CN118527804B - A numerically controlled semiconductor laser processing machine tool - Google Patents
A numerically controlled semiconductor laser processing machine tool Download PDFInfo
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- CN118527804B CN118527804B CN202410924082.2A CN202410924082A CN118527804B CN 118527804 B CN118527804 B CN 118527804B CN 202410924082 A CN202410924082 A CN 202410924082A CN 118527804 B CN118527804 B CN 118527804B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
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- 230000003044 adaptive effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 36
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 238000004887 air purification Methods 0.000 description 3
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 2
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
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- 238000013016 damping Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2101/40—Semiconductor devices
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Abstract
本发明适用于半导体激光加工技术领域，提供了一种数控半导体激光加工机床，包括底座、立架和外壳，外壳内安装有多轴机械手，多轴机械手的输出端安装有安装轴，安装轴上安装有激光器，还包括：承托筒，承托筒的内侧安装固定有网格架，网格架上安装有用于对晶片进行承托以及居中定位的承托居中组件；可调按压组件，承托居中组件还与可调按压组件的横导筒连接，当直线伸缩缸驱动固定环下降时，承托居中组件先对晶片进行居中定位，而后压轮在弧形弹性伸缩杆的弹性支撑下对晶片的外圈进行弹性按压固定。本发明通过承托居中组件和可调按压组件的设计，实现了晶片的高效、精准定位与适应性稳定固定，显著降低了操作难度，提升了加工效率。
The present invention is applicable to the field of semiconductor laser processing technology, and provides a numerically controlled semiconductor laser processing machine tool, including a base, a stand and a shell, a multi-axis manipulator is installed in the shell, a mounting shaft is installed at the output end of the multi-axis manipulator, a laser is installed on the mounting shaft, and also includes: a supporting cylinder, a grid frame is fixedly installed on the inner side of the supporting cylinder, and a supporting centering component for supporting and centering a wafer is installed on the grid frame; an adjustable pressing component, the supporting centering component is also connected to the cross guide cylinder of the adjustable pressing component, when the linear telescopic cylinder drives the fixed ring to descend, the supporting centering component first centers the wafer, and then the pressure wheel elastically presses and fixes the outer ring of the wafer under the elastic support of the arc-shaped elastic telescopic rod. The present invention realizes efficient, accurate positioning and adaptive stable fixation of the wafer through the design of the supporting centering component and the adjustable pressing component, significantly reduces the difficulty of operation, and improves the processing efficiency.
Description
技术领域Technical Field
本发明属于半导体激光加工技术领域，尤其涉及一种数控半导体激光加工机床。The invention belongs to the technical field of semiconductor laser processing, and in particular relates to a numerically controlled semiconductor laser processing machine tool.
背景技术Background Art
半导体晶片是制造电子产品所需要的基础部件，是一种将电路元件集成在一起的芯片。核心材料是半导体材料，具有介于导体和绝缘体之间的导电性，能够在施加电场或添加掺杂材料时改变其导电性。半导体晶片的制造是一个复杂而精密的过程，包括生长硅晶圆、抛光、光刻、蚀刻、离子注入、热处理、化学气相沉积、化学机械抛光、电镀、背面工艺、测试和切割封装等步骤。Semiconductor wafers are the basic components needed to manufacture electronic products. They are chips that integrate circuit components together. The core material is a semiconductor material, which has conductivity between conductors and insulators and can change its conductivity when an electric field is applied or doping materials are added. The manufacture of semiconductor wafers is a complex and precise process, including growing silicon wafers, polishing, photolithography, etching, ion implantation, heat treatment, chemical vapor deposition, chemical mechanical polishing, electroplating, back-side processing, testing, and cutting packaging.
目前，激光加工机床在加工半导体晶片等薄片类零件时，无法对晶片高效、精准定位与适应性稳定固定，操作难度大，加工效率低。因此，针对以上现状，迫切需要开发一种数控半导体激光加工机床，以克服当前实际应用中的不足。At present, when laser processing machines are processing thin parts such as semiconductor wafers, they are unable to efficiently and accurately position and adaptably fix the wafers, making the operation difficult and the processing efficiency low. Therefore, in view of the above situation, it is urgent to develop a CNC semiconductor laser processing machine tool to overcome the shortcomings in current practical applications.
发明内容Summary of the invention
本发明的目的在于提供一种数控半导体激光加工机床，旨在解决上述背景技术中提到的问题。The object of the present invention is to provide a numerically controlled semiconductor laser processing machine tool, aiming to solve the problems mentioned in the above background technology.
