CN117690889A - Chip cooling device - Google Patents

Abstract

The present disclosure relates to the technical field of chip heat dissipation, and provides a chip heat dissipation device, the chip heat dissipation device includes: the semiconductor refrigerator comprises a chip assembly, a heat conducting cover, a semiconductor refrigerator and a radiating fin; the heat conduction cover is covered on the chip assembly and is used for conducting heat for the chip assembly; the refrigerating surface of the semiconductor refrigerator is arranged on one side of the heat conducting cover far away from the chip assembly and is used for refrigerating the heat conducting cover; the radiating fin is arranged on the heating surface of the semiconductor refrigerator and used for radiating heat of the semiconductor refrigerator; wherein the thermally conductive cover, the semiconductor refrigerator and the heat sink form a vertically arranged thin heat dissipating structure. The heat conduction cover, the semiconductor refrigerator and the radiating fin structure are sequentially arranged on the chip assembly, wherein the heat conduction cover can conduct heat for the chip, the semiconductor refrigerator actively radiates heat for the chip, and the radiating fin passively radiates heat for the chip, so that an ultrathin heat radiation structure which is vertically arranged is formed.

Description

Chip cooling device

Technical field

The present disclosure relates to the field of chip heat dissipation technology, and specifically to a chip heat dissipation device.

Background technique

In the traditional chip cooling solution: Chip air cooling solution: In order to improve the air cooling effect, the air cooling radiator often needs to be larger in size, or the fan speed needs to be increased to create greater noise. The two cannot be taken into consideration. Liquid cooling solution for chips: In order to improve the effect of liquid cooling and heat dissipation, liquid cooling solutions often require the use of sealed pipelines, which are costly to build and maintain. The use of non-conductive coolant also further increases the cost of use, and the use of water as the coolant It is not reliable enough and will damage chips and other electronic devices when leaking. Whether it is ultimately dissipating heat to the air or to water, liquid cooling solutions have the problems of large size, heavy weight, and high cost. Passive cooling solution for the chip: In order to improve the heat dissipation effect, the passive cooling solution can only increase the heat sink area and improve the heat sink material, which will increase the size and cost. Compressor refrigeration and semiconductor refrigeration: Compressors and semiconductor refrigeration transport heat from one end to the other by consuming energy. However, if the control is not good, once the temperature of the low-temperature end is lower than the air temperature, the water vapor in the air may condense into Water droplets, and since the low-temperature end is often in direct contact with the chip, this will cause the chip to be damaged by water.

In the above-mentioned traditional chip cooling solutions, there are contradictions that are difficult to reconcile between heat dissipation efficiency, volume, noise, safety and cost. Previous solutions often cannot take these issues into consideration.

Based on this, there is an urgent need for a technical solution for a chip heat dissipation device to solve the above problems.

Contents of the invention

In order to solve one or more technical problems mentioned in the background art, the solution of the present disclosure provides a chip heat dissipation device.

According to one aspect of an embodiment of the present disclosure, a chip heat dissipation device is provided. The chip heat dissipation device includes: a chip assembly, a thermal conductive cover, a semiconductor refrigerator, and a heat sink. The thermally conductive cover is provided on the chip component and is used to conduct heat to the chip component; the cooling surface of the semiconductor refrigerator is disposed on a side of the thermally conductive cover away from the chip component and is used to conduct heat for the chip component. Cover cooling; the heat sink is arranged on the heating surface of the semiconductor refrigerator for dissipating heat for the semiconductor refrigerator; wherein the thermal conductive cover, the semiconductor refrigerator and the heat sink form a vertically arranged Thin heat dissipation structure.

In some embodiments, the chip component includes: a PCB circuit board and a chip. A chip slot, a first interface and a second interface are provided on the PCB circuit board; the chip is arranged in the chip slot; wherein the semiconductor refrigerator is connected to the first interface through a power supply line.

In some embodiments, the chip assembly further includes: a thermal conductive agent, which is coated on the chip to improve the heat conduction efficiency of the chip.

In some embodiments, the thermally conductive cover is a hollow plate structure, and the opening of the thermally conductive cover faces the chip assembly and covers the chip.

In some embodiments, the chip heat dissipation device further includes: an elastic sealing ring, and the thermally conductive cover is tightly attached to the PCB circuit board outside the chip slot through the elastic sealing ring to seal the chip.

