CN118116854B - Wafer scheduling method, device, equipment and storage medium - Google Patents
Wafer scheduling method, device, equipment and storage medium Download PDFInfo
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- CN118116854B CN118116854B CN202410502201.5A CN202410502201A CN118116854B CN 118116854 B CN118116854 B CN 118116854B CN 202410502201 A CN202410502201 A CN 202410502201A CN 118116854 B CN118116854 B CN 118116854B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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Abstract
The invention discloses a wafer scheduling method, a device, equipment and a storage medium, wherein the method is executed by a wafer scheduling system, and the system comprises a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transfer cavity and a process cavity; comprising the following steps: acquiring a task target; acquiring state information of a circulation cavity; determining a scheduling path of the task target according to the state information; in the process of dispatching the wafer according to the dispatching path, the manipulator is controlled in the following manner: when the duration time of the wafer in the circulation cavity reaches a set duration time, the manipulator and the circulation cavity are locked, so that when the dispatching condition is met, the manipulator is controlled to dispatch the wafer in the circulation cavity to the next circulation cavity. The method is utilized: the wafer can be taken out immediately after the process in the circulation cavity is finished, so that the wafer is prevented from being stored in a polluted environment for too long time, and the wafer surface is prevented from being polluted and the wafer is prevented from being wasted.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to a wafer scheduling method, a device, equipment and a storage medium.
Background
Epitaxy is a process of growing a layer of film on the surface of a substrate material, and a complex structure of a chip is prepared on the layer of film. CVD (chemical vapor deposition) is a process technique for depositing solid materials on a substrate surface by separating out solid materials by a vapor phase reaction at high temperature.
The CVD apparatus includes a front end module, a transport module and at most four process chamber modules. Since the time each chamber recipe may be run may vary and the different chamber types also determine whether the chamber can receive wafers from different processes. Some steps of the recipe, such as temperature control, can be set to determine whether the target temperature is actually reached when the step is finished, and wait if the target temperature is not reached, so that the duration of the recipe is prolonged, the current scheduling algorithm schedules a conveying path based on accurate preset of execution time of each action in the process, and when the recipe with variable duration is operated, the reacted wafer cannot be taken out immediately. If the wafer is left in the process chamber for an extended period of time after the process is completed, the wafer surface is contaminated and the wafer is discarded.
Disclosure of Invention
The embodiment of the invention provides a wafer scheduling method, a device, equipment and a storage medium, which ensure that wafers can be taken out immediately after the process execution in a circulation cavity is completed, and solve the problem that the wafers subjected to reaction are stored for too long time in a reaction environment and are polluted.
In a first aspect, an embodiment of the present invention provides a wafer scheduling method, where the method is performed by a wafer scheduling system, the system includes a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transit cavity and a process cavity; comprising the following steps:
acquiring a task target; wherein the task target comprises at least one wafer;
acquiring state information of the circulation cavity; wherein the status information includes an idle status;
determining a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities;
And in the process of dispatching the wafer according to the dispatching path, controlling the manipulator according to the following mode: and when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met.
In a second aspect, an embodiment of the present invention further provides a wafer scheduling apparatus, where the apparatus includes:
the first acquisition module is used for acquiring a task target; wherein the task target comprises at least one wafer;
The second acquisition module is used for acquiring the state information of the circulation cavity; wherein the status information includes an idle status;
The scheduling path determining module is used for determining a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities;
The scheduling control module is used for controlling the manipulator in the process of scheduling the wafer according to the scheduling path in the following manner: and when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met.
In a third aspect, embodiments of the present disclosure further provide an electronic device, including:
One or more processors;
Storage means for storing one or more programs,
And when the one or more programs are executed by the one or more processors, the one or more processors are caused to implement the wafer scheduling method provided by the embodiment of the present disclosure.
In a fourth aspect, the disclosed embodiments also provide a storage medium containing computer-executable instructions, which when executed by a computer processor, are for performing a wafer scheduling method that implements the disclosed embodiments.
In a fifth aspect, embodiments of the present disclosure further provide a semiconductor device capable of performing the wafer scheduling method provided by the embodiments of the present disclosure.
