CN117715405A - Lamination structure pasting method and lamination structure pasting system - Google Patents
Lamination structure pasting method and lamination structure pasting system Download PDFInfo
- Publication number
- CN117715405A CN117715405A CN202410142212.7A CN202410142212A CN117715405A CN 117715405 A CN117715405 A CN 117715405A CN 202410142212 A CN202410142212 A CN 202410142212A CN 117715405 A CN117715405 A CN 117715405A
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- suction nozzle
- copper
- suction
- negative pressure
- abm
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000003475 lamination Methods 0.000 title abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 79
- 239000010949 copper Substances 0.000 claims abstract description 79
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- 229910052709 silver Inorganic materials 0.000 claims abstract description 39
- 239000004332 silver Substances 0.000 claims abstract description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a lamination structure pasting method and a lamination structure pasting system; the method comprises the following steps: coating silver paste on a ceramic copper-clad substrate (ABM) to obtain a ceramic copper-clad substrate (ABM) to be used; at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, the first suction nozzle and the second suction nozzle are heated, after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS), the first suction nozzle and the second suction nozzle are moved, and the copper sheets and corresponding chips are adhered into a whole to form a laminated assembly; moving the first suction nozzle and the second suction nozzle, and attaching the adsorbed laminated assembly to a corresponding position of a ceramic copper-clad substrate (ABM) to be used; the technical problem that the existing SiC chip mounting method in the prior art needs two suction nozzles to jointly finish the mounting of one SiC chip and one copper sheet and has low working efficiency is solved by the proposal of the lamination structure mounting method.
Description
Technical Field
The invention relates to the technical field of chip mounting, in particular to a lamination structure mounting method and a lamination structure mounting system.
Background
For the power module using SiC chips, the conventional aluminum wire bonding method has approached its limit in terms of current carrying capacity, heat conducting capacity and reliability, so copper wire bonding is mostly adopted, and copper sheet (DTS) covering is required to be performed on the surface of the power module to satisfy the copper wire bonding.
As shown in fig. 1 and 2, in the conventional mounting method of SiC chips, in order to print silver paste on a ceramic copper-clad substrate (ABM), one of the suction nozzles is used to mount the chip on the AMB, and then the other suction nozzle is used to suck copper sheets (DTS, the back of each copper sheet contains silver paste) and mount the copper sheets on the AMB, the two suction nozzles are occupied by the copper sheets and the chip respectively, and the two suction nozzles are required to jointly complete the mounting of one SiC chip and one copper sheet, so that the working efficiency is low.
Furthermore, placing the SiC chip can apply certain pressure to the silver paste on the AMB, and when placing the copper sheet, certain pressure can be applied to the silver paste on the AMB, and the printed silver paste is extruded twice, so that the thickness of the silver paste is easy to extrude, and the reliability of a product is influenced.
Accordingly, in view of the foregoing, there is a need in the art for a method and system for laminating a sheet.
Disclosure of Invention
The invention aims to provide a lamination structure pasting method and a lamination structure pasting system, which solve the technical problems that two suction nozzles are required to jointly complete pasting of one SiC chip and one copper sheet in the existing pasting method of the SiC chip in the prior art by the proposal of the lamination structure pasting method, and the working efficiency is low.
The invention provides a lamination structure pasting method, which is characterized in that: the method comprises the following steps:
a ceramic copper-clad substrate (ABM) is coated with silver paste, a standby ceramic copper-clad substrate (ABM) is obtained, the standby ceramic copper-clad substrate (ABM) is placed on a patch platform, the platform is heated to 140+/-20 ℃, negative pressure is formed on the platform, and the negative pressure value is-80 to-70 kpa;
at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃;
after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with glue points on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly;
and moving the first suction nozzle and the second suction nozzle, and mounting the adsorbed laminated assembly on a corresponding position of a ceramic copper-clad substrate (ABM) to be used, thereby completing mounting.
Preferably, a negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure has a value of-60 kpa to-50 kpa.
Preferably, the first suction nozzle and the second suction nozzle are moved to absorb the copper sheet and the chip into a whole, and the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 5-15N; and moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N.
Preferably, the first suction nozzle and the second suction nozzle stay for 0.1-2s when adsorbing the corresponding copper sheets.
Preferably, the thickness of the silver paste layer is 100±20 um.
The invention also provides a lamination structure pasting method, which comprises the following steps:
placing a ceramic copper-clad substrate (ABM) on a patch platform, heating the platform to 140+/-20 ℃, and forming negative pressure on the platform, wherein the negative pressure value is-80 to-70 kpa;
at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃;
after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with dispensing on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly;
moving the first suction nozzle and the second suction nozzle, pressing the adsorbed laminated assembly to the surface of a prefabricated silver film, applying pressure of 25+/-10N, and applying the silver film on the back surface of the chip;
and (3) moving the first suction nozzle and the second suction nozzle, and attaching the adsorbed laminated assembly with the silver film to the corresponding position of the ceramic copper-clad substrate (ABM) to complete the attachment.
Preferably, the silver film has a thickness of 100±20 um.
Preferably, negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure value is-60 kpa to-50 kpa;
moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 5-15N; moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N; when the first suction nozzle and the second suction nozzle adsorb corresponding copper sheets, the copper sheets stay for 0.1-2s.
The invention also provides a laminated structure patch system based on the laminated structure patch method, which comprises
A printing mechanism for printing silver paste on a ceramic copper-clad substrate (ABM);
the transverse and longitudinal moving mechanism is used for driving the suction nozzle to move transversely and longitudinally;
at least one pair of suction nozzles arranged on the transverse and longitudinal moving mechanism and used for adsorbing the copper sheets;
a vacuum pump communicated with the suction nozzle and used for generating negative pressure in the suction nozzle;
the heating mechanism is connected with the suction nozzle and used for heating the suction nozzle;
and the visual mechanism is arranged on the transverse and longitudinal moving mechanism and is used for scanning the adsorption position.
Preferably, the heating mechanism comprises a ceramic plate connected with the suction nozzle and a heating wire arranged on the ceramic, and the heating wire is electrically connected with the power supply.
Compared with the prior art, the laminated structure pasting method and the laminated structure pasting system provided by the invention have the following steps:
1. according to the invention, at least one pair of suction nozzles are moved by a lamination structure pasting method, copper sheets with dispensing and chips are stacked together to form a lamination structure assembly, and then the lamination structure assembly is pasted on a ceramic copper-clad substrate (ABM), compared with the traditional process, the pasting process can complete pasting of one group of chips and copper sheets by one suction nozzle (the traditional process requires two suction nozzles to complete pasting of one group of chips and copper sheets), so that the pasting efficiency is greatly improved, the efficiency is improved by 50%, and the production line pasting UPH (hourly output) is improved.
2. According to the invention, the lamination structure pasting method is used for only extruding the silver paste of the ceramic copper-clad substrate (ABM) once, so that the phenomenon of silver paste extrusion in the traditional pasting mode can not occur.
3. According to the invention, firstly, a lamination structure pasting method is adopted to put forward, at least one pair of suction nozzles are moved, copper sheets with dispensing and chips are stacked together to form a lamination structure assembly, then the suction nozzles are moved, a glue film is pasted on the back surface of the chips, the lamination assembly with the glue film is pasted on a ceramic copper-clad substrate (ABM), compared with the traditional process, the pasting process can be carried out by one suction nozzle, the pasting of one group of chips and copper sheets can be completed by one suction nozzle (the pasting of one group of chips and copper sheets is completed by two suction nozzles in the traditional process), the pasting efficiency is greatly improved by 50%, and the production line pasting UPH (output per hour) is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a prior art SiC patch assembly;
FIG. 2 is a flow chart of a prior art SiC patch process;
FIG. 3 is a flow chart of a process for bonding SiC according to an embodiment of the invention;
fig. 4 is a flow chart of a SiC mounting process according to a second embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 3, the present invention provides a lamination patch method, which includes the following steps:
1) A ceramic copper-clad substrate (ABM) is coated with silver paste, a standby ceramic copper-clad substrate (ABM) is obtained, the standby ceramic copper-clad substrate (ABM) is placed on a patch platform, the platform is heated to 140+/-20 ℃, negative pressure is formed on the platform, and the negative pressure value is-80 to-70 kpa;
2) At least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃; the temperature of the first suction nozzle and the temperature of the second suction nozzle need to reach the required temperature, after the copper sheet is adsorbed, the back surface of the copper sheet can be glued and softened, so that the copper sheet is adhered to a chip, and meanwhile, the presintering effect can be achieved by applying pressure during mounting;
3) After negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with dispensing on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly; the back of the copper sheet is glued and softened, the first suction nozzle and the second suction nozzle apply pressure, and the copper sheet and the corresponding chip are bonded into a whole.
4) And moving the first suction nozzle and the second suction nozzle, and mounting the adsorbed laminated assembly on a corresponding position of a ceramic copper-clad substrate (ABM) to be used, thereby completing mounting.
According to the invention, at least one pair of suction nozzles are moved by a lamination structure pasting method, copper sheets with dispensing and chips are stacked together to form a lamination structure assembly, and then the lamination structure assembly is pasted on a ceramic copper-clad substrate (ABM), compared with the traditional process, the pasting process can complete pasting of one group of chips and copper sheets by one suction nozzle (the traditional process requires two suction nozzles to complete pasting of one group of chips and copper sheets), so that the pasting efficiency is greatly improved, the efficiency is improved by 50%, and the production line pasting UPH (hourly output) is improved.
Moreover, compared with the traditional method of pressurizing silver paste twice, the method provided by the invention has the advantages that the silver paste extrusion phenomenon in the traditional mounting mode can not occur because the silver paste is extruded only once by the lamination structure mounting method for ceramic copper-clad substrate (ABM) silver paste.
Specifically, negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure value is-60 kpa to-50 kpa, so that the stability of the adsorbed copper sheet is ensured.
Specifically, remove first suction nozzle and second suction nozzle, adsorb copper sheet and chip an organic whole respectively, first suction nozzle and second suction nozzle apply the pressure value to the copper sheet and be 5-15N, guarantee that copper sheet and chip's adhesion are in an organic whole, can not excessively exert pressure simultaneously, lead to the chip to take place deformation.
Specifically, the first suction nozzle and the second suction nozzle are moved to adsorb the copper sheet and the chip into a whole, and the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N.
Specifically, when the first suction nozzle and the second suction nozzle adsorb corresponding copper sheets, the copper sheets stay for 0.1-2s.
Specifically, the thickness of the silver paste layer was 100±20 um.
Specifically, a silver paste is coated on a ceramic copper-clad substrate (ABM) by a printing method.
Specifically, the suction nozzle is made of metal, so that heat is conducted rapidly.
The invention also provides a laminated structure patch system based on the laminated structure patch method, which comprises
A printing mechanism for printing silver paste on a ceramic copper-clad substrate (ABM);
the transverse and longitudinal moving mechanism is used for driving the suction nozzle to move transversely and longitudinally;
at least one pair of suction nozzles arranged on the transverse and longitudinal moving mechanism and used for adsorbing the copper sheets;
a vacuum pump communicated with the suction nozzle and used for generating negative pressure in the suction nozzle;
the heating mechanism is connected with the suction nozzle and used for heating the suction nozzle;
and the visual mechanism is arranged on the transverse and longitudinal moving mechanism and is used for scanning the adsorption position.
Specifically, the heating mechanism comprises a ceramic plate connected with the suction nozzle and a heating wire arranged on the ceramic, and the heating wire is electrically connected with a power supply.
The transverse and longitudinal moving mechanism can be realized by crisscross fixing of two linear motion lead screws, which is the prior art and is not described herein.
The vision mechanism is a camera, is prior art, and is not repeated here.
In some embodiments, the lamination patch is specifically processed by:
coating a silver film on a ceramic copper-clad substrate (ABM) to obtain a ceramic copper-clad substrate (ABM) to be used;
three pairs of suction nozzles are adopted, including a first suction nozzle, a second suction nozzle, a third suction nozzle, a fourth suction nozzle, a fifth suction nozzle and a sixth suction nozzle, and the first suction nozzle, the second suction nozzle, the third suction nozzle, the fourth suction nozzle, the fifth suction nozzle and the sixth suction nozzle are heated, so that the temperature of the first suction nozzle and the second suction nozzle reaches 90 ℃;
after negative pressure is formed in the first suction nozzle, the second suction nozzle, the third suction nozzle, the fourth suction nozzle, the fifth suction nozzle and the sixth suction nozzle, the first suction nozzle, the second suction nozzle, the third suction nozzle, the fourth suction nozzle, the fifth suction nozzle and the sixth suction nozzle adsorb copper sheets respectively, and the first suction nozzle, the second suction nozzle, the third suction nozzle, the fourth suction nozzle, the fifth suction nozzle and the sixth suction nozzle are moved to adsorb the copper sheets and the corresponding chips integrally to form a laminated structure assembly.
And (3) mounting the six laminated structure assemblies on corresponding positions of the ceramic copper-clad substrate (ABM) to be used, and completing mounting.
Example two
As shown in fig. 4, a lamination patch method includes the following steps:
placing a ceramic copper-clad substrate (ABM) on a patch platform, heating the platform to 140+/-20 ℃, and forming negative pressure on the platform, wherein the negative pressure value is-80 to-70 kpa;
at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃;
after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with dispensing on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly;
moving the first suction nozzle and the second suction nozzle, pressing the adsorbed laminated assembly to the surface of a prefabricated silver film, applying pressure of 25+/-10N, and applying the silver film on the back surface of the chip; the temperature and the pressure lead the silver film to be orderly pressed on the back of the chip to form a multi-layer laminated structure, namely a DTS-silver layer-chip-silver layer structure;
and (3) moving the first suction nozzle and the second suction nozzle, and attaching the adsorbed laminated assembly with the silver film to the corresponding position of the ceramic copper-clad substrate (ABM) to complete the attachment.
Specifically, the silver film had a thickness of 100±20 um.
Specifically, negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure value is-60 kpa to-50 kpa;
moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 5-15N; moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N; when the first suction nozzle and the second suction nozzle adsorb corresponding copper sheets, the copper sheets stay for 0.1-2s.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. A method for laminating a structure, which is characterized by comprising the following steps: the method comprises the following steps:
a ceramic copper-clad substrate (ABM) is coated with silver paste, a standby ceramic copper-clad substrate (ABM) is obtained, the standby ceramic copper-clad substrate (ABM) is placed on a patch platform, the platform is heated to 140+/-20 ℃, negative pressure is formed on the platform, and the negative pressure value is-80 to-70 kpa;
at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃;
after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with glue points on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly;
and moving the first suction nozzle and the second suction nozzle, and mounting the adsorbed laminated assembly on a corresponding position of a ceramic copper-clad substrate (ABM) to be used, thereby completing mounting.
2. The method of laminating a structure patch of claim 1, wherein: negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure value is-60 kpa to-50 kpa.
3. The method of laminating a structure patch of claim 1, wherein: moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 5-15N; and moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N.
4. The method of laminating a structure patch of claim 1, wherein: when the first suction nozzle and the second suction nozzle adsorb corresponding copper sheets, the copper sheets stay for 0.1-2s.
5. The method of laminating a structure patch of claim 1, wherein: the thickness of the silver paste layer is 100+/-20 um.
6. A method for laminating a structure, which is characterized by comprising the following steps: the method comprises the following steps:
placing a ceramic copper-clad substrate (ABM) on a patch platform, heating the platform to 140+/-20 ℃, and forming negative pressure on the platform, wherein the negative pressure value is-80 to-70 kpa;
at least one pair of suction nozzles is adopted, the pair of suction nozzles are a first suction nozzle and a second suction nozzle respectively, and the first suction nozzle and the second suction nozzle are heated, so that the temperatures of the first suction nozzle and the second suction nozzle reach 90+/-10 ℃;
after negative pressure is formed in the first suction nozzle and the second suction nozzle, the first suction nozzle and the second suction nozzle respectively adsorb copper sheets (DTS) with dispensing on the back, the first suction nozzle and the second suction nozzle are moved, and the copper sheets and the corresponding chips are adhered into a whole to form a laminated assembly;
moving the first suction nozzle and the second suction nozzle, pressing the adsorbed laminated assembly to the surface of a prefabricated silver film, applying pressure of 25+/-10N, and applying the silver film on the back surface of the chip;
and (3) moving the first suction nozzle and the second suction nozzle, and attaching the adsorbed laminated assembly with the silver film to the corresponding position of the ceramic copper-clad substrate (ABM) to complete the attachment.
7. The method of laminating a structure patch of claim 6, wherein: the silver film had a thickness of 100±20 um.
8. The method of laminating a structure patch of claim 6, wherein: negative pressure is formed in the first suction nozzle and the second suction nozzle, and the negative pressure value is-60 kpa to-50 kpa;
moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 5-15N; moving the first suction nozzle and the second suction nozzle to adsorb the copper sheet and the chip into a whole, wherein the pressure value applied by the first suction nozzle and the second suction nozzle to the copper sheet is 10N; when the first suction nozzle and the second suction nozzle adsorb the copper sheets, the copper sheets stay for 0.1-2s.
9. A stacked structure patch system based on the stacked structure patch method of any one of claims 1-5, wherein: comprising
A printing mechanism for printing silver paste on a ceramic copper-clad substrate (ABM);
the transverse and longitudinal moving mechanism is used for driving the suction nozzle to move transversely and longitudinally;
at least one pair of suction nozzles arranged on the transverse and longitudinal moving mechanism and used for adsorbing the copper sheets;
a vacuum pump communicated with the suction nozzle and used for generating negative pressure in the suction nozzle;
the heating mechanism is connected with the suction nozzle and used for heating the suction nozzle;
and the visual mechanism is arranged on the transverse and longitudinal moving mechanism and is used for scanning the adsorption position.
10. The laminated structure patch system of claim 9, wherein the heating mechanism comprises a ceramic plate connected to the mouthpiece and a heater wire mounted on the ceramic plate, the heater wire being electrically connected to a power source.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410142212.7A CN117715405B (en) | 2024-02-01 | 2024-02-01 | Lamination structure pasting method and lamination structure pasting system |
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| CN202410142212.7A CN117715405B (en) | 2024-02-01 | 2024-02-01 | Lamination structure pasting method and lamination structure pasting system |
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| CN117715405B CN117715405B (en) | 2024-05-24 |
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| JP2003234431A (en) * | 2002-02-08 | 2003-08-22 | Ibiden Co Ltd | Semiconductor chip mounting circuit board, its manufacturing method and multilayered circuit board |
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