CN117690889B - Chip cooling device - Google Patents
Chip cooling device Download PDFInfo
- Publication number
- CN117690889B CN117690889B CN202311732949.6A CN202311732949A CN117690889B CN 117690889 B CN117690889 B CN 117690889B CN 202311732949 A CN202311732949 A CN 202311732949A CN 117690889 B CN117690889 B CN 117690889B
- Authority
- CN
- China
- Prior art keywords
- chip
- heat
- semiconductor refrigerator
- heat dissipation
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本公开涉及芯片散热技术领域，其提供了一种芯片散热装置，该芯片散热装置包括：芯片组件、导热盖、半导体制冷器和散热片；导热盖罩设于芯片组件，用于为芯片组件导热；半导体制冷器的制冷面设置于导热盖远离芯片组件的一侧，用于为导热盖制冷；散热片设置于半导体制冷器的发热面，用于为半导体制冷器散热；其中，导热盖、半导体制冷器和散热片形成竖直布置的薄散热结构。该芯片散热装置将导热盖、半导体制冷器和散热片结构依次设置于芯片组件上，其中，导热盖能够给芯片导热、半导体制冷器为芯片主动散热且散热片为芯片被动散热从而形成了竖直布置的超薄散热结构。
The present disclosure relates to the field of chip heat dissipation technology, and provides a chip heat dissipation device, which includes: a chip assembly, a heat-conducting cover, a semiconductor refrigerator and a heat sink; the heat-conducting cover is arranged on the chip assembly, and is used to conduct heat for the chip assembly; the cooling surface of the semiconductor refrigerator is arranged on the side of the heat-conducting cover away from the chip assembly, and is used to cool the heat-conducting cover; the heat sink is arranged on the heating surface of the semiconductor refrigerator, and is used to dissipate heat for the semiconductor refrigerator; wherein the heat-conducting cover, the semiconductor refrigerator and the heat sink form a vertically arranged thin heat dissipation structure. The chip heat dissipation device arranges the heat-conducting cover, the semiconductor refrigerator and the heat sink structure on the chip assembly in sequence, wherein the heat-conducting cover can conduct heat to the chip, the semiconductor refrigerator actively dissipates heat for the chip, and the heat sink passively dissipates heat for the chip, thereby forming a vertically arranged ultra-thin heat dissipation structure.
Description
Technical Field
The disclosure relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation device.
Background
In the traditional chip heat dissipation scheme, in order to improve the air cooling heat dissipation effect, the air cooling heat radiator often needs a larger volume, or the rotating speed of a fan needs to be increased to form larger noise, and the two heat dissipation schemes cannot be combined. In order to improve the liquid cooling heat dissipation effect of the chip, the liquid cooling heat dissipation scheme often needs to adopt a sealing pipeline, the construction and maintenance cost is high, the use cost is further improved by using non-conductive cooling liquid, the use of water as the cooling liquid is unreliable, and electronic devices such as the chip can be damaged when the liquid leaks. Whether it is finally radiating to the air or radiating to the water, the liquid cooling scheme has the problems of large volume, heavy weight and high cost. In order to improve the heat dissipation effect, the passive heat dissipation scheme only increases the area of the heat dissipation plate and improves the material of the heat dissipation plate, which can increase the volume and the cost. Compressor refrigeration and semiconductor refrigeration carry heat from one end to the other by consuming energy, however, if poorly controlled, once the low temperature end is below the air temperature, water vapor in the air may condense into droplets, which may cause the chip to be damaged by water because the low temperature end is often in direct contact with the chip.
In the above conventional chip heat dissipation scheme, there is a contradiction that is difficult to reconcile among heat dissipation efficiency, volume, noise, safety and cost, and the conventional scheme often cannot take these problems into consideration.
Based on this, a technical solution of the chip heat dissipation device is urgently needed to solve the above-mentioned problems.
Disclosure of Invention
In order to solve one or more technical problems mentioned in the background art, the scheme of the disclosure provides a chip heat dissipation device.
According to one aspect of an embodiment of the present disclosure, a chip heat sink is provided that includes a chip assembly, a thermally conductive cap, a semiconductor refrigerator, and a heat sink. The heat-conducting cover is arranged on the chip assembly and used for conducting heat for the chip assembly, the refrigerating surface of the semiconductor refrigerator is arranged on one side, far away from the chip assembly, of the heat-conducting cover and used for refrigerating the heat-conducting cover, the radiating fin is arranged on the heating surface of the semiconductor refrigerator and used for radiating heat for the semiconductor refrigerator, and the heat-conducting cover, the semiconductor refrigerator and the radiating fin form a thin radiating structure which is vertically arranged.