The invention discloses a wafer scheduling method, a device, equipment and a storage medium, wherein the method is executed by a wafer scheduling system, and the system comprises a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transit cavity and a process cavity; comprising the following steps: acquiring a task target; wherein the task target comprises at least one wafer; acquiring state information of the circulation cavity; wherein the status information includes an idle status; determining a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities; and in the process of dispatching the wafer according to the dispatching path, controlling the manipulator according to the following mode: and when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met. The method is utilized: the wafer can be taken out immediately after the process in the circulation cavity is finished, so that the wafer is prevented from being stored in a polluted environment for too long time, and the wafer surface is prevented from being polluted and the wafer is prevented from being wasted.
Drawings
The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. The same or similar reference numbers will be used throughout the drawings to refer to the same or like elements. It should be understood that the figures are schematic and that elements and components are not necessarily drawn to scale.
Fig. 1 is a flowchart of a wafer scheduling method according to an embodiment of the disclosure;
FIG. 2 is a system block diagram of a chemical vapor deposition apparatus according to an embodiment of the present disclosure;
fig. 3 is a schematic scheduling diagram of two process tasks in the wafer scheduling method according to the embodiment of the disclosure;
fig. 4 is a schematic structural diagram of a wafer dispatching apparatus according to an embodiment of the disclosure;
Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the disclosure.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure have been shown in the accompanying drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustration purposes only and are not intended to limit the scope of the present disclosure.
It should be understood that the various steps recited in the method embodiments of the present disclosure may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present disclosure is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments. Related definitions of other terms will be given in the description below.
It should be noted that the terms "first," "second," and the like in this disclosure are merely used to distinguish between different devices, modules, or units and are not used to define an order or interdependence of functions performed by the devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those of ordinary skill in the art will appreciate that "one or more" is intended to be understood as "one or more" unless the context clearly indicates otherwise.
The names of messages or information interacted between the various devices in the embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.
It will be appreciated that prior to using the technical solutions disclosed in the embodiments of the present disclosure, the user should be informed and authorized of the type, usage range, usage scenario, etc. of the personal information related to the present disclosure in an appropriate manner according to the relevant legal regulations.
For example, in response to receiving an active request from a user, a prompt is sent to the user to explicitly prompt the user that the operation it is requesting to perform will require personal information to be obtained and used with the user. Thus, the user can autonomously select whether to provide personal information to software or hardware such as an electronic device, an application program, a server or a storage medium for executing the operation of the technical scheme of the present disclosure according to the prompt information.
As an alternative but non-limiting implementation, in response to receiving an active request from a user, the manner in which the prompt information is sent to the user may be, for example, a popup, in which the prompt information may be presented in a text manner. In addition, a selection control for the user to select to provide personal information to the electronic device in a 'consent' or 'disagreement' manner can be carried in the popup window.
It will be appreciated that the above-described notification and user authorization process is merely illustrative and not limiting of the implementations of the present disclosure, and that other ways of satisfying relevant legal regulations may be applied to the implementations of the present disclosure.
It will be appreciated that the data (including but not limited to the data itself, the acquisition or use of the data) involved in the present technical solution should comply with the corresponding legal regulations and the requirements of the relevant regulations.
Example 1
Fig. 1 is a flowchart of wafer scheduling provided by an embodiment of the present disclosure, where the embodiment of the present disclosure is suitable for providing a solution to the problem that wafers are stored in a contaminated environment for too much time, resulting in contamination of the wafer surface and waste of wafers, and the method may be performed by a wafer scheduling apparatus, where the apparatus may be implemented in the form of software and/or hardware, and optionally, implemented by an electronic device, where the electronic device may be a mobile terminal, a PC or a server, etc.
As shown in fig. 1, a wafer scheduling method provided by an embodiment of the present disclosure is performed by a wafer scheduling system, where the system includes a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transfer cavity and a process cavity; specifically, the method comprises the following steps:
S110, acquiring a task target.
Wherein the task target comprises at least one wafer.
In this embodiment, fig. 2 is a system configuration diagram of a chemical vapor deposition apparatus according to an embodiment of the present disclosure. As shown in fig. 2, the wafer dispatching system is implemented, and the system comprises a manipulator and a circulation cavity; wherein the flow chamber comprises at least one of a vacuum lock chamber (LoadLock), a transfer chamber (WHC), and a process chamber (RC). The system also comprises a control system which is used for controlling the manipulator and the circulation cavity. Meanwhile, the real-time state of the manipulator and the circulation cavity can be obtained.
In this embodiment, the task target may be a set of wafer tasks that are to perform the same process flow. Wherein the task target comprises at least one wafer.
