CN117913150A

CN117913150A - Sensor package structure

Info

Publication number: CN117913150A
Application number: CN202310297092.3A
Authority: CN
Inventors: 张嘉帅; 林建宏; 王伟立; 余文赋; 黄百胤
Original assignee: Tong Hsing Electronic Industries Ltd
Current assignee: Tong Hsing Electronic Industries Ltd
Priority date: 2022-10-17
Filing date: 2023-03-24
Publication date: 2024-04-19
Also published as: CN117913108A; TWI845221B; TW202418492A; TWI840150B; TW202418605A; CN117913149A; TW202418606A

Abstract

The application discloses a sensor packaging structure which comprises a substrate, a sensing chip, a light-transmitting layer, an adhesive layer and a packaging body, wherein the sensing chip is arranged on the substrate and electrically coupled with the substrate, the adhesive layer is annular and clamped between the sensing chip and the light-transmitting layer, and the packaging body is formed on the substrate. The adhesive layer is provided with two bonding surfaces with equal areas and a centering section positioned between the two bonding surfaces, and the area of the centering section is 115% -200% of the area of the bonding surfaces. The adhesive layer allows light to enter and pass through so that the light is deflected and attenuated within the adhesive layer. The sensing chip, the adhesive layer and the light-transmitting layer are buried in the package body, and at least part of the outer surface of the light-transmitting layer is exposed out of the package body. Accordingly, the structure of the adhesive layer can be suitable for turning and attenuating the light travelling therein, so that the glare phenomenon generated by the sensor packaging structure is effectively reduced.

Description

Sensor package structure

Technical Field

The present disclosure relates to packaging, and particularly to a sensor packaging.

Background

The conventional sensor package structure comprises a transparent sheet, a sensing chip and an adhesive layer adhered between the glass sheet and the sensing chip. However, since light passing through the light-transmitting sheet may be reflected by the adhesive layer, it is easy to affect the sensing region of the sensing chip (e.g., glare phenomenon).

Accordingly, the applicant believes that the above-mentioned drawbacks can be improved, and has made intensive studies and has made an application of scientific principles, and finally has proposed an application which is reasonable in design and effectively improves the above-mentioned drawbacks.

Disclosure of Invention

The application provides a sensor packaging structure which can effectively improve defects possibly generated by the existing sensor packaging structure.

The application discloses a sensor packaging structure, which comprises: a substrate; the sensing chip is arranged on the substrate along a preset direction and is electrically coupled with the substrate; wherein, a top surface of the sensing chip comprises a sensing area and a bearing area surrounding the sensing area; the adhesive layer is annular and is arranged on the bearing area of the sensing chip; wherein the adhesive layer has: a bottom surface connected to the bearing area; a top bonding surface parallel to the bottom bonding surface, the area of the top bonding surface being equal to the area of the bottom bonding surface, and the bottom bonding surface and the top bonding surface being overlapped with each other along a predetermined direction; the middle section is parallel to the bottom bonding surface, and the bottom bonding surface and the top bonding surface are respectively separated from the middle section by the same distance along the preset direction; wherein the area of the middle section is 110% -150% of the area of the bottom joint surface; the adhesive layer can be used for allowing light to enter so as to cause the light to turn and attenuate in the adhesive layer; the transparent layer is provided with an outer surface and an inner surface which are respectively positioned at two opposite sides, and is arranged on the top bonding surface of the adhesive layer, so that a closed space is formed by the transparent layer, the adhesive layer and the sensing chip in a surrounding mode; and a package body formed on the substrate, wherein the sensing chip, the adhesive layer and the light-transmitting layer are embedded in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package, and at least one of the inner edge and the outer edge is curved.

Alternatively, either one of the inner side edge and the outer side edge of the adhesive layer is not formed with a concave curved surface.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package; wherein, in a vertical section of the adhesive layer with a vertical centering section, at least one of the inner side edge and the outer side edge is in an arc shape, and the center of the circle is located in the centering section.