本发明是这样实现的，一种数控半导体激光加工机床，包括底座，所述底座上固定有立架，立架上固定有外壳，外壳内安装有多轴机械手，多轴机械手的输出端安装有安装轴，多轴机械手用于驱动所述安装轴移动；所述安装轴上安装固定有激光器，还包括：The present invention is implemented as follows: a numerically controlled semiconductor laser processing machine tool comprises a base, a stand is fixed on the base, a shell is fixed on the stand, a multi-axis manipulator is installed in the shell, a mounting shaft is installed at the output end of the multi-axis manipulator, and the multi-axis manipulator is used to drive the mounting shaft to move; a laser is fixed on the mounting shaft, and further comprises:
承托筒，安装固定于底座上，所述承托筒的内侧安装固定有网格架，网格架上安装有用于对晶片进行承托以及居中定位的承托居中组件；A supporting cylinder is fixedly mounted on the base, a grid frame is fixedly mounted on the inner side of the supporting cylinder, and a supporting centering component for supporting and centering the wafer is mounted on the grid frame;
可调按压组件，安装固定于底座上，所述可调按压组件包括固定环，所述固定环的下侧固定有直线伸缩缸，直线伸缩缸的下端固定于底座上，固定环的上侧转动连接有转环，所述固定环的内侧周向分布固定有多根横导筒，横导筒上滑动设有内板，内板远离横导筒的一端铰接有压板，压板还通过弧形弹性伸缩杆与内板连接，压板远离内板的一端转动安装有用于对晶片外圈进行按压固定的压轮，所述内板上还固定有连接轴，连接轴上转动连接有调节杆，调节杆的另一端与转环内壁铰接，所述固定环的外侧还固定有弧形伸缩缸，弧形伸缩缸的输出端与转环固定连接，弧形伸缩缸用于驱动转环转动，从而通过所述调节杆调节内板的位置；The cam is fixedly mounted on the base, wherein the adjustable pressing assembly comprises a fixing ring, a linear telescopic cylinder is fixed on the lower side of the fixing ring, the lower end of the linear telescopic cylinder is fixed on the base, and a swivel is rotatably connected to the upper side of the fixing ring, wherein a plurality of transverse guide cylinders are circumferentially distributed and fixed to the inner side of the fixing ring, an inner plate is slidably provided on the transverse guide cylinder, an end of the inner plate away from the transverse guide cylinder is hingedly connected to a pressure plate, the pressure plate is also connected to the inner plate through an arc-shaped elastic telescopic rod, and a pressure wheel for pressing and fixing the outer ring of the wafer is rotatably mounted on the end of the pressure plate away from the inner plate, a connecting shaft is also fixed on the inner plate, an adjusting rod is rotatably connected to the connecting shaft, and the other end of the adjusting rod is hinged to the inner wall of the swivel, an arc-shaped telescopic cylinder is also fixed to the outer side of the fixing ring, an output end of the arc-shaped telescopic cylinder is fixedly connected to the swivel, and the arc-shaped telescopic cylinder is used to drive the swivel to rotate, thereby adjusting the position of the inner plate through the adjusting rod;
所述承托居中组件还与可调按压组件的横导筒连接，当所述直线伸缩缸驱动固定环下降时，承托居中组件先对晶片进行居中定位，而后压轮在弧形弹性伸缩杆的弹性支撑下对晶片的外圈进行弹性按压固定。The supporting centering component is also connected to the transverse guide cylinder of the adjustable pressing component. When the linear telescopic cylinder drives the fixed ring to descend, the supporting centering component first centers the wafer, and then the pressure wheel elastically presses and fixes the outer ring of the wafer under the elastic support of the arc-shaped elastic telescopic rod.
进一步的技术方案，所述承托筒采用上开口的圆柱形筒体结构；所述转环和固定环均采用圆环结构，且所述转环和固定环的内径大于承托筒的外径。According to a further technical solution, the supporting tube adopts a cylindrical body structure with an upper opening; the rotating ring and the fixed ring both adopt a circular ring structure, and the inner diameters of the rotating ring and the fixed ring are larger than the outer diameter of the supporting tube.
进一步的技术方案，所述弧形弹性伸缩杆采用圆弧形结构，且弧形弹性伸缩杆的圆心位于内板和压板之间连接轴的轴线上，所述弧形弹性伸缩杆的一端固定于内板的下侧，弧形弹性伸缩杆的另一端固定于压板的下侧。A further technical solution is that the arc-shaped elastic telescopic rod adopts an arc-shaped structure, and the center of the arc-shaped elastic telescopic rod is located on the axis of the connecting shaft between the inner plate and the pressure plate, one end of the arc-shaped elastic telescopic rod is fixed to the lower side of the inner plate, and the other end of the arc-shaped elastic telescopic rod is fixed to the lower side of the pressure plate.
进一步的技术方案，所述压轮与压板阻尼转动连接；多根所述调节杆顺次设置，且所述调节杆与横导筒呈一定角度设置。According to a further technical solution, the pressure wheel is connected to the pressure plate in a damping rotation manner; a plurality of the adjustment rods are arranged in sequence, and the adjustment rods are arranged at a certain angle to the cross guide tube.
进一步的技术方案，所述弧形伸缩缸采用圆弧形结构，且所述弧形伸缩缸的圆心位于转环的轴线上，所述弧形伸缩缸的缸体通过缸固定座与固定环连接固定，弧形伸缩缸的输出端通过固定块与转环连接固定。A further technical solution is that the arc-shaped telescopic cylinder adopts an arc-shaped structure, and the center of the arc-shaped telescopic cylinder is located on the axis of the swivel, the cylinder body of the arc-shaped telescopic cylinder is connected and fixed to the fixing ring through a cylinder fixing seat, and the output end of the arc-shaped telescopic cylinder is connected and fixed to the swivel through a fixing block.
