface 311 on the replacement needle head 31 with a first inclined surface 111 on the damaged needle body 11, and smearing conductive adhesive 4 at the joint of the two, wherein the conductive adhesive 4 can be particularly conductive silver adhesive, in order to ensure conductivity, conductive silver adhesive with higher silver content can be selected, and the conductive adhesive 4 can also comprise other conductive fillers such as gold, copper, aluminum, zinc, iron and nickel powder, graphite and some conductive compounds, so long as good conductivity can be ensured after the replacement needle head 31 is connected with the damaged needle body 11;
s7, backfilling liquid epoxy resin 2 at the cutting position of the blade, and baking the backfilled epoxy resin 2 until hardening;
s8, finishing repair work.
The probe repairing method provided by the embodiment can finish repairing work of the damaged probe 1 by cutting the epoxy resin 2 and replacing the needle after the probe is damaged, thereby remarkably reducing the condition of scrapping a probe ring, greatly facilitating the replacement and maintenance work of the damaged probe 1, remarkably saving a great amount of time cost and material cost, simultaneously ensuring that the replacement needle 31 and the damaged needle 11 are connected and can meet the use standard, and remarkably improving the repairing effect of the probe.
In some embodiments, step S2 is specifically to obtain parameters of the damaged probe 1, including bending parameters, through design drawing or measurement and calculation, where the number of the manufactured replacement probes is 1 to 3, preferably, the number of the manufactured replacement probes is 2 to 3, so as to avoid damage to the replacement probes in the maintenance process, and the replacement probes need to be prepared again, thereby affecting the maintenance efficiency.
In some embodiments, step S3 is specifically to check the distance between the two probes on two sides of the damaged probe 1 and the space between the two probes, specifically, the distance between two adjacent probes and the space between two adjacent probes along the extending direction of the damaged probe 1 after determining the position of the damaged probe 1, if the distance between the two probes on two sides of the damaged probe 1 and the space between the two probes are not equal, the distance between the two probes with larger distance between the two probes and the damaged probe 1 is taken as a knife-in position, so that damage to other surrounding probes caused by the blade can be avoided, meanwhile, knife-in convenience can be ensured, sufficient blade operation space can be ensured, reasonable shapes can be cut more easily, if the distance between the two probes on two sides of the damaged probe 1 and the space between the two probes are equal, then the distance between the two probes on any side and the damaged probe 1 is taken as a knife-in position, and it is required to be explained that when the blade moves along the extending direction of the damaged probe 1, the blade swings to two sides with small amplitude when the two sides are cut, so that burrs or wavy cuts can be formed, the subsequent epoxy resin 2 can form larger contact area with the existing epoxy resin 2, and meanwhile, the influence on the surrounding probe can also be avoided.
In some embodiments, step S4 is specifically that when the blade cuts the epoxy resin 2, at least part of the epoxy resin 2 remains for accommodating the needle groove for fixing the damaged needle 12 of the damaged probe 1, that is, the hole for accommodating the probe is formed in the epoxy resin 2, when the epoxy resin 2 around the damaged probe 1 is cut, only one continuous half or a plurality of epoxy resins 2 wrapped on the outer wall of the damaged probe 1 need to be cut, so that the damaged needle 12 inside can be ensured to be taken out, and part of the needle groove for accommodating the damaged needle 12 can be reserved, and the replacement needle 31 can be conveniently positioned and fixed when the replacement needle 31 is installed.
In a further embodiment, in step S4, if the breaking position of the damaged probe 1 is close to the end of the epoxy resin 2 facing the tip of the damaged needle 12, the set position of the blade cut is set to the middle position of the damaged probe 1 in the epoxy resin 2, and if the breaking position of the damaged probe 1 is close to the end of the epoxy resin 2 facing the tail of the damaged needle 11, the set position of the blade cut is set to the breaking position, so that the stress of the newly implanted replacement needle 31 can be ensured not to affect the breaking point, and a certain length of the replacement needle 31 is ensured to be buried in the epoxy resin 2, that is, after a certain length of the replacement needle 31 is ensured to be buried in the epoxy resin 2, the replacement needle 31 can be supported by the epoxy resin 2, and as the replacement needle 31 is used as a stress point, most of stress can be counteracted by the support of the epoxy resin 2 when the replacement needle is deformed, so that less stress is transferred to the connection position of the replacement needle 31 and the damaged needle 11, and the service life of the repaired probe is ensured.