Optionally, the centering section is perpendicular to the preset direction; the area of the centering section is the largest among all sections of the adhesive layer perpendicular to the preset direction.

Alternatively, the area of the bottom bonding surface and the area of the top bonding surface are the smallest among all the sections of the adhesive layer perpendicular to the predetermined direction.

Optionally, the sensor package structure further includes a plurality of metal wires, wherein two ends of each metal wire are respectively connected to the substrate and the carrying area of the sensing chip, so that the substrate and the sensing chip are electrically coupled with each other; each metal line is located outside the adhesive layer and embedded in the package.

The embodiment of the application also discloses a sensor packaging structure, which comprises: a substrate; the sensing chip is arranged on the substrate along a preset direction and is electrically coupled with the substrate; wherein, a top surface of the sensing chip comprises a sensing area and a bearing area surrounding the sensing area; the adhesive layer is annular and is arranged on the bearing area of the sensing chip; wherein the adhesive layer has: a bottom surface connected to the bearing area; a top bonding surface parallel to the bottom bonding surface, the area of the top bonding surface being equal to the area of the bottom bonding surface, and the bottom bonding surface and the top bonding surface being overlapped with each other along a predetermined direction; the middle section is parallel to the bottom bonding surface, and the bottom bonding surface and the top bonding surface are respectively separated from the middle section by the same distance along the preset direction; the area of the centering section is 90% -110% of the area of the bottom bonding surface, and the bottom bonding surface and the centering section only partially overlap along a preset direction; the adhesive layer can be used for allowing light to enter so as to cause the light to turn and attenuate in the adhesive layer; the transparent layer is provided with an outer surface and an inner surface which are respectively positioned at two opposite sides, and is arranged on the top bonding surface of the adhesive layer, so that a closed space is formed by the transparent layer, the adhesive layer and the sensing chip in a surrounding mode; and a package body formed on the substrate, wherein the sensing chip, the adhesive layer and the light-transmitting layer are embedded in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package, wherein one of the inner edge and the outer edge is concave, and the other of the inner edge and the outer edge is convex.

Optionally, in a longitudinal section of the adhesive layer perpendicular to the centering section, the convex curved surface is circular-arc-shaped and its center is located at the centering section, and the concave curved surface is circular-arc-shaped and its center is located at the extension path of the centering section.

Alternatively, in a longitudinal section of the adhesive layer with a vertical middle section, the convex curved surface and the concave curved surface are both arc-shaped and have the same radius.

Alternatively, the centering cross section is perpendicular to the preset direction, and all cross sections of the adhesive layer perpendicular to the preset direction have equal areas.

The application further discloses a sensor package structure, which comprises: a substrate; the sensing chip is arranged on the substrate along a preset direction and is electrically coupled with the substrate; wherein, a top surface of the sensing chip comprises a sensing area and a bearing area surrounding the sensing area; the adhesive layer is annular and is arranged on the bearing area of the sensing chip; wherein the adhesive layer has: a bottom surface connected to the bearing area; a top bonding surface parallel to the bottom bonding surface, wherein the area of the top bonding surface is equal to that of the bottom bonding surface, and the bottom bonding surface and the top bonding surface only partially overlap along a preset direction; the middle section is parallel to the bottom bonding surface, and the bottom bonding surface and the top bonding surface are respectively separated from the middle section by the same distance along the preset direction; the adhesive layer can be used for allowing light to enter so as to cause the light to turn and attenuate in the adhesive layer; the transparent layer is provided with an outer surface and an inner surface which are respectively positioned at two opposite sides, and is arranged on the top bonding surface of the adhesive layer, so that a closed space is formed by the transparent layer, the adhesive layer and the sensing chip in a surrounding mode; and a package body formed on the substrate, wherein the sensing chip, the adhesive layer and the light-transmitting layer are embedded in the package body, and at least part of the outer surface of the light-transmitting layer is exposed outside the package body.

