CN118268702B - Adjusting device and laser processing equipment - Google Patents
Adjusting device and laser processing equipment Download PDFInfo
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- CN118268702B CN118268702B CN202410703938.3A CN202410703938A CN118268702B CN 118268702 B CN118268702 B CN 118268702B CN 202410703938 A CN202410703938 A CN 202410703938A CN 118268702 B CN118268702 B CN 118268702B
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- 239000011521 glass Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000004048 modification Effects 0.000 abstract description 15
- 238000012986 modification Methods 0.000 abstract description 15
- 238000009792 diffusion process Methods 0.000 abstract description 10
- 238000009434 installation Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 230000010411 postconditioning Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses an adjusting device and laser processing equipment, which relates to the technical field of laser processing, wherein the adjusting device is applied to the laser processing equipment, the laser processing equipment comprises a wave plate for laser to pass through, the adjusting device comprises a mounting seat and a slide holder, the mounting seat comprises a seat body, an elastic module and an adjusting module, the elastic module is limited and arranged on the seat body, the adjusting module is movably arranged on the seat body, the slide holder is elastically connected with the seat body through the elastic module, an adjusting gap is formed between the slide holder and the seat body, and the adjusting module passes through the adjusting gap and is movably abutted with the slide holder; the size of the adjusting gap is adjusted through the adjusting module, so that the position of the slide holder relative to the mounting seat is adjusted. The invention aims to modulate the passing laser through the adjusting device so as to ensure that the diffusion direction of the laser modification dotting is consistent with the laser moving direction and improve the processing precision.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to an adjusting device and laser processing equipment.
Background
The laser internal modification cutting technology is a technology that laser is focused into a material, a plurality of modification layers are formed after laser scanning, and spots are formed on the modification layers, so that the material is promoted to be naturally cracked along a preset cutting direction through a plurality of modification points. The MEMS silicon wafer subjected to laser internal modification cutting can directly realize the separation between the crystal grains, and has clean and dry property, extremely small cutting loss, and the preset cutting path of the wafer can be reduced, and the number of single crystal grains can be increased.
In actual processing, the wafer placement plane and the incident laser cannot be completely vertical, and meanwhile, the straightness of the laser cannot be deviated due to equipment installation errors, so that the laser focus focuses on the energy diffusion directions of the product internal modification dotting in multiple directions, the dotting energy can be dispersed (larger laser power is required), and the dotting energy diffusion in the direction which is not parallel to the dotting connecting line can induce the serial tortoise crack to bend, so that the overall processing precision is poor.
Disclosure of Invention
The invention mainly aims to provide an adjusting device and laser processing equipment, and aims to modulate penetrating laser through the adjusting device so as to ensure that the diffusion direction of laser modification dotting is consistent with the laser moving direction and improve the processing precision.
In order to achieve the above object, the present invention proposes an adjusting device applied to a laser processing apparatus including a wave plate through which laser light passes, the adjusting device comprising:
The mounting seat comprises a seat body, an elastic module and an adjusting module, wherein the elastic module is limited and arranged on the seat body, and the adjusting module is movably arranged on the seat body; and
The slide holder is elastically connected to the base body through the elastic module, an adjusting gap is formed between the slide holder and the base body, the adjusting module penetrates through the adjusting gap and is movably abutted to the slide holder, and the slide holder is used for loading a wave plate;
the size of the adjusting gap is adjusted through the adjusting module, so that the position of the slide holder relative to the mounting seat is adjusted.
In an embodiment, the seat body is provided with a plurality of adjusting holes, and the adjusting holes are communicated with the adjusting gap;
The adjusting module comprises a plurality of adjusting columns, each adjusting column is arranged in one adjusting hole and is connected with the base body in a spiral mode, and the adjusting columns penetrate through the adjusting gaps and are abutted to the slide holder.
In an embodiment, the mounting seat further comprises a plurality of screw sleeves connected to the seat body, each screw sleeve is arranged in one adjusting hole, the screw sleeves form screw holes, and first threads are arranged on the inner walls of the screw holes;
the outer wall of the adjusting column is provided with a second thread, and the adjusting column is arranged in the screw hole so that the first thread and the second thread are in fit and screwed connection.
In an embodiment, the seat body includes a first section and a second section connected to each other, and an extending direction of the first section and the second section is perpendicular to each other;
The adjusting module comprises three adjusting columns, one adjusting column is arranged at the joint of the first section and the second section, the other adjusting column is arranged at the end, away from the second section, of the first section, and the other adjusting column is arranged at the end, away from the first section, of the second section.
In an embodiment, one end of the adjusting column is provided with an adjusting ball head, the adjusting ball head is abutted against the carrying platform, one side of the carrying platform facing the mounting seat is provided with an adjusting groove, the inner wall of the adjusting groove is a spherical surface or a conical surface, and the adjusting ball head is abutted against the inner wall of the adjusting groove;
or, one end of the adjusting column is provided with an adjusting ball head, the slide holder is provided with two guide rods, the two guide rods are arranged in parallel and at intervals, and the adjusting ball head is positioned between the two guide rods and is abutted to the two guide rods.