Further, when the damaged probe 1 is located on any cross layer of the cantilever type probe card, that is, when the cantilever type probe card at least comprises one cross layer and the damaged probe 1 is located on one of the cross layers, step S3 is specifically that the cross layer where the damaged probe 1 is located faces the side face of the tip of the damaged probe 12, as shown in fig. 3, the cut-in surface may be the outer surface of the cross layer facing the grinding plane, it should be understood that when the epoxy resin 2 of the cross layer is cut through by the cut-in surface, the probability that the blade causes damage to other surrounding probes when the epoxy resin 2 wrapping the damaged probe 1 is cut through, or that when the cut-in surface is the distance between the damaged probe 1 and the outer surface of the epoxy resin 2 is short, a suitable repair port for replacing the damaged probe 12 is conveniently cut as soon as possible, step S4 is specifically that if the cut-in position of the damaged probe 1 is close to one end of the damaged probe 12 where the epoxy resin 2 of the cross layer is located, the set-in position of the cut-in position is set to the outer surface of the cut-in the cross layer, the cut-in position of the cut-in the cross layer is set to the position of the epoxy resin 2 of the cut-in the cross layer, and when the cut-in the cross layer is set position of the epoxy resin 2 is close to the cross layer, and the cross layer is set at the end position of the cut probe 1 is close to the cross layer 2, and the cross layer is set to the cross layer 1 is sufficiently close to the cross layer, and the cut position is set to the cross layer is close to the position of the cut position of the epoxy probe 2, and the cut position is sufficient length is further cut on the cross layer is located at the end position of the cut surface was shown layer, and has a cross layer, and is sufficient length is set on the cross layer, and has a cross layer was shown position was shown cut side was shown was next position and has a cross layer.
Further, in step S4, the blade cuts from the damaged needle 12 of the damaged probe 1 toward the damaged needle 11, and when the blade cuts to the set position, the blade continues to cut 1 to 3mm toward the tail of the damaged needle 11, and in particular, when the blade cuts to the set position, the blade continues to cut 2mm toward the tail of the damaged needle 11, so that the end of the damaged needle 11 can be lifted up by the cutting, and the end of the damaged needle 11 can be clamped by forceps or other devices, so that the epoxy resin 2 wrapped around the end of the damaged needle 11 is carefully cleaned, and the problem that the replacement needle 31 cannot be smoothly put in is avoided.
With continued reference to fig. 2, in step S5, the first inclined plane 111 may form an angle of 40 to 50 degrees with the extending direction of the damaged needle 11, and in particular, the first inclined plane 111 may form an angle of 45 degrees with the extending direction of the damaged needle 11, so that the contact area between the damaged needle 11 and the replacement needle 31 is increased, and the strength of the joint between the damaged needle 11 and the replacement needle 31 is ensured, so that the joint cannot be easily deformed during contact connection.
Further, in step S5, the damaged needle body 11 is cut, the damaged needle head 12 with the third bevel 121 formed simultaneously with the first bevel 111 is taken out, the damaged needle head 12 is taken as a reference, the replacement needle head 31 with the second bevel 311 is cut at the position of the replacement probe corresponding to the third bevel 121, so that the preparation of the replacement needle head 31 of the replacement probe can be completed as soon as possible, the preparation is simple and quick, and the accuracy is high.
With continued reference to fig. 3, step S6 is specifically to ensure that the height of the conductive adhesive 4 is lower than the surface height of the epoxy resin 2 when the conductive adhesive 4 is applied, specifically, when the conductive adhesive 4 is applied, the conductive adhesive 4 can be dispensed on the first inclined plane 111 and/or the second inclined plane 311, a conductive adhesive layer 4 with uniform thickness is formed between the first inclined plane 111 and the second inclined plane 311 by utilizing the approach extrusion of the first inclined plane 111 and the second inclined plane 311, or the conductive adhesive 4 can be dispensed in a gap between the first inclined plane 111 and the second inclined plane 311 after aligning and propping against the first inclined plane 111 and the second inclined plane 311, as long as the conductive adhesive 4 is ensured to complete conduction and fixation of the replacement needle head 31 and the damaged needle body 11, and the adhesive surface height is lower than the surface height of the epoxy resin 2, and after the epoxy resin 2 is backfilled, the maintenance part can be covered perfectly, and insulation between the maintenance part and the outside can be ensured by utilizing the epoxy resin 2.
In some embodiments, step S7 specifically includes the steps of:
S71, pre-baking the backfilled epoxy resin 2, namely pre-baking the epoxy resin 2 for 5 minutes at 90 ℃ by using a baking tray to enable the backfilled epoxy resin 2 to be in a sticky state, namely a state with lower fluidity and incomplete solidification, wherein the method only needs to form a certain fixing effect on the replacement needle 31, can not influence the fine adjustment work of the replacement needle 31, and starts fine adjustment of the replacement needle 31 on the damaged probe 1;
S72, after confirming that the position of the replacement needle 31 on the damaged probe 1 is accurate, baking the backfilled epoxy resin 2 according to the process hardening temperature, so that the newly-added epoxy resin 2 achieves the same physical hardness and density as the existing epoxy resin 2;
S73, after the epoxy resin 2 is cooled, measuring whether the resistance between the damaged needle body 11 and the replacement needle head 31 on the damaged probe 1 meets the standard or not, specifically, measuring the resistance from the newly embedded needle head of the replacement needle head 31 to the needle tail of the damaged needle body 11 by using a measuring instrument such as a universal meter, and if the contact between the replacement needle head 31 and the damaged needle body 11 is good and the conductive adhesive 4 is wrapped sufficiently, the whole resistance should be less than 1 ohm, and after the whole resistance is confirmed, cutting or polishing the part of the epoxy resin 2 which is fed in by using a blade or sand paper under a high-power microscope;
And S74, grinding the height of the replacement needle head 31 on the damaged probe 1 to a position consistent with the height of other needle heads, specifically, grinding the needle tip of the replaced new replacement needle head 31 after the replacement needle head 31 is erected on a needle grinder, ensuring that the diameter of the needle tip of the newly-planted replacement needle head 31 and the diameter of the existing needle tip are ground to the same needle tip diameter, and ensuring that the level height difference of all the needle tips, namely planarity, meets the factory inspection standard, namely, ensuring that all the needle tips are in a small height difference range in the Z direction shown in FIG. 3, and ensuring that all the needle tips approach to the same grinding plane. Alternatively, when the replacement probe is prepared and the replacement needle 31 is not cut off, the replacement needle may be pre-ground, the diameter of the tip of the replacement needle 31 may be ground to a predetermined value, and the replacement needle may be finely ground after being installed in place. Then grinding according to glass or synthetic resin used for normal card making, aligning the needle tip of the new implanted needle by manual work under a high power microscope, ensuring that the needle tip is positioned at a corresponding physical position on a grinding sheet, and at the moment, all needle replacement and subsequent adjustment work are finished, so that the needle card can be used normally as the new needle card.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (11)
1. A method of probe repair comprising the steps of:
s1, confirming the position of a damaged probe (1);
S2, acquiring parameters of the damaged probe (1), and manufacturing a replacement probe according to the parameters;
S3, confirming the knife-entering position;
S4, cutting the epoxy resin (2) along the extending direction of the damaged probe (1) by a blade until the damaged probe (1) leaks out of a fracture position;
S5, removing the damaged needle head (12) of the damaged probe (1), cutting a first inclined surface (111) which is formed by a set angle in the extending direction of the damaged needle body (11) of the damaged probe (1), and cutting a matched second inclined surface (311) at a position corresponding to the replaced probe so as to enable the replaced needle head (31) of the replaced probe to be matched with the damaged needle body (11) of the damaged probe (1);
S6, placing a replacement needle head (31) of the replacement probe into a needle groove of epoxy resin (2) where the damaged needle body (11) is located, aligning and propping a second inclined surface (311) on the replacement needle head (31) with a first inclined surface (111) on the damaged needle body (11), and smearing conductive adhesive (4) at the joint of the two inclined surfaces;
S7, backfilling liquid epoxy resin (2) at the cutting position of the blade, and baking the backfilled epoxy resin (2) until hardening;
s8, finishing repair work.
2. The method for repairing the probe according to claim 1, wherein the step S2 is specifically that parameters of the damaged probe (1), including bending parameters, are obtained through a design drawing or measurement calculation, and the number of the manufactured replacement probes is 1 to 3.
3. The method according to claim 1, wherein the step S3 is specifically to check the distance between the probe on both sides of the damaged probe (1) and the probe after determining the position of the damaged probe (1);
if the distance between the probes at the two sides of the damaged probe (1) is not equal to the distance between the probes, taking the probe with larger distance with the damaged probe (1) and the damaged probe (1) as a knife-entering position;
if the distance between the probes at two sides of the damaged probe (1) is equal, a knife-inserting position is adopted between the probes at any side and the damaged probe (1).
4. The method of repairing a probe according to claim 1, wherein the step S4 is specifically to reserve at least part of the epoxy (2) for receiving a needle groove for fixing the damaged needle (12) of the damaged probe (1) when the blade cuts the epoxy (2).
5. The method of repairing a probe according to claim 1, wherein the step S4 is specifically to set the set position of the blade cutting to an intermediate position of the damaged probe (1) in the epoxy resin (2) if the broken position of the damaged probe (1) is close to the end of the epoxy resin (2) toward the tip of the damaged needle (12), and to set the set position of the blade cutting to the broken position if the broken position of the damaged probe (1) is close to the end of the epoxy resin (2) toward the tip of the damaged needle (11).
6. The probe repair method of claim 5, characterized in that when a damaged probe (1) is located on any of the cross-layers of the cantilever probe card;
The step S3 is specifically that the knife entering surface is arranged on the side surface of the cross-layer of the damaged probe (1) facing the needle point of the damaged needle head (12);
The step S4 specifically includes setting the set position of the blade cutting to the middle position of the damaged probe (1) located at the cross-layer epoxy resin (2) if the broken position of the damaged probe (1) is close to the end of the cross-layer epoxy resin (2) located at the end of the damaged probe towards the tip of the damaged needle (12), and setting the set position of the blade cutting to the broken position if the broken position of the damaged probe (1) is close to the end of the cross-layer epoxy resin (2) located at the end of the damaged probe towards the tip of the damaged needle (11).
7. The method according to claim 5, wherein the step S4 is specifically that the blade cuts from the damaged needle (12) of the damaged probe (1) toward the damaged needle body (11), and when the blade cuts to the set position, the blade continues to cut toward the tail of the damaged needle body (11) for 1 to 3mm.
8. The method according to claim 1, wherein the step S5 is specifically that the first inclined surface (111) forms an angle of 40 to 50 degrees with the extending direction of the damaged needle body (11).
9. The method of repairing a probe according to claim 1, wherein the step S5 is specifically to remove the damaged needle (12) having the third bevel (121) formed simultaneously with the first bevel (111) after cutting the damaged needle (11), and to cut the replacement needle (31) having the second bevel (311) at a position corresponding to the third bevel (121) of the replacement probe using the damaged needle (12) as a reference.
10. The method for repairing a probe according to claim 1, wherein in the step S6, the conductive paste (4) is applied to ensure that the height of the conductive paste (4) is lower than the surface height of the epoxy resin (2).
11. The method of probe repair according to any one of claims 1 to 10, wherein the step S7 specifically comprises the steps of:
s71, pre-baking the backfilled epoxy resin (2) to enable the backfilled epoxy resin (2) to be in a sticky state, and starting fine adjustment of the replacement needle head (31) on the damaged probe (1);
S72, after confirming that the position of the replacement needle head (31) on the damaged probe (1) is accurate, starting to bake the backfilled epoxy resin (2) according to the process hardening temperature;
s73, after the epoxy resin (2) is cooled, measuring whether the resistance between the damaged needle body (11) and the replacement needle head (31) on the damaged probe (1) meets the standard or not;
And S74, grinding the height of the replacement needle head (31) on the damaged probe (1) to a position consistent with the height of other needle heads.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103018505A (en) * | 2012-12-04 | 2013-04-03 | 无锡圆方半导体测试有限公司 | Probe correcting device |
| CN114089160A (en) * | 2021-11-19 | 2022-02-25 | 法特迪精密科技（苏州）有限公司 | Method for assembling, repairing and testing parameter setting of vertical probe card device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7437813B2 (en) * | 2006-02-08 | 2008-10-21 | Sv Probe Pte Ltd. | Probe repair methods |
| CN201522509U (en) * | 2009-09-17 | 2010-07-07 | 美博科技(苏州)有限公司 | High-frequency short arm probe card |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103018505A (en) * | 2012-12-04 | 2013-04-03 | 无锡圆方半导体测试有限公司 | Probe correcting device |
| CN114089160A (en) * | 2021-11-19 | 2022-02-25 | 法特迪精密科技（苏州）有限公司 | Method for assembling, repairing and testing parameter setting of vertical probe card device |
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