CN118471091A - Flexible circuit substrate and thin film flip chip packaging structure - Google Patents

Abstract

The present disclosure provides a flexible circuit substrate and a thin film flip-chip packaging structure, wherein the flexible circuit substrate includes a flexible substrate, a plurality of leads, and a plurality of marking patterns. The flexible substrate includes a packaging area and two transmission areas located on opposite sides of the packaging area, the two transmission areas and the packaging area are arranged adjacent to each other in the width direction of the flexible substrate, the packaging area includes a chip bonding area and at least one external connection end, and the flexible substrate is defined with a predetermined bending area, the predetermined bending area extends along the width direction and is located between the chip bonding area and the at least one external connection end. A plurality of leads are arranged in the packaging area and extend from the chip bonding area to the at least one external connection end respectively. A plurality of marking patterns are arranged in the predetermined bending area, wherein the two opposite ends of each marking pattern are aligned with the boundary of the predetermined bending area.

Description

Flexible circuit substrate and thin film flip chip packaging structure

Technical Field

The present invention relates to a flexible circuit substrate and a thin film flip-chip packaging structure.

Background Art

Displays in the prior art generally use a chip-on-film (COF) package as a packaging method for a driver chip, that is, the chip is packaged on a flexible circuit substrate to form a thin film flip-chip packaging structure, and then a board operation is performed to connect the thin film flip-chip packaging structure to a liquid crystal panel and a rigid circuit board respectively, and the flexible circuit substrate is bent so that the rigid circuit board is arranged on the back of the liquid crystal panel to reduce the width of the display frame.

However, the leads at the predetermined bending area of the flexible circuit substrate must have a certain strength to avoid damage to the leads that may be caused by bending the flexible circuit substrate during the subsequent boarding operation. However, the current flexible circuit substrate does not have a mechanism that can directly identify the predetermined bending area. In the packaging process, when the operator temporarily winds and bends the flexible circuit substrate, it is impossible to determine whether to avoid the predetermined bending area. Therefore, the strength of the leads in this area may be weakened in advance, which may lead to the lead in the predetermined bending area being easily broken after the subsequent boarding operation. In addition, when attaching an additional component (such as a heat sink, a reinforcement plate, etc.) to the thin film flip-chip packaging structure, there is no mechanism that can directly identify the predetermined bending area, so it is impossible to determine whether the additional component avoids the predetermined bending area. Therefore, the additional component may hinder the bending during the boarding operation.

Summary of the invention

The present disclosure is directed to a flexible circuit substrate, wherein a marking pattern for identification is arranged at a predetermined bending area of the flexible substrate to improve the yield rate of subsequent processes.

According to an embodiment of the present disclosure, a flexible circuit substrate includes a flexible substrate, a plurality of leads, and a plurality of marking patterns. The flexible substrate includes a packaging area and two transmission areas located on opposite sides of the packaging area, the two transmission areas and the packaging area are arranged adjacent to each other in the width direction of the flexible substrate, the packaging area includes a chip bonding area and at least one external connection end, and the flexible substrate is defined with a predetermined bending area, the predetermined bending area extends along the width direction and is located between the chip bonding area and the at least one external connection end. A plurality of leads are arranged in the packaging area and extend from the chip bonding area to the external connection end respectively. A plurality of marking patterns are arranged in the predetermined bending area, wherein the two opposite ends of each marking pattern are aligned with the boundary of the predetermined bending area.

According to an embodiment of the present disclosure, a thin film flip-chip packaging structure includes the aforementioned flexible circuit substrate and a chip, wherein the chip is disposed in a chip bonding region of the flexible substrate and is electrically connected to a plurality of leads.

Based on the above, the present disclosure defines the boundary of the predetermined bending zone by setting a plurality of marking patterns in the predetermined bending zone of the flexible circuit substrate, and the two opposite ends of each marking pattern are aligned with the boundary of the predetermined bending zone. In this way, in the process, the image capture module or the operator can directly identify the boundary position of the predetermined bending zone through the marking pattern, and then determine the range of the predetermined bending zone. When the operator is performing operations such as winding and bending in the process, the predetermined bending zone can be effectively avoided to reduce damage to the leads in this area; or when attaching additional components (such as heat dissipation patches, reinforcement plates, etc.) to the flexible circuit substrate, the predetermined bending zone can also be effectively avoided to prevent the additional components from obstructing the subsequent bending thin film flip-chip packaging structure. Therefore, the yield of the flexible circuit substrate and the thin film flip-chip packaging structure using the same can be improved during manufacturing and subsequent applications.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure.