Specifically, a task target is obtained.
S120, acquiring state information of the circulation cavity.
Wherein the state information includes an idle state.
In this embodiment, it is required to know that the scheduling of the wafer follows a first come first serve policy, and whether the task target can be executed is determined according to the required state of the circulation cavity. The status information of the circulation cavity may be whether the circulation cavity is idle or busy, if so, the status information of the circulation cavity is in an idle state, and if so, the status information of the circulation cavity is in a busy state.
Specifically, when a process task needs to be executed, state information of the circulation cavity is acquired.
S130, determining a scheduling path of the task target according to the state information.
The scheduling path is a path for the wafer to circulate among all circulation cavities;
The dispatch path may be a path that the wafer in the task target is being transferred between the transfer chambers.
Illustratively, the dispatch path is from the cartridge 1 to the vacuum lock chamber 1, then to the process chamber 2, and finally back to the vacuum lock chamber 1; or the dispatching path is from the sheet bin 2 to the vacuum locking cavity 1, then to the transfer cavity, then to the process cavity 3, and finally to the vacuum locking cavity 1; or the dispatch path is from the sheet bin 1 to the vacuum locking cavity 2, then to the process chamber 3, finally to the vacuum locking cavity 2, etc
Specifically, a scheduling path of the task target is determined according to state information of the circulation cavity.
On the basis of the above embodiment, after determining the scheduling path of the task target according to the state information, the method further includes: the temperature in the process chamber is adjusted in advance based on the scheduling path and the scheduling time, so that the temperature in the process chamber is stabilized at a preset temperature.
Specifically, after the scheduling path is determined, the preparation work of the cavity is immediately executed according to the scheduling time, rather than being executed when the manipulator is idle and can move a slice.
By using the method, the cavity is ensured to be in a stable state before the formulation is executed, and the condition that the temperature is not controlled in place after the formulation is executed is avoided
S140, controlling the manipulator in the process of scheduling the wafer according to the scheduling path in the following manner: when the duration time of the wafer in the circulation cavity reaches a set duration time, the manipulator and the circulation cavity are locked, so that when the dispatching condition is met, the manipulator is controlled to dispatch the wafer in the circulation cavity to the next circulation cavity.
The locking time is set to be delay time.
In this embodiment, the set duration may be a basic duration of processing in the cavity, and the locking may be locked by the process task and cannot be provided for other process tasks, where the locked duration is a set delay duration. The delay time is set as the overtime of executing the recipe. The scheduling condition is that the process is finished, namely, the process setting and processing requirements are met.
Specifically, in the process of dispatching the wafer according to the dispatching path, the manipulator is controlled in the following manner: when the state information of the circulation cavity is in an idle state, the control manipulator schedules the wafers in the process task to the circulation cavity according to a scheduling path, and when the duration time of the wafers in the circulation cavity reaches a set duration, the control manipulator locks the circulation cavity, so that when the scheduling condition is met, namely the process reaches the processing completion requirement, the control manipulator schedules the wafers in the circulation cavity to the next circulation cavity.
On the basis of the above embodiment, in the process of scheduling the wafer according to the scheduling path, the robot is controlled as follows: when the duration time of the wafer in the circulation cavity reaches a set duration, locking the manipulator and the circulation cavity, and when the dispatching condition is met, controlling the manipulator to dispatch the wafer in the circulation cavity to the next circulation cavity comprises the following steps:
a1 When the state information of the circulation cavity is in an idle state, the control manipulator dispatches the wafer in the process task to the idle vacuum locking cavity according to the dispatching path.
In this embodiment, the robot may further include an atmospheric robot and a vacuum robot.
When the state information of the circulation cavity is in an idle state, the control manipulator dispatches the wafer in the process task to the idle vacuum locking cavity according to the dispatching path.
B1 Acquiring scheduling time; the scheduling time includes a duration and an extension time; wherein the duration comprises a process chamber duration; the extension time includes a process chamber extension time.
In this embodiment, the scheduled time may be an execution duration of the recipe, where the scheduled time includes a duration and an extension time. The duration is the basic execution duration of the recipe, and the extension time may be the duration that the waiting will be extended if not reached, because the temperature control and the like may set the time to judge whether the target temperature is really reached when the step is ended. The duration includes a process chamber duration; the extension time includes a process chamber extension time.
C1 Controlling the manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer to the process chamber, when the wafer reaches the duration of the process chamber in the process chamber, the manipulator and the process chamber are locked for an extended time, and when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer in the process chamber to the next circulation chamber.
In this embodiment, the scheduling condition is that the current flow chamber scheduling time is completed and the next flow chamber is the process chamber.
Specifically, the manipulator is controlled to carry the wafer in the vacuum locking cavity according to the scheduling time; when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer to the process chamber, when the wafer reaches the duration of the process chamber in the process chamber, the manipulator and the process chamber are locked for an extended time, and when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer in the process chamber to the next transferring chamber. Wherein the initial vacuum lock chamber and the return vacuum lock chamber are the same.
On the basis of the above embodiment, the method further comprises: and when the wafer scheduling time of the plurality of process tasks is overlapped, carrying out delay adjustment on the wafer scheduling time of the process tasks which are carried out later until the wafer scheduling time of the plurality of process tasks is not overlapped, and stopping.
For example, fig. 3 is a schematic scheduling diagram of two process tasks in the wafer scheduling method provided by the embodiment of the present disclosure, as shown in fig. 3, assuming that a path LoadLock1> PreClean > RC2> LoadLock1 of a process task 1 (PJ 1), a time when an atmospheric robot carries a wafer into the first PreClean on the PJ path is denoted as T1, a time when the wafer enters the RC2 is T2, a1/a2/a3 is a time when the robot moves the wafer, b1/b2 is LoadLock1 lifting time, c1 is PreClean execution Main recipe time, a red part is timeout time when the variable duration recipe is executed by the RC2, d1 is Main recipe time when the red part is timeout time when the variable duration recipe is executed by the RC2, an upper part is the longest execution duration, a lower part is the shortest execution duration, and upper and lower parts share a time axis. Assuming that the path of process task 2 (PJ 2) is LoadLock1> PreClean- > RC3- > LoadLock1, when the time occupied by the same module of PJ1 and PJ2 collides, the PJ2 is moved back as a whole until there is no collision, and then the two are combined to start to execute the action.
On the basis of the above embodiment, before controlling the atmospheric robot to schedule the wafer in the process task into the idle vacuum lock chamber according to the scheduling path, the method further includes: and calibrating the position of the wafer by using a positioning and calibrating device.
On the basis of the above embodiment, in the process of scheduling the wafer according to the scheduling path, the method further includes: controlling a manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; when the wafer reaches the duration of the pre-cleaning cavity in the pre-cleaning cavity, the manipulator and the pre-cleaning cavity are locked for the extension time, so that when the dispatching condition is met, the manipulator is controlled to dispatch the wafer in the pre-cleaning cavity to the process cavity.
Wherein the transfer chamber comprises a pre-cleaning chamber; the duration includes a pre-wash chamber duration; the extension time includes a pre-clean chamber extension time.
Specifically, in the embodiment of the invention, a pre-cleaning process may be added according to practical situations, that is, the wafer may be carried from the vacuum lock chamber at the beginning to the pre-cleaning chamber for cleaning.
On the basis of the above embodiment, after completing the scheduling path of the task target, the method further includes:
And the control manipulator dispatches the wafer in the last circulation cavity in the dispatching path to the outside.
The invention discloses a wafer scheduling method, a device, equipment and a storage medium, wherein the method comprises the following steps: the method is executed by a wafer scheduling system, and the system comprises a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transfer cavity and a process cavity; comprising the following steps: acquiring a task target; acquiring state information of a circulation cavity; determining a scheduling path of the task target according to the state information; in the process of dispatching the wafer according to the dispatching path, the manipulator is controlled in the following manner: when the duration time of the wafer in the circulation cavity reaches a set duration time, the manipulator and the circulation cavity are locked, so that when the dispatching condition is met, the manipulator is controlled to dispatch the wafer in the circulation cavity to the next circulation cavity. The method is utilized: the wafer can be taken out immediately after the process in the circulation cavity is finished, so that the wafer is prevented from being stored in a polluted environment for too long time, and the wafer surface is prevented from being polluted and the wafer is prevented from being wasted.
Example two
Fig. 4 is a schematic structural diagram of a wafer dispatching apparatus according to an embodiment of the present invention, where, as shown in fig. 4, the apparatus includes: a first acquisition module 210, a second acquisition module 220, a scheduling path determination module 230, and a scheduling control module 240.
A first obtaining module 210, configured to obtain a task target; wherein the task target comprises at least one wafer;
A second obtaining module 220, configured to obtain status information of the circulation cavity; wherein the status information includes an idle status;
A scheduling path determining module 230, configured to determine a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities;
The scheduling control module 240 is configured to control the robot arm in the following manner in a process of scheduling the wafer according to the scheduling path: and when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met.
The technical scheme provided by the embodiment of the disclosure is that the method is utilized: the wafer can be taken out immediately after the process in the circulation cavity is finished, so that the wafer is prevented from being stored in a polluted environment for too long time, and the wafer surface is prevented from being polluted and the wafer is prevented from being wasted.
Further, the scheduling control module 240 may be configured to:
when the state information of the circulation cavity is in an idle state, controlling the manipulator to schedule the wafer in the process task into the idle vacuum locking cavity according to the scheduling path;
Acquiring scheduling time; the scheduling time includes a duration and an extension time; wherein the duration comprises a process chamber duration; the extension time includes a process chamber extension time;
Controlling a manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer to the process chamber, when the wafer reaches the duration of the process chamber in the process chamber, the manipulator and the process chamber are locked for an extended time, and when the dispatching conditions are met, the manipulator is controlled to dispatch the wafer in the process chamber to the next circulation chamber.
Further, the apparatus may also be for:
the temperature in the process chamber is adjusted in advance based on the scheduling path and the scheduling time, so that the temperature in the process chamber is stabilized at a preset temperature.
Further, the apparatus may also be for:
And when the wafer scheduling time of the plurality of process tasks is overlapped, carrying out delay adjustment on the wafer scheduling time of the process tasks which are carried out later until the wafer scheduling time of the plurality of process tasks is not overlapped, and stopping.
Further, the apparatus may also be for:
And calibrating the position of the wafer by using a positioning and calibrating device.
Further, the apparatus may also be for:
In the process of scheduling the wafer according to the scheduling path, the method further comprises: controlling a manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; and when the wafer reaches the duration of the pre-cleaning cavity in the pre-cleaning cavity, locking the manipulator and the pre-cleaning cavity for the extended time, so as to control the manipulator to dispatch the wafer in the pre-cleaning cavity to the process cavity when the dispatching condition is met.
Further, the apparatus may also be for:
After completing the scheduling path of the task target, the method further comprises the following steps:
and controlling the manipulator to schedule the wafer in the last circulation cavity in the scheduling path to the outside.
The device can execute the method provided by all the embodiments of the invention, and has the corresponding functional modules and beneficial effects of executing the method. Technical details not described in detail in this embodiment can be found in the methods provided in all the foregoing embodiments of the invention.
Example III
Fig. 5 presents a schematic view of the structure of an electronic device 10 that may be used to implement an embodiment of the present invention. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. Electronic equipment may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
As shown in fig. 5, the electronic device 10 includes at least one processor 11, and a memory, such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc., communicatively connected to the at least one processor 11, in which the memory stores a computer program executable by the at least one processor, and the processor 11 may perform various appropriate actions and processes according to the computer program stored in the Read Only Memory (ROM) 12 or the computer program loaded from the storage unit 18 into the Random Access Memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 may also be stored. The processor 11, the ROM 12 and the RAM 13 are connected to each other via a bus 14. An input/output (I/O) interface 15 is also connected to bus 14.
Various components in the electronic device 10 are connected to the I/O interface 15, including: an input unit 16 such as a keyboard, a mouse, etc.; an output unit 17 such as various types of displays, speakers, and the like; a storage unit 18 such as a magnetic disk, an optical disk, or the like; and a communication unit 19 such as a network card, modem, wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices via a computer network, such as the internet, and/or various telecommunication networks.
The processor 11 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as a wafer scheduling method.
In some embodiments, the wafer scheduling method may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 10 via the ROM 12 and/or the communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the wafer scheduling method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the wafer scheduling method in any other suitable way (e.g., by means of firmware).
Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.
A computer program for carrying out methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions/acts specified in the flowchart and/or block diagram block or blocks to be implemented. The computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.
In the context of the present invention, a computer-readable storage medium may be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium may be a machine readable signal medium. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) through which a user can provide input to the electronic device. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.
The systems and techniques described here can be implemented in a computing system that includes a background component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such background, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), blockchain networks, and the internet.
The computing system may include clients and servers. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also called a cloud computing server or a cloud host, and is a host product in a cloud computing service system, so that the defects of high management difficulty and weak service expansibility in the traditional physical hosts and VPS service are overcome.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (11)
1. The wafer scheduling method is characterized in that the method is executed by a wafer scheduling system, and the system comprises a manipulator and a circulation cavity; the circulation cavity comprises at least one of a vacuum locking cavity, a transit cavity and a process cavity; comprising the following steps:
acquiring a task target; wherein the task target comprises at least one wafer;
Acquiring state information of the circulation cavity; wherein the status information includes an idle status;
determining a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities;
And in the process of dispatching the wafer according to the dispatching path, controlling the manipulator according to the following mode: when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met; the set time length is a basic time length processed in the circulation cavity; the locking time is a set delay time; the set delay time is the overtime time for executing the recipe.
2. The method of claim 1, wherein during the scheduling of the wafers according to the scheduling path, the robot is controlled as follows: when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met, wherein the method comprises the following steps:
When the state information of the vacuum locking cavity is in an idle state, controlling the manipulator to schedule the wafer in the process task into the idle vacuum locking cavity according to the scheduling path;
Acquiring scheduling time; the scheduling time includes a duration and an extension time; wherein the duration comprises a process chamber duration; the extension time includes a process chamber extension time;
Controlling a manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; and when the dispatching conditions are met, controlling the manipulator to dispatch the wafer to the process chamber, and when the wafer reaches the duration of the process chamber in the process chamber, locking the manipulator and the process chamber into the process chamber for an extended time, so as to control the manipulator to dispatch the wafer in the process chamber to the next circulation chamber.
3. The method of claim 2, further comprising, after determining the scheduling path of the task object based on the status information:
the temperature in the process chamber is adjusted in advance based on the scheduling path and the scheduling time, so that the temperature in the process chamber is stabilized at a preset temperature.
4. A method according to claim 3, wherein when there is an overlap in the wafer schedule times of the plurality of process tasks, the wafer schedule times of the process tasks that follow are adjusted postponed until there is no overlap in the wafer schedule times of the plurality of process tasks.
5. The method of claim 2, wherein controlling the robot before dispatching the wafer in the process task into the idle vacuum lock chamber according to the dispatch path further comprises:
And calibrating the position of the wafer by using a positioning and calibrating device.
6. The method of claim 2, wherein the flow chamber comprises a pre-wash chamber; the duration includes a pre-wash chamber duration; the extended time includes a pre-clean chamber extended time; in the process of scheduling the wafer according to the scheduling path, the method further comprises:
Controlling a manipulator to carry the wafer in the vacuum locking cavity according to the scheduling time; and when the wafer reaches the duration of the pre-cleaning cavity in the pre-cleaning cavity, locking the mechanical arm and the pre-cleaning cavity for the extended time, so as to control the mechanical arm to schedule the wafer in the pre-cleaning cavity to the process cavity when the scheduling condition is met.
7. The method of claim 1, further comprising, upon completion of the scheduling path for the task objective:
and controlling the manipulator to schedule the wafer in the last circulation cavity in the scheduling path to the outside.
8. A wafer scheduling apparatus, comprising:
the first acquisition module is used for acquiring a task target; wherein the task target comprises at least one wafer;
The second acquisition module is used for acquiring state information of the circulation cavity; wherein the status information includes an idle status;
The scheduling path determining module is used for determining a scheduling path of the task target according to the state information; the scheduling path is a path for the wafer to circulate among all circulation cavities;
The scheduling control module is used for controlling the manipulator in the process of scheduling the wafer according to the scheduling path in the following manner: and when the duration time of the wafer in the circulation cavity reaches a set duration time, locking the manipulator and the circulation cavity, and controlling the manipulator to schedule the wafer in the circulation cavity to the next circulation cavity when a scheduling condition is met.
9. An electronic device, the electronic device comprising:
at least one processor; and
A memory communicatively coupled to the at least one processor; wherein,
The memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the wafer scheduling method of any one of claims 1-7.
10. A computer readable storage medium storing computer instructions for causing a processor to perform the wafer scheduling method of any one of claims 1-7.
11. A semiconductor device characterized in that it comprises the wafer scheduling apparatus of claim 8, which is capable of performing the wafer scheduling method of any one of claims 1-7.
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