CN118016630B - An integrated semiconductor circuit - Google Patents
An integrated semiconductor circuit Download PDFInfo
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- CN118016630B CN118016630B CN202410417269.3A CN202410417269A CN118016630B CN 118016630 B CN118016630 B CN 118016630B CN 202410417269 A CN202410417269 A CN 202410417269A CN 118016630 B CN118016630 B CN 118016630B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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Abstract
本发明涉及电路技术领域，提供了一种集成式半导体电路，其包括线路板、嵌入所述线路板具备元器件的一侧并与所述线路板电连接的半导体电路板以及固定于所述线路板远离所述半导体电路板一侧并与所述半导体电路板相对设置的散热器；所述半导体电路包括绝缘基板、多个金属图腾柱、绝缘层、电路布线层以及多个所述元器件。本发明中集成式半导体电路通过无引脚设置的方式实现了半导体电路板与线路板的集成，不仅避免了通过引脚连接两个电路模块而因引脚焊接公差在塑封时产生的应力导致引脚焊接处的绝缘层出现分层情况，还避免了人体静电对内部芯片产生的影响，并降低其生产成本，提高生产效率，另外，还提升了其散热能力。
The present invention relates to the field of circuit technology, and provides an integrated semiconductor circuit, which includes a circuit board, a semiconductor circuit board embedded in a side of the circuit board with components and electrically connected to the circuit board, and a heat sink fixed to a side of the circuit board away from the semiconductor circuit board and arranged opposite to the semiconductor circuit board; the semiconductor circuit includes an insulating substrate, a plurality of metal totem poles, an insulating layer, a circuit wiring layer, and a plurality of the components. The integrated semiconductor circuit of the present invention realizes the integration of the semiconductor circuit board and the circuit board by means of a pinless setting, which not only avoids the stress generated by the pin welding tolerance during plastic sealing when connecting two circuit modules through pins, resulting in the delamination of the insulating layer at the pin welding location, but also avoids the influence of human body static electricity on the internal chip, reduces its production cost, improves production efficiency, and also improves its heat dissipation capacity.
Description
技术领域Technical Field
本发明涉及电路技术领域，具体涉及一种集成式半导体电路。The present invention relates to the field of circuit technology, and in particular to an integrated semiconductor circuit.
背景技术Background technique
半导体电路也称模块化智能功率模块MIPM（ Module Intelligent PowerSystem），其不仅把功率开关器件和驱动电路集成在一起，而且还内藏有过电压、过电流和过热等故障检测电路，并且可以将检测信号送到CPU或DSP作中断处理。其由高速低工耗的管芯和优化的门级驱动电路以及快速保护电路构成，即使发生负载事故或使用不当，也可以使IPM自身不受损坏。其一般使用IGBT作为功率开关元件，并内藏电流传感器及驱动电路的集成结构。Semiconductor circuits are also called modular intelligent power modules (MIPMs). They not only integrate power switching devices and drive circuits, but also have built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU or DSP for interrupt processing. They are composed of high-speed, low-power consumption tube cores, optimized gate-level drive circuits, and fast protection circuits. Even if a load accident or improper use occurs, the IPM itself will not be damaged. It generally uses IGBT as a power switching element, and has an integrated structure with a built-in current sensor and drive circuit.
半导体电路需要将IC驱动控制电路、IPM采样放大电路以及PFC电流保护电路等低压控制电路和高压半导体电路组成的逆变电路组装到同一线路板上。但现有技术的半导体电路板均只可以集成单个电路模块，就算是集成多个电路模块也仅仅是通过两个电路模块上的引脚进行连接，这种集成方式容易因引脚焊接公差在塑封时产生的应力导致引脚焊接处的绝缘层出现分层情况，还会由于引脚的设置，使人体静电对内部芯片产生影响（静电击穿），使生产效率降低，另外，为了防止静电的产生还需要对集成的半导体电路进行专用的防静电包装，且引脚的设置还需要采购引脚切筋设备，导致了其生产成本较高；同时，由于多个电路模块进行集成，其产生的热量必然增加，使其散热能力较差。The semiconductor circuit needs to assemble the inverter circuit composed of low-voltage control circuits such as IC drive control circuit, IPM sampling amplifier circuit and PFC current protection circuit and high-voltage semiconductor circuit on the same circuit board. However, the semiconductor circuit boards of the prior art can only integrate a single circuit module. Even if multiple circuit modules are integrated, they are only connected through the pins on the two circuit modules. This integration method is prone to stratification of the insulation layer at the pin welding due to the stress generated by the pin welding tolerance during plastic sealing. The setting of the pins will also cause the static electricity of the human body to affect the internal chip (static breakdown), reducing production efficiency. In addition, in order to prevent the generation of static electricity, the integrated semiconductor circuit needs to be specially packaged with anti-static packaging, and the setting of the pins also requires the purchase of pin cutting equipment, resulting in a high production cost. At the same time, due to the integration of multiple circuit modules, the heat generated will inevitably increase, making its heat dissipation capacity poor.