In some embodiments, the chip heat dissipation device further includes: a temperature sensor, which is disposed inside the thermal conductive cover and connected to the second interface for measuring the real-time temperature of the chip and transmitting the temperature signal Feedback to the PCB circuit board.

In some embodiments, the thermally conductive cover further includes a groove structure formed at a bottom inside the thermally conductive cover to accommodate condensed water formed in the thermally conductive cover when the temperature sensor fails.

In some embodiments, the semiconductor refrigerator is placed under the chip to prevent condensation water from flowing to the chip or PCB circuit board when the temperature sensor fails.

In some embodiments, the volume of the heat sink is larger than that of the semiconductor refrigerator and is close to the heating surface of the semiconductor refrigerator to improve heat dissipation efficiency by increasing the temperature of the heat sink.

In some embodiments, the thermally conductive cover can wrap the PCB circuit board.

The chip heat dissipation device provided by the embodiment of the present disclosure can achieve the following technical effects:

This application fully considers the heat dissipation efficiency, volume, noise, safety and cost, and arranges the thermal conductive cover, semiconductor refrigerator and heat sink structure on the chip assembly in sequence. The thermal conductive cover can conduct heat to the chip, and the semiconductor refrigerator actively dissipates heat for the chip. The heat sink passively dissipates heat for the chip, forming a vertically arranged ultra-thin heat dissipation structure.

A temperature sensor located on the inner surface of the thermal cover is used to control the semiconductor refrigerator to avoid overcooling problems.

The thermally conductive cover seals the chip through an elastic sealing ring, forming a relatively sealed space when the thermally conductive cover is a hollow structure to prevent water vapor from being introduced indefinitely to form excessive condensation water when the temperature sensor fails.

A groove structure is set inside the thermal cover to accommodate a small amount of condensation water when the temperature sensor fails, providing additional safety redundancy.

A semiconductor cooler is placed under the chip to prevent condensation water from flowing to the chip or PCB if the temperature sensor fails.

For passive heat dissipation, the heat dissipation efficiency is improved by increasing the temperature of the heat sink to achieve a more efficient passive heat dissipation solution.

The thermal cover can be designed to completely wrap the PCB circuit board to eliminate the possibility of condensation water on the other side of the PCB circuit board (the side without the heat dissipation chip) when the temperature sensor fails.

Description of the drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are shown by way of illustration and not limitation, and like or corresponding reference numerals designate like or corresponding parts, wherein:

FIG. 1 is an exploded view showing a chip heat dissipation device according to one embodiment of the present disclosure;

2 is a side view illustrating a chip heat dissipation device according to one embodiment of the present disclosure;

3 is a cross-sectional view illustrating a thermally conductive cover according to an embodiment of the present disclosure.

Reference signs:

1. Chip component; 11. PCB circuit board; 111. Chip slot; 112. First interface; 113. Second interface; 12. Chip; 13. Thermal conductive agent;

2. Thermal conductive cover; 21. Groove structure;

3. Semiconductor refrigerator;

4. Heat sink;

5. Elastic sealing ring;

6. Temperature sensor;

Detailed ways

It should be noted that, as long as there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present disclosure will be described in detail below in conjunction with embodiments with reference to the accompanying drawings.

It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meanings commonly understood by one of ordinary skill in the art to which this application belongs.

For the convenience of description, spatially relative terms can be used here, such as "on...", "on...", "on the upper surface of...", "above", etc., to describe what is shown in the figure. The spatial relationship between one device or feature and other devices or features. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a feature in the figure is turned upside down, then one feature described as "above" or "on top of" other features or features would then be oriented "below" or "below" the other features or features. under other devices or structures". Thus, the exemplary term "over" may include both orientations "above" and "below." The device may be otherwise oriented, rotated 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.

Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of these exemplary embodiments to those skilled in the art, and in the drawings, the layers are exaggerated for clarity. and the thickness of the region, and the same reference numerals are used to denote the same devices, and thus their descriptions will be omitted.

FIG. 1 is an exploded view illustrating a chip heat dissipation device according to one embodiment of the present disclosure. 2 is a side view illustrating a chip heat dissipation device according to one embodiment of the present disclosure.

As shown in FIGS. 1 to 2 , an embodiment of the present disclosure provides a chip heat dissipation device. The chip heat dissipation device includes a chip component 1 , a thermal conductive cover 2 , a semiconductor refrigerator 3 and a heat sink 4 . The thermally conductive cover 2 covers the chip component 1 and is used to conduct heat for the chip component 1; the cooling surface of the semiconductor refrigerator 3 is disposed on the side of the thermally conductive cover 2 away from the chip component 1 and is used for cooling the thermally conductive cover 2; the heat sink 4 It is provided on the heating surface of the semiconductor refrigerator 3 to dissipate heat for the semiconductor refrigerator 3; wherein, the thermal conductive cover 2, the semiconductor refrigerator 3 and the heat sink 4 form a vertically arranged thin heat dissipation structure.

According to this technical solution, the thermally conductive cover 2 is a cover-type thermally conductive cover, which can efficiently conduct heat away from the chip assembly 1 . The semiconductor refrigerator 3 can be used to actively dissipate the heat conducted from the chip assembly 1 to the thermally conductive cover 2 . The heat sink 4 uses passive heat dissipation to dissipate heat. The thermal conductive cover 2, semiconductor refrigerator 3 and heat sink 4 can be arranged vertically on the chip assembly 1, or other arrangements can be adopted. Thin heat dissipation structure or ultra-thin heat dissipation structure is compared with traditional air cooling, liquid cooling, passive, compressor refrigeration and semiconductor refrigeration and other heat dissipation structures.

As shown in Figures 1 to 2, in a preferred embodiment, the chip assembly 1 includes: a PCB circuit board 11 and a chip 12. The PCB circuit board 11 is provided with a chip slot 111, a first interface 112 and a second interface 113; The chip 12 is disposed in the chip slot 111; the semiconductor refrigerator 3 is connected to the first interface 112 through a power supply line.

According to this embodiment, the PCB circuit board 11 is a conventional printed circuit board. The chip slot 111 is located in the middle of the PCB circuit board 11 . The chip groove 111 may be a rectangular or rectangular groove to adapt to the shape of the chip 12 . A first interface 112 is provided on one side of the chip slot 111 , and the power supply line of the semiconductor refrigerator 3 is inserted into the first interface 112 to electrically connect to the PCB circuit board 11 . The semiconductor refrigerator 3 is used to actively increase the temperature difference, thereby improving the efficiency of heat dissipation into the air, reducing the volume and reducing noise.

As shown in FIGS. 1 to 2 , in a preferred embodiment, the chip assembly 1 further includes: a thermal conductive agent 13 , which is coated on the chip 12 to improve the thermal conduction efficiency of the chip 12 .

According to this embodiment, the thermal conductive agent 13 may be a conventional thermal conductive agent. The thermal conductive agent 13 is evenly coated on the surface of the chip 12, and is mainly used to speed up the heat conduction of the chip 12 and improve the heat conduction efficiency.

As shown in FIGS. 1 to 2 , in a preferred embodiment, the thermally conductive cover 2 is a hollow plate structure, with its opening facing the chip assembly 1 and covering the chip 12 .

According to this embodiment, the thermally conductive cover 2 is preferably a casing with a rectangular parallelepiped structure. The thermally conductive cover 2 has an opening that just faces the chip 12 to cover the chip 12 to form a sealed space.

As shown in Figures 1 to 2, in a preferred embodiment, the chip heat dissipation device also includes: an elastic sealing ring 5. The thermal conductive cover 2 is tightly attached to the PCB circuit board 11 outside the chip slot 111 through the elastic sealing ring 5 to seal. Chip 12.

According to this embodiment, the elastic sealing ring 5 is located outside the chip groove 111 and pressed against the PCB circuit board 11 . The thermally conductive cover 2 is pressed to the outside of the chip slot 111 through the elastic sealing ring 5 , so that the chip 12 is sealed into the space of the thermally conductive cover 2 .

As shown in FIGS. 1 to 2 , in a preferred embodiment, the chip heat dissipation device also includes: a temperature sensor 6 , which is disposed inside the heat conductive cover 2 and connected to the second interface 113 for measuring the real-time temperature of the chip 12 . temperature, and feeds the temperature signal back to the PCB circuit board 11.