FIG1 is a top view schematically showing a thin film flip chip packaging structure according to an embodiment of the present disclosure;

FIG2 is a perspective schematic diagram of a thin film flip chip packaging structure according to an embodiment of the present disclosure;

FIG3 is a partial enlarged schematic diagram of a flexible circuit substrate according to an embodiment of the present disclosure;

FIG4 is a partially enlarged schematic diagram of a flexible circuit substrate according to another embodiment of the present disclosure;

FIG5 is a partial enlarged schematic diagram of a flexible circuit substrate according to another embodiment of the present disclosure;

6A to 6C are schematic diagrams of usage scenarios of thin film flip chip packaging structures according to different embodiments of the present disclosure.

Description of Figure Numbers

10, 10a, 10b: Display devices

100: Thin film flip chip packaging structure

110: Flexible circuit substrate

111: Flexible substrate

112: Transmission hole

116: External connection terminal

120: Chip

122: Bump

130: Molding compound

140: Lead

140a: Outermost lead

145: Metal layer

150: Solder mask

152: Opening

160, 160a, 160a', 160b, 160b1, 160b2, 160c, 160d, 160e: marking pattern 170: predetermined cutting line

200: Circuit board

300: Display panel

C1: Chip bonding area

D1: Width direction

P1: Packaging area

R, R1, R2: Predetermined bending area

T1: Transmission area

DETAILED DESCRIPTION

The aforementioned and other technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In addition, in the following embodiments, the same or similar components will be labeled with the same or similar numbers.

FIG. 1 is a schematic top view of a thin film flip-chip packaging structure according to an embodiment of the present disclosure. FIG. 2 is a schematic perspective view of a thin film flip-chip packaging structure according to an embodiment of the present disclosure. FIG. 3 is a partially enlarged schematic view of a flexible circuit substrate according to an embodiment of the present disclosure. In FIG. 1 and FIG. 3, the chip, solder mask or molding compound are shown in a perspective manner. Please refer to FIG. 1 and FIG. 2 simultaneously. In some embodiments, the thin film flip-chip packaging structure 100 includes a flexible circuit substrate 110 and a chip 120 disposed on the flexible circuit substrate 110. In some embodiments, the flexible circuit substrate 110 includes a flexible substrate 111, a plurality of leads 140 and a plurality of marking patterns 160. In one embodiment, the flexible substrate 111 may include a packaging area P1 and two transmission areas T1 located on opposite sides of the packaging area P1. The boundary of the packaging area P1 may be defined by a predetermined cutting line 170. Specifically, after the packaging process is completed, the flexible circuit substrate 110 may be cut along the predetermined cutting line 170 by a cutting device to form a plurality of thin film flip-chip packaging structures 100 independent of each other. The transmission area T1 is located at two opposite sides of the packaging area P1 and has a plurality of transmission holes 112 for cooperating with the transmission mechanism on the machine to drive the flexible circuit substrate 110 to move. The two transmission areas T1 and the packaging area P1 are arranged adjacent to each other in the width direction D1 of the flexible substrate 111. Specifically, the packaging area P1 can be located between the two transmission areas T1 in the width direction D1.

In some embodiments, the packaging area P1 of the flexible substrate 111 may include at least one external connection terminal 116 and a chip bonding area C1 for the chip 120 to be disposed. In this embodiment, the packaging area P1 may include two external connection terminals 116 opposite to each other, and the chip bonding area C1 is located between the two external connection terminals 116, that is, the chip 120 may be disposed between the two external connection terminals 116 opposite to each other. The flexible substrate 111 is defined with a predetermined bending area R, which extends along the width direction D1 and is located between the chip bonding area C1 and the external connection terminal 116. The predetermined bending area R refers to the area where the flexible substrate 111 will be bent in the subsequent process (bending at the predetermined bending area R as shown in FIG. 2). In this embodiment, the flexible substrate 111 may include two predetermined bending areas R1 and R2, which are respectively located between the chip bonding area C1 and the two external connection terminals 116. In other embodiments, the number of the predetermined bending area R may also be one, and the present disclosure is not limited thereto.