In some embodiments, the chip assembly includes a PCB circuit board and a chip. The PCB is provided with a chip groove, a first interface and a second interface, the chip is arranged in the chip groove, and the semiconductor refrigerator is connected with the first interface through a power supply line.
In some embodiments, the chip assembly further includes a thermally conductive agent coated on the chip for improving the thermal conduction efficiency of the chip.
In some embodiments, the thermally conductive cover is a hollow plate-like structure, and the opening of the thermally conductive cover faces the chip assembly and covers the chip.
In some embodiments, the chip heat dissipation device further comprises an elastic sealing ring, and the heat conduction cover is tightly attached to the PCB outside the chip groove through the elastic sealing ring so as to seal the chip.
In some embodiments, the chip heat dissipation device further comprises a temperature sensor, wherein the temperature sensor is arranged on the inner side of the heat conduction cover and connected with the second interface, and is used for measuring the real-time temperature of the chip and feeding back a temperature signal to the PCB.
In some embodiments, the thermally conductive cover further includes a groove structure formed at a bottom of an inside of the thermally conductive cover to accommodate condensed water formed within the thermally conductive cover when the temperature sensor fails.
In some embodiments, the semiconductor refrigerator is placed in the lower portion of the chip to prevent condensed water from flowing onto the chip or PCB circuit board in the event of a temperature sensor failure.
In some embodiments, the heat sink has a volume larger than the semiconductor refrigerator and is closely attached to the heat generating surface of the semiconductor refrigerator, so as to improve heat dissipation efficiency by increasing the temperature of the heat sink.
In some embodiments, the thermally conductive cover is capable of wrapping around the PCB circuit board.
The chip heat dissipation device provided by the embodiment of the disclosure can realize the following technical effects:
According to the application, the heat-conducting cover, the semiconductor refrigerator and the radiating fin structure are sequentially arranged on the chip assembly by fully considering the heat-radiating efficiency, the volume, the noise, the safety and the cost, wherein the heat-conducting cover can conduct heat for the chip, the semiconductor refrigerator actively radiates heat for the chip, and the radiating fin passively radiates heat for the chip, so that the vertically arranged ultrathin heat-radiating structure is formed.
A temperature sensor located on the inner surface of the thermally conductive cover is used to control the semiconductor refrigerator to avoid supercooling problems.
The heat conduction cover seals the chip through the elastic sealing ring, and forms a relative sealing space under the condition that the heat conduction cover is of a hollow structure, so that water vapor is prevented from being infinitely led in when the temperature sensor fails, and excessive condensed water is formed.
The heat conduction cover is internally provided with a groove structure for accommodating a small amount of condensed water when the temperature sensor fails, and additional safety redundancy is provided.
The semiconductor refrigerator is placed under the chip so that condensed water does not flow onto the chip or the PCB circuit board when the temperature sensor fails.
For passive heat dissipation, the heat dissipation efficiency is improved by improving the temperature of the heat dissipation fins, so that a more efficient passive heat dissipation scheme is realized.
The heat conduction cover can be designed to completely wrap the PCB, so that the possibility that condensate water is generated on the other surface (the surface without a chip to be cooled) of the PCB under the condition that the temperature sensor fails is avoided.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 is an exploded view illustrating a chip heat sink according to one embodiment of the present disclosure;
FIG. 2 is a side view illustrating a chip heat sink according to one embodiment of the disclosure;
fig. 3 is a cross-sectional view illustrating a thermally conductive cover according to one embodiment of the present disclosure.
Reference numerals:
1. Chip assembly, 11, PCB circuit board, 111, chip slot, 112, first interface, 113, second interface, 12, chip, 13, heat conductive agent;
2. A heat conducting cover, a 21, a groove structure;
3. a semiconductor refrigerator;
4.A heat sink;
5. An elastic sealing ring;
6. A temperature sensor;
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
Spatially relative terms, such as "above," "upper" and "upper surface," "above" and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the process is carried out, the exemplary term "above" may be included. Upper and lower. Two orientations below. The device may also be oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.
Exemplary embodiments according to the present disclosure will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It should be appreciated that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art, that in the drawings, thicknesses of layers and regions are exaggerated for clarity, and identical reference numerals are used to denote identical devices, and thus descriptions thereof will be omitted.