According to this embodiment, the temperature sensor 6 can be fixed to the inner wall of the cavity of the thermally conductive cover 2 and electrically connected to the second interface 113 . The PCB circuit board 11 can stop supplying power to the semiconductor refrigerator 3 through the power supply line when the temperature signal generated by the temperature sensor 6 is lower than room temperature, and can start supplying power to the semiconductor refrigerator 3 through the power supply line when the temperature signal generated by the temperature sensor 6 is higher than room temperature. .

FIG. 3 is a cross-sectional view showing a thermally conductive cover 2 according to an embodiment of the present disclosure.

As shown in FIG. 3 , in a preferred embodiment, the thermally conductive cover 2 further includes a groove structure 21 formed at the bottom inside the thermally conductive cover 2 to accommodate condensed water formed in the thermally conductive cover 2 when the temperature sensor 6 fails.

According to this embodiment, the groove structures 21 are arranged in rows at the bottom of the inside of the thermally conductive cover 2 . When the temperature sensor 6 fails, the water vapor in the air inside the thermal conductive cover 2 condenses on the inner surface of the thermal conductive cover 2 to form condensation water, which flows into the groove structure 21 and is temporarily stored there. The groove structure 21 can accommodate a small amount of condensed water and is a protective design when the temperature sensor 6 fails.

As shown in FIGS. 1 to 2 , in a preferred embodiment, the semiconductor refrigerator 3 is placed under the chip 12 to prevent condensation water from flowing onto the chip 12 or PCB circuit board 11 when the temperature sensor 6 fails.

According to this embodiment, the position of the top of the semiconductor refrigerator 3 is lower than the chip 12 and the thermal conductive agent 13 to ensure that the water vapor in the air inside the thermal conductive cover 2 does not form condensed water on the inner surface of the thermal conductive cover 2 when the temperature sensor 6 fails. It will flow to devices such as chip 12.

As shown in Figures 1 to 2, in a preferred embodiment, the volume of the heat sink 4 is larger than the semiconductor refrigerator 3, and is close to the heating surface of the semiconductor refrigerator 3, so as to improve the heat dissipation efficiency by increasing the temperature of the heat sink 4 .

According to this embodiment, the heat sink 4 is a passive heat dissipation method. On the basis of the passive heat dissipation solution, more heat is brought to the heat sink 4 and the heat conduction to the air is accelerated by increasing the temperature difference between the heat sink 4 and the air, thereby being more efficient than a pure passive heat dissipation solution.

As shown in FIGS. 1 to 2 , in a preferred embodiment, the thermally conductive cover 2 can wrap the PCB circuit board 11 .

According to this embodiment, the thermal conductive cover 2 can be designed to completely wrap the PCB circuit board 11 to eliminate the possibility of condensation water on the other side of the PCB circuit board 11 (the side without the heat dissipation chip) when the temperature sensor 6 fails.

In a preferred embodiment of the present disclosure, a rectangular frame is fixed on the upper area of the rectangular parallelepiped thin-walled PCB circuit board 11 to form the chip slot 111 . Another chip 12 is disposed in the middle area of the chip slot 111 . One side of the chip 12 is fixed close to the chip slot 111, and the opposite side is coated with a thermal conductive agent 13 to enhance the thermal conductivity. A first interface 112 for electrically connecting the temperature sensor 6 to the PCB circuit board 11 is provided under the chip 12 in the chip slot 111 . Dig 4 threaded holes symmetrically at the four corners of the PCB circuit board 11. At the same time, a second interface 113 for electrically connecting the semiconductor refrigerator 3 to the PCB circuit board 11 is opened in the lower left corner of the PCB circuit board 11 . Thermal conductive cover 2 is also a rectangular parallelepiped thin-walled plate. The front part of the thermal conductive cover 2 has a convex part, and the convex part is directly aligned with the elastic sealing ring 5 and is buckled to the elastic sealing ring 5 . The thermally conductive cover 2 is hollow and has a groove structure 21 inside. And after the convex part of the thermal conductive cover 2 is buckled onto the elastic sealing ring 5, it is tightly attached to the PCB circuit board 11 through the elastic sealing ring 5, forming a sealed space. It can be ensured that the interior of the thermal conductive cover 2 is relatively sealed when different materials expand due to thermal expansion or contraction. The size of the thermal conductive cover 2 matches the PCB circuit board 11, and four through holes are also symmetrically opened at the four corners. The positions of the four through holes correspond to the positions of the four threaded holes respectively. In this way, four screws can be screwed through the four through holes to the four threaded holes to combine the thermal conductive cover 2 and the PCB circuit board 11 together. A temperature sensor 6 is disposed in the internal space of the thermally conductive cover 2, and the temperature sensor 6 is connected to the first interface 112 through wires. The rear plane of the thermal conductive cover 2 is close to the cooling surface of the semiconductor refrigerator 3 to enhance the cooling effect. The top of the semiconductor refrigerator 3 is lower than the bottom of the chip 12 . The semiconductor refrigerator 3 is connected to the second interface 113 through wires. The temperature sensor 6 detects the temperature of the chip 12 in real time and establishes a connection with the PCB circuit board 11. The PCB circuit board 11 controls the semiconductor refrigerator 3 to stop working when it receives a temperature signal lower than room temperature transmitted by the temperature sensor 6. Similarly, The PCB circuit board 11 starts the semiconductor refrigerator 3 after receiving a temperature signal higher than room temperature transmitted by the temperature sensor 6 . When the temperature sensor 6 fails, condensed water can be collected into the groove structure 21 in a short time to protect the chip 12 . The heating surface of the semiconductor refrigerator 3 is in close contact with the heat sink 4 . The heat sink 4 provides passive heat dissipation. And the PCB circuit board 11, the thermal conductive cover 2, the semiconductor refrigerator 3 and the heat sink 4 form a vertically arranged ultra-thin heat dissipation structure.

The air-cooling solution for chip 12 is stable and reliable, but the volume and noise are relatively large. To ensure the low temperature of chip 12, a larger volume or noise is required. The air-cooled heat dissipation solution uses heat transfer to dissipate heat into the air. This disclosure uses the semiconductor refrigerator 3 to actively increase the temperature difference, thereby improving the efficiency of heat dissipation into the air, reducing the volume and reducing noise.

The liquid cooling solution for the chip 12 is expensive or unreliable. The low-cost liquid cooling solution will damage the chip 12 and other electronic devices when liquid leaks. The present disclosure does not use cooling liquid and has the characteristics of small volume, low weight and low cost.

The passive cooling solution of the chip 12 has low heat dissipation efficiency and cannot guarantee the effective cooling of the chip 12 . On the basis of the passive heat dissipation scheme, the present disclosure can bring more heat to the heat sink 4 and accelerate the conduction of heat to the air by increasing the temperature difference between the heat sink 4 and the air, thereby being more efficient than a pure passive heat dissipation scheme. Efficient.

Compressor refrigeration and semiconductor refrigeration have temperature control risks. This disclosure ensures the safety of equipment such as the chip 12 by controlling the temperature of the temperature sensor 6, forming a sealing structure by the sealing ring and the cover-type heat conduction cover 2, staggering the refrigeration end lower than the chip 12, and designing the groove below the inside of the heat conduction cover 2. It is safe and can form a safe, reliable, ultra-thin and efficient heat dissipation device without using high-cost processing technology to ensure air tightness.

This application fully considers the heat dissipation efficiency, volume, noise, safety and cost, etc., and arranges the thermal conductive cover 2, semiconductor refrigerator 3 and heat sink 4 structure on the chip assembly 1 in sequence, wherein the thermal conductive cover 2 can conduct heat and semiconductor to the chip 12. The refrigerator 3 actively dissipates heat for the chip 12 and the heat sink 4 passively dissipates heat for the chip 12, thereby forming a vertically arranged ultra-thin heat dissipation structure.

The temperature sensor 6 located on the inner surface of the thermally conductive cover 2 is used to control the semiconductor refrigerator 3 to avoid overcooling problems.

The thermally conductive cover 2 seals the chip 12 through the elastic sealing ring 5, and forms a relatively sealed space when the thermally conductive cover 2 is a hollow structure to prevent water vapor from being introduced indefinitely to form excessive condensation water when the temperature sensor 6 fails.

A groove structure 21 is provided inside the thermal conductive cover 2 to accommodate a small amount of condensed water when the temperature sensor 6 fails, providing additional safety redundancy.

The semiconductor refrigerator 3 is placed under the chip 12 so that condensation water will not flow to the chip 12 or the PCB circuit board 11 when the temperature sensor 6 fails.

For passive heat dissipation, the heat dissipation efficiency is improved by increasing the temperature of heat sink 4 to achieve a more efficient passive heat dissipation solution.

This application ensures that equipment such as the chip 12 is protected by the temperature sensor 6 for temperature control, the elastic sealing ring 5 and the thermal conductive cover 2 forming a sealing structure, the staggered arrangement of the cooling end lower than the chip 12, the design of the groove structure 12 underneath the thermal conductive cover 2, etc. It can form a safe, reliable, ultra-thin and efficient heat dissipation device without using high-cost processing technology to ensure air tightness.

It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular forms are also intended to include the plural forms unless the context clearly indicates otherwise. Furthermore, it will be understood that when the terms "comprises" and/or "includes" are used in this specification, they indicate There are features, steps, operations, means, components and/or combinations thereof.

It will be understood that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that in various embodiments of the present application, the size of the serial numbers of the above steps/processes does not mean the order of execution. The execution order of each step/process should be determined by its function and internal logic, and should not be The implementation process of the embodiments of this application does not constitute any limitations. Moreover, the above-mentioned serial numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments.

It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the application described herein, for example, can be practiced in sequences other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus that encompasses a series of steps or units and need not be limited to those explicitly listed. Those steps or elements may instead include other steps or elements not expressly listed or inherent to the process, method, product or apparatus.

The above descriptions are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and changes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this disclosure shall be included in the protection scope of this disclosure.

Claims (10)

1. A chip heat dissipation device, characterized in that it includes: chip components; A thermally conductive cover, the thermally conductive cover covers the chip component and is used to conduct heat for the chip component; Semiconductor refrigerator, the cooling surface of the semiconductor refrigerator is arranged on the side of the thermal conductive cover away from the chip assembly, and is used for cooling the thermal conductive cover; A heat sink, which is provided on the heating surface of the semiconductor refrigerator and is used to dissipate heat for the semiconductor refrigerator; Wherein, the thermally conductive cover, the semiconductor refrigerator and the heat sink form a vertically arranged thin heat dissipation structure. 2. The chip heat dissipation device according to claim 1, characterized in that the chip assembly includes: PCB circuit board, the PCB circuit board is provided with a chip slot, a first interface and a second interface; A chip, the chip is arranged in the chip slot; Wherein, the semiconductor refrigerator is connected to the first interface through a power supply line. 3. The chip heat dissipation device according to claim 2, wherein the chip assembly further includes: a thermal conductive agent, the thermal conductive agent is coated on the chip to improve the heat conduction efficiency of the chip. 4. The chip heat dissipation device according to claim 2, wherein the thermally conductive cover is a hollow plate structure, and the opening of the thermally conductive cover faces the chip assembly and covers the chip. 5. The chip heat dissipation device according to claim 4, further comprising: an elastic sealing ring, and the thermally conductive cover is tightly attached to the PCB circuit board outside the chip slot through the elastic sealing ring. Seal the chip. 6. The chip heat dissipation device according to claim 4, further comprising: a temperature sensor, the temperature sensor is arranged inside the thermal conductive cover, connected to the second interface, and used to measure the real-time temperature of the chip. temperature, and feeds the temperature signal back to the PCB circuit board. 7. The chip heat dissipation device according to claim 6, wherein the thermally conductive cover further includes a groove structure formed at a bottom inside the thermally conductive cover to accommodate the thermally conductive cover when the temperature sensor fails. Condensation water formed inside. 8. The chip heat dissipation device according to claim 6, wherein the semiconductor refrigerator is placed at the lower part of the chip to prevent condensation water from flowing to the chip or PCB circuit board when the temperature sensor fails. 9. The chip heat dissipation device according to claim 1, wherein the volume of the heat sink is larger than that of the semiconductor refrigerator and is close to the heating surface of the semiconductor refrigerator to increase the temperature of the heat sink. Improve heat dissipation efficiency. 10. The chip heat dissipation device according to any one of claims 1 to 9, characterized in that the thermally conductive cover can wrap the PCB circuit board.