In some embodiments, a plurality of leads 140 are disposed in the packaging area P1 and extend from the chip bonding area C1 to the external connection terminal 116, respectively, and the plurality of leads 140 are arranged adjacently along the width direction D1. In this embodiment, for example, the plurality of bumps 122 of the chip 120 can be electrically connected to the leads 140 located in the chip bonding area C1 via a flip chip bonding technique. In some embodiments, the flexible circuit substrate 110 can further include a solder resist layer 150, which partially covers the leads 140 to prevent the leads 140 from being contaminated or broken or bridged. In more detail, the solder resist layer 150 can include an opening 152 exposing the chip bonding area C1, so that the chip 120 can be disposed in the chip bonding area C1 and electrically connected to the leads 140 located in the chip bonding area C1 via the opening 152. In some embodiments, the solder resist layer 150 can also expose the external connection terminal 116, so that the leads 140 of the external connection terminal 116 can be electrically connected to other devices. In addition, a molding material 130 such as underfill may be filled between the chip 120 and the flexible substrate 111 . In one embodiment, the molding material 130 may not only be filled between the chip 120 and the flexible substrate 111 , but may also cover the side surface of the chip 120 .

In this embodiment, the material of the flexible substrate 111 may include polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polycarbonate (PC) or other suitable flexible insulating materials. In this embodiment, the material of the lead 140 may include a metal material, such as copper.

Please refer to FIG. 1 . In some embodiments, a plurality of marking patterns 160 are disposed in a predetermined bending zone R, wherein two opposite ends of each marking pattern 160 are aligned with the boundary of the predetermined bending zone R. In some embodiments, the marking pattern 160 may include marking patterns 160a, 160b, and 160c, wherein the marking patterns 160a and 160b may be located in two transmission zones T1 and in the predetermined bending zone R. In other words, the marking patterns 160a and 160b may be located in the region where the two transmission zones T1 intersect (overlap) with the predetermined bending zone R. The marking pattern 160c may be located in the packaging zone P1 and in the predetermined bending zone R. In other words, the marking pattern 160c may be located in the region where the packaging zone P1 intersects (overlaps) with the predetermined bending zone R.

Further, each marking pattern 160a may be a single pattern, and has two opposite ends that are respectively aligned with two opposite boundaries of the predetermined bending zone R in the vertical width direction D1 to define the boundary of the predetermined bending zone R. In the present embodiment, the marking pattern 160a is a long strip. However, in other embodiments, the marking pattern 160a may also be a concave shape, an I-shape, a square shape, a triangle, a polygon or other suitable shapes, which is not limited by the present disclosure. In the present embodiment, the flexible circuit substrate 110 may include two marking patterns 160a, which are respectively arranged in two transmission areas T1 opposite to each other. In this way, the image capture module (not shown) arranged above the flexible circuit substrate 110 can capture the image of the flexible circuit substrate 110, and can identify the boundary position of the predetermined bending zone R through the marking pattern 160a, and then determine the range of the predetermined bending zone R. By visually observing the marking pattern 160a, the operator can also directly identify the boundary position of the predetermined bending zone R and determine its range.

In one embodiment, referring to FIG. 3 , the marking pattern 160a′ is similar to the marking pattern 160a shown in FIG. 1 , and the main difference between the marking pattern 160a′ and the marking pattern 160a is located between the transmission hole 112 and the edge of the flexible substrate 111, while the marking pattern 160a is located between the transmission hole 112 and the packaging area P1. However, the positions of the marking pattern 160a and the marking pattern 160a′ can be adjusted most appropriately according to the space available for arrangement in the transmission area T1, and the present disclosure is not limited thereto.

Please continue to refer to Figure 1. In one embodiment, a set of marking patterns 160b may include two separate marking patterns 160b1 and 160b2, which may be respectively arranged on opposite sides of the predetermined bending zone R in the vertical width direction D1, and one end of each marking pattern 160b1 and 160b2 may be aligned with the corresponding boundary of the predetermined bending zone R to define the boundary of the predetermined bending zone R. In this embodiment, the marking patterns 160b1 and 160b2 are square. However, in other embodiments, the marking patterns 160b1 and 160b2 may also be other suitable shapes, and the present disclosure is not limited to this. In this embodiment, the flexible circuit substrate 110 may include two sets of marking patterns 160b, which are respectively arranged in two transmission zones T1 opposite to each other. In this way, the image capture module or the operator can directly identify the boundary position of the predetermined bending zone R through the marking pattern 160b, and then determine the range of the predetermined bending zone R.