发明内容Summary of the invention
本发明提供了一种集成式半导体电路，旨在解决现有技术中的半导体电路集成多个电路模块的方式，容易因引脚焊接公差在塑封时产生的应力导致引脚焊接处的绝缘层出现分层情况，还会由于引脚的设置，使人体静电对内部芯片产生影响，使半导体电路的生产成本较高，使生产效率降低，且散热能力差的问题。The present invention provides an integrated semiconductor circuit, aiming to solve the problem that the way of integrating multiple circuit modules in the semiconductor circuit in the prior art is easy to cause delamination of the insulation layer at the pin welding place due to the stress generated by the pin welding tolerance during plastic sealing, and the static electricity of the human body affects the internal chip due to the setting of the pin, so that the production cost of the semiconductor circuit is high, the production efficiency is reduced, and the heat dissipation capacity is poor.
本发明实施例提供了一种集成式半导体电路，所述集成式半导体电路包括线路板、嵌入所述线路板具备元器件的一侧并与所述线路板电连接的半导体电路板以及固定于所述线路板远离所述半导体电路板一侧并与所述半导体电路板相对设置的散热器；An embodiment of the present invention provides an integrated semiconductor circuit, the integrated semiconductor circuit comprising a circuit board, a semiconductor circuit board embedded in a side of the circuit board having components and electrically connected to the circuit board, and a heat sink fixed to a side of the circuit board away from the semiconductor circuit board and arranged opposite to the semiconductor circuit board;
所述半导体电路板包括：The semiconductor circuit board comprises:
绝缘基板；Insulating substrate;
多个金属图腾柱，多个所述金属图腾柱分别穿过所述绝缘基板设置，多个所述金属图腾柱间隔设置；A plurality of metal totem poles, wherein the plurality of metal totem poles are respectively arranged through the insulating substrate, and the plurality of metal totem poles are arranged at intervals;
绝缘层，所述绝缘层固定于所述金属图腾柱的一端并与所述绝缘基板的一侧平齐；an insulating layer, the insulating layer being fixed to one end of the metal totem pole and being flush with one side of the insulating substrate;
电路布线层，所述电路布线层固定于所述绝缘基板远离所述金属图腾柱的一侧以及所述绝缘层远离所述金属图腾柱的一侧；A circuit wiring layer, the circuit wiring layer is fixed to a side of the insulating substrate away from the metal totem pole and a side of the insulating layer away from the metal totem pole;
多个所述元器件，多个所述元器件间隔设置在所述电路布线层远离所述绝缘层的一侧，多个所述元器件之间、所述元器件与所述电路布线层之间相互电连接；部分所述元器件分别与多个所述金属图腾柱相对设置。A plurality of the components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other; some of the components are respectively arranged opposite to a plurality of the metal totem poles.
优选的，所述散热器贴设于所述线路板的面积大于所述半导体电路板贴设于所述线路板的面积。Preferably, the area of the heat sink attached to the circuit board is larger than the area of the semiconductor circuit board attached to the circuit board.
优选的，所述半导体电路板还包括覆盖部分所述电路布线层以及多个所述元器件设置的封装体。Preferably, the semiconductor circuit board further comprises a packaging body covering a portion of the circuit wiring layer and the plurality of components.
优选的，所述半导体电路板还包括避让所有所述元器件以设置于所述电路布线层上的绿油层。Preferably, the semiconductor circuit board further comprises a green oil layer which is arranged on the circuit wiring layer to avoid all the components.
优选的，多个所述元器件至少包括间隔设置于所述电路布线层上的贴片电阻和贴片电容。Preferably, the plurality of components include at least chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.
优选的，所述半导体电路板还包括间隔设置于所述电路布线层上的多个散热片，部分所述元器件分别设置于多个所述散热片上。Preferably, the semiconductor circuit board further comprises a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on the plurality of heat sinks.
优选的，多个所述元器件之间、所述元器件与所述电路布线层之间通过绑定金属线实现电连接。Preferably, electrical connections are achieved between the plurality of components and between the components and the circuit wiring layer by binding metal wires.
与现有技术相比，本发明中的集成式半导体电路通过将半导体电路板嵌入线路板，从而通过无引脚设置的方式实现了半导体电路板与线路板的集成，不仅避免了通过引脚连接两个电路模块而因引脚焊接公差在塑封时产生的应力导致引脚焊接处的绝缘层出现分层情况，还避免了人体静电对内部芯片产生的影响，并降低其生产成本，提高生产效率，另外，还通过在线路板远离半导体电路板的一侧固定与半导体电路板相对的散热器，并设置穿过线路板与散热器贴合设置的金属图腾柱，进而提升了其散热能力。Compared with the prior art, the integrated semiconductor circuit in the present invention realizes the integration of the semiconductor circuit board and the circuit board by embedding the semiconductor circuit board into the circuit board in a pin-free manner, which not only avoids the stress generated by the pin welding tolerance during plastic sealing when connecting two circuit modules through pins, causing the insulation layer to be delaminated at the pin welding point, but also avoids the influence of human static electricity on the internal chip, reduces its production cost, and improves production efficiency. In addition, by fixing a heat sink opposite to the semiconductor circuit board on the side of the circuit board away from the semiconductor circuit board, and setting a metal totem pole that passes through the circuit board and is bonded to the heat sink, its heat dissipation capacity is improved.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
下面结合附图详细说明本发明。通过结合以下附图所作的详细描述，本发明的上述或其他方面的内容将变得更清楚和更容易理解。附图中：The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:
图1是本发明实施例提供的一种集成式半导体电路的侧面结构示意图；FIG1 is a schematic diagram of the side structure of an integrated semiconductor circuit provided by an embodiment of the present invention;
图2是本发明实施例提供的一种集成式半导体电路中半导体电路板的剖视图。FIG. 2 is a cross-sectional view of a semiconductor circuit board in an integrated semiconductor circuit provided by an embodiment of the present invention.
其中，10、线路板； 20、半导体电路板；21、绝缘基板；22、绝缘层；23、电路布线层；24、元器件；241、贴片电阻；242、贴片电容；25、封装体；26、绿油层；27、散热片；28、绑定金属线；29、金属图腾柱；30、散热器。Among them, 10, circuit board; 20, semiconductor circuit board; 21, insulating substrate; 22, insulating layer; 23, circuit wiring layer; 24, components; 241, chip resistor; 242, chip capacitor; 25, package; 26, green oil layer; 27, heat sink; 28, binding metal wire; 29, metal totem pole; 30, radiator.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
本发明实施例提供了一种集成式半导体电路，结合图1至图2所示，其包括线路板10、嵌入线路板10具备元器件24的一侧并与线路板10电连接的半导体电路板20以及固定于线路板10远离半导体电路板20一侧并与半导体电路板20相对设置的散热器30。An embodiment of the present invention provides an integrated semiconductor circuit, as shown in Figures 1 to 2, which includes a circuit board 10, a semiconductor circuit board 20 embedded in a side of the circuit board 10 having components 24 and electrically connected to the circuit board 10, and a heat sink 30 fixed to a side of the circuit board 10 away from the semiconductor circuit board 20 and arranged opposite to the semiconductor circuit board 20.
其中，线路板10能够将多个电子元件连接在一起，从而形成一个完整的电路，通过精确布线和焊接技术，确保了电子元件之间的信号传输和信息交流。The circuit board 10 can connect multiple electronic components together to form a complete circuit, and ensure signal transmission and information exchange between the electronic components through precise wiring and welding technology.
半导体电路板20将IC驱动控制电路、采样放大电路以及PFC电流保护电路等低压控制电路与高压半导体电路组成的逆变电路布局到了同一板上，最终形成了一个模块。The semiconductor circuit board 20 arranges low-voltage control circuits such as IC drive control circuit, sampling amplifier circuit and PFC current protection circuit and inverter circuit composed of high-voltage semiconductor circuit on the same board, finally forming a module.
散热器30对半导体电路起到快速散热的作用。The heat sink 30 plays a role in rapidly dissipating heat from the semiconductor circuit.
具体地，半导体电路板20包括绝缘基板21、多个金属图腾柱29、绝缘层22、电路布线层23、多个元器件24以及封装体25。Specifically, the semiconductor circuit board 20 includes an insulating substrate 21 , a plurality of metal totem poles 29 , an insulating layer 22 , a circuit wiring layer 23 , a plurality of components 24 and a package 25 .
多个金属图腾柱29分别穿过绝缘基板21设置，多个金属图腾柱29间隔设置；绝缘层22固定于金属图腾柱29的一端并与绝缘基板21的一侧平齐；电路布线层23固定于绝缘基板21远离金属图腾柱29的一侧以及绝缘层22远离金属图腾柱29的一侧；多个元器件24间隔设置在电路布线层23远离绝缘层22的一侧，多个元器件24之间、元器件24与电路布线层23之间相互电连接；部分元器件24分别与多个金属图腾柱29相对设置，多个金属图腾柱29远离绝缘基板21的一侧穿过线路板10并与散热器30贴合设置；封装体25覆盖部分电路布线层23以及多个元器件24。A plurality of metal totem poles 29 are respectively arranged through the insulating substrate 21, and the plurality of metal totem poles 29 are arranged at intervals; the insulating layer 22 is fixed to one end of the metal totem pole 29 and is flush with one side of the insulating substrate 21; the circuit wiring layer 23 is fixed to the side of the insulating substrate 21 away from the metal totem pole 29 and the side of the insulating layer 22 away from the metal totem pole 29; a plurality of components 24 are arranged at intervals on the side of the circuit wiring layer 23 away from the insulating layer 22, and the plurality of components 24 and the components 24 and the circuit wiring layer 23 are electrically connected to each other; some components 24 are respectively arranged opposite to the plurality of metal totem poles 29, and the side of the plurality of metal totem poles 29 away from the insulating substrate 21 passes through the circuit board 10 and is arranged in contact with the heat sink 30; the package body 25 covers part of the circuit wiring layer 23 and the plurality of components 24.
绝缘基板21由玻璃纤维布和环氧树脂组成，对元器件24起到支撑绝缘作用，如FR4板；金属图腾柱29由铜、铝等散热性好的金属材料以及绝缘的介质组成，主要作为半导体电路板20的载体且对半导体电路板20起到散热作用；绝缘层22用于防止电路布线层23与金属图腾柱29通电导致内部电路短路或漏电的风险；电路布线层23又称铜箔层，通过蚀刻形成所需电路；封装体25由环氧树脂为基体树脂，以高性能酚醛树脂为固化剂，加入硅微粉等为填料，以及添加多种助剂混配而成的粉状模塑料，通过热传递成型法挤压入模腔并将其中的元器件24包埋，同时交联固化成型，成为具有一定外型结构器件。The insulating substrate 21 is composed of glass fiber cloth and epoxy resin, and plays a supporting and insulating role for the components 24, such as FR4 board; the metal totem pole 29 is composed of metal materials with good heat dissipation such as copper and aluminum and insulating medium, and is mainly used as a carrier of the semiconductor circuit board 20 and plays a heat dissipation role for the semiconductor circuit board 20; the insulating layer 22 is used to prevent the circuit wiring layer 23 and the metal totem pole 29 from being energized, resulting in the risk of internal circuit short circuit or leakage; the circuit wiring layer 23 is also called the copper foil layer, and the required circuit is formed by etching; the package body 25 is made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micropowder as the filler, and a variety of additives. The powdered molding compound is mixed and extruded into the mold cavity by heat transfer molding and the components 24 therein are embedded, and cross-linked and cured to form a device with a certain external structure.
本实施例中，半导体电路板20还包括避让所有元器件24以设置于电路布线层23上的绿油层26。In this embodiment, the semiconductor circuit board 20 further includes a green oil layer 26 disposed on the circuit wiring layer 23 to avoid all components 24 .
绿油层26又称保护层，用于防止不该上锡的地方上锡，增加线路之间的耐压，防止因线路氧化或污染导致的短路，对线路起保护作用。The green oil layer 26 is also called a protective layer, which is used to prevent tinning at places where tinning is not required, increase the withstand voltage between circuits, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.
本实施例中，多个元器件24至少包括间隔设置于电路布线层23上的贴片电阻241和贴片电容242。In this embodiment, the plurality of components 24 at least include chip resistors 241 and chip capacitors 242 that are spaced apart and arranged on the circuit wiring layer 23 .
贴片电阻241在半导体电路板20里面的IGBT芯片栅极处接入，通过限流达到限制IGBT开关速度的作用；贴片电容242在集成式半导体电路里面起到滤波、耦合、自举的作用。当然，根据实际需求，多个元器件24还包括组成半导体电路板20所需的芯片。The chip resistor 241 is connected to the gate of the IGBT chip in the semiconductor circuit board 20 to limit the switching speed of the IGBT by limiting the current; the chip capacitor 242 plays the role of filtering, coupling, and bootstrapping in the integrated semiconductor circuit. Of course, according to actual needs, the multiple components 24 also include the chips required to form the semiconductor circuit board 20.
金属图腾柱29并未与贴片电阻241和贴片电容242相对设置，即金属图腾柱29的数量少于元器件24的数量，因为金属图腾柱29主要用于散热，所以需要与发热量高的元器件24相对设置。The metal totem poles 29 are not arranged opposite to the chip resistors 241 and the chip capacitors 242 , that is, the number of metal totem poles 29 is less than the number of components 24 . Because the metal totem poles 29 are mainly used for heat dissipation, they need to be arranged opposite to the components 24 with high heat generation.
本实施例中，半导体电路板20还包括间隔设置于电路布线层23上的多个散热片27，部分元器件24分别设置于多个散热片27上。其中，散热片27及设置于散热片27上的元器件24称为元器件半成品，设置于散热片27上的元器件24为散热要求高的高压功率元器件24。In this embodiment, the semiconductor circuit board 20 further includes a plurality of heat sinks 27 disposed at intervals on the circuit wiring layer 23, and some components 24 are disposed on the plurality of heat sinks 27. The heat sinks 27 and the components 24 disposed on the heat sinks 27 are called semi-finished components, and the components 24 disposed on the heat sinks 27 are high-voltage power components 24 with high heat dissipation requirements.
散热片27采用铜材表面镀银工艺可以实现元器件24与散热片27之间更好的贴合，以提高散热能力。The heat sink 27 adopts the copper surface silver plating process to achieve better fit between the component 24 and the heat sink 27, so as to improve the heat dissipation capacity.
本实施例中，多个元器件24之间、元器件24与电路布线层23之间通过绑定金属线28实现电连接。In this embodiment, electrical connections are achieved between the multiple components 24 and between the components 24 and the circuit wiring layer 23 through binding metal wires 28 .
绑定金属线28一般为金、铝、铜等材质，用于实现电路里面元器件24之间的电连接。The binding metal wire 28 is generally made of gold, aluminum, copper or the like, and is used to achieve electrical connection between components 24 in the circuit.
另外，线路板10包括绝缘基板、绝缘层、电路布线层以及绿油层等，与半导体电路板20的基板结构相同或类似。In addition, the circuit board 10 includes an insulating substrate, an insulating layer, a circuit wiring layer, and a green oil layer, etc., which are the same or similar to the substrate structure of the semiconductor circuit board 20 .
具体地，散热器30贴设于线路板10的面积大于半导体电路板20贴设于线路板10的面积，这样设计可以提升散热器30对半导体电路板20的散热能力。Specifically, the area of the heat sink 30 attached to the circuit board 10 is larger than the area of the semiconductor circuit board 20 attached to the circuit board 10 . This design can improve the heat dissipation capability of the heat sink 30 for the semiconductor circuit board 20 .
与现有技术相比，本发明中的集成式半导体电路通过将半导体电路板20嵌入线路板10，从而通过无引脚设置的方式实现了半导体电路板20与线路板10的集成，不仅避免了通过引脚连接两个电路模块而因引脚焊接公差在塑封时产生的应力导致引脚焊接处的绝缘层22出现分层情况，还避免了人体静电对内部芯片产生的影响，并降低其生产成本，提高生产效率，另外，还通过在线路板10远离半导体电路板20的一侧固定与半导体电路板20相对的散热器30，并设置穿过线路板10与散热器30贴合设置的金属图腾柱29，进而提升了其散热能力。Compared with the prior art, the integrated semiconductor circuit in the present invention embeds the semiconductor circuit board 20 into the circuit board 10, thereby realizing the integration of the semiconductor circuit board 20 and the circuit board 10 in a pin-free manner. This not only avoids the stress generated by the pin welding tolerance during plastic sealing when connecting two circuit modules through pins, which causes the insulating layer 22 to be delaminated at the pin welding location, but also avoids the influence of human static electricity on the internal chip, reduces its production cost, and improves production efficiency. In addition, a heat sink 30 opposite to the semiconductor circuit board 20 is fixed on the side of the circuit board 10 away from the semiconductor circuit board 20, and a metal totem pole 29 is set through the circuit board 10 and is bonded to the heat sink 30, thereby improving its heat dissipation capacity.
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
上面结合附图对本发明的实施例进行了描述，所揭露的仅为本发明较佳实施例而已，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式用等同变化，均属于本发明的保护之内。The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.
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