Alternatively, the area of the centering cross-section is 90% to 110% of the area of the bottom contact surface.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package; in a longitudinal section of the adhesive layer of the vertical centering section, the bottom bonding surface, the top bonding surface, the inner side edge, and the outer side edge together form a parallelogram.

Optionally, the parallelogram has two acute angles and two obtuse angles in the longitudinal section of the adhesive layer, and the angle of any acute angle is between 10 degrees and 80 degrees.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package, and at least one of the inner edge and the outer edge is curved, and no concave curved surface is formed on any one of the inner edge and the outer edge.

Optionally, the adhesive layer has an inner edge located in the enclosed space and an outer edge connected to the package; wherein, in a vertical section of the adhesive layer with a vertical centering section, at least one of the inner side edge and the outer side edge is in an arc shape, and the center of the circle is positioned on the adhesive layer but not located on the centering section.

In summary, in the sensor package structure disclosed in the present application, the adhesive layer is matched with the opposite structure of the bottom bonding surface and the top bonding surface through the middle section, so that the structure of the adhesive layer can be suitable for turning and attenuating the light travelling therein, thereby effectively reducing the glare generated in the sensor package structure.

For a further understanding of the nature and the technical aspects of the present application, reference should be made to the following detailed description of the application and the accompanying drawings, which are included to illustrate and not to limit the scope of the application.

Drawings

Fig. 1 is a schematic perspective view of a sensor package structure according to a first embodiment of the application.

Fig. 2 is a schematic top view of fig. 1.

Fig. 3 is a schematic cross-sectional view of fig. 2 along section line III-III.

Fig. 4 is an enlarged schematic view of the area IV of fig. 3.

Fig. 5 is a schematic cross-sectional view of another embodiment of a sensor package structure according to the first embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of another embodiment of a sensor package structure according to the first embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of a sensor package structure according to a second embodiment of the application.

Fig. 8 is a schematic cross-sectional view of another embodiment of a sensor package structure according to the second embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of a sensor package structure according to a third embodiment of the present application.

Fig. 10 is an enlarged schematic view of the region X of fig. 9.

FIG. 11 is a schematic cross-sectional view of another embodiment of a sensor package structure according to a third embodiment of the present application.

Fig. 12 is a schematic cross-sectional view of a sensor package structure according to a third embodiment of the present application.

Fig. 13 is a schematic cross-sectional view of a sensor package structure according to a fourth embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of another embodiment of a sensor package structure according to a fourth embodiment of the present application.

Fig. 15 is a schematic cross-sectional view of a sensor package structure according to another embodiment of the present application.

Detailed Description

The following specific examples are given to illustrate the embodiments of the present application disclosed herein with respect to "sensor package structure", and those skilled in the art will be able to understand the advantages and effects of the present application from the disclosure herein. The application is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the application. The drawings of the present application are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present application in detail, but the disclosure is not intended to limit the scope of the present application.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.

Fig. 1 to 6 show an embodiment of the present application. As shown in fig. 1 and 2, the present embodiment discloses a sensor package structure 100; that is, the inside is not any structure for packaging the sensor, and the structural design basis is different from the sensor packaging structure 100 according to the present embodiment, so that the two are not suitable for comparison.

As shown in fig. 3 to 6, the sensor package structure 100 includes a substrate 1, a sensing chip 2 disposed on the substrate 1, a plurality of metal wires 3 electrically coupling the sensing chip 2 and the substrate 1, an adhesive layer 4 disposed on the sensing chip 2 in a ring shape, a light-transmitting layer 5 disposed on the adhesive layer 4, and a package 6 formed on the substrate 1.

Although the sensor package 100 is described in the embodiment including the above components, the sensor package 100 may be adjusted and changed according to design requirements. For example, in other embodiments of the application not shown, the sensor package 100 may omit the metal wires 3, and the sensing chip 2 is fixed and electrically coupled to the substrate 1 by flip-chip or die-bonding. The respective component configurations and connection relationships of the sensor package 100 in the present embodiment will be described below.