In one embodiment, the marking pattern 160c is located in the packaging area P1, and each marking pattern 160c may be a single pattern, and has two opposite ends respectively aligned with two opposite boundaries of the predetermined bending area R in the vertical width direction D1 to define the boundary of the predetermined bending area R. In the present embodiment, the marking pattern 160c is a concave shape or an inverted concave shape, and the two opposite ends of the marking pattern 160c are at least partially exposed outside the solder resist layer 150. However, in other embodiments, the marking pattern 160c may also be other suitable shapes, and the marking pattern 160c may also be completely covered by the solder resist layer 150, that is, the end of the marking pattern 160c may not be exposed outside the solder resist layer 150, and the present disclosure is not limited to this. In the present embodiment, the flexible circuit substrate 110 may include two marking patterns 160c, which are respectively arranged on opposite sides of the packaging area P1 in the width direction D1. Thus, after the flexible circuit substrate 110 is cut into pieces (parts outside the packaging area P1 are removed), the image capture module or the operator can still identify the boundary position of the predetermined bending area R through the marking pattern 160c located in the packaging area P1, and further determine the range of the predetermined bending area R.

It should be noted that in the present embodiment, the flexible circuit substrate 110 shows three different marking patterns 160a, 160b, and 160c for illustrative purposes. However, those skilled in the art should understand that the flexible circuit substrate 110 may include only a few of the above-mentioned marking patterns 160a, 160b, and 160c, or may include more marking patterns 160 in different forms and positions, as long as the marking pattern 160 is located in the predetermined bending region R, and its end is aligned with the boundary of the predetermined bending region R for identifying the boundary position of the predetermined bending region R. In addition, the marking patterns 160a, 160b, and 160c and the lead 140 are formed of the same material (e.g., metal such as copper). Specifically, the marking pattern 160 and the lead 140 are patterned metal layers formed using the same patterning process.

FIG4 is a partially enlarged schematic diagram of a flexible circuit substrate according to another embodiment of the present disclosure. In FIG4, the solder resist layer is shown in a perspective manner. This embodiment uses the component numbers and part of the content of the previous embodiment, wherein the same number is used to represent the same or similar components, and the description of the same technical content is omitted.

In the present embodiment, the two transmission areas T1 located on opposite sides of the flexible substrate 111 are covered by the metal layer 145, and the marking pattern 160d is a hollow pattern located in the metal layer 145. In other words, the metal layer 145 covering the transmission area T1 may have a slot located in the predetermined bending area R, and the slot is the marking pattern 160d. In the present embodiment, each marking pattern 160d may be a single pattern, and has two opposite ends respectively aligned with the two opposite boundaries of the predetermined bending area R in the vertical width direction D1 to define the boundary of the predetermined bending area R. In the present embodiment, the marking pattern 160d is a long strip of slots. However, the present disclosure does not limit the shape and form of the slotted marking pattern 160d, as long as the end of the marking pattern 160d is aligned with the boundary of the predetermined bending area R, so as to facilitate the identification of the boundary position of the predetermined bending area R. In one embodiment, the metal layer 145 and the lead 140 may be formed of the same material and formed in the same patterning process, but the present disclosure is not limited thereto.

FIG5 is a partially enlarged schematic diagram of a flexible circuit substrate according to another embodiment of the present disclosure. In FIG5, the solder resist layer is shown in a perspective manner. This embodiment uses the component numbers and part of the content of the previous embodiment, wherein the same number is used to represent the same or similar components, and the description of the same technical content is omitted.