Fig. 1 is an exploded view illustrating a chip heat sink according to one embodiment of the present disclosure. Fig. 2 is a side view illustrating a chip heat sink according to one embodiment of the present disclosure.
As shown in fig. 1 to 2, the embodiment of the present disclosure provides a chip heat sink including a chip assembly 1, a heat conductive cover 2, a semiconductor refrigerator 3, and a heat sink 4. The heat conduction cover 2 is covered on the chip assembly 1 and used for conducting heat for the chip assembly 1, the refrigerating surface of the semiconductor refrigerator 3 is arranged on one side, far away from the chip assembly 1, of the heat conduction cover 2 and used for refrigerating the heat conduction cover 2, the radiating fin 4 is arranged on the heating surface of the semiconductor refrigerator 3 and used for radiating heat for the semiconductor refrigerator 3, and the heat conduction cover 2, the semiconductor refrigerator 3 and the radiating fin 4 form a thin radiating structure which is vertically arranged.
According to the technical scheme, the heat conducting cover 2 is a cover type heat conducting cover, and can efficiently conduct out heat of the chip assembly 1. The use of the semiconductor cooler 3 enables an active way of dissipating heat conducted from the chip assembly 1 to the thermally conductive cover 2. And the heat dissipation plate 4 dissipates heat in a passive heat dissipation mode. The heat conducting cover 2, the semiconductor refrigerator 3 and the heat sink 4 may be vertically arranged on the chip assembly 1, or may be arranged in other ways. The thin heat dissipation structure or the ultrathin heat dissipation structure is compared with the traditional heat dissipation structures such as air cooling, liquid cooling, passive heat dissipation structure, compressor refrigeration structure, semiconductor refrigeration structure and the like.
As shown in fig. 1 to 2, in a preferred embodiment, the chip assembly 1 includes a PCB circuit board 11 and a chip 12, the PCB circuit board 11 is provided with a chip slot 111, a first interface 112 and a second interface 113, the chip 12 is disposed in the chip slot 111, and the semiconductor refrigerator 3 is connected to the first interface 112 through a power supply line.
According to the present embodiment, the PCB circuit board 11 is a conventional printed circuit board. The chip slot 111 is located in the middle of the PCB circuit board 11. The chip slot 111 may be rectangular or the like to accommodate the shape of the chip 12. A first interface 112 is provided at one side of the chip groove 111, and a power supply line of the semiconductor refrigerator 3 is inserted into the first interface 112 to electrically connect the PCB circuit board 11. The semiconductor refrigerator 3 is utilized to actively improve the temperature difference, thereby improving the efficiency of radiating heat into the air, reducing the volume and noise.
As shown in fig. 1 to 2, in a preferred embodiment, the chip assembly 1 further comprises a heat conductive agent 13, and the heat conductive agent 13 is coated on the chip 12 to improve the heat conduction efficiency of the chip 12.
According to the present embodiment, the heat transfer agent 13 may be a heat transfer agent which is conventional at present. The heat conductive agent 13 is uniformly coated on the surface of the chip 12, and is mainly used for accelerating heat conduction of the chip 12 and improving heat conduction efficiency.
As shown in fig. 1 to 2, in a preferred embodiment, the thermally conductive cover 2 is of hollow plate-like construction, with its opening facing the chip assembly 1 and covering the chip 12.
According to the present embodiment, the heat conductive cover 2 is preferably a rectangular parallelepiped case. The thermally conductive cover 2 has an opening that faces just the chip 12 to cover the chip 12 to form a sealed space.
As shown in fig. 1 to 2, in a preferred embodiment, the chip heat dissipation device further includes an elastic sealing ring 5, and the heat conduction cover 2 is tightly attached to the PCB 11 outside the chip groove 111 by the elastic sealing ring 5 to seal the chip 12.
According to the present embodiment, the elastic sealing ring 5 is located outside the chip groove 111 and pressed against the PCB circuit board 11. The heat conductive cover 2is pressed to the outside of the chip groove 111 by the elastic sealing ring 5, so that the chip 12 is sealed into the space of the heat conductive cover 2.
As shown in fig. 1 to 2, in a preferred embodiment, the chip heat dissipation device further comprises a temperature sensor 6, wherein the temperature sensor 6 is disposed inside the heat conducting cover 2 and connected to the second interface 113 for measuring the real-time temperature of the chip 12 and feeding back a temperature signal to the PCB circuit board 11.