The substrate 1 is square or rectangular in this embodiment, but the present application is not limited thereto. Wherein, the substrate 1 is provided with a chip fixing region 111 at a substantially center of the upper surface 11 thereof, and the substrate 1 is formed with a plurality of bonding pads 112 located outside the chip fixing region 111 at the upper surface 11. The bonding pads 112 are substantially arranged in a ring shape in the present embodiment, but the present application is not limited thereto. For example, in other embodiments of the present application, which are not shown, the bonding pads 112 may be arranged in two rows on opposite sides of the chip fixing region 111.

In addition, the substrate 1 may also have a plurality of solder balls 7 on the lower surface 12 thereof, and the sensor package 100 may be soldered to an electronic component (not shown) by the plurality of solder balls 7, so that the sensor package 100 may be electrically connected to the electronic component by the plurality of solder balls 7.

The sensor chip 2 is square (e.g. rectangle or square) in the present embodiment and is illustrated by an image sensor chip, but not limited thereto. Wherein (the bottom surface 22 of) the sensing chip 2 is fixed to the chip fixing region 111 of the substrate 1 along a predetermined direction D (and through die bond); that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing region 211 and a carrying region 212 surrounding the sensing region 211 (and having a ring shape), and two ends of each metal wire 3 are respectively connected to the substrate 1 and the carrying region 212 of the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

In more detail, the sensing chip 2 includes a plurality of connection pads 213 located in the carrying area 212 (i.e., the plurality of connection pads 213 are located outside the sensing area 211). The number and positions of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and positions of the plurality of bonding pads 112 of the substrate 1 in the present embodiment; that is, the plurality of connection pads 213 are also arranged in a substantially annular shape in the present embodiment. Furthermore, the two ends of each metal wire 3 are respectively connected to one of the bonding pads 112 and the corresponding connection pad 213.

The adhesion layer 4 is disposed on the carrying region 212 of the sensing chip 2 and surrounds the outer side of the sensing region 211, and each metal wire 3 is located outside the adhesion layer 4. Wherein the adhesive layer 4 has a bottom bonding surface 41 connected to the carrying region 212, a top bonding surface 42 connected to the light-transmitting layer 5, and a middle section 43 between the bottom bonding surface 41 and the top bonding surface 42.

It should be noted that, the adhesive layer 4 can let the light L enter and pass through, so that the light L is turned and attenuated in the adhesive layer 4, thereby effectively reducing the glare (flare phenomenon) generated in the sensor package 100. In this embodiment, the adhesion layer 4 is mainly configured by the cooperation of the opposite structure of the middle section 43 and the top surface 42 compared to the bottom surface 41, so that the adhesion layer 4 can be configured to divert and attenuate the light L traveling therein.

In more detail, the bottom contact surface 41, the top contact surface 42 and the centering cross section 43 are parallel to each other and perpendicular to the predetermined direction D, and the bottom contact surface 41 and the top contact surface 42 are each spaced apart from the centering cross section 43 by an equal distance along the predetermined direction D. Wherein the area of the top bonding surface 42 is equal to the area of the bottom bonding surface 41, and the bottom bonding surface 41 and the top bonding surface 42 overlap each other in the preset direction D; that is, the contour of the bottom contact surface 41 is aligned with the contour of the top contact surface 42 along the predetermined direction D.

The area of the centering section 43 is 110% to 150% of the area of the bottom contact surface 41. Further, of all the sections of the adhesive layer 4 perpendicular to the predetermined direction D, the area of the bottom contact surface 41 and the area of the top contact surface 42 are the smallest, and the area of the centering section 43 is the largest. That is, the adhesive layer 4 has a structure with a wide center and narrow ends.

In addition, the adhesive layer 4 has an inner edge 44 adjacent to the sensing region 211 and an outer edge 45 adjacent to the plurality of connection pads 213, and the specific shapes of the inner edge 44 and the outer edge 45 can be adjusted and changed according to the design requirement, so that it is difficult to represent all aspects in the embodiment, so only a part of preferred embodiments are described below, but the application is not limited thereto.

