CN118524627B - A method for manufacturing an ultra-thin single-sided flexible circuit board - Google Patents
A method for manufacturing an ultra-thin single-sided flexible circuit board Download PDFInfo
- Publication number
- CN118524627B CN118524627B CN202410754048.5A CN202410754048A CN118524627B CN 118524627 B CN118524627 B CN 118524627B CN 202410754048 A CN202410754048 A CN 202410754048A CN 118524627 B CN118524627 B CN 118524627B
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- Prior art keywords
- circuit board
- flexible circuit
- functional module
- sided flexible
- ultra
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 60
- 239000002699 waste material Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 abstract description 8
- 239000003292 glue Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229940127554 medical product Drugs 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
本申请公开了一种超薄单面柔性电路板制作方法，通过在承载膜上贴附胶层，然后在胶层上贴附离型膜，之后根据超薄单面柔性电路板上功能模块的位置在离型膜上切割出防粘贴区域以及被撕除区域，将被撕除区域撕除，然后将超薄单面柔性电路板覆盖到胶层以及离型膜上，这样功能模块下方有离型膜进行阻隔不会与胶层直接接触，超薄单面柔性电路板上除功能模块以外的其余区域为废料，与胶层直接接触被粘贴住，当完成加工后沿功能模块边缘对功能模块进行切割，由于功能模块有离型膜阻隔没有被粘贴，可以直接脱出，无需对其撕下造成功能模块被扯断或导致功能模块褶皱，保证功能模块的完整性。
The present application discloses a method for manufacturing an ultra-thin single-sided flexible circuit board, which comprises the following steps: attaching an adhesive layer on a carrier film, and then attaching a release film on the adhesive layer, and then cutting an anti-sticking area and a to-be-torn area on the release film according to the position of a functional module on the ultra-thin single-sided flexible circuit board, tearing off the to-be-torn area, and then covering the ultra-thin single-sided flexible circuit board on the adhesive layer and the release film, so that the functional module is blocked by the release film below and will not be in direct contact with the adhesive layer, and the remaining area on the ultra-thin single-sided flexible circuit board except for the functional module is waste material, which is in direct contact with the adhesive layer and is adhered, and when the processing is completed, the functional module is cut along the edge of the functional module, and since the functional module is blocked by the release film and is not adhered, it can be directly removed without tearing it off to cause the functional module to be torn off or causing the functional module to be wrinkled, thereby ensuring the integrity of the functional module.
Description
Technical Field
The invention belongs to the technical field of ultrathin single-sided flexible circuit boards, and particularly relates to a manufacturing method of an ultrathin single-sided flexible circuit board.
Background
Along with the continuous promotion of informatization and intelligent construction, the ultrathin single-sided FPC flexible board has better flexibility and can be installed in ultrathin electronic or medical products, so that the market demand for the ultrathin single-sided FPC flexible board is also increasing. Specifically, there are two conventional methods for processing an ultrathin single-sided FPC flexible board: the first is to directly cut the substrate to make a board, the second is to use a carrier film (self-adhesive micro-adhesive film) to cover, then cut the substrate to make a board, tear off the carrier film before molding, if the ultra-thin single-sided FPC flexible board is produced by the first conventional method, the ultra-thin single-sided FPC flexible board is flexible and thin, the ultra-thin single-sided FPC flexible board is easy to fold in the production process, the yield of the product circuit is very easy to be low, if the second conventional method is used for production, the ultra-thin single-sided FPC flexible board is easy to tear or the ultra-thin single-sided FPC flexible board is easy to fold in the carrier film tearing process, and the yield of the product circuit is very easy to be low.
Disclosure of Invention
Object of the invention
In order to overcome the defects, the invention aims to provide a manufacturing method of an ultrathin single-sided flexible circuit board, which solves the technical problems that the existing ultrathin single-sided flexible circuit board is easy to wrinkle and is broken in the processing process, and the circuit inside the product is broken or short-circuited, so that the yield of the circuit of the product is low.