In the present embodiment, the marking pattern 160e is located in the packaging area P1 defined by the cutting line 170, and the marking pattern 160e is a hollow pattern located in the lead 140. In other words, the lead 140 may have a slot located in the predetermined bending area R, and this slot is the marking pattern 160e of the present embodiment. In detail, in the present embodiment, the marking pattern 160e is a hollow pattern located in the outermost lead 140a of the plurality of leads 140 arranged adjacently along the width direction D1. However, the present disclosure does not limit the position and number of the leads 140 having the slotted marking pattern 160e. In some embodiments, the outermost leads 140a on both sides have the marking pattern 160e, or, in other embodiments, the lead 140 having the marking pattern 160e is located in the middle area of the plurality of leads 140 arranged adjacently instead of being located at the outermost side. In the present embodiment, the marking pattern 160e may be a single pattern, and has two opposite ends respectively aligned with two opposite boundaries of the predetermined bending zone R in the vertical width direction D1, so as to define the boundary of the predetermined bending zone R. In the present embodiment, the marking pattern 160e is a long strip slot, but the present disclosure does not limit the shape and form of the slotted marking pattern 160e, as long as the end of the marking pattern 160e is aligned with the boundary of the predetermined bending zone R, so as to facilitate the identification of the boundary position of the predetermined bending zone R. In addition, in the present embodiment, the marking pattern 160e may be completely covered by the solder resist layer 150, that is, the end of the marking pattern 160e may not be exposed outside the solder resist layer 150, and the present disclosure does not limit this.

FIG6A to FIG6C are schematic diagrams of the use scenarios of the thin film flip-chip packaging structure according to different embodiments of the present disclosure. It must be noted here that the aforementioned thin film flip-chip packaging structure can be used to electrically connect various device components. The embodiments of FIG6A to FIG6C are only used to illustrate several possible connection forms, but the present disclosure does not limit the application of the thin film flip-chip packaging structure. This embodiment uses the component numbers and part of the content of the aforementioned embodiment, wherein the same numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

6A to 6C, the thin film flip-chip packaging structure 100 can be applied to the display devices 10, 10a, 10b. Thus, the display devices 10, 10a, 10b may include the thin film flip-chip packaging structure 100, the circuit board 200, and the display panel 300. The thin film flip-chip packaging structure 100 may be connected to the circuit board 200 and the display panel 300 respectively through two opposite external connection terminals 116 of the packaging area P1 of the flexible circuit substrate 110, and the circuit board 200 may be bent so as to be arranged parallel to the back of the display panel 300 to reduce the frame width of the display device 10. In one embodiment, the chip 120 may include a driving integrated circuit (IC) chip of the display devices 10, 10a, 10b, which may be bonded to the flexible circuit substrate 110. The display panel 300 may include a liquid crystal panel, an organic light emitting diode panel, or other suitable display panels. The circuit board 200 may include a rigid printed circuit board (PCB).

6A , in the display device 10 of the present embodiment, the two external connection terminals 116 connected to the circuit board 200 and the display panel 300 respectively and the chip 120 are located on the same surface of the flexible circuit substrate 110. In the present embodiment, after the flexible circuit substrate 110 is bent once, that is, the predetermined bending area R between the external connection terminal 116 connected to the display panel 300 and the chip 120 is bent, both the chip 120 and the circuit board 200 are arranged parallel to the back of the display panel 300. Therefore, according to the configuration of the thin film flip chip packaging structure 100 in the display device 10, the flexible circuit substrate 110 of the present embodiment can define only one predetermined bending area R, that is, the marking pattern 160 of the flexible circuit substrate 110 can be arranged only in one predetermined bending area R.

Referring to FIG. 6B , in the display device 10a of the present embodiment, two external connection terminals 116 and the chip 120 respectively connected to the circuit board 200 and the display panel 300 are located on the same surface of the flexible circuit substrate 110. In the present embodiment, after the flexible circuit substrate 110 is bent once, i.e., the predetermined bending area R1 between the external connection terminal 116 connected to the display panel 300 and the chip 120 is bent, the circuit board 200 connected to the other external connection terminal 116 and the back surface of the display panel 300 are in a vertical relationship. The flexible circuit substrate 110 needs to be bent once more, i.e., the predetermined bending area R2 between the external connection terminal 116 connected to the circuit board 200 and the chip 120 is bent, so that the circuit board 200 is arranged parallel to the back surface of the display panel 300. Therefore, according to the configuration of the thin film flip chip packaging structure 100 in the display device 10a, the flexible circuit substrate 110 of this embodiment can define two predetermined bending regions R1 and R2. That is, the marking pattern 160 of the flexible circuit substrate 110 can be disposed in the two predetermined bending regions R1 and R2.

Please refer to FIG. 6C . In the display device 10b of the present embodiment, two external connection terminals 116 and the chip 120 respectively connected to the circuit board 200 and the display panel 300 are respectively located on two opposite surfaces of the flexible circuit substrate 110. Specifically, a plurality of leads 140 may extend outward from the chip bonding area C1 located on one surface of the flexible circuit substrate 110, and extend to the external connection terminals 116 located on the other surface through conductive through holes (not shown) and leads (not shown) located on the other surface, so as to be used for external electrical connection. Similar to the embodiment of FIG. 6B , the flexible circuit substrate 110 of the present embodiment needs to be bent twice so that the circuit board 200 can be arranged parallel to the back of the display panel 300. Therefore, according to the configuration method of the thin film flip chip packaging structure 100 in the display device 10b, the flexible circuit substrate 110 of the present embodiment can define two predetermined bending areas R1 and R2, that is, the marking pattern 160 of the flexible circuit substrate 110 can be arranged in the two predetermined bending areas R1 and R2. The above embodiments are merely used for illustration, and the present disclosure does not limit the configuration of the thin film flip chip packaging structure 100 in the display device.

In summary, the present disclosure defines the boundary of the predetermined bending zone by setting a plurality of marking patterns in the predetermined bending zone of the flexible circuit substrate, and aligning the two opposite ends of each marking pattern with the boundary of the predetermined bending zone. In this way, during the process, the image capture module or the operator can directly identify the boundary position of the predetermined bending zone through the marking pattern, and then determine the range of the predetermined bending zone. When the operator is performing operations such as winding and bending in the process, the predetermined bending zone can be effectively avoided to reduce damage to the leads in this area; or when attaching additional components (such as heat dissipation patches, reinforcement plates, etc.) to the flexible circuit substrate, the predetermined bending zone can also be effectively avoided to prevent the additional components from obstructing the subsequent bending thin film flip-chip packaging structure. Therefore, the yield of the flexible circuit substrate and the thin film flip-chip packaging structure using the same can be improved during manufacturing and subsequent applications.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims (10)

1. A flexible circuit substrate, comprising: A flexible substrate, comprising a packaging area and two transmission areas located on opposite sides of the packaging area, wherein the two transmission areas and the packaging area are arranged adjacent to each other in the width direction of the flexible substrate, wherein the packaging area comprises a chip bonding area and an external connection end, and wherein the flexible substrate is defined with a predetermined bending area, wherein the predetermined bending area extends along the width direction and is located between the chip bonding area and the external connection end; A plurality of leads are disposed in the packaging area and extend from the chip bonding area to the external connection end respectively; and A plurality of marking patterns are arranged in the predetermined bending zone, wherein two opposite ends of each of the plurality of marking patterns are aligned with the boundary of the predetermined bending zone. 2 . The flexible circuit substrate according to claim 1 , wherein the plurality of marking patterns are respectively located in the two transmission areas. 3 . The flexible circuit substrate according to claim 2 , wherein the two transmission areas are covered by a metal layer, and the plurality of marking patterns are hollow patterns located in the metal layer. 4 . The flexible circuit substrate according to claim 2 , wherein the plurality of marking patterns and the plurality of leads are formed of the same material. 5 . The flexible circuit substrate according to claim 1 , wherein the plurality of marking patterns are located in the packaging area. 6 . The flexible circuit substrate according to claim 5 , wherein the plurality of marking patterns and the plurality of leads are formed of the same material. 7 . The flexible circuit substrate according to claim 5 , wherein the plurality of marking patterns are hollow patterns located on the plurality of leads. 8. The flexible circuit substrate according to claim 5, further comprising a solder resist layer, which is disposed in the packaging area and exposes the chip bonding area and the external connection terminal, wherein the two opposite ends of each of the plurality of marking patterns are at least partially exposed outside the solder resist layer. 9 . The flexible circuit substrate according to claim 1 , wherein a boundary of the packaging area is defined by a predetermined cutting line. 10. A thin film flip chip packaging structure, comprising: The flexible circuit substrate according to any one of claims 1 to 9; and The chip is disposed in the chip bonding area of the flexible substrate and is electrically connected to the plurality of leads.