At least one of the inner edge 44 and the outer edge 45 is curved, and any one of the inner edge 44 and the outer edge 45 is preferably not formed with a concave curved surface (concave surface). For example, the inner edge 44 and the outer edge 45 may each have a convex curved surface (convex sueface) as shown in fig. 3; or one of the inner edge 44 and the outer edge 45 may be a convex curved surface (e.g. fig. 5 and 6).

Further, in a longitudinal section of the adhesive layer 4 perpendicular to the centering section 43, at least one of the inner side edge 44 and the outer side edge 45 is circular and its center C44, C45 is located on the centering section 43, and the width W43 of the centering section 43 is 10% -500% of the distance H4 between the bottom bonding surface 41 and the top bonding surface 42.

The light-transmitting layer 5 is illustrated as a sheet glass in the present embodiment, but the present application is not limited thereto. The transparent layer 5 has an outer surface 51 and an inner surface 52 on opposite sides, and the transparent layer 5 (with the inner surface 52) is disposed on the top surface 42 of the adhesive layer 4, so that an enclosed space E is formed by the transparent layer 5, the adhesive layer 4 and the sensing chip 2, and the inner edge 44 of the adhesive layer 4 and the sensing region 211 of the sensing chip 2 are both located in the enclosed space E.

The package 6 is opaque in this embodiment to block visible light from passing therethrough. The package 6 is illustrated with a liquid encapsulant (Liquid encapsulation), and the package 6 is formed on the upper surface 11 of the substrate 1 with its edges aligned with the edges of the substrate 1. Each of the metal wires 3, the sensing chip 2, the adhesive layer 4 and the transparent layer 5 is buried in the package 6 (e.g. the outer edge 45 of the adhesive layer 4 is connected to the package 6), and at least a portion of the outer surface 51 of the transparent layer 5 is exposed outside the package 6, but the application is not limited thereto.

It should be noted that, in the conventional sensor package structure, the inner edge of the adhesive layer is usually subjected to a profile treatment (e.g. saw-tooth-shaped inner edge) to improve the glare phenomenon by scattering the light. However, the sensor package structure 100 of the present embodiment is free from the above-mentioned prior art, and the whole structure of the adhesive layer 4 is changed to divert and attenuate the light L therein, so as to more effectively improve the glare phenomenon.

Fig. 7 and 8 show a second embodiment of the present application. Since the present embodiment is similar to the first embodiment, the same points of the two embodiments (e.g. the substrate 1, the sensing chip 2, the plurality of metal wires 3, the transparent layer 5, and the package 6) are not described in detail, but the difference between the present embodiment and the first embodiment is mainly that: the specific structure of the adhesive layer 4 is configured.

In this embodiment, the adhesive layer 4 has a bottom contact surface 41 contacting the carrying region 212, a top contact surface 42 contacting the light-transmitting layer 5, and a middle section 43 between the bottom contact surface 41 and the top contact surface 42.

It should be noted that the adhesive layer 4 can be used for allowing the light L to enter, so that the light L is turned and attenuated in the adhesive layer 4, thereby effectively reducing the glare generated in the sensor package structure 100. In this embodiment, the adhesion layer 4 is mainly configured by the cooperation of the opposite structure of the middle section 43 and the top surface 42 compared to the bottom surface 41, so that the adhesion layer 4 can be configured to divert and attenuate the light L traveling therein.

In more detail, the bottom contact surface 41, the top contact surface 42, and the centering cross section 43 are parallel to each other and perpendicular to the predetermined direction D, and the bottom contact surface 41 and the top contact surface 42 are each spaced apart from the centering cross section 43 by an equal distance along the predetermined direction D. Wherein the area of the top bonding surface 42 is equal to the area of the bottom bonding surface 41, and the bottom bonding surface 41 and the top bonding surface 42 overlap each other in the preset direction D; that is, the contour of the bottom contact surface 41 is aligned with the contour of the top contact surface 42 along the predetermined direction D.