(II) technical scheme
In order to achieve the above purpose, the technical scheme provided by the application is as follows:
a manufacturing method of an ultrathin single-sided flexible circuit board comprises the following steps:
taking a bearing film and attaching a glue layer on the bearing film;
attaching a release film on the adhesive layer;
Cutting a corresponding number of anti-sticking areas on the release film according to the positions of the functional modules on the ultrathin single-sided flexible circuit board, wherein the rest areas are torn areas;
Tearing off the torn-off area;
Covering the ultrathin single-sided flexible circuit board on the adhesive layer and the anti-adhesion area of the release film, wherein the functional module of the adhered ultrathin single-sided flexible circuit board is positioned above the anti-adhesion area, and the waste area is adhered with the adhesive layer;
Cutting the functional module along the edge of the functional module to take out the functional module;
according to the application, the adhesive layer is attached to the bearing film, the release film is attached to the adhesive layer, then the anti-sticking area and the torn area are cut on the release film according to the position of the functional module on the ultrathin single-sided flexible circuit board, the torn area is torn off, then the ultrathin single-sided flexible circuit board is covered on the adhesive layer and the release film, so that the release film is arranged below the functional module to be blocked and cannot be in direct contact with the adhesive layer, the rest areas except the functional module on the ultrathin single-sided flexible circuit board are waste materials and are in direct contact with the adhesive layer to be stuck, the functional module is cut along the edge of the functional module after finishing processing, and the functional module can be directly pulled out without tearing the functional module or causing the functional module to be wrinkled because the release film is not stuck.
In some embodiments, attaching the glue layer to the carrier film surface comprises: heating and pressurizing the adhesive layer;
Through heating and pressurizing the glue film, guarantee that the glue film can be smooth attach to the carrier film, guarantee attached effect.
In some embodiments, attaching the release film on the glue layer comprises: heating and pressurizing the release film;
Through heating and pressurizing from the type membrane, guarantee from the type membrane can be smooth attach to the glue film on, guarantee attached effect, it is protruding to avoid from the type membrane to paste ultra-thin single face flexible circuit board when unevenness leads to the ultra-thin single face flexible circuit board of follow-up cover, influences the precision of follow-up processing.
In some embodiments, after covering the ultra-thin single-sided flexible circuit board to the adhesive layer and the release film anti-adhesive area and before cutting the functional module along the functional module edge to remove the functional module, further comprising: heating and pressurizing the ultrathin single-sided flexible circuit board;
Through heating and pressurizing the ultrathin single-sided flexible circuit board, the ultrathin single-sided flexible circuit board can be tightly and flatly attached to the adhesive layer and the release film, and subsequent accurate processing is guaranteed.
In some embodiments, the area of the anti-stiction area is greater than the area of the functional module;
The area of the anti-sticking area is increased, so that the anti-sticking area can comprehensively support the functional module, when the area of the functional module is just equal to the anti-sticking area or the area of the anti-sticking area is slightly smaller than the area of the functional module, the functional module is damaged due to the fact that the edge of the functional module is pulled downwards due to the fact that the height difference is arranged between the release film and the adhesive layer when the ultrathin single-sided flexible circuit board is heated and pressurized, chemical substances such as liquid medicine easily enter the functional module in the processing process at the later stage, or chemical substances such as liquid medicine easily enter an interlayer between the back of the functional module and the anti-sticking area of the release film through the damage position, and the functional module is damaged due to exudation in the subsequent processing process.
In some embodiments, the release film has a thickness of 5-30mm;
The release film with proper thickness is selected, so that the problem that the functional module of the ultrathin single-sided flexible circuit board is damaged due to the fact that the height difference between the release film and the adhesive layer is too high when the ultrathin single-sided flexible circuit board is heated and pressurized is avoided, chemical substances such as liquid medicine and the like easily enter the functional module in the processing process at the later stage to damage the functional module or enter an interlayer between the back of the functional module and an anti-adhesion area of the release film through the damaged position, and the functional module is damaged due to exudation in the subsequent processing process.
In some embodiments, taking the carrier film and prior to attaching the glue layer to the carrier film, comprises: positioning marks for alignment are arranged on the bearing film and the ultrathin single-sided flexible circuit board, and the steps of covering the ultrathin single-sided flexible circuit board on the adhesive layer and the release film include: aligning the positioning marks of the ultrathin single-sided flexible circuit board and the bearing film, and then covering the ultrathin single-sided flexible circuit board on the adhesive layer;
The positioning mark is arranged on the bearing film and the ultrathin single-sided flexible circuit board, when the ultrathin single-sided flexible circuit board is covered on the adhesive layer and the anti-adhesion area of the release film, the alignment of the functional module and the anti-adhesion area below the functional module can be ensured, the functional module part and the adhesive layer are prevented from being adhered due to dislocation between the functional module part and the adhesive layer, and the functional module cannot be directly taken out in the later stage.
Drawings
FIG. 1 is a flow chart of a method of manufacturing an ultrathin single-sided flexible circuit board of the invention;
FIG. 2 is a cross-sectional view of a carrier film, adhesive layer, release film, and ultra-thin single-sided flexible circuit board after being attached together;
FIG. 3 is a top view of an ultra-thin single-sided flexible circuit board;
FIG. 4 is a view of the release film after cutting the anti-stick region, the removed region, and the removed region not removed;
fig. 5 is a state diagram of the release film after being attached to the adhesive layer and the torn-off region being torn off.
Reference numerals:
1. Ultrathin single-sided flexible circuit board; 101. a functional module; 102. a waste region; 2. a release film; 201. an anti-sticking area; 202. the torn area; 3. a glue layer; 4. and a carrier film.
Detailed Description
The objects, technical solutions and advantages of the present invention will become more apparent by the following detailed description of the present invention with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
The invention provides a manufacturing method of an ultrathin single-sided flexible circuit board, which comprises the following steps:
taking a carrier film 4 and attaching an adhesive layer 3 on the carrier film 4;
attaching a release film 2 on the adhesive layer 3;
Cutting a corresponding number of anti-sticking areas 201 on the release film 2 according to the positions of the functional modules 101 on the ultrathin single-sided flexible circuit board 1, wherein the rest areas are torn areas 202;
tearing the torn region 202;
covering the ultrathin single-sided flexible circuit board 1 on the adhesive layer 3 and an anti-adhesion area 201 of the release film 2, wherein the functional module 101 of the covered ultrathin single-sided flexible circuit board 1 is positioned above the anti-adhesion area 201, and the waste area 102 is adhered to the adhesive layer 3;
the functional module 101 is cut along the edge of the functional module 101 to take out the functional module 101.
Specifically, the areas of the carrier film 4, the adhesive layer 3, the release film 2 and the ultrathin single-sided flexible circuit board 1 are selected to be consistent, or the area of the carrier film 4 can be increased appropriately.
Specifically, the ultrathin single-sided flexible circuit board 1 includes a plurality of functional modules 101, when the ultrathin single-sided flexible circuit board 1 is produced, the plurality of functional modules 101 are uniformly processed, after the processing is completed, the functional modules 101 are torn off and mounted on the electronic equipment, specifically, the regions except for the regions of the functional modules 101 on the ultrathin single-sided flexible circuit board 1 are waste regions 102, and all the functional modules 101 are torn off and then discarded.
Specifically, because the ultrathin single-sided flexible circuit board 1 has high softness, it is difficult to directly process the ultrathin single-sided flexible circuit board 1, and the ultrathin single-sided flexible circuit board 1 needs to be adhered to the carrier film 4 through the adhesive layer 3, and the carrier film 4 is used as a support to transport the ultrathin single-sided flexible circuit board 1 to different stations for processing. However, after finishing the processing, the functional module 101 needs to be torn off from the adhesive layer 3, and a large force is required under the action of the adhesive force, which easily causes the functional module 101 to tear or causes the functional module 101 to wrinkle, so that the integrity of the functional module 101 cannot be ensured.
According to the application, the release film 2 is arranged on the carrier film 4 and the adhesive layer 3, then the release film 2 is cut according to the position of the functional module 101 on the ultrathin single-sided flexible circuit board 1, the anti-sticking area 201 and the torn-off area 202 are cut, the adhesive layer 3 is exposed after the torn-off area 202 is torn off, when the ultrathin single-sided flexible circuit board 1 is covered on the adhesive layer 3 and the anti-sticking area 201 of the release film 2, the waste area 102 is stuck by the adhesive layer 3, the anti-sticking area 201 can block the functional module 101, so that the functional module 101 can not be in direct contact with the adhesive layer 3, after the whole ultrathin single-sided flexible circuit board 1 is processed, the whole functional module 101 can be cut out through cutting, and the functional module 101 can be automatically pulled out after the cutting because the release film 2 does not generate viscosity, so that the step of tearing off the functional module 101 is not needed, and the functional module 101 is prevented from being torn off when the functional module 101 is torn off.
Specifically, the functional module 101 may be cut by punching or laser cutting.
Preferably, after the adhesive layer 3 is attached to the carrier film 4, the adhesive layer 3 needs to be heated and pressurized.
Preferably, after the release film 2 is attached to the adhesive layer 3, the release film 2 is heated and pressurized.
Preferably, after the ultra-thin single-sided flexible circuit board 1 is covered on the adhesive layer 3 and the anti-adhesion region 201 of the release film 2, the ultra-thin single-sided flexible circuit board 1 needs to be heated and pressurized.
Specifically, the heating and pressurizing such as false pressing or rapid pressing enable the adjacent two attaching layers to be tightly adhered, reduce air residues, and avoid the phenomena of bulge and the like.
Preferably, the area of the anti-sticking area 201 needs to be cut larger than the area of the functional module 101 when the anti-sticking area 201 is cut out on the release film 2. Such as 2-3mm extending the peripheral edge of the release area 201 outwardly beyond the edge of the functional module 101.
Preferably, the thickness of the release film 2 selected by the application is 5-30mm. Therefore, the height drop of the release film 2 and the adhesive layer 3 can be reduced, and the uneven supporting surface of the ultrathin single-sided flexible circuit board 1 is reduced when the ultrathin single-sided flexible circuit board 1 is heated and pressurized, so that the functional module 101 is pulled and damaged.
Preferably, the positioning marks are arranged on the carrier film 4 and the ultrathin single-sided flexible circuit board 1, and because the adhesive layer 3 and the release film 2 are transparent, the positioning marks on the carrier film 4 can be observed after the adhesive layer 3 and the carrier film 4 are adhered, when the ultrathin single-sided flexible circuit board 1 is covered on the adhesive layer 3 and the release film 2 anti-adhesion area 201, the two positioning marks are aligned and then covered, or the carrier film 4 with a larger area can be arranged, the positioning marks are arranged on the edge of the carrier film 4, the ultrathin single-sided flexible circuit board 1 is covered on the adhesive layer 3 and the release film 2 anti-adhesion area 201 after the positioning marks on the edge of the ultrathin single-sided flexible circuit board 1 are aligned with the positioning marks on the adhesive layer 3 and the release film 2 anti-adhesion area 201, and the functional module 101 can be aligned with the anti-adhesion area 201 below the ultrathin single-sided flexible circuit board 1 when the ultrathin single-sided flexible circuit board 1 is covered on the adhesive layer 3 and the release film 2 anti-adhesion area 201, so that the functional module 101 cannot be directly taken out after the functional module 101 is adhered to the adhesive layer 3 due to dislocation between the two.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and are in no way limiting of the invention. Accordingly, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention should be included in the scope of the present invention. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims, or equivalents of such scope and boundary.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410754048.5A CN118524627B (en) | 2024-06-12 | 2024-06-12 | A method for manufacturing an ultra-thin single-sided flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410754048.5A CN118524627B (en) | 2024-06-12 | 2024-06-12 | A method for manufacturing an ultra-thin single-sided flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118524627A CN118524627A (en) | 2024-08-20 |
| CN118524627B true CN118524627B (en) | 2024-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410754048.5A Active CN118524627B (en) | 2024-06-12 | 2024-06-12 | A method for manufacturing an ultra-thin single-sided flexible circuit board |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN117641734A (en) * | 2023-11-14 | 2024-03-01 | 伟裕(厦门)电子有限公司 | Production method of ultrathin circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101511362B1 (en) * | 2013-08-13 | 2015-04-10 | 주식회사 거림 | Manufacturing method of stiffener set for flexible printed circuit board and stiffener set for flexible printed circuit board |
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- 2024-06-12 CN CN202410754048.5A patent/CN118524627B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN117641734A (en) * | 2023-11-14 | 2024-03-01 | 伟裕(厦门)电子有限公司 | Production method of ultrathin circuit board |
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| CN118524627A (en) | 2024-08-20 |
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