According to the present embodiment, the temperature sensor 6 may be fixed to the inner wall of the cavity of the heat conductive cover 2 to be electrically connected to the second interface 113. The PCB circuit board 11 can stop power supply to the semiconductor refrigerator 3 through the power supply line when the temperature signal generated by the temperature sensor 6 is lower than the room temperature, and turn on power supply to the semiconductor refrigerator 3 through the power supply line when the temperature signal generated by the temperature sensor 6 is higher than the room temperature.
Fig. 3 is a cross-sectional view illustrating a thermally conductive cover 2 according to one embodiment of the present disclosure.
As shown in fig. 3, in a preferred embodiment, the heat conductive cover 2 further includes a groove structure 21 formed at the bottom of the inside of the heat conductive cover 2 to accommodate condensed water formed in the heat conductive cover 2 when the temperature sensor 6 fails.
According to the present embodiment, the groove structures 21 are arranged in rows at the bottom of the inner side of the heat conductive cover 2. In case of failure of the temperature sensor 6, water vapor in the air inside the heat conducting cover 2 condenses on the inner surface of the heat conducting cover 2 to form condensate which flows into the groove structure 21 to be temporarily stored therein. The groove structure 21 can hold a small amount of condensed water, and is a protective design in case of failure of the temperature sensor 6.
As shown in fig. 1 to 2, in a preferred embodiment, the semiconductor refrigerator 3 is placed in a lower portion of the chip 12 to prevent condensed water from flowing onto the chip 12 or the PCB circuit board 11 when the temperature sensor 6 fails.
According to the present embodiment, the top of the semiconductor refrigerator 3 is located below the chip 12 and the heat conductive agent 13, ensuring that condensed water that may be formed by water vapor in the air inside the heat conductive cover 2 when the temperature sensor 6 fails on the inner surface of the heat conductive cover 2 does not flow onto the chip 12 or the like.
As shown in fig. 1 to 2, in a preferred embodiment, the heat sink 4 has a larger volume than the semiconductor refrigerator 3 and is closely attached to the heating surface of the semiconductor refrigerator 3, so as to increase the heat dissipation efficiency by increasing the temperature of the heat sink 4.
According to the present embodiment, the heat sink 4 is a passive heat dissipation type. On the basis of the passive heat dissipation scheme, the heat conduction to the air is quickened in a mode of improving the temperature difference between the heat dissipation fins 4 and the air by bringing more heat to the heat dissipation fins 4, so that the heat dissipation device is more efficient than a pure passive heat dissipation scheme.
As shown in fig. 1-2, in a preferred embodiment, the thermally conductive cover 2 is capable of wrapping around a PCB circuit board 11.
According to the present embodiment, the heat conducting cover 2 can completely wrap the PCB 11, so as to avoid the possibility of condensed water generated on the other surface (surface without the chip to be cooled) of the PCB 11 in case of failure of the temperature sensor 6.
In a preferred embodiment of the present disclosure, an upper region of the rectangular thin-walled PCB 11 is fixed with a rectangular frame to form the chip slot 111. A chip 12 is provided in the central region of the chip slot 111. One side of the chip 12 is fixed against the chip groove 111, and the opposite side is coated with a heat conductive agent 13 to enhance heat conductive performance. A first interface 112 for electrically connecting the temperature sensor 6 to the PCB 11 is provided in the chip slot 111 at a side lower part of the chip 12. 4 threaded holes are symmetrically excavated in four corners of the PCB 11. And a second interface 113 for electrically connecting the semiconductor refrigerator 3 to the PCB circuit board 11 is opened at the lower left corner of the PCB circuit board 11. The heat conductive cover 2 is also a rectangular parallelepiped thin-walled plate. The front part of the heat conductive cover 2 has a boss centering the elastic sealing ring 5 to be fastened to the elastic sealing ring 5. The thermally conductive cover 2 is hollow and has a groove structure 21 inside. And the bulge of the heat conduction cover 2 is tightly attached to the PCB 11 through the elastic sealing ring 5 after being buckled to the elastic sealing ring 5, so as to form a sealing space. Under the condition of thermal expansion and contraction of different materials, the inside of the heat conduction cover 2 is sealed relatively. The size of the heat conducting cover 2 is matched with that of the PCB 11, four corners of the heat conducting cover are symmetrically provided with four through holes, and the positions of the four through holes correspond to the positions of the four threaded holes respectively. In this way, the heat conductive cover 2 and the PCB