Further, the area of the centering section 43 is 90% to 110% of the area of the bottom contact surface 41, and the bottom contact surface 41 and the centering section 43 are only partially overlapped in the predetermined direction D. In this embodiment, all the sections of the adhesive layer 4 perpendicular to the predetermined direction D preferably have the same area (e.g., the area of the centering section 43 is equal to the area of the bottom bonding surface 41), and the centering section 43 is offset from the bottom bonding surface 41 and the top bonding surface 42.

In addition, the adhesive layer 4 has an inner edge 44 located in the enclosed space E and an outer edge 45 connected to the package 6, and the specific shapes of the inner edge 44 and the outer edge 45 can be adjusted and changed according to the design requirement, so that it is difficult to represent all aspects in the embodiment, so the following only illustrates a part of preferred embodiments, but the application is not limited thereto.

One of the inner edge 44 and the outer edge 45 is concavely curved, and the other of the inner edge 44 and the outer edge 45 is convexly curved. Further, in a longitudinal section of the adhesive layer 4 perpendicular to the centering section 43, the convex curved surface and the concave curved surface are preferably both arc-shaped and have the same radius, and the centers C44, C45 of the convex curved surface are located on the centering section 43, the centers C44, C45 of the concave curved surface are located on the extending path of the centering section 43, and the width W43 of the centering section 43 is 10% -500% of the distance H4 between the bottom contact surface 41 and the top contact surface 42.

Example III

Please refer to fig. 9-12, which illustrate a third embodiment of the present application. Since the present embodiment is similar to the first embodiment, the same points of the two embodiments (e.g. the substrate 1, the sensing chip 2, the plurality of metal wires 3, the transparent layer 5 and the package 6) are not described in detail, but the difference between the present embodiment and the first embodiment is mainly that: the specific structure of the adhesive layer 4 is configured.

In this embodiment, as shown in fig. 9 to 11, the adhesive layer 4 has a bottom bonding surface 41 connected to the carrying region 212, a top bonding surface 42 connected to the light-transmitting layer 5, and a middle section 43 located between the bottom bonding surface 41 and the top bonding surface 42.

In more detail, the bottom contact surface 41, the top contact surface 42, and the centering cross section 43 are parallel to each other and perpendicular to the predetermined direction D, and the bottom contact surface 41 and the top contact surface 42 are each spaced apart from the centering cross section 43 by an equal distance along the predetermined direction D. Wherein the area of the top bonding surface 42 is equal to the area of the bottom bonding surface 41, and the bottom bonding surface 41 and the top bonding surface 42 only partially overlap in the preset direction D; that is, the bottom contact surface 41 is offset from the top contact surface 42, but the top contact surface 42 is not located directly above the sensing region 211.

Further, the area of the centering section 43 is 90% to 110% of the area of the bottom contact surface 41, and the bottom contact surface 41 and the centering section 43 are only partially overlapped in the preset direction D, and the top contact surface 42 and the centering section 43 are also only partially overlapped in the preset direction D. In this embodiment, all the sections of the adhesive layer 4 perpendicular to the predetermined direction D preferably have the same area (e.g., the area of the centering section 43 is equal to the area of the bottom bonding surface 41), and the centering section 43 is offset from the bottom bonding surface 41 and the top bonding surface 42.

As shown in fig. 10, in a longitudinal section of the adhesive layer 4 perpendicular to the centering section 43, a width W43 of the centering section 43 is 10% -500% of a distance H4 between the bottom bonding surface 41 and the top bonding surface 42, the bottom bonding surface 41, the top bonding surface 42, the inner side edge 44, and the outer side edge 45 together form a parallelogram, and the parallelogram has two acute angles σ1 and two obtuse angles σ2, and an angle of any one of the acute angles σ1 is 10-80 degrees, but the application is not limited thereto.