进一步的技术方案，所述承托居中组件包括于网格架的上侧周向分布设置的多个L形状的居中托板，居中托板的水平部上安装有滚珠，所述居中托板的下侧固定有下伸杆，下伸杆从网格架上开设的活动口穿过，多根所述下伸杆相远离的一侧固定有直线弹性伸缩杆，直线弹性伸缩杆的缸体上滑动设有导座，导座还与网格架的下侧固定连接，所述直线弹性伸缩杆远离下伸杆的一端固定有楔形块二，楔形块二和导座之间的直线弹性伸缩杆上套设有弹簧；所述横导筒的下侧还固定有可调伸缩杆，可调伸缩杆的下端固定有与楔形块二相配合的楔形块一，当所述可调伸缩杆向下移动时，楔形块一推动楔形块二向靠近导座的方向移动，进而直线弹性伸缩杆推动居中托板和下伸杆构成的整体移动，实现对于晶片的居中定位。A further technical solution is provided, wherein the supporting centering component comprises a plurality of L-shaped centering support plates circumferentially distributed on the upper side of the grid frame, and a ball bearing is installed on the horizontal part of the centering support plate, and a lower extension rod is fixed to the lower side of the centering support plate, and the lower extension rod passes through a movable opening opened in the grid frame, and a linear elastic telescopic rod is fixed on the side away from the plurality of lower extension rods, and a guide seat is slidably provided on the cylinder body of the linear elastic telescopic rod, and the guide seat is also fixedly connected to the lower side of the grid frame, and a wedge block 2 is fixed on the end of the linear elastic telescopic rod away from the lower extension rod, and a spring is sleeved on the linear elastic telescopic rod between the wedge block 2 and the guide seat; an adjustable telescopic rod is also fixed to the lower side of the horizontal guide cylinder, and a wedge block 1 cooperating with the wedge block 2 is fixed at the lower end of the adjustable telescopic rod, and when the adjustable telescopic rod moves downward, the wedge block 1 pushes the wedge block 2 to move in the direction close to the guide seat, and then the linear elastic telescopic rod pushes the overall movement of the centering support plate and the lower extension rod to realize the centering positioning of the chip.
进一步的技术方案，所述可调伸缩杆竖直设置，可调伸缩杆上设有用于对其调节后锁定的锁紧螺栓；所述网格架上还开设有用于可调伸缩杆滑动穿过的杆孔。According to a further technical solution, the adjustable telescopic rod is vertically arranged, and a locking bolt for locking the adjustable telescopic rod after adjustment is provided on the adjustable telescopic rod; and a rod hole for the adjustable telescopic rod to slide through is also provided on the grid frame.
进一步的技术方案，所述下伸杆固定于居中托板的水平部下侧，下伸杆还与活动口滑动连接；所述活动口平行于居中托板的水平部设置。According to a further technical solution, the downward extending rod is fixed to the lower side of the horizontal portion of the center support plate, and the downward extending rod is also slidably connected to the movable opening; the movable opening is arranged parallel to the horizontal portion of the center support plate.
进一步的技术方案，所述楔形块一和楔形块二均采用直角三角形块，楔形块一的斜边为上端向靠近楔形块二的一侧倾斜，楔形块二的斜边为上端向远离楔形块一的一侧倾斜，且所述楔形块一和楔形块二的斜边对应的面滑动连接；所述楔形块一的一个直角边与可调伸缩杆下端固定连接，楔形块一的另一直角边与承托筒内壁滑动连接，所述楔形块二的一个直角边与直线弹性伸缩杆端部固定连接。A further technical solution is that both wedge block one and wedge block two are right-angled triangle blocks, the hypotenuse of wedge block one is that the upper end is inclined toward the side close to wedge block two, and the hypotenuse of wedge block two is that the upper end is inclined toward the side away from wedge block one, and the surfaces corresponding to the hypotenuses of wedge block one and wedge block two are slidingly connected; one right-angled side of wedge block one is fixedly connected to the lower end of the adjustable telescopic rod, the other right-angled side of wedge block one is slidingly connected to the inner wall of the supporting tube, and one right-angled side of wedge block two is fixedly connected to the end of the linear elastic telescopic rod.
进一步的技术方案，该数控半导体激光加工机床，还包括空气净化组件，所述空气净化组件包括吸气头、外罩筒、气管、软管和吸气净化装置，所述吸气净化装置固定于承托筒的内底部，吸气净化装置的出口与承托筒侧壁上开设的出气口连通，出气口上还安装有防尘网，所述出气口具有两个进口，两个进口上均安装有调节阀，其中一个进口上连接有气管，气管从承托筒侧壁伸出并与立架固定连接，气管远离吸气净化装置的一端还通过软管与安装轴上固定的外罩筒连接，所述外罩筒采用空心结构，外罩筒的底部周向分布安装有多个吸气头，多个所述吸气头通过外罩筒内腔与软管连通，所述吸气净化装置用于通过其进口抽吸空气并过滤后经出气口排出。A further technical solution is provided. The CNC semiconductor laser processing machine tool also includes an air purification component, which includes an air suction head, an outer cover tube, an air pipe, a hose and an air suction purification device. The air suction purification device is fixed to the inner bottom of the supporting tube, and the outlet of the air suction purification device is connected to the air outlet opened on the side wall of the supporting tube. A dustproof net is also installed on the air outlet. The air outlet has two inlets, and regulating valves are installed on both inlets. One of the inlets is connected to an air pipe, which extends from the side wall of the supporting tube and is fixedly connected to the stand. The end of the air pipe away from the air suction purification device is also connected to the outer cover tube fixed on the mounting shaft through a hose. The outer cover tube adopts a hollow structure, and a plurality of air suction heads are installed circumferentially on the bottom of the outer cover tube. The plurality of air suction heads are connected to the hose through the inner cavity of the outer cover tube. The air suction purification device is used to draw air through its inlet and discharge it through the air outlet after filtering.