circuit board 11 may be coupled together by four screws which are screwed to four screw holes through four through holes. A temperature sensor 6 is provided in the inner space of the heat conductive cover 2, and the temperature sensor 6 is connected to the first interface 112 through an electric wire. The rear plane of the heat conducting cover 2 is closely attached to the refrigerating surface of the semiconductor refrigerator 3 to enhance the refrigerating effect. The top of the semiconductor refrigerator 3 is lower than the bottom of the chip 12. The semiconductor refrigerator 3 is connected to the second interface 113 by an electric wire. The temperature sensor 6 detects the temperature of the chip 12 in real time and establishes connection with the PCB 11, the PCB 11 controls the semiconductor refrigerator 3 to stop working when receiving a temperature signal which is transmitted by the temperature sensor 6 and is lower than the room temperature, and the PCB 11 starts the semiconductor refrigerator 3 after receiving a temperature signal which is transmitted by the temperature sensor 6 and is higher than the room temperature. The condensation water can be collected to the groove structure 21 in a short time when the temperature sensor 6 fails, resulting in protection of the chip 12. The heat-generating surface of the semiconductor refrigerator 3 is closely attached to the heat sink 4. The heat sink 4 provides passive heat dissipation. And the PCB circuit board 11, the heat conductive cover 2, the semiconductor refrigerator 3 and the heat sink 4 form an ultra-thin heat dissipation structure arranged vertically.
The air cooling scheme of the chip 12 is stable and reliable but has large volume noise, and if the chip 12 needs to be ensured to be at a low temperature, larger volume or noise is needed. The air-cooled heat dissipation scheme utilizes heat transfer to dissipate heat to air, and the semiconductor refrigerator 3 is utilized to actively improve the temperature difference, so that the efficiency of heat dissipation to the air is improved, the volume is reduced, and the noise is reduced.
The liquid cooling scheme of the chip 12 is relatively costly or unreliable, and the low cost liquid cooling scheme can damage the electronic devices such as the chip 12 when liquid leaks. The present disclosure does not use a cooling liquid, and has the characteristics of small volume, small weight, and low cost.
The passive heat dissipation scheme of the chip 12 has low heat dissipation efficiency, and cannot guarantee effective cooling of the chip 12. The present disclosure may accelerate the conduction of heat to air by bringing more heat to the heat sink 4 based on the passive heat dissipation scheme to increase the temperature difference between the heat sink 4 and air, thereby enabling more efficient than the pure passive heat dissipation scheme.
Compressor refrigeration and semiconductor refrigeration present a temperature control risk. According to the heat-conducting cover 2, the temperature of the temperature sensor 6 is controlled, the sealing ring and the cover form a sealing structure, the refrigerating end is lower than the dislocation arrangement of the chip 12, the design of the lower part Fang Aocao in the heat-conducting cover 2 is achieved, the safety of the chip 12 and other equipment is ensured, and a safe, reliable, ultrathin and efficient heat-radiating device can be formed without using a high-cost processing technology for ensuring the air tightness.
The heat conduction cover 2, the semiconductor refrigerator 3 and the radiating fins 4 are sequentially arranged on the chip assembly 1 by fully considering the heat dissipation efficiency, the volume, the noise, the safety, the cost and the like, wherein the heat conduction cover 2 can conduct heat for the chip 12, the semiconductor refrigerator 3 actively dissipates heat for the chip 12, and the radiating fins 4 passively dissipate heat for the chip 12, so that an ultrathin heat dissipation structure which is vertically arranged is formed.
The semiconductor refrigerator 3 is controlled using a temperature sensor 6 located at the inner surface of the heat conductive cover 2 to avoid supercooling problems.
The heat conducting cover 2 seals the chip 12 through the elastic sealing ring 5, and forms a relative sealing space under the condition that the heat conducting cover 2 is of a hollow structure so as to prevent water vapor from being infinitely led in when the temperature sensor 6 fails, thereby forming excessive condensed water.
The heat conductive cover 2 is internally provided with a groove structure 21 for accommodating a small amount of condensed water when the temperature sensor 6 fails, providing additional safety redundancy.
The semiconductor refrigerator 3 is placed under the chip 12 so that condensed water does not flow onto the chip 12 or the PCB circuit board 11 when the temperature sensor 6 fails.
For passive heat dissipation, the heat dissipation efficiency is improved by increasing the temperature of the heat dissipation fins 4, so that a more efficient passive heat dissipation scheme is realized.