In one embodiment, the base is provided with a plurality of through holes, and the through holes are communicated with the adjusting gap;
The elastic module comprises a plurality of elastic pieces, each elastic piece is arranged in one through hole, one end of each elastic piece is limited on the base body, and the other end of each elastic piece is connected with the slide holder.
In one embodiment, the stage comprises:
The table body is elastically connected to the seat body, and the adjusting module is abutted to the table body; the platform body is formed with a placing cavity;
The slide glass frame is arranged in the placing cavity and is used for loading the wave plate; and
The positioning knob is movably arranged on the platform body and is used for fixing the slide frame.
The present invention also proposes a laser processing apparatus including:
A laser;
An adjustment device as described above; and
A focusing device;
the laser generated by the laser sequentially passes through the adjusting device and the focusing device.
In an embodiment, the focusing device comprises:
a focusing mirror, wherein laser generated by the laser enters the focusing mirror through the adjusting device; and
The distance measuring sensor is arranged at intervals with the focusing mirror, and the distance measuring sensor is used for acquiring the height between the focusing mirror and the workpiece.
In one embodiment, the adjusting device further comprises a plurality of driving members, wherein the driving end of each driving member is connected to one adjusting column in the adjusting device;
the laser processing apparatus further includes a controller electrically connected to the ranging sensor and the plurality of driving members.
The adjusting device is used for adjusting the position of the wave plate, the adjusting device is applied to laser processing equipment, the laser processing equipment comprises the wave plate for allowing laser to pass through, the adjusting device comprises an installation seat and a carrying platform, the installation seat comprises a seat body, an elastic module and an adjusting module, the adjusting module is movably arranged on the seat body, meanwhile, one end of the elastic module is limited on the seat body, the other end of the elastic module is also connected with the carrying platform, so that the seat body is elastically connected with the carrying platform, the carrying platform is used for loading the wave plate, an adjusting gap is formed between the carrying platform and the seat body, the adjusting module can penetrate through the adjusting gap and movably abut against the carrying platform, the size of the adjusting gap is adjusted through the adjusting module, the position of the carrying platform relative to the installation seat is adjusted, and therefore the position of the wave plate is adjusted, the adjusting device can modulate laser passing through the wave plate, the diffusion direction of laser dotting is consistent with the laser moving direction, and processing precision is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an adjusting device according to an embodiment of the invention;
FIG. 2 is an exploded view of an adjusting device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a mounting base according to an embodiment of the present invention;
FIG. 4 is a schematic view of a seat according to an embodiment of the present invention;
FIG. 5 is a schematic view of a structure of a carrier according to an embodiment of the invention;
FIG. 6 is a schematic view of a laser processing apparatus according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a conventional modified dotting;
FIG. 8 is a schematic diagram of a prior art tandem crack generated after modification dotting;
FIG. 9 is a schematic diagram of the modified dotting after the adjustment of the adjusting device of the present invention;
FIG. 10 is a schematic diagram of a tandem crack generated by post-conditioning modified dotting with the conditioning apparatus of the present invention.
Reference numerals illustrate:
100. An adjusting device; 1. a mounting base; 11. a base; 11a, avoidance space; 111. a first section; 112. a second section; 113. an adjustment aperture; 114. a via hole; 115. a limit groove; 12. an elastic module; 121. an elastic member; 1211. a limit column; 13. an adjusting module; 13a, adjusting the ball head; 131. a first adjustment column; 132. a second adjustment column; 133. a third adjustment column; 14. a spiral sleeve; 141. an adjustment tank; 2. a slide holder; 2a, adjusting the gap; 21. a table body; 211. a placement cavity; 212. an adjusting groove; 213. a guide bar; 22. a slide holder; 23. a positioning knob; 300. a laser processing device; 301. a laser; 302. a focusing device; 3021. a focusing mirror; 3022. a ranging sensor; 3023. a reflecting mirror; 303. and a controller.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
In the field of laser micromachining, especially when being used for cutting light-transmitting materials such as chips, wafers, etc., focus the focus of laser inside the product to carry out the modification dotting to the product inside, however when current laser directly carries out the modification dotting to the product, the modification point in the product can produce the energy diffusion phenomenon, not only can disperse energy, causes the power deficiency when laser dotting, and the energy in the modification point can be to three to four direction diffusion simultaneously to can produce the bending when a plurality of follow-up modification points induce to form the serial crack (as shown in fig. 7 and 8), greatly reduced laser cutting precision.
Based on the background, referring to fig. 1 to 6, the invention provides an adjusting device 100, which is applied to a laser processing device 300, wherein the laser processing device 300 comprises a wave plate for laser to pass through, the adjusting device 100 comprises a mounting seat 1 and a slide holder 2, the mounting seat 1 comprises a seat 11, an elastic module 12 and an adjusting module 13, the elastic module 12 is limited on the seat 11, the adjusting module 13 is movably arranged on the seat 11, the slide holder 2 is elastically connected to the seat 11 through the elastic module 12, an adjusting gap 2a is formed between the slide holder 2 and the seat 11, the adjusting module 13 passes through the adjusting gap 2a and is movably abutted with the slide holder 2, and the slide holder 2 is used for loading the wave plate; the adjusting module 13 adjusts the size of the adjusting gap 2a, so as to adjust the position of the slide holder 2 relative to the mounting seat 1.
In this embodiment, as shown in fig. 6, the adjusting device 100 is applied to a laser processing apparatus 300, where the laser processing apparatus 300 includes, but is not limited to, a laser welding apparatus, a laser engraving and cutting apparatus, a surface modification apparatus, a laser marking apparatus, a laser drilling and micro-processing apparatus, and the laser processing apparatus 300 includes a wave plate for modulating the light of the laser, the wave plate is an optical phase retarder, and is made of a birefringent material, and generates phase shift of two mutually orthogonal polarization components passing through the wave plate, and can be used to adjust the polarization state of the light beam, and a common wave plate is made of quartz crystal; meanwhile, the laser processing apparatus 300 may be provided with other types of optical devices, such as a polarizer, an optical lens, a dimming sheet, etc., which are not limited herein.
In this embodiment, as shown in fig. 1 and 2, the adjusting device 100 includes a mounting base 1 and a slide holder 2, where the slide holder 2 is used for loading a wave plate, for example, the slide holder 2 is provided with a detachable slide holder 22, and the slide holder 22 is used for mounting the wave plate, and can be optionally detached and replaced, so as to improve convenience in use, the mounting base 1 includes a base 11, an elastic module 12 and an adjusting module 13, the base 11 is a structural supporting component of the adjusting device 100, the base 11 can be a structure such as a mounting base, a mounting rack, and a base, the base 11 is used for mounting the elastic module 12 and the adjusting module 13, and is used for being connected with the slide holder 2, meanwhile, the base 11 is also provided with a mounting hole, and the mounting hole is used for being connected with an external mounting platform through a bolt, so as to optionally arrange the position of the adjusting device 100, and flexibly adjust the optical path of laser.
Specifically, the elastic module 12 is limited to be arranged on the base 11, for example, the elastic module 12 is in a tension spring structure, one end of the elastic module 12 is connected to the slide holder 2, the other end of the elastic module is connected to the base 11, the tension spring structure can apply tension force close to each other to the slide holder 2 and the base 11, of course, the elastic module 12 can also be in a compression spring structure, one end of the compression spring structure is connected to the slide holder 2, the other end of the compression spring structure is connected to the base 11, the compression spring structure can apply thrust away from each other to the slide holder 2 and the base 11, and the elastic module 12 is in a tension spring structure or a compression spring structure, so that the slide holder 2 and the base 11 are elastically connected, and the distance between the slide holder 2 and the base 11 is conveniently adjusted by the adjusting module 13.
Further, the adjusting module 13 is movably arranged on the base 11, and is abutted against one side of the slide holder 2 facing the base 11, the adjusting module 13 can be of a screw structure and is in spiral connection with the base 11, so that movement along the axial direction can be realized during rotation, the slide holder 2 is abutted against and pushed, the distance between the slide holder 2 and the base 11 is adjusted, and the adjusting module 13 can also be of a linear moving structure, such as a linear motor, and is abutted against the slide holder 2 and pushed against the slide holder 2 along the opposite placement direction of the slide holder 2 and the base 11.
It can be understood that an adjusting gap 2a is formed between the slide holder 2 and the base 11, the adjusting gap 2a is formed by an elastic module 12 and an adjusting module 13, for example, the elastic module 12 is of a tension spring structure, when the elastic module 12 pulls the base 11 and the slide holder 2 in a direction close to each other, the adjusting module 13 movably arranged on the base 11 can abut against the slide holder 2, so that the slide holder 2 and the base 11 are prevented from being mutually attached, and the adjusting gap 2a is formed between the base 11 and the slide holder 2.
Meanwhile, the adjusting module 13 passes through the adjusting gap 2a, under the action of elastic tension of the elastic module 12, the adjusting module 13 is always abutted against the slide holder 2, and the position of the adjusting module 13 relative to the slide holder 2 can be changed by enabling the adjusting module 13 to move relative to the seat 11, such as when the adjusting module 13 rotates spirally relative to the seat 11, so that the size of the adjusting gap 2a is changed, the position of the slide holder 2 relative to the seat 11 is adjusted, and the adjustment of the position of a wave plate on the slide holder 2 is realized.
According to the technical scheme, the adjusting device 100 is used for adjusting the position of the wave plate, the adjusting device 100 is applied to the laser processing equipment 300, the laser processing equipment 300 comprises the wave plate for laser to pass through, the adjusting device 100 comprises an installation seat 1 and a slide holder 2, the installation seat 1 comprises a seat body 11, an elastic module 12 and an adjusting module 13, the adjusting module 13 is movably arranged on the seat body 11, meanwhile, one end of the elastic module 12 is limited on the seat body 11, the other end of the elastic module 12 is also connected with the slide holder 2, so that the seat body 11 is elastically connected with the slide holder 2, the slide holder 2 is used for loading the wave plate, an adjusting gap 2a is formed between the slide holder 2 and the seat body 11, the adjusting module 13 can penetrate through the adjusting gap 2a and is movably abutted to the slide holder 2, the position of the slide holder 2 relative to the installation seat 1, so that the position of the wave plate is adjusted, the position of the wave plate is movably arranged, the adjusting module 13, the laser is effectively focused on the inside of a product, the energy diffusion direction of a modified point is ensured to be more consistent with the energy diffusion direction of the modified point, namely, the energy diffusion direction of the modified point is improved in a straight line direction, and the quality is improved in a series connection line figure 9, the quality is improved, and the quality of the line is improved, and the quality is shown in a figure, and the quality is better in a figure is shown in a figure, and the quality is better in the quality is shown in the figure, and is shown in the figure 10, and the quality is improved.
In one embodiment, as shown in fig. 1 to 4, the seat 11 is provided with a plurality of adjusting holes 113, and the adjusting holes 113 are communicated with the adjusting gap 2a; the adjusting module 13 includes a plurality of adjusting columns, each of which is disposed in an adjusting hole 113 and is spirally connected to the base 11, and the adjusting columns pass through the adjusting gap 2a and are abutted to the slide holder 2.
In this embodiment, the plurality of adjustment holes 113 formed in the base 11 are all disposed towards the stage 2, the plurality of adjustment holes 113 are disposed corresponding to the periphery of the stage 2 so as to avoid a wave plate located in the center of the stage 2, and ensure the smoothness of the laser path, meanwhile, each adjustment hole 113 is communicated with the adjustment gap 2a, the axis of each adjustment hole 113 is perpendicular to the adjustment gap 2a, and meanwhile, the adjustment module 13 further includes a plurality of adjustment columns, and each adjustment column is disposed in one adjustment hole 113.
It can be understood that the adjusting column is in spiral connection with the adjusting hole 113, for example, the outer wall of the adjusting column and the inner wall of the adjusting hole 113 are provided with threads, and the adjusting column can also move along the axial direction of the adjusting hole 113 and pass through the adjusting gap 2a to be abutted against the slide holder 2 when the adjusting column rotates relative to the adjusting hole 113 through the threaded connection of the adjusting column and the adjusting hole 113, and can keep the slide holder 2 and the seat 11 in a stable state under the action of the elastic module 12, and can change the position of the slide holder 2 relative to the seat 11 under the action of the abutting pushing of the adjusting column so as to accurately adjust the size of the adjusting gap 2a, thereby accurately adjusting the position of the wave plate.
In one embodiment, as shown in fig. 2, the mounting seat 1 further includes a plurality of screw sleeves 14 connected to the seat body 11, each screw sleeve 14 is disposed in an adjusting hole 113, the screw sleeve 14 forms a screw hole, and a first thread is disposed on an inner wall of the screw hole; the outer wall of the adjusting column is provided with a second thread, and the adjusting column is arranged in the screw hole so that the first thread and the second thread are matched and connected in a threaded manner.
In this embodiment, a spiral sleeve 14 is disposed in each adjusting hole 113, one end of the spiral sleeve 14 along the axial direction of the adjusting hole 113 is provided with an annular boss, the periphery of the base 11 at the adjusting hole 113 is provided with an annular groove for communicating with the adjusting hole 113, the annular boss is limited in the annular groove, so that the spiral sleeve 14 is limited in the adjusting hole 113, meanwhile, the mounting base 1 is further provided with a connecting key, the spiral sleeve 14 and the adjusting hole 113 are connected and fixed through the connecting key, and the fixing effect of the spiral sleeve 14 in the adjusting hole 113 is improved.
Further, the screw sleeve 14 forms a screw hole, the screw hole is communicated with the adjusting gap 2a, a first thread is arranged on the hole wall of the screw hole, a second thread is arranged on the outer wall of the adjusting column, the adjusting column is arranged in the screw hole, the first thread and the second thread are in screw connection, so that the adjusting column rotates relative to the screw sleeve 14 and the seat body 11, meanwhile, the screw sleeve 14 is further provided with an adjusting groove 141, the extending direction of the adjusting groove 141 is identical to the axis direction of the screw sleeve 14 and the axis direction of the adjusting hole 113, and the adjusting groove 141 is communicated with the adjusting hole 113 and the screw hole.
It will be appreciated that, to ensure the rigidity of the whole adjusting device 100 and improve the adjusting accuracy, the base 11 and the stage 2 are generally made of a material with a higher hardness, so that it is not convenient for such a material with a higher hardness to directly tap the threads thereon, that is, the difficulty of directly tapping the threads in the adjusting hole 113 is higher; the screw sleeve 14 is arranged on the basis of the application, the screw sleeve 14 is softer than the base 11 and the slide holder 2, the screw sleeve 14 can be directly tapped with a first thread in a screw hole of the screw sleeve 14 and can be directly arranged in the adjusting hole 113 to be connected with a second thread of an adjusting column, thereby effectively reducing the processing difficulty, improving the processing efficiency, and being convenient to install and replace, meanwhile, the screw sleeve 14 is also provided with the adjusting groove 141, and the inner diameter of the screw hole of the screw sleeve 14 can be changed through the contraction and the expansion of the adjusting groove 141, so that the screw sleeve 14 can be suitable for adjusting holes 113 with different sizes to be suitable for adjusting columns with different sizes, and the universality and the adaptability of the adjusting module 13 are improved.
In one embodiment, as shown in fig. 1 to 4, the base 11 includes a first section 111 and a second section 112 connected to each other, and an extending direction of the first section 111 and the second section 112 is perpendicular to each other; the adjusting module 13 comprises three adjusting columns, one is arranged at the joint of the first section 111 and the second section 112, the other is arranged at one end of the first section 111 far away from the second section 112, and the other is arranged at one end of the second section 112 far away from the first section 111.
In this embodiment, the extending directions of the first section 111 and the second section 112 are perpendicular, the first section 111 extends along the vertical direction, the second section 112 extends along the horizontal direction, and the first section 111 and the second section 112 are both located at the periphery of the stage 2, an avoidance space 11a is formed between the first section 111 and the second section 112, so that laser can pass through the avoidance space 11a and enter the wave plate, the adjusting module 13 includes three adjusting columns, one of the adjusting columns is disposed at the junction of the first section 111 and the second section 112, one adjusting column is disposed at one end of the first section 111 away from the second section 112, the other adjusting column is disposed at one end of the second section 112 away from the first section 111, and the three adjusting columns are abutted to the periphery of the stage 2.
It can be understood that the three adjusting columns can adjust six directions of the stage 2 in space, specifically, the adjusting column at one end of the first section 111 far away from the second section 112 is defined as a first adjusting column 131, the adjusting column at the joint of the first section 111 and the second section 112 is defined as a second adjusting column 132, the adjusting column at one end of the second section 112 far away from the first section 111 is defined as a third adjusting column 133, the second adjusting column 132 and the third adjusting column 133 are fixed to be stationary, the first adjusting column 131 is adjusted, the bottom of the stage 2 can be stationary, the top is close to or far away from the base 11, that is, the stage 2 and the wave plate are adjusted relative to the base 11 in the pitching direction, further, the first adjusting column 131 and the second adjusting column 132 are fixed to be stationary, the third adjusting column 133 is adjusted, so that one end of the stage 2, which is abutted against the first section 111, is fixed, one end of the stage 2, which is far away from the first section 111, is close to or far away from the base 11, that is, adjustment of the deflection directions of the stage 2 and the wave plate relative to the base 11 is realized, and after the second adjusting column 132 and the third adjusting column 133 are fixed, the rotation angles of the stage 2 and the wave plate in space can be changed by adjusting the second adjusting column 132, and through the three adjusting columns, the adjustment of the positions of the stage 2 and the wave plate in space can be realized, and the adjustment flexibility of the adjusting module 13 is effectively improved, so that the adjusting device 100 can modulate laser passing through the wave plate, and the debugging time, the debugging precision and the production efficiency are reduced.
In an embodiment, as shown in fig. 2 and 3, one end of the adjusting column is provided with an adjusting ball head 13a, the adjusting ball head 13a is abutted against the carrying platform 2, one side of the carrying platform 2 facing the mounting seat 1 is provided with an adjusting groove 212, the inner wall of the adjusting groove 212 is a spherical surface or a conical surface, and the adjusting ball head 13a is abutted against the inner wall of the adjusting groove 212;
or, one end of the adjusting column is provided with an adjusting ball 13a, the slide holder 2 is provided with two guide rods 213, the two guide rods 213 are arranged in parallel and at intervals, and the adjusting ball 13a is positioned between the two guide rods 213 and is abutted against the two guide rods 213.
In this embodiment, the adjusting cylindrical surface is provided with an adjusting ball head 13a towards one end of the slide holder 2, and the adjusting ball head 13a is abutted against the slide holder 2, the adjusting ball head 13a may be movably connected with an adjusting column, for example, the end of the adjusting column is provided with a circular groove, the adjusting ball head 13a is limited in the circular groove, and a part of the adjusting ball head protrudes out of the notch of the circular groove to be abutted against the slide holder 2, or the adjusting ball head 13a is fixedly connected with the adjusting column, which is not limited herein.
Meanwhile, the slide holder 2 is provided with an adjusting groove 212 and/or a guide rod 213 corresponding to the adjusting ball 13a, specifically, the adjusting groove 212 is arranged on one side of the slide holder 2 facing the seat 11, the inner wall of the adjusting groove 212 can be a spherical surface or a conical surface, and the adjusting ball 13a can be abutted against the inner wall of the adjusting groove 212; or, two parallel guide rods 213 are arranged at intervals on one side of the slide holder 2 facing the adjusting column, and the adjusting ball 13a is positioned between the two guide rods 213.
It can be understood that, by setting the adjusting groove 212 with a spherical or conical inner wall, when the adjusting ball 13a abuts against the adjusting groove 212 to adjust the slide holder 2, the adjusting column can maintain higher centering accuracy, that is, even if the axis of the adjusting column always coincides with the center point of the adjusting groove 212, the adjusting column is ensured to move along the axis direction thereof, thereby effectively improving the adjusting accuracy, meanwhile, two guide rods 213 disposed on the slide holder 2 have the same extending direction as the first section 111 or the second section 112 of the base 11, and by setting two guide rods 213 at parallel intervals and the same extending direction as the first end, when the first adjusting column 131 is adjusted, one end of the slide holder 2 abutting against the second section 112 is fixed relative to the second section 112, and one end of the slide holder 2 abutting against the first section 111 is close to or far away from the first section 111, that is, at this time, the slide holder 2 can be regarded as an axis about the second section 112 to perform pitching motion, and by setting two guide rods 213 in parallel intervals, thereby effectively improving the precision of the slide holder 2.
In one embodiment, as shown in fig. 2 and 4, the base 11 is provided with a plurality of through holes 114, and the through holes 114 are communicated with the adjusting gap 2a; the elastic module 12 includes a plurality of elastic members 121, each elastic member 121 is disposed in a through hole 114, one end of each elastic member 121 is limited on the base 11, and the other end of each elastic member 121 is connected to the stage 2.
It can be understood that the elastic module 12 includes a plurality of elastic members 121, and the elastic members 121 are tension springs, one end of each elastic member 121 is limited and connected to the base 11, and the other end of each elastic member 121 passes through a through hole 114 of the base 11 and the adjusting gap 2a and is connected with the slide holder 2, so as to realize elastic connection between the slide holder 2 and the base 11, meanwhile, a limiting groove 115 is provided on the base 11, the limiting groove 115 is communicated with the through hole 114, one end of the elastic member 121 is provided with a limiting post 1211, the limiting post 1211 is limited and arranged in the limiting groove 115, and the elastic member 121 can be directly limited on the base 11 through the limiting post 1211 and the limiting groove 115, thereby improving installation convenience and facilitating replacement of the elastic member 121.
In an embodiment, as shown in fig. 1,2 and 5, the slide holder 2 includes a holder body 21, a slide holder 22 and a positioning knob 23, the holder body 21 is elastically connected to the base body 11, the adjusting module 13 is abutted to the holder body 21, the holder body 21 is formed with a placement cavity 211, the slide holder 22 is disposed in the placement cavity 211, the slide holder 22 is used for loading a wave plate, the positioning knob 23 is movably disposed on the holder body 21, and the positioning knob 23 is used for fixing the slide holder 22.
In this embodiment, the stage body 21 is formed with a placement cavity 211, and the stage body 21 is provided with an entrance opening on a side facing the seat body 11, an exit opening is provided on a side facing away from the seat body 11, the entrance opening and the exit opening are communicated with the placement cavity 211, the slide holder 22 is disposed in the placement cavity 211, and the slide holder 22 is disposed corresponding to the entrance opening and the exit opening, simultaneously, two positioning knobs 23 are disposed on the stage body 21, specifically, the stage body 21 is provided with a guide hole communicating with the placement cavity 211, the positioning knobs 23 are in threaded connection with the guide hole, and one end of each positioning knob 23 extends into the placement cavity 211 to be abutted against the slide holder 22.
It will be appreciated that by rotating the positioning knob 23, the positioning knob 23 moves along the axial direction of the guide hole to abut against the slide holder 22, and at the same time, the moving directions of the two positioning knobs 23 are perpendicular, so that the two positioning knobs 23 can abut against the slide holder 22 from two directions and cooperate with the inner wall of the placement cavity 211 together to fix the position of the slide holder 22 and fix the position of the wave plate.
The present invention further proposes a laser processing apparatus 300, as shown in fig. 6, where the laser processing apparatus 300 includes a laser 301, the adjusting device 100 and the focusing device 302, and laser light generated by the laser 301 sequentially passes through the adjusting device 100 and the focusing device 302. The specific structure of the adjusting device 100 refers to the foregoing embodiments, and since the present laser processing apparatus 300 adopts all the technical solutions of all the foregoing embodiments, at least has all the beneficial effects brought by the technical solutions of the foregoing embodiments, which are not described in detail herein.
It will be appreciated that the laser processing apparatus 300 includes, but is not limited to, a laser welding apparatus, a laser engraving and cutting apparatus, a surface modifying apparatus, a laser marking apparatus, a laser drilling and micro-processing apparatus, etc., where the laser 301 is used to generate laser light, and the laser 301 may be a gas laser, a solid laser, a liquid laser or a semiconductor laser, which is not limited herein, and the laser light first passes through the adjusting device 100 to modulate optical properties of the laser light, such as phase, amplitude, polarization state, etc., and at the same time, the focal length of the laser light is adjusted in real time by the focusing device 302, so that the focal point of the laser beam can be always located on the surface of the product to be processed to adapt to the change of the surface thickness of the workpiece, thereby improving the processing precision and the processing effect of the laser light.
In an embodiment, as shown in fig. 6, the focusing device 302 includes a focusing mirror 3021 and a ranging sensor 3022, the laser light generated by the laser 301 enters the focusing mirror 3021 through the adjusting device 100, the ranging sensor 3022 is disposed at a distance from the focusing mirror 3021, and the ranging sensor 3022 is used for acquiring the height between the focusing mirror 3021 and the workpiece.
In this embodiment, the laser processing apparatus 300 is further provided with a moving platform, the moving platform has a working surface on which a workpiece to be processed is placed, the focusing device 302 includes a focusing mirror 3021 and a ranging sensor 3022, the mirror surface of the focusing mirror 3021 is parallel to the working surface, the laser beam passes through the focusing mirror 3021 in a direction perpendicular to the working surface after being modulated by the adjusting device 100, and irradiates the surface of the workpiece to be processed, the ranging sensor 3022 is disposed adjacent to the focusing mirror 3021, and the ranging sensor 3022 is used for collecting the height change condition of the surface of the workpiece to be processed on the moving platform.
It can be understood that when the laser beam is modulated by the adjusting device 100, the focal length of the laser beam is changed, so that the focal point of the laser beam can accurately fall onto the surface of the workpiece to be processed, and when the modulated focal point of the laser beam cannot accurately fall onto the surface of the workpiece to be processed, the focusing mirror 3021 performs secondary focusing on the laser beam, so that the focal point of the laser beam falls onto the surface of the workpiece to be processed, thereby improving the focusing capability of the laser beam and improving the precision of laser processing.
It can be appreciated that the ranging sensor 3022 is configured to collect height change data of a surface of a workpiece to be processed on the moving platform, and when the moving platform drives the workpiece to be processed to move horizontally in a lateral direction along a certain direction, the ranging sensor 3022 is turned on and collect height change data of the surface of the workpiece to be processed passing below the ranging sensor 3022 synchronously. The ranging sensor 3022 may be a laser ranging device, an ultrasonic ranging device, or an infrared ranging device, and is not limited herein. Taking a laser range finder as an example, when the range sensor 3022 emits a laser beam to the surface of the workpiece to be processed, the workpiece to be processed receives the laser beam and reflects it, the range sensor 3022 receives the reflected laser beam and calculates the time taken from the emission to the reception of the laser beam, and the thickness difference between the surface of the workpiece to be processed and the standard horizontal plane is measured by the time, so that the complete height change data of the surface of the workpiece to be processed is acquired.
In an embodiment, the focusing device 302 further includes a mirror 3023, the mirror 3023 is disposed on a side of the focusing mirror 3021 facing away from the moving platform and is opposite to and spaced from the focusing mirror 3021, an incident mirror surface is formed on a side of the mirror 3023, the incident mirror surface is disposed at an included angle with the working surface, and the incident mirror surface faces the adjusting device 100, and the laser beam enters the incident mirror surface after being modulated by the adjusting device 100 and is reflected to the focusing mirror 3021 by the incident mirror surface.
In this embodiment, the mirror 3023 is opposite to the focusing mirror 3021 and spaced apart from the focusing mirror 3021, an incident mirror surface for reflecting the laser beam is formed on a side of the mirror 3023 facing the adjusting apparatus 100, and the mirror 3023 is disposed obliquely, so that the incident mirror surface is disposed at an angle with the working surface and the adjusting apparatus 100.
It will be appreciated that the laser beam needs to enter the adjusting device 100 in a direction parallel to the working surface, and the laser beam needs to be incident in a direction perpendicular to the working surface for processing the workpiece to be processed, so that the mirror 3023 needs to be provided to change the direction of the laser beam path and convert the horizontal laser beam into the vertical laser beam for performing the laser processing on the surface of the workpiece to be processed. The reflecting mirror 3023 is formed with an incident mirror surface for reflecting the laser beam, the incident mirror surface is disposed facing the adjusting apparatus 100, so that the laser beam emitted from the adjusting apparatus 100 can be incident into the incident mirror surface along a horizontal direction, the incident mirror surface is disposed at a certain angle with the working surface, and an included angle between the reflecting mirror 3023 and the working surface can be adjusted to ensure that the laser beam reflected from the incident mirror surface can be irradiated onto the surface of the workpiece to be processed along a direction perpendicular to the working surface.
In one embodiment, the adjusting device 100 further includes a plurality of driving members, wherein the driving end of each driving member is connected to one adjusting column in the adjusting device 100; the laser processing apparatus 300 further includes a controller 303, the controller 303 being electrically connected to the ranging sensor 3022 and the plurality of driving members.
In this embodiment, the driving members may be servo motors, and the output end (power end) of each driving member is connected to one adjusting column in the adjusting device 100, so as to individually control each adjusting column to rotate, thereby adjusting the position of the stage 2 relative to the mounting base 1, so as to achieve adjustment of the position of the wave plate, and meanwhile, the laser processing apparatus 300 further includes a controller 303, where the controller 303 is electrically connected to the distance measuring sensor 3022 and the plurality of driving members, respectively.
It can be understood that, the laser processing apparatus 300 firstly obtains the height change data of the surface of the workpiece to be processed on the moving platform through the ranging sensor 3022, the controller 303 receives the height change data of the surface of the workpiece to be processed, and controls the adjusting device 100 to perform corresponding parameter modulation on the laser beam according to the processed data so as to change the focal length of the laser beam, so that the focal point of the laser beam can accurately fall on the surface of the workpiece to be processed with corresponding height, and further laser processing is performed, that is, the controller 303 controls the plurality of driving members to independently move respectively according to the received height change data so as to adjust each adjusting column respectively, thereby accurately adjusting the position of the stage 2 relative to the mounting seat 1, and selecting different parameters for modulating according to different laser types, different laser processing modes and different processing environments, so as to enhance the universality and applicability of the laser processing device and improve the application efficiency.
The foregoing description is only exemplary embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (6)
1. An adjusting device for use in a laser machining apparatus comprising a wave plate through which laser light passes, the adjusting device comprising:
the mounting seat comprises a seat body, an elastic module, an adjusting module and a plurality of spiral sleeves connected with the seat body, wherein the elastic module is limited and arranged on the seat body, the adjusting module is movably arranged on the seat body, the seat body is provided with a plurality of adjusting holes, each spiral sleeve is arranged in one adjusting hole, the spiral sleeves form screw holes, the inner wall of each screw hole is provided with a first thread, the adjusting module comprises a plurality of adjusting columns, each adjusting column is arranged in one screw hole, the outer wall of each adjusting column is provided with a second thread, so that the first thread and the second thread are matched and screwed, and one end of each adjusting column is provided with an adjusting ball; and
The slide holder is elastically connected to the base body through the elastic module, an adjusting gap is formed between the slide holder and the base body, the adjusting hole is communicated with the adjusting gap, the adjusting column penetrates through the adjusting gap and movably abuts against the slide holder, and the slide holder is used for loading a wave plate;
An adjusting groove is formed in one side, facing the mounting seat, of the slide holder, the inner wall of the adjusting groove is a spherical surface or a conical surface, and the adjusting ball head is abutted against the inner wall of the adjusting groove; or the slide holder is provided with two guide rods which are arranged in parallel at intervals, and the adjusting ball head is positioned between the two guide rods and is abutted against the two guide rods; the seat body is provided with a plurality of via holes, the via holes are communicated with the adjusting gap, the elastic module comprises a plurality of elastic pieces, each elastic piece is arranged in one of the via holes, one end of each elastic piece is limited on the seat body, the other end of each elastic piece is connected to the slide holder, and the size of the adjusting gap is adjusted through the adjusting module so as to be used for adjusting the position of the slide holder relative to the mounting seat.
2. The adjustment device of claim 1, wherein the housing comprises a first section and a second section connected, the first section and the second section extending in a direction perpendicular to each other;
The adjusting module comprises three adjusting columns, one adjusting column is arranged at the joint of the first section and the second section, the other adjusting column is arranged at the end, away from the second section, of the first section, and the other adjusting column is arranged at the end, away from the first section, of the second section.
3. The adjustment device of any one of claims 1 or 2, wherein the stage comprises:
The table body is elastically connected to the seat body, and the adjusting module is abutted to the table body; the platform body is formed with a placing cavity;
The slide glass frame is arranged in the placing cavity and is used for loading the wave plate; and
The positioning knob is movably arranged on the platform body and is used for fixing the slide frame.
4. A laser processing apparatus, characterized in that the laser processing apparatus comprises:
A laser;
A regulating device according to any one of claims 1 to 3; and
A focusing device;
the laser generated by the laser sequentially passes through the adjusting device and the focusing device.
5. The laser processing apparatus according to claim 4, wherein the focusing device includes:
a focusing mirror, wherein laser generated by the laser enters the focusing mirror through the adjusting device; and
The distance measuring sensor is arranged at intervals with the focusing mirror, and the distance measuring sensor is used for acquiring the height between the focusing mirror and the workpiece.
6. The laser processing apparatus of claim 5 wherein said adjustment means further comprises a plurality of driving members, each driving end of said driving members being connected to an adjustment post in said adjustment means;
the laser processing apparatus further includes a controller electrically connected to the ranging sensor and the plurality of driving members.
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| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN110567925A (en) * | 2019-09-10 | 2019-12-13 | 哈尔滨焊接研究院有限公司 | laser welding online self-adaptive penetration detection device and detection method |
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| CN211102140U (en) * | 2019-07-12 | 2020-07-28 | 华南理工大学 | A laser automatic focus positioning device |
| CN218003811U (en) * | 2022-11-08 | 2022-12-09 | 华翊博奥(北京)量子科技有限公司 | Optical adjusting frame and optical path system |
| CN117718603A (en) * | 2024-01-16 | 2024-03-19 | 江苏乐希激光装备有限公司 | But focusing cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN110567925A (en) * | 2019-09-10 | 2019-12-13 | 哈尔滨焊接研究院有限公司 | laser welding online self-adaptive penetration detection device and detection method |
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