本发明提供的一种数控半导体激光加工机床，具有以下有益效果：The present invention provides a numerically controlled semiconductor laser processing machine tool, which has the following beneficial effects:
通过设计的承托居中组件和可调按压组件，能够高效且准确地固定和处理晶片。具体过程如下：The designed support centering component and adjustable pressing component can efficiently and accurately fix and handle the wafer. The specific process is as follows:
将晶片轻置在承托居中组件上，随后直线伸缩缸驱动固定环平稳下降，这时承托居中组件首先会自动将晶片居中定位。紧接着，压轮在弧形弹性伸缩杆的弹性支撑下，对晶片的外圈进行弹性按压固定，确保晶片在加工过程中保持稳定。The wafer is gently placed on the supporting centering assembly, and then the linear telescopic cylinder drives the fixed ring to descend smoothly. At this time, the supporting centering assembly will automatically center the wafer. Then, the pressure wheel, under the elastic support of the arc-shaped elastic telescopic rod, elastically presses and fixes the outer ring of the wafer to ensure that the wafer remains stable during processing.
这种定位与固定方式极大地简化了操作过程，降低了操作难度，同时显著提升了加工效率。尤其值得一提的是，通过弧形伸缩缸驱动的转环，可以灵活地调节调节杆，进而改变内板和压轮的初始位置，不仅可与承托居中组件配合应用，更能适应不同尺寸的晶片固定需求，展现出较高的灵活性和便捷性。This positioning and fixing method greatly simplifies the operation process, reduces the difficulty of operation, and significantly improves the processing efficiency. It is particularly worth mentioning that the swivel driven by the arc-shaped telescopic cylinder can flexibly adjust the adjustment rod to change the initial position of the inner plate and the pressure wheel. It can not only be used in conjunction with the supporting centering component, but also can adapt to the fixing needs of wafers of different sizes, showing high flexibility and convenience.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明实施例提供的数控半导体激光加工机床的结构示意图；FIG1 is a schematic structural diagram of a numerically controlled semiconductor laser processing machine tool provided by an embodiment of the present invention;
图2为图1中A部分的放大结构示意图；FIG2 is an enlarged structural schematic diagram of part A in FIG1 ;
图3为图1的另一视角结构示意图；FIG3 is a schematic diagram of the structure of FIG1 from another viewing angle;
图4为本发明实施例提供的数控半导体激光加工机床中底座部分的主视剖视结构示意图；FIG4 is a schematic diagram of a front cross-sectional structure of a base portion of a numerically controlled semiconductor laser processing machine tool provided by an embodiment of the present invention;
图5为图4中B部分的放大结构示意图；FIG5 is an enlarged schematic diagram of the structure of part B in FIG4 ;
图6为图5中居中托板解除对晶片限位的结构示意图；FIG6 is a schematic diagram of the structure of the center support plate in FIG5 releasing the wafer limit;
图7为本发明实施例提供的数控半导体激光加工机床中网格架部分的俯视结构示意图；7 is a schematic diagram of a top view of a grid frame portion in a numerically controlled semiconductor laser processing machine tool provided by an embodiment of the present invention;
图8为图3中外罩筒部分的放大结构示意图。FIG8 is an enlarged structural schematic diagram of the outer cover tube portion in FIG3 .
图中：1-激光器，2-吸气头，3-外罩筒，4-外壳，5-立架，6-气管，7-软管，8-转环，9-固定环，10-底座，11-直线伸缩缸，12-承托筒，13-弧形伸缩缸，14-横导筒，15-调节杆，16-连接轴，17-内板，18-压板，19-弧形弹性伸缩杆，20-压轮，21-可调伸缩杆，22-锁紧螺栓，23-安装轴，24-固定块，25-缸固定座，26-居中托板，27-滚珠，28-晶片，29-网格架，30-出气口，31-中心支杆，32-吸气净化装置，33-楔形块一，34-楔形块二，35-弹簧，36-导座，37-直线弹性伸缩杆，38-下伸杆，39-活动口，40-杆孔；A-可调按压组件的局部放大图；B-承托居中组件的局部放大图。In the figure: 1-laser, 2-suction head, 3-outer cover tube, 4-hosing shell, 5-stand, 6-trachea, 7-hose, 8-swivel, 9-fixing ring, 10-base, 11-linear telescopic cylinder, 12-supporting cylinder, 13-arc telescopic cylinder, 14-cross guide cylinder, 15-adjusting rod, 16-connecting shaft, 17-inner plate, 18-pressing plate, 19-arc elastic telescopic rod, 20-pressing wheel, 21-adjustable telescopic rod, 22-locking bolt, 23-mounting shaft , 24-fixed block, 25-cylinder fixing seat, 26-centering support plate, 27-ball, 28-chip, 29-grid frame, 30-air outlet, 31-center support rod, 32-air suction purification device, 33-wedge block one, 34-wedge block two, 35-spring, 36-guide seat, 37-linear elastic telescopic rod, 38-downward extension rod, 39-movable port, 40-rod hole; A-partial enlarged view of the adjustable pressing component; B-partial enlarged view of the supporting centering component.
具体实施方式DETAILED DESCRIPTION
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
以下结合具体实施例对本发明的具体实现进行详细描述。The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.
如图1-图4所示，为本发明一个实施例提供的一种数控半导体激光加工机床，包括底座10，所述底座10上固定有立架5，立架5上固定有外壳4，外壳4内安装有多轴机械手，多轴机械手的输出端安装有安装轴23，多轴机械手用于驱动所述安装轴23移动，多轴机械手优选采用3～6轴机械手；所述安装轴23上安装固定有激光器1，对于激光器1的应用参考现有公开技术即可，不作限定和赘述。还包括：As shown in Figures 1 to 4, a CNC semiconductor laser processing machine tool provided by an embodiment of the present invention includes a base 10, a stand 5 is fixed on the base 10, a shell 4 is fixed on the stand 5, a multi-axis manipulator is installed in the shell 4, and a mounting shaft 23 is installed at the output end of the multi-axis manipulator. The multi-axis manipulator is used to drive the mounting shaft 23 to move. The multi-axis manipulator preferably uses a 3-6-axis manipulator; a laser 1 is fixed on the mounting shaft 23. For the application of the laser 1, refer to the existing public technology without limitation or elaboration. It also includes:
承托筒12，安装固定于底座10上，所述承托筒12的内侧安装固定有网格架29，网格架29上安装有用于对晶片28进行承托以及居中定位的承托居中组件；The support cylinder 12 is fixedly mounted on the base 10, and a grid frame 29 is fixedly mounted on the inner side of the support cylinder 12, and a support centering component for supporting and centering the wafer 28 is mounted on the grid frame 29;
可调按压组件，安装固定于底座10上，所述可调按压组件包括固定环9，所述固定环9的下侧固定有直线伸缩缸11，直线伸缩缸11的下端固定于底座10上，固定环9的上侧转动连接有转环8，所述固定环9的内侧周向分布固定有多根横导筒14，横导筒14上滑动设有内板17，内板17远离横导筒14的一端铰接有压板18，压板18还通过弧形弹性伸缩杆19与内板17连接，压板18远离内板17的一端转动安装有用于对晶片28外圈进行按压固定的压轮20，所述内板17上还固定有连接轴16，连接轴16上转动连接有调节杆15，调节杆15的另一端与转环8内壁铰接，所述固定环9的外侧还固定有弧形伸缩缸13，弧形伸缩缸13的输出端与转环8固定连接，弧形伸缩缸13用于驱动转环8转动，从而通过所述调节杆15调节内板17的位置；The adjustable pressing assembly is installed and fixed on the base 10. The adjustable pressing assembly includes a fixing ring 9. A linear telescopic cylinder 11 is fixed to the lower side of the fixing ring 9. The lower end of the linear telescopic cylinder 11 is fixed to the base 10. A swivel 8 is rotatably connected to the upper side of the fixing ring 9. A plurality of transverse guide cylinders 14 are circumferentially fixed to the inner side of the fixing ring 9. An inner plate 17 is slidably provided on the transverse guide cylinder 14. A pressure plate 18 is hinged at one end of the inner plate 17 away from the transverse guide cylinder 14. The pressure plate 18 is also connected to the inner plate 17 through an arc-shaped elastic telescopic rod 19. Then, a pressing wheel 20 for pressing and fixing the outer ring of the wafer 28 is rotatably mounted on one end of the pressing plate 18 away from the inner plate 17, and a connecting shaft 16 is also fixed on the inner plate 17, and an adjusting rod 15 is rotatably connected to the connecting shaft 16, and the other end of the adjusting rod 15 is hinged to the inner wall of the rotating ring 8, and an arc-shaped telescopic cylinder 13 is also fixed to the outer side of the fixing ring 9, and the output end of the arc-shaped telescopic cylinder 13 is fixedly connected to the rotating ring 8, and the arc-shaped telescopic cylinder 13 is used to drive the rotating ring 8 to rotate, so as to adjust the position of the inner plate 17 through the adjusting rod 15;
所述承托居中组件还与可调按压组件的横导筒14连接，当所述直线伸缩缸11驱动固定环9下降时，承托居中组件先对晶片28进行居中定位，而后压轮20在弧形弹性伸缩杆19的弹性支撑下对晶片28的外圈进行弹性按压固定。The supporting centering component is also connected to the transverse guide cylinder 14 of the adjustable pressing component. When the linear telescopic cylinder 11 drives the fixed ring 9 to descend, the supporting centering component first centers the chip 28, and then the pressure wheel 20 elastically presses and fixes the outer ring of the chip 28 under the elastic support of the arc-shaped elastic telescopic rod 19.
在本发明实施例中，通过设计的承托居中组件和可调按压组件，能够高效且准确地固定和处理晶片28。具体过程如下：将晶片28轻置在承托居中组件上，随后直线伸缩缸11驱动固定环9平稳下降，这时承托居中组件首先会自动将晶片28居中定位。紧接着，压轮20在弧形弹性伸缩杆19的弹性支撑下，对晶片28的外圈进行弹性按压固定，确保晶片28在加工过程中保持稳定。In the embodiment of the present invention, the wafer 28 can be efficiently and accurately fixed and processed by the designed supporting centering component and adjustable pressing component. The specific process is as follows: the wafer 28 is gently placed on the supporting centering component, and then the linear telescopic cylinder 11 drives the fixing ring 9 to descend steadily. At this time, the supporting centering component will automatically center the wafer 28. Then, the pressing wheel 20, under the elastic support of the arc-shaped elastic telescopic rod 19, elastically presses and fixes the outer ring of the wafer 28 to ensure that the wafer 28 remains stable during the processing.
这种定位与固定方式极大地简化了操作过程，降低了操作难度，同时显著提升了加工效率。尤其值得一提的是，通过弧形伸缩缸13驱动的转环8，可以灵活地调节调节杆15，进而改变内板17和压轮20的初始位置，不仅可与承托居中组件配合应用，更能适应不同尺寸的晶片28固定需求，展现出较高的灵活性和便捷性。This positioning and fixing method greatly simplifies the operation process, reduces the difficulty of operation, and significantly improves the processing efficiency. It is particularly worth mentioning that the rotating ring 8 driven by the arc-shaped telescopic cylinder 13 can flexibly adjust the adjustment rod 15, thereby changing the initial position of the inner plate 17 and the pressure wheel 20, which can not only be used in conjunction with the supporting centering component, but also can adapt to the fixing requirements of wafers 28 of different sizes, showing high flexibility and convenience.
如图1-图7所示，作为本发明的一种优选实施例，所述承托筒12优选采用上开口的圆柱形筒体结构；所述转环8和固定环9均采用圆环结构，且所述转环8和固定环9的内径大于承托筒12的外径，直线伸缩缸11可以周向布置多个，提升对于固定环9支撑以及驱动升降的可靠性。As shown in Figures 1 to 7, as a preferred embodiment of the present invention, the supporting tube 12 preferably adopts a cylindrical barrel structure with an upper opening; the swivel ring 8 and the fixed ring 9 both adopt a circular ring structure, and the inner diameters of the swivel ring 8 and the fixed ring 9 are larger than the outer diameter of the supporting tube 12, and multiple linear telescopic cylinders 11 can be arranged circumferentially to improve the reliability of supporting the fixed ring 9 and driving the lifting.
所述弧形弹性伸缩杆19采用圆弧形结构，且弧形弹性伸缩杆19的圆心位于内板17和压板18之间连接轴16的轴线上，所述弧形弹性伸缩杆19的一端固定于内板17的下侧，弧形弹性伸缩杆19的另一端固定于压板18的下侧，利于压轮20能够对晶片28可靠按压，以及满足对于晶片28加工所需的空间。The arc-shaped elastic telescopic rod 19 adopts an arc-shaped structure, and the center of the arc-shaped elastic telescopic rod 19 is located on the axis of the connecting shaft 16 between the inner plate 17 and the pressure plate 18. One end of the arc-shaped elastic telescopic rod 19 is fixed to the lower side of the inner plate 17, and the other end of the arc-shaped elastic telescopic rod 19 is fixed to the lower side of the pressure plate 18, which is conducive to the pressure wheel 20 to reliably press the wafer 28 and meet the space required for processing the wafer 28.
所述压轮20与压板18阻尼转动连接，保证压轮20对于晶片28按压固定的可靠性。The pressure wheel 20 is connected to the pressure plate 18 in a damped rotation manner, thereby ensuring the reliability of the pressure wheel 20 pressing and fixing the wafer 28 .
多根所述调节杆15顺次设置，且所述调节杆15与横导筒14呈一定角度设置，保证转环8转动时，调节杆15能够对内板17推拉移动，可靠性高。The plurality of adjusting rods 15 are arranged in sequence, and the adjusting rods 15 and the transverse guide tube 14 are arranged at a certain angle, so as to ensure that when the swivel 8 rotates, the adjusting rods 15 can push and pull the inner plate 17 , and the reliability is high.
所述弧形伸缩缸13采用圆弧形结构，且所述弧形伸缩缸13的圆心位于转环8的轴线上，所述弧形伸缩缸13的缸体通过缸固定座25与固定环9连接固定，弧形伸缩缸13的输出端通过固定块24与转环8连接固定，保证弧形伸缩缸13能够可靠的驱动转环8转动。The arc-shaped telescopic cylinder 13 adopts an arc-shaped structure, and the center of the arc-shaped telescopic cylinder 13 is located on the axis of the swivel 8. The cylinder body of the arc-shaped telescopic cylinder 13 is connected and fixed to the fixing ring 9 through a cylinder fixing seat 25, and the output end of the arc-shaped telescopic cylinder 13 is connected and fixed to the swivel 8 through a fixing block 24, ensuring that the arc-shaped telescopic cylinder 13 can reliably drive the swivel 8 to rotate.
为了提升网格架29的稳定性，所述网格架29的下侧中间还固定有中心支杆31，中心支杆31的下端固定于承托筒12的内底部。In order to improve the stability of the grid frame 29 , a central support rod 31 is fixed in the middle of the lower side of the grid frame 29 , and the lower end of the central support rod 31 is fixed to the inner bottom of the supporting tube 12 .
对于承托居中组件的结构，具体参考图4-图7，所述承托居中组件包括于网格架29的上侧周向分布设置的多个L形状的居中托板26，居中托板26的水平部上安装有滚珠27，所述居中托板26的下侧固定有下伸杆38，下伸杆38从网格架29上开设的活动口39穿过，多根所述下伸杆38相远离的一侧固定有直线弹性伸缩杆37，直线弹性伸缩杆37的缸体上滑动设有导座36，导座36还与网格架29的下侧固定连接，所述直线弹性伸缩杆37远离下伸杆38的一端固定有楔形块二34，楔形块二34和导座36之间的直线弹性伸缩杆37上套设有弹簧35；所述横导筒14的下侧还固定有可调伸缩杆21，可调伸缩杆21的下端固定有与楔形块二34相配合的楔形块一33，当所述可调伸缩杆21向下移动时，楔形块一33推动楔形块二34向靠近导座36的方向移动，进而直线弹性伸缩杆37推动居中托板26和下伸杆38构成的整体移动，实现对于晶片28的居中定位。此外，通过滚珠27可避免晶片28移动磨损；通过弹簧35利于直线弹性伸缩杆37复位；设置直线弹性伸缩杆37能够弹性伸缩，利于居中托板26对于晶片28弹性支撑，提升居中定位的可靠性。With regard to the structure of the supporting centering component, specifically refer to FIGS. 4 to 7 , wherein the supporting centering component comprises a plurality of L-shaped centering plates 26 circumferentially distributed on the upper side of a grid frame 29, a ball bearing 27 is mounted on the horizontal portion of the centering plate 26, a downward extension rod 38 is fixed to the lower side of the centering plate 26, the downward extension rod 38 passes through a movable opening 39 provided on the grid frame 29, a linear elastic telescopic rod 37 is fixed to one side away from the plurality of downward extension rods 38, a guide seat 36 is slidably provided on the cylinder body of the linear elastic telescopic rod 37, the guide seat 36 is also fixedly connected to the lower side of the grid frame 29, and the linear elastic telescopic rod 37 is fixed to the lower side of the grid frame 29. A wedge block 2 34 is fixed to one end of the retracting rod 37 away from the extending rod 38, and a spring 35 is sleeved on the linear elastic telescopic rod 37 between the wedge block 2 34 and the guide seat 36; an adjustable telescopic rod 21 is also fixed to the lower side of the transverse guide tube 14, and a wedge block 1 33 matching with the wedge block 2 34 is fixed to the lower end of the adjustable telescopic rod 21. When the adjustable telescopic rod 21 moves downward, the wedge block 1 33 pushes the wedge block 2 34 to move toward the guide seat 36, and then the linear elastic telescopic rod 37 pushes the centering support plate 26 and the extending rod 38 to move as a whole, so as to realize the centering positioning of the wafer 28. In addition, the ball bearing 27 can prevent the wafer 28 from moving and wearing; the spring 35 is used to facilitate the reset of the linear elastic telescopic rod 37; the linear elastic telescopic rod 37 is set to be elastically retractable, which is conducive to the elastic support of the centering support plate 26 for the wafer 28, and improves the reliability of the centering positioning.
优选的，所述可调伸缩杆21竖直设置，可调伸缩杆21上设有用于对其调节后锁定的锁紧螺栓22，设置可调伸缩杆21可调节，使得承托居中组件与横导筒14升降更好的配合，利于承托居中组件先对晶片28进行居中定位，而后压轮20在弧形弹性伸缩杆19的弹性支撑下对晶片28的外圈进行弹性按压固定这一功能的可靠实现。所述网格架29上还开设有用于可调伸缩杆21滑动穿过的杆孔40，提升可靠性。Preferably, the adjustable telescopic rod 21 is vertically arranged, and a locking bolt 22 is provided on the adjustable telescopic rod 21 for locking after adjustment. The adjustable telescopic rod 21 is arranged to be adjustable, so that the supporting centering assembly and the horizontal guide tube 14 can be better coordinated in lifting and lowering, which is conducive to the supporting centering assembly to first center the wafer 28, and then the pressure wheel 20 reliably realizes the function of elastically pressing and fixing the outer ring of the wafer 28 under the elastic support of the arc-shaped elastic telescopic rod 19. The grid frame 29 is also provided with a rod hole 40 for the adjustable telescopic rod 21 to slide through, so as to improve reliability.
优选的，所述下伸杆38固定于居中托板26的水平部下侧，下伸杆38还与活动口39滑动连接，提升可靠性；所述活动口39平行于居中托板26的水平部设置，对于活动口39的长度按需布置即可，不作限定和赘述。Preferably, the downward extension rod 38 is fixed to the lower side of the horizontal part of the center support plate 26, and the downward extension rod 38 is also slidably connected to the movable opening 39 to improve reliability; the movable opening 39 is arranged parallel to the horizontal part of the center support plate 26, and the length of the movable opening 39 can be arranged as needed without limitation or elaboration.
优选的，所述楔形块一33和楔形块二34均采用直角三角形块，楔形块一33的斜边为上端向靠近楔形块二34的一侧倾斜，楔形块二34的斜边为上端向远离楔形块一33的一侧倾斜，且所述楔形块一33和楔形块二34的斜边对应的面滑动连接；所述楔形块一33的一个直角边与可调伸缩杆21下端固定连接，楔形块一33的另一直角边与承托筒12内壁滑动连接，所述楔形块二34的一个直角边与直线弹性伸缩杆37端部固定连接，提升楔形块一33和楔形块二34配合作用的可靠性。Preferably, both the wedge block 1 33 and the wedge block 2 34 are right-angled triangle blocks, the hypotenuse of the wedge block 1 33 is inclined with the upper end being close to the side of the wedge block 2 34, and the hypotenuse of the wedge block 2 34 is inclined with the upper end being away from the side of the wedge block 1 33, and the surfaces corresponding to the hypotenuses of the wedge block 1 33 and the wedge block 2 34 are slidably connected; one right-angled side of the wedge block 1 33 is fixedly connected to the lower end of the adjustable telescopic rod 21, the other right-angled side of the wedge block 1 33 is slidably connected to the inner wall of the supporting tube 12, and one right-angled side of the wedge block 2 34 is fixedly connected to the end of the linear elastic telescopic rod 37, thereby improving the reliability of the cooperation between the wedge block 1 33 and the wedge block 2 34.
如图1、图3、图4和图8所示，作为本发明的一种优选实施例，该数控半导体激光加工机床，还包括空气净化组件，所述空气净化组件包括吸气头2、外罩筒3、气管6、软管7和吸气净化装置32，所述吸气净化装置32固定于承托筒12的内底部，吸气净化装置32的出口与承托筒12侧壁上开设的出气口30连通，出气口30上还安装有防尘网，所述出气口30具有两个进口，两个进口上均安装有调节阀（未示出），其中一个进口上连接有气管6，气管6从承托筒12侧壁伸出并与立架5固定连接，气管6远离吸气净化装置32的一端还通过软管7与安装轴23上固定的外罩筒3连接，所述外罩筒3采用空心结构，外罩筒3的底部周向分布安装有多个吸气头2，多个所述吸气头2通过外罩筒3内腔与软管7连通，所述吸气净化装置32用于通过其进口抽吸空气并过滤后经出气口30排出。As shown in Figures 1, 3, 4 and 8, as a preferred embodiment of the present invention, the CNC semiconductor laser processing machine tool also includes an air purification component, which includes an air suction head 2, an outer cover tube 3, an air pipe 6, a hose 7 and an air suction purification device 32. The air suction purification device 32 is fixed to the inner bottom of the supporting tube 12, and the outlet of the air suction purification device 32 is connected to the air outlet 30 opened on the side wall of the supporting tube 12. A dustproof net is also installed on the air outlet 30. The air outlet 30 has two inlets, both of which are installed A regulating valve (not shown) is installed, one of the inlets of which is connected to an air pipe 6, which extends from the side wall of the supporting tube 12 and is fixedly connected to the stand 5, and the end of the air pipe 6 away from the air intake purification device 32 is also connected to the outer cover tube 3 fixed on the mounting shaft 23 through a hose 7. The outer cover tube 3 adopts a hollow structure, and a plurality of air intake heads 2 are circumferentially installed at the bottom of the outer cover tube 3. The plurality of air intake heads 2 are connected to the hose 7 through the inner cavity of the outer cover tube 3. The air intake purification device 32 is used to draw air through its inlet and discharge it through the air outlet 30 after filtering.
在应用时，对于吸气净化装置32的结构不作限定和赘述，能够抽吸空气并过滤即可，可以按需适应性设置，设置两个进口，不仅可通过激光器1加工周围的吸气头2抽吸净化空气，还可对承托筒12内腔抽吸净化空气，而且通过调节阀便于进行调节，可靠合理。When in use, there is no limitation or elaboration on the structure of the air suction purification device 32. It only needs to be able to suck and filter air, and can be adaptively set as needed. Two inlets are set, which can not only suck and purify air through the suction head 2 around the laser 1 processing, but also suck and purify air from the inner cavity of the supporting tube 12, and it is easy to adjust through the regulating valve, which is reliable and reasonable.
本发明上述实施例中提供了一种数控半导体激光加工机床，通过承托居中组件对晶片28进行居中定位，再利用可调按压组件的压轮20在弹性支撑下对晶片28外圈进行可靠固定，显著提升了晶片28定位的准确性和稳定性，进而简化了操作，提高了加工效率。此外，机床还配备弧形伸缩缸13以调节压轮20位置，满足不同尺寸晶片28的固定需求，展现出高度的灵活性和适应性。同时，空气净化组件的引入有效净化了加工环境，进一步保障了加工质量。The above embodiment of the present invention provides a CNC semiconductor laser processing machine tool, which centers the wafer 28 by supporting the centering component, and then uses the pressure wheel 20 of the adjustable pressing component to reliably fix the outer ring of the wafer 28 under elastic support, which significantly improves the accuracy and stability of the positioning of the wafer 28, thereby simplifying the operation and improving the processing efficiency. In addition, the machine tool is also equipped with an arc-shaped telescopic cylinder 13 to adjust the position of the pressure wheel 20 to meet the fixing requirements of wafers 28 of different sizes, showing a high degree of flexibility and adaptability. At the same time, the introduction of the air purification component effectively purifies the processing environment and further ensures the processing quality.
此外，对于各部件的控制采用现有技术中公开的PLC控制器即可，各部件的型号及电路连接不作具体限定，在实际应用时可灵活设置。In addition, the PLC controller disclosed in the prior art can be used to control each component, and the model and circuit connection of each component are not specifically limited and can be flexibly set in actual application.
涉及到的电路、电子元器件和模块均为现有技术，本领域技术人员完全可以实现，无须赘言，本发明保护的内容也不涉及对于软件和方法的改进。The circuits, electronic components and modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by the present invention does not involve improvements to software and methods.
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.
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