According to the application, the temperature control of the temperature sensor 6, the sealing structure formed by the elastic sealing ring 5 and the heat conducting cover 2, the staggered arrangement of the refrigerating end lower than the chip 12, the design of the groove structure 12 below the inner part of the heat conducting cover 2 and other methods are adopted, so that the safety of the chip 12 and other devices is ensured, and a safe, reliable, ultrathin and efficient heat radiating device can be formed without using a high-cost processing technology for ensuring the air tightness.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in various embodiments of the present application, the sequence number of each step/process described above does not mean that the execution sequence of each step/process should be determined by its functions and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. Moreover, the foregoing description of the embodiments of the application is provided for the purpose of illustration only, and does not represent the advantages or disadvantages of the embodiments.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be capable of being practiced otherwise than as specifically illustrated and described. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing description of the preferred embodiments of the present disclosure is provided only and not intended to limit the disclosure so that various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311732949.6A CN117690889B (en) | 2023-12-15 | 2023-12-15 | Chip cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311732949.6A CN117690889B (en) | 2023-12-15 | 2023-12-15 | Chip cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117690889A CN117690889A (en) | 2024-03-12 |
| CN117690889B true CN117690889B (en) | 2025-03-25 |
Family
ID=90126216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311732949.6A Active CN117690889B (en) | 2023-12-15 | 2023-12-15 | Chip cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117690889B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN213368468U (en) * | 2020-11-30 | 2021-06-04 | 北京罗克维尔斯科技有限公司 | Active radiator and vehicle |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548361B (en) * | 2011-12-21 | 2014-12-10 | 华中科技大学 | Heat dissipation device using latent heat functional fluid and heat dissipation method thereof |
| CN103021877B (en) * | 2012-12-22 | 2016-03-09 | 中国船舶重工集团公司第七0九研究所 | A kind of superchip heat dissipating method adopting dual path to conduct heat |
| CN207925488U (en) * | 2018-03-13 | 2018-09-28 | 谱诉光电科技（苏州）有限公司 | Photosensor package |
| CN218385193U (en) * | 2022-08-25 | 2023-01-24 | 联测优特半导体(东莞)有限公司 | Chip stacking type packaging machine |
-
2023
- 2023-12-15 CN CN202311732949.6A patent/CN117690889B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN213368468U (en) * | 2020-11-30 | 2021-06-04 | 北京罗克维尔斯科技有限公司 | Active radiator and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117690889A (en) | 2024-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3255818B2 (en) | Cooling device for electronic components | |
| US6795315B1 (en) | Cooling system | |
| US5918469A (en) | Cooling system and method of cooling electronic devices | |
| WO2018045933A1 (en) | Heat sink, heat dissipation apparatus, heat dissipation system and communication device | |
| TW201724959A (en) | Thermoelectric cooling module and heat dissipation apparatus including the same | |
| US20230052681A1 (en) | Charger Plug Nozzle | |
| KR101013889B1 (en) | Heat exchanger with compact thermoelectric cooling using heat pipe | |
| CN111479450B (en) | Electrical box and heat exchange equipment equipped therewith | |
| CN115955825A (en) | A kind of inverter, power equipment and photovoltaic system | |
| CN117690889B (en) | Chip cooling device | |
| CN115047961A (en) | Edge server cooling system and wide-ring-temperature edge server | |
| US11910572B2 (en) | Sealed communications module with multi-path thermal management system | |
| CN208431978U (en) | A kind of electronic equipment radiating module | |
| CN113555190B (en) | Inductor and electrical apparatus box assisting in heat dissipation of electronic component | |
| US11924996B2 (en) | Liquid-cooling devices, and systems, to cool multi-chip modules | |
| CN212362210U (en) | Indoor unit and air conditioner with condensation prevention function | |
| US20070153479A1 (en) | Connector heat transfer unit | |
| KR20020053838A (en) | Heat transfer apparatus using refrigerant and computer having the same | |
| WO2020051763A1 (en) | Isolated heat-dissipation structure applicable to charging pile module and heat dissipation method thereof | |
| CN113923938B (en) | Electronic device | |
| CN220911720U (en) | Refrigerating device and refrigerating equipment | |
| CN222621423U (en) | Cooling components and air conditioning | |
| CN118174515B (en) | Power conversion equipment and energy storage equipment | |
| CN215222818U (en) | Heat dissipation device and electronic equipment | |
| CN222564190U (en) | Heat dissipation structure of electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |