CN118522705A - Electronic package and method for manufacturing the same - Google Patents

Abstract

An electronic package and its manufacturing method, including setting a heat radiation structure covering the electronic element on a carrier board with the electronic element, wherein the heat radiation structure is made by molding insulating material, and the heat radiation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object, so the heat radiation structure is formed by insulating material to reduce the weight of the heat radiation structure.

Description

Electronic packaging and method of manufacturing the same

Technical Field

The present invention relates to a semiconductor packaging process, in particular to an electronic packaging component with a heat dissipation structure and a manufacturing method thereof.

Background Art

As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as core components of electronic products, need to have higher density electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat energy during operation.

Therefore, in order to quickly dissipate the heat to the outside, the industry usually configures a heat sink or heat spreader in the semiconductor package. The heat sink is usually combined with the back of the semiconductor chip by a heat dissipation adhesive, such as a thermal interface material (TIM), so as to dissipate the heat generated by the semiconductor chip by the heat dissipation adhesive and the heat sink.

As shown in FIG. 1 , the manufacturing method of the conventional semiconductor package 1 is to first place a semiconductor chip 11 with its active surface 11a on a package substrate 10 by means of a flip chip bonding method (i.e., through conductive bumps 110 and bottom glue 111), and then place a heat sink 13 with its top sheet 130 on the inactive surface 11b of the semiconductor chip 11 by means of a TIM layer 12, and the support legs 131 of the heat sink 13 are mounted on the package substrate 10 by means of an adhesive layer 14.

During operation, heat energy generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the inactive surface 11 b and the TIM layer 12 to be dissipated to the outside of the semiconductor package 1 .

However, in the existing semiconductor package 1, a metal frame is used as the heat sink 13, and thus a complicated process such as etching metal and/or electroplating metal is required to manufacture the heat sink 13. Therefore, the heat sink 13 is not only very expensive to manufacture, but also difficult to reduce in weight, making the semiconductor package 1 not conducive to meeting the demand for being lightweight.

Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry.

Summary of the invention

In view of the above-mentioned deficiencies of the prior art, the present invention provides an electronic package and a manufacturing method thereof, which can at least partially solve the problems of the prior art.

The electronic package of the present invention comprises: a carrier having at least one circuit layer; an electronic component disposed on the carrier and electrically connected to the circuit layer; and an insulating material heat dissipation structure disposed on the carrier and covering the electronic component, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening for exposing the phase change material object.

The present invention also provides a method for manufacturing an electronic package, comprising: manufacturing an insulating material heat dissipation structure by injection molding an insulating material, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object; and arranging the insulating material heat dissipation structure on a carrier having at least one circuit layer, wherein the carrier is provided with at least one electronic component electrically connected to the circuit layer so that the insulating material heat dissipation structure covers the electronic component.

In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure contacts the electronic element.

In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure has a shielding layer, so that after the insulating material heat dissipation structure is arranged on the carrier, the shielding layer is located between the phase change material object and the electronic component.

In the aforementioned electronic package and its manufacturing method, the manufacturing process of the insulating material heat dissipation structure includes: respectively manufacturing a first heat dissipation element and a second heat dissipation element by injection molding insulating material; forming the opening on the first heat dissipation element; and joining the first heat dissipation element and the second heat dissipation element so that the phase change material object is sandwiched between the first heat dissipation element and the second heat dissipation element, wherein the insulating material heat dissipation structure is arranged on the carrier with the second heat dissipation element so that the second heat dissipation element covers the electronic component.

In the aforementioned electronic packaging component and its manufacturing method, the phase change material object includes paraffin, organic acid, inorganic salt or salt water compound.

As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by injection molding insulating material, with a simple process. Therefore, compared with the existing metal heat dissipation parts, the present invention can not only greatly reduce the manufacturing cost of the insulating material heat dissipation structure, but also reduce the weight of the insulating material heat dissipation structure, so that the electronic package meets the lightweight requirements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a conventional semiconductor package.

2A to 2H are cross-sectional schematic diagrams of a method for manufacturing an electronic package of the present invention.

FIG. 2D-1 is a top schematic diagram of another embodiment of FIG. 2D .

FIG. 2E-1 is a top schematic diagram of another embodiment of FIG. 2E .

3A to 3B are cross-sectional views of the manufacturing process of the first heat sink of the insulating material heat sink structure of the electronic package of the present invention.

4A to 4B are cross-sectional views of the manufacturing process of the second heat sink of the insulating material heat dissipation structure of the electronic package of the present invention.

The reference numerals are described as follows:

1Semiconductor Package

10Package substrate

11Semiconductor Chips

11a, 21a action surface

11b, 21b non-active surface

110, 210 conductive bumps

111, 211 primer

12TIM layer

13 heat sink

130 Top Sheet

131,400 support feet

14, 24 adhesive layer

2Electronic packaging

2a Insulation material heat dissipation structure

2b Substrate structure

20 carrier boards

200 insulation layer

201 circuit layer

21 Electronic components

22 Phase change material objects

23 shielding layer

3. Heat dissipation frame

3a bracket

30 first heat sink

30a, 402 insulation material

300 openings

301 convex part

40 second heat sink

40a sheet

401 recess

70, 80 first module

71, 81 second module

9, 9a bearing member

S Accommodation Space

L cutting path.

DETAILED DESCRIPTION

The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of people familiar with this technology, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

2A to 2H are cross-sectional schematic diagrams of a method for manufacturing an electronic package 2 according to the present invention.

As shown in FIG. 2A , a first heat dissipation element 30 having a plurality of protrusions 301 and a second heat dissipation element 40 having a plurality of concave portions 401 are provided.

In this embodiment, the first heat sink 30 is a plate, and the second heat sink 40 is a sheet connected to a plurality of support legs 400, so that the recess 401 is formed on one side of the support legs 400. For example, the second heat sink 40 is surrounded by the plurality of support legs 400 to form a cover shape to form an accommodation space S.

Furthermore, the first heat sink 30 is an insulating material, such as prepreg (PP), epoxy encapsulation colloid, molding compound or other plastic materials. For example, the first heat sink 30 can be made by injection molding, such as the first mold 70 and the second mold 71 shown in FIG. 3A , and after demolding, the excess insulating material 30a is removed, as shown in FIG. 3B .

In addition, the second heat sink 40 is an insulating material, such as prepreg (PP), epoxy resin (epoxy) packaging colloid, packaging material or other plastic materials. For example, the second heat sink 40 can be made by injection molding, such as the first mold 80 and the second mold 81 shown in FIG4A, and after demolding, the excess insulating material 402 is removed, as shown in FIG4B. It should be understood that the materials of the first heat sink 30 and the second heat sink 40 can be the same or different.

As shown in FIGS. 2B to 2C , a plurality of openings 300 are first formed on the first heat sink 30 , and then a phase change material (PCM) mass 22 is positioned between the first heat sink 30 and the second heat sink 40 to press the first heat sink 30 and the second heat sink 40 , so that the PCM mass 22 is sandwiched between the first heat sink 30 and the second heat sink 40 , and the PCM mass 22 is exposed from the plurality of openings 300 .

In this embodiment, the openings 300 penetrate the body of the first heat dissipation element 30 , and the convex portion 301 of the first heat dissipation element 30 is inserted into the concave portion 401 of the second heat dissipation element 40 , so that the first and second heat dissipation elements 30 , 40 are joined.

Furthermore, the phase change material object 22 is in the shape of a sheet, and the material forming the phase change material object 22 is paraffin, organic acid, inorganic salt, salt water compound or other phase change materials.

As shown in FIG. 2D , a shielding layer 23 is formed on the second heat dissipation element 40 to form an insulating material heat dissipation structure 2 a .

In this embodiment, the shielding layer 23 is formed on the surface of the sheet 40a and the supporting leg 400 in the accommodation space S of the second heat sink 40. For example, the shielding layer 23 includes a metal material, such as formed on the second heat sink 40 by electroplating a metal layer such as gold (Au), silver (Ag), nickel (Ni) or other metal layers.

Furthermore, the first heat sink 30 and the second heat sink 40 can be manufactured by injection molding to form a panel specification or a wafer level specification, such as the heat sink frame 3 shown in FIG. 2D-1, which connects a plurality of array-arranged insulating material heat sink structures 2a via a plurality of brackets 3a.

Alternatively, a single insulating material heat dissipation structure 2a with its first heat dissipation element 30 can be placed on a single carrier 9 according to needs, so as to facilitate transportation to a machine used in a subsequent process, as shown in FIG2E. It should be understood that, as shown in FIG2E-1, multiple insulating material heat dissipation structures 2a can also be arrayed on a carrier 9a of a full-page specification or wafer-level specification.

As shown in FIG. 2F to FIG. 2G , a substrate structure 2b of full-page or wafer-level specifications is provided, which includes a plurality of adjacent carriers 20, and at least one electronic component 21 is disposed on each of the carriers 20. Next, following the process shown in FIG. 2E-1 , each of the insulating material heat dissipation structures 2a is removed from the carrier 9a, so as to place each of the insulating material heat dissipation structures 2a on each of the carriers 20 respectively.

In the present embodiment, the carrier 20 is, for example, a package substrate having a core layer and a circuit structure, a package substrate having a coreless circuit structure, a silicon interposer (TSI) with conductive through-silicon via (TSV), or other board types, which includes at least one insulating layer 200 and at least one circuit layer 201 combined with the insulating layer 200, such as at least one fan-out redistribution layer (RDL). For example, the material forming the circuit layer 201 is copper, and the material forming the insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. It should be understood that the substrate structure 2b may also be in the form of a single carrier 20 (not shown) or other plate materials for carrying chips, such as a lead frame, a wafer, or other plates with metal routing, etc., but is not limited to the above.

Furthermore, the electronic component 21 is an active component, a passive component or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a is disposed on the circuit layer of the carrier 20 by a flip chip method through a plurality of conductive bumps 210 such as solder materials, metal pillars or others and electrically connected to the circuit layer 201, and the conductive bumps 210 are coated with a primer 211; or, the electronic component 21 can be electrically connected to the circuit layer 201 of the carrier 20 by a plurality of welding wires (not shown) by a wire bonding method; or, the electronic component 21 can directly contact the circuit layer 201 of the carrier 20. Therefore, the required type and quantity of electronic components 21 can be placed on the carrier 20 to enhance its electrical function. There are many ways to electrically connect the electronic components 21 to the carrier structure 20, which are not limited to the above.

In addition, the insulating material heat dissipation structure 2a is combined with the support leg 400 of the second heat dissipation element 40 on the carrier 20 through the adhesive layer 24, so that the electronic component 21 is located in the accommodating space S, and the second heat dissipation element 40 covers the electronic component 21. For example, the shielding layer 23 is located between the second heat dissipation element 40 (the phase change material object 22) and the electronic component 21 to cover the electronic component 21, so that the shielding layer 23 can prevent the electronic component 21 from being subjected to external electromagnetic interference (Electromagnetic Interference, referred to as EMI).

In addition, the insulating material heat dissipation structure 2a contacts the inactive surface 21b of the electronic component 21 with the sheet 40a of the second heat dissipation element 40 (or the shielding layer 23). It should be understood that the insulating material heat dissipation structure 2a may not contact the electronic component 21, that is, the insulating material heat dissipation structure 2a is separated from the inactive surface 21b of the electronic component 21.

As shown in FIG. 2H , a singulation process is performed along the cutting path L shown in FIG. 2G (ie, the boundary between each of the carriers 20 ) to obtain the electronic package 2 .

In this embodiment, the heat dissipation path of the heat energy generated by the electronic component 21 is from the second heat sink 40 through the phase change material object 22, and then dissipates the heat energy to the external environment through the opening 300. When the phase change material object 22 absorbs the heat energy from the electronic component 21, the phase change material object 22 will change from a solid state to a liquid state, and when the phase change material object 22 dissipates the heat energy through the opening 300, the phase change material object 22 will change from a liquid state to a solid state.

Therefore, the manufacturing method of the present invention mainly manufactures the first heat sink 30 and the second heat sink 40 by injection molding insulating material, with a simple process. Therefore, compared with the existing metal heat sink, the manufacturing method of the present invention can not only greatly reduce the manufacturing cost of the insulating material heat dissipation structure, but also reduce the weight of the insulating material heat dissipation structure 2a, so as to help the electronic package 2 meet the lightweight requirements.

Furthermore, the electronic package 2 is designed with the phase change material object 22 so that when the phase change material object 22 absorbs heat energy from the electronic component 21, the temperature of the electronic component 21 will remain stable (i.e., maintained at a desired temperature). At this time, the opening 300 of the first heat sink 30 serves as a flow path and pressure release space for the liquid diffusion of the phase change material object 22 to reduce the pressure applied by the phase change material object 22 on the second heat sink 40 (or the electronic component 21), thereby helping to improve the reliability of the electronic package 2.