Or as shown in fig. 12, one of the inner edge 44 and the outer edge 45 of the adhesive layer 4 is a concave curved surface, and the other of the inner edge 44 and the outer edge 45 is a convex curved surface, the convex curved surface and the concave curved surface are preferably both arc-shaped and have the same radius, and the center C45 of the convex curved surface is located on the adhesive layer 4 but not located on the middle section 43.

Example IV

Please refer to fig. 13-15, which illustrate a fourth embodiment of the present application. Since the present embodiment is similar to the third embodiment, the same points of the two embodiments (e.g. the substrate 1, the sensing chip 2, the plurality of metal wires 3, the transparent layer 5 and the package 6) are not described in detail, but the difference between the present embodiment and the third embodiment is that: the specific structure of the adhesive layer 4 is configured.

In this embodiment, the area of the centering section 43 is 110% to 150% of the area of the bottom contact surface 41. Further, of all the sections of the adhesive layer 4 perpendicular to the predetermined direction D, the area of the bottom contact surface 41 and the area of the top contact surface 42 are the smallest, and the area of the centering section 43 is the largest. That is, the adhesive layer 4 has a structure with a wide center and narrow ends.

At least one of the inner edge 44 and the outer edge 45 is curved, and any one of the inner edge 44 and the outer edge 45 is preferably not formed with a concave curved surface. For example, the inner edge 44 and the outer edge 45 may each have a convex curved surface as shown in fig. 13; or one of the inner edge 44 and the outer edge 45 may be a convex curved surface (e.g. fig. 14 and 15).

Further, in a longitudinal section of the adhesive layer 4 perpendicular to the centering section 43, at least one of the inner side edge 44 and the outer side edge 45 is circular arc-shaped, and the centers C44, C45 thereof are located on the adhesive layer 4 but not located on the centering section 43, and the width W43 of the centering section 43 is 10% -500% of the distance H4 between the bottom bonding surface 41 and the top bonding surface 42.

In summary, according to the sensor package structure disclosed by the embodiment of the application, the adhesive layer is matched with the opposite structure of the bottom bonding surface and the top bonding surface through the centering section, so that the structure of the adhesive layer can be suitable for turning and attenuating the light travelling therein, and further, the glare phenomenon generated by the sensor package structure is effectively reduced.

The foregoing disclosure is only illustrative of the preferred embodiments of the present application and is not to be construed as limiting the scope of the application, as all changes which come within the meaning and range of equivalency of the specification and drawings are intended to be embraced therein.

Claims

1. A sensor packaging structure, characterized in that the sensor packaging structure comprises:

a substrate;

A sensing chip is disposed on the substrate along a preset direction and is electrically coupled to the substrate; wherein a top surface of the sensing chip includes a sensing area and a supporting area surrounding the sensing area;

An adhesive layer, in a ring shape and disposed on the supporting area of the sensing chip; wherein the adhesive layer has:

A bottom connecting surface connected to the bearing area;

a top connecting surface, parallel to the bottom connecting surface, the area of the top connecting surface is equal to the area of the bottom connecting surface, and the bottom connecting surface and the top connecting surface overlap each other along the preset direction; and

a center cross section parallel to the bottom connecting surface, and the bottom connecting surface and the top connecting surface are each spaced equidistant from the center cross section along the preset direction; wherein the area of the center cross section is 110% to 150% of the area of the bottom connecting surface;

The adhesive layer can be used to allow light to enter, so that the light is turned and attenuated within the adhesive layer;

a light-transmitting layer having an outer surface and an inner surface located at opposite sides, and the light-transmitting layer is disposed on the top contact surface of the adhesive layer, so that the light-transmitting layer, the adhesive layer, and the sensing chip together surround a closed space; and

A package is formed on the substrate, and the sensing chip, the adhesive layer, and the light-transmitting layer are buried in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

2. The sensor packaging structure according to claim 1, wherein the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body, and at least one of the inner edge and the outer edge is curved.

3 . The sensor packaging structure according to claim 2 , wherein no concave surface is formed on either the inner edge or the outer edge of the adhesive layer.

4. The sensor packaging structure according to claim 3 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body; wherein, in a longitudinal section of the adhesive layer perpendicular to the center section, at least one of the inner edge and the outer edge is in an arc shape and its center is located on the center section.

5 . The sensor packaging structure according to claim 1 , wherein the center cross section is perpendicular to the preset direction; and among all cross sections of the adhesive layer perpendicular to the preset direction, the area of the center cross section is the largest.

6 . The sensor package structure according to claim 5 , wherein among all cross sections of the adhesive layer perpendicular to the predetermined direction, the area of the bottom connecting surface and the area of the top connecting surface are the smallest.

7. The sensor packaging structure according to claim 1 is characterized in that the sensor packaging structure further includes a plurality of metal wires, and two ends of each of the metal wires are respectively connected to the substrate and the supporting area of the sensor chip to electrically couple the substrate and the sensor chip to each other; each of the metal wires is located on the outside of the adhesive layer and buried in the packaging body.

8. A sensor packaging structure, characterized in that the sensor packaging structure comprises: a substrate;

A bottom connecting surface connected to the bearing area;

a center section parallel to the bottom connecting surface, and the bottom connecting surface and the top connecting surface are each spaced the same distance from the center section along the preset direction; wherein the area of the center section is 90% to 110% of the area of the bottom connecting surface, and the bottom connecting surface and the center section only partially overlap along the preset direction;

9. The sensor packaging structure according to claim 8 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body, and one of the inner edge and the outer edge is a concave surface, and the other of the inner edge and the outer edge is a convex surface.

10. The sensor packaging structure according to claim 9 is characterized in that, in a longitudinal section of the adhesive layer perpendicular to the center section, the convex surface is in an arc shape with its center located on the center section, and the concave surface is in an arc shape with its center located on an extension path of the center section.

11 . The sensor packaging structure according to claim 9 , wherein in a longitudinal section of the adhesive layer perpendicular to the center section, the convex curved surface and the concave curved surface are both arc-shaped and have the same radius.

12 . The sensor package structure according to claim 8 , wherein the center cross section is perpendicular to the preset direction, and all cross sections of the adhesive layer perpendicular to the preset direction have equal areas.

13. A sensor packaging structure, characterized in that the sensor packaging structure comprises: a substrate;

A bottom connecting surface connected to the bearing area;

a top connecting surface, parallel to the bottom connecting surface, the area of the top connecting surface is equal to the area of the bottom connecting surface, and the bottom connecting surface and the top connecting surface only partially overlap along the preset direction; and

A center cross section, parallel to the bottom connecting surface, and the bottom connecting surface and the top connecting surface are equally spaced from the center cross section along the preset direction;

14 . The sensor packaging structure according to claim 13 , wherein the area of the center cross section is 90% to 110% of the area of the bottom bonding surface.

15. The sensor packaging structure according to claim 14 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body; in a longitudinal section of the adhesive layer perpendicular to the center section, the bottom connecting surface, the top connecting surface, the inner edge, and the outer edge together form a parallelogram.

16 . The sensor package structure according to claim 15 , wherein in the longitudinal section of the adhesive layer, the parallelogram has two acute angles and two obtuse angles, and an angle of any of the acute angles is between 10 degrees and 80 degrees.

17. The sensor packaging structure according to claim 13 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body, and one of the inner edge and the outer edge is a concave surface, and the other of the inner edge and the outer edge is a convex surface.

18. The sensor packaging structure according to claim 14 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body, and at least one of the inner edge and the outer edge is curved, and neither of the inner edge nor the outer edge has a concave curved surface.

19. The sensor packaging structure according to claim 18 is characterized in that the adhesive layer has an inner edge located in the closed space and an outer edge connected to the packaging body; wherein, in a longitudinal section of the adhesive layer perpendicular to the center section, at least one of the inner edge and the outer edge is in an arc shape and its center is located in the adhesive layer but not located in the center section.