In addition, the shielding layer 23 can not only prevent the electronic component 21 from being interfered by external electromagnetic interference, but also serve as a heat-conducting structure to transfer the heat energy of the electronic component 21 to the phase change material object 22, so that the phase change material object 22 undergoes a phase transformation, that is, the phase change material object 22 changes from a solid state to a liquid state.

The present invention provides an electronic package 2 including: a carrier 20 having at least one circuit layer 201 , at least one electronic component 21 disposed on the carrier 20 and electrically connected to the circuit layer 201 , and an insulating material heat dissipation structure 2a disposed on the carrier 20 to cover the electronic component 21 .

The insulating material heat dissipation structure 2 a is embedded with a phase change material object 22 and has at least one opening 300 exposing the phase change material object 22 .

In one embodiment, the insulating material heat dissipation structure 2 a contacts the electronic component 21 .

In one embodiment, the insulating material heat dissipation structure 2 a has a shielding layer 23 , and the shielding layer 23 is located between the phase change material object 22 and the electronic component 21 .

In one embodiment, the insulating material heat dissipation structure 2a includes a first heat dissipation element 30 and a second heat dissipation element 40 that are connected to each other, so that the phase change material object 22 is sandwiched between the first heat dissipation element 30 and the second heat dissipation element 40, and the opening 300 is formed on the first heat dissipation element 30, and the second heat dissipation element 40 is disposed on the carrier 20 to cover the electronic component 21.

In one embodiment, the phase change material 22 includes paraffin, organic acid, inorganic salt or salt water compound.

In summary, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by injection molding insulating material to reduce the manufacturing cost of the insulating material heat dissipation structure and reduce the weight of the insulating material heat dissipation structure, so that the electronic package can meet the demand of being lightweight.

The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Anyone skilled in the art can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims (10)

1. An electronic package, comprising:

the carrier plate is provided with at least one circuit layer;

the electronic element is arranged on the carrier plate and is electrically connected with the circuit layer; and

The insulating material heat dissipation structure is arranged on the carrier plate and covers the electronic element, wherein the insulating material heat dissipation structure is embedded with a phase change material object and provided with at least one opening exposing the phase change material object.

2. The electronic package of claim 1, wherein the insulating material heat dissipation structure contacts the electronic component.

3. The electronic package of claim 1, wherein the insulating material heat dissipation structure has a shielding layer, and the shielding layer is located between the phase change material object and the electronic component.

4. The electronic package of claim 1, wherein the insulating material heat dissipating structure comprises a first heat dissipating member and a second heat dissipating member that are coupled to each other, such that the phase change material object is sandwiched between the first heat dissipating member and the second heat dissipating member, and the opening is formed on the first heat dissipating member, and such that the second heat dissipating member is disposed on the carrier to cover the electronic component.

5. The electronic package of claim 1, wherein the phase change material body comprises paraffin, organic acid, inorganic salt, or brine compound.

6. A method of manufacturing an electronic package, comprising:

manufacturing an insulating material heat dissipation structure by means of injection molding of an insulating material, wherein the insulating material heat dissipation structure is embedded with a phase change material object and provided with at least one opening exposing the phase change material object; and

The insulating material heat dissipation structure is arranged on a carrier plate with at least one circuit layer, wherein the carrier plate is provided with at least one electronic element electrically connected with the circuit layer, so that the insulating material heat dissipation structure covers the electronic element.

7. The method of claim 6, wherein the insulating material heat dissipation structure contacts the electronic device.

8. The method of claim 6, wherein the insulating material heat dissipation structure has a shielding layer, and the shielding layer is located between the phase change material object and the electronic device after the insulating material heat dissipation structure is disposed on the carrier.

9. The method of claim 6, wherein the fabricating the insulating material heat dissipation structure comprises: respectively manufacturing a first heat dissipation piece and a second heat dissipation piece by means of molding insulating materials; forming the opening on the first heat sink; and the first heat dissipation piece and the second heat dissipation piece are jointed, so that the phase change material object is clamped between the first heat dissipation piece and the second heat dissipation piece, wherein the insulating material heat dissipation structure is arranged on the carrier plate by the second heat dissipation piece, and the second heat dissipation piece covers the electronic element.

10. The method of claim 6, wherein the phase change material comprises a paraffin, an organic acid, an inorganic salt, or a salt water compound.